CN113664316A - Laser tin ball welding equipment - Google Patents
Laser tin ball welding equipment Download PDFInfo
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- CN113664316A CN113664316A CN202110961261.XA CN202110961261A CN113664316A CN 113664316 A CN113664316 A CN 113664316A CN 202110961261 A CN202110961261 A CN 202110961261A CN 113664316 A CN113664316 A CN 113664316A
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- 238000003466 welding Methods 0.000 title claims abstract description 112
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims abstract description 180
- 239000000463 material Substances 0.000 claims abstract description 115
- 238000001514 detection method Methods 0.000 claims abstract description 55
- 239000000969 carrier Substances 0.000 claims abstract description 22
- 238000007599 discharging Methods 0.000 claims description 30
- 238000003825 pressing Methods 0.000 claims description 27
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000005476 soldering Methods 0.000 claims description 11
- 230000003028 elevating effect Effects 0.000 claims 2
- 230000000694 effects Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- 230000003139 buffering effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004579 marble Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides laser tin ball welding equipment which comprises a conveying device, a first material taking device, a cover plate device, a first detection device, a second detection device, a welding device, a second material taking device and a plurality of groups of mobile feeding devices, wherein the conveying device is arranged on a rack and used for conveying carriers with workpieces and backflow of empty carriers; the cover plate device is used for placing a fixed cover plate on a carrier so as to reinforce the placement of workpieces on the carrier, the first detection device comprises a first detection mechanism and a height measuring mechanism, the second detection device is used for detecting a welding device, the welding device is used for welding the workpieces on the carrier, and the second material taking device is used for placing the carrier on the movable feeding device on the conveying device.
Description
Technical Field
The invention relates to the technical field of automation equipment, in particular to laser tin ball welding equipment.
Background
In the prior art, components on a plurality of workpieces are connected and fixed through welding. The mobile phone camera is widely applied to a portable information terminal as an image acquisition functional module, and all parts in the camera also need to be fixed through welding. Some existing welding equipment usually needs manual operation, an operator places a workpiece to be welded on a tool clamp, and then a machine is started to perform welding treatment, so that the automation degree is low, and the welding machining efficiency is low.
Therefore, it is necessary to provide a laser solder ball soldering apparatus with reasonable structural layout, high efficiency and good soldering effect.
Disclosure of Invention
The invention aims to provide laser tin ball welding equipment with high efficiency and good welding effect.
In order to achieve the purpose, the invention provides laser tin ball welding equipment which comprises a conveying device, a first material taking device, a cover plate device, a first detection device, a second detection device, a welding device, a second material taking device and a plurality of groups of mobile feeding devices, wherein the conveying device is arranged on a rack and is used for conveying carriers with workpieces and backflow of empty carriers; the cover plate device is used for placing a fixed cover plate on the carrier, and/or the cover plate device is used for picking up the fixed cover plate on the carrier, the first detection device comprises a first detection mechanism and a height measuring mechanism, the first detection mechanism is used for detecting the welding position of a workpiece, the height measuring mechanism is used for detecting whether the fixed cover plate is placed on a preset position of the carrier, the second detection device is used for detecting the welding device, the welding device is used for welding the workpiece on the carrier, and the second material taking device is used for placing the carrier on the movable feeding device on the conveying device.
Preferably, the rack is provided with a first portal frame and a second portal frame, the first material taking device and the first detecting device are arranged on two sides of the first portal frame relatively, the cover plate device is arranged at the bottom of the beam of the first portal frame, and the welding device and the second material taking device are arranged on two side faces of the second portal frame relatively.
Preferably, the conveying device comprises a feeding mechanism, a discharging mechanism and a backflow mechanism, the feeding mechanism and the discharging mechanism are oppositely arranged at two ends of the rack, and the backflow mechanism is positioned between the feeding mechanism and the discharging mechanism and inside the rack; the feeding mechanism comprises a first conveying assembly and a first jacking assembly, the first conveying assembly is used for conveying the carrier, and the first jacking assembly acts to jack the carrier conveyed on the first conveying assembly, so that the carrier is picked up by the first material taking device on the feeding mechanism.
Preferably, the first material taking mechanism comprises a first traversing mechanism arranged on the first portal frame and a first material taking mechanism arranged on the traversing mechanism in a sliding manner, and the first material taking mechanism comprises a code scanning assembly for identifying the carrier, a material clamping assembly for clamping the carrier and a buffering limiting assembly for limiting.
