CN208093539U - A kind of integrated circuit package structure - Google Patents
A kind of integrated circuit package structure Download PDFInfo
- Publication number
- CN208093539U CN208093539U CN201820058948.6U CN201820058948U CN208093539U CN 208093539 U CN208093539 U CN 208093539U CN 201820058948 U CN201820058948 U CN 201820058948U CN 208093539 U CN208093539 U CN 208093539U
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- Prior art keywords
- protecting crust
- screw thread
- shell
- chip
- integrated circuit
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Abstract
The utility model discloses a kind of integrated circuit package structures, including mounting plate, the upper surface of the mounting plate is fixedly connected with the lower surface for placing shell, the outer surface for placing shell and the surface of protecting crust inner wall overlap, the upper surface of the protecting crust inner wall is fixedly connected by four telescopic rods with the upper surface of four pressing plates, and four telescopic rods are located at position of the protecting crust inner wall upper surface close to quadrangle, and the surface of four telescopic rods is socketed with spring, and the both ends of four springs are fixedly connected with the upper surface of the upper surface of protecting crust inner wall and pressing plate respectively.The integrated circuit package structure, shell, protecting crust, pressing plate, spring, the first screw thread, the second screw thread and the first bolt are placed by setting, to when needing to replace chip or overhauled, protecting crust is set to detach with shell is placed and can take out chip, save the time of staff, the working strength of staff is reduced simultaneously, while improving the efficiency replaced and overhauled to chip.
Description
Technical field
The utility model is related to integrated antenna package technical field, specially a kind of integrated circuit package structure.
Background technology
Integrated circuit is a kind of microelectronic device or component.Using certain technique, brilliant needed for a circuit
The elements such as body pipe, resistance, capacitance and inductance and wiring interconnection together, are produced on a fritter or a few fritter semiconductor wafers or medium
It on substrate, is then encapsulated in a shell, becomes the microstructure with required circuit function, wherein all elements are in structure
On formed a whole, so that electronic component has been strided forward one in terms of microminaturization, low-power consumption, intelligence and high reliability big
Step.
Position of the integrated antenna package in electronics pyramid is both pyramidal pinnacle and pyramidal pedestal.It says
It is in both positions simultaneously very sufficient basis.For on from the density of electronic component this angle, IC is represented
The tip of electronics, but IC is a starting point again, be a kind of basic structural unit, be composition we live in it is most of
The basis of electronic system.Equally, IC is not only monolithic chip or basic electronic structure, and the type of IC is multifarious, thus
Demand and requirement for encapsulation is also different.
It is that chip is directly anchored in shell that current integrated circuit is mostly when packaged, when needing to replace to chip
Or it when maintenance, needs to take a long time to and takes out chip, not only increase the working strength of staff, simultaneously meeting
The efficiency that causes to replace chip or overhaul declines.
Utility model content
（One）The technical issues of solution
In view of the deficiencies of the prior art, the utility model provides a kind of integrated circuit package structure, solves current
It is that chip is directly anchored in shell that integrated circuit is mostly when packaged, when needing to replace chip or overhauled, is needed
Take a long time to and take out chip, not only increases the working strength of staff, while can cause to chip more
The problem of efficiency changed or overhauled declines.
（Two）Technical solution
To achieve the above object, the utility model provides the following technical solutions：A kind of integrated circuit package structure, including peace
Loading board, the upper surface of the mounting plate are fixedly connected with the lower surface for placing shell, place outer surface and the protecting crust inner wall of shell
Surface overlaps, and the upper surface of the protecting crust inner wall is fixedly connected by four telescopic rods with the upper surface of four pressing plates, and four
A telescopic rod is located at protecting crust inner wall upper surface close to the position of quadrangle, and the surface of four telescopic rods is socketed with bullet
Spring, and the both ends of four springs are fixedly connected with the upper surface of the upper surface of protecting crust inner wall and pressing plate respectively, and four pressing plates
Lower surface overlapped with the upper surface of chip, the lower surface of the chip and the upper surface of four supporting blocks overlap, and four
Supporting block, which is located at, places shell interior lower surface and is located at the position of quadrangle, and the lower surface of four supporting blocks in placement shell
The lower surface of wall is fixedly connected.
