CN113594100A - Refrigeration type packaging structure of miniaturized volume - Google Patents
Refrigeration type packaging structure of miniaturized volume Download PDFInfo
- Publication number
- CN113594100A CN113594100A CN202110716339.1A CN202110716339A CN113594100A CN 113594100 A CN113594100 A CN 113594100A CN 202110716339 A CN202110716339 A CN 202110716339A CN 113594100 A CN113594100 A CN 113594100A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 41
- 238000005057 refrigeration Methods 0.000 title claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 15
- 238000005538 encapsulation Methods 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 12
- 238000013461 design Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 5
- 239000007769 metal material Substances 0.000 description 4
- 238000004378 air conditioning Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a refrigerating type packaging structure with a miniaturized volume, which comprises a packaging base, a packaging cover and a mounting piece, wherein the bottom end of the packaging base is fixedly connected with a radiating assembly, the top end of the packaging base is fixedly connected with the mounting piece, a placing groove is arranged in the mounting piece, the outer wall of the mounting piece is fixedly connected with a pin, the inner wall of the placing groove is fixedly connected with a pin, a chip is arranged in the placing groove and is connected with the pin, and one end, far away from the chip, of the pin is fixedly connected with the pin; the utility model discloses a heat exchanger, including installed part, mounting part top fixedly connected with encapsulation lid, the encapsulation is covered the up end and is located between two parties and offer the first recess that is used for installing first heat-conducting plate, first recess and standing groove intercommunication, the first heat-conducting plate outside and first recess inner wall fixed connection, first heat-conducting plate up end fixedly connected with semiconductor refrigeration piece. The packaging structure has a refrigeration function and can improve the heat dissipation efficiency of the chip.
Description
Technical Field
The invention relates to the technical field of packaging structures, in particular to a refrigerating type packaging structure with a small size.
Background
Packaging is a process of assembling an integrated circuit into a chip final product, in short, an integrated circuit Die (Die) produced by a foundry is placed on a substrate for bearing, pins are led out, and then the integrated circuit Die is fixed and packaged into a whole. As a verb, "package" emphasizes the process and actions of placement, securing, sealing, and wiring; the term "package" mainly focuses on the form and type of package, the materials of the substrate and the housing, and the leads, and emphasizes the important roles of protecting the chip, enhancing the electric heating performance, and facilitating the assembly of the whole machine. The existing packaging structure has the problems of single function and poor heat dissipation effect, so that improvement is needed.
Therefore, a refrigerating type packaging structure with a small size is provided.
Disclosure of Invention
The invention mainly aims to provide a refrigerating type packaging structure with a small size, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the invention adopts the technical scheme that:
a refrigerating type packaging structure with a small size comprises a packaging base, a packaging cover and a mounting piece, wherein a radiating assembly is fixedly connected to the bottom end of the packaging base, the mounting piece is fixedly connected to the top end of the packaging base, a placing groove is formed in the mounting piece, a pin is fixedly connected to the outer wall of the mounting piece, a pin is fixedly connected to the inner wall of the placing groove, a chip is arranged in the placing groove and connected with the pin, and one end, away from the chip, of the pin is fixedly connected with the pin;
the utility model discloses a semiconductor refrigeration piece, including mounting part, mounting part top fixedly connected with encapsulation lid, the encapsulation is covered the up end and is located between two parties and offer the first recess that is used for installing first heat-conducting plate, first recess and standing groove intercommunication, first heat-conducting plate outside and first recess inner wall fixed connection, first heat-conducting plate up end fixedly connected with semiconductor refrigeration piece, fixedly connected with wire on the semiconductor refrigeration piece, semiconductor refrigeration piece can refrigerate, and through the design of first heat-conducting plate, air conditioning can transmit to the standing groove in to cool off the chip, semiconductor refrigeration piece is prior art, and the theory of operation is not repeated here.
Further, radiator unit includes second heat-conducting plate, casing and fin, the casing both ends all have the opening, the second heat-conducting plate passes through bolt and encapsulation base bottom fixed connection, through the design of bolt, and the radiator unit's of being convenient for installation and dismantlement.
Further, terminal surface fixed connection under casing, fin top all and the second heat-conducting plate, the fin is parallel relatively and is equipped with the polylith, the fin is located the casing, and fin, first heat-conducting plate, second heat-conducting plate, first keysets and second keysets are the metal material, and the metal material has the effectual advantage of heat conduction.
