CN113579550A - Brazing filler metal paste for stainless steel brazing without brazing flux and preparation method thereof, copper-manganese-nickel-cobalt brazing filler metal and application - Google Patents
Brazing filler metal paste for stainless steel brazing without brazing flux and preparation method thereof, copper-manganese-nickel-cobalt brazing filler metal and application Download PDFInfo
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- 238000005219 brazing Methods 0.000 title claims abstract description 142
- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 66
- 239000010935 stainless steel Substances 0.000 title claims abstract description 66
- 239000000945 filler Substances 0.000 title claims abstract description 59
- 239000002184 metal Substances 0.000 title claims abstract description 58
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 58
- 230000004907 flux Effects 0.000 title claims abstract description 18
- RDNYEBBIOKDIBV-UHFFFAOYSA-N [Mn].[Co].[Ni].[Cu] Chemical compound [Mn].[Co].[Ni].[Cu] RDNYEBBIOKDIBV-UHFFFAOYSA-N 0.000 title claims abstract description 9
- 238000002360 preparation method Methods 0.000 title abstract description 22
- 238000007716 flux method Methods 0.000 title description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 62
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 45
- 229910000679 solder Inorganic materials 0.000 claims abstract description 45
- 239000010949 copper Substances 0.000 claims abstract description 43
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000005543 nano-size silicon particle Substances 0.000 claims abstract description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910001868 water Inorganic materials 0.000 claims abstract description 13
- 239000002994 raw material Substances 0.000 claims abstract description 10
- 229910052911 sodium silicate Inorganic materials 0.000 claims abstract description 6
- 239000004115 Sodium Silicate Substances 0.000 claims abstract description 5
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 claims abstract description 4
- 239000000843 powder Substances 0.000 claims description 13
- 239000011734 sodium Substances 0.000 claims description 9
- 239000000725 suspension Substances 0.000 claims description 9
- 230000006698 induction Effects 0.000 claims description 7
- 239000007864 aqueous solution Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 230000035484 reaction time Effects 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 238000003892 spreading Methods 0.000 description 9
- 230000007480 spreading Effects 0.000 description 9
- 238000005476 soldering Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000008367 deionised water Substances 0.000 description 6
- 229910021641 deionized water Inorganic materials 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 239000010963 304 stainless steel Substances 0.000 description 3
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- QDOXWKRWXJOMAK-UHFFFAOYSA-N chromium(III) oxide Inorganic materials O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 210000003097 mucus Anatomy 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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- 239000000243 solution Substances 0.000 description 1
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- 239000000126 substance Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention belongs to the technical field of brazing materials, and particularly relates to brazing filler metal paste for stainless steel brazing without a brazing flux, a preparation method of the brazing filler metal paste, copper-manganese-nickel-cobalt brazing filler metal and application of the brazing filler metal paste. The solder paste mainly comprises water, sodium silicate, nano silicon dioxide and copper-based solder; the solder paste is prepared from the following raw materials in parts by weight: 70-80 parts of copper-based solder, 3-5 parts of nano silicon dioxide, 1-3 parts of sodium hydroxide and 10-15 parts of water. The brazing filler metal paste contains water, sodium silicate and nano silicon dioxide paste, and is dehydrated at high temperature to form a film during brazing, wherein the nano silicon dioxide can construct a three-dimensional network structure, has huge surface area and great activity, and can enhance the strength and high temperature resistance of the film to form a high temperature resistant film. The film isolates air, protects the brazed surface and molten solder from being oxidized, and realizes the fluxless brazing of stainless steel in atmospheric environment; meanwhile, the nano silicon dioxide particles are pinned in the brazing seams, and the strength of the stainless steel joint is enhanced.
Description
Technical Field
The invention belongs to the technical field of brazing materials, and particularly relates to brazing filler metal paste for stainless steel brazing without a brazing flux, a preparation method of the brazing filler metal paste, copper-manganese-nickel-cobalt brazing filler metal and application of the brazing filler metal paste.
