CN113597130A - Method for cleaning solder resist ink based on ultrasonic waves - Google Patents
Method for cleaning solder resist ink based on ultrasonic waves Download PDFInfo
- Publication number
- CN113597130A CN113597130A CN202110631423.3A CN202110631423A CN113597130A CN 113597130 A CN113597130 A CN 113597130A CN 202110631423 A CN202110631423 A CN 202110631423A CN 113597130 A CN113597130 A CN 113597130A
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- Prior art keywords
- cleaning
- ink
- solder resist
- ultrasonic
- ultrasonic waves
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Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 23
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000002791 soaking Methods 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 7
- 238000011001 backwashing Methods 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000011010 flushing procedure Methods 0.000 claims description 3
- 238000004506 ultrasonic cleaning Methods 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention discloses a method for cleaning solder resist ink based on ultrasonic waves, which is used for back washing the ink in holes in a PCB (printed circuit board) of a plug hole, and used equipment and tools comprise a green oil stripper groove, an ultrasonic sound generator, a high-pressure water gun, a solder resist developing machine and a water tank, wherein the cleaning process comprises the following steps: s1, soaking the plate; s2 primary cleaning; s3, stripping the ink; s4 secondary cleaning; compared with the prior art, (1) the invention can clean the printing ink in the plug hole more thoroughly; (2) the invention adopts the green oil stripping agent and the solder resist developing machine to soak and clean, can identify and flush the ink which is not cleaned, and is convenient for the working personnel to flush the plate more cleanly and thoroughly; (3) the invention utilizes ultrasonic-assisted stripping, and is matched with twice cleaning and one-time cleaning under a solder resist developing machine, so that the printing ink in the hole with the aperture of less than 0.5mm can be cleaned, and the plate is not damaged.
Description
Technical Field
The invention relates to the field of electronic products, in particular to a method for cleaning solder resist ink based on ultrasonic waves.
Background
With the development of electronic products in the directions of light weight, thinness, shortness and smallness, PCBs are also developed in high density and high difficulty, so that a large number of PCBs with SMT and BGA appear, and customers require plugging holes when mounting components, and the holes needing oil plugging all belong to conducting holes. The via hole is added with a conductive hole, and plays a role in connecting and conducting in the circuit board. In order to prevent the short circuit caused by the fact that tin penetrates through the element surface from the conducting hole when the PCB passes through wave soldering, scaling powder is remained in the conducting hole, surface tin paste flows into the hole to cause false soldering and affect mounting, and in order to prevent tin balls from popping out and causing short circuit when the wave soldering is passed, the PCB is subjected to vacuum absorption on a testing machine to form negative pressure after the surface mounting and the element assembly of an electronic factory are completed. This requires the manufacturer to block the vias with ink.
In normal production, the ink needs to be washed back for reprocessing due to poor hole plugging or other poor quality. Currently, conventional methods are used for processing these rework boards. The specific operation method comprises the following steps: soaking the PCB to be washed in special cleaning liquid, taking out the PCB after a period of time, and washing the PCB by using a high-pressure water gun. The treatment method can only remove the ink on the surface of the PCB and the ink in the holes with the diameter of more than 0.5mm, and the holes with the diameter of less than 0.5mm cannot be washed clean, and if the holes are soaked for a longer time, the quality problems such as substrate deformation, substrate texture exposure and the like are easily caused.
Disclosure of Invention
The invention aims to solve the problem that ink on a PCB needing to be washed back is difficult to wash in the prior art, and provides a method for washing solder resist ink based on ultrasonic waves.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method for cleaning solder resist ink based on ultrasonic waves is used for back washing the ink in holes in a PCB (printed Circuit Board) of a plug hole, used equipment and tools comprise a green oil stripper groove, an ultrasonic generator, a high-pressure water gun, a solder resist developing machine and a water tank, and the cleaning process comprises the following steps: s1, soaking the plate; placing the hole-plugging PCB subjected to back washing in a green oil stripper tank provided with an ultrasonic sounder for soaking; s2 primary cleaning; cleaning the soaked plugged plate in a water tank, and flushing residual ink on the plate surface of the plugged plate by using a high-pressure water gun; s3, stripping the ink; resetting the PCB with a clean board surface in a green oil stripping agent groove, and starting ultrasonic vibration to strip residual ink in the hole; s4 secondary cleaning; and cleaning the ink stripped from the S3 by using a high-pressure water gun.
