CN113629107A - Manufacturing method of display panel, display panel and display device - Google Patents

Manufacturing method of display panel, display panel and display device Download PDF

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Publication number
CN113629107A
CN113629107A CN202110812289.7A CN202110812289A CN113629107A CN 113629107 A CN113629107 A CN 113629107A CN 202110812289 A CN202110812289 A CN 202110812289A CN 113629107 A CN113629107 A CN 113629107A
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layer
metal
display panel
pdms mold
substrate
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CN113629107B (en
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王恺君
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

The invention relates to a manufacturing method of a display panel, the display panel and a display device, wherein the manufacturing method of the display panel is characterized in that a hydrophilic area is formed on a PDMS mold through metal ink matched with the PDMS mold by adopting a photoetching method, the metal ink coated on the PDMS mold is gathered to the hydrophilic area, a metal wire can be formed after heating and sintering, and then the metal wire is transferred to the side edge of a substrate, so that the metal wire is butted with a leading-out wire and a connecting wire, and the extremely narrow or even frameless display panel can be obtained by the method.

Description

Manufacturing method of display panel, display panel and display device
Technical Field
The present invention relates to the field of display technologies, and in particular, to a method for manufacturing a display panel, a display panel manufactured by the method, and a display device having the display panel.
Background
With the higher requirements of people on display devices, the frame of the display screen is smaller and smaller, so that better visual experience is obtained. The previous narrow bezel usually achieves the effect of a narrow bezel by reducing the non-display area around the display area through design and material optimization, but the adjustable size of the bezel in this way is limited.
Disclosure of Invention
The invention aims to provide a manufacturing method of a display panel, the display panel and a display device, and aims to solve the problem that the frame size of the existing display panel is large.
Specifically, the technical scheme adopted by the invention is as follows:
a manufacturing method of a display panel comprises the following steps:
providing a substrate, defining a display area and a non-display area surrounding the display area on the front side of the substrate, and defining a binding area on the back side of the substrate;
forming a display area film layer in the display area, and forming a plurality of outgoing lines which are arranged at intervals and one ends of which are connected with the display area film layer in the non-display area;
a binding region film layer is formed in the binding region on the back surface of the substrate, the binding region further comprises a plurality of connecting wires which are arranged at intervals and one ends of which are connected with the binding end of the binding region film layer, and the connecting wires correspond to the outgoing lines;
providing a PDMS mold, and forming a plurality of hydrophilic regions arranged at intervals on at least part of the surface of the PDMS mold through a photoetching method;
coating metal ink on the surface of the PDMS mould with the hydrophilic area to form a metal ink layer;
after the metal printing ink is gathered to the hydrophilic area, heating and sintering are carried out, and a plurality of metal wires which are arranged at intervals are formed on the surface of the PDMS mold;
transferring the metal wire formed on the PDMS mold to the substrate, so that one end of the metal wire is connected with the outgoing line, and the other end of the metal wire is connected with the connecting line;
and finishing the binding of the chip on film and the circuit board in the binding area.
Optionally, the display area film layer includes a thin film transistor layer formed on the front surface of the substrate, an organic light emitting device layer formed on the thin film transistor layer and facing away from one surface of the front surface of the substrate, a packaging thin film layer formed on the organic light emitting device layer and facing away from one surface of the thin film transistor layer, and/or a light resistance protection layer formed on the packaging thin film layer and facing away from one surface of the organic light emitting device layer.
Optionally, after the bonding region film layer is formed, the photoresist protective layer is removed by using a stripping liquid.
Optionally, the bonding region film layer includes a first metal layer formed on the back surface of the substrate, a first insulating layer formed on a surface of the first metal layer facing away from the back surface of the substrate, a second metal layer formed on a surface of the first insulating layer facing away from the first metal layer, a second insulating layer formed on a surface of the second metal layer facing away from the first metal layer, and a transparent electrode layer formed on a surface of the second insulating layer facing away from the second metal layer, where the first metal layer and the second metal layer are connected to the transparent electrode layer respectively.
