CN113607755B - Automatic detection device for wafer - Google Patents
Automatic detection device for wafer Download PDFInfo
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- CN113607755B CN113607755B CN202110989155.2A CN202110989155A CN113607755B CN 113607755 B CN113607755 B CN 113607755B CN 202110989155 A CN202110989155 A CN 202110989155A CN 113607755 B CN113607755 B CN 113607755B
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- 238000001514 detection method Methods 0.000 title claims abstract description 45
- 238000003384 imaging method Methods 0.000 claims abstract description 35
- 238000009434 installation Methods 0.000 claims abstract description 13
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- 238000007689 inspection Methods 0.000 claims description 11
- 238000006073 displacement reaction Methods 0.000 claims description 7
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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Abstract
The automatic wafer detecting device comprises a base assembly, a first detection device and a second detection device, wherein the base assembly comprises a cantilever and a base platform, and the cantilever is arranged on the base platform; the double-camera microscopic imaging unit is arranged on the cantilever in a lifting manner; the XY theta axis moving platform comprises a X, Y axis moving platform arranged on a base platform and a correction platform arranged on the X, Y axis moving platform, the correction platform comprises a module installation base plate fixed on the X, Y axis moving platform, a carrier assembly rotatably arranged on the installation base plate through a rotating assembly and a plurality of XY theta axis guide modules arranged between the carrier assembly and the carrier assembly, each XY theta axis guide module comprises a guide module base plate, an X axis guide module, a Y axis guide module and a rotating module, the guide module base plate is fixed with the installation base plate, the rotating module is fixedly connected with the carrier assembly, and the X axis guide module of one XY theta axis guide module is connected with a driving device to push the carrier assembly to rotate. The device can realize quick and efficient image capturing and improve the detection speed and the detection precision of the wafer.
Description
Technical Field
The invention relates to the technical field of wafer detection devices, in particular to an automatic wafer detection device.
Background
In the early stage, the domestic wafer detection is mostly manually detected by using a microscope, and the manual detection has low efficiency, high misjudgment rate and many foreign matters, so that the method is not suitable for the high-requirement wafer. The high-demand wafer can only be detected by using the full-automatic wafer detection equipment. Early fully automatic wafer inspection equipment was only imported, expensive and long-lived.
The imported full-automatic wafer detection architecture adopts an XY axis platform to drive a wafer to move, uses two sets of microscopic image capturing units to detect and re-judge, and uses a coaxial focusing technology to assist in image capturing.
The currently imported full-automatic wafer detection architecture has the following three disadvantages:
1. the detection platform is not provided with a theta axis, a motion control algorithm is complex, the platform movement smoothness is poor, and the image capturing quality is poor;
2. the coaxial focusing is suitable for static image capturing or low-speed moving image capturing, so that the detection speed is greatly limited;
3. two sets of microscopic image capturing units, one set is used for microscopic detection and the other set is used for repeated image capturing, and the equipment cost is high.
Disclosure of Invention
In order to solve the technical problems of the full-automatic wafer detection architecture in the prior art, the invention provides an automatic wafer detection device for solving the above-mentioned problems in the prior art.
The invention provides an automatic wafer detection device, which comprises:
the base assembly comprises a cantilever and a base platform, wherein the cantilever is arranged on the base platform;
the double-camera microscopic imaging unit is arranged on the cantilever in a lifting manner;
The XY theta axis moving platform comprises two mutually perpendicular X, Y axis moving platforms arranged on a base platform and a correction platform arranged on the X, Y axis moving platform, wherein the correction platform comprises a module installation bottom plate, a plurality of XY theta axis guide modules and a carrier assembly from bottom to top, the module installation bottom plate is fixed on the X, Y axis moving platform, the carrier assembly is rotatably arranged on the installation bottom plate through a rotating assembly, the installation bottom plate is connected with the carrier assembly through the plurality of XY theta axis guide modules uniformly distributed on a circle where a rotating shaft of the carrier assembly is located, the XY theta axis guide modules comprise a guide module bottom plate, an X axis guide module, a Y axis guide module and a rotating module from bottom to top, the guide module bottom plate is fixed with the installation bottom plate, the rotating module is fixedly connected with the carrier assembly, and one X axis guide module of the XY theta axis guide modules is connected with a driving device to push the carrier assembly to rotate.