Preferably, the cover plate device comprises a cover plate mechanism for taking and placing a fixed cover plate and a material pressing mechanism for pressing materials, the cover plate mechanism comprises a cover plate cylinder and a cover plate assembly located at the output end of the cover plate cylinder, and the cover plate cylinder acts to drive the cover plate assembly to stretch and move so as to take and place the fixed cover plate; the pressing mechanism comprises a pressing cylinder and a pressing component positioned at the output end of the pressing cylinder, and the pressing component comprises an elastic part protruding into the cover plate mechanism; the cover plate mechanism places the fixed cover plate on the carrier, and the material pressing cylinder acts to enable the elastic piece to act on the fixed cover plate, so that the fixed cover plate can be attached to the carrier.
Preferably, a plurality of mobile feeding devices are arranged on the rack, each mobile feeding device comprises a mobile module and a turntable mechanism arranged on the mobile module in a sliding manner, each turntable mechanism comprises a power assembly and a discharging assembly located at the output end of the power assembly, each discharging assembly is used for placing a carrier, and the power assembly acts to enable each discharging assembly to rotate by a preset angle.
Preferably, the first detection device comprises a second traversing mechanism and at least one first detection mechanism arranged on the second traversing mechanism in a sliding manner, the height measuring mechanism is arranged on the first detection mechanism, the first detection mechanism comprises a first lifting component and a first CCD camera arranged on the first lifting component, and the welding position on the workpiece can be detected by the first CCD camera.
Preferably, the second detection device is located in the frame and partially protrudes out of the frame, and the second detection device includes a second CCD camera for shooting and detecting the welding device.
Preferably, the welding device comprises a third traversing mechanism and at least one welding mechanism arranged on the third traversing mechanism, the welding mechanism is provided with a second lifting component and at least one welding component arranged on the second lifting component, and the welding component is used for welding the workpiece.
Preferably, the carrier is provided with a material taking part matched with the first material taking device and the second material taking device, a first positioning part matched with the fixed cover plate and a magnetic part for adsorbing the fixed cover plate, and the fixed cover plate is provided with a second positioning part matched with the first positioning part.
After the technical scheme is adopted, the laser tin ball welding equipment comprises a conveying device, a first material taking device, a cover plate device, a first detection device, a second detection device, a welding device, a second material taking device and a plurality of groups of movable feeding devices, wherein the conveying device, the first material taking device, the cover plate device, the first detection device, the second detection device, the welding device, the second material taking device and the plurality of groups of movable feeding devices are arranged on a rack. The conveying device is used for conveying carriers with workpieces and refluxing empty carriers, the groups of movable feeding devices are provided with turntable mechanisms, and the carriers with the workpieces can be placed on the turntable mechanisms through the first material taking devices. The rack is also provided with a first portal frame and a second portal frame, and the first material taking device and the first detection device are arranged on two sides of the first portal frame relatively and can move back along a beam of the first portal frame. The first material taking device is used for picking up the carrier from the conveying device and placing the carrier on the movable feeding device, the cover plate device is located between the first material taking device and the first detection device and located at the bottom of the first portal frame beam, the structure is reasonably and compactly arranged, the cover plate device is used for placing a fixed cover plate and/or the cover plate device on the carrier and picking up the fixed cover plate on the carrier, a first detection mechanism on the first detection device is used for detecting the welding position of the workpiece, a height measuring mechanism on the first detection device is used for detecting whether the fixed cover plate is placed on a preset position of the carrier or not, and whether the fixed cover plate is placed on the carrier or not is detected to be parallel or not, so that whether the workpiece is placed in the carrier or not is judged. Welding set and second extracting device set up in the both sides of second portal frame relatively, and second detection device sets up in the frame and is used for detecting welding head to welding set, detects whether the welding tip is intact, whether have the tin dross in the welding tip, whether need change or clearance welding tip etc.. The welding device is used for welding workpieces on the carrier on the movable feeding device, and the second material taking device is used for placing the welded carrier and the workpieces on the conveying device to convey the workpieces to the next procedure. The laser tin ball welding equipment has the advantages of reasonable and compact overall structural layout, high welding efficiency and good welding effect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a laser solder ball bonding apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic view of the internal structure of fig. 1 with the housing removed.
Fig. 3 is a schematic view of the structure of fig. 2 from another angle.
Fig. 4 is a schematic view of a further angle of fig. 2.
Fig. 5 is a schematic view of the structure of the feeding mechanism in fig. 2.
Fig. 6 is a schematic view of the structure at another angle in fig. 5.
Fig. 7 is a schematic structural view of the turntable mechanism in fig. 2.
Fig. 8 is a schematic view of another state of fig. 7.
Fig. 9 is a schematic view of the first reclaimer assembly of fig. 2.
Fig. 10 is a schematic view of the structure of the cover plate device in fig. 2.
Fig. 11 is a schematic structural diagram of the first detecting device in fig. 2.
Fig. 12 is a schematic structural diagram of the second detecting device in fig. 2.
Fig. 13 is a schematic view of the welding apparatus of fig. 2.
