CN113677181A

CN113677181A - Electronic component mounting device and mounting method thereof

Info

Publication number: CN113677181A
Application number: CN202011529542.XA
Authority: CN
Inventors: 宋准根; 宋京洙
Original assignee: Hanwha Precision Machinery Co Ltd
Current assignee: Hanwha Precision Machinery Co Ltd
Priority date: 2020-05-13
Filing date: 2020-12-22
Publication date: 2021-11-19
Also published as: KR20210138878A; KR102468015B1

Abstract

The invention relates to an electronic component mounting device and a mounting method thereof, wherein the mounting method comprises the following steps: at least one component which is received in a component supply device and supplied, and which is received such that a first surface thereof is exposed upward with a terminal portion facing downward of the component supply device, or which is received such that a second surface thereof is exposed upward with the terminal portion facing in a side surface direction of the component supply device; a pickup part that picks up one of the first face or the second face of the component; a substrate on which the component is mounted; and a rotating member positioned between the component supplying apparatus and the substrate, and in a case where the second side of the component is picked up by the pickup member, positioning the picked up component and rotating the component by 90 degrees so that the first side faces the pickup member.

Description

Electronic component mounting device and mounting method thereof

Technical Field

The present invention relates to an electronic component mounting apparatus and a mounting method thereof, and for example, to an electronic component mounting apparatus and a mounting method thereof, which are as follows: when a component housed in the tray is picked up to mount the component to the substrate, the component can be automatically rotated according to the housed state of the component so that the lead part of the component can be arranged toward the substrate.

Background

In order to insert a component supplied from a component supply device such as a tray, a rod, a block, or the like into a printed circuit board, a lead part or a mounting surface of the component needs to be supplied to a lower side (substrate direction).

However, in consideration of the shape of the component, the convenience of packaging and transportation of the component supply device for housing, and the like, the lead portion of the component is supplied in a lateral direction in many cases.

Since the lead portions of the components supplied from the component supply device are housed so as to face the side surface direction of the component supply device, the components are housed in the component supply device in a state rotated by 90 degrees to the mounting surface of the printed circuit board. Therefore, the component picked up by the pickup device in the component supply device cannot be directly mounted on the printed circuit board because the lead portions face in the side direction.

In order to mount the components on the printed circuit board according to the mounting state of the components, a worker has to manually mount the components, to which the lead portions are mounted toward the side of the component supply device, on the printed circuit board one by one.

Alternatively, in order to directly mount the component rotated 90 degrees toward the side surface of the component supply device on the printed circuit board, the component supply device is repackaged so that the lead portions of the component face downward. In this case, a new component supply device separate from the component supply device loaded with the component rotated by 90 degrees is required, and a separate apparatus for changing the storage position of the component is required.

In contrast to this, a pivot function may be used at the head of the pick-up element. At this time, an expensive apparatus having a pivot function is required, a pivot holder conforming to the shape and size of the element is required, a rotation radius needs to be secured, and therefore the flexibility of the head inevitably decreases.

Therefore, in the case of a component which is accommodated and supplied in a side direction of the component supply device, an electronic component mounting device which can rotate the component by 90 degrees and can direct the lead part of the component toward the printed circuit board is required.

[ Prior art documents ]

Korean granted patent No. 10-1541838 (grant date: 2015.07.29, Dineeng corporation)

Disclosure of Invention

An object of the present invention is to provide an electronic component mounting apparatus and a mounting method thereof, which can rotate components supplied while being accommodated toward a side surface of a component supply apparatus by 90 degrees.

Another object of the present invention is to provide an electronic component mounting apparatus and a mounting method thereof, which can ensure a space for rotating a component, facilitate the rotation of the component, and reduce the cost for installing equipment for a rotating device of a rotating member.

The technical problems that the present invention is intended to solve are not limited to the above-mentioned technical problems, and other technical problems not mentioned may be clearly understood by those skilled in the art through the following descriptions.