Optionally, before the transfer printing, the side edge of the substrate between the outgoing line and the connecting line is edged to prevent the metal line from being cut by the side edge of the substrate.
Optionally, the photolithography method includes the following steps:
providing a PDMS mold;
arranging a mask on one surface of the PDMS mold, arranging an ultraviolet light source on the outer side of one surface of the mask, which is far away from the PDMS mold, and arranging a plurality of light-transmitting areas on the surface of the mask at intervals;
and starting the ultraviolet light source, enabling the generated ultraviolet light to penetrate through the light-transmitting area of the mask plate to irradiate the PDMS mold, forming a plurality of hydrophilic areas on the surface of the PDMS mold, and enabling the surface of the PDMS mold between the hydrophilic areas to be a hydrophobic area.
Optionally, the PDMS mold is block-shaped, and the mask is disposed on an outer side of one side of the PDMS mold.
Optionally, the PDMS mold includes a base portion, and two ends of the base portion are respectively bent towards the same side to form a coating portion; the mask plate comprises a first plate body parallel to the base portion, two ends of the first plate body are bent towards the same side respectively to form bending portions, the mask plate is arranged on the inner side of the PDMS mold, the opening direction of the mask plate is the same as that of the PDMS mold, and the ultraviolet light source is arranged on the inner side of the mask plate.
Optionally, the metal ink comprises the following components in percentage by weight: metal nanoparticles: 40-70 wt%, solvent: 20-60 wt%, stabilizer: 1 to 10 wt%.
Optionally, the metal nanoparticles are selected from one of the following: gold nanoparticles, silver nanoparticles, and copper nanoparticles.
Optionally, the solvent is selected from one or more of the following solvents: water, ethanol, ethylene glycol, diethylene glycol and toluene.
Optionally, the stabilizer is vinylpyrrolidone or lauric acid.
Optionally, before the transfer printing, a layer of dielectric layer is coated on the outgoing line, the connecting line and the side edge of the substrate between the outgoing line and the connecting line, the dielectric layer in the dielectric layer is a volatile dielectric, and the dielectric layer is volatilized along with the transfer printing process.
Optionally, the medium in the medium layer is isopropanol or ethanol.
Optionally, after the transfer printing is completed, the PDMS mold is peeled off, and a protective adhesive layer is coated on the outgoing line, the metal line, and the connecting line on the side away from the substrate.
In order to achieve the above object, the present invention further provides a display panel, wherein the display panel is manufactured by the manufacturing method of the display panel.
To achieve the above object, the present invention further provides a display device including the display panel as described above.
The manufacturing method of the display panel has the advantages that the metal ink is matched with the PDMS mold, the hydrophilic area is formed on the PDMS mold by adopting a photoetching method, the metal ink coated on the PDMS mold is gathered to the hydrophilic area, and a metal wire with the thinnest of 1 mu m can be formed after heating and sintering. Furthermore, the extremely narrow-frame/frameless display panel can be spliced to obtain a narrow-slit/seamless spliced screen.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a display panel according to an exemplary embodiment of the invention;
fig. 2 is a schematic front structure diagram of a display panel according to an exemplary embodiment of the present invention;
fig. 3 is a schematic diagram of a back structure of a display panel according to an exemplary embodiment of the present invention;
fig. 4 is a schematic structural diagram corresponding to step S102 in the method for manufacturing a display panel according to an exemplary embodiment of the present invention;
fig. 4a is a schematic structural diagram of a display region film layer in a display panel manufactured by a method for manufacturing a display panel according to an exemplary embodiment of the invention;
fig. 5 is a schematic structural diagram corresponding to step S103 in the method for manufacturing a display panel according to an exemplary embodiment of the present invention;
fig. 5a is a schematic structural diagram of a bonding region in a display panel manufactured by a method for manufacturing a display panel according to an exemplary embodiment of the present invention;
fig. 6 is a schematic structural diagram corresponding to step S104 in the method for manufacturing a display panel according to an exemplary embodiment of the present invention;
