CN113584549A - Diamond wire sanding device, diamond wire preparation method and diamond wire preparation system - Google Patents
Diamond wire sanding device, diamond wire preparation method and diamond wire preparation system Download PDFInfo
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- CN113584549A CN113584549A CN202110941444.5A CN202110941444A CN113584549A CN 113584549 A CN113584549 A CN 113584549A CN 202110941444 A CN202110941444 A CN 202110941444A CN 113584549 A CN113584549 A CN 113584549A
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 150
- 239000010432 diamond Substances 0.000 title claims abstract description 150
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 238000007747 plating Methods 0.000 claims abstract description 83
- 239000004576 sand Substances 0.000 claims abstract description 75
- 238000011084 recovery Methods 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 12
- 239000010936 titanium Substances 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 239000013589 supplement Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims description 3
- 238000011068 loading method Methods 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 16
- 238000010586 diagram Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000000428 dust Substances 0.000 description 5
- 229910001453 nickel ion Inorganic materials 0.000 description 5
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The application relates to the technical field of diamond wire preparation, in particular to diamond wire sanding equipment, a diamond wire preparation method and a diamond wire preparation system, which comprise: a power supply comprising a cathode and an anode; a first conductive roller electrically connected to the cathode, the first conductive roller and the second conductive roller having a first axis and a second axis parallel to each other, respectively; the first and second plating parts are arranged on two sides of a first plane which is determined by the first axis and the second axis together, and a first plating tank and a second plating tank are formed; and the sand feeding cylinder is provided with an extending direction and comprises a first opening and a second opening which are opposite to each other in the extending direction, the inner wall of the sand feeding cylinder is electrically connected with the anode, and the sand feeding cylinder is arranged between a second plane which passes through the first axis and is perpendicular to the first plane and a third plane which passes through the second axis and is perpendicular to the first plane. According to the diamond wire sanding equipment, the diamond wire preparation method and the diamond wire preparation system, sanding uniformity is effectively improved.
Description
Technical Field
The application relates to the technical field of diamond wire preparation, in particular to diamond wire sanding equipment, a diamond wire preparation method and a diamond wire preparation system.
Background
With the development of science and technology, the requirement on the cutting precision of precision components (such as silicon wafers) is continuously increased, which makes higher requirements on the quality of diamond wires for cutting precision components. The quality of the diamond wire is mainly determined by the uniformity and fastness of the coating of the steel wire electroplating sanding process.
However, in the prior electroplating sanding process of the diamond wire, sanding is not uniform easily due to equipment reasons, and even one side of the steel wire has sand and the other side has no sand.
In addition, in order to keep the distribution uniformity of the carborundum in the plating solution, a dispersing agent is added into the plating solution, so that the binding force of a plating layer is weak, and the problems of sand removal and plating removal are easy to occur; in order to guarantee the sanding amount, the routing speed of the sanding process of the diamond wire is low, so that sanding efficiency is low.
Disclosure of Invention
The application aims to provide diamond wire sanding equipment, a diamond wire preparation method and a diamond wire preparation system, so that the technical problem of uneven sanding in the prior art is solved to a certain extent.
According to a first aspect of the present application, there is provided a diamond wire sanding apparatus comprising:
a power supply comprising a cathode and an anode;
a first conductive roller electrically connected to the cathode, the first conductive roller having a first axis;
a second conductive roller having a second axis, the second axis being parallel to the first axis;
a first plated portion and a second plated portion respectively disposed on both sides of a first plane defined by the first axis and the second axis, the first plated portion and the second plated portion respectively having a first plating bath and a second plating bath;
the upper sand cylinder is provided with an extending direction and comprises a first opening and a second opening which are opposite to each other in the extending direction, diamond wires penetrate through the first opening and the second opening, the inner wall of the upper sand cylinder is electrically connected with the anode, and the upper sand cylinder is arranged between a second plane which passes through the first axis and is perpendicular to the first plane and a third plane which passes through the second axis and is perpendicular to the first plane.
Preferably, a plurality of sets of disposing grooves are formed in the outer side portion of the sand feeding cylinder, each set of disposing grooves includes a plurality of disposing grooves arranged in a direction surrounding the sand feeding cylinder, the diamond wire sand feeding device further includes a magnetic portion and a driving member, the magnetic portion is disposed in any one of the disposing grooves, the driving member is connected with the sand feeding cylinder, and the driving member drives the sand feeding cylinder to rotate around an axis extending in the extending direction and passing through the sand feeding cylinder.
