CN113588124B - Integrated monitoring devices of electronic product mainboard temperature rise - Google Patents
Integrated monitoring devices of electronic product mainboard temperature rise Download PDFInfo
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- CN113588124B CN113588124B CN202110942547.3A CN202110942547A CN113588124B CN 113588124 B CN113588124 B CN 113588124B CN 202110942547 A CN202110942547 A CN 202110942547A CN 113588124 B CN113588124 B CN 113588124B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
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- Testing Electric Properties And Detecting Electric Faults (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an integrated monitoring device for temperature rise of a mainboard of an electronic product, which belongs to the technical field of temperature monitoring and comprises an electronic equipment shell, wherein the lower surface of the inner wall of the electronic equipment shell is fixedly connected with the lower surface of a mounting plate, and the upper surface of the mounting plate is provided with four accommodating grooves. This integrated monitoring devices of electronic product mainboard temperature rise, through setting up the arc limiting plate, first spring, the loading board, pressing plates, the second spring, a weighing sensor and a vertical plate, the vibrations that third spring and first spring can receive loading board and electronic motherboard simultaneously carry out buffer protection, reduce the influence that vibrations led to the fact to electronic motherboard, reduce electronic motherboard to a certain extent because the probability of damage appears in vibrations, guarantee the stable connection of temperature sensor and electronic motherboard surface cable simultaneously, guarantee the smooth stable of temperature rise testing process and go on, guarantee electronic motherboard's normal smooth operation simultaneously.
Description
Technical Field
The invention belongs to the technical field of temperature monitoring, and particularly relates to an integrated monitoring device for temperature rise of a mainboard of an electronic product.
Background
The electronic product is a product which is relatively hot at present, various modes such as people's life, trip have been solved to the electronic product, but the electronic product all can generate heat when moving to can lead to the inside temperature of electronic product to rise sharply, can lead to inside mainboard to burn out after reaching certain temperature very easily, finally can't continue to use, so need add the problem of generating heat that temperature rise monitoring devices solved the electronic product in the electronic product.
Electronic equipment uses more and more in the vehicle, electronic equipment can often receive vibrations in the vehicle removal in-process, it realizes the monitoring to the temperature to simply set up temperature rise monitoring devices in some electronic equipment many, the temperature sensor part bonds on the mainboard surface through glue, glue can influence the heat dispersion of mainboard self, and the mainboard passes through the cable among the electronic equipment and is connected with other components, it is not hard up that cable and mainboard junction probably appear when electronic equipment receives vibrations, the condition that cable and mainboard junction drop even, or the disconnection of being connected between temperature sensor and other equipment appears, influence the temperature rise testing process and go on.
Disclosure of Invention
Technical problem to be solved
In order to overcome the defects in the prior art, the invention provides an integrated monitoring device for temperature rise of a mainboard of an electronic product, which solves the problems that a temperature sensor is arranged on the surface of the mainboard through glue in the existing temperature rise detection device, the heat dissipation performance of the mainboard can be influenced by the glue, and meanwhile, when the mainboard is vibrated, the connection between the temperature sensor and other equipment is possibly disconnected, or cables are loosened, and the smooth proceeding of the temperature rise detection process can be influenced.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides an integrated monitoring devices of electronic product mainboard temperature rise, includes the electronic equipment shell, the lower surface of electronic equipment shell inner wall is connected with the lower fixed surface of mounting panel, four grooves of accomodating have been seted up to the upper surface of mounting panel, the lower surface of accomodating the inslot wall is connected with the bottom fixed connection of first spring, four the top of first spring is connected with the lower fixed surface of same loading board, the upper surface of loading board and the lower surface overlap joint of electron mainboard, the upper surface of electron mainboard is provided with temperature sensor, temperature sensor's upper surface and the bottom fixed connection of second spring.
The top of second spring is connected with the lower fixed surface of locating plate, the upper surface of locating plate is provided with four elastic component, elastic component's bottom and the upper fixed surface of mounting panel are connected, the upper surface of mounting panel and the lower fixed surface of four risers are connected, the right side of riser and the left end fixed connection of two third springs, two the right-hand member of third spring and the left surface fixed connection of same arc limiting plate, four the opposite face of arc limiting plate respectively with the surface overlap joint of electron mainboard, two connecting holes have been seted up to the upper surface of locating plate.
