CN113687150A

CN113687150A - Radio frequency test seat, probe, radio frequency circuit and electronic equipment

Info

Publication number: CN113687150A
Application number: CN202111113118.1A
Authority: CN
Inventors: 陈其兴; 王利荣
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-09-22
Filing date: 2021-09-22
Publication date: 2021-11-23

Abstract

The embodiment of the application provides a radio frequency test seat, a probe, a radio frequency circuit and electronic equipment. The radio frequency test socket specifically comprises: the device comprises an outer frame, a first insulating fixing piece and a second insulating fixing piece; the outer frame is provided with an accommodating space for accommodating the first insulating fixing piece and the second insulating fixing piece; the first insulating fixing piece and the second insulating fixing piece are arranged in the accommodating space, a first signal spring pin and a second signal spring pin are arranged on the first insulating fixing piece, and a third signal spring pin and a fourth signal spring pin are arranged on the second insulating fixing piece; the first test probe can be inserted into the radio frequency test seat so that the radio frequency test seat is switched from a first working state to a first test state, and the second test probe can be inserted into the radio frequency test seat so that the radio frequency test seat is switched from a second working state to a second test state.

Description

Radio frequency test seat, probe, radio frequency circuit and electronic equipment

Technical Field

The application belongs to the technical field of communication, and particularly relates to a radio frequency test seat, a probe, a radio frequency circuit and an electronic device.

Background

With the development of science and technology, along with the development of communication technology, the requirements of electronic devices such as mobile phones and tablet computers on network functions are higher and higher, network systems to be supported are more and more, and correspondingly, antenna channels on the electronic devices are more and more.

In the prior art, each antenna path needs to be provided with a radio frequency test socket for debugging and testing the radio frequency performance of the antenna path, so that the number of the radio frequency test sockets increases correspondingly with the increase of the antenna paths in the electronic device.

However, since the rf test socket needs a certain structure clearance area, the space occupied by the rf test socket on the circuit board is large, which easily causes that the space of the circuit board is difficult to be effectively utilized.

Disclosure of Invention

The application aims at providing a radio frequency test seat, a probe, a radio frequency circuit and electronic equipment to solve the problems that the space occupied by the existing radio frequency test seat on a circuit board is large and the space of the circuit board is difficult to be effectively utilized.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, the present application discloses a radio frequency test socket, comprising: the device comprises an outer frame, a first insulating fixing piece and a second insulating fixing piece; wherein the content of the first and second substances,

the outer frame is provided with an accommodating space for accommodating the first insulating fixing piece and the second insulating fixing piece;

the first insulating fixing piece and the second insulating fixing piece are arranged in the accommodating space, a first signal spring pin and a second signal spring pin are arranged on the first insulating fixing piece, and a third signal spring pin and a fourth signal spring pin are arranged on the second insulating fixing piece;

the first test probe can be inserted into the radio frequency test seat so that the radio frequency test seat is switched from a first working state to a first test state, and the second test probe can be inserted into the radio frequency test seat so that the radio frequency test seat is switched from a second working state to a second test state;

in the first working state, the first signal spring pin and the second signal spring pin are conducted, and in the first testing state, the second signal spring pin is abutted to the second testing probe, and the first signal spring pin and the second signal spring pin are disconnected; in the second working state, the third signal spring pin and the fourth signal spring pin are connected, and in the second testing state, the fourth signal spring pin is abutted to the second testing probe, and the third signal spring pin and the fourth signal spring pin are disconnected.

In a second aspect, an embodiment of the present application further discloses a probe, including: a first test probe and a second test probe; wherein the content of the first and second substances,

the first test probe and the second test probe are of an integrated structure; wherein the content of the first and second substances,

a cavity is arranged in the second test probe, and the first test probe is arranged in the cavity and at least partially extends out of the cavity.