According to the technical characteristics, the magnetic part and the driving component jointly act to form a rotating magnetic field, under the action of the rotating magnetic field, the carborundum in the carborundum plating solution in the upper sand cylinder is magnetized by the magnetic field, and under the action of magnetic force, the carborundum is suspended in the plating solution, so that the carborundum in the carborundum plating solution is uniformly distributed.
Preferably, in a use state of the diamond wire sanding device, the first plane is a vertical plane, and the extending direction is a vertical direction; the diamond wire extending between both the first conductive roller and the second conductive roller comprises a first segment flowing from the first conductive roller to the second conductive roller and a second segment flowing from the second conductive roller to the first conductive roller;
the diamond wire sanding device comprises a plurality of sanding cylinders, one part of the plurality of sanding cylinders is used for the first section to penetrate through, and the other part of the plurality of sanding cylinders is used for the second section to penetrate through.
According to the technical characteristics, relative to the same diamond wire, sanding can be performed at least through two sanding cylinders, namely the first sanding cylinder penetrated by the first section and the second sanding cylinder penetrated by the second section, so that the length of the sanding cylinders is prolonged, and a sanding interval is prolonged; for different root buddha's warrior attendant lines, buddha's warrior attendant line sanding equipment can carry out many buddha's warrior attendant lines and carry out the cladding material simultaneously and sand, has effectively improved sanding efficiency.
Preferably, the first conductive roller and the second conductive roller are each formed with an annular groove portion around which the diamond wire is wound; and defining the diamond wire to surround one circle after sequentially passing through the first conductive roller and the second conductive roller and then returning to the first conductive roller, wherein the annular groove part is set to enable the diamond wire to surround 3-5 circles.
According to the technical characteristics, the sanding interval of the same diamond wire is further prolonged.
Preferably, the system further comprises a carborundum plating solution circulating device, and the carborundum plating solution circulating device comprises:
a liquid inlet portion communicating with the first opening;
the titanium basket is formed on the inner wall of the upper sand cylinder, the titanium basket is electrically connected with the anode, the titanium basket and the inner wall jointly define a plurality of cavities, and any cavity contains a plating solution supplement metal block;
the recovery part is arranged below the second conductive roller in the use state of the diamond wire sanding device and is provided with an opening, the opening is arranged to enable the whole projection of the sanding cylinder to fall into the projection of the opening when the diamond wire sanding device is projected to the horizontal plane along the vertical direction, and a liquid outlet pipe communicated with the interior of the recovery groove is formed at the bottom of the recovery groove;
and the stirring part is communicated with the liquid outlet pipe and the liquid inlet part.
According to the technical characteristics, the circulation of the carborundum plating solution is formed, so that the carborundum concentration and the nickel ion concentration in the carborundum plating solution are kept stable.
Preferably, the number of the first openings and the number of the second openings are the same and are both multiple, and the diameter of any one of the first openings and the second openings is 2-5 mm;
the plating solution replenishes the metal mass into nickel balls.
According to the technical characteristics, the speed of the carborundum plating solution flowing out of the upper sand cylinder is slowed down, so that the carborundum plating solution can fill the whole upper sand cylinder.
Preferably, the diameters of the first conductive roller and the second conductive roller are equal and 200-250 mm;
the diamond wire sanding device further comprises a driving assembly, and the first conductive roller and the second conductive roller are driven by the driving assembly to be linked;
the first conductive roll further comprises a first conductive ring, the second conductive roll further comprises a second conductive ring, and both the first conductive ring and the second conductive ring are electrically connected to the cathode;
the power supply is configured such that a voltage between the anode and the cathode is regulated in a range of 0.5V to 10V.
According to the technical characteristics, the sand coating on the diamond wire is prevented from cracking due to overlarge curvature of the sand coating wound on the first conductive roller and the second conductive roller 5; the edge height of the diamond wire can be controlled by adjusting the voltage to control the thickness of the plating layer.
Preferably, the settling grooves are defined by portions of an inner spherical surface, and the radii of a plurality of inner spherical surfaces respectively defining the settling grooves arranged in the direction surrounding the sand feeding barrel are equal;
the number of the plurality of the placing grooves arranged along the direction surrounding the sand feeding cylinder is even and the placing grooves are arranged in pairs in an opposite mode.
