CN113589544B

CN113589544B - Shape memory alloy actuator and method thereof

Info

Publication number: CN113589544B
Application number: CN202111072217.XA
Authority: CN
Inventors: M·A·米勒; D·E·迈尔斯; M·W·戴维斯; N·K·贝宁
Original assignee: Hutchinson Technology Inc
Current assignee: Hutchinson Technology Inc
Priority date: 2017-05-05
Filing date: 2018-05-04
Publication date: 2023-06-16
Anticipated expiration: 2038-05-04
Also published as: GB2577203B; CN113589544A; CN113589545B; CN110709757A; CN113589545A; GB201917208D0; CN110709757B; GB2577203A

Abstract

SMA actuators and related methods are described. One embodiment of the actuator comprises: a base; a plurality of tilt arms; and at least a first shape memory alloy wire coupled with a pair of warp arms of the plurality of warp arms. Another embodiment of an actuator includes a base and at least one piezoelectric bimorph actuator comprising a shape memory alloy material. The piezoelectric bimorph actuator is attached to the base.

Description

Shape memory alloy actuator and method thereof

The present application is a divisional application of the chinese invention patent application with application number 201880029763.5, filed 5/4/2018.

Cross Reference to Related Applications

The present application claims priority from U.S. patent application No. 15/971,995, filed on 5, 4, 2018, and further claims priority from U.S. provisional patent application No. 62/502,568, filed on 5, 2017, and U.S. provisional patent application No. 62/650,991, filed on 30, 3, 2018, the disclosures of which are incorporated herein by reference in their entireties.

Technical Field

Embodiments of the present invention relate to the field of shape memory alloy systems. In particular, embodiments of the present invention relate to the field of shape memory alloy actuators and methods related thereto.

Background

Shape memory alloy ("SMA") systems have a movable component or structure that can be used, for example, in conjunction with a camera lens element to function as an autofocus actuator. These systems may be surrounded by structures such as shields. The movable assembly is supported by a bearing portion such as a plurality of balls to move on the support assembly. A flexure element formed of a metal such as phosphor bronze or stainless steel has a movable plate and respective flexures. The flexure extends between the movable plate and the fixed support assembly and acts as a spring to enable movement of the movable assembly relative to the fixed support assembly. The balls allow the movable assembly to move with little resistance. The movable and support assemblies are coupled by four strip Shape Memory Alloy (SMA) wires extending between the assemblies. One end of each SMA wire is attached to the support assembly and the opposite end is attached to the movable assembly. The suspension is driven by applying an electrical drive signal to the SMA wire. However, these types of systems suffer from system complexity, which results in bulky systems requiring large footprints and large height clearances. In addition, existing systems fail to provide a high-Z range of travel with a compact low-profile footprint.

Disclosure of Invention

SMA actuators and related methods are described. One embodiment of the actuator comprises: a base; a plurality of tilt arms; and at least a first shape memory alloy wire coupled with a pair of warp arms of the plurality of warp arms. Another embodiment of the actuator includes a base and at least one piezoelectric bimorph actuator comprising a shape memory alloy material. The piezoelectric bimorph actuator is attached to a base.

Other features and advantages of embodiments of the present invention will become apparent from the accompanying drawings and the following detailed description.

Drawings

Embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like reference numerals refer to similar elements and in which:

FIG. 1a illustrates a lens assembly including an SMA actuator configured as a warp actuator, according to an embodiment;

FIG. 1b illustrates an SMA actuator according to an embodiment;

FIG. 2 illustrates an SMA actuator according to an embodiment;

FIG. 3 illustrates an exploded view of an autofocus assembly including an SMA wire actuator according to an embodiment;

FIG. 4 illustrates an autofocus assembly including an SMA actuator according to an embodiment;

FIG. 5 illustrates an SMA actuator according to an embodiment that includes a sensor;

FIG. 6 illustrates top and side views of an SMA actuator configured as a warp actuator equipped with a lens carrier according to an embodiment;

FIG. 7 illustrates a side view of a portion of an SMA actuator according to an embodiment;

FIG. 8 illustrates various views of an embodiment of a warp actuator;

FIG. 9 illustrates a piezoelectric bimorph actuator with a lens holder according to an embodiment;

FIG. 10 illustrates a cross-sectional view of an autofocus assembly including an SMA actuator in accordance with an embodiment;

FIGS. 11a-c illustrate views of a piezoelectric bimorph actuator according to some embodiments;

FIG. 12 illustrates a view of an embodiment of a piezoelectric bimorph actuator according to an embodiment;

FIG. 13 illustrates an end pad cross-section of a piezoelectric bimorph actuator according to an embodiment;

FIG. 14 illustrates an intermediate supply pad cross-section of a piezoelectric bimorph actuator according to an embodiment;

FIG. 15 illustrates an exploded view of an SMA actuator including two warp actuators according to an embodiment;

FIG. 16 illustrates an SMA actuator including two warp actuators according to an embodiment;

FIG. 17 illustrates a side view of an SMA actuator that includes two warp actuators according to an embodiment;

FIG. 18 illustrates a side view of an SMA actuator that includes two warp actuators according to an embodiment;

FIG. 19 illustrates an exploded view of an assembly including an SMA actuator that includes two warp actuators, according to an embodiment;

FIG. 20 illustrates an SMA actuator that includes two warp actuators according to an embodiment;

FIG. 21 illustrates an SMA actuator that includes two warp actuators according to an embodiment;

FIG. 22 illustrates an SMA actuator that includes two warp actuators according to an embodiment;

FIG. 23 illustrates an SMA actuator including two warp actuators and a coupler according to an embodiment;

FIG. 24 illustrates an exploded view of an SMA system including an SMA actuator including a warp actuator with a stacked hanger according to an embodiment;

FIG. 25 illustrates an SMA system including an SMA actuator including a warp actuator 2402 with a stacked hanger according to an embodiment;

FIG. 26 illustrates a warp actuator including a stacked hanger according to an embodiment;

FIG. 27 illustrates a stacked hanger of SMA actuators according to an embodiment;

FIG. 28 illustrates a crimped connection formed by a stack of SMA actuators according to an embodiment;

FIG. 29 illustrates an SMA actuator including a warp actuator with a laminate hanger;

FIG. 30 illustrates an exploded view of an SMA system including an SMA actuator including a warp-type actuator, according to an embodiment;

FIG. 31 illustrates an SMA system including an SMA actuator including a warp-type actuator, according to an embodiment;

FIG. 32 illustrates an SMA actuator including a warp type actuator according to an embodiment;

FIG. 33 illustrates a double yoke capture joint of a pair of warp arms of an SMA actuator according to an embodiment;

FIG. 34 illustrates a resistance weld crimp for an SMA actuator for attaching an SMA wire to a warp actuator, according to an embodiment;

FIG. 35 illustrates an SMA actuator including a warp actuator with a double yoke capture joint;

FIG. 36 illustrates an SMA piezoelectric bimorph liquid lens according to an embodiment;

FIG. 37 illustrates an SMA piezoelectric bimorph liquid lens in perspective view according to an embodiment;

FIG. 38 illustrates a cross-sectional view and a bottom view of an SMA piezoelectric bimorph liquid lens according to an embodiment;

FIG. 39 illustrates an SMA system including an SMA actuator with a piezoelectric bimorph actuator according to an embodiment;

FIG. 40 illustrates an SMA actuator having a piezoelectric bimorph actuator according to an embodiment;

FIG. 41 illustrates the length of a wire used to extend an SMA wire beyond the length of a piezoelectric bimorph actuator and the location of bond pads;

FIG. 42 illustrates an exploded view of an SMA system that includes a piezoelectric bimorph actuator according to an embodiment;

FIG. 43 illustrates an exploded view of a sub-portion of an SMA actuator according to an embodiment;

FIG. 44 illustrates a subsection of an SMA actuator according to an embodiment;

FIG. 45 illustrates a five-axis sensor shift system according to an embodiment;

FIG. 46 illustrates an exploded view of a five-axis sensor shift system according to an embodiment;

figure 47 shows an SMA actuator comprising a piezoelectric bimorph actuator integrated into the circuit for all movement, according to an embodiment.

Figure 48 illustrates an SMA actuator comprising a piezoelectric bimorph actuator integrated into the circuit for all movement, according to an embodiment.