An electronic component mounting apparatus according to an embodiment of the present invention may include: at least one component which is received in a component supply device and supplied, and which is received such that a terminal portion is exposed upward in a first plane while facing downward of the component supply device, or which is received such that a terminal portion is exposed upward in a second plane while facing a side surface direction of the component supply device; a pickup part that picks up one of the first face or the second face of the component; a substrate on which the component is mounted; and a rotating member located between the component supplying apparatus and the substrate, and in a case where the second face of the component is picked up by the pickup member, positioning the picked up component and rotating the component by 90 degrees so that the first face faces the pickup member.

The method can comprise the following steps: an imaging unit that is provided between the rotating unit and the substrate and confirms a suction state of the component picked up by the pickup unit; and a control unit configured to control the driving operations of the rotating member and the pickup member in an interlocking manner by communication.

The method can also comprise the following steps: and an auxiliary photographing part which is arranged between the component supplying device and the rotating part and confirms the suction state of the component picked up by the picking part.

The method can also comprise the following steps: and a communication member configured to link the rotation of the rotating member and the driving of the pickup member by the control unit.

The rotating member may further include: a sensor component that senses a position of the pickup component, senses placement of the element, and senses rotation of the element.

The rotating member may include: a base plate; a rotator provided on the base plate to be rotatable about a first axis and constituting a mounting surface on which the element is mounted; a support member adjacent to the rotator, supporting the element while being in contact with the seating surface according to rotation of the rotator; and a driving part providing power for rotational driving of the rotator.

The seating surface may be formed with a seating groove introduced to the inside to seat and support the element.

When the rotator rotates by taking the first shaft as a center, one side surface of two side surfaces of a placing surface of the rotator is folded with the bottom surface of the base plate, the other side surface of two sides of the placing surface of the rotator is exposed upwards, the first surface of the element can be folded with one surface of the supporting part, and the second surface of the element is exposed upwards.

The driving part may be formed to include a hydraulic cylinder.

Also, the electronic component mounting method according to the embodiment of the present invention may include the steps of: providing a component supply device with a component housed in such a manner that a first surface or a second surface perpendicular to the first surface faces upward; sucking the first surface or the second surface of the component by a suction nozzle of a pickup part; releasing the component sucked to the pickup member to a rotating member when the second surface of the component is housed in an upward direction; rotating the rotating member to position the element with the first face of the element facing upward; sucking the first surface of the component by a suction nozzle of the pickup part; and mounting the element with the first surface adsorbed on a substrate.

When the rotating member is rotated by 90 degrees, the second surface of the element may be moved in a lateral direction and the terminal portion of the element may be directed downward.

After the step of the pickup member adsorbing the first face of the component, the following step may be further included: the state in which the pickup member has attracted the first surface of the element is confirmed by an imaging member formed between the rotating member and the substrate.

The method can also comprise the following steps: confirming, by an auxiliary photographing part between the component supplying apparatus and the rotating part, a state in which the pickup part adsorbs the component before the component is seated on the rotating part.

The rotating member and the pickup member may be linked by a communication member for the pickup of the component, the rotation of the component, and the placement of the component.

Other embodiments are specifically included in the detailed description and the accompanying drawings.

The electronic component mounting apparatus and the mounting method thereof according to the embodiment of the present invention as described above have the following advantages: even in the case where the lead part of the component is housed so as to face the side surface of the component supply device, the component can be automatically rotated by 90 degrees by the component rotating apparatus, so that the component mounting time can be shortened, whereby the productivity can be improved.

Also, the electronic component mounting apparatus and the mounting method thereof according to the embodiment of the present invention have the following advantages since it has a structure in which the picked-up component is mounted on the rotator and the mounted component is rotated according to the rotation of the rotator: the structure or constitution of the rotating device is simple, the unit price of the equipment is low, and the space for the rotatable member is easily secured.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by those skilled in the art from the following description.

Drawings

Fig. 1 is a diagram schematically illustrating an electronic component mounting apparatus according to an embodiment of the present invention.