Preferably, the rotating assembly comprises a crossed roller bearing and a rotating shaft, wherein an outer ring of the crossed roller bearing is fixed with the mounting bottom plate, and two ends of the rotating shaft are respectively connected with an inner ring of the crossed roller bearing and the lower end face of the carrier assembly. By virtue of this arrangement, the stage assembly can be rotatably arranged on the mounting base plate and a space is formed therebetween in which the xyθ -axis guide module can be placed.
Further preferably, the three-dimensional support comprises 3 XY-theta axis guide modules, and the 3 XY-theta axis guide modules are distributed on the mounting base plate and located at three bisectors of a circle where the rotation axis of the carrier assembly is located. By virtue of the arrangement, the rotation of the carrier assembly can be realized more stably.
Preferably, the relation between the relative movement amount δx of the X-axis guide module and the rotation angle δθ of the stage assembly is: δx= Rcos (δθ+θ) -Rcos θ, where R represents a radius of a circle where the xyθ axis guide module is located on the rotation axis of the stage assembly, and θ represents an angle between the radius of the current position and the X axis. The formula can be used for rapidly calculating and obtaining the relative movement amount of the X-axis guide module so as to be convenient for controlling the feeding of the driving device to realize accurate angle rotation.
Preferably, the driving device comprises a motor and a ball screw mechanism, the motor drives the ball screw mechanism, a screw nut of the ball screw mechanism is arranged on the connecting seat, and the connecting seat is fixedly connected with the X-axis guide module. The motor and the ball screw mechanism are utilized to control the movement amount of the X-axis guide module conveniently.
Further preferably, the carrier assembly comprises a rotary shaft mounting plate, a horizontal adjusting mechanism and a vacuum adsorption platform, wherein the rotary shaft mounting plate is rotatably arranged on the mounting base plate through the rotary assembly, and the vacuum adsorption platform is arranged on the rotary shaft mounting plate through a plurality of horizontal adjusting mechanisms. By means of the arrangement, the levelness of the vacuum adsorption platform can be adjusted.
Preferably, the guide module bottom plate is provided with X axle guide portion, is provided with X axle guide track in the X axle guide module corresponds, still is provided with Y axle guide portion on the X axle guide module, corresponds in the Y axle guide module and is provided with Y axle guide track, and rotatory module is the bearing, the inner circle of bearing and the lower terminal surface fixed connection of microscope carrier subassembly, the up end fixed connection of outer lane and Y axle guide module. By means of this arrangement, two degrees of freedom in the X, Y direction of the guide module and an increased degree of freedom in rotation on the basis of this can be achieved.
Preferably, the device further comprises a laser range finder, wherein the laser range finder is arranged in front of the scanning direction of the dual-camera microscopic imaging unit.
Further preferably, the dual-camera microscopic imaging unit is arranged on the cantilever in a lifting manner through a Z-axis height adjustment servo module, the Z-axis height adjustment servo module comprises a module base plate, a servo motor, a guide rail, a screw rod mechanism and a movable plate, the module base plate is fixed on the cantilever, the servo motor is connected with the screw rod mechanism to control Z-axis directional displacement of the movable plate, the dual-camera microscopic imaging unit is fixed on the movable plate, and the laser range finder is arranged on the module base plate. By means of the device, the problem that focusing speed is low and high-speed scanning cannot be achieved is solved, and the microscope always keeps an optimal focusing state in a high-speed moving process, so that a high-quality imaging effect is achieved.
Preferably, the dual-camera microscopic imaging unit comprises an area array color camera, a black-and-white line scanning camera, a spectroscope, a reflector, an objective lens and a lens group main body, wherein the area array color camera and the black-and-white line scanning camera are arranged above the lens group main body at intervals, the spectroscope is arranged below the black-and-white line scanning camera, the reflector is arranged below the area array color camera and is positioned on a reflection path of the spectroscope, so that light entering the lens group main body through the objective lens is divided into two paths, one path passes through the spectroscope to enter the black-and-white line scanning camera, and the other path passes through the spectroscope and the reflector to enter the area array color camera. Compared with two sets of microscopic image capturing units, the device has the advantages that the structure is simplified, the cost is saved, and the image capturing efficiency is improved.