fig. 6a is a schematic structural diagram corresponding to S1041 to S1043 in the manufacturing method of the display panel according to the exemplary embodiment of the invention;
FIG. 6b is a schematic flow chart of a photolithography method in a method for manufacturing a display panel according to an exemplary embodiment of the present invention;
fig. 7 is a schematic structural diagram corresponding to step S105 in the method for manufacturing a display panel according to an exemplary embodiment of the invention;
fig. 8 is a schematic structural diagram corresponding to step S106 in the method for manufacturing a display panel according to an exemplary embodiment of the present invention;
fig. 9 is a schematic structural diagram corresponding to step S107 in the method for manufacturing a display panel according to an exemplary embodiment of the present invention;
fig. 9a is a schematic diagram of a connection structure of the lead-out lines, the metal lines and the connection lines in step S107 of the method for manufacturing a display panel according to an exemplary embodiment of the present invention;
fig. 9b is a schematic structural diagram corresponding to step S107 in the method for manufacturing a display panel according to another exemplary embodiment of the present invention;
fig. 9c is a schematic structural view of the PDMS mold corresponding to step S107 in the method for manufacturing a display panel according to another exemplary embodiment of the present invention;
fig. 9d is a schematic diagram illustrating a connection structure of the lead lines, the metal lines and the connection lines in step S107 of the method for manufacturing a display panel according to another exemplary embodiment of the present invention;
fig. 10 is a schematic structural diagram corresponding to step S108 in the method for manufacturing a display panel according to an exemplary embodiment of the present invention;
fig. 11 is a schematic structural diagram corresponding to step S108 in the method for manufacturing a display panel according to another exemplary embodiment of the present invention;
fig. 12 is a schematic structural diagram of a display device according to an exemplary embodiment of the present invention.
The direction of the arrow in fig. 6a is the light exit direction of the uv light source.
The parts in the figure are numbered as follows:
100. a display panel, 110, a substrate, 111, a front surface, 112, a back surface, 120, a display area, 121, a display area film layer, 1211, a thin film transistor film layer, 1212, an organic light emitting device layer, 1213, an encapsulation film layer, 1214, a photoresist protection layer, 130, a non-display area, 131, a lead-out wire, 140, a bonding area, 141, a bonding area film layer, 1411, a first metal layer, 1412, a first insulating layer, 1413, a second metal layer, 1414, a second insulating layer, 1415, a transparent electrode layer, 1416, a first via hole, 1417, a second via hole, 142, a bonding terminal, 143, a connecting wire, 150, a protection adhesive layer, 160, and a circuit board;
200. the light source module comprises a PDMS (polydimethylsiloxane) mold, 201, hydrophilic regions, 202, hydrophobic regions, 203, a base part, 204, a coating part, 210, a mask, 211, a light-transmitting region, 212, a first plate body, 213, a bending part, 220, an ultraviolet light source, 230, a metal ink layer, 240, metal wires, 241, a first line segment, 242 and a second line segment;
300. display device, 310, display screen.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The manufacturing method of the display panel comprises the steps of matching metal ink with a PDMS mold, forming a hydrophilic area on the PDMS mold by adopting a photoetching method, gathering the metal ink coated on the PDMS mold to the hydrophilic area, forming a metal wire after heating and sintering, and transferring the metal wire to the side edge of a substrate, so that the metal wire is in butt joint with a leading-out wire and a connecting wire. As a typical application, the display panel 100 manufactured by the method for manufacturing a display panel according to the present invention can be applied to the display device 300. The display device 300 may be: any product or component with practical functions such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
Referring to fig. 1, in an embodiment of the present invention, a method for manufacturing a display panel 100 includes the following steps:
s101, providing a substrate 110, referring to fig. 2, defining a display area 120 and a non-display area 130 surrounding the display area 120 on a front surface 111 of the substrate 110, and referring to fig. 3, defining a bonding area 140 on a back surface 112 of the substrate 110;
in the present embodiment, the bonding region 140 corresponds to the non-display region 130 and is located on the same side of the substrate 110. Wherein, the substrate 110 is a glass substrate.