FIG. 49 illustrates a cross section of a five-axis sensor shift system in accordance with an embodiment;

FIG. 50 illustrates an SMA actuator comprising a piezoelectric bimorph actuator according to an embodiment;

FIG. 51 illustrates a top view of an SMA actuator that includes a piezoelectric bimorph actuator that moves an image sensor in different x and y positions, according to an embodiment;

FIG. 52 illustrates an SMA actuator comprising a piezoelectric bimorph actuator configured as a cassette piezoelectric bimorph autofocus device according to an embodiment;

FIG. 53 illustrates an SMA actuator that includes a piezoelectric bimorph actuator according to an embodiment;

FIG. 54 illustrates an SMA actuator that includes a piezoelectric bimorph actuator according to an embodiment;

FIG. 55 illustrates an SMA actuator that includes a piezoelectric bimorph actuator according to an embodiment;

FIG. 56 illustrates an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator according to an embodiment;

FIG. 57 illustrates an exploded view of an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator configured as a biaxial lens displacement OIS, according to an embodiment;

FIG. 58 illustrates a cross section of an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator configured as a biaxial lens displacement OIS, according to an embodiment;

FIG. 59 illustrates a cassette piezoelectric bimorph actuator according to an embodiment;

FIG. 60 illustrates an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator according to an embodiment;

FIG. 61 illustrates an exploded view of an SMA system that includes an SMA actuator that includes a piezoelectric bimorph actuator according to an embodiment;

FIG. 62 illustrates a cross-section of an SMA system that includes an SMA actuator that includes a piezoelectric bimorph actuator, according to an embodiment;

FIG. 63 illustrates a cassette piezoelectric bimorph actuator according to an embodiment;

FIG. 64 illustrates an SMA system that includes an SMA actuator that includes a piezoelectric bimorph actuator according to an embodiment;

FIG. 65 illustrates an exploded view of an SMA system that includes an SMA actuator that includes a piezoelectric bimorph actuator according to an embodiment;

FIG. 66 illustrates an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator according to an embodiment;

FIG. 67 illustrates an SMA system that includes an SMA actuator that includes a piezoelectric bimorph actuator according to an embodiment;

FIG. 68 illustrates an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator according to an embodiment;

FIG. 69 illustrates an exploded view of an SMA that includes an SMA actuator that includes a piezoelectric bimorph actuator according to an embodiment;

FIG. 70 illustrates a cross-section of an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator configured as a tri-axial sensor-displaced OIS device, in accordance with an embodiment;

FIG. 71 illustrates a cassette piezoelectric bimorph actuator member according to an embodiment;

FIG. 72 illustrates a flexible sensor circuit for an SMA system according to an embodiment;

FIG. 73 illustrates an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator according to an embodiment;

FIG. 74 illustrates an exploded view of an SMA system that includes an SMA actuator that includes a piezoelectric bimorph actuator, according to an embodiment;

FIG. 75 illustrates a cross-section of an SMA system that includes an SMA actuator, according to an embodiment;

FIG. 76 illustrates a cassette piezoelectric bimorph actuator according to an embodiment;

FIG. 77 illustrates a flexible sensor circuit for an SMA system according to an embodiment;

FIG. 78 illustrates an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator according to an embodiment;

FIG. 79 illustrates an exploded view of an SMA system that includes an SMA actuator that includes a piezoelectric bimorph actuator according to an embodiment;

FIG. 80 illustrates a cross-section of an SMA system including an SMA actuator, according to an embodiment;

FIG. 81 illustrates a cassette piezoelectric bimorph actuator according to an embodiment;

FIG. 82 illustrates a flexible sensor circuit for an SMA system according to an embodiment;

FIG. 83 illustrates an SMA system that includes an SMA actuator that includes a piezoelectric bimorph actuator according to an embodiment;

FIG. 84 illustrates an exploded view of an SMA system including an SMA actuator, according to an embodiment;

FIG. 85 illustrates a cross section of an SMA system that includes an SMA actuator that includes a piezoelectric bimorph actuator, according to an embodiment;

FIG. 86 illustrates a cassette piezoelectric bimorph actuator for an SMA system according to an embodiment;

FIG. 87 illustrates a flexible sensor circuit for an SMA system according to an embodiment; and

fig. 88 illustrates exemplary dimensions of a piezoelectric bimorph actuator of an SMA actuator according to an embodiment.

Detailed Description

Embodiments of SMA actuators are described herein that include a compact footprint and provide a high actuation height, e.g., motion in a positive z-axis direction (z-direction) (referred to herein as z-travel). Embodiments of SMA actuators include SMA warp actuators and SMA piezoelectric bimorph actuators. SMA actuators may be used in a number of applications including, but not limited to, use in lens assemblies as auto-focus actuators, microfluidic pumps, sensor displacements, optical stabilization, optical zoom assemblies to mechanically strike two surfaces to create the vibratory sensations common to haptic feedback sensors and devices, and in other systems using actuators. For example, embodiments of the actuators described herein may be used as haptic feedback actuators for use in cell phones or wearable devices that are configured to provide an alert, notification, warning, touch-area, or button-press response to a user. In addition, more than one SMA actuator may be used in the system to achieve a greater stroke.

For various embodiments, the SMA actuator has a z-travel of greater than 0.4 millimeters. In addition, for the various embodiments, the height of the SMA actuator in the z-direction is 2.2 millimeters or less when the SMA actuator is in its initial non-actuated position. Various embodiments of SMA actuators configured as autofocus actuators in a lens assembly may have a footprint as small as only 3 millimeters greater than the lens inner diameter ("ID"). According to various embodiments, SMA actuators may have a wider footprint in one direction to accommodate components including, but not limited to, sensors, wires, traces, and connectors. According to some embodiments, the footprint of the SMA actuator is 0.5 millimeters longer in one direction, e.g., the SMA actuator is 0.5 millimeters longer than the width.

Fig. 1a illustrates a lens assembly including an SMA actuator configured as a warp-type actuator, according to an embodiment. Fig. 1b illustrates an SMA actuator configured as a warp-type actuator according to an embodiment. The warp actuator 102 is coupled with the base 101. As shown in fig. 1b, the SMA wires 100 are attached to the warp-type actuators 102 such that when the SMA wires 100 are actuated and contracted, this causes the warp-type actuators 102 to warp, which at least causes the middle portion 104 of each warp-type actuator 102 to move in the z-stroke direction, e.g., the positive z-direction, as indicated by arrow 108. According to some embodiments, the SMA wire 100 is actuated when an electrical current is supplied to one end of the wire through a wire holder such as the crimp structure 106. Due to the inherent electrical resistance of the SMA material from which the SMA wire 100 is made, an electrical current flows through the SMA wire 100 and heats it. The other side of the SMA wire 100 has a wire holder, such as a crimp structure 106, that is connected to the SMA wire 100 to complete the electrical circuit to ground. Heating the SMA wire 100 to a sufficient temperature causes the unique material properties to change from martensitic to austenitic crystal structure, which results in a change in length of the wire. Changing the current will change the temperature and thus the length of the wire, which is used to actuate and deactuate the actuator to control at least the movement of the actuator in the z-direction. Those skilled in the art will appreciate that other techniques may be used to provide current to the SMA wire.

Fig. 2 illustrates an SMA actuator configured as an SMA piezoelectric bimorph actuator according to an embodiment. As shown in fig. 2, the SMA actuator comprises a piezoelectric bimorph actuator 202 coupled to a base 204. The piezoelectric bimorph actuator 202 comprises SMA strips. The piezoelectric bimorph actuator 202 is configured to move at least the unsecured end of the piezoelectric bimorph actuator 202 in the z-stroke direction 208 upon contraction of the SMA strip 206.

Fig. 3 illustrates an exploded view of an autofocus assembly including an SMA actuator according to an embodiment. As shown, the SMA actuator 302 is configured as a warp actuator according to embodiments described herein. The autofocus assembly also includes an optical image stabilizer ("OIS") 304, a lens carrier 306 configured to hold one or more optical lenses using techniques including techniques known in the art, a return spring 308, a vertical slide support 310, and a guide cover 312. The lens bracket 306 is configured to slide against the vertical slide bearing 310 as the SMA actuator 302 moves in the z-travel direction (e.g., the positive z-axis direction) when the SMA wire is actuated and pulls and warps the warped SMA actuator 302 using techniques including techniques known in the art. The return spring 308 is configured to apply a force on the lens carrier 306 in a direction opposite the z-travel direction using techniques including those known in the art. According to various embodiments, the return spring 308 is configured to move the lens carrier 306 in a direction opposite the z-travel direction as the tension in the SMA wire decreases as the SMA wire is deactuated. When the tension in the SMA wire decreases to an initial value, the lens holder 306 moves to a minimum height in the z-stroke direction. Fig. 4 illustrates an autofocus assembly including an SMA wire actuator according to the embodiment illustrated in fig. 3.