Description of reference numerals:
100. laser tin ball welding equipment; 101. a frame; 102. a housing; 103. a first gantry; 104. a second gantry; 105. fixing the cover plate; 1051. a second positioning portion;
10. a conveying device; 11. a feeding mechanism; 111. a first transfer assembly; 112. a transfer motor; 113. a first jacking assembly; 12. a discharging mechanism; 121. a second transfer assembly; 122. a second jacking assembly; 123. the material blocking component; 13. a reflux mechanism;
20. moving the feeding device; 21. a moving module; 22. a turntable mechanism; 221. a power assembly; 222. a transmission assembly; 223. a discharging component;
30. a first material taking device; 31. a first traversing mechanism; 32. a first material taking mechanism; 321. a material clamping component; 3211. a material clamping cylinder; 3212. clamping the material; 322. a buffer limiting component; 323. a code scanning component; 324. a lifting cylinder;
40. a cover plate device; 41. a cover plate mechanism; 411. a cover plate cylinder; 412. a cover plate assembly; 42. a material pressing mechanism; 421. a material pressing cylinder; 422. an elastic member;
50. a first detection device; 51. a second traversing mechanism; 52. a first detection mechanism; 521. a first lifting assembly; 522. a first CCD camera; 523. a first light source; 53. a height measuring mechanism;
60. a second detection device; 61. a second light source; 62. a second CCD camera;
70. a welding device; 71. a third traversing mechanism; 72. a welding mechanism;
80. a second material taking device;
90. a carrier; 91. a discharging part; 92. a material taking part; 93. a magnetic member; 94. a first positioning portion.
Detailed Description
In order to explain technical contents and structural features of the present invention in detail, the following description is made with reference to the embodiments and the accompanying drawings.
Referring to fig. 1 to 4, the present invention provides a laser solder ball soldering apparatus 100 for soldering a camera of a mobile phone. The laser tin ball welding device 100 comprises a rack 101, a housing 102 covering the rack 101, a conveying device 10, a first material taking device 30, a cover plate device 40, a first detection device 50, a second detection device 60, a welding device 70, a second material taking device 80 and a plurality of groups of moving feeding devices 20, wherein the conveying device 10, the first material taking device 30, the cover plate device 40, the first detection device 50, the second detection device 60, the welding device 70, the second material taking device 80 and the groups of moving feeding devices 20 are arranged on the rack 101. The transport device 10 is used for transporting the carriers 90 with workpieces and the return flow of the empty carriers 90. The first material taking device 30 picks up the carrier 90 with the workpiece on the conveying device 10 and places the carrier on the moving feeding device 20. The mobile feeding device 20 conveys the carrier 90 on which the workpiece is placed, and passes through the cover device 40, the first detecting device 50, the welding device 70, and the second taking device 80 in sequence. The cover device 40 is used to place a fixed cover 105 on the carrier 90 and/or the cover device 40 is used to pick up a fixed cover 105 on the carrier 90. The cover device 40 places the fixed cover 105 on the carrier 90, so that the placement of the workpiece on the carrier 90 can be reinforced, and the cover device 40 unloads the fixed cover 105 on the carrier 90, so that the fixed cover 105 can be recycled. The first detection device 50 includes a first detection mechanism 52 and a height measurement mechanism 53, and the first detection mechanism 52 is used for detecting the welding position of the workpiece to ensure that the subsequent welding can be performed smoothly. The height measuring mechanism 53 is used to detect whether the fixed cover 105 is placed on a predetermined position of the carrier 90, where the predetermined position is a position where the fixed cover 105 is attached to the carrier 90. For example, the height measuring mechanism 53 can emit two laser detection points at the same time, and if the heights of the two laser detection points are not consistent, it indicates that the workpiece in the fixed cover plate 105 or the carrier 90 is not placed well and needs to be adjusted. The second detecting device 60 is used for detecting the welding head of the welding device 70, and detecting whether the welding tip is intact, whether tin dross exists in the welding tip, whether the welding tip needs to be replaced or cleaned, and the like. The welding device 70 is used to weld workpieces on the carrier 90. The second material taking device 80 is used for placing the carrier 90 on the moving feeder 20 on the conveyor 10.
Referring to fig. 2 to 4, in some alternative embodiments, a first gantry 103 and a second gantry 104 are disposed on the frame 101. The bottom plate that is used for installing each device on the frame 101 can be marble structure, and first portal frame 103 and second portal frame 104 also can be marble structure, and the structure that adopts the marble to make can effectively carry out the shock attenuation to make overall structure more firm. The first material taking device 30 and the first detecting device 50 are oppositely arranged on two sides of the first portal frame 103, and can slide back and forth along a beam of the first portal frame 103. The cover plate device 40 is positioned at the bottom of the beam of the first portal frame 103, the structure of each device is reasonably arranged, and the whole space of the whole equipment is fully utilized. The welding device 70 and the second material taking device 80 are oppositely arranged on two sides of the second portal frame 104 and can slide back and forth along the beam of the second portal frame 104.