The connecting hole inner wall is provided with the guide bar, the surface of guide bar is provided with three removal cover, the lower surface of removal cover and the top fixed connection of positioning spring, positioning spring's bottom and the last fixed surface of clamp plate are connected, the lower surface of clamp plate and the upper surface overlap joint of riser, the upper surface of removal cover is provided with the connecting plate, the upper surface joint of connecting plate has locating component, a plurality of constant head tanks have been seted up to the upper surface of guide bar, locating component sets up the lower surface at the constant head tank inner wall.
As a further scheme of the invention: the elastic component comprises a first sliding rod, the bottom end of the first sliding rod is fixedly connected with the upper surface of the mounting plate, the top end of the first sliding rod is fixedly connected with the lower surface of the top plate, a first sliding sleeve is arranged on the outer surface of the first sliding rod, the first sliding sleeve is arranged on the upper surface of the positioning plate, a fourth spring is arranged on the outer surface of the first sliding rod, the top end of the fourth spring is fixedly connected with the lower surface of the top plate, and the bottom end of the fourth spring is fixedly connected with the upper surface of the first sliding sleeve.
As a further scheme of the invention: the positioning assembly comprises a second sliding sleeve, the second sliding sleeve is connected to the upper surface of the connecting plate in a clamped mode, the inner wall of the second sliding sleeve is connected with the outer surface of the second sliding rod in a sliding mode, the bottom end of the second sliding rod is connected with the lower surface of the inner wall of the positioning groove in a fixed mode, the top end of the second sliding rod is connected with the lower surface of the control plate in a fixed mode, a fifth spring is arranged on the outer surface of the second sliding rod, the top end of the fifth spring is connected with the lower surface of the control plate in a fixed mode, and the bottom end of the fifth spring is connected with the upper surface of the second sliding sleeve in a fixed mode.
As a further scheme of the invention: the upper surface of the vertical plate is provided with a rubber pad, the position of the rubber pad corresponds to that of the pressing plate, the lower surface of the pressing plate is arc-shaped, and the positioning plate is net-shaped.
As a further scheme of the invention: the upper surface of locating plate is provided with the treater, the upper surface of locating plate is provided with the alarm.
As a further scheme of the invention: the guide bar sets up to the rectangle, the shape of moving the cover and the shape looks adaptation of guide bar, it is a plurality of to the leftmost side the constant head tank is the sharp setting on the guide bar surface, the left and right sides face of moving the cover is respectively with the left and right sides face overlap joint of connecting hole inner wall.
As a further scheme of the invention: the upper surface of the bearing plate is fixedly connected with the left side face and the right side face of the electronic mainboard respectively through four connecting assemblies.
As a further scheme of the invention: the connecting assembly comprises a connecting piece, the left side face of the connecting piece is fixedly connected with the right side face of the electronic mainboard, the lower surface of the connecting piece is in lap joint with the upper surface of the bearing plate, and the connecting piece is in threaded connection with the upper surface of the bearing plate through a bolt.
As a further scheme of the invention: the outer surface of the arc limiting plate is provided with a rubber layer, the number of the temperature sensors is four, and the positions of the connecting holes correspond to the positions of the vertical plates.
As a further scheme of the invention: the upper surface of loading board is provided with the buffer layer, the shape of mounting panel sets up to the rectangle, the upper surface of electronic equipment shell is provided with the apron.
(III) advantageous effects
Compared with the prior art, the invention has the beneficial effects that:
1. the integrated monitoring device for the temperature rise of the mainboard of the electronic product is characterized in that an arc-shaped limiting plate, a first spring, a bearing plate, a pressing plate, a second spring, a temperature sensor, a positioning plate and a vertical plate are arranged, the second spring applies downward acting force to the temperature sensor to ensure stable contact between the temperature sensor and the electronic mainboard, and simultaneously the pressing plate can press and position cables connected with the electronic mainboard and cables connected with the temperature sensor to avoid the situation that the cables shake at will or break and fall off due to vibration of the device, meanwhile, the third spring and the first spring can buffer and protect the vibration received by the bearing plate and the electronic mainboard, reduce the influence of vibration on the electronic mainboard, reduce the probability of damage of the electronic mainboard due to vibration to a certain degree, ensure stable connection of the temperature sensor and the cables on the surface of the electronic mainboard, and ensure smooth and stable proceeding of the temperature rise detection process, and meanwhile, the normal and smooth operation of the electronic mainboard is ensured.
