CN217881509U

CN217881509U - Display panel and mobile terminal

Info

Publication number: CN217881509U
Application number: CN202221851106.9U
Authority: CN
Inventors: 张鹏
Original assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2022-07-18
Filing date: 2022-07-18
Publication date: 2022-11-22
Anticipated expiration: 2032-07-18

Abstract

The embodiment of the application discloses a display panel and a mobile terminal, wherein the display panel comprises a non-bending area and a bending area, and further comprises a substrate, a driving device layer, a flat layer and a pixel definition layer, wherein the flat layer is made of a hydrophilic material, and the pixel definition layer is made of a hydrophobic material; in the bending area, the pixel definition layer is arranged on the flat layer, a through contact hole is formed in the pixel definition layer, and the spot glue layer partially penetrates through the contact hole to be in contact with the flat layer. According to the technical scheme, even if the display panel adopts the IJP process, the glue coated in the rear-section display panel manufacturing process can be uniformly spread, the uniformity of glue coating is improved, the production efficiency and the production quality of the display panel are improved, and the display panel is suitable for production of large-size display panels.

Description

Display panel and mobile terminal

Technical Field

The application relates to the technical field of display, in particular to a display panel and a mobile terminal.

Background

In order to increase the screen occupation ratio of electronic products, a bending binding technology is generally adopted in the prior art, that is, a part of fan-out wiring area of a screen, a driver IC and a flexible circuit board are bent to the back of the screen together for binding. The common technique of the back plate in the bending binding technique is to etch a deep hole on the inorganic layer of the bending area, fill organic material in the deep hole, then deposit metal on the organic material as the trace, and finally cover the organic material on the trace.

After the screen is bent, the pixel definition layer of the bending area is coated with point glue for fixing in the manufacturing process of the display panel of the rear section. Due to the requirement of the Ink Jet Print (IJP) process, the material of the pixel definition layer is usually hydrophobic, and the dispensing used in the subsequent display panel process is hydrophilic, which are not matched in material properties, resulting in the difficulty of spreading the dispensing, low uniformity of the coating, and the influence on the production efficiency and quality of the display panel, and is not suitable for the production of large-sized display panels.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a display panel and a mobile terminal, so that even if the display panel adopts an IJP process, glue coated in the manufacturing process of a rear-stage display panel can be uniformly spread, the uniformity of glue coating is improved, the production efficiency and the production quality of the display panel are improved, and the display panel and the mobile terminal are suitable for the production of large-size display panels.

The embodiment of the application provides a display panel, including non-bending region and bending region, display panel still includes:

a substrate;

the driving device layer is arranged on the substrate and comprises a plurality of driving devices, and the plurality of driving devices are positioned in the non-bending area;

the flat layer is arranged on the driving device layer and is made of a hydrophilic material;

the pixel definition layer is at least partially arranged on the flat layer, and the material of the pixel definition layer is a hydrophobic material;

the adhesive dispensing layer is at least partially arranged on the flat layer in the bending area;

in the bending area, the pixel definition layer is arranged on the flat layer, a through contact hole is formed in the pixel definition layer, and part of the point glue layer penetrates through the contact hole to be in contact with the flat layer.

Optionally, in a direction perpendicular to the substrate, the contact hole covers the bending region.

Optionally, the driving device layer includes an insulating layer and a metal wiring layer stacked on the insulating layer, and the metal wiring layer is located in the bending region;

the metal wiring layer comprises at least two metal sub-layers which are arranged in a stacked mode, the at least two metal sub-layers comprise a first metal sub-layer and at least one second metal sub-layer which is located on one side, close to the substrate, of the first metal sub-layer, and the corrosion resistance of the first metal sub-layer is larger than that of the second metal sub-layer.

Optionally, a third metal sublayer is disposed on a side of the second metal sublayer close to the substrate, the side being far away from the first metal sublayer;

the material of the first metal sub-layer and the material of the third metal sub-layer comprise titanium or molybdenum-titanium alloy, and the material of the second metal sub-layer comprises copper or copper alloy.

