CN113608381A - Composite copper foil material for preventing warping of liquid crystal module - Google Patents
Composite copper foil material for preventing warping of liquid crystal module Download PDFInfo
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- CN113608381A CN113608381A CN202110892940.6A CN202110892940A CN113608381A CN 113608381 A CN113608381 A CN 113608381A CN 202110892940 A CN202110892940 A CN 202110892940A CN 113608381 A CN113608381 A CN 113608381A
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- copper foil
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
- G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C3/00—Milling particular work; Special milling operations; Machines therefor
- B23C3/28—Grooving workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/02—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for connecting objects by press fit or for detaching same
- B23P19/033—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for connecting objects by press fit or for detaching same using vibration
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to the technical field of liquid crystal modules, in particular to an anti-warping composite copper foil material for a liquid crystal module, which improves the supporting strength of a copper foil in all directions, ensures heat dissipation and is beneficial to the anti-warping of the liquid crystal module; the method comprises the following steps: the copper foil is fixedly arranged on the liquid crystal module heating component and used for radiating heat of the heating component; one end of the copper foil, which is far away from the heating component, is symmetrically provided with caulking grooves which are shaped like Chinese characters 'mi'; the carbon fiber bar is of a structure shaped like a Chinese character 'mi', is embedded into the caulking groove in an interference manner, and has the same thickness as the depth of the caulking groove; and a copper plating layer is plated on the joint end face of the carbon fiber rib and the copper foil.
Description
Technical Field
The invention relates to the technical field of liquid crystal modules, in particular to a composite copper foil material for resisting warping of a liquid crystal module.
Background
The principle of liquid crystal display is that a backlight lamp assembly emits uniform surface light, and the light is transmitted to eyes of people through a liquid crystal screen; the screen functions to process these lights on a pixel-by-pixel basis to display an image;
in the liquid crystal module course of operation, main working assembly can produce a large amount of heats, needs in time to dispel the heat, and most liquid crystal module all adopt the copper foil to attach on working assembly, will some heat dissipation to convert the face heat dissipation into, and current copper foil supports intensity relatively poor, is unfavorable for the anti warpage of liquid crystal module.
Disclosure of Invention
In order to solve the technical problems, the invention provides the composite copper foil material for the liquid crystal module, which can improve the supporting strength of the copper foil in all directions, ensure the heat dissipation and is beneficial to the liquid crystal module to resist the warping.
The invention relates to a composite copper foil material for resisting warping of a liquid crystal module, which comprises the following components:
the copper foil is fixedly arranged on the liquid crystal module heating component and used for radiating heat of the heating component; one end of the copper foil, which is far away from the heating component, is symmetrically provided with caulking grooves which are shaped like Chinese characters 'mi';
the carbon fiber bar is of a structure shaped like a Chinese character 'mi', is embedded into the caulking groove in an interference manner, and has the same thickness as the depth of the caulking groove;
and a copper plating layer is plated on the joint end face of the carbon fiber rib and the copper foil.
Furthermore, the ratio of the depth of the caulking groove to the thickness of the copper foil is 0.4-0.5.
Furthermore, the end face roughness of the copper foil provided with the caulking groove is Ra1.2-1.4.
Furthermore, the branch end part of the caulking groove does not penetrate through the side end of the copper foil.