Furthermore, a plurality of heat dissipation channels are arranged between every two adjacent heat dissipation fins, and the heat dissipation channels and the heat dissipation fins are arranged at intervals.
Furthermore, a mounting groove is formed in the top end of the packaging base, a substrate is embedded in the mounting groove, and the upper end face of the substrate is fixedly connected with the lower end face of the chip.
Furthermore, the inner wall of the bottom end of the mounting groove is provided with a clamping groove communicated with the mounting groove, a first adapter plate is embedded in the clamping groove, and the upper end face of the first adapter plate is in contact with the lower end face of the substrate.
Furthermore, a second groove used for installing a second adapter plate is formed in the inner wall of the bottom end of the clamping groove, the upper end face of the second adapter plate is in contact with the lower end face of the first adapter plate, and the lower end face of the second adapter plate is in contact with the upper end face of the second heat conducting plate.
Furthermore, the jacks are formed in four corners of the upper end face of the mounting piece, the four corners of the lower end face of the packaging plate are fixedly connected with the insertion rods matched with the jacks, the positions of the packaging covers can be limited through the design of the insertion rods and the slots, and the packaging covers are connected with the mounting piece more tightly.
Compared with the prior art, the invention has the following beneficial effects: the heat on chip and the base plate can be transmitted to the second heat-conducting plate through first keysets and second keysets, in transmitting to the fin and radiating channel through the second heat-conducting plate, the semiconductor refrigeration piece can refrigerate, through the design of first heat-conducting plate, air conditioning can transmit in the standing groove to cool off the chip, use through the cooperation of above-mentioned structure, make this packaging structure possess refrigerated function, can improve the radiating efficiency of chip.
Drawings
Fig. 1 is a schematic structural view of a refrigeration type package structure with a small volume according to the present invention.
Fig. 2 is a perspective view of a mounting member of a refrigeration type package structure with a reduced volume according to the present invention.
Fig. 3 is a schematic diagram of an internal structure of a package base of a refrigeration package structure with a small volume according to the present invention.
Fig. 4 is a perspective view of a heat dissipation assembly of a small-sized refrigeration type package structure according to the present invention.
Fig. 5 is a perspective view of a package base of a refrigeration package structure with a small volume according to the present invention.
In the figure: 1. a package base; 2. a package cover; 3. a mounting member; 4. a pin; 5. a heat dissipating component; 6. a first heat-conducting plate; 7. a first groove; 8. a semiconductor refrigeration sheet; 9. a wire; 10. a jack; 11. a pin; 12. A chip; 13. a placement groove; 14. a substrate; 15. a first transfer plate; 16. a second adapter plate; 17. a bolt; 18. a second heat-conducting plate; 19. a housing; 20. a heat sink; 21. a heat dissipation channel; 22. mounting grooves; 23. A card slot; 24. a second groove.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1-5, a refrigeration type package structure with a miniaturized volume includes a package base 1, a package cover 2 and a mounting member 3, wherein a heat dissipation assembly 5 is fixedly connected to a bottom end of the package base 1, the mounting member 3 is fixedly connected to a top end of the package base 1, a placement groove 13 is arranged inside the mounting member 3, a pin 4 is fixedly connected to an outer wall of the mounting member 3, a pin 11 is fixedly connected to an inner wall of the placement groove 13, a chip 12 is arranged in the placement groove 13, the chip 12 is connected to the pin 11, and one end of the pin 11, far away from the chip 12, is fixedly connected to the pin 4;
3 top fixedly connected with encapsulation of installed part lid 2, encapsulation lid 2 up end department placed in the middle offers first recess 7 that is used for installing first heat-conducting plate 6, first recess 7 and standing groove 13 intercommunication, 6 outside and the 7 inner wall fixed connection of first recess of first heat-conducting plate, 6 up end fixedly connected with semiconductor refrigeration piece 8 of first heat-conducting plate, fixedly connected with wire 9 on the semiconductor refrigeration piece 8, semiconductor refrigeration piece 8 can refrigerate, and through the design of first heat-conducting plate 6, air conditioning can transmit in the standing groove 13 to cool off chip 12, semiconductor refrigeration piece 8 is prior art, and the theory of operation is not repeated here.
Wherein, radiator unit 5 includes second heat-conducting plate 18, casing 19 and fin 20, casing 19 both ends all have the opening, second heat-conducting plate 18 passes through bolt 17 and encapsulation base 1 bottom fixed connection, through the design of bolt 17, the installation and the dismantlement of radiator unit 5 of being convenient for.