Fig. 2 is a diagram schematically illustrating a component housed in a component supply device in an electronic component mounting device according to an embodiment of the present invention.

Fig. 3 is a diagram schematically illustrating a rotating member in an electronic component mounting apparatus according to an embodiment of the present invention.

Fig. 4 is a diagram schematically showing a state in which a rotary member rotates in an electronic component mounting apparatus according to an embodiment of the present invention.

Fig. 5 is a schematic cross-sectional view of a rotating member in an electronic component mounting apparatus according to an embodiment of the present invention.

Fig. 6 is a schematic block diagram of an electronic component mounting apparatus according to an embodiment of the present invention.

Fig. 7 is a view schematically showing rotation of a component in an electronic component mounting apparatus according to an embodiment of the present invention.

Fig. 8 is a diagram showing an electronic component mounting apparatus according to an embodiment of the present invention and a schematic operation diagram thereof.

Fig. 9 is a schematic plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

Fig. 10 is a view schematically showing an overall operation diagram of an electronic component mounting apparatus according to an embodiment of the present invention, in which an additional photographing part is provided.

Fig. 11 is a flowchart schematically illustrating an electronic component mounting method according to an embodiment of the present invention.

Description of reference numerals:

10: electronic component mounting device

20: component supply device

110: component

110 a: terminal section

111: first side

112: second surface

120: pick-up component

121: suction nozzle

130: substrate

140: rotating part

141: basal disc

142: rotary device

142 a: setting surface

142 b: base surface

142 c: first side surface

142 d: second side surface

1421: placing groove

143: support member

145: driving part

149: sensor component

150: shooting part

160: communication component

180: auxiliary shooting component

190: control unit

Detailed Description

The advantages and features of the present invention and the methods of accomplishing the same will become apparent by reference to the following detailed description of the embodiments taken in conjunction with the accompanying drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments disclosed below, which are provided for the purpose of making the disclosure of the present invention complete and informing a person of ordinary skill in the art to which the present invention pertains of the scope of the present invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Accordingly, in several embodiments, well-known process steps, well-known structures and well-known techniques have not been described in detail in order to avoid obscuring the present invention.

The terminology used in the description is for the purpose of describing the embodiments and is not intended to be limiting of the invention. In this specification, the singular forms also include the plural forms unless specifically mentioned in the sentence. The use of "comprising" and/or "including" in the specification is intended to mean that the presence or addition of one or more other constituent elements, steps, actions, and/or elements other than the mentioned constituent elements, steps, actions, and/or elements is not excluded. Also, "and/or" includes all combinations of the various items mentioned and more than one.

Also, the embodiments described herein will be described with reference to cross-sectional and/or schematic illustrations of idealized exemplary embodiments of the present invention. Accordingly, the morphology of the exemplary figures may vary depending on manufacturing techniques and/or tolerances, etc. Accordingly, embodiments of the present invention are not limited to the specific forms shown, but include variations in form depending on the manufacturing process. In the drawings shown in the present invention, each constituent element may be shown in a somewhat enlarged or reduced form for convenience of explanation. Like reference numerals refer to like elements throughout the specification.

Hereinafter, the present invention will be described with reference to the drawings for describing the electronic component mounting apparatus 10 by way of examples of the present invention.

Fig. 1 is a diagram schematically illustrating an electronic component mounting apparatus 10 according to an embodiment of the present invention. Fig. 2 is a diagram schematically illustrating a component 110 received in a component supply device 20 in an electronic component mounting device 10 according to an embodiment of the present invention.

Referring to fig. 1 and 2, an electronic component mounting apparatus 10 according to an embodiment of the present invention may include a component supplying apparatus 20, a component 110, a pickup member 120, a substrate 130, and a rotating member 140. In addition, as described below, the electronic component mounting apparatus 10 may include a communication component 160, a sensor component 149, and a control unit 190, which are described below.

The component supply device 20 is a structure in which a plurality of components 110 are housed, and can be supplied to the electronic component mounting device 10 in order to mount the plurality of components 110 on the substrate 130.