The left and right sides for placing shell are opened up respectively there are four card slot, and two, left side card slot and two, right side card slot
Inside offering the first screw thread, the position that the left and right sides of the protecting crust inner wall correspond to card slot offers first through hole,
And the second screw thread is offered in four first through hole, and the hand of spiral of first screw thread and the second screw thread is identical, and described
One screw thread and the second screw thread are connect with the first bolt thread, and the left and right sides for placing shell and protecting crust offer the
Two through-holes, and two the second through-holes are connected, second through-hole is located at the centre position of two card slots, and two the second through-holes
It is inside both provided with sealing ring, and two sealing rings in left side mutually overlap, and two sealing rings on right side mutually overlap.
Preferably, the mounting plate upper surface offers third through-hole close to the position of quadrangle, in the third through-hole
Third screw thread is offered, the third screw thread is connect with the second bolt thread.
Preferably, the lower surface of the protecting crust is provided with the first gasket, the lower surface of first gasket and peace
The upper surface of loading board overlaps.
Preferably, the upper surface for placing shell is provided with the second gasket, the upper surface of second gasket with it is anti-
The upper surface of protective case inner wall overlaps.
Preferably, the upper surface of the protecting crust offers several fourth holes, and the fourth hole is stretched positioned at four
The inside of contracting bar is provided with protective screen plate in the fourth hole.
Preferably, the shape for placing shell is rectangle, and the shape of the protecting crust is rectangle.
（Three）Advantageous effect
The utility model provides a kind of integrated circuit package structure, has following advantageous effect：
（1）, the integrated circuit package structure, pass through setting place shell, protecting crust, pressing plate, spring, the first screw thread, second
Screw thread and the first bolt can be fixed protecting crust when the first bolt is threadedly coupled with the first screw thread and second, to
Preferably chip can be protected, protecting crust is made to detach with shell is placed when the first bolt is with the first thread separation, to
It can make pressing plate that no longer chip be fixed, pressing plate can be made preferably to consolidate to chip using the elastic reaction of spring
It is fixed, to when needing to replace chip or overhauled, make protecting crust detach with shell is placed and can take out chip, save
The time of staff, while reducing the working strength of staff, while improving the effect replaced and overhauled to chip
Rate.
（2）, the integrated circuit package structure, by the way that the second through-hole and sealing ring is arranged, can more easily to chip into
It exercises and uses, while sealing ring can protect the lead for connecting chip.
（3）, the integrated circuit package structure, by the way that fourth hole and protective screen plate is arranged, can preferably to chip into
Row heat dissipation, while can effectively avoid sundries from entering using protective screen plate and place the normal work for influencing chip in shell, and
The utility model which has a compact structure and a reasonable design, it is highly practical.
Description of the drawings
Fig. 1 is the cross-sectional view that the utility model is faced；
Fig. 2 is the structural schematic diagram amplified at the utility model A.