According to the technical characteristics, the magnet blocks are uniformly distributed in the extending direction of the sand feeding cylinder, so that the magnetic field at each position of the sand feeding cylinder is uniformly distributed.
According to a second aspect of the present application, there is provided a method of manufacturing a diamond wire, the method being performed by the above-described diamond wire sanding apparatus, the method comprising the steps of:
s10, cleaning: cleaning the surface of the diamond wire to be sanded;
s20, sanding: loading the diamond wire into the diamond wire sanding device, respectively adding plating solutions into the first plating tank and the second plating tank, pre-plating the diamond wire through the first plating tank, sanding the diamond wire through the first conductive roller, the sanding cylinder and the second conductive roller in sequence, and then entering the second plating tank for reinforcement to enable the thickness of a plated layer to reach 0.1-0.05 mm;
s30, washing: washing the diamond wire with water at the temperature of 40-50 ℃;
s40, drying: and drying the diamond wire and coiling.
According to a third aspect of the present application there is provided a diamond wire preparation system comprising a diamond wire sanding apparatus as described above and/or a diamond wire preparation system for performing a diamond wire preparation method as described above.
Compared with the prior art, the beneficial effect of this application is:
the application provides a sand equipment on buddha's warrior attendant line for go up the sand more even, reduce one side of steel wire line and have the probability that the phenomenon of sand one side does not have sand appears. In addition, under the action of the rotating magnetic field, the addition of a dispersing agent in the plating solution is avoided, so that the binding force of the plating layer is enhanced; and a plurality of diamond wires are subjected to a sanding process simultaneously, so that sanding efficiency is effectively improved.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of an axonometric view of a diamond wire sanding apparatus provided in an embodiment of the present application;
fig. 2 is a schematic diagram of a front view of a diamond wire sanding apparatus provided in an embodiment of the present application;
FIG. 3 is a schematic diagram of a cross-sectional view taken along direction A-A of a diamond wire sanding apparatus provided in an embodiment of the present application;
FIG. 4 is an enlarged schematic structural diagram of a diamond wire sanding device B provided in FIG. 3;
fig. 5 is a schematic diagram of a flowchart of a method for manufacturing a diamond wire according to an embodiment of the present application.
Reference numerals:
1-diamond wire; 2-pre-plating bath; 3-a first conductive roller; 31-a first conductive ring; 4-sanding component; 40-liquid inlet pipe; 41-sanding; 42-a magnet block; 43-a belt motor; 44-a belt; 5-a second conductive roller; 51-a second conductive ring; 6-a plating solution recovery tank; 61-a liquid outlet pipe; 7-main plating bath; 8-a rotating electrical machine; 81-conductive roller synchronous belt.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments.
The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Fig. 1 is a schematic structural diagram of an axonometric view of a diamond wire sanding apparatus provided in an embodiment of the present application; fig. 2 is a schematic diagram of a front view of a diamond wire sanding apparatus provided in an embodiment of the present application; FIG. 3 is a schematic diagram of a cross-sectional view taken along direction A-A of a diamond wire sanding apparatus provided in an embodiment of the present application; FIG. 4 is an enlarged schematic structural diagram of a diamond wire sanding device B provided in FIG. 3; fig. 5 is a schematic diagram of a flowchart of a method for manufacturing a diamond wire according to an embodiment of the present application.
The diamond wire sanding apparatus, the diamond wire manufacturing method, and the diamond wire manufacturing system according to some embodiments of the present application are described below with reference to fig. 1 to 4.
Referring to fig. 1 to 4, a first aspect of the embodiments of the present application provides a diamond wire sanding apparatus, which includes a power supply, a first conductive roller 3, a second conductive roller 5, a pre-plated portion, a main plated portion, a sanding component 4, and a diamond grain plating solution circulating system.
Specifically, the first conductive roller 3 has a first axis, and the second conductive roller 5 has a second axis parallel to the first axis. As shown in fig. 1, preferably, the first plane defined by both the first axis and the second axis may be a vertical plane. The diameters of the first conductive roller 3 and the second conductive roller 5 may be equal and the diameters of the two may be 200 to 250 mm. Thus, the curvature radius of the first conductive roller 3 and the second conductive roller 5 is large enough, and the sand coating on the diamond wire 1 is prevented from cracking due to overlarge curvature of the sand coating wound on the first conductive roller 3 and the second conductive roller 5; in addition, the vertical arrangement of the sanding cylinder 41 is ensured, so that the circulation system of the carborundum plating solution can realize circulation by utilizing the action of gravity.