S102, referring to fig. 4, forming a display area film 121 in the display area 120, and forming a plurality of lead-out lines 131 arranged at intervals and having one end connected to the display area film 121 in the non-display area 130;
in this embodiment, referring to fig. 4a, the display region film layer 121 includes a thin-film transistor layer 1211 formed on the front surface 111 of the substrate 110, an organic light-emitting device layer 1212 formed on a surface of the thin-film transistor layer 1211 facing away from the front surface 111 of the substrate 110, an encapsulation film layer 1213 formed on a surface of the organic light-emitting device layer 1212 facing away from the thin-film transistor layer 1211, and/or a photoresist protection layer 1214 formed on a surface of the encapsulation film layer 1213 facing away from the organic light-emitting device layer 1212.
In this embodiment, thin-film transistor layer 1211 includes a plurality of thin-film transistors arranged in an array on front surface 111 of substrate 110, a portion of lead line 131 is located in display region 120 and connected to the thin-film transistors in thin-film transistor layer 1211 in the display region, and another portion of lead line 131 is located in non-display region 130.
In this embodiment, a photoresist protection layer 1214 is designed on a surface of the encapsulation thin film layer 1213 away from the organic light emitting device layer 1212. In another embodiment, the encapsulation film layer 1213 may not be provided with the photoresist protective layer 1214 on the side facing away from the organic light emitting device layer 1212. The photoresist protection layer 1214 serves to protect the thin film transistor layer 1211, the organic light emitting device layer 1212, and the encapsulation thin film layer 1213 during the manufacturing process of the display panel 100.
S103, referring to fig. 5, a bonding region film layer 141 is formed in the bonding region 140 on the back surface 112 of the substrate 110, the bonding region 140 further includes a plurality of connection lines 143 arranged at intervals and having one end connected to the bonding end 142 of the bonding region film layer 141, and the connection lines 143 correspond to the lead-out lines 131; in the present embodiment, the connection lines 143 correspond one-to-one to the lead-out lines 131.
In this embodiment, referring to fig. 5a, the bonding region film 141 includes a first metal layer 1411 formed on the back surface 112 of the substrate 110, a first insulating layer 1412 formed on a surface of the first metal layer 1411 facing away from the back surface 112 of the substrate 110, a second metal layer 1413 formed on a surface of the first insulating layer 1412 facing away from the first metal layer 1411, a second insulating layer 1414 formed on a surface of the second metal layer 1413 facing away from the first metal layer 1412, and a transparent electrode layer 1415 formed on a surface of the second insulating layer 1414 facing away from the second metal layer 1413, where the first metal layer 1411 and the second metal layer 1413 are respectively connected to the transparent electrode layer 1415. A first via 1416 penetrating through the second metal layer, the second insulating layer 1414, the second metal layer 1413 and the first insulating layer 1412 is formed on the inner side of the bonding region film layer 141, and the transparent electrode layer 1415 is deposited on the first metal layer 1411 through the first via 1416 to electrically connect with the first metal layer 1411; the bonding region film 141 further has a second via 1417 penetrating through the second insulating layer 1414, and the transparent electrode layer 1415 is deposited on the second metal layer 1413 through the second via 1417 to electrically connect with the second metal layer 1413.
In the present embodiment, the bonding layer 141 is formed by first turning the substrate 110, i.e. the back surface 112 faces upward and the front surface 111 faces downward.
If the photoresist protection layer 1214 is disposed on the side of the encapsulation thin film layer 1213 away from the organic light emitting device layer 1212, the photoresist protection layer 1214 may be removed by a stripping solution after the bonding region film layer 141 is formed. The photoresist protection layer 1214 is a negative photoresist or a positive photoresist, which may be one of the conventional positive and negative photoresists in the market, and serves to protect the display area film layer 121 and the lead-out wires 131 on the front surface 111 of the substrate 110 after the substrate 110 is turned over.
In this embodiment, the photoresist used for the photoresist protection layer 1214 is a conventional negative photoresist, and the stripping liquid used is a KOH-based stripping liquid. In another embodiment, the photoresist used for the photoresist protection layer 1214 is a conventional positive photoresist, and is stripped and removed by using a corresponding stripping solution.