The automatic detection device for the wafer adopts the front laser focusing technology, the double-camera microscopic detection unit and the special theta correction platform, the front laser focusing technology solves the problems that the focusing speed is low and high-speed scanning is impossible, and realizes that the microscope always keeps the optimal focusing state in the high-speed moving process, thereby obtaining the high-quality imaging effect. The correction platform solves the problem that the crystal grain direction of the wafer is inconsistent with the detection direction, and realizes high-rigidity angle correction and zero-jitter detection. The dual-camera microscopic detection unit simplifies a microscope group mechanism, reduces manufacturing cost, improves space utilization rate and improves image capturing efficiency. And finally, the effect of accurate and efficient detection during wafer detection is realized.
Drawings
The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and together with the description serve to explain the principles of the invention. Many of the intended advantages of other embodiments and embodiments will be readily appreciated as they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.
FIG. 1 is a schematic view of an automatic wafer inspection apparatus according to an embodiment of the present invention;
FIG. 2 is a front view of an automatic wafer inspection apparatus according to one embodiment of the present invention;
fig. 3 is a schematic view of the structure of an xyθ -axis moving platform according to a specific embodiment of the present invention;
FIG. 4 is an exploded view of a correction stage according to one embodiment of the present invention;
FIG. 5 is an exploded view of a Z-axis height adjustment servo module according to one embodiment of the present invention;
FIG. 6 is a schematic diagram of the operation of a laser rangefinder in accordance with a specific embodiment of the invention;
Fig. 7 is a schematic diagram of the structure of a dual camera microscopy imaging unit in accordance with a specific embodiment of the application.
Meaning of each number in the figure: 100-base platform, 200-cantilever, 300-XY theta axis moving platform, 400-Z axis height adjustment servo module, 500-biphase microscopic detection unit, 600-laser range finder, 700-alignment camera, 310-X axis moving platform, 320-Y axis moving platform, 330-correction platform, 331-module mounting base plate, 332-stepper motor, 333-ball screw mechanism, 334-XY theta axis guide module, 335-crossed roller bearing, 336-spindle, 337-rotation axis mounting plate, 338-stage horizontal adjustment mechanism, 339-vacuum adsorption platform, 410-module base plate, 420-LM guide rail, 430-servo motor, 440-screw nut seat, 450-moving plate, 510-lens group main body, 520-spectroscope, 530-auxiliary objective lens, 540-reflector, 550-objective lens converter, 560-objective lens, 570-black and white line scanning camera, 580-color area array camera.
Detailed Description
In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. For this, directional terms, such as "top", "bottom", "left", "right", "upper", "lower", and the like, are used with reference to the orientation of the described figures. Because components of embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized or logical changes may be made without departing from the scope of the present invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.
Fig. 1 is a schematic structural view of an automatic wafer inspection apparatus according to an embodiment of the present invention. As shown in fig. 1, the automatic wafer detection device mainly comprises a marble platform 100, a marble cantilever 200, an xyθ -axis moving platform 300, a Z-axis height adjustment servo module 400, a dual-camera microscopic imaging unit 500, a laser range finder 600 and an alignment camera 700, wherein the marble Dan Pingtai and the marble cantilever 200 form a base component of the automatic wafer detection device, the marble cantilever 200 is fixed on the marble platform 100, the marble cantilever 200 can improve the stability of the whole detection device, and the influence of shaking which may exist in the detection process to cause the detection precision is avoided. The XY θ axis moving platform 300 is disposed on the surface of the marble platform 100, the dual-camera microscopic imaging unit 500, the laser rangefinder 600 and the alignment camera 700 are disposed on the Z-axis height adjustment servo module 400, the dual-camera microscopic imaging unit 500 can be lifted along with the height adjustment mechanism on the Z-axis height adjustment servo module 400, and the laser rangefinder 600 and the alignment camera 700 are fixedly connected with the bottom plate of the Z-axis height adjustment servo module 400 and not lifted along with the height adjustment mechanism. In combination with the front view of the automatic wafer inspection device shown in fig. 2, the XY- θ -axis moving platform 300 is disposed below the dual-camera microscopic imaging unit 500, the laser rangefinder 600 and the alignment camera 700, the angles of the wafer and the inspection direction are measured by the alignment camera 700, the wafer direction is consistent with the scanning direction of the dual-camera microscopic imaging unit 500 by using the XY- θ -axis moving platform 300, and the dual-camera microscopic imaging unit 500 is always in the optimal alignment state during the moving process by using the laser rangefinder 600, so that the wafer inspection accuracy is improved.