The component 110 is accommodated in the component supply device 20 and supplied, and can be attached to the substrate 130. The element 110 may be provided with a terminal portion 110a on one surface thereof. The component 110 is received in the component supply device 20, and the terminal portions 110a need to be arranged toward the substrate 130, that is, downward, in order to be mounted on the substrate 130.

Therefore, when the component 110 is stored in the component supply device 20, the terminal portion 110a is preferably stored so as to face downward in order to pick up and attach the pickup member 120 to the board 130, which will be described later. However, the component supply device 20 that accommodates the components 110 may accommodate the components 110 in the component supply device 20 from the side in consideration of the size, the damage of the terminals during transfer, and the like. Specifically, the terminal portions 110a of the components 110 may be received and supplied to the electronic component mounting apparatus 10 so as to face one side surface of the component supply apparatus 20.

Accordingly, the terminal portions 110a of the component 110 can be picked up by the pickup member 120 described later in a state of being directed to the side surface direction, and thus a device capable of changing the positions of the terminal portions 110a of the component 110 to be directed downward is required. Accordingly, a rotating member 140, which will be described later, is provided between the component supply device 20 and the substrate 130, so that it is possible to provide a mechanism capable of changing the pickup direction of the component 110. Hereinafter, a surface of the element 110 facing the mounting surface of the terminal portion 110a may be referred to as a first surface 111, and a surface adjacent to the first surface 111 and located between the mounting surface of the terminal portion 110a and the first surface 111 may be referred to as a second surface 112. In the present invention, the first surface 111 and the second surface 112 may be formed perpendicular to each other. Accordingly, when the component 110 is stored in the component supply device 20, if the terminal portion 110a is directed downward, the first surface 111 of the component 110 may be exposed upward in the component supply device 20. When the component 110 is stored in the component supply device 20, the second surface 112 of the component 110 may be exposed upward in the component supply device 20 if the terminal portion 110a faces a side surface.

The pickup member 120 may pick up one of the first surface 111 or the second surface 112 of the component 110 according to a storage state of the component 110 stored in the component supply device 20. When the component 110 is stored in the component supply apparatus 20 such that the first surface 111 faces upward, the pickup member 120 picks up the first surface 111 of the component 110 exposed upward. In contrast, if the component 110 is stored in the component supply apparatus 20 such that the second surface 112 faces upward, the pickup member 120 picks up the second surface 112 of the component 110 exposed upward.

The component 110 picked up by the pickup device 120 may move according to the movement of the pickup device 120 and be mounted on a substrate 130. However, the component 110 terminal portions 110a need to be picked up so as to face the board 130, that is, so as to face downward. Therefore, if the first surface 111 of the component 110 is picked up by the pickup device 120, the pickup device 120 may transfer the component 110 to the substrate 130 and mount the component to the substrate 130. However, in the case where the pickup part 120 picks up the second surface 112 of the component 110 from the component supply apparatus 20, the component 110 needs to change a pickup position so that the terminal portions 110a can be directed toward the substrate 130.

Therefore, a rotating member 140 may be provided between the component supply device 20 and the substrate 130 to be able to change the terminal portions 110a of the components 110.

Fig. 3 is a diagram schematically illustrating a rotating member 140 in the electronic component mounting apparatus 10 according to an embodiment of the present invention. Fig. 4 is a diagram schematically illustrating a state in which the rotary member 140 is rotated in the electronic component mounting apparatus 10 according to an embodiment of the present invention. Fig. 5 is a schematic cross-sectional view of the rotating member 140 in the electronic component mounting apparatus 10 according to an embodiment of the present invention.

Referring to fig. 3 to 5, the rotating member 140 may be located between the component supply device 20 and the substrate 130. The rotating member 140 may be provided to change the upper position of the element 110 by rotating 90 degrees after the element 110 is seated.