2. This integrated monitoring devices of electronic product mainboard temperature rise, through setting up the guide bar, remove the cover, the constant head tank, the second slide bar, a pressing plate, connection piece and fifth spring, direct pulling control panel rebound, after second slide bar and constant head tank separation, steerable removal cover is slided on the guide bar surface this moment, after the clamp plate removed the position to corresponding the cable, stop the pulling and remove the cover, then loosen the control panel, fifth spring drove the second slide bar rebound to the constant head tank this moment in, this device can be according to the cable position to the position of removing cover and clamp plate in time adjust, make the flexibility and the suitability of this device more ideal.
3. This integrated monitoring devices of electronic product mainboard temperature rise, through setting up temperature sensor, treater and alarm, when temperature sensor monitored electronic motherboard surface temperature and riseed, then send signal to treater, the treater carries out data processing and with data transmission in the alarm, then notifies people electronic motherboard temperature rise after the alarm starts, in time handles, avoids the high temperature to lead to the condition appearance that electronic motherboard is burnt out.
Drawings
FIG. 1 is a schematic sectional view of the front view of the present invention;
FIG. 2 is a schematic top view of the mounting plate of the present invention;
FIG. 3 is a schematic left-side sectional view of the positioning plate of the present invention;
FIG. 4 is a schematic left side view of a guide bar in partial cross-section;
FIG. 5 is a front view of the guide bar of the present invention;
FIG. 6 is a front view of the elastic assembly of the present invention;
FIG. 7 is a left side view of the positioning assembly of the present invention;
FIG. 8 is a schematic sectional view of the vertical plate of the present invention viewed from the left;
FIG. 9 is a front cross-sectional view of a connecting assembly of the present invention;
in the figure: the electronic equipment comprises an electronic equipment shell 1, a mounting plate 2, a receiving groove 3, a first spring 4, a bearing plate 5, a connecting assembly 6, a connecting sheet 61, a bolt 62, an electronic main board 7, a temperature sensor 8, a second spring 9, a positioning plate 10, an elastic assembly 11, a first sliding rod 111, a first sliding sleeve 112, a top plate 113, a fourth spring 114, a processor 12, an alarm 13, a vertical plate 14, a third spring 15, an arc limiting plate 16, a pressing plate 17, a positioning spring 18, a movable sleeve 19, a guide rod 20, a connecting hole 21, a positioning groove 22, a connecting plate 23, a positioning assembly 24, a second sliding sleeve 241, a second sliding rod 242, a control plate 243, a fifth spring 244 and a rubber pad 25.
Detailed Description
The technical solution of the present patent will be further described in detail with reference to the following embodiments.
As shown in fig. 1 to 9, the present invention provides a technical solution: an integrated monitoring device for temperature rise of an electronic product mainboard comprises an electronic device shell 1, wherein the lower surface of the inner wall of the electronic device shell 1 is fixedly connected with the lower surface of a mounting plate 2, four accommodating grooves 3 are formed in the upper surface of the mounting plate 2, a bearing plate 5 can be buffered by a first spring 4 through arranging the accommodating grooves 3 and the first spring 4, when the device is vibrated, the first spring 4 can reduce the influence of vibration on an electronic mainboard 7, the lower surface of the inner wall of the accommodating groove 3 is fixedly connected with the bottom end of the first spring 4, the top ends of the four first springs 4 are fixedly connected with the lower surface of the same bearing plate 5, the upper surface of the bearing plate 5 is lapped with the lower surface of the electronic mainboard 7, a temperature sensor 8 is arranged on the upper surface of the electronic mainboard 7, and when the temperature sensor 8, a processor 12 and an alarm 13 are arranged, and the temperature sensor 8 monitors that the surface temperature of the electronic mainboard 7 rises, then send signal to treater 12, treater 12 carries out data processing and with data transmission to in alarm 13, alarm 13 starts the back then and notifies people electronic motherboard 7 temperature rise, in time handle, avoid the high condition that leads to electronic motherboard 7 to be burnt out of temperature to appear, temperature sensor 8's upper surface and second spring 9's bottom fixed connection, through setting up second spring 9, the distance between temperature sensor 8 and locating plate 10 is variable, avoid temperature sensor 8 to cause energetically to push electronic motherboard 7.