With continued reference to fig. 3, fig. 3 shows a schematic structural diagram of an xyθ -axis moving platform according to an embodiment of the present invention, as shown in fig. 3, the xyθ -axis moving platform 300 includes an X-axis moving platform 310, a Y-axis moving platform 320, and a correction platform 330, wherein the X-axis moving platform 310 and the Y-axis moving platform 320 are perpendicular to each other, the Y-axis moving platform 320 is disposed on the marble platform 100, the X-axis moving platform 310 is disposed on the Y-axis moving platform 320 and can move along the Y-axis, the correction platform 330 is disposed on the Y-axis moving platform 320 and can move along the X-axis, and the correction platform 330 has a certain rotation angle adjusting space, so as to facilitate adjusting the angle between the wafer and the inspection direction.
Fig. 4 shows an exploded view of a correction stage according to an embodiment of the present invention, as shown in fig. 4, the correction stage 333 includes a module mounting base plate 331, an xyθ axis guide module 334, a driving device including a stepping motor 332 and a ball screw mechanism 333, and a stage assembly including a rotation shaft mounting plate 337, a stage leveling mechanism 338, and a vacuum suction stage 339. The rotary shaft mounting plate 337 of the carrier assembly is rotatably disposed on the module mounting plate 331 around the rotary shaft 336 through a cross roller bearing 335 and the rotary shaft 336, an outer ring of the cross roller bearing 335 is fixed to an upper surface of the module mounting plate 331, a lower end surface of the rotary shaft 336 is locked to an inner ring of the cross roller bearing 335, a space is formed between the rotary shaft mounting plate 337 and the module mounting plate 331 due to a certain height of the cross roller bearing 335 and the rotary shaft 336, the XY-axis guide module 334 is mounted in the space, a bottom thereof is fixedly connected with the module mounting plate 331, a top thereof is connected with the rotary shaft mounting plate 337, the ball screw mechanism 333 of the driving device is connected with the XY-axis guide module 334 for driving the X-axis module in the XY-axis guide module 334 to move, the rotation shaft mounting plate 337 receives an X-axis force in the circumferential direction, the rotation shaft mounting plate 337 rotates under the limitation of the rotation shaft 336, and the xyθ -axis guide module 334 has three degrees of freedom, namely, X-axis, Y-axis and θ, and the top of the XY- θ -axis guide module is rotatably connected with the rotation shaft mounting plate 337, so that when the X-axis is driven to displace, the Y-axis and θ automatically adjust displacement and rotation angle within the rotation radius of the rotation shaft mounting plate 337 where the xyθ -axis guide module 334 is located, so that the rotation shaft mounting plate 337 can smoothly complete rotation, and the process has a very high reduction ratio, thereby endowing the rotation shaft mounting plate 337 (i.e., a carrier assembly) with ultra-high rigidity, effectively avoiding shake in the process, and realizing high-quality wafer detection. In addition, according to the working principle of the stepping motor, under the condition that pulse signals are not input to the stepping motor, the rotor can keep static under the attraction of the stator under the condition that the motor does not exceed the load, so that the correction platform can reach zero shake under the static state.
