CN113625474A - Electro-optic modulator and system thereof - Google Patents
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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Abstract
The present disclosure relates to an electro-optic modulator and a system thereof. Wherein the electro-optic modulator comprises: the optical signal modulation module comprises at least two modulation components, the at least two modulation components are connected in parallel between the optical signal input end and the optical signal output end, and each electrical signal input end is correspondingly connected to one modulation component. In the embodiment of the disclosure, each modulation component can realize modulation processing of optical signals, and a plurality of optical signals subjected to modulation processing can be converged together and output from an optical signal output end, so that multi-order optical signals can be generated, and transmission of the multi-order optical signals can be realized only by butting one optical fiber at the optical signal output end, so that a plurality of silicon-based monolithic micro-ring modulators are not needed, and a plurality of optical fibers are not needed to be matched, thereby saving the cost.
Description
Technical Field
The embodiment of the disclosure relates to, but is not limited to, the technical field of silicon-based photonic integrated chips, and particularly relates to an electro-optical modulator and a system thereof.
Background
Silicon-based optoelectronic devices have advantages of Complementary Metal Oxide Semiconductor (CMOS) compatibility, good thermo-optic effect, plasma dispersion effect, and the like, and have been developed in recent years. Among them, the silicon-based modulator has gained much research attention because it can be used in an optical communication module, and among them, the silicon-based mach zehnder modulator and the silicon-based micro-ring modulator have been greatly developed. The silicon-based Mach-Zehnder modulator has good process stability and thermal stability, and compared with the Mach-Zehnder modulator, the micro-ring modulator has better advantages in the aspects of power consumption, size and the like. However, for example, in fig. 1, the current silicon-based monolithic micro-ring modulator only supports generation of single-order optical signals, and if multi-order optical signals are to be realized, a plurality of silicon-based monolithic micro-ring modulators are required to be matched with optical fibers, thereby causing a problem of increasing cost.
Disclosure of Invention
The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
In a first aspect, embodiments of the present disclosure provide an electro-optical modulator and a system thereof, which can be used to generate multi-order optical signals, and can save cost compared with a manner in which a plurality of silicon-based monolithic micro-ring modulators are used in cooperation with a plurality of optical fibers to implement multi-order optical signals.
In a second aspect, embodiments of the present disclosure provide an electro-optic modulator, comprising:
an optical signal input terminal;
an optical signal output terminal;
the optical signal modulation module comprises at least two modulation components, and the at least two modulation components are connected in parallel between the optical signal input end and the optical signal output end;
at least two electrical signal input ends, each electrical signal input end is correspondingly connected with one modulation component.
In a third aspect, embodiments of the present disclosure also provide an electro-optical modulation system including the electro-optical modulator of the second aspect.
The embodiment of the disclosure comprises: the optical signal modulation module comprises at least two modulation components, the at least two modulation components are connected between the optical signal input end and the optical signal output end in parallel, and each electrical signal input end is correspondingly connected to one modulation component. According to the scheme provided by the embodiment of the disclosure, the optical signal input end can provide optical signal input for the optical signal modulation module, and the electrical signal input end can provide electrical signal input for the optical signal modulation module, so that the electrical signal can modulate the optical signal in the optical signal modulation module; because the modulation subassembly is provided with two at least, every modulation subassembly all can realize the modulation processing to light signal, consequently, a plurality of light signals that are handled through the modulation can assemble together and export from the light signal output to can produce multistage light signal, so, only need at light signal output end butt joint an optic fibre, can realize multistage light signal's transmission. Therefore, compared with the mode that a plurality of silicon-based monolithic micro-ring modulators are matched with a plurality of optical fibers to realize multi-order optical signals in the related art, the embodiment of the disclosure does not need to use a plurality of silicon-based monolithic micro-ring modulators or a plurality of optical fibers for matching, thereby saving the cost.