Referring to fig. 2-6, in some alternative embodiments, the conveyor 10 includes a feeding mechanism 11, a discharging mechanism 12, and a returning mechanism 13. Feed mechanism 11 and discharge mechanism 12 set up in the both ends of frame 101 relatively, and return mechanism 13 is located between feed mechanism 11 and discharge mechanism 12 and sets up under frame 101 bottom plate and be located inside frame 101, the abundant whole space that has utilized the board, and structural configuration sets up rationally. The feeding mechanism 11 is a pre-docking process for conveying the carrier 90 on which the workpiece is placed. Specifically, the feeding mechanism 11 includes a first conveying assembly 111 and a first jacking assembly 113, the first conveying assembly 111 is used for conveying the carrier 90, the first jacking assembly 113 acts to jack up the carrier 90 conveyed on the first conveying assembly 111, and the first jacking assembly 113 jacks up and positions the carrier 90 so that the first material taking device 30 can pick up the carrier 90 on the feeding mechanism 11. The first conveying assembly 111 is connected to the conveying motor 112, and the conveying motor 112 is activated to drive the carrier 90 on the first conveying assembly 111 to convey. The first conveying assembly 111 includes a plurality of conveying rollers disposed on two sides, and the first jacking assembly 113 is disposed between the rollers on two sides, so that when the carrier 90 is conveyed to a position for taking material, the carrier 90 is jacked away from the first conveying assembly 111 by the first jacking assembly 113 and positioned at a certain position, so that the first material taking device 30 can accurately take the carrier 90.
Referring to fig. 3, in some optional embodiments, the discharging mechanism 12 is provided with a second conveying assembly 121 for conveying the carrier 90, and the discharging mechanism 12 further includes a second jacking assembly 122 for jacking up the receiving material and a material blocking assembly 123 for blocking the material. The second transfer assembly 121 and the second jacking assembly 122 have a structure similar to that of the first transfer assembly 111 and the first jacking assembly 113. The second conveying assembly 121 also includes a plurality of conveying rollers disposed on two sides, and the second jacking assembly 122 is disposed between the rollers on two sides. When the second material taking device 80 picks up the carrier 90 and approaches the discharging mechanism 12, the second jacking assembly 122 protrudes out of the second conveying assembly 121 to receive the carrier 90 on the second material taking device 80, and the second jacking assembly 122 carries the carrier 90 to reset so as to place the carrier 90 on the second conveying assembly 121 for conveying. On the other hand, the material blocking assembly 123 is arranged to suspend the carrier 90 on the second conveying assembly 121, so that the carrier 90 can be better placed on the second conveying assembly 121 to be conveyed, the carrier 90 is prevented from being conveyed without being adjusted, and the conveying effect is better.
Referring to fig. 9, in some alternative embodiments, the first material taking mechanism 32 includes a first traversing mechanism 31 disposed on one side of the first gantry 103 and the first material taking mechanism 32 slidably disposed on the traversing mechanism. First sideslip mechanism 31 can be for setting up the sharp module on first portal frame 103 crossbeam, and the sharp module can drive first feeding agencies 32 and slide. Specifically, the first material taking mechanism 32 includes a code scanning assembly 323 for identifying the carrier 90, a material clamping assembly 321 for clamping the carrier 90, a buffering and limiting assembly 322 for limiting, and further includes a lifting cylinder 324 for lifting. The lifting cylinder 324 acts to drive the whole first material taking mechanism 32 to lift, so that the material clamping assembly 321 can take and place materials more conveniently. The code scanning assembly 323 is used for reading the bar code on the carrier 90 to confirm the workpieces on the carrier 90 and the welding positions of the workpieces to be welded, so that the loss caused by the wrong material feeding or the misplaced material feeding position can be avoided, and the code scanning assembly 323 can better and more accurately perform welding. The material clamping assembly 321 includes a material clamping cylinder 3211 and material clamping members 3212 connected to the material clamping cylinder 3211, wherein the material clamping cylinder 3211 operates to move the material clamping members 3212 on both sides to approach each other to clamp the carrier 90, or the material clamping cylinder 3211 operates to move the material clamping members 3212 on both sides to move away from each other to put down the carrier 90. The buffering limiting component 322 comprises a buffering limiting part provided with a spring, and the buffering limiting component 322 can abut against the carrier 90 which is taken, so that the carrier 90 can be stably picked up according to a certain state, and can be better placed on the mobile feeding device 20.