In another aspect, a composite copper foil material for use in liquid crystal modules that resists warping is produced by processing the following steps:
s1, selecting copper foils with certain thickness and uniform thickness according to the liquid crystal modules with different sizes, and carrying out roughness treatment on one side end face of each copper foil according to the pre-calculated roughness value;
s2, milling a plurality of sets of crossed-type caulking grooves on the end face subjected to the roughness treatment in the step S1 by using a high-precision milling machine according to the size of the liquid crystal module, wherein the distances between the adjacent crossed-type caulking grooves are the same;
s3, cleaning the end face, which is milled with the mi-shaped caulking groove in the step S2, and cleaning the inside of the mi-shaped caulking groove;
s4, air-drying the cleaned copper foil at constant temperature, wherein the constant temperature is not higher than 85 ℃;
s5, uniformly coating an insoluble sealant on the end face of the copper foil which is not grooved, and carrying out constant-temperature air drying;
s6, cutting the cleaned copper foil into rectangular plates with corresponding sizes according to the region where each group of the rice-shaped caulking grooves are located;
s7, pressing a prepared carbon fiber rib shaped like a Chinese character 'mi' into the embedded groove shaped like a Chinese character 'mi' on the rectangular plate in an interference manner by using an ultrasonic pressing machine, and enabling the carbon fiber rib shaped like a Chinese character 'mi' to be flush with the surface of the rectangular plate;
s8, connecting the pressed rectangular plate of the S7 with the negative electrode of a direct current power supply by using a lead, completely immersing the rectangular plate in an electroplating pool containing copper sulfate solution, connecting the positive electrode of the direct current power supply with a pure copper block, completely immersing the pure copper block in the copper sulfate solution, starting the direct current power supply, electroplating the end face of the carbon fiber rib in front of the rectangular plate in the shape of the Chinese character 'mi' until the plating layer completely covers the surface of the carbon fiber rib in the shape of the Chinese character 'mi', and forming a flat copper surface;
s9, cleaning the rectangular plate electroplated in the step S8, washing away copper sulfate solution on the surface of the rectangular plate, and then carrying out constant-temperature air drying;
and S10, carrying out hot melting degumming on the rectangular plate air-dried in the S9 temperature, wherein the hot melting temperature is not higher than 80 ℃, and obtaining the composite copper foil after degumming.
Further, in the step S7, a difference between the surface of the carbon fiber rib shaped like a Chinese character 'mi' and the surface of the rectangular plate is less than 0.05 mm.
Further, the concentration of the copper sulfate solution is 2.3-3 mol/L.
Further, the wind direction of the S4, the S5 and the S9 is parallel to the surface of the copper foil when the copper foil is dried at a constant temperature.
Further, a sodium chloride solution is added into the copper sulfate solution, and the concentration of the sodium chloride solution is 1-1.5 mol/L.
Compared with the prior art, the invention has the beneficial effects that: through fluting on the copper foil to the embedding carbon fiber, can greatly promote the support intensity of copper foil, through designing into the rice style of calligraphy with the caulking groove, be favorable to making the carbon fiber muscle be and disperse the form and imbed to the copper foil in, thereby promote the support intensity of copper foil all directions, when guaranteeing the heat dissipation, be favorable to the anti warpage of liquid crystal module.
Drawings
FIG. 1 is a schematic structural view of the present invention;
in the drawings, the reference numbers: 1. copper foil; 2. caulking grooves; 3. carbon fiber ribs; 4. and (4) copper plating.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, or may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. This embodiment is written in a progressive manner.
As shown in fig. 1, the composite copper foil material for preventing warping of a liquid crystal module according to the present invention comprises:
the copper foil 1 is fixedly arranged on the liquid crystal module heating component and used for dissipating heat of the heating component; one end of the copper foil 1, which is far away from the heating component, is symmetrically provided with caulking grooves 2, and the caulking grooves 2 are in a shape of Chinese character 'mi';
the carbon fiber bar 3 is of a structure shaped like a Chinese character 'mi', the carbon fiber bar 3 is embedded into the caulking groove 2 in an interference mode, and the thickness of the carbon fiber bar 3 is the same as the depth of the caulking groove 2;
wherein, the end face of the combination of the carbon fiber rib 3 and the copper foil 1 is plated with a copper plating layer 4;
in this embodiment, through fluting on the copper foil to the embedding carbon fiber, can greatly promote the support intensity of copper foil, through designing into the rice style of calligraphy with the caulking groove, be favorable to making the carbon fiber muscle be and disperse form embedding to the copper foil in, thereby promote the support intensity of copper foil all directions, when guaranteeing the heat dissipation, be favorable to the anti warpage of liquid crystal module.
