CN113680626A - 一种低温热封涂布膜及其制造方法 - Google Patents
一种低温热封涂布膜及其制造方法 Download PDFInfo
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Abstract
本发明提供了一种低温热封涂布膜,包括基材;所述基材的上表面依次设置有第一聚氨酯底胶层和低温热封涂料层;所述基材的下表面依次设置有第二聚氨酯底胶层和丙烯酸涂料层;按照质量含量计,所述低温热封涂料层包括:软水70%~80%,乙烯-丙烯酸共聚物12%~17%,氨基树脂5%~7%,乳化剂1.5%~4.5%,引发剂0.2%~1.5%,消泡剂0.2%~0.5%,PH调节剂0.1%~0.2%,沉淀法二氧化硅隔离剂0.2%~0.5%,棕榈蜡0.5%~1.5%,纳米聚四氟乙烯乳液0.2%~1.2%。
Description
技术领域
本发明涉及食品包装技术领域,尤其涉及一种低温热封涂布膜及其制造方法。
背景技术
巧克力、软糖、奶糖等属于热敏性食品,对包装的设备温度要求较高,一般要在73℃较低温条件包装,因此要求在73℃时具有良好的热封强度(≥1.5N/15mm)才能满足包装的要求。
目前针对热敏性的食品包装有两种方法:一是传统应用镀铝或铝箔复合BOPP薄膜通过涂布热熔胶实现低温度起封包装;二是使用BOPP低温热封涂布膜进行包装。传统采用铝箔或镀箔复合BOPP薄膜存在耐撕裂度差、成本高、非透明包装以及工序繁杂等缺陷。采用BOPP低温热封涂布膜,一定程度上解决了由于采用铝箔或镀箔,耐撕裂度差,成本高,非透明包装、工序繁杂等缺陷。但是目前用的低温热封涂布膜存在起封温度高、热封强度低以及贮存发粘等缺陷,限制了低温热封涂布膜在食品包装行业的应用。
发明内容
有鉴于此,本发明要解决的技术问题在于提供一种低温热封涂布膜及其制造方法,制备的低温热封涂布膜起封温度低,热封强度高,长时间贮存在较高温度下不会出现发粘问题。
为解决以上技术问题,本发明提供了一种低温热封涂布膜,包括基材;
所述基材的上表面依次设置有第一聚氨酯底胶层和低温热封涂料层;
所述基材的下表面依次设置有第二聚氨酯底胶层和丙烯酸涂料层;
按照质量含量计,所述低温热封涂料层包括:
软水70%~80%,乙烯-丙烯酸共聚物12%~17%,氨基树脂5%~7%,乳化剂1.5%~4.5%,引发剂0.2%~1.5%,消泡剂0.2%~0.5%,PH调节剂0.1%~0.2%,沉淀法二氧化硅隔离剂0.2%~0.5%,棕榈蜡0.5%~1.5%,纳米聚四氟乙烯乳液0.2%~1.2%。
图1为本发明提供的低温热封涂布膜的结构示意图,包括低温热封涂料层1,第一聚氨酯底胶层2,基材3,第二聚氨酯底胶层4,丙烯酸涂料层5。
本发明优选的,所述基材的厚度为18~30μm,更优选为21μm。
所述基材优选为BOPP膜。
第一聚氨酯底胶层设置于基材的光膜面。
本发明优选的,所述第一聚氨酯底胶层的厚度为0.2~0.5μm,更优选为0.5μm。
本发明优选的,所述第二聚氨酯底胶层的厚度为0.2~0.5μm,更优选为0.5μm。
本发明中,所述第一聚氨酯底胶层和第二聚氨酯底胶层为聚氨酯涂料烘干形成的涂层。
所述聚氨酯涂料由下述质量含量的原料配置而成:
软水55%~65%,二异氰酸酯14%~22%,聚酯多元醇9%~13%,改性环氧树脂2%~5%,炔二醇表面活性剂0.3%~1.5%,N-甲基吡咯烷酮2.0%~3.5%,羟基羧酸化合物0.5%~2.0%,三乙胺0.5%~3%,丙酮2%~8%,扩链剂0.1%~0.3%,PH调节剂0.5%~2.2%。
所述二异氰酸酯优选为二苯基甲烷二异氰酸酯。
本发明优选的,所述聚酯多元醇选自聚己内酯多元醇。