Background
Stainless steel has excellent high-temperature performance and good corrosion resistance, and is widely used for manufacturing heat exchanger pipelines. In recent years, stainless steel heat exchangers have become popular heat exchange devices in industrial sectors such as metallurgy, chemical industry, energy, traffic, light industry, food and the like. Brazing is a key link in the manufacture of stainless steel heat exchanger pipelines and determines the service life of the heat exchanger. Along with the improvement of the life quality of people, the requirement on the welding quality of the stainless steel heat exchanger is higher and higher. The quality of the weld of a stainless steel heat exchanger depends to a large extent on the brazing material used.
H1CuNi30-2-0.2(Ni 27-30; Si 1.5-2.0; B0.2, Cu allowance) widely used in the aviation industry, has a melting temperature range of 1080-1200 ℃, has a working temperature of 600 ℃ (Zhouxi, braze, high-temperature copper-based brazing filler metal), has the advantages of good high-temperature performance, low cost and good compatibility with stainless steel, and is commonly used for brazing stainless steel in a protective atmosphere furnace. However, the existing H1CuNi30-2-0.2 brazing filler metal has no self-fluxing property, when stainless steel is brazed in an atmosphere furnace, a dense oxide film on the surface of the stainless steel is difficult to remove when the brazing temperature is lower than 1000 ℃, and stainless steel grains grow up when the brazing temperature is higher than 1000 ℃, which both affect the welding quality of the stainless steel and have higher cost. When the H1CuNi30-2-0.2 copper-based brazing filler metal is used for brazing stainless steel in an atmospheric environment by adopting a brazing flux, a better joint can be obtained, but most of the brazing flux contains fluoride, and the brazing flux is volatile in the brazing process, pollutes the environment and is harmful to human health; the residual brazing flux residues are high in corrosivity and prone to corroding stainless steel pipelines, leakage is caused, and the service life of the stainless steel heat exchanger is influenced.
Disclosure of Invention
The invention aims to provide a brazing filler metal paste for stainless steel brazing without a brazing flux, which can realize stainless steel brazing without the brazing flux in an atmospheric environment and improve the joint strength.
The second purpose of the invention is to provide a preparation method of the brazing filler metal paste for the stainless steel fluxless brazing.
The third purpose of the invention is to provide a copper-manganese-nickel-cobalt solder for stainless steel brazing.
A fourth object of the present invention is to provide the use of the above-mentioned braze paste for induction brazing of stainless steel.
In order to realize the purpose, the technical scheme of the brazing filler metal paste for the stainless steel fluxless brazing is as follows:
a brazing filler metal paste for stainless steel brazing without a brazing flux mainly comprises water, sodium silicate, nano silicon dioxide and a copper-based brazing filler metal; the solder paste is prepared from the following raw materials in parts by weight: 70-80 parts of copper-based brazing filler metal, 3-5 parts of nano silicon dioxide, 1-3 parts of sodium hydroxide and 10-15 parts of water; the copper-based brazing filler metal consists of the following components in percentage by mass: 26.0-30.0% of Mn, 26.0-30.0% of Ni, 4.0-6.0% of Co, 0.1-0.5% of B, 0.1-0.6% of Li, 0.1-0.2% of Na, 0.01-0.3% of K and the balance of Cu.
The brazing filler metal paste contains water, sodium silicate and nano silicon dioxide paste, and is dehydrated at high temperature to form a film during brazing, wherein the nano silicon dioxide can construct a three-dimensional network structure, has huge surface area and great activity, and can enhance the strength and high temperature resistance of the film to form a high temperature resistant film. The film isolates air, protects the brazed surface and molten solder from being oxidized, and realizes the fluxless brazing of stainless steel in atmospheric environment; meanwhile, the nano silicon dioxide particles are pinned in the brazing seams, and the strength of the stainless steel joint is enhanced.