Referring to fig. 10, in some alternative embodiments, the cover device 40 is disposed at the bottom of the beam of the first gantry 103, and the cover device 40 is correspondingly disposed right above each mobile feeding device 20. The cover device 40 includes a cover mechanism 41 for taking and placing the fixed cover 105 and a pressing mechanism 42 for pressing. Specifically, the cover mechanism 41 includes a cover cylinder 411 and a cover assembly 412 located at an output end of the cover cylinder 411, and the cover cylinder 411 acts to drive the cover assembly 412 to move in a telescopic manner so as to be able to pick and place the fixed cover 105. The pressing mechanism 42 includes a pressing cylinder 421 and a pressing component located at the output end of the pressing cylinder 421, and the pressing component includes an elastic member 422 protruding into the cover plate mechanism 41. The cover mechanism 41 places the fixed cover 105 on the carrier 90, and the pressing cylinder 421 acts to make the elastic member 422 act on the fixed cover 105, so that the fixed cover 105 can be attached to the carrier 90. The elastic member 422 presses the material to prevent the fixed cover 105 from damaging the workpiece on the carrier 90. The elastic member 422 may be a spring or the like. In general, the fixed cover plate 105 is picked up by the cover plate mechanism 41 for material waiting, and when the carrier 90 needs to fix the fixed cover plate 105 to assist welding, the fixed cover plate 105 is placed on the carrier 90 and pressed and fixed. After the welding is completed, the mobile feeding device 20 returns the carrier 90 to the underside of the cover device 40 again, and the cover device 40 retrieves the fixed cover 105 to be placed on the carrier 90 to be welded next time. The carrier 90 with the fixed cover 105 removed is then transferred to the next process. In the cover plate device 40 in this embodiment, the fixed cover plate 105 can be reused, and a material placing mechanism for placing the fixed cover plate 105 is not required to be additionally arranged, so that the overall structure is reasonable and simpler in arrangement. In another embodiment, a linear module may be disposed at the bottom of the beam of the first portal frame 103, the cover device 40 is slidably disposed on the linear module, and a material placing mechanism for placing the fixed cover 105 may be disposed between any two of the mobile feeding devices 20. In this embodiment, one cover device 40 is matched with the discharging mechanism, so that the plate placing and taking device can be suitable for placing and taking plates of carriers 90 on multiple groups of mobile feeding devices 20. In yet another embodiment, the beam bottoms of the first gantry 103 and the second gantry 104 can be provided with linear modules, and each linear module is provided with at least one cover plate device 40. A discharging mechanism capable of reflowing the fixed cover plate 105 can be further arranged on the rack 101, and a reflow line can be arranged inside the rack 101. Illustratively, the cover device 40 on the first portal frame 103 picks up the fixed cover 105 on the drop off mechanism and places the fixed cover 105 on the carrier 90 conveyed on the mobile feeding device 20, and by detection and welding, the mobile feeding device 20 conveys the carrier 90 with welded workpieces to the cover device 40 on the second portal frame 104, and the cover device 40 on the second portal frame 104 picks up the fixed cover 105 and places the fixed cover 105 on the drop off mechanism and conveys the fixed cover 105 to the cover device 40 on the side of the first portal frame 103 through a return line inside the rack 101. The cover plate device 40 of the embodiment does not need to return to the cover plate device 40 of the first portal frame 103 after the movable feeding device 20 is welded, so that the production efficiency can be more effectively improved.
Referring to fig. 2, 3, 7 and 8, in some alternative embodiments, a plurality of mobile feeding devices 20 are disposed on the frame 101. Each moving feeding device 20 comprises a moving module 21 and a turntable mechanism 22 slidably disposed on the moving module 21. The plurality of moving modules 21 are equidistantly and parallelly arranged on the rack 101. Specifically, the turntable mechanism 22 includes a power assembly 221 and a discharging assembly 223 at an output end of the power assembly 221, the discharging assembly 223 is used for placing the carrier 90, and the power assembly 221 acts to rotate the discharging assembly 223 by a preset angle. The predetermined angle is a preferred angle for the carrier 90 on the discharging assembly 223 to cooperate with the welding device 70. Wherein, a transmission assembly 222 is further arranged between the power assembly 221 and the emptying assembly 223. Power component 221 can be servo motor, and transmission assembly 222 can be for the reduction gear subassembly with servo motor complex, through servo motor and reduction gear subassembly's cooperation for blowing subassembly 223 can rotate to stop on removing module 21 and predetermine the angle, thereby makes the welding set 70 that the work piece that is located carrier 90 on revolving stage mechanism 22 can be better cooperate, realizes the angle and welds, and the welding effect is better. Specifically, the discharging component 223 includes a rotating shaft connected to the reduction gear component, and fixing seats are disposed at two ends of the rotating shaft, and a discharging plate for placing the carrier 90 is connected to the rotating shaft. The rotating shaft can drive the discharging part to rotate between the two fixing seats under the driving of the power assembly 221 and the transmission assembly 222. It can be understood that the material placing plate for placing the carrier 90 is provided with a material placing groove for adsorbing and fixing the carrier 90, that is, the carrier 90 can be locked or unlocked and placed on the material placing plate.