Optionally, the driving device layer further includes a signal routing layer, the signal routing layer is located in the non-bending region, and the signal routing layer and the metal routing layer are arranged on the same layer and are made of the same material.

Optionally, in the bending region, a stress-reducing hole is formed in the insulating layer, at least a portion of the metal routing layer is located in the stress-reducing hole, a portion of the flat layer is disposed in the stress-reducing hole and covers the metal routing layer, and an inner wall of the stress-reducing hole is stepped.

Optionally, it falls the stress hole including the first power hole and the second that fall of intercommunication to fall the stress hole, just it is perpendicular that first fall the stress hole the orthographic projection in base plate direction is located it is downthehole that the second falls the stress, the first opening edge distance that falls the stress hole the distance between the lateral wall that the second falls the stress hole is 10um ~ 30um.

Optionally, in the bending region, the substrate includes a base layer and a blocking layer disposed on the base layer, the driving device layer is disposed on the blocking layer, and a distance between a side of the metal routing layer in the stress-reducing hole close to the base layer and a side of the blocking layer away from the base layer in a direction perpendicular to the substrate is 0A to 2000A.

Optionally, the display panel of the bending region is bent along a bending central line, the number of the contact holes is plural, and the closer to the bending central line, the larger the opening area of the contact hole is.

In addition, an embodiment of the present application further provides a mobile terminal, including the display panel and the terminal main body described in any of the above embodiments, where the display panel and the terminal main body are combined into a whole.

The utility model discloses beneficial effect includes at least:

this application is through set up the contact hole on the pixel definition layer, run through setting up the contact hole pixel definition layer makes the flat bed naked expose, wherein, the material on pixel definition layer is hydrophobic material, the material on flat bed is hydrophilic material, when making display panel adopt the inkjet printing technique in the process of making, the coating of gluing in the back end process is not influenced simultaneously, the point is glued in the back end process and can is passed the contact hole and directly coats on flat bed, the material on flat bed is its nature of hydrophilic material and the point matching, the homogeneity and the extensibility of coating are glued in the point has been improved, specially adapted large size display panel's production, production efficiency and production quality have effectively been improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic view of a prior art structure;

fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;

fig. 3 is a top view of a portion of a pixel definition layer of a display panel according to an embodiment of the present disclosure;

fig. 4 is a top view of a portion of a pixel definition layer of a display panel according to an embodiment of the present disclosure;

FIG. 5 is a top view of a portion of a pixel definition layer of another display panel according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of another display panel provided in an embodiment of the present application;

fig. 7 is a schematic structural diagram of another display panel provided in the embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The embodiment of the application provides a display panel and a mobile terminal. The following are detailed below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments. In addition, in the description of the present application, the term "including" means "including but not limited to". The terms first, second, third and the like are used merely as labels, and do not impose numerical requirements or an established order. Various embodiments of the present invention may exist in a range of forms; it should be understood that the description in range format is merely for convenience and brevity and should not be construed as an inflexible limitation on the scope of the invention; accordingly, the described range descriptions should be considered to have specifically disclosed all the possible sub-ranges as well as individual numerical values within that range. For example, it is contemplated that the description of a range from 1 to 6 has specifically disclosed sub-ranges such as, for example, from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as individual numbers within a range such as, for example, 1, 2, 3, 4, 5, and 6, as applicable regardless of the range. In addition, whenever a numerical range is indicated herein, it is meant to include any number (fractional or integer) recited within the range so indicated.