In the invention, the improved copper-based brazing filler metal is based on H1CuNi30-2-0.2 brazing filler metal, Mn and Co are added, Cu is reduced, the melting temperature of the brazing filler metal is between 930 and 970 ℃, and the brazing temperature can be reduced. Meanwhile, a certain content of B, Li element is added into the brazing filler metal, and the brazing filler metal has self-fluxing property. This is because B, Li can reduce stainless steel surface oxides such as Cr2O3And the melting point of the reduction product is lower than the brazing temperature, and the reduction product floats on the surfaces of the base metal and the molten brazing filler metal in a liquid film mode to play a role in protection. However, the viscosity of the B oxide is so high that solder spreading is hindered. Therefore, trace Na and K elements are added, and Na and K oxides have low viscosity, so that the viscosity of a reduction product can be reduced, the film removal wetting and the solder spreading are promoted, and the self-soldering performance of the solder is enhanced.
In order to further improve the joint strength, preferably, the solder paste is prepared from the following raw materials in parts by weight: 74-80 parts of copper-based solder, 3-5 parts of nano silicon dioxide, 1-3 parts of sodium hydroxide and 12-15 parts of water. More preferably, the copper-based brazing filler metal consists of the following components in percentage by mass: 28.0-30.0% of Mn, 28.0-30.0% of Ni, 4.0-6.0% of Co, 0.3-0.5% of B, 0.4-0.6% of Li0.1-0.2% of Na, 0.15-0.3% of K and the balance of Cu.
Preferably, the particle size of the nano silicon dioxide is 30-50 nm.
The technical scheme of the copper-manganese-nickel-cobalt brazing filler metal for stainless steel brazing is as follows:
the copper-manganese-nickel-cobalt brazing filler metal for stainless steel brazing comprises the following components in percentage by mass: 26.0-30.0% of Mn, 26.0-30.0% of Nis, 4.0-6.0% of Co, 0.1-0.5% of B, 0.1-0.6% of Li, 0.1-0.2% of Na, 0.01-0.3% of K and the balance of Cu.
Compared with the H1CuNi30-2-0.2 solder, the Cu-Mn-Ni-Co solder for brazing the stainless steel has low brazing temperature (beneficial to inhibiting the growth of stainless steel crystal grains) and strong wetting and spreading capability, and can reduce the dosage of a soldering flux or avoid the use of the soldering flux aiming at the situation of using the conventional matching soldering flux.
More preferably, the copper-manganese-nickel-cobalt brazing filler metal for stainless steel brazing comprises, by mass, 28.0-30.0% of Mn, 28.0-30.0% of Ni, 4.0-6.0% of Co, 0.3-0.5% of B, 0.4-0.6% of Li, 0.1-0.2% of Na, 0.15-0.3% of K, and the balance of Cu.
The technical scheme of the preparation method of the brazing filler metal paste for the stainless steel brazing flux-free brazing is as follows:
a preparation method of a brazing filler metal paste for stainless steel fluxless brazing comprises the following steps:
1) preparing an alkaline aqueous solution from sodium hydroxide and water;
2) reacting the alkaline aqueous solution obtained in the step 1) with nano silicon dioxide under the condition of higher than normal pressure to obtain suspension;
3) and uniformly mixing the suspension and the copper-based solder powder to form a uniform paste to obtain the solder paste.
The preparation method of the brazing filler metal paste for the stainless steel brazing flux-free brazing has the advantages of simple preparation process, high stability of the obtained brazing filler metal paste and capability of effectively improving the brazing effect of the stainless steel brazing.
Preferably, in the step 2), the above-normal pressure condition means that the steam pressure is 0.3-0.5 MPa. The reaction time is 3.0-5.0 h.
The technical scheme of the application of the solder paste is as follows: the solder paste is applied to induction brazing of stainless steel.
Preferably, the stainless steel is brazed and connected in an atmosphere without a brazing flux when in use.
When stainless steel is brazed, the brazing paste is used, does not contain brazing flux, can realize rapid induction brazing of the stainless steel in an atmospheric environment, does not pollute the environment, and is green and environment-friendly.