Fig. 5 shows an SMA wire actuator according to an embodiment comprising a sensor. For various embodiments, the sensor 502 is configured to measure movement of the SMA actuator in the z-direction or movement of a component that the SMA actuator is moving using techniques including those known in the art. The SMA actuators include one or more warp actuators 506 configured to be actuated using one or more SMA wires 508 similar to those described herein. For example, in the autofocus assembly described with reference to fig. 4, the sensor is configured to determine the amount of movement of lens carrier 306 from the initial position along z-direction 504 using techniques including techniques known in the art. According to some embodiments, the sensor is a tunneling magneto-resistive ("TMR") sensor.

Fig. 6 illustrates top and side views of an SMA actuator 602 configured as a warp-type actuator fitted with a lens carrier 604, according to an embodiment. Fig. 7 illustrates a side view of a portion of an SMA actuator 602 according to the embodiment illustrated in fig. 6. According to the embodiment shown in fig. 7, the SMA actuator 602 includes a sliding base 702. According to an embodiment, the slide base 702 is formed from a metal, such as stainless steel, using techniques including those known in the art. However, those skilled in the art will appreciate that other materials may be used to form the slide base 702. Additionally, according to some embodiments, the slide base 702 has a spring arm 612 coupled with the SMA actuator 602. According to various embodiments, spring arm 612 is configured to have two functions. The first function is to help push an object (e.g., lens carrier 604) into the vertical sliding surface of the guide cover. For this example, spring arm 612 preloads lens carrier 604 against the surface to ensure that the lens does not tilt during actuation. For some embodiments, the vertical sliding surface 708 is configured to mate with a guide cover. The second function of the spring arm 612 is to help pull the SMA actuator 602 back downward, e.g., in the negative z-direction, after the SMA wire 608 moves the SMA actuator 602 in the z-travel direction (z-positive direction). Thus, when the SMA wire 608 is actuated, it contracts to move the SMA actuator 602 in the z-stroke direction, and the spring arm 612 is configured to move the SMA actuator 602 in the opposite direction to the z-stroke direction when the SMA wire 608 is deactuated.

The SMA actuator 602 also includes a warp actuator 710. For various embodiments, the warp actuator 710 is formed from a metal such as stainless steel. In addition, the warp actuator 710 includes a warp crank arm 610 and one or more wire holders 606. According to the embodiment shown in fig. 6 and 7, the warp actuator 710 includes four wire holders 606. The four wire holders 606 are each configured to receive an end of the SMA wire 608 and hold the end of the SMA wire 608 such that the SMA wire 608 is secured to the warp actuator 710. For various embodiments, the four wire retainers 606 are crimps configured to clamp onto a portion of the SMA wire 608 to secure the wire to the crimps. Those skilled in the art will appreciate that the SMA wire 608 may be secured to the wire holder 606 using techniques known in the art, including but not limited to: adhesive, welding and mechanical fixing. A smart memory alloy ("SMA") wire 608 extends between the pair of wire holders 606 such that the warp arms 610 of the warp actuator 710 are configured to move when the SMA wire 608 is actuated, which causes the pair of wire holders 606 to be drawn closer to one another. According to various embodiments, when current is applied to the SMA wire 608, the SMA wire 608 is electrically actuated to move the warp arm 610 and control the position of the warp arm 610. When the current is removed or the current is below a threshold, the SMA wire 608 is deactuated. This moves the pair of wire retainers 606 away from each other and the warp arms 610 move in the opposite direction as when the SMA wire 608 is actuated. According to various embodiments, the warp arm 610 is configured to have an initial angle of 5 degrees relative to the slide base 702 when the SMA wire is deactuated in its initial position. Also, according to various embodiments, the warp arm 610 is configured to have an angle of 10 to 12 degrees relative to the slide base 702 at full travel or when the SMA wire is fully actuated.

According to the embodiment shown in fig. 6 and 7, the SMA actuator 602 further comprises a sliding support 706 configured between the sliding base 702 and the wire holder 606. The slide bearing 706 is configured to minimize any friction between the slide base 702 and the warp arm 610 and/or wire retainer 606. For some embodiments, the sliding support is fixed to the sliding bearing 706. According to various embodiments, the slide bearing is formed from polyoxymethylene ("POM"). Those skilled in the art will appreciate that other structures may be used to reduce any friction between the warp-type actuator and the base.

According to various embodiments, the slide base 702 is configured to couple with a component base 704, such as an autofocus base for an autofocus component. According to some embodiments, the actuator base 704 includes etched bond pads. Such etched pads may be used to provide clearance for wires and crimps when the SMA actuator 602 is part of an assembly such as an auto focus assembly.

Fig. 8 illustrates various views of an embodiment of a warp actuator 802 relative to the x-axis, y-axis, and z-axis. As oriented in fig. 8, the warp arm 804 is configured to move along the z-axis when the SMA wire is actuated and deactuated as described herein. According to the embodiment shown in fig. 8, the warp arms 804 are coupled to each other by a middle portion, such as a hanger (hammock) portion 806. According to various embodiments, the hanger portion 806 is configured to rest on a portion of an object acted upon by the warp actuator to provide support thereto, such as a lens carrier moved by the warp actuator using techniques including those described herein. According to some embodiments, the hanger portion 806 is configured to provide lateral rigidity to the warp actuator during actuation. For other embodiments, the warp actuator does not include a hanger portion 806. According to these embodiments, the tilt arm is configured to act on the object to move it. For example, the tilt arms are configured to act directly on features of the lens carrier to push it upwards.

Fig. 9 illustrates an SMA actuator configured as an SMA piezoelectric bimorph actuator according to an embodiment. SMA piezoelectric bimorph actuators include piezoelectric bimorph actuator 902, which includes those described herein. According to the embodiment shown in fig. 9, one end 906 of each of the piezoelectric bimorph actuators 902 is secured to a base 908. According to some embodiments, the end 906 is welded to the base 908. However, one skilled in the art will appreciate that other techniques may be used to secure the end 906 to the base 908. Fig. 9 also shows a lens carrier 904 arranged such that the piezoelectric bimorph actuator 902 is configured to curl in the z-direction and lift the carrier 904 in the z-direction when actuated. For some embodiments, a return spring is used to push the piezoelectric bimorph actuator 902 back to the initial position. The return spring may be configured as described herein to help push the piezoelectric bimorph actuator downward to its initial, deactuated position. Because of the small footprint of piezoelectric bimorph actuators, SMA actuators can be fabricated with smaller footprints than existing actuator technology.

Fig. 10 illustrates a cross-sectional view of an autofocus assembly including an SMA actuator that includes a position sensor, such as a TMR sensor, according to an embodiment. Autofocus assembly 1002 includes a position sensor 1004 attached to a movable spring 1006, and a magnet 1008 attached to a lens carrier 1010 of an autofocus assembly that includes SMA actuators, such as those described herein. The position sensor 1004 is configured to determine the amount of movement of the lens carrier 1010 from the initial position in the z-direction 1005 based on the distance of the magnet 1008 from the position sensor 1004 using techniques including techniques known in the art. According to some embodiments, the position sensor 1004 is electrically coupled to a controller or processor (e.g., a central processing unit) using a plurality of electrical traces on a spring arm of the movable spring 1006 of the optical stabilization assembly.