In figure：1 mounting plate, 2 place shells, 3 protecting crusts, 4 telescopic rods, 5 pressing plates, 6 springs, 7 chips, 8 supporting blocks, 9 card slots,
10 first screw threads, 11 first through hole, 12 second screw threads, 13 first bolts, 14 second through-holes, 15 sealing rings, 16 third through-holes, 17
Third screw thread, 18 second bolts, 19 first gaskets, 20 second gaskets, 21 fourth holes, 22 protective screen plates.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
As shown in Figs. 1-2, the utility model provides a kind of technical solution：A kind of integrated circuit package structure, including installation
Plate 1,1 upper surface of mounting plate offer third through-hole 16 close to the position of quadrangle, third screw thread are offered in third through-hole 16
17, third screw thread 17 is threadedly coupled with the second bolt 18, by the way that the second bolt 18 is arranged, can preferably be carried out to mounting plate 1
It is fixed, so as to more easily use chip 7 fixation of chip 7, under the upper surface and placement shell 2 of mounting plate 1
Surface is fixedly connected, and the outer surface for placing shell 2 and the surface of 3 inner wall of protecting crust overlap, and the shape for placing shell 2 is rectangle, protection
The shape of shell 3 is rectangle, places shell 2 and protecting crust 3 by setting, can preferably protect chip 7, protecting crust 3
Lower surface is provided with the first gasket 19, and the lower surface of the first gasket 19 is overlapped with the upper surface of mounting plate 1, places shell 2
Upper surface is provided with the second gasket 20, and the upper surface of the second gasket 20 is overlapped with the upper surface of 3 inner wall of protecting crust, by setting
The first gasket 19 and the second gasket 20 are set, can preferably be closed to placing the gap between shell 2 and protecting crust 3,
The upper surface of 3 inner wall of protecting crust is fixedly connected by four telescopic rods 4 with the upper surface of four pressing plates 5, and four telescopic rods 4 divide
Not Wei Yu 3 inner wall upper surface of protecting crust close to the position of quadrangle, by the way that telescopic rod 4 is arranged, pressing plate 5 and spring 6 can be carried out
It is fixed, preferably chip 7 can be fixed, and the surface of four telescopic rods 4 is socketed with spring 6, and four springs 6
Both ends are fixedly connected with the upper surface of the upper surface of 3 inner wall of protecting crust and pressing plate 5 respectively, by the way that spring 6 is arranged, utilize spring 6
Elastic reaction, pressing plate 5 can be made preferably to be contacted with chip 7, more preferably chip 7 can be fixed, and four pressing plates 5
Lower surface is overlapped with the upper surface of chip 7, and the lower surface of chip 7 and the upper surface of four supporting blocks 8 overlap, and four supports
Block 8, which is located at, to be placed 2 interior lower surface of shell and is located at the position of quadrangle, and the lower surface of four supporting blocks 8 in placement shell 2
The lower surface of wall is fixedly connected, and by the way that supporting block 8 is arranged, can be preferably supported, can be made in placement shell 2 to chip 7
Air preferably circulate.
The left and right sides for placing shell 2 are opened up respectively there are four card slot 9, and two, left side card slot 9 and two, right side card slot 9
Inside offer the first screw thread 10, the position that the left and right sides of 3 inner wall of protecting crust correspond to card slot 9 offers first through hole
11, and the second screw thread 12 is offered in four first through hole 11, the first screw thread 10 is identical with the hand of spiral of the second screw thread 12,
First screw thread 10 and the second screw thread 12 are threadedly coupled with the first bolt 13, by the way that the first screw thread 10,12 and of the second screw thread is arranged
First bolt 13 can be fixed protecting crust 3 when the first bolt 13 is connect with the first screw thread 10, so as to better
Chip 7 is protected, it can be more easily by chip 7 out of placement shell 2 when the first bolt 13 is detached with the first screw thread 10
It takes out, the first bolt 13 can be fixed in the second screw thread 12, and the left and right sides for placing shell 2 and protecting crust 3 offer
Second through-hole 14, and two the second through-holes 14 are connected, the second through-hole 14 is located at the centre position of two card slots 9, and two
Sealing ring 15 is both provided in two through-holes 14, and two sealing rings 15 in left side mutually overlap, and two sealing rings 15 on right side
Mutually overlap joint can more easily use chip 7, while sealing ring by the way that the second through-hole 14 and sealing ring 15 is arranged
15 can protect the lead for connecting chip 7, and the upper surface of protecting crust 3 offers several fourth holes 21, four-way
Hole 21 is located at the inside of four telescopic rods 4, and protective screen plate 22 is provided in fourth hole 21, by the way that fourth hole 21 is arranged and prevents
Protecting wire net plate 22 can preferably radiate to chip 7, while effectively sundries can be avoided to enter using protective screen plate 22
Placing influences the normal work of chip 7 in shell 2.