Drawings
FIG. 1 is a schematic illustration of the preparation of a braze paste of the present invention;
FIG. 2 is a spreading appearance of a conventional H1CuNi30-2-0.2 solder in a fluxless spreading performance test in an atmospheric environment;
FIG. 3 shows the spreading morphology of the solder paste obtained in example 5 of the present invention when tested for solderless spreading performance in an atmospheric environment.
Detailed Description
In the invention, the reaction of the nano silicon dioxide and the sodium hydroxide is as follows: SiO 22+2NaOH＝Na2SiO3+H2O。
During the reaction, the amount of the nano silicon dioxide is controlled to be excessive, a part of the nano silicon dioxide is consumed by the reaction with the sodium hydroxide, and the other part of the nano silicon dioxide is remained in the liquid to form a suspension. The turbid liquid is dehydrated at high temperature to form a layer of film, wherein redundant nano silicon dioxide is of a three-dimensional network structure, has huge surface area and great activity, and can enhance the strength and high temperature resistance of the film to form a high temperature resistant film. The film is isolated from air, and the brazed surface and the molten brazing filler metal are protected from being oxidized. The nano-silica particles are pinned in the brazing seams and also contribute to the strength of the stainless steel joint.
In a word, the suspension can enhance the high temperature resistance of a film formed by dehydrating mucus on one hand, and the nano silicon dioxide in the suspension can be pinned at a brazing seam on the other hand, so that the strength of a joint is enhanced.
Further matched with the improvement of the copper-based brazing filler metal, the brazing flux-free rapid induction brazing of the stainless steel in the atmospheric environment can be better realized, and a high-strength joint is obtained.
First, the concrete embodiment of the preparation method of the brazing filler metal paste for stainless steel fluxless brazing
Example 1
The preparation method of the brazing filler metal paste for the stainless steel fluxless brazing of the embodiment comprises the following raw materials in parts by weight: 70 parts of copper-based solder powder, 3 parts of nano silicon dioxide, 3 parts of sodium hydroxide and 10 parts of deionized water; the copper-based solder powder comprises the following components in percentage by mass: 26.0 percent of Mn26.0 percent, 26.0 percent of Ni0 percent, Co4.0 percent, 0.1 percent of B, 0.1 percent of Li0.1 percent, 0.1 percent of Na0 percent, 0.01 percent of K and the balance of Cu.
The preparation method comprises the following steps:
(1) weighing the components in proportion, and dissolving sodium hydroxide in deionized water to form an alkaline aqueous solution for later use;
(2) adding nano silicon dioxide (30-50 nm) into the alkaline aqueous solution obtained in the step (1), putting the solution into a high-pressure reaction kettle, and reacting for 3.0 hours under the steam pressure of 0.3MPa to form a suspension (transparent colloidal liquid and a small amount of silicon dioxide); the reaction process is schematically shown in figure 1;
(3) and (3) adding the copper-based solder powder into the suspension liquid obtained in the step (2), and mixing and stirring to form a uniform paste to obtain the solder paste.
Example 2
The preparation method of the brazing filler metal paste for the stainless steel fluxless brazing of the embodiment comprises the following raw materials in parts by weight: 72 parts of copper-based solder powder, 4 parts of nano silicon dioxide, 2 parts of sodium hydroxide and 11 parts of deionized water; the copper-based solder powder comprises the following components in percentage by mass: mn27.0%, Ni27.0%, Co5.0%, B0.2%, Li0.2%, Na0.1%, K0.1%, and the balance Cu. The specific preparation method is basically the same as that of the example 1, and the differences are only that: in the step (2), the steam pressure is 0.4MPa, and the reaction time is 4.0 h.