Referring to fig. 2, fig. 3 and fig. 11, in some optional embodiments, the first detecting device 50 includes a second traversing mechanism 51 and at least one first detecting mechanism 52 slidably disposed on the second traversing mechanism 51, the first detecting mechanism 52 includes a first lifting assembly 521 and at least one height measuring mechanism 53 disposed on the first lifting assembly 521, and the first lifting assembly 521 can drive the height measuring mechanism 53 to move up and down so as to approach or move away from the moving feeding device 20 for detection. The height measuring mechanism 53 is used for detecting the height of the fixed cover 105 to determine whether the fixed cover 105 is placed on a predetermined position of the carrier 90. It can be understood that, because a plurality of sets of mobile feeding devices 20 may be disposed on the rack 101, the plurality of sets of mobile feeding devices 20 may be simultaneously used to convey the carrier 90, so as to improve the production efficiency, and each mobile feeding device 20 may be correspondingly disposed with the first detecting mechanism 52, so as to perform the height measurement detection on the carrier 90 and the fixed cover plate 105 on the first detecting mechanism 52 in time. In this embodiment, a plurality of workpieces can be placed on the carrier 90, at least one height measurement mechanism 53 is disposed on the first detection mechanism 52, and the plurality of height measurement mechanisms 53 can detect different ranges on the carrier 90 at the same time, so that the detection is faster and more accurate. Of course, one first detection mechanism 52 may be provided on the second traverse mechanism 51, and the carriers 90 on different mobile feeding devices 20 may be detected by the sliding of the first detection mechanism 52 on the second traverse mechanism 51. Specifically, the laser height measurement assembly 522 comprises a first CCD camera 522 and a first light source 523, and the image capture by the first CCD camera 522 is matched with the laser height measurement, so that the detection effect is good.
Referring to fig. 2, 3 and 12, in some alternative embodiments, the second detecting device 60 is located in the frame 101 and partially protrudes out of the frame 101, and the second detecting device 60 includes a second CCD camera 62 and a second light source 61, and the second CCD camera 62 is used for shooting and detecting the welding device 70. It will be appreciated that the first inspection device 50 is used to inspect a workpiece and the second inspection device 60 is used to inspect the welding device 70. The soldering apparatus 70 is a laser solder ball soldering apparatus 70, and the soldering apparatus 70 is provided with a nozzle through which solder balls flow, and the second detecting device 60 can clearly know whether the nozzle is clogged or not, so that soldering can be smoothly performed. The second detection device 60 is disposed on one side of the rack 101, and is reasonable in structural layout.
Referring to fig. 2, 3 and 13, in some alternative embodiments, the welding device 70 includes a third traversing mechanism 71 and at least one welding mechanism 72 disposed on the third traversing mechanism 71. Wherein, the welding mechanism 72 is provided with a second lifting component and at least one welding component positioned on the second lifting component, and the welding component is used for welding workpieces. The second lifting component can drive the welding component to lift to be close to a workpiece to be welded. In the embodiment, the total number of the workpieces on one carrier 90 is 24, and the workpieces can be welded more quickly by matching a plurality of welding assemblies, so that the welding efficiency is effectively improved. Under the effect of revolving stage mechanism 22 for the work piece can be better the welding subassembly cooperate, and it is effectual to weld.
Referring to fig. 2, 3 and 5, in some alternative embodiments, the carrier 90 is provided with a plurality of material placing portions 91 for placing workpieces, a material taking portion 92 cooperating with the first material taking device 30 and the second material taking device 80, a first positioning portion 94 cooperating with the fixed cover plate 105 and a magnetic member 93 for attracting the fixed cover plate 105, and the fixed cover plate 105 is provided with a second positioning portion 1051 cooperating with the first positioning portion 94. It can be understood that, in order to pick up the carrier 90 more conveniently, the side of the carrier 90 is provided with the material taking part 92 for the first material taking device 30 and the second material taking device 80 to take materials, and the picked-up carrier 90 can be placed on the turntable mechanism 22 or the conveying device 10 more accurately through the positioning of the material taking part 92. And the carrier 90 can be picked up by the first material taking device 30 or the second material taking device 80 more stably through the material taking part 92. Specifically, the carrier 90 is further provided with a first positioning portion 94 engaged with the fixed cover plate 105, the fixed cover plate 105 is provided with a second positioning portion 1051 engaged with the first positioning portion 94, the first positioning portion 94 may be a positioning column, and the second positioning portion 1051 may be a positioning hole engaged with the positioning column. The fixing cover plate 105 is stably disposed on the carrier 90 by the cooperation of the first positioning portion 94 and the second positioning portion 1051, and then the fixing cover plate 105 is fixedly attracted to the carrier 90 by the magnetic member 93 of the carrier 90, so that when the turntable mechanism 22 drives the carrier 90 to rotate, the workpiece on the carrier 90 can be stably located at the related material level without moving.