In a third aspect, the present application also discloses a radio frequency circuit, including: the radio frequency test socket comprises a transceiver, a first radio frequency input circuit, a first radio frequency output circuit, a second radio frequency input circuit, a second radio frequency output circuit and any one of the radio frequency test sockets;

one end of the first radio frequency input circuit and one end of the second radio frequency input circuit are respectively electrically connected with the transceiver, the other end of the first radio frequency input circuit is electrically connected with a second signal spring pin of the radio frequency test seat, and the first radio frequency output circuit is electrically connected with a first signal spring pin of the radio frequency test seat; the other end of the second radio frequency input circuit is electrically connected with a fourth signal spring pin of the radio frequency test seat, and the second radio frequency output circuit is electrically connected with a third signal spring pin of the radio frequency test seat.

In a fourth aspect, the present application further discloses an electronic device, including: the radio frequency test seat.

In the embodiment of the application, a first signal spring pin and a second signal spring pin are arranged on a first insulating fixing piece of the radio frequency test seat, and a third signal spring pin and a fourth signal spring pin are arranged on a second insulating fixing piece. The first test probe is inserted into the radio frequency test seat, so that the radio frequency test seat can be switched from a first working state to a first test state, and transmission or test of a first radio frequency signal is realized. By inserting the second test probe into the radio frequency test socket, the radio frequency test socket can be switched from the second working state to the second test state, so that transmission or test of the second radio frequency signal is realized. That is, the antenna path of the first radio frequency signal and the antenna path of the second radio frequency signal may share one radio frequency test socket, so that the number of radio frequency test sockets in the electronic device may be reduced, the space occupied by the radio frequency test socket in the circuit board of the electronic device may be reduced, and the space utilization of the circuit board may be improved.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a conventional rf circuit;

FIG. 2 is a schematic view of an angle structure of an RF test socket according to an embodiment of the present application;

FIG. 3 is a schematic view of the RF test socket shown in FIG. 1 at another angle;

FIG. 4 is an exploded view of the RF test socket shown in FIG. 1;

FIG. 5 is a schematic structural view of the RF test socket shown in FIG. 1 in a first operating state;

FIG. 6 is a schematic view of the RF test socket shown in FIG. 1 in a first test state;

FIG. 7 is a schematic structural view of the RF test socket shown in FIG. 1 in a second operating state;

FIG. 8 is a schematic structural view of the RF test socket shown in FIG. 1 in a second test state;

FIG. 9 is a schematic view of an angle at which a probe of an embodiment of the present application may be used with an RF test socket;

FIG. 10 is a schematic view of another angle of the structure shown in FIG. 9;

fig. 11 is a schematic structural diagram of a radio frequency circuit according to an embodiment of the present application;

reference numerals: 10-outer frame, 11-first insulating fixing piece, 111-first signal elastic pin, 112-second signal elastic pin, 113-supporting part, 12-second insulating fixing piece, 121-third signal elastic pin, 122-fourth signal elastic pin, 1221-through hole, 13-first test probe, 14-second test probe, 15-inner frame, 20-transceiver, 21-antenna channel, 210-traditional radio frequency test seat, 22-first radio frequency input circuit, 23-first radio frequency output circuit, 24-second radio frequency input circuit, 25-second radio frequency output circuit, 26-radio frequency test seat, 27-first antenna, 28-second antenna.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1, a schematic structural diagram of a conventional radio frequency circuit is shown, and as shown in fig. 1, the radio frequency circuit may specifically include a transceiver 20 and a plurality of antenna vias 21, where a conventional radio frequency test socket 210 is generally disposed in each antenna via 21 for debugging and testing radio frequency performance of the antenna via 21.

As shown in fig. 1, since each antenna channel 21 is provided with a conventional rf test socket 210, the conventional rf circuit has a large number of conventional rf test sockets 210. Because the conventional rf test socket 210 requires a certain structure clearance area, the space occupied by the conventional rf test socket 210 on the circuit board is large, and thus, the space of the circuit board is difficult to be effectively utilized.

Referring to fig. 2, a schematic structural diagram of an angle of a radio frequency test socket according to an embodiment of the present application is shown, referring to fig. 3, a schematic structural diagram of another angle of the radio frequency test socket shown in fig. 1 is shown, referring to fig. 4, an exploded structural diagram of the radio frequency test socket shown in fig. 1 is shown, referring to fig. 5, a schematic structural diagram of the radio frequency test socket shown in fig. 1 in a first working state is shown, referring to fig. 6, a schematic structural diagram of the radio frequency test socket shown in fig. 1 in a first test state is shown, referring to fig. 7, a schematic structural diagram of the radio frequency test socket shown in fig. 1 in a second working state is shown, and referring to fig. 8, a schematic structural diagram of the radio frequency test socket shown in fig. 1 in a second test state is shown.