In addition, the diamond wire sanding device further comprises a driving assembly, and the first conductive roller 3 and the second conductive roller 5 are driven by the driving assembly to be linked. Preferably, the driving assembly is formed as a rotating motor 8, and both the first conductive roller 3 and the second conductive roller 5 are connected via a conductive roller timing belt 81, so that the first conductive roller 3 and the second conductive roller 5 are interlocked. One of the first conductive roller 3 and the second conductive roller 5 is disposed coaxially with the rotating motor 8. Preferably, as shown in fig. 3, the first conductive roller 3 is disposed coaxially with the rotating motor 8.
In addition, the embodiment further comprises a power supply, and the power supply comprises a cathode and an anode. As shown in fig. 3, the first conductive roller 3 further includes a first conductive ring 31 disposed at an end of the first conductive roller 3 away from the rotating motor 8, and the second conductive roller 5 further includes a second conductive ring 51 disposed at an end of the second conductive roller 5 away from the conductive roller timing belt 81. Both the first conductive roller 3 and the second conductive roller 5 are electrically connected to a cathode (a cathode included in a power supply which also includes an anode, which will be mentioned in the following description) via a first conductive ring 31 and a second conductive ring 51, respectively. Therefore, the diamond wire 1 wound between the first conductive roller 3 and the second conductive roller 5 is electrified, so that radial current is formed between the diamond wire 1 and a titanium basket described below to drive diamond grains to be attached to the diamond wire 1, and the arrangement mode of the titanium basket will be described in detail below.
In the embodiment, the pre-plated part and the main plated part are respectively provided with the pre-plating bath 2 and the main plating bath 7 on both sides of the first plane. Preferably, as shown in fig. 1, both the pre-plating bath 2 and the main plating bath 7 are formed as square-shaped baths, the pre-plating part is formed with a first wire inlet and a first wire outlet, the first wire inlet is arranged at one end of the pre-plating part far away from the first conductive roller 3, and the first wire outlet is arranged at one end of the pre-plating part close to the first conductive roller 3. Similarly, the main plating part is formed with a second wire inlet and a second wire outlet, the second wire inlet is disposed at one end of the main plating part close to the first conductive roller 3, and the second wire outlet is disposed at one end of the main plating part far from the first conductive roller 3. Preferably, as shown in fig. 1 and 2, the first wire inlet, the first wire outlet, the second wire inlet and the second wire outlet are all arranged at the same height and are equal to the height of the upper edge of the first conductive roller 3.
In an embodiment, the diamond wire sanding device further comprises a sanding assembly 4, the sanding assembly 4 comprising a sanding cylinder 41 having an extension direction. As shown in fig. 1, the sanding cylinder 41 is disposed between a second plane perpendicular to the first plane passing through the first axis and a third plane perpendicular to the first plane passing through the second axis. Preferably, the direction of extension is a vertical direction. The sanding cylinder 41 includes a first opening and a second opening opposite to each other in the extending direction, both of which are penetrated by the diamond wire 1. Preferably, the number of the first opening and the number of the second opening are the same and are both multiple, and the diameter of any one of the first opening and the second opening is 2-5 mm, so that the speed of the carborundum plating solution flowing out of the upper sand cylinder 41 is reduced, and the carborundum plating solution can be ensured to fill the whole upper sand cylinder 41.
In addition, as shown in fig. 4, a plurality of sets of disposition grooves are formed at an outer side portion of the sand feeding barrel 41, each set of disposition grooves includes a plurality of disposition grooves arranged in a direction surrounding the sand feeding barrel 41, the disposition grooves are defined by portions of inner spherical surfaces, the radii of the inner spherical surfaces respectively defining the disposition grooves arranged in the direction surrounding the sand feeding barrel 41 are equal, and the disposition grooves arranged in the direction surrounding the sand feeding barrel 41 are even in number and arranged opposite to each other.
Preferably, each set of the seating groove groups comprises a first seating groove, a second seating groove, a third seating groove and a fourth seating groove, an axis of the first seating groove and an axis of the third seating groove coincide to define a first axis, an axis of the second seating groove and an axis of the fourth seating groove coincide to define a second axis, and the first axis and the second axis are perpendicular to each other and on the same horizontal plane. The upper sand cylinder 41 is provided with six groups of arrangement groove groups which are uniformly distributed along the axial direction of the upper sand cylinder 41. So set up, guaranteed magnet piece 42 evenly distributed on the extending direction of going up sand section of thick bamboo 41, will specifically explain about magnet piece 42's mode of setting below.