Example 3
The preparation method of the brazing filler metal paste for the stainless steel fluxless brazing of the embodiment comprises the following raw materials in parts by weight: 74 parts of copper-based solder powder, 5 parts of nano silicon dioxide, 1 part of sodium hydroxide and 12 parts of deionized water. The copper-based solder powder comprises the following components in percentage by mass: 28.0 percent of Mn28.0 percent, 28.0 percent of Ni0 percent, 6.0 percent of Co6, 0.3 percent of B, 0.4 percent of Li0, 0.2 percent of Na0, 0.15 percent of K and the balance of Cu.
The specific preparation method is basically the same as that of the example 1, and the differences are only that: in the step (2), the steam pressure is 0.5MPa, and the reaction time is 5.0 h.
Example 4
The preparation method of the brazing filler metal paste for the stainless steel fluxless brazing of the embodiment comprises the following raw materials in parts by weight: 76 parts of copper-based solder powder, 3 parts of nano silicon dioxide, 3 parts of sodium hydroxide and 14 parts of deionized water. The copper-based solder powder comprises the following components in percentage by mass: 29.0% of Mn29.0%, 29.0% of Ni0%, Co4.0%, 0.4% of B, 0.5% of Li0%, 0.1% of Na0.2%, and the balance of Cu. The specific preparation method is the same as that of example 1.
Example 5
The preparation method of the brazing filler metal paste for the stainless steel fluxless brazing of the embodiment comprises the following raw materials in parts by weight: 80 parts of copper-based solder powder, 5 parts of nano silicon dioxide, 2 parts of sodium hydroxide and 15 parts of deionized water. The copper-based solder powder comprises the following components in percentage by mass: 30.0 percent of Mn30.0 percent, 30.0 percent of Ni0 percent, 5.0 percent of Co5, 0.5 percent of B, 0.6 percent of Li0, 0.2 percent of Na0, 0.3 percent of K and the balance of Cu. The specific preparation method is the same as that of example 1.
In another embodiment of the method for preparing a brazing filler metal paste for stainless steel fluxless brazing according to the present invention, in the step (3), the reaction is performed for 3.0 to 5.0 hours under a pressure of 0.3 to 0.5MPa, for example, for 3.0 hours under 0.5MPa, or for 5.0 hours under 0.4MPa, and the reaction effect is substantially equivalent to that of the embodiment 1.
Second, specific examples of the brazing filler metal paste for stainless steel fluxless brazing according to the present invention respectively correspond to the brazing filler metal pastes obtained by the preparation methods of the above examples 1 to 5, and detailed description thereof is omitted.
Third, specific embodiments of the cu-mn-ni-co solder for brazing stainless steel according to the present invention respectively correspond to the cu-based solders of embodiments 1 to 5, and detailed description thereof is omitted.
Fourth, application description of solder paste in experimental examples
Experimental example 1
A flux-free spreading performance test was performed on a 304 stainless steel plate (40 mm long by 40mm wide by 3mm thick) using H1CuNi30-2-0.2 solder and the solder paste of example 5, and the wet spreading profiles of the two joints were compared by rapid induction heating to 1000 ℃ in an atmospheric environment, and the test results are shown in FIGS. 2 and 3.
As can be seen from FIGS. 2 and 3, the H1CuNi30-2-0.2 braze did not spread on the steel plate and was almost completely carbonized, whereas the braze paste of example 5 spread on the steel plate and was wet and had better wetting properties.
Experimental example 2
The purpose of this experimental example is to compare the shear strength of the soldered joints of different solders, the test base material is a stainless steel plate with thickness of 3mm, width of 20mm and length of 80mm, the H1CuNi30-2-0.2 solder is used to perform gas-shielded soldering of 304 stainless steel plate (the gas-shielded soldering temperature needs to be maintained between 1170-1200 ℃), then the solder paste of examples 1-5 is used to perform fluxless induction soldering of 304 stainless steel plate in the atmosphere (the soldering temperature is 1050-1100 ℃), and six joints are processed into standard shear test pieces (according to the regulation of GB/T11364-.