The embodiment of the present application provides a display panel, as shown in fig. 2 to 7, including a non-bending region A1 and a bending region A2, the display panel further includes:

a substrate 10;

the driving device layer 20 is disposed on the substrate 10, and the driving device layer 20 includes a plurality of driving devices M1, where the plurality of driving devices M1 are located in the non-bending region A1;

the flat layer 30 is arranged on the driving device layer 20, and the material of the flat layer 30 is a hydrophilic material;

a pixel defining layer 40 at least partially disposed on the planarization layer 30, wherein the pixel defining layer 40 is made of a hydrophobic material;

the adhesive dispensing layer is at least partially arranged on the flat layer 30 in the bending area A2;

in the bending region A2, the pixel defining layer 40 is disposed on the flat layer 30, a through contact hole 401 is disposed on the pixel defining layer 40, and a portion of the dot glue layer passes through the contact hole 401 and contacts the flat layer 30.

The display panel includes a substrate 10, a driving device layer 20 disposed on the substrate 10, and a planarization layer 30 disposed on the driving device layer 20, wherein a light emitting layer is disposed on the planarization layer 30;

specifically, the light emitting layer includes a first electrode 402 disposed on the flat layer 30 and located in the non-bending region A1, and a pixel defining layer 40 disposed on the flat layer 30 and a portion of the first electrode 402, a pixel opening is disposed on the pixel defining layer 40 corresponding to the first electrode 402, an organic light emitting material layer is disposed in the pixel opening, the organic light emitting material layer is disposed on the first electrode 402, a second electrode (only the first electrode 402 of the light emitting layer is shown in the figure) is disposed on the organic light emitting material layer, and the organic light emitting material layer includes a hole functional layer, an organic light emitting material layer, and a hole electron layer sequentially stacked on the first electrode 402.

Referring to fig. 2, the display panel includes a non-bending region A1 and a bending region A2, and the bending region A2 may be used to bend a portion of the structure of the display panel to the back of the display panel, so as to implement a narrow frame design, for example, bending a portion of the metal wires, the driving chip, and the flexible circuit board together to the back of the display panel for binding.

The driving device layer 20 includes a plurality of driving devices M1, the plurality of driving devices M1 are located in the non-bending region A1, the driving devices M1 are used for driving a display light emitting layer to perform light emitting display, the driving devices M1 specifically include thin film transistors, and the application describes that the driving devices M1 are thin film transistors.

The driving device layer 20 at least includes an active layer 204, a gate layer 206, routing layers (including a signal routing layer 207A1 and a metal routing layer 207 A2), and insulating layers, which are disposed in different layers, where the signal routing layer 207A1 may be a source drain layer, and the signal routing layer 207A1 is taken as a source drain layer for illustration in this application;

the insulating layer comprises a buffer layer 201, a dielectric layer 202 arranged on the buffer layer 201, and a passivation layer 203 arranged on the dielectric layer 202;

the active layer 204, the gate layer 206 and the source/drain layer are all designed in a patterned manner, and are used for forming devices such as an active portion, a gate, a source and a drain of each thin film transistor.

Specifically, the substrate 10 may include a base layer 101, a barrier layer 102 disposed on the base layer 101;

the material of the base layer 101 includes glass, and the barrier layer 102 may include two polyimide layers and an inorganic material layer disposed between the two polyimide layers, the material of the inorganic material layer includes but is not limited to at least one of SiOx, siNx, and Si (ON) x;

it should be noted that, in order to adapt to the production of a large-size display panel, an IJP process is usually adopted for the manufacturing of the light emitting layer, and the IJP process needs to set the material of the pixel defining layer 40 as a hydrophobic material, and a layer of glue (specifically, UV glue) needs to be coated on the board surface in the bending region A2 for fixing in the back-end manufacturing process of the display panel, so that the material of the pixel defining layer 40 and the material of the glue are not matched in the bending region A2, which results in uneven coating of the glue coating layer coated on the pixel defining layer 40 and results in unmatched bending stress of the display panel in the bending region A2 when the display panel is bent and bound.

Specifically, the planarization layer 30 is a hydrophilic material layer, and the material of the planarization layer 30 may be specifically an organic hydrophilic material;

specifically, the material of the pixel defining layer 40 is a hydrophobic material, and the material of the pixel defining layer 40 is not limited and is suitable for the IJP process, and may be, for example, a hydrophobic organic photoresist material.