The top end of the second spring 9 is fixedly connected with the lower surface of the positioning plate 10, the upper surface of the positioning plate 10 is provided with four elastic components 11, the bottom ends of the elastic components 11 are fixedly connected with the upper surface of the mounting plate 2, the upper surface of the mounting plate 2 is fixedly connected with the lower surfaces of four vertical plates 14, through the arrangement of the vertical plates 14, the third springs 15 and the arc limiting plates 16, the third springs 15 apply acting force to the arc limiting plates 16, the four arc limiting plates 16 extrude and position the electronic mainboard 7, the clamping protection of the arc limiting plates 16 on the electronic mainboard 7 is ensured, the vertical plates 14 can support the third springs 15, meanwhile, the vertical plates 14 can be matched with the pressing plate 17 to clamp and position cables, the right side surfaces of the vertical plates 14 are fixedly connected with the left ends of the two third springs 15, and the right ends of the two third springs 15 are fixedly connected with the left side surfaces of the same arc limiting plate 16, the opposite surfaces of the four arc-shaped limiting plates 16 are respectively lapped with the outer surface of the electronic main board 7, and the upper surface of the positioning plate 10 is provided with two connecting holes 21.
Connecting hole 21 inner wall is provided with guide bar 20, through setting up guide bar 20 and removal cover 19, it can 20 surface sliding of guide bar to remove cover 19, the position of clamp plate 17 is conveniently adjusted, can guarantee that clamp plate 17 corresponds with the cable position, the surface of guide bar 20 is provided with three removal cover 19, the lower surface of removal cover 19 and positioning spring 18's top fixed connection, positioning spring 18's bottom and clamp plate 17's last fixed surface are connected, clamp plate 17's lower surface and riser 14's upper surface overlap joint, the upper surface of removal cover 19 is provided with connecting plate 23, the upper surface of connecting plate 23 has been pegged graft and has been had locating component 24, a plurality of constant head tanks 22 have been seted up to the upper surface of guide bar 20, locating component 24 sets up the lower surface at constant head tank 22 inner wall.
Specifically, as shown in fig. 6, the elastic assembly 11 includes a first sliding rod 111, a bottom end of the first sliding rod 111 is fixedly connected to an upper surface of the mounting plate 2, a top end of the first sliding rod 111 is fixedly connected to a lower surface of the top plate 113, an outer surface of the first sliding rod 111 is provided with a first sliding sleeve 112, the first sliding sleeve 112 is disposed on an upper surface of the positioning plate 10, an outer surface of the first sliding rod 111 is provided with a fourth spring 114, a top end of the fourth spring 114 is fixedly connected to a lower surface of the top plate 113, a bottom end of the fourth spring 114 is fixedly connected to an upper surface of the first sliding sleeve 112, by disposing the first sliding rod 111, the first sliding sleeve 112 and the fourth spring 114, the positioning plate 10 can be smoothly slid in an up-down direction, the distance between the positioning plate 10 and the mounting plate 2 can be conveniently adjusted, the taking and placing process of the electronic motherboard 7 can be conveniently performed, the fourth spring 114 exerts a downward acting force on the positioning plate 10, the positioning plate 10 and the temperature sensor 8 are prevented from randomly shaking up and down.