Preferably, the composite copper foil material for preventing warping of the liquid crystal module comprises:
the copper foil 1 is fixedly arranged on the liquid crystal module heating component and used for dissipating heat of the heating component; one end of the copper foil 1, which is far away from the heating component, is symmetrically provided with caulking grooves 2, and the caulking grooves 2 are in a shape of Chinese character 'mi';
the carbon fiber bar 3 is of a structure shaped like a Chinese character 'mi', the carbon fiber bar 3 is embedded into the caulking groove 2 in an interference mode, and the thickness of the carbon fiber bar 3 is the same as the depth of the caulking groove 2;
wherein, the end face of the combination of the carbon fiber rib 3 and the copper foil 1 is plated with a copper plating layer 4;
the ratio of the depth of the caulking groove 2 to the thickness of the copper foil 1 is 0.4-0.5.
Preferably, the composite copper foil material for preventing warping of the liquid crystal module comprises:
the copper foil 1 is fixedly arranged on the liquid crystal module heating component and used for dissipating heat of the heating component; one end of the copper foil 1, which is far away from the heating component, is symmetrically provided with caulking grooves 2, and the caulking grooves 2 are in a shape of Chinese character 'mi';
the carbon fiber bar 3 is of a structure shaped like a Chinese character 'mi', the carbon fiber bar 3 is embedded into the caulking groove 2 in an interference mode, and the thickness of the carbon fiber bar 3 is the same as the depth of the caulking groove 2;
wherein, the end face of the combination of the carbon fiber rib 3 and the copper foil 1 is plated with a copper plating layer 4;
the end face roughness of the copper foil 1 provided with the caulking groove 2 is Ra1.2-1.4; in the present embodiment, by the above arrangement, the surface of the copper foil 1 is easily plated.
Preferably, the composite copper foil material for preventing warping of the liquid crystal module comprises:
the copper foil 1 is fixedly arranged on the liquid crystal module heating component and used for dissipating heat of the heating component; one end of the copper foil 1, which is far away from the heating component, is symmetrically provided with caulking grooves 2, and the caulking grooves 2 are in a shape of Chinese character 'mi';
the carbon fiber bar 3 is of a structure shaped like a Chinese character 'mi', the carbon fiber bar 3 is embedded into the caulking groove 2 in an interference mode, and the thickness of the carbon fiber bar 3 is the same as the depth of the caulking groove 2;
wherein, the end face of the combination of the carbon fiber rib 3 and the copper foil 1 is plated with a copper plating layer 4;
the branch end part of the caulking groove 2 is not penetrated through the side end of the copper foil 1; in this embodiment, through the above arrangement, the integrity of the copper foil 1 can be ensured, and the copper foil is not easy to bend along the caulking groove in the subsequent use process.