Optionally, the sanding assembly 4 comprises a plurality of sets of sanding cartridges; each group of the sanding cylinder groups comprises a first sanding cylinder and a second sanding cylinder, the first sanding cylinder is arranged on one side, close to the main coating part, of the central plane, the second sanding cylinder and the first sanding cylinder are arranged on the other side of the central plane in an opposite mode, and the distance from the axis of the first sanding cylinder to the central plane and the distance from the axis of the second sanding cylinder to the central plane are both equal to the radius of the first conductive roller 3; each group of the upper sand cylinder groups are arranged side by side along the axis direction of the first conductive roller 3, and the distance between any two adjacent groups of the upper sand cylinder groups is equal.
In addition, the sanding assembly 4 further includes a magnetic portion, which may be formed as a magnet block 42, and a driving member, in which the magnet block 42 is provided in any of the seating grooves. The drive member is connected to the sanding cylinder 41, and the drive member drives the sanding cylinder 41 to rotate about an axis extending in the extension direction through the sanding cylinder 41. Thus, a rotating magnetic field is formed inside each upper sand cylinder 41, under the action of the rotating magnetic field, the diamond grains in the diamond grain plating solution inside the upper sand cylinder 41 are magnetized by the magnetic field, and under the action of the magnetic force, the diamond grains are suspended in the plating solution, so that the diamond grains in the diamond grain plating solution are uniformly distributed.
Preferably, the driving means may be formed as a belt motor 43, the belt motor 43 may include a first belt motor and a second belt motor, each set of the first sand feeding cylinders is rotationally driven via the first belt motor, the first belt motor is juxtaposed with the first sand feeding cylinder of each set of the sand feeding cylinders, the first belt motor is connected via a belt with the first sand feeding cylinder of one set of the sets of the sand feeding cylinders close to the first belt motor, and the first sand feeding cylinders of any adjacent two sets of each set of the sand feeding cylinders are connected via a belt 44; each set of the second sand feeding cylinders is driven to rotate by the second belt motor, the second belt motor is arranged in parallel with the second sand feeding cylinders in each set of the second sand feeding cylinders, the second belt motor is connected with the second sand feeding cylinders in one set of the sets of the upper sand feeding cylinders by a belt 44, and the second sand feeding cylinders in any two adjacent sets of the upper sand feeding cylinders are connected by the belt 44. The arrangement of the step-by-step transmission belt ensures the synchronous rotation of the sand feeding cylinders and ensures the stability of transmission among the sand feeding cylinders 41.
In an embodiment, the diamond wire sanding device further comprises a diamond dust plating solution circulating system, and the diamond dust plating solution circulating system comprises: a liquid inlet pipe 40 communicated with the first opening, a titanium basket, a recovery part and a stirring part.
Specifically, a titanium basket is formed on a portion of the inner wall of the upper sand cylinder 41, the titanium basket is electrically connected with the anode, so that an electric field is formed between the diamond wire 1 penetrating between the first conductive roller 3 and the second conductive roller 5 and the inner wall of the upper sand cylinder 41, a radial current is formed along the radial direction of the cross section of the upper sand cylinder 41, and under the action of the radial current, nickel ions and magnetized diamond dust in the plating solution move towards the direction of the diamond wire 1 to realize plating. Preferably, the power supply is configured such that the voltage between the anode and the cathode is regulated in the range of 0.5V to 10V. In this way, the thickness of the plating layer can be controlled by adjusting the voltage, thereby controlling the cutting height of the diamond wire 1.
The titanium basket and the inner wall jointly define a plurality of cavities, any cavity contains a plating solution supplement metal block, and preferably, the plating solution supplement metal block can be formed into a nickel metal ball. Therefore, under the action of the electric field, the nickel metal ball continuously ionizes nickel ions to supplement the nickel ions lost by the plating layer, and the concentration of the nickel ions in the plating solution is ensured.
Further, as shown in fig. 2, the recovery part is formed with a plating solution recovery tank 6, the recovery part is disposed below the second conductive roller 5 in a use state of the diamond wire sanding apparatus, the plating solution recovery tank 6 has an opening, the opening is set such that the projection of the sanding cylinder 41 falls entirely within the projection of the opening when the diamond wire sanding apparatus is projected to a horizontal plane in a vertical direction, a liquid outlet pipe 61 communicating with the inside of the plating solution recovery tank 6 is formed at the bottom of the plating solution recovery tank 6, and the stirring part can add diamond dust and communicate with both the liquid outlet pipe 61 and the liquid inlet part. So that the emery plating solution is circulated among the upper sand cylinder 41, the recovery unit, and the stirring unit.