Specifically, the radio frequency test socket includes: an outer frame 10, a first insulating fixing member 11 and a second insulating fixing member 12; wherein the content of the first and second substances,

the outer frame 10 is provided with an accommodating space for accommodating the first insulating fixing member 11 and the second insulating fixing member 12;

the first insulating fixing member 11 and the second insulating fixing member 12 are disposed in the accommodating space, the first insulating fixing member 11 is provided with a first signal spring leg 111 and a second signal spring leg 112, and the second insulating fixing member 12 is provided with a third signal spring leg 121 and a fourth signal spring leg 122;

the first test probe 13 can be inserted into the rf test socket to switch the rf test socket from the first working state shown in fig. 5 to the first test state shown in fig. 6, and the second test probe 14 can be inserted into the rf test socket to switch the rf test socket from the second working state shown in fig. 7 to the second test state shown in fig. 8;

in the first working state, the first signal pin 111 and the second signal pin 112 are turned on to transmit a first radio frequency signal, and in the first testing state, the second signal pin 112 abuts against the first testing probe 13, and the first signal pin 111 and the second signal pin 112 are turned off to test the first radio frequency signal; in the second working state, the third signal pin 121 and the fourth signal pin 122 are turned on to transmit the second radio frequency signal, and in the second testing state, the fourth signal pin 122 abuts against the second testing probe 14, and the third signal pin 121 and the fourth signal pin 122 are turned off to test the second radio frequency signal.

In this embodiment, the first insulating fixing member 11 of the rf test socket is provided with a first signal spring leg 111 and a second signal spring leg 112, and the second insulating fixing member 12 is provided with a third signal spring leg 121 and a fourth signal spring leg 122. By inserting the first test probe 13 into the radio frequency test socket, the radio frequency test socket can be switched from the first working state to the first test state, so as to realize transmission or test of the first radio frequency signal. By inserting the second test probe 14 into the rf test socket, the rf test socket can be switched from the second working state to a second test state, so as to implement transmission or test of the second rf signal. That is, the antenna path of the first rf signal and the antenna path of the second rf signal may share one rf test socket. Therefore, the number of the radio frequency test seats in the electronic equipment can be reduced, the space occupied by the radio frequency test seats in the circuit board of the electronic equipment is reduced, and the space utilization rate of the circuit board is improved.

It should be noted that the first radio frequency signal and the second radio frequency signal may be the same type of radio frequency signal, for example, the first radio frequency signal and the second radio frequency signal may be the same high frequency signal or the same low frequency signal; alternatively, the first radio frequency signal and the second radio frequency signal are different types of radio frequency signals, for example, the first radio frequency signal is a high frequency signal, and the second radio frequency signal is a low frequency signal.

Specifically, the outer frame 10 may be made of a metal capable of conducting electricity, such as copper or silver. In the case where the radio frequency test socket is used in an electronic device, a circuit board may be disposed within the electronic device, and the circuit board may include, but is not limited to, at least one of a printed circuit board and a flexible circuit board. The circuit board may be provided with a ground terminal, and the outer frame 10 of the rf test socket may be soldered to the ground terminal of the circuit board, so as to realize the grounding of the outer frame 10. The first insulating fixing member 11 and the second insulating fixing member 12 may be made of insulating material such as plastic, plastics, etc.

In practical applications, the rf test socket may further include an inner frame 15, and the inner frame 15 is disposed inside the outer frame 10 and is used for supporting the outer frame 10. Through holes are formed in the inner frame 15 so that the first test probe 13 or the second test probe 14 passes through the inner frame 15 to be in contact with the signal pogo pin located at the bottom of the inner frame 15.

For example, the inner frame 15 may be made of an insulating material such as plastic, plastics, etc., and the specific material of the inner frame 15 in the embodiment of the present application may not be limited.