Operation principle：When needing that chip 7 is replaced or overhauled, turning the first bolt 13 makes the first bolt 13 and
One screw thread 10 detaches, and so that protecting crust 3 is detached with shell 2 is placed, spring 6 extends when protecting crust 3 is raised above, when pressing plate 5
Conveniently chip 7 can be replaced or be overhauled, chip 7 is replaced by chip 7 from taking-up in shell 2 is placed when being detached with chip 7
Chip 7 is placed on after maintenance and is placed in shell 2, then contacts pressing plate 5 and the upper surface of chip 7, when protecting crust 3 is downward
In mobile process spring 6 can shorten, pressing plate 5 can be made preferably to consolidate to chip 7 using the elastic reaction of spring 6
Fixed, then turning the first bolt 13 makes the first bolt 13 be threadedly coupled with the first screw thread 10, so as to consolidate to protecting crust 3
It is fixed, preferably mounting plate 1 can be fixed using the second bolt 18, so as to preferably use chip 7.
It can to sum up obtain, the integrated circuit package structure, shell 2, protecting crust 3, pressing plate 5, spring 6, first are placed by setting
Screw thread 10, the second screw thread 12 and the first bolt 13, can be with when the first bolt 13 is connect with the first screw thread 10 and the second screw thread 12
Protecting crust 3 is fixed, so as to preferably protect chip 7, when the first bolt 13 is detached with the first screw thread 10
When so that protecting crust 3 is detached with shell 2 is placed, so as to so that pressing plate 5 is no longer fixed chip 7, utilize the elasticity of spring 6 to make
With that can make pressing plate 5 that preferably chip 7 be fixed, to when needing that chip 7 is replaced or overhauled, make protecting crust
3 detach with shell 2 is placed and can take out chip 7, save the time of staff, while reducing the work of staff
Intensity, while improving the efficiency replaced and overhauled to chip 7.
Meanwhile the integrated circuit package structure can be more easily to core by the way that the second through-hole 14 and sealing ring 15 is arranged
Piece 7 is used, while sealing ring 15 can protect the lead for connecting chip 7.
Meanwhile the integrated circuit package structure can be preferably to core by the way that fourth hole 21 and protective screen plate 22 is arranged
Piece 7 radiates, while can effectively avoid sundries from entering using protective screen plate 22 and place the interior influence chip 7 of shell 2 just
Often work, and the utility model which has a compact structure and a reasonable design, it is highly practical.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of integrated circuit package structure, including mounting plate（1）, it is characterised in that：The mounting plate（1）Upper surface with put
Set shell（2）Lower surface be fixedly connected, place shell（2）Outer surface and protecting crust（3）The surface of inner wall overlaps, the protecting crust
（3）The upper surface of inner wall passes through four telescopic rods（4）With four pressing plates（5）Upper surface be fixedly connected, and four telescopic rods（4）
It is located at protecting crust（3）Inner wall upper surface is close to the position of quadrangle, and four telescopic rods（4）Surface be socketed with spring
（6）, and four springs（6）Both ends respectively with protecting crust（3）The upper surface of inner wall and pressing plate（5）Upper surface be fixedly connected,
And four pressing plates（5）Lower surface and chip（7）Upper surface overlap joint, the chip（7）Lower surface and four supporting blocks
（8）Upper surface overlap joint, and four supporting blocks（8）It is located at placement shell（2）Interior lower surface is located at the position of quadrangle, and four
A supporting block（8）Lower surface with place shell（2）The lower surface of inner wall is fixedly connected；The placement shell（2）The left and right sides
Face is opened up respectively there are four card slot（9）, and two, left side card slot（9）With two, right side card slot（9）Inside offer the first screw thread
（10）, the protecting crust（3）The left and right sides of inner wall correspond to card slot（9）Position offer first through hole（11）, and four
A first through hole（11）Inside offer the second screw thread（12）, first screw thread（10）With the second screw thread（12）Hand of spiral
It is identical, first screw thread（10）With the second screw thread（12）With the first bolt（13）It is threadedly coupled, the placement shell（2）With it is anti-
Protective case（3）Left and right sides offer the second through-hole（14）, and two the second through-holes（14）It is connected, second through-hole
（14）Positioned at two card slots（9）Centre position, and two the second through-holes（14）Inside it is both provided with sealing ring（15）, and left side
Two sealing rings（15）Mutually overlap joint, and two sealing rings on right side（15）Mutually overlap joint.
