CN113582128A - 一种硅麦叠装wb封装工艺 - Google Patents
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Abstract
本发明公开了一种硅麦叠装WB封装工艺,工艺步骤包括:(1)在PCB基板上固定ASIC集成芯片;(2)在ASIC集成芯片正面点涂MEMS感应器贴片固定胶,以及在焊接点点位点涂锡膏或导电银胶;(3)在MEMS感应器背面设计相对应的焊接点,把MEMS感应器定位摆放在ASIC集成芯片正面对应位置,然后经过回流焊或烘烤实现ASIC集成芯片与MEMS感应器上的焊接点导通;(4)在PCB基板上涂锡后组装外壳,外壳与PCB基板形成包裹MEMS感应器及ASIC集成芯片的腔体。本发明采用叠片焊接点点对点式设计封装布局,减少产品设计摆件空间,便于产品小型化;封装减少了金线使用,可降低产品作业成本、简化封装工艺流程。
Description
技术领域
本发明属于半导体封装技术领域,具体是涉及一种硅麦叠装WB封装工艺。
背景技术
现有常规硅麦设计封装是在一块PCB基板上平行摆放MEMS感应器及ASIC集成芯片,使用贴片胶实现MEMS感应器及ASIC集成芯片与PCB的固定,其次通过专用设备利用金线分别把MEMS感应器与ASIC集成芯片、 ASIC集成芯片与PCB基板上的PAD(焊接点)连接导通,然后通过在PCB上对应位置涂锡后组装外壳,经回流焊后外壳与PCB基板固定使外壳完全包裹MEMS感应器及ASIC集成芯片形成需要的腔体,最终实现产品声学转化为电信号功能要求。这样存在的缺陷是:1、封装需要2次使用金线及对应打金线专用设备,生产成本较高;2、产品结构设计不够紧凑,产品体积偏大;3、生产工艺较复杂。
发明内容
本发明的目的在于针对上述问题,提供一种硅麦叠装WB封装工艺,采用叠片焊接点点对点式设计封装布局,可以简化生产工艺,封装只需使用一次金线及对应打金线专用设备,降低了生产成本较高,同时产品结构更紧凑,有利于产品体积小型化。
本发明的技术方案是这样实现的。
一种硅麦叠装WB封装工艺,其特征在于,工艺步骤如下:
(1)在PCB基板上先利用贴片固定胶固定ASIC集成芯片;
(2)使用专用设备利用金线把ASIC集成芯片与PCB基板上焊接点连通;
(3)在ASIC集成芯片正面点涂MEMS感应器贴片固定胶,以及在焊接点点位点涂锡膏或导电银胶;
(4)在MEMS感应器背面设计与ASIC集成芯片正面焊接点相对应的焊接点,把MEMS感应器利用相应设备定位摆放在ASIC集成芯片正面对应位置,然后经过回流焊或烘烤实现ASIC集成芯片与MEMS感应器上的焊接点导通;
(5)通过在PCB基板上对应位置涂锡后组装外壳,经回流焊后外壳与PCB基板固定使外壳完全包裹MEMS感应器及ASIC集成芯片形成需要的腔体,最终实现产品声学转化为电信号功能要求。
进一步地,上述的硅麦叠装WB封装工艺,其特征在于,步骤(3)中MEMS感应器贴片固定胶点涂在ASIC集成芯片正面非焊接点区域。
本发明的有益效果是:1、本发明采用叠片焊接点点对点式设计封装布局,减少产品设计摆件空间,可以实现产品小型化;2、采用叠片焊接点点对点式设计封装布局,封装只需使用一次金线及对应打金线专用设备,可以降低产品生产成本、简化封装工艺流程。
附图说明
图1为本发明工艺封装的产品结构示意图。
图2为现有技术工艺封装的产品结构示意图。
在图中,1、PCB基板,2、ASIC集成芯片,3、MEMS感应器,4、外壳,5、进音孔,6、贴片固定胶,7、焊接点,8、焊接点连接锡膏或导电银胶,9、外壳连接锡膏,10、金线,11、COB胶。