Preferably, the green oil stripper tank comprises a tank body, a plurality of sounders connected with an ultrasonic instrument are mounted at the top of the tank body, and a stripping box is mounted in the tank body; a control panel is arranged on the outer wall of the tank body; and a heating pipe is arranged in the groove body.
Preferably, in the step of S4 secondary cleaning, the cleaned plugged PCB is placed in a solder resist developing machine to wash away residual ink adhered on the board surface.
Preferably, in the step of soaking the board in S1, the soaking time of the PCB is 45 min.
Preferably, in the step of S3 ink peeling, the ultrasonic generator is turned on for 10min, and the direction of the PCB board placed in the peeling box is perpendicular to the direction of the ultrasonic vibrator.
Preferably, when the temperature of the heating pipe is set to 80 ℃, and the solution in the tank body reaches 80 ℃, the timing is started.
Preferably, the temperature of the solution in the tank body is maintained at (80 +/-5) DEG C.
The invention has the beneficial effects that: (1) compared with the prior art, the core technology of the invention is as follows: the printing ink in the PCB is stripped by the green oil stripping agent, the printing ink in the small hole is subjected to shock impact by the ultrasonic principle, the printing ink loosened in the hole is washed and stripped by a high-pressure gun, and finally, the green oil remained in the hole and on the surface is thoroughly cleaned and dried by a resistance welding developing machine, so that the process is simple and rapid, and the printing ink in the plug hole can be more thoroughly cleaned; (2) the invention adopts the green oil stripping agent and the solder resist developing machine to soak and clean, can identify and flush the ink which is not cleaned, and is convenient for the working personnel to flush the plate more cleanly and thoroughly; (3) the invention utilizes ultrasonic-assisted stripping, and is matched with twice cleaning and one-time cleaning under a solder resist developing machine, so that the printing ink in the hole with the aperture of less than 0.5mm can be cleaned, and the plate is not damaged.
Drawings
FIG. 1 is a flow chart of a method of cleaning ink according to the present invention;
FIG. 2 is a view showing the structure of a green oil remover bath according to the present invention.
Reference numbers in the figures: 1 groove body, 2 sounders, 3 stripping boxes, 4 heating pipes and 5 control panels.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to specific embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1 and 2, a method for cleaning solder resist ink based on ultrasonic waves is used for back washing the ink in holes in a Printed Circuit Board (PCB) of a plug hole, and used equipment and tools comprise a green oil stripper groove, an ultrasonic generator, a high-pressure water gun, a solder resist developing machine and a water tank, wherein the cleaning process comprises the following steps: s1, soaking the plate; placing the hole-plugging PCB subjected to back washing in a green oil stripper tank provided with an ultrasonic sounder for soaking; s2 primary cleaning; cleaning the soaked plugged plate in a water tank, and flushing residual ink on the plate surface of the plugged plate by using a high-pressure water gun; s3, stripping the ink; resetting the PCB with a clean board surface in a green oil stripping agent groove, and starting ultrasonic vibration to strip residual ink in the hole; s4 secondary cleaning; and cleaning the ink stripped from the S3 by using a high-pressure water gun.
In this embodiment, the green oil stripper tank comprises a tank body 1, wherein a plurality of sounders 2 connected with an ultrasonic instrument are mounted at the top of the tank body 1, and a stripping box 3 is mounted in the tank body 1; a control panel 5 is arranged on the outer wall of the tank body 1; a heating pipe 4 is arranged in the tank body 1.