On the other hand, the composite copper foil material is processed and produced by the following steps:
s1, selecting copper foils with certain thickness and uniform thickness according to the liquid crystal modules with different sizes, and carrying out roughness treatment on one side end face of each copper foil according to the pre-calculated roughness value;
s2, milling a plurality of sets of crossed-type caulking grooves on the end face subjected to the roughness treatment in the step S1 by using a high-precision milling machine according to the size of the liquid crystal module, wherein the distances between the adjacent crossed-type caulking grooves are the same;
s3, cleaning the end face, which is milled with the mi-shaped caulking groove in the step S2, and cleaning the inside of the mi-shaped caulking groove;
s4, air-drying the cleaned copper foil at constant temperature, wherein the constant temperature is not higher than 85 ℃;
s5, uniformly coating an insoluble sealant on the end face of the copper foil which is not grooved, and carrying out constant-temperature air drying;
s6, cutting the cleaned copper foil into rectangular plates with corresponding sizes according to the region where each group of the rice-shaped caulking grooves are located;
s7, pressing a prepared carbon fiber rib shaped like a Chinese character 'mi' into the embedded groove shaped like a Chinese character 'mi' on the rectangular plate in an interference manner by using an ultrasonic pressing machine, and enabling the carbon fiber rib shaped like a Chinese character 'mi' to be flush with the surface of the rectangular plate;
s8, connecting the pressed rectangular plate of the S7 with the negative electrode of a direct current power supply by using a lead, completely immersing the rectangular plate in an electroplating pool containing copper sulfate solution, connecting the positive electrode of the direct current power supply with a pure copper block, completely immersing the pure copper block in the copper sulfate solution, starting the direct current power supply, electroplating the end face of the carbon fiber rib in front of the rectangular plate in the shape of the Chinese character 'mi' until the plating layer completely covers the surface of the carbon fiber rib in the shape of the Chinese character 'mi', and forming a flat copper surface;
s9, cleaning the rectangular plate electroplated in the step S8, washing away copper sulfate solution on the surface of the rectangular plate, and then carrying out constant-temperature air drying;
s10, carrying out hot melting degumming on the rectangular plate air-dried in the S9 temperature not higher than 80 ℃ to obtain the composite copper foil after degumming;
in the embodiment, the copper foil is prevented from being heated and deformed by adopting constant-temperature air drying, and the back surface of the copper foil can be prevented from being electroplated by adopting insoluble sealant; and the later electroplating is facilitated through the roughness treatment.
Preferably, in the above technical solution, in S7, a difference between the surface of the carbon fiber rib shaped like a Chinese character 'mi' and the surface of the rectangular plate is less than 0.05 mm.
As the technical scheme is preferable, the concentration of the copper sulfate solution is 2.3-3 mol/L.
Preferably, the wind direction of the S4, S5 and S9 is parallel to the surface of the copper foil during constant-temperature air drying; in the embodiment, the copper foil is less blown to be bent by wind power through the arrangement.
Preferably, the copper sulfate solution is added with a sodium chloride solution, and the concentration of the sodium chloride solution is 1-1.5 mol/L; in the embodiment, the conductivity of the copper sulfate solution is improved by adding the sodium chloride solution.
The installation mode, the connection mode or the arrangement mode of the composite copper foil material for resisting warping of the liquid crystal module are common mechanical modes, and the composite copper foil material can be implemented as long as the beneficial effects of the composite copper foil material can be achieved.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (9)
1. The composite copper foil material for preventing warping of a liquid crystal module is characterized by comprising the following components in percentage by weight:
the copper foil (1) is fixedly arranged on the liquid crystal module heating component and used for dissipating heat of the heating component; one end, far away from the heating component, of the copper foil (1) is symmetrically provided with embedded grooves (2), and the embedded grooves (2) are in a shape like a Chinese character 'mi';
the carbon fiber bar (3) is of a structure shaped like a Chinese character 'mi', the carbon fiber bar (3) is embedded into the embedded groove (2) in an interference manner, and the thickness of the carbon fiber bar (3) is the same as the depth of the embedded groove (2);
and a copper plating layer (4) is plated on the joint end face of the carbon fiber rib (3) and the copper foil (1).
2. The composite copper foil material for liquid crystal module warp resistance as claimed in claim 1, wherein the ratio of the depth of the caulking groove (2) to the thickness of the copper foil (1) is 0.4-0.5.
3. The composite copper foil material for liquid crystal module warp resistance as claimed in claim 1, wherein the copper foil (1) is provided with a caulking groove (2) having an end surface roughness of ra 1.2-1.4.
4. The composite copper foil material for liquid crystal module resistant to warping as claimed in claim 1, wherein the branch end portion of said caulking groove (2) is not penetrated through the side end of the copper foil (1).