2. a kind of integrated circuit package structure according to claim 1, it is characterised in that：The mounting plate（1）Upper surface
Position close to quadrangle offers third through-hole（16）, the third through-hole（16）Inside offer third screw thread（17）, described
Third screw thread（17）With the second bolt（18）It is threadedly coupled.
3. a kind of integrated circuit package structure according to claim 1, it is characterised in that：The protecting crust（3）Following table
Face is provided with the first gasket（19）, first gasket（19）Lower surface and mounting plate（1）Upper surface overlap joint.
4. a kind of integrated circuit package structure according to claim 1, it is characterised in that：The placement shell（2）Upper table
Face is provided with the second gasket（20）, second gasket（20）Upper surface and protecting crust（3）The upper surface of inner wall overlaps.
5. a kind of integrated circuit package structure according to claim 1, it is characterised in that：The protecting crust（3）Upper table
Face offers several fourth holes（21）, the fourth hole（21）Positioned at four telescopic rods（4）Inside, the four-way
Hole（21）Inside it is provided with protective screen plate（22）.
6. a kind of integrated circuit package structure according to claim 1, it is characterised in that：The placement shell（2）Shape
For rectangle, the protecting crust（3）Shape be rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820058948.6U CN208093539U (en) | 2018-01-15 | 2018-01-15 | A kind of integrated circuit package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820058948.6U CN208093539U (en) | 2018-01-15 | 2018-01-15 | A kind of integrated circuit package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208093539U true CN208093539U (en) | 2018-11-13 |
Family
ID=64065624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820058948.6U Active CN208093539U (en) | 2018-01-15 | 2018-01-15 | A kind of integrated circuit package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208093539U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112382617A (en) * | 2020-11-12 | 2021-02-19 | 广州市铂江光电有限公司 | Integrated circuit packaging structure |
| CN113588124A (en) * | 2021-08-17 | 2021-11-02 | 宿迁万泽电子科技有限公司 | Integrated monitoring devices of electronic product mainboard temperature rise |
-
2018
- 2018-01-15 CN CN201820058948.6U patent/CN208093539U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112382617A (en) * | 2020-11-12 | 2021-02-19 | 广州市铂江光电有限公司 | Integrated circuit packaging structure |
| CN112382617B (en) * | 2020-11-12 | 2021-11-02 | 江苏友润微电子有限公司 | Integrated circuit packaging structure |
| CN113588124A (en) * | 2021-08-17 | 2021-11-02 | 宿迁万泽电子科技有限公司 | Integrated monitoring devices of electronic product mainboard temperature rise |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191025 Address after: 201400 room 6494, building 5, No. 24, Hongwei Road, Nanqiao Town, Fengxian District, Shanghai Patentee after: Dinghe Industry (Shanghai) Co., Ltd. Address before: 312500 Dongchen 109, Dongchen Village, Dongcheng Town, Chengtan Town, Xinchang County, Shaoxing City, Zhejiang Province Patentee before: Zhejiang Haicheng De Chang Machinery Co., Ltd. |
|
| TR01 | Transfer of patent right |