本发明优选的,所述改性环氧树脂选自有机硅改性二酚基丙烷型环氧树脂。
本发明优选的,所述扩链剂选自乙二胺基乙磺酸钠扩链剂。
所述羟基羧酸化合物优选为2,2-二羟甲基丙酸。
本发明优选的,所述PH调节剂选自二甲基乙醇胺PH调节剂。
本发明优选的,所述低温热封涂料层的厚度为0.5~1.5μm,更优选为1.0μm。
本发明优选的,所述低温热封涂料层由下述质量含量的原料配置而成:
软水70%~80%,乙烯-丙烯酸共聚物12%~17%,氨基树脂5%~7%,乳化剂1.5%~4.5%,引发剂0.2%~1.5%,消泡剂0.2%~0.5%,PH调节剂0.1%~0.2%,沉淀法二氧化硅隔离剂0.2%~0.5%,棕榈蜡0.5%~1.5%,纳米聚四氟乙烯乳液0.2%~1.2%。
所述乳化剂优选为乙烯基磺酸钠乳化剂。
所述引发剂优选为过氧化特戊酸特戊酯引发剂。
所述消泡剂优选为GS-T532聚醚合成消泡剂。
所述pH调节剂优选为二甲基乙醇胺pH调节剂。
所述沉淀法二氧化硅隔离剂优选为沉淀式改性纳米二氧化硅S340。
本发明优选的,所述丙烯酸涂料层的厚度为0.5~1.5μm,更优选为1.0μm。
所述丙烯酸涂料层为热封面。
本发明优选的,所述丙烯酸涂料层包括:
软水55%~65%,乙烯-丙烯酸共聚物15%~20%,甲基丙烯酸乙酯5%~10%,丙烯腈5%~8%,LT-5603环氧基硅烷偶联剂3%~5%,乙烯基磺酸钠乳化剂1.5%~4.5%,过氧化特戊酸特戊酯引发剂0.2%~1.5%,GS-T532聚醚合成消泡剂0.5%~1.0%,二甲基乙醇胺pH调节剂0.2%~0.5%,沉淀法二氧化硅隔离剂0.2%~0.5%,棕榈蜡1.5%~3.5%,聚四氟乙烯乳液1.0%~1.5%。
本发明提供了上述低温热封涂布膜的制造方法,包括以下步骤:
S1)放卷工序:展开基材;
S2)在基材的一侧进行电晕处理;
S3)在基材未进行电晕处理的一侧表面涂布第一聚氨酯底胶层、烘干,然后在第一聚氨酯底胶层表面涂布低温热封涂料层并烘干;
S4)在基材进行电晕处理的一侧表面涂布第二聚氨酯底胶层、烘干,然后在第二聚氨酯底胶层表面涂布丙烯酸涂层并烘干。
本发明优选的,所述放卷工序的张力优选为60~110N。
在本发明的一些具体实施例中,所述放卷工序具体为:
在60~110N的张力下,将基材平整的展开,在此放卷张力下,膜卷经过多个导辊连续向前运行,并采用两个相同工位相互交替工作,运用自动拼接及快速换膜,达到连续放卷的目的。
所述基材优选为BOPP单面热封膜膜卷。
然后在基材的一侧进行电晕处理,所述电晕处理的功率优选为5.0~10KW,可以在薄膜热封面上均匀处理出表面张力具有38以上的达因值。
然后在基材未进行电晕处理的一侧表面涂布第一聚氨酯底胶层、烘干。
本发明优选的,所述第一聚氨酯底胶层的涂布量为0.2~0.5g/m2,涂布速度为150~500m/min。
在本发明的一些具体实施例中,所述第一聚氨酯底胶层的涂布具体为:
通过涂布辊逆转辊吻式将水性聚氨酯底胶涂料涂布在基材的光膜面。
本发明优选的,所述第一聚氨酯底胶层的烘干分为多段;
第一段为红外线干燥,所述红外线干燥的温度为100~130℃,时间为1.0~1.5s;
第二段以及第二段以后为电热烘箱干燥,所述干燥的温度为80~120℃,时间为3~8s。
本发明优选的,在烘干过程中,薄膜需要有一定张力控制,张力大小满足薄膜拉直拉平即可,优选为35~110N。
然后在第一聚氨酯底胶层表面涂布低温热封涂料层并烘干。
本发明优选的,所述低温热封涂料层的涂布量为0.5~1.2g/m2,涂布速度为150~500m/min。
所述涂布优选通过涂布辊逆转辊吻式将低温热封涂料涂布在第一聚氨酯底胶层上。
本发明优选的,所述低温热封涂料层的烘干分为多段;
第一段为红外线干燥,所述红外线干燥的温度为100~130℃,时间为0.5~1.0s;