The operation of the laser solder ball bonding apparatus 100 of the present invention is described below with reference to fig. 1 to 13:
first, the carrier 90 with the workpiece placed thereon in the above step is fed from the feeding mechanism 11 of the conveying device 10, the first conveying assembly 111 in the feeding mechanism 11 conveys the carrier 90, the first lifting assembly 113 operates to lift the carrier 90 conveyed on the first conveying assembly 111, and the carrier 90 is picked up by the first material-taking device 30 and placed on the turntable mechanism 22 of the mobile feeding device 20.
Next, the moving feeding device 20 is operated to make the turntable mechanism 22 drive the carrier 90 to slide to the lower side of the cover device 40, the cover device 40 is operated to place the fixed cover 105 on the carrier 90, and the fixed cover 105 is pressed on the carrier 90 under the action of the pressing assembly.
Next, the first detecting device 50 performs laser height measurement on the fixed cover 105 and the carrier 90 to determine whether the fixed cover 105 is placed at a proper position on the carrier 90.
Meanwhile, the second detecting device 60 detects the welded assembly of the welding device 70 to ensure that the welding device 70 can smoothly perform welding.
Then, the moving feeding device 20 drives the turntable mechanism 22 and the carrier 90 thereon to slide to the welding device 70, and the turntable mechanism 22 rotates to a preset position according to welding requirements, so that the welding device 70 can better weld the workpiece on the carrier 90.
After the welding is completed, the movable feeding device 20 drives the turntable mechanism 22 to return to the cover device 40, the turntable mechanism 22 is rotated and reset, and the cover device 40 removes the fixed cover 105 on the turntable mechanism 22.
Finally, the moving feeding device 20 drives the turntable mechanism 22 and the carriers 90 thereon to move to the discharging mechanism 12, the second material taking device 80 picks up and places the carriers 90 on the turntable mechanism 22 on the discharging mechanism 12, and conveys the carriers to the next process, and the empty carriers 90 flow back to the original stations through the backflow mechanism 13.
As shown in fig. 1 to 13, the laser solder ball soldering apparatus 100 of the present invention includes a conveying device 10, a first material taking device 30, a cover device 40, a first detecting device 50, a second detecting device 60, a soldering device 70, a second material taking device 80 and a plurality of sets of moving feeding devices 20, which are disposed on a frame 101. The conveying device 10 is used for conveying carriers 90 with workpieces and for returning empty carriers 90, a plurality of groups of mobile feeding devices 20 are provided with a turntable mechanism 22, and the carriers 90 with workpieces can be placed on the turntable mechanism 22 through the first material taking device 30. The rack 101 is further provided with a first portal frame 103 and a second portal frame 104, and the first material taking device 30 and the first detecting device 50 are oppositely arranged on two sides of the first portal frame 103 and can move back along a beam of the first portal frame 103. The first material taking device 30 is used for picking up the carrier 90 from the conveying device 10 and placing the carrier on the mobile feeding device 20, and the cover device 40 is located between the first material taking device 30 and the first detecting device 50 and at the bottom of the beam of the first portal frame 103, so that the structure and the arrangement are reasonable and compact. The cover device 40 is used for placing the fixed cover 105 on the carrier 90 to reinforce the placement of the workpiece on the carrier 90, and also can take back the fixed cover 105 from the carrier 90 after the welding is completed. The first detecting device 50 includes a first detecting mechanism 52 and a height measuring mechanism 53, the first detecting mechanism 52 is used for detecting the welding position of the workpiece, and the height measuring mechanism 53 is used for detecting whether the fixed cover plate 105 is placed on the carrier 90 in parallel, so as to determine whether the workpiece is placed in the carrier 90. The welding device 70 and the second material taking device 80 are arranged on two sides of the second portal frame 104, and the second detection device 60 is arranged on the frame 101 and used for detecting a welding head of the welding device 70, detecting whether a welding tip is intact, whether tin slag exists in the welding tip, whether the welding tip needs to be replaced or cleaned, and the like. The welding device 70 is used for welding the workpieces on the carriers 90 on the mobile feeding device 20, and the second material taking device 80 is used for placing the welded carriers 90 and the workpieces on the conveying device 10 for conveying to the next process. The laser tin ball welding equipment 100 has the advantages of reasonable and compact overall structural layout, high welding efficiency and good welding effect.
The above disclosure is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, so that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.