Additional features and advantages of the disclosure will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the disclosure. The objectives and other advantages of the disclosure may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the disclosed embodiments and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the example serve to explain the principles of the disclosure and not to limit the disclosure.
FIG. 1 is a schematic diagram of a prior art electro-optic modulator;
FIG. 2 is a schematic diagram of an electro-optic modulator provided by one embodiment of the present disclosure;
FIG. 3 is a schematic diagram of an electro-optic modulator provided by another embodiment of the present disclosure;
FIG. 4 is a schematic diagram of an electro-optic modulator provided by another embodiment of the present disclosure;
FIG. 5 is a schematic diagram of an electro-optic modulator provided by another embodiment of the present disclosure;
FIG. 6 is a schematic diagram of an electro-optic modulator according to an embodiment of the present disclosure with a 1:2 splitting ratio of the splitting assembly;
FIG. 7 is a schematic diagram of an electro-optic modulator according to another embodiment of the present disclosure with a 1:2 splitting ratio of the splitting assembly;
FIG. 8 is a schematic diagram of an electro-optic modulator with a 1:3 splitting ratio of the splitting assembly according to one embodiment of the present disclosure;
FIG. 9 is a schematic diagram of an electro-optic modulator according to another embodiment of the present disclosure with a 1:3 splitting ratio of the splitting assembly;
fig. 10 is a schematic diagram of an electro-optic modulation system provided by one embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the disclosure and are not intended to limit the disclosure.
It is to be understood that the description and claims are for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
The utility model provides an electro-optical modulator and system thereof, through setting up light signal input end, light signal output end, light signal modulation module and at least two electrical signal input ends, wherein, light signal modulation module includes two at least modulation subassemblies, two at least modulation subassemblies connect in between light signal input end and light signal output end, every electrical signal input end corresponds and connects in the modulation subassembly of one, therefore, light signal input end can provide the light signal input for light signal modulation module, electrical signal input end can provide the electrical signal input for light signal modulation module, therefore, the electrical signal can carry out modulation processing to the light signal in light signal modulation module; because the modulation subassembly is provided with two at least, every modulation subassembly all can realize the modulation processing to light signal, consequently, a plurality of light signals that are handled through the modulation can assemble together and export from the light signal output to can produce multistage light signal, so, only need at light signal output end butt joint an optic fibre, can realize multistage light signal's transmission. Therefore, compared with the mode that a plurality of silicon-based monolithic micro-ring modulators are matched with a plurality of optical fibers to realize multi-order optical signals in the related art, the embodiment of the disclosure does not need to use a plurality of silicon-based monolithic micro-ring modulators or a plurality of optical fibers for matching, thereby saving the cost.
The embodiments of the present disclosure will be further explained with reference to the drawings.
As shown in fig. 2, fig. 2 is a schematic diagram of an electro-optic modulator 500 provided by an embodiment of the present disclosure.
As shown in fig. 2, the electro-optic modulator 500 includes:
an optical signal input terminal 100;
an optical signal output terminal 200;
the optical signal modulation module 300 includes at least two modulation components 310, wherein the at least two modulation components 310 are connected in parallel between the optical signal input end 100 and the optical signal output end 200;
at least two electrical signal inputs 400, each electrical signal input 400 being connected to a corresponding one of the modulation assemblies 310.
In an embodiment, the optical signal input terminal 100 is capable of receiving an externally input optical signal to provide to the optical signal modulation module 300, wherein the externally input optical signal can be obtained by, but not limited to, various types of signal generation devices, such as various types of lasers or signal generators.
In an embodiment, the optical signal output end 200 can be matched with an optical fiber, that is, the optical signal output end 200 can transmit the multi-order optical signal through the optical fiber, and transmit the information carried by the multi-order optical signal through the optical fiber, so that the optical fiber communication can be realized well and stably.