Fig. 11a-c illustrate views of a piezoelectric bimorph actuator according to some embodiments. According to various embodiments, the piezoelectric bimorph actuator 1102 includes a beam 1104 and one or more SMA materials 1106, such as SMA strips 1106b (e.g., as shown in the perspective view of the piezoelectric bimorph actuator including SMA strips according to the embodiment of fig. 11 b) or SMA wires 1106a (e.g., as shown in the cross-section of the piezoelectric bimorph actuator including SMA wires according to the embodiment of fig. 11 a). The SMA material 1106 is secured to the beam 1104 using techniques including those described herein. According to some embodiments, the SMA material 1106 is fixed to the beam 1104 using an adhesive film material 1108. For various embodiments, the ends of the SMA material 1106 are electrically and mechanically coupled to contacts 1110, the contacts 1110 being configured to supply electrical current to the SMA material 1106 using techniques including techniques known in the art. According to various embodiments, contacts 1110 (e.g., as shown in fig. 11a and 11 b) are gold plated copper pads. According to an embodiment, a piezoelectric bimorph actuator 1102 of approximately 1 mm in length is configured to produce a large stroke, and a 50 millinewton ("mN") thrust is used as part of the lens assembly, for example as shown in fig. 11 c. According to some embodiments, using a piezoelectric bimorph actuator 1102 that is longer than 1 millimeter will produce more travel and less force than a piezoelectric bimorph actuator 1102 that is 1 millimeter in length. For an embodiment, piezoelectric bimorph actuator 1102 includes 20 microns thick SMA material 1106, 20 microns thick insulator (e.g., polyimide insulator) 1112, and 30 microns thick stainless steel beam 1104 or base metal (base metal). Various embodiments include a second insulator 1114 disposed between a contact layer including contacts 1110 and the SMA material 1106. According to some embodiments, the second insulator 1114 is configured to insulate the SMA material 1106 from portions of the contact layer not used as contacts 1110. For some embodiments, the second insulator 1114 is a cover layer, such as a polyimide insulator. Those skilled in the art will appreciate that other dimensions and materials may be used to meet the desired design characteristics.

Fig. 12 shows a view of an embodiment of a piezoelectric bimorph actuator according to an embodiment. The embodiment shown in fig. 12 includes an intermediate feed 1204 for applying power. Power is supplied at the center of SMA material 1202 (wire or ribbon), such as the SMA material described herein. The ends of the SMA material 1202 are grounded to the beam 1206 or base metal at end pads 1203 to act as return paths. The end pads 1203 are electrically isolated from the rest of the contact layer 1214. According to an embodiment, the beam 1206 or base metal is in close proximity to the SMA material 1202 (e.g., SMA wire) along the entire length of the SMA material 1202, providing more rapid cooling of the wire when the current is turned off (i.e., the piezoelectric bimorph actuator is deactuated). As a result, the wire deactuates and the actuator response time are faster. The heat distribution of the SMA wire or ribbon is improved. For example, the heat distribution is more uniform, so that a higher total current can be reliably transferred to the wire. Without uniform heat dissipation, certain portions of the wire (e.g., the middle region) may overheat and fail, thus requiring reduced current and reduced movement to operate reliably. The middle feeding portion 1204 has the following advantages: the SMA material 1202 has faster wire activation/actuation (faster heating) and reduced power consumption (lower resistance path length) and thus faster response time. This allows for faster actuator action and the ability to operate at higher frequencies of motion.

As shown in fig. 12, the beam 1206 includes an intermediate metal 1208 that is isolated from the rest of the beam 1206 to form an intermediate feed 1204. Insulators 1210, such as those described herein, are disposed on the beam 1206. The insulator 1210 is configured with one or more openings or vias 1212 to provide electrical access to the beam 1206, for example, to couple the ground section 1214b of the contact layer, and to provide contact to the intermediate metal 1208 to form the intermediate feed 1204. According to some embodiments, the contact layer 1214, such as those described herein, includes a power section 1214a and a ground section 1214b to provide actuation/control signals to the piezoelectric bimorph actuator via the power supply contacts 1216 and the ground connector 1218. The cover layers 1220, such as those described herein, are disposed on the contact layers 1214 to electrically isolate the contact layers, except at portions (e.g., one or more contacts) of the contact layers 1214 that require electrical coupling.

Fig. 13 shows an end pad cross section of a piezoelectric bimorph actuator according to the embodiment shown in fig. 12. As described above, the end pad 1203 is electrically isolated from the rest of the contact layer 1214 by means of a gap 1222 formed between the end pad 1203 and the contact layer 1214. According to some embodiments of the invention, the gap is formed using etching techniques including those known in the art. The end pad 1203 includes a via section 1224 configured to electrically couple the end pad 1203 with the beam 1206. The via section 1224 is formed in the via 1212, and the via 1212 is formed in the insulator 1210. The SMA material 1202 is electrically coupled to the end pads 1213. The SMA material 1202 may be electrically coupled to the end pads 1213 using techniques including, but not limited to, brazing, resistance welding, laser welding, and direct plating.

Fig. 14 shows a cross section of the medial feed portion of the piezoelectric bimorph actuator according to the embodiment shown in fig. 12. The intermediate feed 1204 is electrically coupled to a power source by the shrink layer 1214 and is electrically and thermally coupled to the intermediate metal 1208 by means of a via section 1226 in the intermediate feed 1204 formed in a via 1212, wherein the via 1212 is formed in the insulator 1210.

The actuators described herein may be used to form actuator assemblies using multiple warp actuators and/or multiple piezoelectric bimorph actuators. According to an embodiment, the actuators can be stacked one on top of the other to increase the stroke distance that can be achieved.

Fig. 15 illustrates an exploded view of an SMA actuator including two warp-type actuators according to an embodiment. According to embodiments described herein, the two

warp actuators

1302, 1304 are arranged relative to each other to oppose each other using their actions. For various embodiments, the two

warp actuators

1302, 1304 are configured to move in opposite relation to each other to position the lens carrier 1306. For example, the first warp actuator 1302 is configured to receive a power signal that is opposite to the power signal sent to the second warp actuator 1304.

Fig. 16 illustrates an SMA actuator comprising two warp-type actuators according to an embodiment. The

warp actuators

1302, 1304 are configured such that the warp arms 1310, 1312 of each

warp actuator

1302, 1304 face each other, and the

slide base

1314, 1316 of each

warp actuator

1302, 1304 is an outer surface of two warp actuators. According to various embodiments, the hanger portion 1308 of each

SMA actuator

1302, 1304 is configured to rest on a portion of an object on which one or

more warp actuators

1302, 1304 acts to provide support thereto, such as a lens carrier 1306 moved by the warp actuator using techniques including those described herein.

Fig. 17 illustrates a side view of an SMA actuator including two warp actuators, showing the direction of SMA wire 1318 that causes an object such as a lens holder to move in the positive z-direction or in an upward direction, according to an embodiment.

Fig. 18 illustrates a side view of an SMA actuator including two warp actuators, showing the direction of SMA wire 1318 that causes an object such as a lens holder to move in the negative z-direction or downward, according to an embodiment.

Figure 19 illustrates an exploded view of an assembly including an SMA actuator including two warp actuators according to an embodiment. The

warp actuators

1902, 1904 are configured such that the warp arms 1910, 1912 of each

warp actuator

1902, 1904 are the outer surfaces of two warp actuators and the sliding

bases

1914, 1916 of each

warp actuator

1902, 1904 face each other. According to various embodiments, the hanger portion 1908 of each

SMA actuator

1902, 1904 is configured to rest on a portion of an object acted upon by one or

more warp actuators

1902, 1904 to provide support thereto, such as a lens bracket 1906 moved by the warp actuator using techniques including those described herein. For some embodiments, the SMA actuator includes a base portion 1918 configured to receive the second warp actuator 1904. The SMA actuator may also include a cover portion 1920. Fig. 20 illustrates an SMA actuator comprising two warp-type actuators comprising a base part and a cover part according to an embodiment.

Fig. 21 illustrates an SMA actuator comprising two warp-type actuators according to an embodiment. For some embodiments, the

warp actuators

1902, 1904 are arranged relative to one another such that the hanger portion 1908 of the first warp actuator 1902 is rotated about 90 degrees relative to the hanger portion of the second warp actuator 1904. The 90 degree configuration allows pitch and roll rotation of an object such as lens carrier 1906. This provides better control of the movement of the lens carrier 1906. For the various embodiments, a differential power signal is applied to the SMA wires of each warp actuator pair, which provides pitch and roll rotations of the lens carrier, thereby achieving a tilt OIS action.