Specifically, as shown in fig. 7, the positioning assembly 24 includes a second sliding sleeve 241, the second sliding sleeve 241 is fastened to the upper surface of the connecting plate 23, the inner wall of the second sliding sleeve 241 is slidably connected to the outer surface of the second sliding rod 242, the bottom end of the second sliding rod 242 is fixedly connected to the lower surface of the inner wall of the positioning groove 22, the top end of the second sliding rod 242 is fixedly connected to the lower surface of the control plate 243, the outer surface of the second sliding rod 242 is provided with a fifth spring 245, the top end of the fifth spring 245 is fixedly connected to the lower surface of the control plate 243, by providing the second sliding sleeve 241 and the second sliding rod 242, it can be ensured that the second sliding rod 242 does not tilt or shake during the up-and-down moving process, it is ensured that the second sliding rod 242 accurately and stably moves into the positioning groove 22, by providing the fifth spring 245, a downward acting force can be applied to the second sliding rod 242, it is ensured that the second sliding rod 242 and stably and tightly contacts the positioning groove 22, by arranging the positioning slot 22, when the second sliding rod 242 is located in the positioning slot 22, the movable sleeve 19 can be prevented from sliding freely on the surface of the guide rod 20, and the bottom end of the fifth spring 245 is fixedly connected with the upper surface of the second sliding sleeve 241.
Specifically, as shown in fig. 2 and 8, the upper surface of the vertical plate 14 is provided with a rubber pad 25, the rubber pad 25 corresponds to the pressing plate 17, the lower surface of the pressing plate 17 is arc-shaped, and by arranging the pressing plate 17 and the positioning springs 18, the positioning springs 18 can ensure stable contact between the pressing plate 17 and the cable, so that the cable is prevented from shaking randomly, and the positioning plate 10 is net-shaped.
Specifically, as shown in fig. 1, a processor 12 is disposed on an upper surface of the positioning plate 10, an alarm 13 is disposed on the upper surface of the positioning plate 10, and the upper surface of the carrier plate 5 is fixedly connected to left and right sides of the electronic motherboard 7 through four connecting assemblies 6.
Specifically, as shown in fig. 4 and 5, guide bar 20 sets up to the rectangle, set up to the rectangle through setting up guide bar 20 and moving cover 19, it is rotatory to avoid moving cover 19 and clamp plate 17 to appear moving the in-process, guarantee that clamp plate 17 can stabilize accurate and cable contact, the shape of moving cover 19 and the shape looks adaptation of guide bar 20, a plurality of constant head tanks 22 in the leftmost side are the straight line and set up on guide bar 20 surface, the left and right sides face of moving cover 19 overlaps with the left and right sides face of connecting hole 21 inner wall respectively.
Specifically, as shown in fig. 9, the connection assembly 6 includes a connection sheet 61, a left side surface of the connection sheet 61 is fixedly connected to a right side surface of the electronic motherboard 7, a lower surface of the connection sheet 61 is overlapped with an upper surface of the loading plate 5, the connection sheet 61 is in threaded connection with the upper surface of the loading plate 5 through a bolt 62, and the connection sheet 61 and the bolt 62 are arranged to realize assembly between the electronic motherboard 7 and the loading plate 5.
Specifically, as shown in fig. 1 and 2, the outer surface of the arc-shaped limiting plate 16 is provided with four rubber layers, the positions of the connecting holes 21 correspond to the positions of the risers 14, the upper surface of the bearing plate 5 is provided with a buffer layer, the mounting plate 2 is rectangular, and the upper surface of the electronic device housing 1 is provided with a cover plate.