In an embodiment, the number of the modulation elements 310 in the optical signal modulation module 300 is at least two, for example, as shown in fig. 2, the number of the modulation elements 310 in this embodiment is three, and regardless of the number of the modulation elements 310, each modulation element 310 in the optical signal modulation module 300 can receive the initial optical signal from the optical signal input end 100 and output the corresponding modulated output optical signal to the optical signal output end 200, thereby achieving stable modulation and output of multiple optical signals.
In an embodiment, it is only necessary to ensure that at least two modulation components 310 are connected in parallel between the optical signal input terminal 100 and the optical signal output terminal 200, that is, each modulation component 310 may be arbitrarily installed, for example, each modulation component 310 may be arranged in a staggered manner, and the installation position of each modulation component 310 is not limited in this embodiment.
In an embodiment, the electrical signal input terminals 400 can receive an externally input electrical signal to provide the externally input electrical signal to the corresponding modulation component 310, and under the action of the electrical signal, the modulation component 310 can perform modulation processing on the optical signal, where the electrical signal input by each electrical signal input terminal 400 may be the same or different, that is, the modulation effect on the modulation component 310 based on the electrical signal may be the same or different, and is not limited in this embodiment. It should be noted that, in the case that the electrical signals input by the electrical signal input terminals 400 are the same, in order to ensure that the optical signal output terminal 200 can output multiple orders of optical signals, an attenuator may be connected after each modulation component 310, and the attenuation value of each attenuator is different.
In one embodiment, the modulation component 310 may be a micro-ring modulation module, which is a passive element, has smaller power consumption and size, can be integrated on a smaller chip, and can save energy consumption compared to the currently commonly used mach-zehnder modulator.
In an embodiment, the modulation component 310 may also be an electro-absorption modulation module, which is an optical signal modulation element fabricated by utilizing an exciton absorption effect in a semiconductor, has the characteristics of fast response speed and low power consumption, can be applied to modulation and coding of signals in high-speed optical fiber communication, belongs to a passive element, can save power consumption, and can be integrated on a small chip.
In one embodiment, the optical signal input 100, the optical signal output 200, the modulation component 310, and the electrical signal input 400 may be integrated on a single silicon substrate. The silicon-based monolithic is an information function device using photons and electrons as carriers, combines the characteristics of extremely high bandwidth, ultra-fast speed and high anti-interference of light, can be integrated on a large scale, has the advantages of low energy consumption, low cost and the like, belongs to a novel large-scale photoelectric integrated chip with comprehensive functions at present, and can integrally execute a series of processes from optical signal input and modulation to output by integrating an optical signal input end 100, an optical signal output end 200, a modulation component 310 and an electric signal input end 400 on the silicon-based monolithic, namely, the silicon-based monolithic is used as a carrier, so that the whole functions of the electro-optical modulator 500 of the embodiment can be completely realized.
As shown in fig. 3, fig. 3 is a schematic diagram of an electro-optic modulator 500 provided by another embodiment of the present disclosure.
As shown in fig. 3, the optical signal modulation module 300 further includes an optical splitter 320, and the optical signal input terminal 100 is connected to each of the modulation components 310 through the optical splitter 320. In this embodiment, the optical splitting component 320 can be configured to receive an initial optical signal input by the optical signal input end 100, and split the initial optical signal to generate multiple split optical signals, where the number of paths of the optical signals is not less than the number of the modulation components 310, and therefore, the optical splitting component 320 can input multiple optical signals into each modulation component 310 in a one-to-one correspondence manner, so that each modulation component 310 can receive a corresponding optical signal, so that the optical signal can be modulated by the optical splitting component.
In an embodiment, the optical splitter component 320 may be, but is not limited to, optical splitters of various models or categories, and since the optical splitter is a passive device, it does not need external energy to support when operating, and only needs to input an initial optical signal to split light through the optical splitter, so that the optical splitter consumes less power relatively and is convenient to integrate on a smaller chip.