In this embodiment, in the step of S4 secondary cleaning, the cleaned receptacle PCB is placed in a solder resist developing machine to wash away residual ink adhering to the board surface.
In the present embodiment, in the step of soaking the board at S1, the soaking time of the PCB is 45 min.
In this embodiment, in the step of S3 ink peeling, the ultrasonic generator is turned on for 10min, and the direction of the PCB board placed in the peeling box 3 is perpendicular to the direction of the ultrasonic vibrator.
In this embodiment, when the temperature of the heating pipe 4 is set to 80 ℃, the timing is started when the solution in the tank body 1 reaches 80 ℃.
In this embodiment, the temperature of the solution in the tank 1 is maintained at (80 ± 5) ° c.
Compared with the prior art, the core technology of the invention is as follows: stripping the printing ink of the PCB by using a green oil stripping agent, vibrating and impacting the printing ink in the small holes by using an ultrasonic principle, washing and stripping the printing ink loosened in the holes by using a high-pressure gun, finally, completely cleaning the residual green oil in the holes and on the surface by using a resistance welding developing machine, and cleaning and drying. The operation by adopting the traditional method not only has longer time, but also can cause scrapping because part of the small holes are not washed completely, and the operation by adopting the technology can continuously shorten the time, improve the efficiency, and also can wash the small holes completely and reduce the scrapping rate.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (7)
1. The utility model provides a method for hinder and weld printing ink based on ultrasonic cleaning for the downthehole printing ink in PCB board that back-washes the consent, its characterized in that, its equipment instrument that uses includes green oil stripper groove, ultrasonic wave sounder, high-pressure squirt, hinders and welds developing machine, basin, and its cleaning process includes following step:
s1, soaking the plate; placing the hole-plugging PCB subjected to back washing in a green oil stripper tank provided with an ultrasonic sounder for soaking;
s2 primary cleaning; cleaning the soaked plugged plate in a water tank, and flushing residual ink on the plate surface of the plugged plate by using a high-pressure water gun;
s3, stripping the ink; resetting the PCB with a clean board surface in a green oil stripping agent groove, and starting ultrasonic vibration to strip residual ink in the hole;
s4 secondary cleaning; and cleaning the ink stripped from the S3 by using a high-pressure water gun.
2. The method for cleaning solder resist ink based on ultrasonic waves is characterized in that the green oil stripper tank comprises a tank body (1), a plurality of sounders (2) connected with an ultrasonic instrument are mounted at the top of the tank body (1), and a stripping box (3) is mounted in the tank body (1); a control panel (5) is arranged on the outer wall of the tank body (1); a heating pipe (4) is arranged in the tank body (1).
3. The method for cleaning solder resist ink based on ultrasonic waves of claim 1, wherein in the step of S4 secondary cleaning, the cleaned plugged PCB board is placed in a solder resist developing machine to wash away residual ink adhered on the board surface.
4. The method for cleaning solder resist ink based on ultrasonic waves of claim 2, wherein in the step of soaking the S1 board, the soaking time of the PCB board is 45 min.
5. The method for cleaning solder resist ink based on ultrasonic waves as claimed in claim 4, wherein in the step of S3 ink peeling, the turn-on time of the ultrasonic wave generator is 10min, and the direction of the PCB placed in the peeling box (3) is perpendicular to the vibrator direction of the ultrasonic waves.
6. The method for cleaning solder resist ink based on ultrasonic waves as claimed in claim 2, characterized in that the temperature of the heating pipe (4) is set to 80 ℃, and the timing is started when the solution in the tank body (1) reaches 80 ℃.