Specifically, in the case where the pickup member 120 picks up the second surface 112 of the component 110, the pickup member 120 may position the component 110 in a state where the second surface 112 is picked up on the rotating member 140 after being positioned on the rotating member 140. The element 110 is mounted on the rotating member 140 in a state where the second surface 112 of the element 110 faces upward, and then rotates together according to the rotation of the rotating member 140. Accordingly, the first face 111 of the component 110 may be placed facing upward and positioned facing the pickup part 120.

The rotating member 140 may include a base plate 141, a rotator 142, a supporting member 143, and a driving part 145.

The base plate 141 may be positioned between the component supply device 20 and the substrate 130, and a supporting member 143 and a rotator 142, which will be described later, may be positioned above the same. A coupling base capable of mounting and dismounting the base plate 141 to and from the electronic component mounting apparatus 10 may be further provided on a lower surface of the base plate 141. Accordingly, the rotating member 140 may be configured to be attachable to and detachable from the electronic component mounting apparatus 10 as needed. The rotating member 140 may be attached to the electronic component mounting apparatus 10 by being attached to or detached from the electronic component mounting apparatus 10, or by being changed in accordance with the size or shape of the component 110.

The rotator 142 may be provided on the base plate 141 to be rotatable around a first axis 142 x. The rotators 142 may respectively include: a seating surface 142a on which the element 110 is seated; a base surface 142b facing the placement surface 142 a; a first side surface 142c facing a support member 143, which will be described later, in a state before the rotation of the rotator 142; and a second side surface 142d opposite to the first side surface 142 c.

The first axis 142x may be located between an end of the first side surface 142c and an end of the base surface 142b to constitute a rotation center of the rotator 142.

When the rotator 142 rotates about the first axis 142x, one side surface (the first side surface 142c) of the two side surfaces of the seating surface 142a of the rotator 142 may be folded with the bottom surface of the base plate 141, and the other side surface (the second side surface 142d) of the two side surfaces of the seating surface 142a of the rotator 142 may be exposed upward.

The seating surface 142a may be located above before rotation according to rotation of the rotator 142, and may be disposed to face a support member 143 described later after rotation.

A seating groove 1421 introduced to the inner side thereof to be able to seat and support the element 110 may be formed at the seating surface 142 a. The seating groove 1421 may be formed to penetrate from one side surface to the other side surface of the rotator 142, i.e., from the first side surface 142c to the second side surface 142 d. The seating groove 1421 may be provided to correspond to the shape of the element 110. Also, since the shape of the element 110 may be variously formed, at least one of the protrusions formed at both sides of the seating groove 1421 may also be equipped as a variable part to be able to change the size of the seating groove 1421. For example, the variable member is coupled to the rotator 142 by a member such as a bolt, and the size of the seating groove 1421 may be varied according to the position of coupling to the rotator 142. The mounting groove 1421 may be variously modified or deformed, for example, in order to prevent the play of the element 110 attached to the mounting groove 1421, an elastic member corresponding to the shape of the element 110 may be provided in the mounting groove 1421, and as a modification thereof, a suction hole due to a pneumatic pressure may be provided in a corresponding surface so that the element 110 does not play during rotation.

The supporting member 143 may be disposed adjacent to the rotator 142 and opposite to the first side 142c of the rotator 142. Also, the supporting part 143 may be provided to contact the seating surface 142a according to the rotation of the rotator 142 and support the element 110 seated in the seating groove 1421.

The driving part 145 may be equipped to provide power for the rotational driving of the rotator 142. The driving part 145 according to an embodiment of the present invention may include a hydraulic cylinder. However, the configuration of the driving unit 145 is not limited to this, and any modification or modification may be made as long as the driving unit is configured to rotate the rotator 142 about the first shaft 142x, such as a motor. As a modification, by providing a lever for converting the vertically downward movement of the pickup part 120 into a rotational movement, it is possible to replace an active type driving portion such as a separate motor, thereby enabling the rotation of the rotator 142.