In one embodiment, the optical signal input 100, the optical splitting element 320, the optical signal output 200, the modulation element 310 and the electrical signal input 400 can be integrated on a silicon-based monolithic, which is an information-functional device using photons and electrons as carriers, it combines the characteristics of extremely high bandwidth, ultra-fast speed and high anti-interference of light, can be integrated on a large scale, has the advantages of low energy consumption, low cost and the like, in the current novel large-scale photoelectric integrated chip with comprehensive functions, by integrating the optical signal input end 100, the light splitting component 320, the optical signal output end 200, the modulation component 310 and the electrical signal input end 400 on a silicon-based single chip, so that a series of processes including input, dispersion, modulation to output of an optical signal can be integrally performed, that is, the entire function of the electro-optical modulator 500 of the present embodiment can be completely realized based on the silicon-based monolithic substrate as a carrier.
In one embodiment, the splitting ratio of the splitting assembly 320 corresponds to the number of modulating assemblies 310, that is, the optical splitter module 320 outputs a corresponding number of optical signals after being split based on the splitting ratio thereof, and these optical signals can be input into the modulator module 310 in a one-to-one correspondence, it is ensured that each modulation component 310 can acquire a stable and reliable optical signal input, thereby facilitating the modulation component 310 to implement the modulation of the optical signal, specifically, for example, when the splitting ratio of the splitting component 320 is 1:2, the number of the corresponding modulation assemblies 310 is two, and the optical splitting assembly 320 can output two optical signals to each corresponding modulation assembly 310, or, when the splitting ratio of the optical splitting assembly 320 is 1:3, the number of the corresponding modulation components 310 is three, and the optical splitter component 320 can output three optical signals to each corresponding modulation component 310, and so on.
As shown in fig. 4, fig. 4 is a schematic diagram of an electro-optic modulator 500 provided by another embodiment of the present disclosure.
As shown in fig. 4, the optical signal modulation module 300 further includes at least one attenuation element 330, and each attenuation element 330 is connected between the optical signal output end 200 and one of the modulation elements 310. In this embodiment, the attenuation component 330 can perform attenuation modulation on the modulated optical signal from the modulation component 310, so as to obtain an attenuated optical signal meeting the modulation requirement, and can output the optical signal to the optical signal output end 200, so as to implement the output of a multi-order optical signal, the attenuation component 330 provides attenuation for the optical signal, and can correspondingly adjust the amplitude of the optical signal, so that the optical signal meets the modulation requirement, and the attenuation component 330 can also improve impedance matching, that is, the optical signal related circuit requires a relatively stable load impedance, and the attenuation component 330 is arranged between the optical signal related circuit and the actual load impedance, so that the impedance change can be buffered, and the optical signal transmission is more stable and reliable. The modulation requirements include, but are not limited to, amplitude values of the optical signal, uniformity of the multi-level optical signal, and the like, which are not limited in this embodiment.
In one embodiment, the attenuation component 330 may be various types or categories of attenuators, such as displacement type optical attenuators, attenuation sheet type optical attenuators, and the like, which are not limited in this embodiment.
In one embodiment, the optical signal input terminal 100, the optical signal output terminal 200, the modulation component 310, the attenuation component 330 and the electrical signal input terminal 400 can be integrated on a silicon-based monolithic chip, which combines the characteristics of extremely high bandwidth, ultra-fast speed and high anti-interference of light, and can be integrated on a large scale, and has the advantages of low energy consumption, low cost and the like, which is an information functional device using photons and electrons as carriers, belongs to a novel large-scale photoelectric integrated chip with comprehensive functions at present, by integrating the optical signal input 100, the optical signal output 200, the modulation component 310, the attenuation component 330 and the electrical signal input 400 on a silicon-based single chip, so that a series of processes including input, modulation, attenuation to output of an optical signal can be integrally performed, i.e., based on a silicon-based monolithic substrate as a carrier, the entire functionality of the electro-optic modulator 500 of the present embodiment can be fully realized.