In the embodiment of the present application, the first signal pin 111 and the second signal pin 112 may be connected to an antenna path for radiating the first rf signal. Specifically, the first signal pin 111 may be connected to an output circuit of a first radio frequency signal, and the second signal pin 112 may be connected to an input circuit of the first radio frequency signal. Thus, under the condition that the first signal pin 111 and the second signal pin 112 are conducted, the input circuit and the output circuit of the first radio frequency signal can be conducted, so that the transmission and radiation of the first radio frequency signal are realized; under the condition that the first signal pin 111 and the second signal pin 112 are disconnected, the signal input by the input circuit of the first radio frequency signal can be transmitted to the test circuit through the first test probe 13, so as to debug and test the radio frequency performance of the antenna path of the first radio frequency signal.

Similarly, the third signal pin 121 and the fourth signal pin 122 may be connected to an antenna path for radiating the second rf signal. Specifically, the third signal pin 121 may be connected to an output circuit of the second radio frequency signal, and the fourth signal pin 122 may be connected to an input circuit of the first radio frequency signal. Thus, under the condition that the third signal pin 121 and the fourth signal pin 122 are conducted, the input circuit and the output circuit of the second radio frequency signal can be conducted, so that transmission and radiation of the second radio frequency signal are realized; under the condition that the third signal pin 121 and the fourth signal pin 122 are disconnected, the signal input by the input circuit of the second radio frequency signal can be transmitted to the test circuit through the second test probe 14, so as to debug and test the radio frequency performance of the antenna path of the second radio frequency signal.

In some optional embodiments of the present application, the first test probe 13 and the second test probe 14 may be inserted into the rf test socket from a first direction; the first insulating fixing member 11 and the second insulating fixing member 12 are stacked in the accommodating space along the first direction, and the first insulating fixing member 11 is disposed on a side of the second insulating fixing member 12 away from the first test probe 13 and the second test probe 14.

Specifically, the first test probe 13 and the second test probe 14 are inserted into the radio frequency test from the same direction, so that the first test probe 13 and the second test probe 14 can share the insertion space inside the outer frame 10, and the volume of the outer frame 10 is reduced, thereby reducing the overall volume of the radio frequency test socket. And through stacking the first insulating fixing member 11 and the second insulating fixing member 12 with the accommodating space inside the outer frame 10, the volume of the accommodating space occupied by the first insulating fixing member 11 and the second insulating fixing member 12 can be reduced, and further, the volume of the radio frequency test socket can be further reduced.

For example, the first direction may be a vertical direction, the first insulating fixing member 11 and the second insulating fixing member 12 may be stacked in the vertical direction and disposed in the accommodating space, and the first insulating fixing member 11 is disposed at the bottom of the accommodating space and the second insulating fixing member 12 is disposed above the first insulating fixing member 11.

In a specific application, the first and second

signal spring legs

111 and 112 may be connected to the first insulating fixing member 11 by an integral injection molding process, and the third and fourth

signal spring legs

121 and 122 may be connected to the second insulating fixing member 12 by an integral injection molding process. Then, the inner frame 15 is sleeved in the outer frame 10, the second insulating fixing element 12 and the first insulating fixing element 11 are sequentially stacked at the bottom of the inner frame 15, and the first insulating fixing element 11 is clamped by the clamping portion at the bottom of the outer frame 10 from the four sides of the first insulating fixing element 11. Specifically, since the second insulating fixing piece 12 and the first insulating fixing piece 11 are stacked at the bottom of the inner frame 15, the first insulating fixing piece 11 and the second insulating fixing piece 12 may also function to support the inner frame 15.

As shown in fig. 5, along the projection direction of the first direction, the projection of the first signal spring leg 111 and the projection of the second signal spring leg 112 at least partially coincide. As shown in fig. 7, the third signal pin 121 and the fourth signal pin 122 at least partially overlap along the projection direction of the first direction. In the first working state shown in fig. 5, the first signal spring leg 111 and the second signal spring leg 112 are at least partially overlapped, and in the first testing state shown in fig. 6, the first signal spring leg 111 and the second signal spring leg 112 are not overlapped. In the second working state shown in fig. 7, the third signal spring leg 121 and the fourth signal spring leg 122 are at least partially overlapped, and in the second testing state shown in fig. 8, the third signal spring leg 121 and the fourth signal spring leg 122 are not overlapped.