Embodiments of SMA actuators that include two warp actuators eliminate the need to provide a return spring. The use of two warp actuators can improve/reduce hysteresis when using SMA wire resistance for position feedback. The reaction force SMA actuator comprising two warp actuators contributes to a more accurate position control due to the lower hysteresis than those comprising a return spring. For certain embodiments, such as the embodiment shown in fig. 22, SMA actuators comprising two

warp actuators

2202, 2204 use differential power to provide two-axis tilting to the left and right SMA wires 2218a, 2218b of each

warp actuator

2202, 2204. For example, the left SMA wire 2218a is actuated at a higher power than the right SMA wire 2218 b. This causes the left side of the lens holder 2206 to move downward and the right side to move upward (tilt). For some embodiments, the SMA wires of the first warp actuator 2202 are held at equal power to act as a fulcrum that urges the SMA wires 2218a, 2218b differentially against to cause the tilting action. Reversing the power signal applied to the SMA wires, for example, applying equal power to the SMA wires of the second warp actuator 2202, and applying differential power to the left and right SMA wires 2218a, 2218b of the second warp actuator 2204, causes the lens carrier 2206 to tilt in the other direction. This provides the ability to tilt an object (e.g. a lens holder) along either axis of motion, or any tilt between the lens and the sensor can be adjusted to achieve good dynamic tilt, thus achieving better image quality across all pixels.

Fig. 23 illustrates an SMA actuator including two warp-type actuators and a coupler according to an embodiment. SMA actuators include two warp-type actuators, such as those described herein. The first warp-type actuator 2302 is configured to couple with the second warp-type actuator 2304 using a coupling such as a coupling ring 2305. The

warp actuators

2302, 2304 are arranged relative to each other such that the hanger portion 2308 of the first warp actuator 2302 is rotated approximately 90 degrees relative to the hanger portion 2309 of the second warp actuator 2304. A payload for movement (e.g., a lens or lens assembly) is attached to a lens carrier 2306 that is configured to be disposed on a sliding base of the first warp actuator 2302.

For various embodiments, equal power may be applied to the SMA wires of the first and

second warp actuators

2302, 2304. This may result in maximizing the z-travel of the SMA actuator in the positive z-direction. For some embodiments, the stroke of the SMA actuator may have a z-stroke equal to or greater than twice the stroke of the other SMA actuators including the two warp actuators. For some embodiments, additional springs may be added to urge the two warp members against when the power signal is removed from the SMA actuator, thereby helping to push the actuator assembly and payload back down. Equal and opposite power signals may be applied to the SMA wires of the first and

second warp actuators

2302, 2304. This enables the SMA actuator to move in the positive z-direction by the warp-type actuator and in the negative z-direction by the warp-type actuator, which enables the position of the SMA actuator to be precisely controlled. In addition, equal and opposite power signals (differential power signals) may be applied to the left and right SMA wires of the first and

second warp actuators

2302, 2304 to tilt an object such as the lens carrier 2306 in the direction of at least one of the two axes.

An embodiment of an SMA actuator that includes two warp-type actuators and a coupler, such as shown in fig. 23, may be coupled with additional warp-type actuators and pairs of warp-type actuators to achieve a greater desired travel than a single SMA actuator.

Fig. 24 illustrates an exploded view of an SMA system including an SMA actuator comprising a warp actuator with a stacked hanger according to an embodiment. As described herein, for some embodiments, the SMA system is configured to be used in conjunction with one or more camera lens elements as an autofocus driver. As shown in fig. 24, the SMA system includes a return spring 2403, which return spring 2403 is configured to move the lens carrier 2406 in a direction opposite to the z-stroke direction as the tension in the SMA wire 2408 decreases as the SMA wire deactuates, according to various embodiments. For some embodiments, the SMA system includes a housing 2409 configured to receive a return spring 2403 and act as a sliding support to guide the lens carrier in the z-travel direction. The housing 2409 is also configured to be disposed on the warp actuator 2402. The warp actuator 2402 includes a slide base 2401, similar to those described herein. The warp actuator 2402 includes a warp arm 2404 coupled to a hanger portion, such as a laminate hanger 2406 formed from a laminate. The warp actuator 2402 also includes SMA wire attachment structures, such as crimp connections 2412 formed in a stack.

As shown in fig. 24, the slide base 2401 is disposed on an optional adapter plate 2414. The adapter plate is configured to mate the SMA system or warp actuator 2402 with other systems, such as OIS, additional SMA systems, or other components. Fig. 25 illustrates an SMA system 2501 including an SMA actuator comprising a warp actuator 2402 with a strap hanger according to an embodiment.

Fig. 26 illustrates a warp actuator including a stacked hanger according to an embodiment. The warp actuator 2402 includes a warp arm 2404. The warp arms 2404 are configured to move along the z-axis when the SMA wire 2412 is actuated and deactuated as described herein. The SMA wires 2408 are attached to the warp actuator using crimp connections 2412 formed in a stack. According to the embodiment shown in fig. 26, warp arms 2404 are coupled to each other by intermediate portions such as lamination hangers 2406. According to various embodiments, the stacking crane 2406 is configured to rest on a portion of an object acted upon by a warp actuator to provide support thereto, such as a lens carrier moved by a warp actuator using techniques including those described herein.

Fig. 27 shows a stacked hanger of SMA actuators according to an embodiment. For some embodiments, the stacked hanger 2406 material is a low stiffness material such that it does not resist actuation actions. For example, the stacked hanger 2406 is formed using a copper layer provided over a first polyimide layer and a second polyimide layer provided over the copper. For some embodiments, the stacked hanger 2406 is formed on the warp arm 2404 using deposition and etching techniques including those known in the art. For other embodiments, the lamination hanger 2406 is formed separately from the warp arms 2404 and attached to the warp arms 2404 using techniques including welding, adhesives, and other techniques known in the art. For various embodiments, glue or other adhesive is used on the stacking crane 2406 to ensure that the lift arms 2404 remain in place relative to the lens carrier.

Figure 28 illustrates a crimped connection formed by a stack of SMA actuators according to an embodiment. The lamination crimp connection 2412 is configured to attach the SMA wire 2408 to the warp actuator and form a circuit joint with the SMA wire 2408. For various embodiments, the crimp connection 2412 formed of a laminate includes a laminate formed of one or more layers of insulator and one or more conductive layers formed on the crimp.

For example, a polyimide layer is disposed on at least a portion of the stainless steel portion to form the crimp 2413. Subsequently, a conductive layer, such as copper, is disposed on the polyimide layer, which is electrically coupled with one or more signal traces 2415 disposed on the warp actuator. The crimp is deformed to bring it into contact with the SMA wire therein and also to bring the SMA wire into electrical contact with the conductive layer. Thus, the conductive layer coupled with the signal trace(s) is used to apply a power signal to the SMA wire using techniques including those described herein. For some embodiments, the second polyimide layer is formed on the conductive layer in areas where the conductive layer will not contact the SMA wire. For some embodiments, the lap formed crimp connection 2412 is formed on the crimp 2413 using deposition and etching techniques including those known in the art. For other embodiments, the lap-formed crimp connection 2412 and one or more electrical traces are formed separately from the crimp 2413 and the warp actuator and attached to the crimp 2412 and the warp actuator using techniques including welding, adhesives, and other techniques known in the art.

Fig. 29 shows an SMA actuator with a stacked hanger warp actuator. As shown in fig. 29, when a power signal is applied, the SMA wire contracts or shortens to move the warp arm and the lamination hanger in the positive z-direction. The stacked gantry in contact with the object in turn moves the object (e.g., lens holder) in the positive z-axis direction. When the power signal is reduced or removed, the SMA wire lengthens and moves the warp arm and the lamination hanger in the negative z-direction.

Figure 30 illustrates an exploded view of an SMA system including an SMA actuator including a warp-type actuator according to an embodiment. As described herein, for some embodiments, the SMA system is configured for use in conjunction with one or more camera lens elements to function as an autofocus driver. As shown in fig. 30, the SMA system includes a return spring 3003, which return spring 3003 is configured to move the lens carrier 3005 in a direction opposite the z-stroke direction when tension in the SMA wire 3008 decreases as the SMA wire deactuates, according to various embodiments. For some embodiments, the SMA system includes a stiffener 3000 disposed on the return spring 3003. For some embodiments, the SMA system includes a housing 3009 formed from two portions configured to receive the return spring 3003 and function as a sliding support to guide the lens carrier in the z-travel direction. The housing 3009 is also configured to be disposed on the warp actuator 3002. The warp actuator 3002 includes a slide base 3001, similar to that described herein, formed of two portions. The slide base 3001 is split to electrically isolate the two sides (e.g., one side to ground and the other side to a power source) because, according to some embodiments, current flows to the wire through portions of the slide base 3001.

The warp actuator 3002 includes a warp arm 3004. Each pair of warp-type actuators 3002 is formed on a separate portion of the warp-type actuators 3002. The warp actuator 3002 also includes SMA wire attachment structures, such as resistance wire crimp 3012. The SMA system optionally includes a flexible circuit 3020 for electrically coupling the SMA wire 3008 to one or more control circuits.