5. The composite copper foil material for liquid crystal module warp resistance according to any one of claims 1 to 4, wherein the composite copper foil material is processed and produced by the following steps:
s1, selecting copper foils with certain thickness and uniform thickness according to the liquid crystal modules with different sizes, and carrying out roughness treatment on one side end face of each copper foil according to the pre-calculated roughness value;
s2, milling a plurality of sets of crossed-type caulking grooves on the end face subjected to the roughness treatment in the step S1 by using a high-precision milling machine according to the size of the liquid crystal module, wherein the distances between the adjacent crossed-type caulking grooves are the same;
s3, cleaning the end face, which is milled with the mi-shaped caulking groove in the step S2, and cleaning the inside of the mi-shaped caulking groove;
s4, air-drying the cleaned copper foil at constant temperature, wherein the constant temperature is not higher than 85 ℃;
s5, uniformly coating an insoluble sealant on the end face of the copper foil which is not grooved, and carrying out constant-temperature air drying;
s6, cutting the cleaned copper foil into rectangular plates with corresponding sizes according to the region where each group of the rice-shaped caulking grooves are located;
s7, pressing a prepared carbon fiber rib shaped like a Chinese character 'mi' into the embedded groove shaped like a Chinese character 'mi' on the rectangular plate in an interference manner by using an ultrasonic pressing machine, and enabling the carbon fiber rib shaped like a Chinese character 'mi' to be flush with the surface of the rectangular plate;
s8, connecting the pressed rectangular plate of the S7 with the negative electrode of a direct current power supply by using a lead, completely immersing the rectangular plate in an electroplating pool containing copper sulfate solution, connecting the positive electrode of the direct current power supply with a pure copper block, completely immersing the pure copper block in the copper sulfate solution, starting the direct current power supply, electroplating the end face of the carbon fiber rib in front of the rectangular plate in the shape of the Chinese character 'mi' until the plating layer completely covers the surface of the carbon fiber rib in the shape of the Chinese character 'mi', and forming a flat copper surface;
s9, cleaning the rectangular plate electroplated in the step S8, washing away copper sulfate solution on the surface of the rectangular plate, and then carrying out constant-temperature air drying;
and S10, carrying out hot melting degumming on the rectangular plate air-dried in the S9 temperature, wherein the hot melting temperature is not higher than 80 ℃, and obtaining the composite copper foil after degumming.
6. The composite copper foil material for liquid crystal module anti-warping according to claim 5, wherein in S7, the difference between the surface of the carbon fiber rib shaped like a Chinese character 'mi' and the surface of the rectangular plate is less than 0.05 mm.
7. The composite copper foil material for liquid crystal module anti-warp as claimed in claim 5, wherein the copper sulfate solution concentration is 2.3-3 mol/L.
8. The composite copper foil material for liquid crystal module resistant to warping as claimed in claim 5, wherein the wind direction is parallel to the copper foil surface when said S4, S5 and S9 are air dried at constant temperature.
9. The composite copper foil material for liquid crystal module anti-warp as claimed in claim 5, wherein the copper sulfate solution is added with sodium chloride solution, and the concentration of the sodium chloride solution is 1-1.5 mol/L.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110892940.6A CN113608381A (en) | 2021-08-04 | 2021-08-04 | Composite copper foil material for preventing warping of liquid crystal module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110892940.6A CN113608381A (en) | 2021-08-04 | 2021-08-04 | Composite copper foil material for preventing warping of liquid crystal module |
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| Publication Number | Publication Date |
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| CN113608381A true CN113608381A (en) | 2021-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110892940.6A Withdrawn CN113608381A (en) | 2021-08-04 | 2021-08-04 | Composite copper foil material for preventing warping of liquid crystal module |
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| Country | Link |
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| CN (1) | CN113608381A (en) |
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2021
- 2021-08-04 CN CN202110892940.6A patent/CN113608381A/en not_active Withdrawn
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Application publication date: 20211105 |