As shown in fig. 2, fig. 3, fig. 4 and fig. 5, in the embodiment of the present application, the contact hole 401 is disposed on the pixel defining layer 40 in the bending region A2, so that the flat layer 30 in the bending region A2 is exposed through the contact hole 401, and during the back-end process of the display panel, the applied dispensing glue can be coated on the flat layer 30, and since the flat layer 30 is a hydrophilic material layer, which is matched with the material property of the dispensing glue, the dispensing glue can be uniformly spread on the flat layer 30, and the uniformity of the dispensing coating is effectively improved.

Specifically, the number of the contact holes 401 may be one or more, and the opening area of the contact holes 401 is not limited;

in a specific example, as shown in fig. 4, the number of the contact holes 401 may be one, a projection of the contact holes 401 in a direction perpendicular to the substrate 10 covers the bending region A2, in an actual production process, an upper opening area of the contact holes 401 is generally slightly larger than a lower opening area of the contact holes 401, and a projection of the contact holes 401 in a direction perpendicular to the substrate 10 may refer to a projection of an upper opening of the contact holes 401 in a direction perpendicular to the substrate 10.

In a specific example, as shown in fig. 3 and 5, the contact hole 401 may be a plurality of contact holes, and the shape of the contact hole 401 includes, but is not limited to, a long strip, a circle, or a rectangle; the arrangement mode of the contact holes 401 may be regular lattice arrangement, or may be sequential arrangement along a preset direction, where the preset direction may be a bending direction of the display panel, or a direction perpendicular to the bending direction of the display panel, and the bending stress of the display panel in the bending region A2 may also be further relieved by adopting different arrangement modes.

In particular, the material of the spot gluing layer (not shown in the figures) comprises UV glue.

It can be understood that, in the present application, the contact hole 401 is disposed on the pixel defining layer 40, the flat layer 30 is exposed by disposing the contact hole 401, the pixel defining layer 40 is made of a hydrophobic material, and the flat layer 30 is made of a hydrophilic material, so that the display panel can adopt the inkjet printing technology in the manufacturing process, and meanwhile, the coating of the dispensing in the back-end process is not affected, the dispensing in the back-end process can be directly coated on the flat layer 30 through the contact hole 401, and the flat layer 30 is made of a hydrophilic material, and the properties of the hydrophilic material are matched with the dispensing, so that the uniformity and the flatness of the dispensing coating are improved, the display panel is particularly suitable for the production of medium-size and large-size display panels, the production efficiency is effectively improved, and the production quality is improved.

In one embodiment, as shown in fig. 4, the contact hole 401 covers the bending region A2 in a direction perpendicular to the substrate 10.

It should be noted that, in an actual production process, an upper opening area of the contact hole 401 is generally slightly larger than a lower opening area of the contact hole 401, and a projection of the contact hole 401 in a direction perpendicular to the substrate 10 may refer to a projection of an upper opening of the contact hole 401 in a direction perpendicular to the substrate 10.

Specifically, in the present embodiment, the pixel defining layer 40 is hollowed out in the bending region A2 to expose most of the flat layer 30 in the bending region A2, and by using this scheme, the dispensing layers are uniform and more uniformly coated in the subsequent dispensing coating process.

It can be understood that the projection of the contact hole 401 in the direction perpendicular to the substrate 10 is disposed to cover the bending region A2, so that the uniformity of dispensing in the subsequent dispensing process can be further improved.

In an embodiment, the driving device layer 20 includes an insulating layer and a metal routing layer 207A2 stacked on the insulating layer, and the metal routing layer 207A2 is located in the bending region A2;

the metal routing layer 207A2 includes at least two metal sub-layers stacked together, where the at least two metal sub-layers include a first metal sub-layer L1 and at least one second metal sub-layer L2 located on a side of the first metal sub-layer L1 close to the substrate 10, and a corrosion resistance of the first metal sub-layer L1 is greater than a corrosion resistance of the second metal sub-layer L2.