As shown in fig. 5, in the first working state, the first signal pin 111 and the second signal pin 112 are at least partially overlapped to achieve conduction between the first signal pin 111 and the second signal pin 112, and the first radio frequency signal input by the second signal pin 112 can be output through the first signal pin 111. As shown in fig. 6, in the first test state, the first signal pin 111 and the second signal pin 112 may be detached from each other to disconnect the first signal pin 111 and the second signal pin 112, and the first radio frequency signal input by the second signal pin 112 may be output to a test circuit through the first test probe 13 to test or debug the radio frequency performance of the antenna path of the first radio frequency signal.

As shown in fig. 7, in the second working state, the third signal pin 121 and the fourth signal pin 122 are at least partially overlapped to realize conduction between the third signal pin 121 and the fourth signal pin 122, and the second radio frequency signal input by the fourth signal pin 122 can be output through the third signal pin 121. As shown in fig. 8, in the second test state, the third signal pin 121 and the fourth signal pin 122 may be detached from each other, so as to disconnect the third signal pin 121 and the fourth signal pin 122, and the second radio frequency signal input by the fourth signal pin 122 may be output to a test circuit through the second test probe 14, so as to implement testing or debugging of the radio frequency performance of the antenna path of the second radio frequency signal.

In the embodiment of the present application, the outer frame 10 is provided with sockets for inserting the first test probes 13 and the second test probes 14, which may be provided on the top of the outer frame 10, as shown in fig. 6. The second signal spring leg 112 is arranged on one side of the first signal spring leg 111 far away from the socket, in the first test state, the first test probe 13 is abutted against the second signal spring leg 112, and the first signal spring leg 111 is not overlapped with the second signal spring leg 112.

In a specific application, since the second signal spring leg 112 is disposed on a side of the first signal spring leg 111 away from the socket, when the radio frequency test socket needs to be switched from the first working state to the first testing state, the first test probe 13 may be inserted into the radio frequency test socket from the first direction, so that the first test probe 13 abuts against the second signal spring leg 112, and further pressing down of the first test probe 13 along the first direction may move the second signal spring leg 112 toward a direction away from the first signal spring leg 111 until the overlapping joint between the second signal spring leg 112 and the first signal spring leg 111 is released, so as to break the conduction between the first signal spring leg 111 and the second signal spring leg 112. When the radio frequency test socket needs to be switched from the first test state shown in fig. 6 to the first working state shown in fig. 5, the first test probe 13 is only required to be pulled out of the radio frequency test socket, and after the abutting joint of the first test probe 13 on the second signal spring leg 112 is released, the second signal spring leg 112 can rebound to a state of being overlapped with the first signal spring leg 111 under the action of elastic restoring force, so that the first working state shown in fig. 5 is realized. In this way, a fast switching between the first operating state and the first test state can be achieved.

As shown in fig. 8, the fourth signal spring leg 122 is disposed on a side of the third signal spring leg 121 away from the socket, and in the second test state, the second test probe 14 abuts against the fourth signal spring leg 122, and the third signal spring leg 121 and the fourth signal spring leg 122 are released from overlapping.

In a specific application, since the fourth signal spring leg 122 is disposed on a side of the third signal spring leg 121 away from the socket, when the radio frequency test socket needs to be switched from the second working state to the second testing state, the second test probe 14 may be inserted into the radio frequency test socket from the first direction, so that the second test probe 14 abuts against the fourth signal spring leg 122, and further pressing down of the second test probe 14 along the first direction may move the fourth signal spring leg 122 toward a direction away from the third signal spring leg 121 until the overlapping joint between the fourth signal spring leg 122 and the third signal spring leg 121 is released, so as to disconnect the conduction between the third signal spring leg 121 and the fourth signal spring leg 122. When the radio frequency test socket needs to be switched from the second test state shown in fig. 8 to the second working state shown in fig. 7, the second test probe 14 only needs to be pulled out of the radio frequency test socket, and after the second test probe 14 releases the abutment on the fourth signal spring leg 122, the fourth signal spring leg 122 can rebound to a state of overlapping with the third signal spring leg 121 under the action of the elastic restoring force, so that the second working state shown in fig. 7 is realized. In this way, a fast switching between the second operating state and the second test state can be achieved.