TABLE 1 shear strength of the braze joint
As can be seen from Table 1, the average shear strength of the braze joints of examples 1-5 was higher than that of the H1CuNi30-2-0.2 braze joint, indicating higher joint strength.
Claims (10)
1. The brazing filler paste for stainless steel brazing without the brazing flux is characterized by mainly comprising water, sodium silicate, nano silicon dioxide and copper-based brazing filler metal; the solder paste is prepared from the following raw materials in parts by weight: 70-80 parts of copper-based brazing filler metal, 3-5 parts of nano silicon dioxide, 1-3 parts of sodium hydroxide and 10-15 parts of water; the copper-based brazing filler metal consists of the following components in percentage by mass: 26.0-30.0% of Mn, 26.0-30.0% of Ni, 4.0-6.0% of Co, 0.1-0.5% of B, 0.1-0.6% of Li, 0.1-0.2% of Na, 0.01-0.3% of K and the balance of Cu.
2. The brazing filler metal paste for stainless steel fluxless brazing according to claim 1, wherein the brazing filler metal paste is prepared from the following raw materials in parts by weight: 74-80 parts of copper-based solder, 3-5 parts of nano silicon dioxide, 1-3 parts of sodium hydroxide and 12-15 parts of water.
3. The brazing paste for stainless steel fluxless brazing according to claim 2, wherein the copper-based brazing filler metal consists of the following components in percentage by mass: 28.0-30.0% of Mn, 28.0-30.0% of Ni, 4.0-6.0% of Co, 0.3-0.5% of B, 0.4-0.6% of Li, 0.1-0.2% of Na, 0.15-0.3% of K and the balance of Cu.
4. The brazing paste for stainless steel fluxless brazing according to any one of claims 1 to 3, wherein the nano silica has a particle size of 30 to 50 nm.
5. The copper-manganese-nickel-cobalt brazing filler metal for stainless steel brazing is characterized by comprising the following components in percentage by mass: 26.0-30.0% of Mn, 26.0-30.0% of Ni, 4.0-6.0% of Co, 0.1-0.5% of B, 0.1-0.6% of Li, 0.1-0.2% of Na, 0.01-0.3% of K and the balance of Cu.
6. A method for preparing a brazing paste for fluxless brazing of stainless steel according to any one of claims 1 to 4, comprising the steps of:
1) preparing an alkaline aqueous solution from sodium hydroxide and water;
2) reacting the alkaline aqueous solution obtained in the step 1) with nano silicon dioxide under the condition of higher than normal pressure to obtain suspension;
3) and uniformly mixing the suspension and the copper-based solder powder to form a uniform paste to obtain the solder paste.
7. The method for preparing a brazing filler metal paste for stainless steel fluxless brazing according to claim 6, wherein the above-normal pressure condition in step 2) means a vapor pressure of 0.3 to 0.5 MPa.
8. The method for preparing a brazing filler metal paste for stainless steel fluxless brazing according to claim 7, wherein the reaction time in the step 2) is 3.0 to 5.0 hours.
9. Use of a braze paste for fluxless brazing of stainless steel according to any one of claims 1 to 4 for induction brazing of stainless steel.
10. Use according to claim 9, wherein the stainless steel is brazed in connection in an atmospheric environment, without a flux.
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| JP2024508001A JP2024529553A (en) | 2021-08-12 | 2021-12-03 | Brazing filler metal paste for flux-free brazing of stainless steel and its manufacturing method, copper manganese nickel cobalt brazing filler metal and use |
| PCT/CN2021/135209 WO2023015784A1 (en) | 2021-08-12 | 2021-12-03 | Braze paste for fluxless brazing of stainless steel and preparation method therefor, copper-manganese-nickel-cobalt braze material, and application |
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| WO2023015784A1 (en) * | 2021-08-12 | 2023-02-16 | 郑州机械研究所有限公司 | Braze paste for fluxless brazing of stainless steel and preparation method therefor, copper-manganese-nickel-cobalt braze material, and application |
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| JP2024529553A (en) | 2024-08-06 |
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