In this embodiment, after the fabrication of the bonding region film 141 is completed, the whole substrate 110 may be cut into a plurality of small substrate units (panels), each substrate unit has the display region film 121, the lead-out line 131 and the bonding region film 141, and after the subsequent fabrication steps, each substrate unit may form one display panel 100, and the substrate 110 may also be regarded as a small substrate unit (panel).
S104, providing a PDMS mold 200, and forming a plurality of hydrophilic regions 201 arranged at intervals on at least part of the surface of the PDMS mold 200 through a photolithography method;
in this embodiment, referring to fig. 6a and 6b, the photolithography method includes the steps of:
s1041, providing a PDMS mold 200;
s1042, arranging a mask 210 on one surface of the PDMS mold 200, arranging an ultraviolet light source 220 on the outer side of one surface, far away from the PDMS mold 200, of the mask 210, and arranging a plurality of light-transmitting regions 211 on the surface of the mask 210 at intervals;
s1043, turning on the ultraviolet light source 220, and allowing the generated ultraviolet light to pass through the light-transmitting region of the mask 210 and irradiate the PDMS mold 200, so as to form a plurality of hydrophilic regions 201 on the surface of the PDMS mold 200, wherein the surface of the PDMS mold 200 located between the hydrophilic regions 201 is a hydrophobic region 202.
Wherein, PDMS, polydimethysiloxane, namely polydimethylsiloxane, and the PDMS mold 200 is a commercially available PDMS mold. Photolithography refers to a technique of transferring a pattern on a reticle onto a substrate with the aid of a photoresist (also known as a photoresist) under the action of light. In this embodiment, the patterns (the light transmission regions 211 arranged at intervals) on the mask 210 are transferred to the surface of the PDMS mold 200 under the Ultraviolet (UV) illumination, that is, the ultraviolet illuminates the surface of the PDMS mold 200 through the light transmission regions 211, so that the illuminated surface of the PDMS mold 200 is changed from the original hydrophobicity to the hydrophilicity to form the hydrophilic regions 201, and the surface of the PDMS mold 200 not illuminated by the ultraviolet maintains the original hydrophobicity, thereby forming the patterns arranged at intervals between the hydrophilic regions 201 and the hydrophobic regions 202 on the surface of the PDMS mold 200.
In the present embodiment, the width of the transparent region 211 on the mask 210 is determined according to the line width and line distance of the required metal lines, generally, the line width is 1-5 μm, and when the width of the transparent region 211 is 1 μm, the metal lines with the thinnest width of 1 μm can be formed. The ultraviolet light has a wavelength of 200nm or less.
S105, referring to fig. 7, coating a metal ink on the surface of the PDMS mold 200 on which the hydrophilic region 201 is formed, to form a metal ink layer 230; the metal ink comprises the following components in percentage by weight: metal nanoparticles: 40-70 wt%, solvent: 20-60 wt%, stabilizer: 1 to 10 wt%.
In the present embodiment, the coating thickness of the metal ink layer 230 is determined according to the thickness of the required metal wire, for example, if the thickness of a single metal wire is 5 μm, the thickness of the metal ink layer 230 is 50 μm.
Wherein the metal nanoparticles are selected from one of the following: gold nanoparticles, silver nanoparticles, and copper nanoparticles. The solvent is selected from one or more of the following solvents: water, ethanol, ethylene glycol, diethylene glycol and toluene. The stabilizer is vinylpyrrolidone (PVP) or lauric acid (DDA).
The metal ink has a high content of metal nanoparticles, which results in a low resistivity of the subsequently formed metal lines.
S106, referring to fig. 8, after the metal ink is gathered to the hydrophilic region 201, heating and sintering are performed, and a plurality of metal lines 240 arranged at intervals are formed on the surface of the PDMS mold 200; the number of the metal wires 240 corresponds to the number of the lead-out wires 131, and one metal wire 240 corresponds to one lead-out wire 131.