In some optional embodiments of the present application, the fourth signal spring leg 122 is provided with a through hole 1221 for avoiding the first test probe 13, and in the first test state, the first test probe 13 can pass through the through hole 1221 to abut against the second signal spring leg 112 and press the second signal spring leg 112 to separate from the first signal spring leg 111.

Specifically, since the first test probe 13 can pass through the through hole 1221 of the fourth signal spring leg 122 and abut against the second signal spring leg 112, when the first test probe 13 is inserted into the radio frequency test socket, the first test probe 13 can be prevented from contacting the fourth signal spring leg 122 and pressing down the fourth signal spring leg 122, thereby improving the test accuracy of the first test probe 13.

In this embodiment, the outer diameter of the second test probe 14 needs to be larger than the aperture of the through hole 1221, so that when the radio frequency test socket needs to be switched from the second working state to the second test state, the second test probe 14 can be inserted into the radio frequency test socket and press down the fourth signal spring leg 122, thereby avoiding the defect that the second test probe 14 passes through the through hole 1221 of the fourth signal spring leg 122, and thus improving the reliability of the second test probe 14 in pressing down the fourth signal spring leg 122.

As shown in fig. 7 and 8, the first insulating fixing member 11 is provided with a supporting portion 113 protruding toward the fourth signal spring leg 122, and the supporting portion 113 is disposed to protrude from the first signal spring leg 111 and the second signal spring leg 112. In the second test state shown in fig. 8, when the second test probe 14 presses down the fourth signal spring leg 122 to a position separated from the third signal spring leg 121, the supporting portion 113 may function to restrict the fourth signal spring leg 122 from continuing to move toward. Thus, the short circuit phenomenon caused by the contact between the fourth signal pin 122 and the second signal pin 112 can be avoided.

Optionally, the supporting portion 113 and the first insulating fixing member 11 are integrally formed, so as to avoid an additional operation of processing the supporting portion 113 on the first insulating fixing member 11, and improve the processing efficiency of the supporting portion 113. For example, the first insulating fixing member 11 and the supporting portion 113 may be made of the same material, such as plastic or plastic, and the first insulating fixing member 11 and the supporting portion 113 may be formed by an integral injection molding process.

Embodiments of the present application may also include a probe that may include a first test probe 13 and a second test probe 14, which may be used in conjunction with the rf test socket of the embodiments described above.

Referring to fig. 9, a schematic structural diagram of a certain angle of the probe and the rf test socket according to the embodiment of the present application is shown, and referring to fig. 10, a schematic structural diagram of another angle of the structure shown in fig. 9 is shown. As shown in fig. 9 and 10, of the probes, the first test probe 13 and the second test probe 14 may be a unitary structure; wherein a cavity is provided in the second test probe 14, in which cavity the first test probe 13 is provided and at least partly protrudes from the cavity. Thus, when the second test probe 14 is inserted into the radio frequency test socket and abuts against the fourth signal spring pin 122, the first test probe 13 in the second test probe 14 can be correspondingly inserted into the radio frequency test socket and abuts against the second signal spring pin 112, so that the radio frequency new energy of the antenna path of the first radio frequency signal and the second radio frequency signal can be tested or debugged simultaneously, and the test efficiency of the radio frequency test socket for the radio frequency signal is improved.

In practical applications, a person skilled in the art may set the first test probe 13 and the second test probe 14 to be separate structures, or may set the first test probe 13 and the second test probe 14 to be an integrated structure, and the specific structures of the first test probe 13 and the second test probe 14 in the embodiments of the present application may not be limited.