Fig. 6 is a schematic block diagram of the electronic component mounting apparatus 10 according to an embodiment of the present invention. Fig. 7 is a diagram schematically illustrating rotation of the component 110 in the electronic component mounting apparatus 10 according to an embodiment of the present invention.

Referring to fig. 6 and 7, the electronic component mounting apparatus 10 of the present invention may further include an imaging part 150, a control part 190, a communication part 160, and a sensor part 149.

The photographing part 150 may be provided between the rotating part 140 and the substrate 130. The photographing part 150 may be provided to confirm the suction state of the component 110 picked up by the first surface 111 by the component supply device 20 or the rotating part 140, and the position of the terminal part 110a in the state where the component 110 is sucked. The photographing part 150 may be arranged in an upward manner. The image pickup section 150 is a component for confirming the suction state or position of the component 110 using the picked-up image in the present invention, but is not limited to this, and may be replaced with another sensing section (detection unit) such as a contact sensing sensor. However, in the following description of the present invention, the imaging unit 150 is described as an example of the sensing unit.

The communication member 160 may be provided to cause the control unit 190 to cause the rotation of the rotating member 140 to be interlocked with the driving of the pickup member 120. That is, a work time for realizing the following operation is required: as the rotating member 140 rotates, the element 110 is caused to rotate, thereby assuming a pickable configuration. In order to obtain the optimal time and avoid interference or collision with the pickup member 120, the communication member 160 may be configured to communicate between the driving operation of the rotating member 140 and the driving operation of the pickup member 120.

The sensor part 149 may be provided to the rotating part 140, and may be configured to sense the position of the pickup part 120, sense the placement of the element 110, and sense the rotation of the element 110. The sensor part 149 may be at least one of a position sensor detecting a rotation state of the rotating part 140, a proximity sensor detecting an approach of the pickup part 120, and a pressure sensor detecting a disposition of the element 110.

The control unit 190 may be provided to control the driving operations of the rotating member 140 and the pickup member 120 in conjunction with each other through communication by the communication member 160. And the control section 190 may receive the detection of the sensor member 149 and control the driving of the rotating member 140 and the driving of the pickup member 120 based thereon. As in the above-described modified embodiment, if the driving or switching by the physical contact or force of the pickup member can be operated, it is not necessary to separately provide a control portion for driving the rotating member 140.

Fig. 8 is a diagram showing the electronic component mounting apparatus 10 according to an embodiment of the present invention and a schematic operation diagram thereof. Fig. 9 is a schematic plan view of the electronic component mounting apparatus 10 according to an embodiment of the present invention.

Referring to fig. 8 and 9, the operation of the electronic component mounting apparatus 10 according to the present invention will be described.

The electronic component mounting apparatus 10 as described above may first pick up the component 110 by the pickup unit 120 in a state where the component supplying device 20 is supplied to the electronic component mounting apparatus 10. According to the state of the component 110 picked up by the pickup member 120, for example, if the pickup member 120 picks up the second surface 112 of the component 110, the component 110 may be seated on the rotating member 140 in order to be re-picked up as the first surface 111.

When the component 110 is placed on the rotating member 140, specifically, the component 110 is placed on the seating groove 1421 of the rotator 142, the pickup member 120 may be released from the suction state and moved upward after the component 110 is seated on the rotating member 140.

In a state where the second surface 112 of the element 110 faces upward, the rotator 142 rotates 90 degrees around the first axis 142 x. By the rotation of the rotator 142, the first side surface 142c of the rotator 142 is folded with the bottom surface of the base plate 141. Also, the second side 142d of the rotator 142 may be exposed upward. Also, the seating surface 142a may contact one surface of the supporting member 143. Accordingly, the second surface 112 of the element 110 may contact one surface of the supporting member 143 while maintaining a state of being supported by the seating groove 1421. Also, the first face 111 of the element 110 may be in an upwardly exposed state due to the 90-degree rotation of the rotator 142.

The pickup part 120 rotates to pick up the first face 111 of the component 110 exposed upward. Accordingly, the component 110 can be picked up in a state where the terminal portion 110a of the component 110 faces the substrate 130, and can be mounted and mounted at a set position of the substrate 130.