In the prior art, as shown in fig. 1, the structure of the display panel includes a bending region A2 and a non-bending region A1, and the display panel further includes a substrate 10, a driving device layer 20, a planarization layer 30, and a pixel defining layer 40;

as shown in fig. 1, the driving device layer 20 includes an active layer 204, a gate insulating layer GI, a gate GE, and a routing layer 207; the wiring layer 207 includes source/drain wirings located in the non-bending region A1 and peripheral connection lines located in the bending region A2, the flat layer 30 covers the driving device layer 20, and the pixel defining layer 40 is disposed on the flat layer 30.

In the prior art, the routing layer 207 is partially located in the non-bending region A1 and partially located in the bending region A2, aluminum metal is generally used as a material of the routing layer 207 for small and medium-sized display panels, resistance-capacitance and voltage drop effects need to be considered in the structure of the large and medium-sized display panels, copper or an alloy thereof is generally used as the material of the routing layer 207, but copper is easily corroded when exposed in air or covered by an uncured organic material.

To the above defect, the embodiment of the present invention provides a metal routing layer 207A2 including at least two metal sub-layers, the corrosion resistance of the first metal sub-layer L1 is greater than the corrosion resistance of the second metal sub-layer L2, so as to avoid the metal routing layer 207A2 to be exposed in the air or the uncured organic material, and reduce the risk of corrosion of the metal routing layer 207A2.

Specifically, the metal routing layer 207A2 includes a plurality of peripheral metal routing lines for transmitting signals, such as a data line for transmitting a data voltage, a high voltage line VDD for transmitting a dc high level signal, or a low voltage line VSS for transmitting a dc low level signal.

Specifically, the insulating layer in this embodiment includes a buffer layer 201, a dielectric layer 202 disposed on the buffer layer 201, and a passivation layer 203 disposed on the dielectric layer; in this embodiment, a stress-reducing hole DH is disposed in communication with the buffer layer 201 and the dielectric layer 202, the metal wiring layer 207A2 is disposed on the buffer layer 201 and the dielectric layer 202, a portion of the metal wiring layer 207A2 is located in the stress-reducing hole DH, the passivation layer 203 is disposed on the metal wiring layer 207A2 and the dielectric layer 202, a connection hole is disposed on the passivation layer at a position corresponding to the stress-reducing hole DH, and the connection hole exposes the metal wiring layer 207A2 located in the stress-reducing hole DH, such that the planarization layer 30 contacts the metal wiring layer 207 A2;

specifically, the metal sub-layer is made of molybdenum, titanium, molybdenum-titanium alloy, copper alloy and the like, wherein the corrosion resistance of the molybdenum, the titanium and the molybdenum-titanium alloy is greater than that of the copper and the copper alloy.

Specifically, as shown in fig. 6 and 7, the driving device layer 20 includes a buffer layer 201, the buffer layer 201 includes three buffer sublayers, a light-shielding layer 50 is disposed between the three buffer sublayers, a total thickness of the buffer sublayers below the light-shielding layer 50 may be 6000A to 9000A, and a thickness of the buffer sublayers above the light-shielding layer 50 is 1000A to 5000A; the material of the buffer layer 201 may be any one or a combination of SiOx, siNx and Si (ON) x;

the light shielding layer 50 can be of one-layer or multi-layer structure, the material of the light shielding layer 50 is metal, and can be copper or copper alloy, and the thickness of the light shielding layer is 500A-10000A;

an active layer 204 is arranged on the buffer layer 201, the active layer 204 is obtained by patterning a deposited metal oxide semiconductor material, the metal oxide semiconductor material includes but is not limited to indium gallium zinc oxide, indium zinc tin oxide and indium gallium zinc tin oxide, and the thickness of the metal oxide semiconductor material can be 100A-1000A;

a gate insulating layer 205 is disposed on the active layer 204, the gate insulating layer 205 is made of materials including but not limited to SiOx or SiNx, and the gate insulating layer 205 may be one or more inorganic films;