Further, as shown in fig. 1, the first conductive roller 3 and the second conductive roller 5 are each formed with an annular groove portion around which the diamond wire 1 is wound. Defining a circle of the diamond wire 1 passing through the first conductive roller 3, the first section flowing from the first conductive roller 3 to the second conductive roller 5, the second section flowing from the second conductive roller 5 to the first conductive roller 3 and the second conductive roller 5 and then returning to the first conductive roller 3, wherein the annular groove portion is configured to make 3-5 circles of the diamond wire 1. Specifically, the first sanding cylinder is penetrated by the first section, and the second sanding cylinder is penetrated by the second section. The diamond wire sanding device can comprise a plurality of annular grooves, and the number of the annular grooves is relative to the number of groups of the sanding cylinder groups. In other words, the diamond wire sanding device can perform simultaneous sanding of a plurality of diamond wires, and the number of the diamond wires which can be sanded simultaneously is consistent with the number of the annular grooves and the number of the groups of sanding sets (for example, as shown in fig. 1, the number of the diamond wires which are sanded simultaneously is four for the number of the annular grooves and the number of the groups of sanding sets).
The second aspect of the embodiments of the present application also provides a method for manufacturing a diamond wire, and referring to fig. 5, a flowchart of the method for manufacturing a diamond wire provided by the present embodiment is shown, and the method for manufacturing a diamond wire includes the following steps.
S10, cleaning: cleaning the surface of the diamond wire 1 to be sanded, removing dirt (for example, oil stain and dust) on the surface of the diamond wire 1 to be sanded, and preparing for subsequent surface plating.
S20, sanding: the diamond wire 1 is loaded into the diamond wire sanding device, plating solutions are respectively added into the first plating tank and the second plating tank, and the diamond wire 1 is subjected to pre-plating treatment through the first plating tank, so that a nickel metal layer is formed on the surface of the diamond wire 1 to improve the conductivity of the diamond wire 1, and radial current is generated in the sanding process. Then, the sand is repeatedly wound for 3-5 weeks among the first conductive roller 3, the first sand feeding cylinder, the second sand feeding cylinder and the second conductive roller 5 in sequence, and the sand feeding treatment is carried out; and then, the steel plate enters the second plating tank for reinforcement treatment, so that the thickness of a plating layer reaches 0.1-0.05 mm.
S30, washing: and (3) carrying out water washing treatment on the diamond wire 1, wherein the water temperature of the water washing is 40-50 ℃, and removing the residual redundant plating solution on the surface.
S40, drying: and drying and coiling the diamond wire 1.
A third aspect of embodiments of the present application also provides a diamond wire preparation system, which is the above-mentioned diamond wire sanding apparatus and/or diamond wire preparation system for performing the above-mentioned diamond wire preparation method. Have all beneficial technological effects of this diamond wire sanding equipment, same technical feature and beneficial effect are no longer repeated.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. A diamond wire sanding apparatus, comprising:
a power supply comprising a cathode and an anode;
a first conductive roller electrically connected to the cathode, the first conductive roller having a first axis;
a second conductive roller having a second axis, the second axis being parallel to the first axis;
a first plated portion and a second plated portion respectively disposed on both sides of a first plane defined by the first axis and the second axis, the first plated portion and the second plated portion respectively having a first plating bath and a second plating bath;
the upper sand cylinder is provided with an extending direction and comprises a first opening and a second opening which are opposite to each other in the extending direction, diamond wires penetrate through the first opening and the second opening, the inner wall of the upper sand cylinder is electrically connected with the anode, and the upper sand cylinder is arranged between a second plane which passes through the first axis and is perpendicular to the first plane and a third plane which passes through the second axis and is perpendicular to the first plane.
2. The diamond wire sanding device according to claim 1, wherein a plurality of sets of seating grooves are formed in an outer side portion of the sanding cylinder, each set of seating grooves includes a plurality of seating grooves arranged in a direction surrounding the sanding cylinder, the diamond wire sanding device further includes a magnetic portion and a driving member, the magnetic portion is provided in any one of the seating grooves, the driving member is connected with the sanding cylinder, and the driving member drives the sanding cylinder to rotate about an axis extending in the extending direction and passing through the sanding cylinder.