As shown in fig. 30, the slide base 3001 is disposed on an optional adapter plate 3014. The adapter plate is configured to mate the SMA system or warp actuator 3002 with other systems, such as OIS, additional SMA systems, or other components. Fig. 31 illustrates an SMA system 3101 including SMA actuators including a warp-type actuator 3002 according to an embodiment.

Figure 32 includes an SMA actuator according to an embodiment that includes a warp-type actuator. The warp actuator 3002 includes a warp arm 3004. The warp arm 3004 is configured to move along the z-axis when the SMA wire 3012 is actuated and deactuated as described herein. SMA wire 2408 is attached to a resistance wire crimp 3012. According to the embodiment shown in fig. 32, the warp arm 3004 is configured to mate with an object (e.g., a lens holder) without using a double yoke to capture the middle portion of the joint.

Fig. 33 illustrates a double yoke capture joint of a pair of warp arms of an SMA actuator according to an embodiment. Fig. 33 also shows plating pads for attaching an optional flex circuit to the slide base. For some embodiments, the plating pad is formed using gold. Fig. 34 illustrates a resistance weld crimp for an SMA actuator that is used to attach an SMA wire to a warp actuator according to an embodiment. For some embodiments, glue or adhesive may also be disposed on top of the weld to aid mechanical strength and to act to relieve fatigue strain during handling and impact loading.

Fig. 35 shows an SMA actuator comprising a warp-type actuator with a double-yoke trap joint. As shown in fig. 35, when a power signal is applied, the SMA wire contracts or shortens to move the warp arm in the positive z-direction. The double yoke capture joint is in contact with the object, thereby moving the object (e.g., lens holder) in the positive Z-direction. When the power signal is reduced or removed, the SMA wire will elongate and cause the warp arm to move in the negative z-direction. The yoke capture feature enables the warp arm to be held in place relative to the lens carrier.

Fig. 36 illustrates an SMA piezoelectric bimorph liquid lens according to an embodiment. The SMA piezoelectric bimorph liquid lens 3501 includes a liquid lens sub-assembly 3502, a housing 3504, and an electrical circuit having an SMA actuator 3506. For various embodiments, the SMA actuator comprises four piezoelectric bimorph actuators 3508, such as the embodiments described herein. The piezoelectric bimorph actuator 3508 is configured to push against the shaped blank 3510 on the flexible membrane 3512. The loop bends the membrane 3512/liquid 3514 to assume a shape (warp) to alter the optical path through the membrane 3512/liquid 3514. The liquid containing ring 3516 is used to contain the liquid 3514 between the membrane 3512 and the lens 3518. Equal force from the piezo bimorph actuator will change the focus point of the image in the Z direction (perpendicular to the lens), which makes it possible to use it as auto focus. According to some embodiments, different forces from the piezo bimorph actuator 3508 may move light in the X, Y axis direction, which may make it useful as an optical image stabilizer. By appropriately controlling each actuator, OIS and AF functions can be simultaneously realized. For some embodiments, three actuators are used. The circuit with the SMA actuator 3506 includes one or more contacts 3520 for control signals to actuate the SMA actuator. According to some embodiments including four SMA actuators, the circuit with SMA actuators 3506 includes four power circuit control contacts and a common return contact for each SMA actuator.

Fig. 37 shows an SMA piezoelectric bimorph liquid lens in perspective according to an embodiment. Fig. 38 illustrates a cross-sectional view and a bottom view of an SMA piezoelectric bimorph liquid lens according to an embodiment.

Fig. 39 illustrates an SMA system including an SMA actuator 3902 having a piezoelectric bimorph actuator according to an embodiment. The SMA actuator 3902 comprises four piezoelectric bimorph actuators using the techniques described herein. As shown in fig. 40, two of the piezoelectric bimorph actuators are configured as positive z-stroke actuators 3904, while the other two are configured as negative z-stroke actuators 3906, fig. 40 shows an SMA actuator 3902 having a piezoelectric bimorph actuator according to an embodiment. The opposing

actuators

3906, 3904 are configured to control motion in both directions throughout a range of travel. This provides the ability to adjust the control code to compensate for tilting. For the various embodiments, two SMA wires 3908 attached to the top of the component achieve positive z-stroke displacement. Two SMA wires attached to the bottom of the component achieve a negative Z-stroke displacement. For some embodiments, each piezoelectric bimorph actuator is attached to an object (e.g., lens carrier 3910) using tabs to engage the object. The SMA system includes a top spring 3912 configured to provide stability of the lens carrier 3910 in an axis perpendicular to the z-travel axis (e.g., in the directions of the x-axis and the y-axis). In addition, the top spacer 3914 is configured to be disposed between the top spring 3912 and the SMA actuator 3902. The bottom spacer 3916 is disposed between the SMA actuator 3902 and the bottom spring 3918. Bottom spring 3918 is configured to provide stability of lens carrier 3910 in an axis perpendicular to the z-travel axis, e.g., in the directions of the x-axis and the y-axis. The bottom spring 3918 is configured to be disposed on a base 3920, such as those described herein.

Fig. 41 shows the length 4102 of the piezoelectric bimorph actuator 4103 and the location of the bond pads 4104 for the SMA wire 4206 such that the wire length extends beyond the piezoelectric bimorph actuator. Wires longer than piezoelectric bimorph actuators are used to increase stroke and force. Thus, the extension 4108 of the SMA wire 4206 beyond the piezoelectric bimorph actuator 4103 is used to set the stroke and force of the piezoelectric bimorph actuator 4103.

Fig. 42 shows an exploded view of an SMA system including an SMA piezoelectric bimorph actuator 4202 according to an embodiment. According to various embodiments, the SMA system is configured to form one or more circuits using separate metallic materials and non-conductive adhesives to independently power the SMA wires. Some embodiments do not affect the AF size and include four piezoelectric bimorph actuators, such as those described herein. Two of the piezoelectric bimorph actuators are configured as positive Z-stroke actuators, and the other two are configured as negative Z-stroke actuators. Fig. 43 shows an exploded view of a sub-portion of an SMA actuator according to an embodiment. The sub-section includes a negative actuator signal connection 4302, a base 4304 having a piezoelectric bimorph actuator 4306. The negative actuator signal connection 4302 includes wire bond pads 4308 for connecting SMA wires of the piezoelectric bimorph actuator 4306 using techniques including those described herein. The negative actuator signal connector 4302 is secured to the base 4304 using an adhesive layer 4310. The subsection also includes a positive actuator signal connection 4314 having wire bond pads 4316 for connecting SMA wires 4312 of the piezoelectric bimorph actuator 4306 using techniques including those described herein. The positive actuator signal connection 4314 is secured to the base 4304 using an adhesive layer 4318. Each of the base 4304, the negative actuator signal connector 4302, and the positive actuator signal connector 4314 is formed of metal, such as stainless steel. Connection pads 4322 on each of the base 4304, the negative actuator signal connector 4302, and the positive actuator signal connector 4314 are configured to electrically couple control signals and ground to actuate the piezoelectric bimorph actuator 4306 using techniques including those described herein. For some embodiments, connection pads 4322 are gold plated. Fig. 44 shows a subsection of an SMA actuator according to an embodiment. For some embodiments, gold-plated pads are formed on the stainless steel layer for solder bonding or other known electrical termination methods. In addition, the wire bond pads formed are used for signal joints to electrically couple SMA wires to achieve a power signal.

Fig. 45 shows a five-axis sensor shift system according to an embodiment. The five-axis sensor displacement system is configured to move an object, such as an image sensor, along five axes relative to one or more lenses. This includes X/Y/Z axis translation and pitch/roll tilt. Alternatively, the system is configured to tilt the X/Y axes together using only four axes, and Z action using a separate AF on top. Other embodiments include a five-axis sensor displacement system configured to move one or more lenses relative to an image sensor. For some embodiments, the static lens stack is mounted on the top cover and is inserted within the ID (without touching the inside orange movable carriage).

FIG. 46 illustrates an exploded view of a five-axis sensor shift system according to an embodiment. The five-axis sensor shift system includes two circuit components: flexible sensor circuit 4602, piezoelectric bimorph actuator circuit 4604; and eight to twelve piezoelectric bimorph actuators 4606 configured onto the piezoelectric bimorph circuit member using techniques including those described herein. The five-axis sensor shift system includes a movable bracket 4608 and a housing 4610, the movable bracket 4608 being configured to hold one or more lenses. According to an embodiment, piezoelectric bimorph actuator circuit 4604 includes eight to twelve SMA actuators, such as those described herein. These SMA actuators are configured to move the movable carriage 4608 in five axes, e.g., in the x-direction, y-direction, z-direction, pitch, and roll, similar to other five-axis systems described herein.