Claims (10)
1. A laser tin ball welding device is characterized by comprising a conveying device, a first material taking device, a cover plate device, a first detection device, a second detection device, a welding device, a second material taking device and a plurality of groups of movable feeding devices, wherein the conveying device is used for conveying carriers with workpieces and backflow of empty carriers; the cover plate device is used for placing a fixed cover plate on the carrier, and/or the cover plate device is used for picking up the fixed cover plate on the carrier, the first detection device comprises a first detection mechanism and a height measuring mechanism, the first detection mechanism is used for detecting the welding position of the workpiece, the height measuring mechanism is used for detecting whether the fixed cover plate is placed on the preset position of the carrier, the second detection device is used for detecting the welding device, the welding device is used for welding the workpiece on the carrier, and the second material taking device is used for placing the carrier on the movable feeding device on the conveying device.
2. The laser solder ball welding equipment of claim 1, wherein a first portal frame and a second portal frame are arranged on the rack, the first material taking device and the first detecting device are oppositely arranged on two sides of the first portal frame, the cover plate device is arranged at the bottom of a beam of the first portal frame, and the welding device and the second material taking device are oppositely arranged on two side faces of the second portal frame.
3. The laser solder ball soldering apparatus according to claim 1, wherein the conveyor comprises a feeding mechanism, a discharging mechanism and a reflow mechanism, the feeding mechanism and the discharging mechanism are oppositely arranged at two ends of the rack, and the reflow mechanism is located between the feeding mechanism and the discharging mechanism and inside the rack; the feeding mechanism comprises a first conveying assembly and a first jacking assembly, the first conveying assembly is used for conveying the carrier, and the first jacking assembly acts to jack the carrier conveyed on the first conveying assembly, so that the carrier is picked up by the first material taking device on the feeding mechanism.
4. The laser solder ball bonding apparatus of claim 2, wherein the first material taking mechanism comprises a first traversing mechanism disposed on the first gantry and a first material taking mechanism slidably disposed on the traversing mechanism, and the first material taking mechanism comprises a code scanning assembly for identifying the carrier, a material clamping assembly for clamping the carrier and a buffer limiting assembly for limiting.
5. The laser solder ball welding device of claim 1, wherein the cover device comprises a cover mechanism for taking and placing a fixed cover and a pressing mechanism for pressing, the cover mechanism comprises a cover cylinder and a cover assembly at the output end of the cover cylinder, and the cover cylinder acts to drive the cover assembly to move telescopically so as to take and place the fixed cover; the pressing mechanism comprises a pressing cylinder and a pressing component positioned at the output end of the pressing cylinder, and the pressing component comprises an elastic piece protruding into the cover plate mechanism; the cover plate mechanism places the fixed cover plate on the carrier, and the material pressing cylinder acts to enable the elastic piece to act on the fixed cover plate, so that the fixed cover plate can be attached to the carrier.
6. The laser solder ball welding device of claim 1, wherein a plurality of the mobile feeding devices are disposed on the rack, each of the mobile feeding devices comprises a mobile module and a turntable mechanism slidably disposed on the mobile module, the turntable mechanism comprises a power assembly and a discharging assembly disposed at an output end of the power assembly, the discharging assembly is used for placing the carrier, and the power assembly operates to rotate the discharging assembly by a preset angle.
7. The laser solder ball bonding apparatus of claim 1, wherein the first detecting device comprises a second traverse mechanism and at least one first detecting mechanism slidably disposed on the second traverse mechanism, the height measuring mechanism is disposed on the first detecting mechanism, and the first detecting mechanism comprises a first elevating assembly and a first CCD camera disposed on the first elevating assembly, whereby the first CCD camera can detect the bonding position on the workpiece.
8. The laser solder ball bonding apparatus of claim 1, wherein the second detecting means is located in the frame and partially protrudes out of the frame, and the second detecting means comprises a second CCD camera, by which the bonding means is photographed and detected.
9. The laser solder ball bonding apparatus of claim 1, wherein the bonding device comprises a third traverse mechanism and at least one bonding mechanism disposed on the third traverse mechanism, the bonding mechanism having a second lift assembly and at least one bonding assembly disposed on the second lift assembly, the bonding assembly being used for bonding the workpiece.
10. The laser solder ball bonding apparatus of claim 1, wherein the carrier is provided with a material taking part cooperating with the first material taking device and the second material taking device, a first positioning part cooperating with the fixed cover plate, and a magnetic member for attracting the fixed cover plate, and the fixed cover plate is provided with a second positioning part cooperating with the first positioning part.
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| CN202110961261.XA CN113664316B (en) | 2021-08-20 | 2021-08-20 | Laser tin ball welding equipment |
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| CN202110961261.XA CN113664316B (en) | 2021-08-20 | 2021-08-20 | Laser tin ball welding equipment |
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| CN113664316B (en) | 2022-06-14 |
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