3. A diamond wire sanding apparatus according to claim 1,
in the use state of the diamond wire sanding device, the first plane is a vertical plane, and the extending direction is a vertical direction; the diamond wire extending between both the first conductive roller and the second conductive roller comprises a first segment flowing from the first conductive roller to the second conductive roller and a second segment flowing from the second conductive roller to the first conductive roller;
the diamond wire sanding device comprises a plurality of sanding cylinders, one part of the plurality of sanding cylinders is used for the first section to penetrate through, and the other part of the plurality of sanding cylinders is used for the second section to penetrate through.
4. A diamond wire sanding apparatus according to claim 1,
the first conductive roller and the second conductive roller are both provided with annular groove parts for the diamond wires to surround; and defining the diamond wire to surround one circle after sequentially passing through the first conductive roller and the second conductive roller and then returning to the first conductive roller, wherein the annular groove part is set to enable the diamond wire to surround 3-5 circles.
5. The diamond wire sanding apparatus according to any one of claims 1 to 4, further comprising a diamond grain plating solution circulating device comprising:
a liquid inlet portion communicating with the first opening;
the titanium basket is formed on the inner wall of the upper sand cylinder, the titanium basket is electrically connected with the anode, the titanium basket and the inner wall jointly define a plurality of cavities, and any cavity contains a plating solution supplement metal block;
the recovery part is arranged below the second conductive roller in the use state of the diamond wire sanding device and is provided with an opening, the opening is arranged to enable the whole projection of the sanding cylinder to fall into the projection of the opening when the diamond wire sanding device is projected to the horizontal plane along the vertical direction, and a liquid outlet pipe communicated with the interior of the recovery groove is formed at the bottom of the recovery groove;
and the stirring part is communicated with the liquid outlet pipe and the liquid inlet part.
6. Diamond wire sanding apparatus according to claim 5,
the number of the first openings and the number of the second openings are the same and are multiple, and the diameter of any one of the first openings and the second openings is 2-5 mm;
the plating solution replenishes the metal mass into nickel balls.
7. A diamond wire sanding apparatus according to claim 1,
the diameters of the first conductive roller and the second conductive roller are equal and are 200-250 mm;
the diamond wire sanding device further comprises a driving assembly, and the first conductive roller and the second conductive roller are driven by the driving assembly to be linked;
the first conductive roll further comprises a first conductive ring, the second conductive roll further comprises a second conductive ring, and both the first conductive ring and the second conductive ring are electrically connected to the cathode;
the power supply is configured such that a voltage between the anode and the cathode is regulated in a range of 0.5V to 10V.
8. A diamond wire sanding apparatus according to claim 2,
the placing grooves are defined by parts of inner spherical surfaces, and the radii of the inner spherical surfaces respectively defining the placing grooves arranged along the direction surrounding the sand feeding barrel are equal;
the number of the plurality of the placing grooves arranged along the direction surrounding the sand feeding cylinder is even and the placing grooves are arranged in pairs in an opposite mode.
9. A method of manufacturing a diamond wire, the method being performed by the diamond wire sanding apparatus according to any one of claims 1 to 8, the method comprising the steps of:
s10, cleaning: cleaning the surface of the diamond wire to be sanded;
s20, sanding: loading the diamond wire into the diamond wire sanding device, respectively adding plating solutions into the first plating tank and the second plating tank, pre-plating the diamond wire through the first plating tank, sanding the diamond wire through the first conductive roller, the sanding cylinder and the second conductive roller in sequence, and then entering the second plating tank for reinforcement to enable the thickness of a plated layer to reach 0.1-0.05 mm;
s30, washing: washing the diamond wire with water at the temperature of 40-50 ℃;
s40, drying: and drying the diamond wire and coiling.
10. A diamond wire preparation system comprising the diamond wire sanding apparatus of any one of claims 1 to 8 and/or for performing the diamond wire preparation method of claim 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110941444.5A CN113584549A (en) | 2021-08-17 | 2021-08-17 | Diamond wire sanding device, diamond wire preparation method and diamond wire preparation system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110941444.5A CN113584549A (en) | 2021-08-17 | 2021-08-17 | Diamond wire sanding device, diamond wire preparation method and diamond wire preparation system |
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Application publication date: 20211102 |