The top ends of the shell 19 and the radiating fins 20 are fixedly connected with the lower end face of the second heat conducting plate 18, the radiating fins 20 are arranged in parallel, the radiating fins 20 are located in the shell 19, the radiating fins 20, the first heat conducting plate 6, the second heat conducting plate 18, the first adapter plate 15 and the second adapter plate 16 are made of metal materials, and the metal materials have the advantage of good heat conducting effect.
A plurality of heat dissipation channels 21 are arranged between two adjacent heat dissipation fins 20, and the heat dissipation channels 21 and the heat dissipation fins 20 are arranged at intervals.
The packaging structure comprises a packaging base 1 and a substrate 14, wherein a mounting groove 22 is formed in the top end of the packaging base 1, the substrate 14 is embedded in the mounting groove 22, and the upper end face of the substrate 14 is fixedly connected with the lower end face of the chip 12.
The inner wall of the bottom end of the mounting groove 22 is provided with a clamping groove 23 communicated with the mounting groove 22, a first adapter plate 15 is embedded in the clamping groove 23, and the upper end face of the first adapter plate 15 is in contact with the lower end face of the substrate 14.
A second groove 24 for mounting a second adapter plate 16 is formed in the inner wall of the bottom end of the clamping groove 23, the upper end face of the second adapter plate 16 is in contact with the lower end face of the first adapter plate 15, and the lower end face of the second adapter plate 16 is in contact with the upper end face of the second heat conduction plate 18.
Jack 10 has all been seted up to 3 up end four corners departments of installed part, 2 lower end four corners departments of encapsulation board equal fixedly connected with the inserted bar of jack 10 looks adaptation, through the design of inserted bar and slot 10, can prescribe a limit to the position of encapsulation lid 2, make encapsulation lid 2 be connected inseparabler with installed part 3.
The invention is a refrigeration type packaging structure with a miniaturized volume, firstly, a heat dissipation component 5 is fixedly installed on the lower end face of a packaging base 1 connected with an installation part 3 through a bolt 17, then a chip 12 is installed in the installation part 3, a packaging cover 2 is buckled on the installation part 3, a semiconductor refrigeration piece 8 can refrigerate, through the design of a first heat conduction plate 6, cold air can be transmitted into a placing groove 13, so that the chip 12 is cooled, meanwhile, heat on the chip 12 and a substrate 14 can be transmitted onto a second heat conduction plate 18 through a first adapter plate 15 and a second adapter plate 16, and is transmitted onto a heat dissipation fin 20 and a heat dissipation channel 21 through the second heat conduction plate 18, so that the purpose of dissipating heat of the chip 12 is achieved.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, refer to orientations or positional relationships that are based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships that the products of the present invention are conventionally placed in use, or the orientations or positional relationships that are conventionally understood by those skilled in the art, and are used for convenience in describing and simplifying the description, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, so: all equivalent changes made according to the structure, shape and principle of the invention are covered by the protection scope of the invention.
Claims (8)
1. The refrigerating type packaging structure with the small size comprises a packaging base (1) and is characterized by further comprising a packaging cover (2) and a mounting piece (3), wherein a heat dissipation assembly (5) is fixedly connected to the bottom end of the packaging base (1), the mounting piece (3) is fixedly connected to the top end of the packaging base (1), a placing groove (13) is formed in the mounting piece (3), a pin (4) is fixedly connected to the outer wall of the mounting piece (3), a pin (11) is fixedly connected to the inner wall of the placing groove (13), a chip (12) is arranged in the placing groove (13), the chip (12) is connected with the pin (11), and one end, far away from the chip (12), of the pin (11) is fixedly connected with the pin (4);
mounting part (3) top fixedly connected with encapsulation lid (2), encapsulation lid (2) up end department placed in the middle offers first recess (7) that are used for installing first heat-conducting plate (6), first recess (7) and standing groove (13) intercommunication, first heat-conducting plate (6) outside and first recess (7) inner wall fixed connection, end fixedly connected with semiconductor refrigeration piece (8) on first heat-conducting plate (6), fixedly connected with wire (9) on semiconductor refrigeration piece (8).
2. The refrigeration-type packaging structure of miniaturized volume of claim 1, wherein: the heat dissipation assembly (5) comprises a second heat conduction plate (18), a shell (19) and heat dissipation fins (20), openings are formed in two ends of the shell (19), and the second heat conduction plate (18) is fixedly connected with the bottom end of the packaging base (1) through bolts (17).