the gate insulating layer 205 is provided with a gate, and in the manufacturing process, a pattern of the gate may be etched first, and then the inorganic film layer of the gate insulating layer 205 is etched to form the gate insulating layer 205 by using the pattern of the gate as a self-alignment; after the gate electrode is formed, ion implantation treatment is performed on the semiconductor layer other than the channel portion in the active layer 204, and an N + conductor layer is formed after the treatment on the metal oxide semiconductor without the gate insulating layer 205 and the gate electrode thereon;

specifically, the material of the grid electrode can be copper or copper alloy, the grid electrode can be a structure of one or more layers of metal, and the thickness can be 2000A-8000A.

Specifically, the material of the gate insulating layer 205 includes SiOx or SiNx, the gate insulating layer 205 may be a structure in which one or more thin films are stacked, and the thickness of the gate insulating layer 205 may be 1000A to 3000A.

A dielectric layer 202 is arranged on the active layer 204 and the gate, the signal routing layer 207A1 (source drain layer in this embodiment) is arranged on the dielectric layer 202, the material of the dielectric layer 202 includes but is not limited to SiOx or SiNx, the dielectric layer 202 may be a single layer or a multilayer structure, and the thickness thereof may be 1000A to 5000A;

specifically, the structure and the material of the signal routing layer 207A1 may be the same as those of the metal routing layer 207A2, that is, the signal routing layer 207A1 and the metal routing layer 207A2 may be prepared on the same layer, and a manufacturing process is omitted;

specifically, the signal routing layer 207A1 is located in the non-bending area A1, and the metal routing layer 207A2 is located in the bending area A2;

it can be understood that, as shown in fig. 6 and 7, by disposing the metal routing layer 207A2 to include at least two metal sub-layers, the corrosion resistance of the metal sub-layer disposed close to the planar layer 30 is greater than that of the metal sub-layer disposed away from the planar layer 30, the metal routing layer 207A2 in the middle-and large-sized display panel manufacturing process using the bending and bonding technology is prevented from being exposed to air or uncured organic material, and the risk of corrosion of the metal routing layer 207A2 is reduced.

In view of the above embodiments, as shown in fig. 7, a third metal sub-layer L3 is disposed on a side surface of the second metal sub-layer L2 close to the substrate 10, the side surface being far away from the first metal sub-layer L1;

the material of the first metal sub-layer L1 and the third metal sub-layer L3 includes titanium or molybdenum-titanium alloy, and the material of the second metal sub-layer L2 includes copper or copper alloy.

Specifically, the total thickness of the first metal sublayer L1, the second metal sublayer L2 and the third metal sublayer L3 may be 2000A to 8000A.

It can be understood that the material of the first metal sub-layer L1 and the third metal sub-layer L3 includes at least one of molybdenum, titanium, and molybdenum-titanium alloy, and the material of the second metal sub-layer L2 includes Cu, so that when the metal routing layer 207A2 uses copper or its alloy as a raw material, the upper first metal sub-layer L1 can play a role in corrosion prevention, and the third metal sub-layer L3 can enable the second metal sub-layer L2 to be better deposited on the dielectric layer 202, so as to improve the adhesion between the display panel film layers.

In one embodiment, as shown in fig. 7, the driving device layer 20 includes a signal routing layer 207A1, and the signal routing layer 207A1 and the metal routing layer 207A2 are disposed on the same layer and have the same material.

Specifically, the signal wiring layer 207A1 may specifically be a source drain of each thin film transistor.

It can be understood that the signal routing layer 207A1 and the metal routing layer 207A2 are disposed on the same layer and have the same material, which can reduce the number of mask processes, save the manufacturing process and reduce the manufacturing cost.

In an embodiment, in the bending region A2, a stress relief hole DH is disposed on the insulating layer, at least a portion of the metal wiring layer 207A2 is located in the stress relief hole DH, a portion of the flat layer 30 is disposed in the stress relief hole DH and covers the metal wiring layer 207A2, and an inner wall of the stress relief hole DH is stepped.