具体实施方式
下面通过实施例以及说明书附图对本发明的技术方案做进一步地详细说明。
如图1所示,本发明的一种硅麦叠装WB封装工艺,工艺步骤如下:
(1)在PCB基板1上先利用贴片固定胶6固定ASIC集成芯片2。
(2)使用专用设备利用金线10把ASIC集成芯片2与PCB基板1上的焊接点7连通。
(3)在ASIC集成芯片2正面非焊接点区域点涂MEMS感应器贴片固定胶6及在焊接点7的点位点涂焊接点连接锡膏或导电银胶8。
(4)在MEMS感应器3背面设计与ASIC集成芯片2正面焊接点7相对应的焊接点7,把MEMS感应器3利用相应设备定位摆放在ASIC集成芯片2正面对应位置,然后经过回流焊或烘烤,锡膏或导电银胶8将ASIC集成芯片2上的焊接点7与MEMS感应器3上的焊接点7导通。
(4)通过在PCB基板1上对应位置涂外壳连接锡膏9后组装外壳4,所述外壳4上设有进音孔5,经回流焊后外壳4与PCB基板1固定使外壳4完全包裹MEMS感应器3及ASIC集成芯片2形成需要的腔体,最终实现产品声学转化为电信号功能要求。
如图2所示,现有技术的硅麦叠装WB封装工艺,则是在PCB基板1上利用贴片固定胶6分别固定ASIC集成芯片2、MEMS感应器3(ASIC集成芯片2、MEMS感应器3并排设置在PCB基板1上),然后通过专用设备利用金线10分别把ASIC集成芯片2与PCB基板1上的焊接点、MEMS感应器3与ASIC集成芯片2上的焊接点连接导通(两次用到金线10),然后通过在PCB基板1上对应位置涂锡后组装外壳4,经回流焊后外壳4与PCB基板1固定,使外壳4完全包裹MEMS感应器3及ASIC集成芯片2形成需要的腔体,最终实现产品声学转化为电信号功能要求。所述外壳4上设有进音孔5,处于进音孔5下方的ASIC集成芯片2上的金线10连接点需要涂上COB胶11。
从以上对比来看,本发明的硅麦叠装WB封装工艺,采用叠片焊接点点对点式设计封装布局,减少产品设计摆件空间,可以实现产品小型化;并且封装只需使用一次金线及对应打金线专用设备,可以降低产品生产成本。
以上所述是本发明的优选实施例,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本发明的保护范围。
Claims (2)
1.一种硅麦叠装WB封装工艺,其特征在于,工艺步骤如下:
(1)在PCB基板上先利用贴片固定胶固定ASIC集成芯片;
(2)在ASIC集成芯片正面点涂MEMS感应器贴片固定胶,以及在焊接点点位点涂锡膏或导电银胶;
(3)在MEMS感应器背面设计与ASIC集成芯片正面焊接点相对应的焊接点,把MEMS感应器利用相应设备定位摆放在ASIC集成芯片正面对应位置,然后经过回流焊或烘烤实现ASIC集成芯片与MEMS感应器上的焊接点导通;
(4)通过在PCB基板上对应位置涂锡后组装外壳,经回流焊后外壳与PCB基板固定使外壳完全包裹MEMS感应器及ASIC集成芯片形成需要的腔体,最终实现产品声学转化为电信号功能要求。
2.根据权利要求1所述的硅麦叠装WB封装工艺,其特征在于:步骤(3)中MEMS感应器贴片固定胶点涂在ASIC集成芯片正面非焊接点区域。
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CN116193972A (zh) * | 2023-04-27 | 2023-05-30 | 宁波中车时代传感技术有限公司 | 一种传感器制备方法及结构 |
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