3. The refrigeration-type package structure of a miniaturized volume of claim 2, wherein: the top ends of the shell (19) and the radiating fins (20) are fixedly connected with the lower end face of the second heat conducting plate (18), the radiating fins (20) are arranged in parallel relatively, and the radiating fins (20) are located in the shell (19).
4. A reduced volume refrigeration-type package as recited in claim 3, wherein: a plurality of heat dissipation channels (21) are arranged between every two adjacent heat dissipation fins (20), and the heat dissipation channels (21) and the heat dissipation fins (20) are arranged at intervals.
5. The refrigeration-type packaging structure of miniaturized volume of claim 1, wherein: packaging base (1) top has seted up mounting groove (22), it has base plate (14) to inlay in mounting groove (22), terminal surface fixed connection under base plate (14) up end and chip (12).
6. The refrigeration-type package structure of a miniaturized volume of claim 5, wherein: the inner wall of the bottom end of the mounting groove (22) is provided with a clamping groove (23) communicated with the mounting groove (22), a first adapter plate (15) is embedded in the clamping groove (23), and the upper end face of the first adapter plate (15) is in contact with the lower end face of the substrate (14).
7. The refrigeration-type package structure of a miniaturized volume of claim 6, wherein: a second groove (24) used for installing a second adapter plate (16) is formed in the inner wall of the bottom end of the clamping groove (23), the upper end face of the second adapter plate (16) is in contact with the lower end face of the first adapter plate (15), and the lower end face of the second adapter plate (16) is in contact with the upper end face of the second heat conduction plate (18).
8. The refrigeration-type packaging structure of miniaturized volume of claim 1, wherein: jacks (10) are formed in four corners of the upper end face of the mounting piece (3), and inserting rods matched with the jacks (10) are fixedly connected to four corners of the lower end face of the packaging plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110716339.1A CN113594100B (en) | 2021-06-26 | 2021-06-26 | Refrigerating type packaging structure with miniaturized volume |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110716339.1A CN113594100B (en) | 2021-06-26 | 2021-06-26 | Refrigerating type packaging structure with miniaturized volume |
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| Publication Number | Publication Date |
|---|---|
| CN113594100A true CN113594100A (en) | 2021-11-02 |
| CN113594100B CN113594100B (en) | 2024-06-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110716339.1A Active CN113594100B (en) | 2021-06-26 | 2021-06-26 | Refrigerating type packaging structure with miniaturized volume |
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| Country | Link |
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| JP2002083914A (en) * | 2000-09-06 | 2002-03-22 | Sanyo Electric Co Ltd | Electronic circuit cooler |
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| CN111638580A (en) * | 2020-07-26 | 2020-09-08 | 武汉永鼎光通科技有限公司 | High-speed radiating optical module tube structure |
| CN211828825U (en) * | 2020-05-25 | 2020-10-30 | 深圳格来得电子科技有限公司 | Heat dissipation packaged semiconductor |
| CN212343002U (en) * | 2020-11-26 | 2021-01-12 | 江西联创光电科技股份有限公司 | Semiconductor laser packaging structure for improving heat dissipation |
| CN213125053U (en) * | 2020-08-11 | 2021-05-04 | 郑君雄 | Laser chip heat radiation structure |
-
2021
- 2021-06-26 CN CN202110716339.1A patent/CN113594100B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002083914A (en) * | 2000-09-06 | 2002-03-22 | Sanyo Electric Co Ltd | Electronic circuit cooler |
| US20080224303A1 (en) * | 2006-10-18 | 2008-09-18 | Sunao Funakoshi | Power Semiconductor Module |
| CN103617968A (en) * | 2013-12-06 | 2014-03-05 | 中国电子科技集团公司第四十四研究所 | Packaging device of APD focal plane |
| CN109904139A (en) * | 2019-03-08 | 2019-06-18 | 中国科学院微电子研究所 | Large size chip system packaging structure and preparation method thereof with flexible pinboard |
| CN209981203U (en) * | 2019-07-29 | 2020-01-21 | 复汉海志(江苏)科技有限公司 | Chip packaging structure convenient and rapid to radiate |
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| CN111638580A (en) * | 2020-07-26 | 2020-09-08 | 武汉永鼎光通科技有限公司 | High-speed radiating optical module tube structure |
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| CN113594100B (en) | 2024-06-14 |
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