第二段以及第二段以后为电热烘箱干燥,所述干燥的温度为70~120℃,并呈递减设置,时间为5~15s。
在本发明一些具体实施例中,所述电热烘箱干燥具体为:
前段100~120℃,后段70~90℃。
本发明优选的,在低温热封涂料层的烘干过程中,薄膜需要有一定张力控制,张力大小满足薄膜拉直拉平即可,优选为35~110N。
然后在基材进行电晕处理的一侧表面涂布第二聚氨酯底胶层、烘干。
本发明优选的,所述第二聚氨酯底胶层的涂布量为0.2~0.5g/m2,涂布速度为150~500m/min。
本发明优选的,所述第二聚氨酯底胶层的烘干分为多段;
第一段为红外线干燥,所述红外线干燥的温度为100~130℃,时间为1.0~1.5s;
第二段以及第二段以后为电热烘箱干燥,所述干燥的温度为80~120℃,时间为3~8s。
然后在第二聚氨酯底胶层表面涂布丙烯酸涂层并烘干。
本发明优选的,所述丙烯酸涂层的涂布量为0.5~1.2g/m2,更优选为1.0g/m2;涂布速度优选为150~250m/min,更优选为200m/min。
本发明优选的,所述丙烯酸涂层的烘干分为多段;
第一段为红外线干燥,所述红外线干燥的温度为110~130℃,更优选为130℃,时间优选为3~5S,更优选为5S;
第二段以及第二段以后为电热烘箱干燥,所述干燥的温度优选为90~120℃,更优选为105℃,时间优选为8~15S,更优选为12S。
本发明优选的,上述步骤之后还包括:
在线检测、收卷、固化。
所述在线检测优选具体为:采用相机在线图像扫描的工作原理,在生产线高速生产时,采用光源照射产品表面,同时通过相机实时扫描并采集光源照射处的产品图像,将采集的图像进行处理与分割,并记录标记,所述的相机优选为CCD工业相机,所述的光源优选为高亮度LED线性聚光光源,用于判定产品质量及烘干情况。
所述收卷优选具体为:将涂布好的产品进行收卷,收卷时需要控制收卷的张力及压辊的压力,收卷在由小变大时,所受的张力及压力也由大变小,过程中有一最佳衰减率,工艺过程需要根据基材膜、涂布量、膜宽、膜厚等做精细的设定。本发明优选的,所述收卷的张力为50~110N,压辊压力为3.0±2kg。
所述固化优选具体为:常温固化。所述固化的时间优选为2天。
与现有技术相比,本发明提供了一种低温热封涂布膜,包括基材;所述基材的上表面依次设置有第一聚氨酯底胶层和低温热封涂料层;所述基材的下表面依次设置有第二聚氨酯底胶层和丙烯酸涂料层;按照质量含量计,所述低温热封涂料层包括:软水70%~80%,乙烯-丙烯酸共聚物12%~17%,氨基树脂5%~7%,乳化剂1.5%~4.5%,引发剂0.2%~1.5%,消泡剂0.2%~0.5%,PH调节剂0.1%~0.2%,沉淀法二氧化硅隔离剂0.2%~0.5%,棕榈蜡0.5%~1.5%,纳米聚四氟乙烯乳液0.2%~1.2%。
低温热封涂层发粘的问题主要来自于储存时环境温度高,低温热封涂层活化后与所接触的丙烯酸涂层起热封导致发粘。本发明采用特定的低温热封涂料层,将水性聚氨酯底胶涂布在热封面上后再涂布丙烯酸,所制成的丙烯酸涂层完全丧失了热封强度。确保了收卷时,丙烯酸与低温热封面没有任何热封功能。大大降低了由于低温热封料的起封温度低导致发粘的问题发生,同时,不会损失丙烯酸面涂料所具备的保润、保湿及保香等的阻隔功能。本发明的低温热封料,临界起封温度明显,即在72℃时热封特别小,70℃时完全没有热封,但73℃时具有非常好的热封强度(≥2.8N/15mm),具体测试结果如下表1。这也确保了在较高温度储存时不会活化热封料的起封现象,达到了双重解决发粘问题。
附图说明
图1为本发明提供的低温热封涂布膜的结构示意图。
具体实施方式
为了进一步说明本发明,下面结合实施例对本发明提供的低温热封涂布膜及其制造方法进行详细描述。