In a specific embodiment, the plurality of the xyθ -axis guiding modules 334 may be disposed on a circle on which the rotation axis of the rotation axis mounting plate 337 is located, and the radius of the circle is smaller than that of the rotation axis mounting plate 337 so that the xyθ -axis guiding modules 334 can be fixed in the rotation axis mounting plate 337, preferably, the plurality of the xyθ -axis guiding modules 334 are uniformly distributed on the circle in an equally divided manner, and in this embodiment, the 3 xyθ -axis guiding modules 334 are disposed on the circle in an equally divided manner. One of the xyθ -axis guide modules 334 is used as a driving end, and the other xyθ -axis guide modules 334 are used as driven ends, and the displacement or rotation angle of X, Y and θ is automatically adjusted according to the degree of freedom when the rotation shaft mounting plate 337 rotates.
In a specific embodiment, the ball screw mechanism 333 of the driving device is connected to one of the xyθ -axis guiding modules 334 to control the displacement in the X-axis direction, which pushes the xyθ -axis guiding module 334 at the driving end to move in the X-axis direction, thereby giving the rotation mounting plate 337 a thrust in the X-axis direction at the position of the xyθ -axis guiding module 334 and its fixing portion, so that the rotation mounting plate 337 rotates, and the xyθ -axis guiding module 334 has three degrees of freedom including the X-axis, the Y-axis and the θ, so that a rotation track on the radius of the fixing portion can be formed under the limitation of degrees of freedom in two directions X, Y, and then can rotate while being fixed with the rotation mounting plate 337 by the rotatable characteristic in the θ -direction, thereby avoiding the problem of non-rotation caused by the rigid connection.
In a specific embodiment, the xyθ -axis guide module 334 includes a guide module base, an X-axis guide module, a Y-axis guide module and a rotation module from bottom to top, the guide module base is fixed on the rotation shaft mounting plate 337, the upper portion of the guide module base is provided with an X-axis guide portion, the bottom of the X-axis guide module is provided with a guide rail corresponding to the X-axis guide portion, the upper portion is provided with a Y-axis guide portion, the bottom of the Y-axis guide module is provided with a guide rail for the Y-axis guide portion, the rotation module is a bearing, an outer ring of the bearing is fixed with the top of the Y-axis guide module, the inner ring is rotatable relative to the outer ring, and the inner ring is connected with the rotation shaft mounting plate 337. The X-axis guide module, the Y-axis guide module and the rotating module of the XY theta axis guide module have a degree of freedom relation, and the degree of freedom can be adjusted.
In a specific embodiment, the shaft coupling of the stepping motor and the ball screw mechanism drives the screw rod connected with the shaft coupling to rotate, the screw rod is provided with a screw rod nut, the screw rod nut is fixed with the screw rod nut connecting seat, and the whole displacement of the screw rod nut connecting seat can be driven through the rotation of the screw rod. The lead screw nut connecting seat is fixedly connected with the X-axis guide module of the xyθ -axis guide module 334 to drive the X-axis guide module to displace, it should be appreciated that the lead screw nut connecting seat may also be fixedly connected with the Y-axis guide module, and the rotation of the rotation shaft mounting plate 337 may also be achieved by means of two additional degrees of freedom.
In a specific embodiment, the vacuum suction platform 339 and the stage horizontal adjustment mechanism 338 are mounted on the rotating shaft mounting plate 337, and the vacuum suction platform 339 is locked on the support rods of the three stage horizontal adjustment mechanisms 338; when the fine tooth nuts on the carrier horizontal adjusting mechanism 338 are rotated, the fine tooth nuts drive the supporting rods to stretch and retract, and as a plane is determined by three points, the levelness of the vacuum adsorption platform 339 can be adjusted by only rotating the fine tooth nuts of the three carrier horizontal adjusting mechanisms 338. It should be appreciated that the stage leveling mechanism 338 may also be sized to be greater than 3 depending on the size of the vacuum suction platform 339, as well as achieving the technical effects of the present application.