In this embodiment, since the metal ink has a hydrophilic property, the metal ink will gather toward the hydrophilic region 201 on the surface of the PDMS mold 200 in a liquid state, and the hydrophobic property of the hydrophobic region 202 will also drive the liquid metal ink toward the hydrophilic region 201, so that no metal ink remains on the surface of the hydrophobic region 202. After the metal ink is completely gathered, heating and sintering are performed, and a metal line 240 is formed on the surface of the hydrophilic region 201.
Wherein, the heating sintering can be carried out in a hot plate or a hot furnace at the temperature of 50-100 ℃ for 1-20 min. The temperature is too low, the time is too short, and the metal ink is not completely cured; if the temperature is too high and the time is too long, the solvent in the metal ink is volatilized too fast, and the accumulation amount of the metal nanoparticles in the metal ink in each hydrophilic region 201 is different, so that the thickness of the metal line 240 formed by each hydrophilic region 201 is different, and there is a risk of causing the metal line 240 to be broken or having a large resistivity.
S107, referring to fig. 9, transferring the metal line 240 formed on the PDMS mold 200 to the substrate 110 such that one end of the metal line 240 is connected to the lead-out line 131 and the other end is connected to the connection line 143. And after the transfer printing is finished, peeling off the PDMS mold.
In this embodiment, one side of the PDMS mold 200 provided with the metal wires 240 is pressed to the side of the substrate 110, and the metal wires 240 are butted with the outgoing lines 131 and the connecting wires 143, so that the outgoing lines 131 and the connecting wires 143 are electrically connected to form conduction through the metal wires 240, and the outgoing lines 131, the metal wires 240 and the connecting wires 143 are in a one-to-one correspondence relationship, that is, one outgoing line 131 corresponds to one metal wire 240 and one connecting wire 143 corresponds to one connecting wire.
In this embodiment, the shape of the PDMS mold 200 is a block with reference to fig. 9, the metal lines 240 are formed on one surface of the PDMS mold 200, during the transfer, the surface of the PDMS mold where the metal lines 240 are disposed is pressed to the side of the substrate 110, the metal lines 240 are attached to the side of the substrate 110, referring to fig. 9a, the upper ends of the metal lines 240 and the ends of the lead-out lines 131 extending to the edge of the front surface 111 of the substrate 110 are pressed and connected, and the lower ends of the metal lines 240 and the ends of the connecting lines 143 extending to the edge of the back surface 112 of the substrate 110 are pressed and connected, thereby realizing the connection and conduction of the lead-out lines 131, the metal lines 240 and the connecting lines 143. However, in this type of PDMS mold 200, there is a risk that the connection between the metal wires 240 and the lead-out wires 131 and the connection wires 143 may be unstable or even broken.
In another embodiment of the present invention, referring to fig. 9c, the PDMS mold 200 includes a base portion 203, and both ends of the base portion 203 are bent toward the same side to form a coating portion 204, i.e., the cross-sectional shape of the PMDS mold 200 is a transverse concave shape or a transverse U-shape. During transfer, the coating portion 204 of the PDMS mold 200 coats the lead-out wires 131 and the connecting wires 143, referring to fig. 9c, the cross-sectional shape of the mask 210 corresponds to the cross-sectional shape of the PDMS mold 200, the cross-sectional shape of the light-transmitting region 211 on the mask 210 corresponds to the cross-sectional shape of the PDMS mold 200, the mask 210 includes a first plate body 212 parallel to the base portion 203, two ends of the first plate body 212 are respectively bent to the same side to form a bent portion 213, the mask 210 is disposed inside the PDMS mold 200, the opening of the mask 210 faces the same direction as the opening of the PDMS mold 200, and the ultraviolet light source 220 is disposed inside the mask 210. Referring to fig. 9d, in the present embodiment, the metal line 240 includes a first line segment 241 and a second line segment 242 connected to two ends of the first line segment 241, referring to fig. 9b and 9d, during the transfer process of the PDMS mold 200, the first line segment 241 is attached to a side of the substrate 110, the first line segment 241 covers a part of the outgoing line 131 and overlaps and is conducted with a part of the outgoing line 131 after being pressed, and the second line segment 242 covers a part of the connecting line 143 and overlaps and is conducted with a part of the connecting line 143 after being pressed.
