CN113639510A - Powder cooling device for electronic product powder packaging machine - Google Patents
Powder cooling device for electronic product powder packaging machine Download PDFInfo
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- CN113639510A CN113639510A CN202110906849.5A CN202110906849A CN113639510A CN 113639510 A CN113639510 A CN 113639510A CN 202110906849 A CN202110906849 A CN 202110906849A CN 113639510 A CN113639510 A CN 113639510A
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- water
- powder
- pipe
- cooled
- cooling
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- 239000000843 powder Substances 0.000 title claims abstract description 89
- 238000001816 cooling Methods 0.000 title claims abstract description 88
- 238000004806 packaging method and process Methods 0.000 title abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 87
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000005022 packaging material Substances 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 230000001360 synchronised effect Effects 0.000 abstract description 2
- 238000007710 freezing Methods 0.000 description 4
- 230000008014 freezing Effects 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
- F25D17/08—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation using ducts
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
Abstract
The invention discloses a powder cooling device for an electronic product powder encapsulating machine, which belongs to the technical field of powder cooling devices and comprises a water cooling machine, wherein a water inlet pipe and a water outlet pipe are respectively arranged on two sides of the water cooling machine; the two ends of each water-cooled tube are respectively communicated with the first collecting pipe and the second collecting pipe, the water-cooled tubes are arranged in a staggered mode, the water-cooled tubes are fixedly arranged on the fixing frame, and the water-cooled tubes are provided with hole expanding mechanisms; according to the invention, cold water is fed into the water cooling pipe through the water cooler, the water cooling pipe is embedded in the powder pile, the cold water takes away heat in the powder pile, and the synchronous action of the hole expanding mechanism, the air cooling mechanism and the plurality of heat conducting plates is used, so that the powder is rapidly and uniformly cooled, the powder packaging machine does not need to be stopped, the working time is saved, the production efficiency is improved, the product performance is improved, and the service life of the packaging material is prolonged.
Description
Technical Field
The invention belongs to the technical field of powder cooling devices, and particularly relates to a powder cooling device for an electronic product powder packaging machine.
Background
The powder encapsulation technique is a thermal coating technique in which insulating powder is applied to a preheated electronic component by a fluidized bed coating method, and the component is heated to melt the insulating powder on the outer surface of the component to form a uniform insulating paint film, wherein the insulating paint film does not have the necessary insulation and mechanical strength. And further heating the coated element, and carrying out curing treatment for 1-2 hours to form a firm insulating layer on the surface of the electronic component, wherein the encapsulation material is aged due to too high powder temperature, so that the powder needs to be cooled.
Chinese patent (CN201821141728.6) a be applied to epoxy powder and seal cooling device who encapsulates machine, it includes intake pipe and outlet duct, epoxy powder is connected to the one end of intake pipe and is sealed the machine, freezing water tank is connected to the relative other end, be provided with the evaporimeter on the freezing water tank, freezing water tank is connected to the one end of outlet duct, epoxy powder is connected to the relative other end and is sealed the machine, be provided with first coil pipe in the freezing water tank, the condenser is connected to the one end of first coil pipe, the compressor is connected to the relative other end, the condenser is connected with the compressor simultaneously.
At present, for cooling powder in a powder packaging machine, one method is to stop the powder packaging machine for cooling, which wastes working hours and reduces production efficiency, and the other method is to add a cooling device in the powder packaging machine, but the compactness among the powder is high, which causes uneven cooling of the powder, thereby affecting the packaging effect and reducing the product performance.
Disclosure of Invention
The invention aims to: the powder cooling device for the electronic product powder encapsulating machine is provided for solving the problems that the powder is cooled unevenly, the service life of an encapsulating material is short, the product performance is poor, the production efficiency is low and the working hours are wasted due to the fact that the powder is cooled down in a shutdown mode or a cooling device is used for local cooling when the temperature of the powder in the powder encapsulating machine is too high.