With continued reference to fig. 5, fig. 5 shows an exploded view of a Z-axis height adjustment servo module according to an embodiment of the present invention, and as shown in fig. 5, the Z-axis height adjustment servo module 400 includes a module base 410, LM guides 420, a high resolution servo motor 430, a screw nut mount 440, and a Z-axis moving plate 450, wherein the module base 410 is fixed on a marble cantilever, the high resolution servo motor 430 is connected with a screw, the screw nut mount 440 is engaged with the screw, the Z-axis moving plate 450 is fixed on the screw nut mount 440, and simultaneously, two LM guides provided on the Z-axis moving plate are used as moving guides of the screw nut mount 440, further ensuring stability of movement of the screw nut mount 440, ensuring smooth elevation of the dual-camera microscopy imaging unit, and adjusting a distance of the dual-camera microscopy imaging unit to an xyθ -axis moving platform by driving the servo motor, thereby ensuring precise focusing upon detection.
In a specific embodiment, fig. 6 shows a schematic diagram of the operation of the laser rangefinder according to a specific embodiment of the present invention, as shown in fig. 6, the laser rangefinder 600 is placed in front of the scanning direction of the dual-camera microscopic imaging unit 500 (in a preferred embodiment, at about 50mm in front), and locked on the marble cantilever or on the module bottom plate of the Z-axis height adjustment servo module 400 so as not to follow the elevation of the dual-camera microscopic imaging unit 500, after the wafer is transferred to the correction platform, the X, Y-axis moving platform is driven to move the correction platform, the wafer is moved to the position below the alignment camera 700 (shown in fig. 1), and several pictures are taken on the wafer edge, and the angle delta theta between the wafer and the detection direction is obtained through calculation. After the wafer direction is consistent with the scanning direction of the microscopic imaging unit by controlling the rotation angle delta theta of the correction platform, the X, Y-axis moving platform is driven to move, so that the dual-camera microscopic imaging unit 500 scans the surface of the wafer line by line, and the detection work is started. In the moving process, the laser rangefinder 600 collects the height data of the wafer surface in real time, and a height change curve is drawn in combination with the scanning movement displacement. The height change curve is fed back to the servo motor of the Z-axis height adjustment servo module 400, so that the height of the servo motor is adjusted in real time in the process of taking an image of the dual-camera microscopic imaging unit 500, and the dual-camera microscopic imaging unit 500 is ensured to be always in an optimal focusing state in the high-speed moving process.
In a specific embodiment, the wafer is transferred to the inspection platform, after the alignment camera 700 takes several pictures on the wafer edge, the angle δθ between the wafer and the inspection direction is calculated by a specific algorithm, and the moving amount of the screw nut of the driving device of the xyθ axis guiding module 334 (i.e. the moving amount of the X axis guiding module of the xyθ axis guiding module 334) δx and the rotation angle of the rotation platform conform to the following mathematical relationship: δx= Rcos (δθ+θ) -Rcos θ, where R is the radius of the circle where the xyθ axis guide module is located on the rotation axis of the stage assembly, θ is the angle between the radius of the current position and the X axis, and θ is understood as the sum of the angular position θx of the crossed roller bearing center connected to the X axis and the table angle θ0 before the operation. The relative movement of the X axis, that is, the movement of the screw nut can be obtained by substituting the calculated angle δθ into the above equation. And the relation between the moving amount δx of the screw nut (i.e. the relative moving amount of the X axis) and the number of screw turns n is δx=n×p, where n represents the number of screw turns and p represents the lead of the screw. Therefore, the rotation of the detection platform can be controlled to rotate a specific angle by controlling the rotation ring speed of the stepping motor.
In a specific embodiment, the laser focusing technology solves the problem that the focusing speed is low and high-speed scanning is impossible, and realizes that the dual-camera microscopic imaging unit 500 always maintains an optimal focusing state in the high-speed moving process, so as to obtain a high-quality imaging effect. The laser focusing technology is specifically implemented as follows: 1. the independent threads collect the height and X-axis coordinates, and collect a data point at intervals of 1mm in the X-axis direction; 2. calculating height data corresponding to the current X-axis coordinate point according to the height data information acquired in advance; 3. using the height data of the height data in the worksheet to compare, calculating a height difference value, transmitting the difference value data to a servo motor of the Z-axis height adjustment servo module 400, and executing the difference value height to ensure that the objective lens surface of the dual-camera microscopic imaging unit 500 is always at an optimal distance from the observation surface; under the actual running condition, the focusing precision can reach +/-1 um when the moving speed is 200 mm/s.