In an embodiment, the attenuation amplitude that the attenuation component 330 itself can provide for the corresponding optical signal may be preset, or may be adjusted according to the situation of the acquired optical signal, which is not limited in this embodiment.
In an embodiment, the number of attenuation elements 330 is equal to the number of modulation elements 310, that is, each attenuation element 330 can provide an attenuation amplitude for the corresponding optical signal, so that the optical signal output by any one modulation element 310 can be attenuated and output, thereby satisfying the modulation requirement.
In an embodiment, the number of the attenuation elements 330 is smaller than the number of the modulation elements 310, that is, based on the modulation requirement, when at least one path of the optical signal does not need to be attenuated, theoretically, the attenuation value provided to the path of the optical signal is zero, and the corresponding attenuation element 330 does not need to be provided for the path of the optical signal, so that the number of the attenuation elements 330 is necessarily smaller than the number of the modulation elements 310 as a whole, thereby satisfying the modulation requirement.
In one embodiment, when the number of the attenuation elements 330 is more than two, the attenuation values between the attenuation elements 330 are in a multiple relationship. In this embodiment, the attenuation values of the attenuation components 330 are set to be in a multiple relationship, so that the attenuation amplitudes of the corresponding optical signals attenuated by the attenuation components 330 are also distributed in multiples, and therefore, the amplitudes of the multi-order optical signals formed based on the attenuated optical signals are also distributed, that is, the output multi-order optical signals can have the characteristic of uniform step distribution.
Specific examples are given below to illustrate the contents of the above-described embodiments.
Example one:
as shown in fig. 6, when the splitting ratio of the splitting assembly 320 is 1:2, the splitting assembly 320 can output two optical signals based on the splitting ratio, the two optical signals can be input into the two modulation assemblies 310 in a one-to-one correspondence manner, at this time, the modulation assemblies 310 modulate the corresponding optical signals based on the obtained electrical signals and output two paths of modulated optical signals, then, based on the attenuation values between the attenuation assemblies 330 being in a multiple relationship, the two attenuation assemblies 330 are adopted, the attenuation values of the two attenuation assemblies can be 3dB and 6dB respectively, and finally, the two paths of attenuated optical signals are transmitted to the optical signal output end 200, so that multi-order optical signals can be generated to match optical fibers for signal transmission.
Example two:
as shown in fig. 7, when the splitting ratio of the splitting assembly 320 is 1:2, the splitting assembly 320 can output two optical signals based on the splitting ratio, the two optical signals can be input into the two modulation assemblies 310 in a one-to-one correspondence manner, at this time, the modulation assemblies 310 modulate corresponding optical signals based on the obtained electrical signals and output two paths of modulated optical signals, then only one attenuation assembly 330 is adopted, that is, only one path of modulated optical signals is attenuated, and the other path of modulated optical signals is directly output to the optical signal output end 200 without being attenuated, at this time, the attenuation value of the attenuation assembly 330 may be 3dB, and finally, both the one path of attenuated optical signals and the one path of non-attenuated optical signals are transmitted to the optical signal output end 200, so that a multi-order optical signal can be generated to match an optical fiber for signal transmission.
Example three:
as shown in fig. 8, when the splitting ratio of the splitting component 320 is 1:3, the splitting component 320 can output three optical signals based on the splitting ratio, the three optical signals can be input into the three modulation components 310 in a one-to-one correspondence, at this time, the modulation components 310 modulate the corresponding optical signals based on the obtained electrical signals and output three modulated optical signals, then, based on the attenuation values between the attenuation components 330 being in a multiple relationship, the three attenuation components 330 are adopted, the attenuation values of the three attenuation components can be 3dB, 6dB and 9dB, respectively, and finally, the three attenuated optical signals are transmitted to the optical signal output end 200, so that multi-order optical signals can be generated to match optical fibers for signal transmission.