The working principle of the invention is as follows:
s1, when the electronic main board 7 needs to be installed, firstly, the positioning plate 10 is pulled to move upwards to a proper height, the four arc-shaped limiting plates 16 are controlled to move close to the vertical plates 14 respectively, the electronic main board 7 is directly placed on the surface of the bearing plate 5, the bearing plate 5 and the electronic main board 7 are assembled through the bolts 62 and the connecting pieces 61, then the arc-shaped limiting plates 16 are loosened, meanwhile, the third springs 15 drive the arc-shaped limiting plates 16 to be in contact with the electronic main board 7, and at this time, the control plate 243 and the second sliding rod 242 can be pulled to move upwards;
s2, when the second sliding rod 242 is separated from the positioning slot 22, the moving sleeve 19 is controlled to slide on the surface of the guide rod 20, when the pressing plate 17 moves to the position corresponding to the cable, the positioning plate 10 is loosened, the fourth spring 114 drives the positioning plate 10 and the temperature sensor 8 to move downwards, then the temperature sensor 8 contacts with the electronic main board 7 downwards, and simultaneously the positioning plate 10 presses the positioning spring 18 and the pressing plate 17 downwards;
s3, pressing plate 17 and cable stable contact, accomplish the equipment process to electron mainboard 7 this moment, when electron mainboard 7 temperature rise, temperature sensor 8 detected the temperature rise signal this moment to with in temperature rise signal transmission to treater 12, treater 12 is handled data and control alarm 13 work, reminds people electron mainboard 7 temperature rise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (10)
1. The utility model provides an integrated monitoring devices of electronic product mainboard temperature rise, includes electronic equipment shell (1), its characterized in that: the lower surface of the inner wall of the electronic equipment shell (1) is fixedly connected with the lower surface of the mounting plate (2), the upper surface of the mounting plate (2) is provided with four accommodating grooves (3), the lower surface of the inner wall of each accommodating groove (3) is fixedly connected with the bottom ends of the first springs (4), the top ends of the four first springs (4) are fixedly connected with the lower surface of the same bearing plate (5), the upper surface of the bearing plate (5) is in lap joint with the lower surface of the electronic mainboard (7), the upper surface of the electronic mainboard (7) is provided with a temperature sensor (8), and the upper surface of the temperature sensor (8) is fixedly connected with the bottom ends of the second springs (9);
the top end of the second spring (9) is fixedly connected with the lower surface of the positioning plate (10), four elastic assemblies (11) are arranged on the upper surface of the positioning plate (10), the bottom ends of the elastic assemblies (11) are fixedly connected with the upper surface of the mounting plate (2), the upper surface of the mounting plate (2) is fixedly connected with the lower surfaces of four vertical plates (14), one surface of each vertical plate (14) relative to the electronic main board (7) is fixedly connected with one end of each third spring (15), one end of each third spring (15) relative to the electronic main board (7) is fixedly connected with the outer surface of the same arc-shaped limiting plate (16), one surface of each arc-shaped limiting plate (16) relative to the electronic main board (7) is respectively in lap joint with the side surface of the electronic main board (7), and a connecting hole (21) is formed in the upper surface of the positioning plate (10);
connecting hole (21) inner wall is provided with guide bar (20), the surface of guide bar (20) is provided with three removal cover (19), the lower surface of removal cover (19) and the top fixed connection of positioning spring (18), the bottom of positioning spring (18) is connected with the last fixed surface of clamp plate (17), the lower surface of clamp plate (17) and the upper surface overlap joint of riser (14), the upper surface of removal cover (19) is provided with connecting plate (23), the upper surface joint of connecting plate (23) has locating component (24), a plurality of constant head tanks (22) have been seted up to the upper surface of guide bar (20), locating component (24) set up the lower surface at constant head tank (22) inner wall.
2. The integrated monitoring device of temperature rise of electronic product mainboard of claim 1, characterized in that: elastic component (11) includes first slide bar (111), the bottom of first slide bar (111) and the upper surface fixed connection of mounting panel (2), the top of first slide bar (111) and the lower fixed surface of roof (113) are connected, the surface of first slide bar (111) is provided with first sliding sleeve (112), first sliding sleeve (112) set up the upper surface at locating plate (10), the surface of first slide bar (111) is provided with fourth spring (114), the top of fourth spring (114) and the lower fixed surface of roof (113) are connected, the bottom of fourth spring (114) and the upper surface fixed connection of first sliding sleeve (112).
3. The integrated monitoring device of temperature rise of electronic product mainboard of claim 1, characterized in that: the positioning assembly (24) comprises a second sliding sleeve (241), the second sliding sleeve (241) is connected to the upper surface of the connecting plate (23) in a clamped mode, the inner wall of the second sliding sleeve (241) is connected with the outer surface of the second sliding rod (242) in a sliding mode, the bottom end of the second sliding rod (242) is fixedly connected with the lower surface of the inner wall of the positioning groove (22), the top end of the second sliding rod (242) is fixedly connected with the lower surface of the control plate (243), a fifth spring (244) is arranged on the outer surface of the second sliding rod (242), the top end of the fifth spring (244) is fixedly connected with the lower surface of the control plate (243), and the bottom end of the fifth spring (244) is fixedly connected with the upper surface of the second sliding sleeve (241).