In order to achieve the purpose, the invention adopts the following technical scheme: a powder cooling device for an electronic product powder encapsulating machine, comprising:
the water cooler is provided with a water inlet pipe and a water outlet pipe on two sides respectively, a first collecting pipe is arranged at the end part of the water inlet pipe, and a second collecting pipe is arranged at the end part of the water outlet pipe;
the two ends of each water-cooled tube are respectively communicated with the first collecting pipe and the second collecting pipe, the water-cooled tubes are arranged in a staggered mode, the water-cooled tubes are fixedly arranged on the fixing frame, and the water-cooled tubes are provided with hole expanding mechanisms;
the heat conduction plates are sleeved on the water cooling pipe and are uniformly distributed along the water cooling pipe at equal intervals;
air-cooled mechanism, it includes vacuum pump and many forced air cooling pipes, the forced air cooling pipe is fixed the water-cooled tube on the surface, the forced air cooling pipe with the water-cooled tube one-to-one, vacuum pump fixed mounting be in on the cold water machine, the one end intercommunication of forced air cooling pipe the vacuum pump, just the other end of forced air cooling pipe is located one side of mount.
As a further description of the above technical solution:
the water-cooling pipes are arranged in an S-shaped bending mode.
As a further description of the above technical solution:
the heat-conducting plate comprises a fixing ring and a heat-conducting block, the fixing ring is sleeved on the water-cooling pipe, the heat-conducting block is fixedly connected with the fixing ring, and the heat-conducting block is of a conical structure.
As a further description of the above technical solution:
the reaming mechanism comprises a vibration pump and a plurality of fixing rods, the vibration pump is fixedly installed on the water-cooled tube, the vibration pump is located on one side of the fixing frame, and the fixing rods are fixedly installed on the water-cooled tube.
As a further description of the above technical solution:
the vibration pump is a pneumatic vibration pump and is connected with the vacuum pump.
As a further description of the above technical solution:
the vibration pump is connected with the vacuum pump through an air pipe, and an air valve is installed on the air pipe.
As a further description of the above technical solution:
the fixing rod is a hollow pipe, and the air cooling pipe penetrates through the inside of the fixing rod.
As a further description of the above technical solution:
the water inlet pipe and the water outlet pipe are all provided with water valves.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. according to the invention, cold water is fed into the water cooling pipe through the water cooler, the water cooling pipe is embedded in the powder pile, the cold water takes away heat in the powder pile, and the synchronous action of the hole expanding mechanism, the air cooling mechanism and the plurality of heat conducting plates is used, so that the powder is rapidly and uniformly cooled, the powder packaging machine does not need to be stopped, the working time is saved, the production efficiency is improved, the product performance is improved, and the service life of the packaging material is prolonged.
2. According to the invention, the plurality of heat conduction plates are arranged on the water cooling pipe, the conical heat conduction block is inserted into the powder pile, the heat dissipation area of the powder is increased, and the heat conduction block conducts the heat to the fixing ring and is taken out by cold water, so that the powder is uniformly and quickly cooled.
3. According to the invention, the vibration pump generates vibration under the action of the vacuum pump, the vibration is transmitted to the fixed rod on the water-cooling tube, the fixed rod shakes and stirs the powder pile, so that a plurality of blind holes are formed between the powder pile and the water-cooling tube, the vacuum pump simultaneously supplies air to the air-cooling tube, cold water in the water-cooling tube simultaneously cools air flow in the air-cooling tube, and the air flow passes through the inside of the fixed rod and takes away heat in the blind holes, so that the powder is uniformly radiated.
Drawings
Fig. 1 is a schematic diagram of the overall structure of a powder cooling device for an electronic product powder encapsulating machine.
Fig. 2 is a schematic diagram of the internal structure of a powder cooling device for an electronic product powder encapsulating machine.
Fig. 3 is a partially enlarged view of a portion a in fig. 2.