In summary, the rf test socket according to the embodiment of the present application can at least include the following advantages:

Referring to fig. 11, a schematic structural diagram of a radio frequency circuit according to an embodiment of the present application is shown, and as shown in fig. 11, the radio frequency circuit includes: a transceiver 20, a first rf input circuit 22, a first rf output circuit 23, a second rf input circuit 24, a second rf output circuit 25, and an rf test socket 26 according to any of the above embodiments; one end of the first radio frequency input circuit 22 and one end of the second radio frequency input circuit 24 are electrically connected to the transceiver 20, the other end of the first radio frequency input circuit 22 is electrically connected to the second signal pin 112 of the radio frequency test socket 26, one end of the first radio frequency output circuit 23 is electrically connected to the first signal pin 111 of the radio frequency test socket 26, the other end of the first radio frequency output circuit 23 is connected to the first antenna 27, the first antenna 27 can be used for radiating the first radio frequency signal, the other end of the second radio frequency input circuit 24 is electrically connected to the fourth signal pin 122 of the radio frequency test socket 26, one end of the second radio frequency output circuit 25 is electrically connected to the third signal pin 121 of the radio frequency test socket 26, the other end of the second radio frequency output circuit 25 is connected to the second antenna 28, and the second antenna 28 can be used for radiating the second radio frequency signal.

In this embodiment, the specific structure of the radio frequency test socket 26 is the same as that of the radio frequency test socket described in any of the above embodiments, and details thereof are not repeated herein.

In the embodiment of the present application, the first rf input circuit 22, the first signal pin 111 and the second signal pin 112 of the rf test socket 26, the first rf output circuit 23, and the first antenna 27 may form a first antenna path, and the first antenna path may be used for transmitting and radiating the first rf signal. Similarly, the second rf input circuit 24, the third signal pin 121 and the fourth signal pin 122 of the rf test socket 26, the second rf output circuit 25, and the second antenna 28 may form a second antenna path, which may be used for transmitting and radiating the second rf signal.

Specifically, when the radio frequency test socket 26 is in the first working state, the first signal spring pin 111 and the second signal spring pin 112 of the radio frequency test socket 26 may be turned on to turn on the first radio frequency input circuit 22 and the first radio frequency output circuit 23, so as to implement transmission and radiation of the first radio frequency signal. When the rf test socket 26 is in the first test state, the first signal spring leg 111 and the second signal spring leg 112 of the rf test socket 26 may be disconnected to disconnect the electrical connection between the first rf input circuit 22 and the first rf output circuit 23. Thus, the first rf signal inputted by the first rf input circuit 22 can be transmitted to the test circuit through the first test probe 13 to debug and test the rf performance of the first antenna path.

Specifically, when the radio frequency test socket 26 is in the second working state, the third signal pin 121 and the fourth signal pin 122 of the radio frequency test socket 26 may be turned on to turn on the second radio frequency input circuit 24 and the second radio frequency output circuit 25, so as to implement transmission and radiation of the second radio frequency signal. When the rf test socket 26 is in the second test state, the third signal spring leg 121 and the fourth signal spring leg 122 of the rf test socket 26 may be disconnected to disconnect the electrical connection between the second rf input circuit 24 and the second rf output circuit 25. Thus, the second rf signal inputted by the second rf input circuit 24 can be transmitted to the test circuit through the second test probe 14, so as to debug and test the rf performance of the second antenna path.

That is, the first antenna path of the first radio frequency signal and the second antenna path 21 of the second radio frequency signal may share one radio frequency test socket 26, so that the number of the radio frequency test sockets 26 in the radio frequency circuit may be reduced, the space occupied by the radio frequency test socket 26 in the circuit board of the electronic device may be reduced, and the space utilization rate of the circuit board may be improved.

For example, as shown in fig. 11, the rf circuit includes 4 antenna paths, but only 2 rf test sockets 26 need to be provided, and the number of the rf test sockets 26 in the rf circuit is small.