The structure of the PDMS mold 200 and the metal line 240 in this embodiment can ensure the connection and conduction between the metal line 240 and the outgoing line 131 and the connection line 143, and no risk of breaking occurs.
In another embodiment of the present invention, before the PDMS mold 200 is used to transfer the metal lines 240, the side edges of the substrate 110 between the lead-out wires 131 and the connecting wires 143 are edged, rounded corners are formed on the side edges of the substrate 110, and the side edge portions of the substrate 110 are polished smoothly, so that the frame width can be further reduced, and the metal lines 240 can be prevented from being cut by the edge corners of the side edges.
In yet another embodiment of the present invention, before the metal lines 240 are transferred by using the PDMS mold 200, a dielectric layer (not shown) is coated on the lead-out lines 131, the connection lines 143, and the side of the substrate 110 between the lead-out lines 131 and the connection lines 143, wherein the dielectric layer is a volatile medium, and the dielectric layer is volatilized as the transfer process proceeds. In this embodiment, the volatile medium is isopropanol or ethanol, preferably isopropanol. The dielectric layer is used as a liquid bridge medium, the thickness of the dielectric layer is 0.1-1 μm, the dielectric layer (isopropanol) volatilizes along with the pressing transfer printing of the PDMS mold 200, and the metal wire 240 is fixed on the side of the substrate 110.
In another embodiment of the present invention, referring to fig. 10 or 11, after the transfer and the PDMS mold is released, a protective glue layer 150 is coated on the surfaces (i.e., outer surfaces) of the lead-out wires 131, the metal wires 240, and the connecting wires 143 away from the substrate 110. Wherein, protection glue layer 150 is glued with the protection and can be selected UV solidification type protection to glue, also can select thermosetting type protection to glue, and the mode of side printing can be adopted to the coating mode, need cover whole metal line region to play the guard action, the thickness 5 ~ 15um of protection glue layer 150, too thin, the guard action is relatively weak, and is too thick, then increases the display panel frame.
S108, referring to fig. 10 or fig. 11, the bonding between a chip on film (COF, not shown) and a circuit board (PCB)160 is completed in the bonding region 140, and the manufacturing of the display panel 100 is completed.
In an embodiment of the present invention, referring to fig. 12, the display panel 100 may be used in a display device 300, and a plurality of display panels 100 are spliced to form a narrow-frame or frameless display screen 310, such as an OLED display screen. The display panel 100 shown in fig. 12 is a frameless display panel.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (17)

1. A method for manufacturing a display panel is characterized by comprising the following steps:
providing a substrate, defining a display area and a non-display area surrounding the display area on the front side of the substrate, and defining a binding area on the back side of the substrate;
forming a display area film layer in the display area, and forming a plurality of outgoing lines which are arranged at intervals and one ends of which are connected with the display area film layer in the non-display area;
a binding region film layer is formed in the binding region on the back surface of the substrate, the binding region further comprises a plurality of connecting wires which are arranged at intervals and one ends of which are connected with the binding end of the binding region film layer, and the connecting wires correspond to the outgoing lines;
providing a PDMS mold, and forming a plurality of hydrophilic regions arranged at intervals on at least part of the surface of the PDMS mold through a photoetching method;
coating metal ink on the surface of the PDMS mould with the hydrophilic area to form a metal ink layer;
after the metal printing ink is gathered to the hydrophilic area, heating and sintering are carried out, and a plurality of metal wires which are arranged at intervals are formed on the surface of the PDMS mold;
transferring the metal wire formed on the PDMS mold to the substrate, so that one end of the metal wire is connected with the outgoing line, and the other end of the metal wire is connected with the connecting line;
and finishing the binding of the chip on film and the circuit board in the binding area.