FIG. 4 is a schematic diagram of a heat-conducting plate of a powder cooling device for an electronic product powder encapsulating machine.
Illustration of the drawings:
1. a water chiller; 2. a water inlet pipe; 3. a water outlet pipe; 4. a first header; 5. a second header; 6. a water-cooled tube; 7. a fixed mount; 8. a hole expanding mechanism; 81. a vibration pump; 82. fixing the rod; 9. a heat conducting plate; 91. a fixing ring; 92. a heat conducting block; 10. an air cooling mechanism; 101. a vacuum pump; 102. an air-cooled pipe; 11. an air tube; 12. an air valve; 13. a water valve.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a powder cooling device for an electronic product powder encapsulating machine, comprising:
the water cooler comprises a water cooler 1, wherein a water inlet pipe 2 and a water outlet pipe 3 are respectively arranged on two sides of the water cooler 1, a first collecting pipe 4 is arranged at the end part of the water inlet pipe 2, and a second collecting pipe 5 is arranged at the end part of the water outlet pipe 3;
the two ends of each water-cooled tube 6 are respectively communicated with the first collecting pipe 4 and the second collecting pipe 5, the water-cooled tubes 6 are arranged in a staggered mode, the water-cooled tubes 6 are fixedly arranged on a fixing frame 7, and a hole expanding mechanism 8 is arranged on each water-cooled tube 6;
the heat conduction plates 9 are sleeved on the water cooling pipe 6, and the heat conduction plates 9 are uniformly distributed along the water cooling pipe 6 at equal intervals;
the air cooling mechanism 10 comprises a vacuum pump 101 and a plurality of air cooling pipes 102, the air cooling pipes 102 are fixed on the surface of the water cooling pipe 6, the air cooling pipes 102 correspond to the water cooling pipe 6 one by one, the vacuum pump 101 is fixedly installed on the water cooling machine 1, one end of each air cooling pipe 102 is communicated with the vacuum pump 101, and the other end of each air cooling pipe 102 is located on one side of the fixed frame 7;
the water-cooling pipes 6 are arranged in an S-shaped bent mode and are arranged at the powder accumulation positions as much as possible, and the contact area between the water-cooling pipes and the powder is increased, so that the powder is fully radiated;
the heat conducting plate 9 comprises a fixing ring 91 and a heat conducting block 92, the fixing ring 91 is sleeved on the water cooling tube 6, the heat conducting block 92 is fixedly connected with the fixing ring 91, the heat conducting block 92 is in a conical structure, the heat on the powder is absorbed and transferred to the fixing ring 91 by the heat conducting block 92, the surface of the fixing ring 91 is fully contacted with the water cooling tube 6, the heat on the fixing ring 91 is taken away by cold water in the water cooling tube 6, the contact area of the powder for heat dissipation is increased, and therefore the powder is fully dissipated;
the hole expanding mechanism 8 comprises a vibration pump 81 and a plurality of fixing rods 82, the vibration pump 81 is fixedly installed on the water-cooled tube 6, the vibration pump 81 is located on one side of the fixing frame 7, the fixing rods 82 are fixedly installed on the water-cooled tube 6, the vibration pump 81 is started and transmits vibration to the fixing rods 82 through the water-cooled tube 6, blind holes are formed in the powder pile after the fixing rods 82 shake, heat in the powder is diffused into the blind holes, and the air cooling mechanism 10 takes away the heat in the blind holes, so that the powder is uniformly radiated;
the vibration pump 81 is a pneumatic vibration pump, and the vibration pump 81 is connected with the vacuum pump 101; the vibration pump 81 is connected with the vacuum pump 101 through an air pipe 11, and an air valve 12 is mounted on the air pipe 11, so that the vibration pump 81 can be opened and closed independently;
the fixing rod 82 is a hollow tube, and the air-cooled tube 102 penetrates through the inside of the fixing rod 82, so that the air-cooled tube 102 can fully carry away heat in the blind hole;
the water inlet pipe 2 and the water outlet pipe 3 are both provided with water valves 13, and the water cooling circulation of the water cooling pipe 6 is controlled.