Fig. 7 is a schematic diagram illustrating a dual-camera microscopic imaging unit according to an embodiment of the present application, and as shown in fig. 7, the dual-camera microscopic imaging unit 500 includes a lens unit body 510, a beam splitter 520, an auxiliary objective 530, a reflective mirror 540, an objective converter 550, an objective 560, a black-and-white line scanning camera 570 and a color area array camera 580, wherein the black-and-white line scanning camera 570 and the color area array camera 580 are respectively disposed at two collection points above the lens unit body 510, the beam splitter 520 is disposed below the black-and-white line scanning camera 570 inside the lens unit body 510, and the beam splitter 520 can divide the light passing through the objective 560 on the objective converter 550 to the auxiliary objective 530 at the bottom of the lens unit body 510 into two paths, one path passes through the beam splitter 520 to enter the black-and-white line scanning camera 570, and the other path is reflected by the reflective mirror 540 to enter the color area array camera 580. The dual-camera microscopic imaging unit 500 simplifies the microscope group mechanism, reduces manufacturing cost, improves space utilization, and improves image capturing efficiency. Compared with two sets of microscopic imaging units, 1 set of auxiliary objective lenses, an objective lens converter and a plurality of objective lenses are saved, the structure is simplified, the cost is saved, and the image taking efficiency is improved.
Aiming at the problems of poor platform movement smoothness, poor image taking quality, poor platform movement smoothness and suitability for static image taking or low-speed movement image taking in coaxial focusing in the prior art, the application greatly limits the detection speed, two sets of microscopic image taking units, one set of microscopic image taking unit is used for microscopic detection, the other set of microscopic image taking unit is used for complex judgment, and the equipment cost is high, and the problems of slow focusing speed and incapability of high-speed scanning are solved by adopting a front laser focusing technology, a dual-camera microscopic detection unit and a special correction platform by adopting the laser focusing technology, so that the microscope always keeps the optimal focusing state in the high-speed movement process, and further the high-quality imaging effect is obtained; the dual-camera microscopic detection unit simplifies a microscope group mechanism, reduces manufacturing cost, improves space utilization rate and improves image capturing efficiency; the correction platform solves the problem that the crystal grain direction of the wafer is inconsistent with the detection direction, and realizes high-rigidity angle correction and zero-jitter detection.
It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present invention without departing from the spirit and scope of the invention. In this manner, the invention is also intended to cover such modifications and variations as come within the scope of the appended claims and their equivalents. The word "comprising" does not exclude the presence of other elements or steps than those listed in a claim. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims shall not be construed as limiting the scope.
Claims (7)
1. An automatic wafer inspection apparatus, comprising:
A base assembly comprising a cantilever and a base platform, the cantilever disposed on the base platform;
the double-camera microscopic imaging unit is arranged on the cantilever in a lifting manner through the Z-axis height adjustment servo module, and the alignment camera is fixedly arranged on a bottom plate of the Z-axis height adjustment servo module;
The system comprises a base platform, an XY theta axis moving platform and a correction platform, wherein the base platform is provided with two mutually perpendicular X, Y-axis moving platforms and the correction platform is arranged on the X, Y-axis moving platform, the correction platform comprises a module installation bottom plate, a plurality of XY theta axis guide modules and a carrier assembly from bottom to top, the module installation bottom plate is fixed on the X, Y-axis moving platform, the carrier assembly is rotatably arranged on the installation bottom plate through a rotating assembly, the installation bottom plate is connected with the carrier assembly through a plurality of XY theta axis guide modules uniformly distributed on a circle where a rotating shaft of the carrier assembly is positioned, the XY theta axis guide modules comprise a guide module bottom plate, an X axis guide module, a Y axis guide module and a rotating module from bottom to top, the guide module bottom plate is fixed with the installation bottom plate, the rotating module is fixedly connected with the carrier assembly, and one X axis guide module of the XY theta axis guide modules is connected with a driving device so as to push the carrier assembly to rotate; the rotary assembly comprises a crossed roller bearing and a rotating shaft, the outer ring of the crossed roller bearing is fixed with the mounting bottom plate, two ends of the rotating shaft are respectively connected with the inner ring of the crossed roller bearing and the lower end face of the carrier assembly, the driving device comprises a motor and a ball screw mechanism, the motor drives the ball screw mechanism, a screw nut of the ball screw mechanism is arranged on a connecting seat, the connecting seat is fixedly connected with the X-axis guide module, the carrier assembly comprises a rotary shaft mounting plate, a horizontal adjusting mechanism and a vacuum adsorption platform, the rotary shaft mounting plate is rotatably arranged on the mounting bottom plate through the rotary assembly, and the vacuum adsorption platform is arranged on the rotary shaft mounting plate through a plurality of horizontal adjusting mechanisms.