7. The method for cleaning solder resist ink based on ultrasonic waves as claimed in claim 2, wherein the temperature of the solution in the tank body (1) is maintained at (80 ± 5) ° c.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110631423.3A CN113597130A (en) | 2021-06-07 | 2021-06-07 | Method for cleaning solder resist ink based on ultrasonic waves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110631423.3A CN113597130A (en) | 2021-06-07 | 2021-06-07 | Method for cleaning solder resist ink based on ultrasonic waves |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113597130A true CN113597130A (en) | 2021-11-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110631423.3A Pending CN113597130A (en) | 2021-06-07 | 2021-06-07 | Method for cleaning solder resist ink based on ultrasonic waves |
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| Country | Link |
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| CN (1) | CN113597130A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003283111A (en) * | 2002-03-25 | 2003-10-03 | Sumitomo Bakelite Co Ltd | Method for cleaning printed wiring board |
| CN101139474A (en) * | 2007-10-18 | 2008-03-12 | 珠海顺泽电子实业有限公司 | Printed circuit board green paint scavenging agent and method for producing the same |
| CN201500667U (en) * | 2009-08-05 | 2010-06-09 | 天津普林电路股份有限公司 | Sheet-soaking bracket for cleaning solder resistant printing ink on surface of circuit board |
| CN102548230A (en) * | 2012-02-10 | 2012-07-04 | 深圳崇达多层线路板有限公司 | Device and method for ultrasonically rewashing printing ink of hole-plugging plate |
| CN106413276A (en) * | 2016-09-30 | 2017-02-15 | 珠海杰赛科技有限公司 | Method for re-washing solder resist plug hole |
| CN106714466A (en) * | 2015-07-13 | 2017-05-24 | 东莞市斯坦得电子材料有限公司 | Solder-resistor/character ink stripping technology |
| CN206237690U (en) * | 2016-12-14 | 2017-06-09 | 珠海精毅电路有限公司 | A kind of welding resistance for printed wiring board is done over again to move back and washes improved device extremely |
| CN108024451A (en) * | 2017-11-24 | 2018-05-11 | 江门市奔力达电路有限公司 | A kind of pcb board moves back oily technique |
| CN207573731U (en) * | 2017-12-18 | 2018-07-03 | 宏俐（汕头）电子科技有限公司 | The ink of printed circuit board moves back the system of washing |
| CN109462946A (en) * | 2018-12-14 | 2019-03-12 | 江门崇达电路技术有限公司 | A kind of PCB welding resistance returns washing method |
-
2021
- 2021-06-07 CN CN202110631423.3A patent/CN113597130A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003283111A (en) * | 2002-03-25 | 2003-10-03 | Sumitomo Bakelite Co Ltd | Method for cleaning printed wiring board |
| CN101139474A (en) * | 2007-10-18 | 2008-03-12 | 珠海顺泽电子实业有限公司 | Printed circuit board green paint scavenging agent and method for producing the same |
| CN201500667U (en) * | 2009-08-05 | 2010-06-09 | 天津普林电路股份有限公司 | Sheet-soaking bracket for cleaning solder resistant printing ink on surface of circuit board |
| CN102548230A (en) * | 2012-02-10 | 2012-07-04 | 深圳崇达多层线路板有限公司 | Device and method for ultrasonically rewashing printing ink of hole-plugging plate |
| CN106714466A (en) * | 2015-07-13 | 2017-05-24 | 东莞市斯坦得电子材料有限公司 | Solder-resistor/character ink stripping technology |
| CN106413276A (en) * | 2016-09-30 | 2017-02-15 | 珠海杰赛科技有限公司 | Method for re-washing solder resist plug hole |
| CN206237690U (en) * | 2016-12-14 | 2017-06-09 | 珠海精毅电路有限公司 | A kind of welding resistance for printed wiring board is done over again to move back and washes improved device extremely |
| CN108024451A (en) * | 2017-11-24 | 2018-05-11 | 江门市奔力达电路有限公司 | A kind of pcb board moves back oily technique |
| CN207573731U (en) * | 2017-12-18 | 2018-07-03 | 宏俐（汕头）电子科技有限公司 | The ink of printed circuit board moves back the system of washing |
| CN109462946A (en) * | 2018-12-14 | 2019-03-12 | 江门崇达电路技术有限公司 | A kind of PCB welding resistance returns washing method |
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Application publication date: 20211102 |
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| RJ01 | Rejection of invention patent application after publication |