The working principle is as follows: firstly, a water valve 13 is opened, cold water is sent into a water cooling pipe 6 by a water cooling machine 1, the water cooling pipe 6 flows through a powder pile and takes out heat in the powder pile, at the moment, a conical heat conduction block 92 on a heat conduction plate 9 is inserted into the powder pile to increase the heat dissipation area of powder, the heat conduction block 92 conducts the heat to a fixing ring 91 and takes out the heat by the cold water, so that the powder is uniformly and quickly cooled, secondly, an air valve 12 is opened, a vacuum pump 101 acts on a vibration pump 81 to generate vibration which is transmitted to a fixing rod 82 on the water cooling pipe 6, the fixing rod 82 shakes and stirs the powder pile, so that a plurality of blind holes are formed between the powder pile and the water cooling pipe 6, the heat in the powder pile is quickly diffused to the water cooling pipe 6 in a gradient manner through the blind holes, the cold water in the water cooling pipe 6 takes away the heat in the blind holes, secondly, the vacuum pump 101 simultaneously supplies the air to an air cooling pipe 102, and the cold water in the water cooling pipe 6 simultaneously cools air flow in the air cooling pipe 102, the air flow passes through the inside of the fixed rod 82 and takes away heat in the blind hole, so that the powder is uniformly radiated, finally, the air valve 12 is closed, the vibration pump 81 stops working, the water valve 13 and the water chiller 1 are closed, and the powder pile is stopped radiating.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. A powder cooling device for an electronic product powder encapsulating machine is characterized in that: the method comprises the following steps:
the water cooling system comprises a water cooler (1), wherein a water inlet pipe (2) and a water outlet pipe (3) are respectively arranged on two sides of the water cooler (1), a first collecting pipe (4) is arranged at the end part of the water inlet pipe (2), and a second collecting pipe (5) is arranged at the end part of the water outlet pipe (3);
the two ends of each water-cooled tube (6) are respectively communicated with the first collecting pipe (4) and the second collecting pipe (5), the water-cooled tubes (6) are arranged in a staggered mode, the water-cooled tubes (6) are fixedly arranged on a fixing frame (7), and a hole expanding mechanism (8) is arranged on each water-cooled tube (6);
the heat conduction plates (9) are sleeved on the water cooling pipe (6), and the heat conduction plates (9) are uniformly distributed along the water cooling pipe (6) at equal intervals;
air-cooled mechanism (10), it includes vacuum pump (101) and many air-cooled pipes (102), air-cooled pipe (102) are fixed the water-cooled pipe (6) on the surface, air-cooled pipe (102) with water-cooled pipe (6) one-to-one, vacuum pump (101) fixed mounting be in on cold water machine (1), the one end intercommunication of air-cooled pipe (102) vacuum pump (101), just the other end of air-cooled pipe (102) is located one side of mount (7).
2. The powder cooling device for the electronic product powder encapsulating machine according to claim 1, wherein the water cooling tube (6) is arranged in an S-shaped curve.
3. The powder cooling device for the electronic product powder encapsulating machine according to claim 1, wherein the heat conducting plate (9) comprises a fixing ring (91) and a heat conducting block (92), the fixing ring (91) is sleeved on the water cooling tube (6), the heat conducting block (92) is fixedly connected with the fixing ring (91), and the heat conducting block (92) is of a conical structure.
4. The powder cooling device for the electronic product powder encapsulating machine according to claim 1, wherein the hole expanding mechanism (8) comprises a vibration pump (81) and a plurality of fixing rods (82), the vibration pump (81) is fixedly installed on the water-cooling tube (6), the vibration pump (81) is located at one side of the fixing frame (7), and the fixing rods (82) are fixedly installed on the water-cooling tube (6).