2. The method of claim 1, wherein the display area film layer comprises a thin film transistor layer formed on the front surface of the substrate, an organic light emitting device layer formed on a surface of the thin film transistor layer facing away from the front surface of the substrate, an encapsulation film layer formed on a surface of the organic light emitting device layer facing away from the thin film transistor layer, and/or a photoresist protection layer formed on a surface of the encapsulation film layer facing away from the organic light emitting device layer.
3. The method of claim 2, wherein the photoresist protection layer is removed using a stripping solution after the bonding region film layer is formed.
4. The method for manufacturing a display panel according to claim 3, wherein the bonding region film layer includes a first metal layer formed on the back surface of the substrate, a first insulating layer formed on a surface of the first metal layer facing away from the back surface of the substrate, a second metal layer formed on a surface of the first insulating layer facing away from the first metal layer, a second insulating layer formed on a surface of the second metal layer facing away from the first metal layer, and a transparent electrode layer formed on a surface of the second insulating layer facing away from the second metal layer, and the first metal layer and the second metal layer are respectively connected to the transparent electrode layer.
5. The method of claim 1, wherein before the transferring, the side edge of the substrate between the lead lines and the connecting lines is edged to prevent the metal lines from being cut by the side edge of the substrate.
6. The method for manufacturing a display panel according to claim 1,
the photolithography method comprises the following steps:
providing a PDMS mold;
arranging a mask on one surface of the PDMS mold, arranging an ultraviolet light source on the outer side of one surface of the mask, which is far away from the PDMS mold, and arranging a plurality of light-transmitting areas on the surface of the mask at intervals;
and starting the ultraviolet light source, enabling the generated ultraviolet light to penetrate through the light-transmitting area of the mask plate to irradiate the PDMS mold, forming a plurality of hydrophilic areas on the surface of the PDMS mold, and enabling the surface of the PDMS mold between the hydrophilic areas to be a hydrophobic area.
7. The method according to claim 6, wherein the PDMS mold is block-shaped, and the mask is disposed on an outer side of one surface of the PDMS mold.
8. The method for manufacturing a display panel according to claim 6,
the PDMS mold comprises a base part, wherein two ends of the base part are respectively bent towards the same side to form a coating part;
the mask plate comprises a first plate body parallel to the base portion, two ends of the first plate body are bent towards the same side respectively to form bending portions, the mask plate is arranged on the inner side of the PDMS mold, the opening direction of the mask plate is the same as that of the PDMS mold, and the ultraviolet light source is arranged on the inner side of the mask plate.
9. The method for manufacturing a display panel according to claim 1, wherein the metal ink comprises the following components in percentage by weight: metal nanoparticles: 40-70 wt%, solvent: 20-60 wt%, stabilizer: 1 to 10 wt%.
10. The method of manufacturing a display panel according to claim 9, wherein the metal nanoparticles are selected from one of: gold nanoparticles, silver nanoparticles, and copper nanoparticles.
11. The method for manufacturing a display panel according to claim 9, wherein the solvent is selected from one or more of the following solvents: water, ethanol, ethylene glycol, diethylene glycol and toluene.
12. The method of manufacturing a display panel according to claim 9, wherein the stabilizer is vinylpyrrolidone or lauric acid.
13. The method for manufacturing a display panel according to claim 1, wherein before the transfer printing, a dielectric layer is coated on the lead-out lines, the connecting lines and the side edges of the substrate between the lead-out lines and the connecting lines, the dielectric layer is a volatile dielectric, and the dielectric layer is volatilized with the transfer printing.
14. The method of manufacturing a display panel according to claim 13, wherein the medium in the medium layer is isopropyl alcohol or ethyl alcohol.
15. The method according to claim 13, wherein in step 107, after the transfer printing is completed, the PDMS mold is peeled off, and a protective adhesive layer is coated on the surface of the lead lines, the metal lines and the connecting lines away from the substrate.
16. A display panel manufactured by the manufacturing method according to any one of claims 1 to 15.
17. A display device comprising the display panel according to claim 16.
CN202110812289.7A 2021-07-19 2021-07-19 Display panel manufacturing method, display panel and display device Active CN113629107B (en)

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