Example four:
as shown in fig. 9, when the splitting ratio of the splitting assembly 320 is 1:3, the splitting assembly 320 can output three optical signals based on the splitting ratio, the three optical signals can be input into the three modulation components 310 in a one-to-one correspondence, at which time the modulation components 310 modulate the corresponding optical signals based on the obtained electrical signals and output three-way modulated optical signals, then, based on the multiple relationship of the attenuation values between the attenuation elements 330, using two attenuation elements 330, that is, only two paths of modulated optical signals are attenuated, and the other path of modulated optical signals are directly output to the optical signal output end 200 without being attenuated, at this time, the attenuation values of the two attenuation components 330 can be 3dB and 6dB respectively, both the two attenuated optical signals and the one non-attenuated optical signal are finally transmitted to the optical signal output end 200, so that a multi-order optical signal can be generated to match an optical fiber for signal transmission.
In an embodiment, when the number of the attenuation elements 330 is two or more, the attenuation values of the attenuation elements 330 are different from each other, and therefore, the amplitudes of the attenuated optical signals corresponding to different attenuation values are different from each other, and a stable multi-order optical signal can be obtained based on the attenuated optical signals different from each other, for example, if the number of the attenuation elements 330 is two and the attenuation values of the two attenuation elements 330 are different from each other, a stable 2 can be generated2A step light signal, i.e., a 4-step light signal; if the number of the attenuation elements 330 is three and the attenuation values of the three attenuation elements 330 are different from each other, it is possible to generate stable 23The order light signal, i.e. the 8-order light signal, and so on, if the number of the attenuation elements 330 is N and the attenuation values of the N attenuation elements 330 are different from each other, then stable 2 can be generatedNA step light signal, wherein N is a positive integer greater than or equal to 2.
As shown in fig. 5, fig. 5 is a schematic diagram of an electro-optic modulator 500 provided by another embodiment of the present disclosure.
As shown in fig. 5, the optical signal modulation module 300 further includes a coupling component 340, and the coupling component 340 is connected between the attenuation component 330 and the optical signal output end 200. In this embodiment, the coupling component 340 can couple the attenuated optical signals output by the attenuation components 330, so as to generate multi-order optical signals and transmit the multi-order optical signals to the optical signal output end 200, thereby implementing communication transmission of the multi-order optical signals, and therefore, the coupling component 340 has a good coupling effect, which is beneficial to generating the multi-order optical signals and outputting the multi-order optical signals as a whole, and compared with the conventional technology, the cost can be saved.
In an embodiment, the coupling component 340 may be an integrated light combiner, the type of the light combiner is not limited, or may be a light combining device formed by a lens set and a related structure, that is, light combining is realized by the polarization of the lens set and the related structure, since the lens set and the related structure are one of the coupling components 340 commonly used in the art, they are not described in detail herein to avoid redundancy.
In an embodiment, the optical signal input terminal 100, the optical signal output terminal 200, the modulation component 310, the coupling component 340 and the electrical signal input terminal 400, or the optical signal input terminal 100, the optical signal output terminal 200, the modulation component 310, the attenuation component 330, the coupling component 340 and the electrical signal input terminal 400, may be integrated on a silicon-based single chip, which is an information functional device using photons and electrons as carriers, and which combines the characteristics of extremely high bandwidth, ultra-fast rate and high interference resistance of light, and is capable of large-scale integration, and has the advantages of low energy consumption, low cost, etc. in the present novel large-scale optoelectronic integrated chip with integrated functions, the optical signal input terminal 100, the optical signal output terminal 200, the modulation component 310, the coupling component 340 and the electrical signal input terminal 400, or the optical signal input terminal 100, the optical signal output terminal 200, the modulation component 310, the coupling component 340 and the electrical signal input terminal 400 are integrated on a silicon-based single chip The attenuation module 330, the coupling module 340 and the electrical signal input terminal 400 are integrated on a silicon-based monolithic substrate, so that a series of processes from optical signal input, modulation to coupling output can be integrally performed, that is, based on the silicon-based monolithic substrate as a carrier, the whole functions of the electro-optical modulator 500 of the present embodiment can be completely realized.