2. The apparatus according to claim 1, comprising 3 xyθ -axis guide modules, the 3 xyθ -axis guide modules being distributed on the mounting base plate at three points of a circle where the axis of rotation of the stage assembly is located.
3. The apparatus according to claim 1, wherein the relation between the relative movement amount δx of the X-axis guide module and the rotation angle δθ of the stage assembly is: δx= Rcos (δθ+θ) -Rcos θ, where R represents a radius of a circle where the XY θ axis guide module is located on the rotation axis of the stage assembly, and θ represents an angle between the radius of the current position and the X axis.
4. The automatic wafer detection device according to claim 1, wherein the guide module bottom plate is provided with an X-axis guide portion, an X-axis guide rail is correspondingly arranged in the X-axis guide module, a Y-axis guide portion is further arranged on the X-axis guide module, a Y-axis guide rail is correspondingly arranged in the Y-axis guide module, the rotating module is a bearing, an inner ring of the bearing is fixedly connected with a lower end face of the carrier assembly, and an outer ring of the bearing is fixedly connected with an upper end face of the Y-axis guide module.
5. The apparatus according to claim 1, further comprising a laser rangefinder disposed in front of the dual camera microscopy imaging unit in a scanning direction.
6. The apparatus according to claim 5, wherein the Z-axis height adjustment servo module comprises a module base plate, a servo motor, a guide rail, a screw mechanism and a moving plate, wherein the module base plate is fixed on the cantilever, the servo motor is connected with the screw mechanism to control the Z-axis displacement of the moving plate, the dual-camera microscopic imaging unit is fixed on the moving plate, and the laser range finder is arranged on the module base plate.
7. The automatic wafer detection device according to claim 1, wherein the dual-camera microscopic imaging unit comprises an area array color camera, a black-and-white line scanning camera, a spectroscope, a reflecting mirror, an objective lens and a lens group main body, wherein the area array color camera and the black-and-white line scanning camera are arranged above the lens group main body at intervals, the spectroscope is arranged below the black-and-white line scanning camera, and the reflecting mirror is arranged below the area array color camera and is positioned on a reflection path of the spectroscope, so that light entering the lens group main body through the objective lens is divided into two paths, one path passes through the spectroscope to enter the black-and-white line scanning camera, and the other path passes through the spectroscope to enter the area array color camera.
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| CN114235840B (en) * | 2021-12-29 | 2024-03-08 | 复旦大学 | Wafer surface defect detection method based on light cutting microscope |
| CN114441555A (en) * | 2022-01-14 | 2022-05-06 | 上海世禹精密机械有限公司 | Automatic solder ball array packaging and ball mounting detection system |
| CN114654394B (en) * | 2022-03-20 | 2022-11-01 | 上海图双精密装备有限公司 | Wafer detection moving carrier mechanism |
| CN117116831A (en) * | 2023-07-26 | 2023-11-24 | 柯尔微电子装备(厦门)有限公司 | Ultrathin correction device for wafer detection and operation method |
| CN117388274B (en) * | 2023-10-24 | 2024-05-24 | 上海感图网络科技有限公司 | Multi-freedom-degree camera detection carrier |
| CN117742083A (en) * | 2023-12-26 | 2024-03-22 | 苏州矽行半导体技术有限公司 | Multi-freedom-degree adjustable wafer focusing system |
| CN117680389B (en) * | 2024-01-25 | 2024-05-03 | 厦门普诚半导体科技有限公司 | Wafer NG selects machine |
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