Specifically, as shown in fig. 7, in the bending region A2, the insulating layer may include a plurality of buffer layers 201 stacked on top of each other, a dielectric layer 202 disposed on the buffer layers 201, and a passivation layer 203 disposed on the dielectric layer 202;

specifically, the number of the stress reduction holes DH is not limited, and may be multiple, and the shape of the stress reduction holes DH is not limited, and may be circular or elongated, and may be adjusted according to actual production needs;

specifically, the depth of the stress relief hole DH is not limited, and may extend to the buffer layer 201 or the dielectric layer 202, and may be adjusted according to specific production conditions.

Specifically, a portion of the metal routing layer 207A2 extends into the stress relief hole DH, while the planarization layer 30 fills the stress relief hole DH, and the planarization layer 30 covers a portion of the metal routing layer 207A2 in the stress relief hole DH.

It should be noted that, in order to avoid the metal trace of the metal trace layer 207A2 from breaking when passing through the stress reduction hole DH, the technical solution of this embodiment is provided, that is, the stress reduction inner wall is set to be stepped, the number of steps in the stress reduction hole DH is not limited, and may be adjusted according to the actual production situation.

It can be understood that, through set up the stress hole DH that falls on the inorganic layer of bending zone A2, the part of metal routing layer 207A2 extends to in the stress hole DH that falls, it has mechanical material to fill in the stress hole DH that falls, and the metal is walked the top and is covered with organic material, can increase bending zone A2 display panel's resistant bending property, prevents simultaneously that the metal from walking the line fracture, and the setting is fallen stress hole DH inner wall and is the echelonment, can further solve the metal and walk the fracture problem because of falling the too dark fracture that leads to of stress hole DH.

Bearing the above embodiment, as shown in fig. 6 and 7, the stress reduction hole DH includes a first stress reduction hole and a second stress reduction hole DH2 that are communicated with each other, and an orthogonal projection of the first stress reduction hole DH1 in the direction perpendicular to the substrate 10 is located in the second stress reduction hole DH2, and a distance D between an opening edge of the first stress reduction hole DH1 and a sidewall of the second stress reduction hole DH2 is 10um to 30um.

Specifically, first fall stress hole DH1 set up in second fall stress hole DH2, the bottom surface of first fall stress hole DH1 forms the platform section of ladder, and the stress hole DH is fallen in the follow-up metal routing layer 207A2 cover of being convenient for, and the metal wiring (metal routing layer 207 A2) is difficult for breaking in the lateral wall department that falls stress hole DH simultaneously.

In an embodiment, in the bending region A2, the substrate 10 includes a base layer 101 and a barrier layer 102 disposed on the base layer 101, the driving device layer 20 is disposed on the barrier layer 102, and a distance between a side of the metal routing layer 207A2 in the stress reduction hole DH close to the base layer 101 and a side of the barrier layer 102 away from the base layer 101 in a direction perpendicular to the substrate 10 is 0A to 2000A.

It should be noted that, based on the limitation of the etching process condition, the etching depth of the stress reduction hole DH is not a fixed value, and fluctuates within a certain range according to the actual production condition;

it can be understood that, by setting the distance between the side of the metal routing layer 207A2 in the stress reduction hole DH, which is close to the substrate layer 101, and the side of the barrier layer 102, which is away from the substrate layer 101, to be 0A-2000A, specifically, any one of 0A, 1500A, or 2000A, a more suitable bending central plane can be achieved, so as to optimize the bending effect of the display panel in the bending area A2.

In an embodiment, as shown in fig. 5, the display panel of the bending region A2 is bent along a bending center line CL, and the number of the contact holes 401 is plural, wherein the closer to the bending center line CL, the larger the opening area of the contact holes 401 is.