5. The powder cooling device for the electronic product powder encapsulating machine according to claim 4, wherein the vibration pump (81) is a pneumatic vibration pump, and the vibration pump (81) is connected with the vacuum pump (101).
6. The powder cooling device for the electronic product powder encapsulating machine according to claim 5, wherein the vibration pump (81) is connected with the vacuum pump (101) through an air pipe (11), and an air valve (12) is installed on the air pipe (11).
7. The powder cooling device for an electronic product powder encapsulating machine according to claim 4, wherein said fixing rod (82) is a hollow tube, and said air-cooled tube (102) passes through the inside of said fixing rod (82).
8. A powder cooling device for an electronic product powder encapsulating machine according to claim 1, characterized in that a water valve (13) is mounted on both the water inlet pipe (2) and the water outlet pipe (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110906849.5A CN113639510B (en) | 2021-08-09 | 2021-08-09 | Powder cooling device for electronic product powder encapsulation machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110906849.5A CN113639510B (en) | 2021-08-09 | 2021-08-09 | Powder cooling device for electronic product powder encapsulation machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113639510A true CN113639510A (en) | 2021-11-12 |
| CN113639510B CN113639510B (en) | 2024-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110906849.5A Active CN113639510B (en) | 2021-08-09 | 2021-08-09 | Powder cooling device for electronic product powder encapsulation machine |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040008483A1 (en) * | 2002-07-13 | 2004-01-15 | Kioan Cheon | Water cooling type cooling system for electronic device |
| CN206222773U (en) * | 2016-11-16 | 2017-06-06 | 东莞市顶盛环保科技有限公司 | It is a kind of air-cooled with water-cooled and with type chemical raw material cooling device |
| US20180042140A1 (en) * | 2015-03-31 | 2018-02-08 | Guangdong Shenling Air-conditioning Equipment Co., Ltd. | Server rack heat sink system with combination of liquid cooling device and auxiliary heat sink device |
| CN108759137A (en) * | 2018-07-18 | 2018-11-06 | 昆山万盛电子有限公司 | A kind of cooling device and epoxy powder sealing machine applied to epoxy powder sealing machine |
| CN110586946A (en) * | 2019-10-16 | 2019-12-20 | 西安科技大学 | Cooling device for metal powder processing |
| CN213434962U (en) * | 2020-10-09 | 2021-06-15 | 许昌安信科技有限公司 | Powder coating production is with reducing mechanism's water-cooling air inlet system |
| CN213578324U (en) * | 2020-11-09 | 2021-06-29 | 昆山力兆塑胶有限公司 | Plastic particle cooling device |
-
2021
- 2021-08-09 CN CN202110906849.5A patent/CN113639510B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040008483A1 (en) * | 2002-07-13 | 2004-01-15 | Kioan Cheon | Water cooling type cooling system for electronic device |
| US20180042140A1 (en) * | 2015-03-31 | 2018-02-08 | Guangdong Shenling Air-conditioning Equipment Co., Ltd. | Server rack heat sink system with combination of liquid cooling device and auxiliary heat sink device |
| CN206222773U (en) * | 2016-11-16 | 2017-06-06 | 东莞市顶盛环保科技有限公司 | It is a kind of air-cooled with water-cooled and with type chemical raw material cooling device |
| CN108759137A (en) * | 2018-07-18 | 2018-11-06 | 昆山万盛电子有限公司 | A kind of cooling device and epoxy powder sealing machine applied to epoxy powder sealing machine |
| CN110586946A (en) * | 2019-10-16 | 2019-12-20 | 西安科技大学 | Cooling device for metal powder processing |
| CN213434962U (en) * | 2020-10-09 | 2021-06-15 | 许昌安信科技有限公司 | Powder coating production is with reducing mechanism's water-cooling air inlet system |
| CN213578324U (en) * | 2020-11-09 | 2021-06-29 | 昆山力兆塑胶有限公司 | Plastic particle cooling device |
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| CN113639510B (en) | 2024-06-11 |
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