以下实施例1~3中,水性聚氨酯底胶、丙烯酸涂料配方如下:
1)水性聚氨酯底胶配比:
2)丙烯酸涂料配比:
实施例1低温热封涂料层配比:
实施例2
低温热封涂料层配比:
实施例3
低温热封涂料层配比:
具体制备过程:
(1)放卷工序:在90N的张力下,把制备的BOPP单面热封膜膜卷平整的展开,在此放卷张力下,膜卷经过多个导辊连续向前运行,并采用两个相同工位相互交替工作,运用自动拼接及快速换膜,达到连续放卷的目的;
(2)电晕工序:在8.0KW功率下薄膜电晕电极通过,在薄膜热封面上均匀处理出表面张力具有38以上的达因值;
(3)底涂工序:通过涂布辊逆转辊吻式将水性聚氨酯底胶涂料涂布在BOPP薄膜的光膜面涂布一层涂布量为0.5g/m2,速度为200m/min;
(4)低涂烘干工序:在烘干过程中,薄膜张力控制在:95N,所述烘箱分为几段,第一段的红外温度为:130℃,时间:1.5秒;电热烘箱2段的温度分别为:第一段为110℃,时间为3S;第二段温度为100℃,时间:3S;
(5)面涂工序:通过涂布辊逆转辊吻式将低温热封涂料涂布在BOPP薄膜的聚氨酯涂层上,面涂涂料层的涂布量分别为实施例1:1.2g/m2,、实施例2:1.0g/m2,实施例3:0.7g/m2,速度为200m/min;
(6)面涂烘干工序:在烘干过程中,薄膜张力控制在:35~110N,所述烘箱分为几段,第一段的红外温度为:130℃,1.0秒;电热烘箱分3段,前段温度为110℃,时间为3S;中间段温度为90℃,时间为3S;后段一般为70℃,面涂烘干总时间:2秒;
(7)相同热封面上工艺方法,在热封面涂布相同的水性底胶及丙烯酸面涂涂料;
(8)在线检测工序:采用相机在线图像扫描的工作原理,在生产线高速生产时,采用光源照射产品表面,同时通过相机实时扫描并采集光源照射处的产品图像,将采集的图像进行处理与分割,并记录标记,所述的相机为CCD工业相机,所述的光源为高亮度LED线性聚光光源,用于判定产品质量及烘干情况;
(9)收卷工序:涂布好的产品需要对薄膜进行收卷,收卷的张力在90N,压辊压力在3.0kg。
(10)固化:常温固化2天。
将制备得到的低温热封涂布膜的低温热封面与低温热封面接触,或低温热封面与丙烯酸面接触,或丙烯酸面与丙烯酸面接触,在不同温度条件下分别进行热封强度检测,结果如表1所示。
由表1可以看出,本发明制备得到的低温热封涂布膜在70℃时完全没有热封,72℃时热封特别小,但73℃时具有非常好的热封强度,可以确保其作为包装材料,即使在较高温度储存,比如在40℃存放7天,均完全不会出现活化热封料的起封现象。
表1 不同温度条件下热封强度检测
以上实施例的说明只是用于帮助理解本发明的方法及其核心思想。应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以对本发明进行若干改进和修饰,这些改进和修饰也落入本发明权利要求的保护范围内。
Claims (10)
1.一种低温热封涂布膜,其特征在于,包括基材;
所述基材的上表面依次设置有第一聚氨酯底胶层和低温热封涂料层;
所述基材的下表面依次设置有第二聚氨酯底胶层和丙烯酸涂料层;
按照质量含量计,所述低温热封涂料层包括:
软水70%~80%,乙烯-丙烯酸共聚物12%~17%,氨基树脂5%~7%,乳化剂1.5%~4.5%,引发剂0.2%~1.5%,消泡剂0.2%~0.5%,PH调节剂0.1%~0.2%,沉淀法二氧化硅隔离剂0.2%~0.5%,棕榈蜡0.5%~1.5%,纳米聚四氟乙烯乳液0.2%~1.2%。
2.根据权利要求1所述的低温热封涂布膜,其特征在于,所述沉淀法二氧化硅隔离剂为沉淀式改性纳米二氧化硅S340。