Fig. 47 shows an SMA actuator according to an embodiment that includes a piezoelectric bimorph actuator integrated into the circuit for all actions. Embodiments of SMA actuators may include eight to twelve piezoelectric bimorph actuators 4606. However, other embodiments may include more or less. Fig. 48 illustrates an SMA actuator 4802 including a piezoelectric bimorph actuator integrated into the circuit for all actions, the SMA actuator 4802 being formed in part to fit within a respective housing 4804, in accordance with an embodiment. Fig. 49 shows a cross section of a five-axis sensor displacement system according to an embodiment.

Fig. 50 illustrates an SMA actuator 5002 including a piezoelectric bimorph actuator according to an embodiment. The SMA actuator 5002 is configured to move an image sensor, lens, or other various payloads in the x and y directions using four side-mounted SMA piezoelectric bimorph actuators 5004. Figure 51 shows a top view of an SMA actuator comprising a piezoelectric bimorph actuator that moves an image sensor, lens or other various payloads in different x and y positions.

Fig. 52 illustrates an SMA actuator including a piezoelectric bimorph actuator 5202, the piezoelectric bimorph actuator 5202 configured as a cassette piezoelectric bimorph autofocus, in accordance with an embodiment. Four top and bottom mounted SMA piezoelectric bimorph actuators (e.g., the actuators described herein) are configured to move together to produce motion in the z-forming direction for autofocus. Fig. 53 illustrates an SMA actuator comprising a piezoelectric bimorph actuator, two top mounted piezoelectric bimorph actuators 5302 configured to urge one or more lenses downward, in accordance with an embodiment. Fig. 54 illustrates an SMA actuator comprising a piezoelectric bimorph actuator, two bottom mounted piezoelectric bimorph actuators 5402 configured to urge upward on one or more lenses, according to an embodiment. Fig. 55 illustrates an SMA actuator including a piezoelectric bimorph actuator to show four top and bottom mounted SMA piezoelectric bimorph actuators 5502, such as those described herein, for moving one or more lenses to produce a tilting action, in accordance with an embodiment.

Figure 56 illustrates an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator configured as a two-axis lens-shifted OIS (device), according to an embodiment. For some embodiments, the two-axis lens shift OIS is configured to move the lens in the X/Y axis. For some embodiments, the Z-axis motion is from a separate AF, such as those described herein. Four piezo bimorph actuators push one side of the autofocus to achieve OIS action. Fig. 57 shows an exploded view of an SMA system including an SMA actuator 5802, the SMA actuator 5802 comprising a piezoelectric bimorph actuator 5806 configured as a biaxial lens shift OIS, according to an embodiment. Fig. 58 shows a cross section of an SMA system including an SMA actuator 5802, the SMA actuator 5802 comprising a piezoelectric bimorph actuator 5806 configured as a biaxial lens shift OIS, according to an embodiment. Fig. 59 shows a cassette piezoelectric bimorph actuator 5802 for use in SMA systems according to an embodiment, the cassette piezoelectric bimorph actuator 5802 being configured as a biaxial lens-shifting OIS as it was manufactured prior to being shaped to fit in the system. Such a system may be configured with a high OIS trip OIS (e.g., +/-200um or higher). In addition, such an embodiment is configured to use four sliding bearings (e.g., POM sliding bearings) to have a wide range of motion and good OIS dynamic tilting. Embodiments are configured to be easily integrated with an AF design (e.g., VCM or SMA).

Figure 60 illustrates an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator configured to five-axis lens shift OIS and autofocus, according to an embodiment. For some embodiments, the five-axis lens shift OIS and auto-focus are configured to move the lens in the X/Y/Z axis. For some embodiments, pitch and yaw axis actions are used for dynamic tilt adjustment capability. Eight piezo bimorph actuators are used to provide motion to autofocus and OIS using the techniques described herein. Fig. 61 illustrates an exploded view of an SMA system including an SMA actuator 6202, the SMA actuator 6202 comprising a piezoelectric bimorph actuator 6204 configured as a five-axis lens shift OIS and auto focus, according to an embodiment. Fig. 62 illustrates a cross section of an SMA system including an SMA actuator 6202, the SMA actuator 6202 comprising a piezoelectric bimorph actuator 6204 configured as a five-axis lens shift OIS and auto focus, according to an embodiment. Fig. 63 shows a cassette piezoelectric bimorph actuator 6202 for use in an SMA system according to an embodiment, the cassette piezoelectric bimorph actuator 6202 being configured as a five-axis lens shifting OIS and auto focus just as it was manufactured prior to being shaped to fit in the system. Such a system may be configured with a high OIS stroke OIS (e.g., +/-200um or higher) and a high autofocus stroke (e.g., 400um or higher). In addition, such an embodiment can accommodate any tilt and eliminate the need for a separate autofocus assembly.

Figure 64 illustrates an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator configured as an extrapolation cassette in accordance with an embodiment. For some embodiments, the piezoelectric bimorph actuator assembly is configured to be wrapped around an object such as a lens holder. The X/Y/Z stiffness of the flexible portion is low as the circuit assembly moves with the lens carrier. The tail pads of the circuit are static. The extrapolation cassette may be constructed as four or eight piezo-electric bimorph actuators. Thus, the extrapolation box may be configured as four piezo bimorph actuators on each side to achieve OIS movement in X-axis and Y-axis. The extrapolation box may be configured as four piezo-electric bimorph actuators on top and bottom to achieve auto-focus of motion in the Z-axis. The extrapolation box may be constructed as eight piezo bimorph actuators on top, bottom and sides to achieve OIS and auto focus movement in X, Y and Z axis and enable tri-axial tilting (pitch/roll/yaw). Fig. 65 illustrates an exploded view of an SMA system including an SMA actuator 6602 comprising a piezoelectric bimorph actuator 6604 configured as an outwardly urged cassette, according to an embodiment. Thus, the SMA actuator is configured such that a piezoelectric bimorph actuator acts on the housing 6504 to move the lens carrier 6506 using the techniques described herein. Fig. 66 illustrates an SMA system including an SMA actuator 6602 comprising a piezoelectric bimorph actuator configured as an extrapolation cassette, partially shaped to receive a lens carrier 6604, according to an embodiment. Fig. 67 shows an SMA system including an SMA actuator 6602 that includes a piezoelectric bimorph actuator 6604 configured to extrapolate a cassette just as it was manufactured prior to being shaped to fit in the system, according to an embodiment.

Fig. 68 illustrates an SMA system including an SMA actuator 6802, the SMA actuator 6802 comprising a piezoelectric bimorph actuator configured to displace OIS of a three-axis sensor, according to an embodiment. For some embodiments, the z-axis motion is from a separate autofocus system. Four piezo bimorph actuators are configured to push on each side of the sensor carriage 6804 to provide motion to the OIS using the techniques described herein. Fig. 69 illustrates an exploded view of an SMA including an SMA actuator 6802 comprising a piezoelectric bimorph actuator configured as a tri-axial sensor-shifted OIS, according to an embodiment. Fig. 70 illustrates a cross section of an SMA system including an SMA actuator 6802 comprising a piezoelectric bimorph actuator 6806 configured to displace OIS from a three-axis sensor, according to an embodiment. Fig. 71 shows a cassette piezoelectric bimorph actuator 6802 component for use in an SMA system configured as a tri-axial sensor displacement OIS, just as it was manufactured prior to being shaped to fit in the system, according to an embodiment. Fig. 72 illustrates a flexible sensor circuit for use in an SMA system configured to shift OIS for a three-axis sensor, according to an embodiment. Such a system may be configured with a high OIS stroke OIS (e.g., +/-200um or higher) and a high autofocus stroke (e.g., 400um or higher). In addition, such an embodiment is configured to use four sliding bearings (e.g., POM sliding bearings) to have a wide two-axis range of motion and good OIS dynamic tilting. Embodiments are configured to be easily integrated with an AF design (e.g., VCM or SMA).