In summary, the radio frequency circuit according to the embodiment of the present application may include at least the following advantages:

in the embodiment of the present application, the radio frequency test socket in the radio frequency circuit includes a first signal pin, a second signal pin, a third signal pin and a fourth signal pin. The first test probe is inserted into the radio frequency test seat, so that the radio frequency test seat can be switched from a first working state to a first test state, and transmission or test of a first radio frequency signal is realized. By inserting the second test probe into the radio frequency test socket, the radio frequency test socket can be switched from the second working state to the second test state, so that transmission or test of the second radio frequency signal is realized. That is, the antenna path of the first radio frequency signal and the antenna path of the second radio frequency signal may share one radio frequency test socket, so that the number of radio frequency test sockets in the electronic device may be reduced, the space occupied by the radio frequency test socket in the circuit board of the electronic device may be reduced, and the space utilization of the circuit board may be improved.

An embodiment of the present application further provides an electronic device, where the electronic device specifically includes: the radio frequency test seat. The electronic device may include, but is not limited to, any one of a mobile phone, a tablet computer, and a wearable device, and the specific type of the electronic device may not be limited in the embodiments of the present application.

It should be noted that, in the embodiment of the present application, the structure and the working principle of the radio frequency circuit are the same as those of the radio frequency test socket in the foregoing embodiments, and details are not described herein.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A radio frequency test socket, comprising: the device comprises an outer frame, a first insulating fixing piece and a second insulating fixing piece; wherein the content of the first and second substances,

in the first working state, the first signal spring pin and the second signal spring pin are conducted, and in the first testing state, the second signal spring pin is abutted to the first testing probe, and the first signal spring pin and the second signal spring pin are disconnected; in the second working state, the third signal spring pin and the fourth signal spring pin are connected, and in the second testing state, the fourth signal spring pin is abutted to the second testing probe, and the third signal spring pin and the fourth signal spring pin are disconnected.

2. The radio frequency test socket according to claim 1, wherein the first test probe and the second test probe are insertable into the radio frequency test socket from a first orientation;

the first insulation fixing piece and the second insulation fixing piece are stacked in the accommodating space along the first direction, and the first insulation fixing piece is arranged on one side, away from the first test probe and the second test probe, of the second insulation fixing piece.

3. The radio frequency test socket according to claim 2, wherein along a projection of the first direction, a projection of the first signal spring leg and a projection of the second signal spring leg at least partially coincide, and the third signal spring leg and the fourth signal spring leg at least partially coincide;

wherein, in the first working state, the first signal spring pin and the second signal spring pin are at least partially overlapped, and in the first testing state, the first signal spring pin and the second signal spring pin are not overlapped; in the second working state, the third signal spring pin and the fourth signal spring pin are at least partially overlapped, and in the second testing state, the third signal spring pin and the fourth signal spring pin are not overlapped.

4. The radio frequency test socket according to claim 3, wherein the outer frame is provided with a socket for inserting the first test probe and the second test probe;

the second signal spring pin is arranged on one side, far away from the socket, of the first signal spring pin, in the first test state, the first test probe is abutted against the second signal spring pin, and the first signal spring pin is not overlapped with the second signal spring pin;

the fourth signal bullet foot sets up the third signal bullet foot is kept away from one side of socket the second test condition, the second test probe with fourth signal bullet foot butt, the third signal bullet foot with the overlap joint is relieved to the fourth signal bullet foot.

5. The RF test socket according to claim 4, wherein the fourth signal spring leg is provided with a through hole for avoiding the first test probe, and in the first test state, the first test probe passes through the through hole and abuts against the second signal spring leg.

6. The radio frequency test socket according to claim 5, wherein the outer diameter of the second test probe is larger than the aperture of the through hole.

7. The RF test socket according to claim 4, wherein the first insulating fixture has a support portion protruding toward the fourth signal spring pin, and the support portion protrudes from the first signal spring pin and the second signal spring pin.

8. A probe, characterized in that it comprises: a first test probe and a second test probe; wherein the content of the first and second substances,

the first test probe and the second test probe are of an integrated structure;

9. A radio frequency circuit, characterized in that the radio frequency circuit comprises: a transceiver, a first rf input circuit, a first rf output circuit, a second rf input circuit, a second rf output circuit, and the rf test socket of any one of claims 1-7;

10. An electronic device, characterized in that the electronic device comprises: the radio frequency test socket of any one of claims 1 to 7.