Fig. 10 is a diagram schematically showing an overall operation diagram in which an additional imaging part is provided in the electronic component mounting apparatus 10 according to an embodiment of the present invention.

Referring to fig. 10, an auxiliary photographing member 180 may be additionally formed between the component supplying apparatus 20 and the rotating member 140. By the auxiliary photographing part 180, the suction state of the component 110 picked up by the pickup part 120 can be confirmed.

Accordingly, in the operation illustrated in fig. 9, after the pickup of the component supply device 20 is performed and before the component 110 is mounted on the rotating member 140, the pickup state of the component 110 may be additionally confirmed by the auxiliary photographing member 180. The auxiliary photographing part 180 may be disposed in an upward manner.

Referring to fig. 11, the electronic component mounting method according to an embodiment of the present invention may include a component providing step, a first suction step S10, a release step S20, a rotation step S30, a second suction step S40, and a mounting step S50.

First, the component 110 received in the component supply device 20 in such a manner that the first surface 111 or the second surface 112 perpendicular to the first surface 111 faces upward may be provided to the electronic component mounting device 10.

After the component supplying device 20 is supplied to the electronic component mounting device 10, the pickup unit 120 moves to the component supplying device 20 and sucks the first side 111 or the second side 112 of the component 110 by the suction nozzle 121 (S10).

The pickup unit 120 picks up the first surface 111 of the component 110 when the component 110 is stored such that the first surface 111 faces upward. When the second surface 112 of the component 110 is stored so as to face upward, the pickup member 120 picks up the second surface 112 of the component 110 (first suction).

When the pickup part 120 picks up the first face 111 of the component 110, since the terminal portions 110a are arranged toward the substrate 130, a rotation step of the component 110 is not required. Therefore, in this case, the component 110 may be mounted on the substrate 130 after being transferred to the image pickup device 150 side to pick up the suction state of the component 110 in a state where the first surface 111 is picked up by the pickup device 120.

If the component 110 is stored in the component supply device 20 such that the second surface 112 of the component 110 faces upward, the component 110 needs to be changed in position so that the first surface 111 can be picked up by the pickup device 120. For this, the component 110, which is adsorbed to the pickup member 120, of the second surface 112 is released from the pickup member 120 and mounted to the rotating member 140 (S20).

The element 110 is disposed and supported on the disposition surface 142a of the rotator 142, and the rotation member 140 rotates centering on the first axis 142x according to the support of the disposition surface 142a (S30). If the rotating member 140 is rotated by 90 degrees, the elements 110 are rotated together by 90 degrees according to the rotation of the rotating member 140, thereby being arranged such that the first face 111 faces upward (S30). When the rotating member 140 is rotated by 90 degrees, the second surface 112 of the element 110 moves in a lateral direction and the terminal portion 110a of the element 110 faces downward.

The pickup member 120 moves toward the rotating member 140 side after the rotation, and sucks the first surface 111 of the element 110 exposed upward (second suction, S40).

The pickup member 120 is transferred to the image pickup member 150 side formed between the rotating member 140 and the board 130, and the image pickup member 150 confirms the suction state of the element 110 sucked to the pickup member 120, the position of the terminal portion 110a, and the like (S45). The component 110, which is confirmed by the image pickup device 150 as to the suction state, the position of the terminal portion 110a, and the like, can be transferred to the substrate 130 and mounted (S50).

After the pickup unit 120 picks up the component 110 from the component supply device 20 and before the component is transferred to the rotating unit 140, the suction state of the component 110 sucked to the pickup unit 120 or the position of the terminal portion 110a may be further confirmed by the auxiliary photographing unit 180 (S15).

The rotating member 140 and the pickup member 120 may be interlocked by a communication member 160 for the pickup of the component 110, the rotation of the component 110, and the mounting of the component 110 according to the respective steps.