Fig. 73 illustrates an SMA system including an SMA actuator 7302, the SMA actuator 7302 comprising a piezoelectric bimorph actuator 7304 configured to six-axis sensor displacement OIS and autofocus, according to an embodiment. For some embodiments, the six-axis sensor shift OIS and autofocus are configured to move the lens on the X/Y/Z/pitch/yaw/roll axis. For some embodiments, pitch and yaw axis actions enable dynamic tilt adjustment capabilities. Eight piezo bimorph actuators are used to provide motion to autofocus and OIS using the techniques described herein. Fig. 74 shows an exploded view of an SMA system including an SMA actuator 7402, the SMA actuator 7402 comprising a piezoelectric bimorph actuator 7404 configured as a six-axis sensor displacement OIS and autofocus, according to an embodiment. Fig. 75 illustrates a cross-section of an SMA system including an SMA actuator 7402, the SMA actuator 7402 comprising a piezoelectric bimorph actuator configured to six-axis sensor displacement OIS and autofocus, in accordance with an embodiment. Fig. 76 shows a cassette piezo bimorph actuator 7402 for an SMA system that is configured to displace OIS and autofocus as a six-axis sensor manufactured before being shaped to fit the system, according to an embodiment. Fig. 77 illustrates a flexible sensor circuit for use in an SMA system configured as a tri-axial sensor displacement OIS, according to an embodiment. Such a system may be configured with a high OIS stroke OIS (e.g., +/-200um or higher) and a high autofocus stroke (e.g., 400um or greater). In addition, such an embodiment can accommodate any tilt and eliminate the need for a separate autofocus assembly.

Figure 78 illustrates an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator configured as a two-axis camera tilt OIS according to an embodiment. For some embodiments, the two-axis camera tilt OIS is configured to move the camera along a pitch/yaw axis. Four piezo bimorph actuators are used to push the top and bottom of auto-focus using the techniques described herein to achieve OIS pitch and yaw actuation for the entire camera action. Fig. 79 illustrates an exploded view of an SMA system including an SMA actuator 7902, the SMA actuator 7902 comprising a piezoelectric bimorph actuator 7904 configured as a two-axis camera tilt OIS, according to an embodiment. Figure 80 illustrates a cross section of an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator configured as a two-axis camera tilt OIS according to an embodiment. Fig. 81 shows a cassette piezoelectric bimorph actuator for use in SMA systems configured as a two-axis camera tilt OIS just as it was manufactured before it was shaped to fit the system, according to an embodiment. Fig. 82 illustrates a flexible sensor circuit for an SMA system configured as a two-axis camera tilt OIS, according to an embodiment. Such a system may be configured with a high OIS trip OIS (e.g., plus/minus 3 degrees or higher). Embodiments are configured to be easily integrated with an auto focus ("AF") design (e.g., VCM or SMA).

Figure 83 illustrates an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator configured as a three-axis camera tilt OIS according to an embodiment. For some embodiments, the two-axis camera tilt OIS is configured to move the camera along a pitch/yaw/roll axis. Four piezo bimorph actuators are used to push the top and bottom of the autofocus using the techniques described herein to achieve OIS pitch and yaw motions for the entire camera action, and four piezo bimorph actuators are used to push the side of the autofocus using the techniques described herein to achieve OIS roll motions for the entire camera action. Fig. 84 shows an exploded view of an SMA system including an SMA actuator 8402, the SMA actuator 8402 comprising a piezoelectric bimorph actuator 8404 configured as a three-axis camera tilt OIS, according to an embodiment. Fig. 85 illustrates a cross section of an SMA system including an SMA actuator comprising a piezoelectric bimorph actuator configured as a three-axis camera tilt OIS according to an embodiment. Fig. 86 shows a cassette piezoelectric bimorph actuator for use in an SMA system configured as a three-axis camera tilt OIS just as it was manufactured prior to being shaped to fit in the system, according to an embodiment. Fig. 87 illustrates a flexible sensor circuit for an SMA system configured as a three-axis camera tilt OIS, according to an embodiment. Such a system may be configured with a high OIS trip OIS (e.g., plus/minus 3 degrees or higher). Embodiments are configured to be easily integrated with an AF design (e.g., VCM or SMA).

Fig. 88 illustrates exemplary dimensions of a piezoelectric bimorph actuator of an SMA actuator according to an embodiment. These dimensions are the preferred embodiments, but those skilled in the art will appreciate that other dimensions may be used based on the desired characteristics of the SMA actuator.

It will be understood that terms such as "top," "bottom," "above," "below," and x-, y-, and z-directions, as used herein as convenient terms, refer to spatial relationships of parts relative to one another, and do not refer to any particular spatial or gravitational orientation. Accordingly, these terms are intended to encompass the assembly of components regardless of whether the assembly is oriented in the particular orientation shown in the figures and described in the specification, inverted relative to the orientation, or any other rotational variation.

It is to be understood that the term "invention" as used herein should not be interpreted as representing only a single invention having a single basic element or group of elements. Similarly, it should also be understood that the term "invention" encompasses many separate innovations, which may be considered as separate inventions. Although the present invention has been described in detail with respect to the preferred embodiments and the accompanying drawings thereof, it should be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present invention without departing from the spirit and the essence of the invention. The scope of the invention. In addition, the techniques described herein may be used to fabricate devices with two, three, four, five, six, or more typically n piezoelectric bimorph actuators and warp actuators. It is to be understood, therefore, that the detailed description and drawings set forth above are not intended to limit the breadth of the present invention, and are to be inferred only from the appended claims and their appropriately interpreted legal equivalents.

Claims

1. An actuator, comprising:

a base;

a plurality of warp arms, each warp arm of the plurality of warp arms comprising a first end and a second end opposite the first end; and

a shape memory alloy wire coupled with a pair of warp arms of the plurality of warp arms at the first ends of the pair of warp arms, each of the first ends of the pair of warp arms coupled with the base, and each of the second ends of the pair of warp arms configured to be unfixed;

wherein the pair of buckling arms are arranged along a first direction such that the second ends of the pair of buckling arms are opposite to each other in the first direction and such that the first ends of the pair of buckling arms are opposite to each other in the first direction, and the shape memory alloy wire extends along the first direction between the first ends of the pair of buckling arms;

wherein the second ends of the pair of buckling arms are configured to move in a second direction perpendicular to the first direction when the shape memory alloy wire is actuated to contract between the first ends of the pair of buckling arms.

2. The actuator of claim 1, wherein the second ends of the pair of warp arms of the plurality of warp arms are coupled together by an intermediate portion and are configured to move the intermediate portion in the second direction when the shape memory alloy wire is actuated.

3. The actuator of claim 2, wherein the second direction is a positive z-direction.

4. The actuator of claim 1, wherein a first end of the shape memory alloy wire is attached to a first one of the pair of tilt arms and a second end of the shape memory alloy wire is attached to a second one of the pair of tilt arms.

5. The actuator of claim 4, wherein the shape memory alloy wire is attached to the first tilt arm by a first crimp and is attached to the second tilt arm by a second crimp.

6. The actuator of claim 2, wherein the intermediate portion is configured to receive a portion of a lens carrier.

7. The actuator of claim 2, wherein the intermediate portion is a stacked hanger.

8. The actuator of claim 1, wherein the actuator is included in an autofocus system.

9. The actuator of claim 1, wherein the actuator is configured as a microfluidic pump.

10. An autofocus system comprising more than one actuator according to claim 1.

11. A microfluidic pump comprising more than one actuator according to claim 1.

12. An actuation assembly, comprising:

a first warp-type actuator, which is an actuator according to any one of claims 1 to 7;

a second warp-type actuator, which is the actuator according to any one of claims 1 to 7; and

a lens carrier configured to be moved by the first warp actuator and the second warp actuator.

13. The actuation assembly of claim 12 wherein the first warp actuator is configured to move the lens carrier in a negative z-direction.

14. The actuation assembly of claim 13 wherein the second warp actuator is configured to move the lens carrier in a positive z-direction.

15. The actuation assembly of claim 12 wherein the first warp-type actuator comprises a first base and the second warp-type actuator comprises a second base, the first warp-type actuator comprising a first pair of warp-type arms and a second pair of warp-type arms attached to the first base, the second warp-type actuator comprising a third pair of warp-type arms and a fourth pair of warp-type arms.

16. The actuation assembly of claim 15 wherein the lens carrier is disposed between the first and second warp-type actuators.

17. The actuation assembly of claim 16 wherein the first base and the second base face each other.

18. The actuation assembly of claim 17 wherein the first and second warp actuators are configured to tilt the lens carrier relative to an axis.