4. The integrated monitoring device of temperature rise of the mainboard of electronic product according to claim 1, characterized in that: the upper surface of the vertical plate (14) is provided with a rubber pad (25), the position of the rubber pad (25) corresponds to the position of the pressing plate (17), the lower surface of the pressing plate (17) is arc-shaped, and the positioning plate (10) is net-shaped.
5. The integrated monitoring device of temperature rise of the mainboard of electronic product according to claim 1, characterized in that: the upper surface of locating plate (10) is provided with treater (12), the upper surface of locating plate (10) is provided with alarm (13).
6. The integrated monitoring device of temperature rise of electronic product mainboard of claim 1, characterized in that: guide bar (20) set up to the rectangle, the shape of removing cover (19) and the shape looks adaptation of guide bar (20), it is a plurality of to the leftmost side constant head tank (22) are the straight line and set up on guide bar (20) surface, the left and right sides face that removes cover (19) overlaps with the left and right sides face of connecting hole (21) inner wall respectively.
7. The integrated monitoring device of temperature rise of electronic product mainboard of claim 1, characterized in that: the upper surface of the bearing plate (5) is fixedly connected with the left side surface and the right side surface of the electronic mainboard (7) through four connecting assemblies (6).
8. The integrated monitoring device of temperature rise of the mainboard of electronic product according to claim 7, characterized in that: the connecting assembly (6) comprises two connecting pieces (61) on the right side, the left side face of each connecting piece (61) is fixedly connected with the right side face of the electronic main board (7), the right side face of each connecting piece (61) is fixedly connected with the left side face of the electronic main board (7), the lower surface of each connecting piece (61) is in lap joint with the upper surface of the bearing plate (5), and each connecting piece (61) is in threaded connection with the upper surface of the bearing plate (5) through a bolt (62).
9. The integrated monitoring device of temperature rise of electronic product mainboard of claim 1, characterized in that: the outer surface of the arc limiting plate (16) is provided with four rubber layers, the number of the temperature sensors (8) is four, and the positions of the connecting holes (21) correspond to the positions of the vertical plates (14).
10. The integrated monitoring device of temperature rise of the mainboard of electronic product according to claim 1, characterized in that: the upper surface of loading board (5) is provided with the buffer layer, the shape of mounting panel (2) sets up to the rectangle, the upper surface of electronic equipment shell (1) is provided with the apron.
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| CN202110942547.3A CN113588124B (en) | 2021-08-17 | 2021-08-17 | Integrated monitoring devices of electronic product mainboard temperature rise |
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| CN202110942547.3A CN113588124B (en) | 2021-08-17 | 2021-08-17 | Integrated monitoring devices of electronic product mainboard temperature rise |
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| CN113588124B true CN113588124B (en) | 2022-07-26 |
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| JP2008147276A (en) * | 2006-12-07 | 2008-06-26 | Matsushita Electric Ind Co Ltd | Probe card and device and method for inspecting semiconductor wafer |
| CN208093539U (en) * | 2018-01-15 | 2018-11-13 | 浙江海澄德畅机械有限公司 | A kind of integrated circuit package structure |
| CN108958413A (en) * | 2018-07-19 | 2018-12-07 | 安徽博豪信息技术有限公司 | A kind of computer motherboard safeguard structure |
| CN112259876A (en) * | 2019-07-06 | 2021-01-22 | 诸暨慧达机电有限公司 | New energy automobile is seismic isolation device for battery |
| CN211348473U (en) * | 2019-11-29 | 2020-08-25 | 深圳通洲检测有限公司 | Temperature rise monitoring device of electronic product |
| CN210955411U (en) * | 2020-01-06 | 2020-07-07 | 南京朝曦信息科技有限公司 | Indoor smoking check out test set convenient to it is clean |
| CN212748081U (en) * | 2020-04-24 | 2021-03-19 | 郑州泰恩科技有限公司 | Passive wireless temperature measurement sensor based on LORA technology |
| CN212514902U (en) * | 2020-07-02 | 2021-02-09 | 深圳市实益达工业有限公司 | Mainboard detection device |
| CN212808708U (en) * | 2020-08-07 | 2021-03-26 | 武汉锐奥特科技有限公司 | Optical device mounting device with positioning function |
| CN213753319U (en) * | 2020-12-29 | 2021-07-20 | 刘菊红 | Power plug with temperature monitoring function |
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2021
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