Although the embodiments of the present invention have been described with reference to the drawings, those having ordinary skill in the art to which the present invention pertains will appreciate that the present invention may be embodied in other specific forms without changing the technical spirit or essential features thereof. The embodiments described above are therefore to be considered in all respects as illustrative and not restrictive.

Claims

1. An electronic component mounting apparatus comprising:

at least one component which is received in a component supply device and supplied, and which is received such that a first surface thereof is exposed upward with a terminal portion facing downward of the component supply device, or which is received such that a second surface thereof is exposed upward with the terminal portion facing in a side surface direction of the component supply device;

a pickup part that picks up one of the first face or the second face of the component;

a substrate on which the component is mounted; and

a rotating member located between the component supplying apparatus and the substrate, and in a case where the second side of the component is picked up by the pickup member, positioning the picked up component and rotating the component by 90 degrees so that the first side faces the pickup member.

2. The electronic component mounting apparatus as set forth in claim 1, comprising:

a sensing member provided between the rotating member and the substrate, and configured to confirm a suction state of the component picked up by the pickup member; and

and a control unit for controlling the driving operation of the rotating member and the pickup member.

3. The electronic component mounting apparatus as set forth in claim 2, further comprising:

and an auxiliary sensing member, which is provided between the component supply device and the rotating member, and confirms a suction state of the component picked up by the pickup member.

4. The electronic component mounting apparatus as set forth in claim 1, further comprising:

and a control unit for controlling the rotation of the rotating member by controlling the driving of the pickup member.

5. The electronic component mounting apparatus as set forth in claim 2,

the rotating component also includes a sensor component that senses a position of the pickup component, senses placement of the element, and senses rotation of the element.

6. The electronic component mounting apparatus as set forth in claim 1,

the rotating member includes:

a base plate;

a rotator provided on the base plate to be rotatable about a first axis and constituting a mounting surface on which the element is mounted;

a support member adjacent to the rotator, supporting the element while being in contact with the seating surface according to rotation of the rotator; and

and a driving part which provides power for the rotation driving of the rotator.

7. The electronic component mounting apparatus as set forth in claim 6,

the seating surface is formed with a seating groove introduced to an inner side to seat and support the element.

8. The electronic component mounting apparatus as set forth in claim 6,

when the rotator rotates around the first shaft,

one of the two side surfaces of the placing surface of the rotator is folded with the bottom surface of the base plate, and the other side surface of the two side surfaces of the placing surface of the rotator is exposed upwards,

the first face of the element is folded with a face of the support member and the second face of the element is exposed upward.

9. The electronic component mounting apparatus as set forth in claim 6,

the driving portion is formed to include a hydraulic cylinder.

10. An electronic component mounting method comprises the following steps:

providing a component supply device with a component housed in such a manner that a first surface or a second surface perpendicular to the first surface faces upward;

sucking the first surface or the second surface of the component by a suction nozzle of a pickup part;

releasing the component sucked to the pickup member to a rotating member when the second surface of the component is housed in an upward direction;

rotating the rotating member to position the element with the first face of the element facing upward;

sucking the first surface of the component by a suction nozzle of the pickup part;

and mounting the element with the first surface adsorbed on a substrate.

11. The electronic component mounting method according to claim 10, wherein,

when the rotating member is rotated by 90 degrees, the second surface of the element moves in a side direction and the terminal portion of the element faces downward.

12. The electronic component mounting method according to claim 10, wherein,

after the step of the pickup member adsorbing the first face of the component, further comprising the steps of:

the state in which the pickup member has attracted the first surface of the element is confirmed by a sensing member formed between the rotating member and the substrate.

13. The electronic component mounting method according to claim 10, further comprising the steps of:

confirming, by an auxiliary sensing member between the component supply device and the rotating member, a state in which the pickup member adsorbs the component before the component is set on the rotating member.

14. The electronic component mounting method according to claim 10, wherein,

the rotating member and the pickup member are interlocked by a communication member for pickup of the component, rotation of the component, and placement of the component.