As shown in fig. 10, fig. 10 is a schematic diagram of an electro-optical modulation system 600 provided by an embodiment of the present disclosure.
As shown in fig. 10, the electro-optic modulation system 600 includes: the electro-optic modulator 500 of any of the embodiments described above.
In one embodiment, the electro-optic modulation system 600 comprises: the optical signal modulation module 300 comprises at least two modulation components 310, the at least two modulation components 310 are connected in parallel between the optical signal input end 100 and the optical signal output end 200, and each electrical signal input end 400 is correspondingly connected to one modulation component 310. According to the scheme provided by the embodiment of the present disclosure, the optical signal input end 100 can provide optical signal input for the optical signal modulation module 300, and the electrical signal input end 400 can provide electrical signal input for the optical signal modulation module 300, so that the electrical signal can perform modulation processing on the optical signal in the optical signal modulation module 300; because the modulation assemblies 310 are at least provided with two, each modulation assembly 310 can realize the modulation processing of the optical signals, and therefore, a plurality of optical signals subjected to the modulation processing can be converged together and output from the optical signal output end 200, so that multi-order optical signals can be generated, and the transmission of the multi-order optical signals can be realized only by butting one optical fiber at the optical signal output end 200. Therefore, compared with the mode that a plurality of silicon-based monolithic micro-ring modulators are matched with a plurality of optical fibers to realize multi-order optical signals in the related art, the embodiment of the disclosure does not need to use a plurality of silicon-based monolithic micro-ring modulators or a plurality of optical fibers for matching, thereby saving the cost.
While the present disclosure has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims.
Claims (10)
1. An electro-optic modulator, comprising:
an optical signal input terminal;
an optical signal output terminal;
the optical signal modulation module comprises at least two modulation components, and the at least two modulation components are connected in parallel between the optical signal input end and the optical signal output end;
at least two electrical signal input ends, each electrical signal input end is correspondingly connected with one modulation component.
2. The electro-optic modulator of claim 1, wherein the optical signal modulation module further comprises an optical splitter, and the optical signal input terminal is connected to each of the modulation modules through the optical splitter.
3. The electro-optic modulator of claim 1 or 2, wherein the optical signal modulating module further comprises at least one attenuation element, each attenuation element being coupled between the optical signal output and one of the modulating elements.
4. The electro-optic modulator of claim 3, wherein the optical signal modulation module further comprises a coupling assembly connected between the attenuation assembly and the optical signal output.
5. The electro-optic modulator of claim 2, wherein a splitting ratio of the splitting assembly corresponds to a number of the modulating assemblies.
6. The electro-optic modulator of claim 3, wherein when the number of the attenuation elements is two or more, attenuation values between the attenuation elements are in a multiple relationship.
7. The electro-optic modulator of claim 3, wherein the number of attenuation components does not exceed the number of modulation components.
8. The electro-optic modulator of claim 1, wherein the modulating component is a micro-ring modulating component.
9. The electro-optic modulator of claim 1, wherein the optical signal input, the optical signal output, the modulation component, and the electrical signal input are integrated into a single silicon-based chip.
10. An electro-optic modulation system comprising an electro-optic modulator according to any one of claims 1 to 9.
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| CN202010373619.2A CN113625474A (en) | 2020-05-06 | 2020-05-06 | Electro-optic modulator and system thereof |
| PCT/CN2021/091934 WO2021223715A1 (en) | 2020-05-06 | 2021-05-06 | Electro-optic modulator and system thereof |
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| CN101577589B (en) * | 2008-05-05 | 2012-08-22 | 华为技术有限公司 | Optical modulation device, optical modulation method and dispersion pre-compensation transmitter |
| CN103576345A (en) * | 2013-10-28 | 2014-02-12 | 华中科技大学 | Programmable optical filter based on integrated silicon waveguide |
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