3.根据权利要求1所述的低温热封涂布膜,其特征在于,所述第一聚氨酯底胶层和第二聚氨酯底胶层为聚氨酯涂料烘干形成的涂层;
按照质量含量计,所述聚氨酯涂料包括:软水55%~65%,二异氰酸酯14%~22%,聚酯多元醇9%~13%,改性环氧树脂2%~5%,炔二醇表面活性剂0.3%~1.5%,N-甲基吡咯烷酮2.0%~3.5%,羟基羧酸化合物0.5%~2.0%,三乙胺0.5%~3%,丙酮2%~8%,扩链剂0.1%~0.3%,PH调节剂0.5%~2.2%。
4.根据权利要求3所述的低温热封涂布膜,其特征在于,所述聚酯多元醇选自聚己内酯多元醇;
所述改性环氧树脂选自有机硅改性二酚基丙烷型环氧树脂;
所述扩链剂选自乙二胺基乙磺酸钠扩链剂。
5.根据权利要求1所述的低温热封涂布膜,其特征在于,所述基材的厚度为18~30μm;
所述第一聚氨酯底胶层的厚度为0.2~0.5μm;
所述低温热封涂料层的厚度为0.5~1.5μm;
所述第二聚氨酯底胶层的厚度为0.2~0.5μm;
所述丙烯酸涂料层的厚度为0.5~1.5μm。
6.根据权利要求1所述的,按照质量含量计,所述的丙烯酸涂料层包括:
软水55%~65%,乙烯-丙烯酸共聚物15%~20%,甲基丙烯酸乙酯5%~10%,丙烯腈5%~8%,LT-5603环氧基硅烷偶联剂3%~5%,乙烯基磺酸钠乳化剂1.5%~4.5%,过氧化特戊酸特戊酯引发剂0.2%~1.5%,GS-T532聚醚合成消泡剂0.5%~1.0%,二甲基乙醇胺pH调节剂0.2%~0.5%,沉淀法二氧化硅隔离剂0.2%~0.5%,棕榈蜡1.5%~3.5%,聚四氟乙烯乳液1.0%~1.5%。
7.权利要求1~6任一项所述的低温热封涂布膜的制造方法,包括以下步骤:
S1)放卷工序:展开基材;
S2)在基材的一侧进行电晕处理;
S3)在基材未进行电晕处理的一侧表面涂布第一聚氨酯底胶层、烘干,然后在第一聚氨酯底胶层表面涂布低温热封涂料层并烘干;
S4)在基材进行电晕处理的一侧表面涂布第二聚氨酯底胶层、烘干,然后在第二聚氨酯底胶层表面涂布丙烯酸涂层并烘干。
8.根据权利要求7所述的制造方法,其特征在于,所述第一聚氨酯底胶层的涂布量为0.2~0.5g/m2,涂布速度为150~500m/min;
所述第一聚氨酯底胶层的烘干分为多段;
第一段为红外线干燥,所述红外线干燥的温度为100~130℃,时间为1.0~1.5s;
第二段以及第二段以后为电热烘箱干燥,所述干燥的温度为80~120℃,时间为3~8s;
所述低温热封涂料层的涂布量为0.5~1.2g/m2,涂布速度为150~500m/min;
所述低温热封涂料层的烘干分为多段;
第一段为红外线干燥,所述红外线干燥的温度为100~130℃,时间为0.5~1.0s;
第二段以及第二段以后为电热烘箱干燥,所述干燥的温度为70~120℃,并呈递减设置,时间为5~15s。
9.根据权利要求7所述的制造方法,其特征在于,所述第二聚氨酯底胶层的涂布量为0.2~2.5g/m2,涂布速度为150~500m/min;
所述第二聚氨酯底胶层的烘干分为多段;
第一段为红外线干燥,所述红外线干燥的温度为100~130℃,时间为1.0~1.5s;
第二段以及第二段以后为电热烘箱干燥,所述干燥的温度为80~120℃,时间为3~8s。
10.根据权利要求7所述的制造方法,其特征在于,所述丙烯酸涂层的涂布量为0.5~1.2g/m2;涂布速度为150~250m/min;
所述丙烯酸涂层的烘干分为多段;
第一段为红外线干燥,所述红外线干燥的温度为110~130℃,时间为3~5S;
第二段以及第二段以后为电热烘箱干燥,所述干燥的温度为90~120℃,时间为8~15S。
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