It should be noted that when the display panel in the bending area A2 is bent and bound, the bending stress applied to the position close to the bending center line CL is relatively large;

it can be understood that the number of the contact holes 401 is set to be plural, the contact holes are set to be close to the bending center line CL, the larger the opening area of the contact holes 401 is, and further, the more uniform the distribution of the dispensing layers at the corresponding positions is, and meanwhile, the patterned pixel definition layer 40 can better relieve the bending stress of the display panel in the bending region A2.

In particular, mobile terminals include, but are not limited to, the following types: the display device comprises a mobile phone, a watch, a bracelet, a television or other wearable display or touch electronic devices, a smart phone with a curved surface, a tablet computer, a notebook computer, a desktop display, a television, smart glasses, a smart watch, an ATM (automatic teller machine), a digital camera, a vehicle-mounted display, a medical display, an industrial control display, an electronic paper book, an electrophoresis display device, a game machine, a transparent display, a double-sided display, a naked-eye 3D display, a mirror surface display device, a semi-reflecting and semi-transparent display device and the like.

In summary, in the present application, the contact hole 401 is formed in the pixel defining layer 40, the flat layer 30 is exposed by the contact hole 401, the pixel defining layer 40 is made of a hydrophobic material, and the flat layer 30 is made of a hydrophilic material, so that the display panel can adopt the inkjet printing technology in the manufacturing process, and the dispensing coating in the back-end process is not affected, the dispensing can be directly coated on the flat layer 30 through the contact hole 401 in the back-end process, and the flat layer 30 is made of a hydrophilic material, and the properties of the hydrophilic material are matched with the dispensing, so that the uniformity and the spreadability of the dispensing coating are improved, and the method is particularly suitable for the production of large-size display panels, effectively improves the production efficiency, and improves the production quality.

The display panel and the mobile terminal provided by the embodiment of the present application are described in detail above, and a specific example is applied in the description to explain the principle and the implementation of the present application, and the description of the above embodiment is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A display panel, comprising a non-bending region and a bending region, the display panel further comprising:

a substrate;

2. The display panel according to claim 1, wherein the contact hole covers the bending region in a direction perpendicular to the substrate.

3. The display panel of claim 1, wherein the driving device layer comprises an insulating layer and a metal routing layer stacked with the insulating layer, the metal routing layer being located in the bending region;

4. The display panel according to claim 3, wherein a side of the second metal sublayer, which is close to the substrate and is far from the first metal sublayer, is provided with a third metal sublayer;

5. The display panel of claim 3, wherein the driving device layer further comprises a signal routing layer, the signal routing layer is located in the non-bending region, and the signal routing layer and the metal routing layer are arranged on the same layer and are made of the same material.

6. The display panel according to claim 3, wherein a stress-relief hole is formed in the insulating layer in the bending region, at least a portion of the metal wiring layer is located in the stress-relief hole, a portion of the flat layer is disposed in the stress-relief hole and covers the metal wiring layer, and an inner wall of the stress-relief hole is stepped.

7. The display panel of claim 6, wherein the stress reduction holes comprise a first stress reduction hole and a second stress reduction hole which are communicated with each other, an orthographic projection of the first stress reduction hole in the direction perpendicular to the substrate is located in the second stress reduction hole, and a distance between an opening edge of the first stress reduction hole and a side wall of the second stress reduction hole is 10-30 um.

8. The display panel according to claim 6, wherein in the bending region, the substrate comprises a base layer and a barrier layer disposed on the base layer, the driving device layer is disposed on the barrier layer, and a distance between a side of the metal routing layer in the stress-reducing hole close to the base layer and a side of the barrier layer away from the base layer in a direction perpendicular to the substrate is 0A to 2000A.

9. The display panel of claim 1, wherein the display panel of the bending region is bent along a bending central line, and the number of the contact holes is plural, wherein the opening area of the contact hole is larger closer to the bending central line.

10. A mobile terminal comprising the display panel according to any one of claims 1 to 9 and a terminal body, wherein the display panel is integrated with the terminal body.