CN113579255B - Metal fuse additive manufacturing substrate cooling device and method - Google Patents

Metal fuse additive manufacturing substrate cooling device and method Download PDF

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Publication number
CN113579255B
CN113579255B CN202110857857.5A CN202110857857A CN113579255B CN 113579255 B CN113579255 B CN 113579255B CN 202110857857 A CN202110857857 A CN 202110857857A CN 113579255 B CN113579255 B CN 113579255B
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China
Prior art keywords
cooling
substrate
liquid
storage chamber
additive manufacturing
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CN202110857857.5A
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CN113579255A (en
Inventor
刘学刚
曹磊
蒋立君
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Chongqing General Industry Group Co Ltd
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Chongqing General Industry Group Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/20—Cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Abstract

The invention provides a metal fuse additive manufacturing substrate cooling device and a metal fuse additive manufacturing substrate cooling method, wherein the device comprises: the device comprises a bottom plate, a cooling circuit, a liquid storage chamber, a base plate, a forming piece and a splash-proof cover plate; the cooling loop and the liquid storage chamber are both arranged on the bottom plate, and cooling liquid flows in the cooling loop; the liquid storage chamber is arranged around the cooling loop and is communicated with the cooling loop through an overflow groove, the overflow groove is arranged at the upper end of the liquid storage chamber, the liquid storage chamber is also connected with a micro water pump, and cooling liquid in the liquid storage chamber is conveyed to the cooling loop through the micro water pump; the substrate is arranged on the cooling loop and fixed with the cooling loop through substrate clamping, and the forming piece is arranged on the substrate; the splash-proof cover plate is arranged on the cooling circuit through the forming piece and matched with the bottom plate. The invention can achieve the effect of automatically and circularly cooling the substrate, ensures that the substrate contacts cooling liquid in the largest area, improves the cooling efficiency and the cooling effect, realizes the continuous work of additive manufacturing, and can realize the quick replacement of the substrate through substrate clamping.

Description

Metal fuse additive manufacturing substrate cooling device and method
Technical Field
The invention relates to the technical field of fuse wire additive manufacturing, in particular to a cooling device and a cooling method for a metal fuse wire additive manufacturing substrate.
Background
The metal fuse additive manufacturing refers to a technology of manufacturing a real object in a material accumulation mode through a forming device, and accordingly achieving free manufacturing. The method integrates mechanical engineering, CAD (computer aided design), reverse engineering, layered manufacturing technology, numerical control technology, material science and welding technology, and can automatically, directly, quickly and accurately convert the design idea into a prototype with certain functions or directly manufacture parts, thereby providing a high-efficiency and low-cost implementation means for aspects such as part prototype manufacture, new design idea verification and the like.
The existing metal fuse wire additive manufacturing usually adopts air cooling, argon cooling or a heat dissipation mode of adding a copper plate below a substrate, has low cooling efficiency, needs to wait for cooling, and particularly, titanium alloy fuse wire additive manufacturing has slow cooling and cannot realize continuous additive manufacturing work.
Disclosure of Invention
In view of the above, it is necessary to provide a cooling apparatus and a cooling method for a metal fuse additive manufacturing substrate.
A metal fuse additive manufacturing substrate cooling apparatus, comprising: the device comprises a bottom plate, a cooling circuit, a liquid storage chamber, a base plate, a forming piece and a splash-proof cover plate; the cooling loop and the liquid storage chamber are both arranged on the bottom plate, and cooling liquid flows in the cooling loop; the liquid storage chamber is arranged around the cooling loop and is communicated with the cooling loop through an overflow groove, the overflow groove is arranged at the upper end of the liquid storage chamber, the liquid storage chamber is also connected with a micro water pump, and cooling liquid in the liquid storage chamber is conveyed to the cooling loop through the micro water pump; the substrate is arranged on the cooling loop and fixed with the cooling loop through substrate clamping, and the forming piece is arranged on the substrate; the splash-proof cover plate penetrates through the forming piece and is arranged on the cooling circuit and matched with the bottom plate.
Furthermore, lifting lugs are arranged on two sides of the bottom plate.
Further, the cooling circuit is formed by gaps among a plurality of cooling baffles, and cooling liquid flows among the plurality of cooling baffles.
Furthermore, the plurality of cooling baffles are arranged to be L-shaped, centrosymmetric, return-shaped or labyrinth-shaped.
Furthermore, a strip-shaped hole is formed in the substrate clamping, and a fastening bolt penetrates through the strip-shaped hole to be fixed with the cooling baffle.
Furthermore, the micro water pump is connected with a liquid injection pipe, and the liquid injection pipe injects cooling liquid into the cooling loop through a liquid injection hole arranged on the liquid storage chamber.
Further, the height of the liquid injection hole is higher than that of the overflow groove.
A cooling method of a metal fuse additive manufacturing substrate comprises the following steps: arranging a forming piece on a substrate, and fixing the substrate on a cooling circuit by clamping the substrate; starting a micro water pump to inject cooling liquid in the liquid storage chamber into a cooling loop, and when the liquid level of the cooling liquid reaches an overflow groove, refluxing the cooling liquid to the liquid storage chamber through the overflow groove; the substrate is cooled by the flowing of the cooling liquid in the cooling loop, and the liquid level in the cooling loop is controlled by the micro water pump to be not more than the thickness center line of the substrate in the cooling process.
Further, the cooling of the substrate by the flow of the cooling liquid in the cooling circuit further comprises: and in the cooling process, the height of the liquid level in the cooling loop is controlled not to exceed the thickness center line of the substrate through the overflow groove.
Compared with the prior art, the invention has the advantages and beneficial effects that:
1. the invention can achieve the effect of automatically and circularly cooling the substrate, ensure that the substrate contacts cooling liquid in the largest area, improve the cooling efficiency and the cooling effect, realize continuous work of additive manufacturing, and realize quick replacement of the substrate by clamping the substrate.
2. The invention has the advantages that the liquid supplementing and overflowing control liquid of the water pump is carried, the self circulation is realized, the liquid level of the base plate is effectively cooled by the cooling liquid which is accurately controlled, the base plate is prevented from deforming, and the reliability of the quality of the material increase manufacturing workpiece is improved.
3. The sliding adjustable clamping device can realize the quick clamping of the substrates with different sizes, is convenient to change the model and firm in clamping, and lays a foundation for the deformation of the substrates and the guarantee of the additive manufacturing environment on the substrates.
Drawings
FIG. 1 is a schematic diagram of a cooling apparatus for a metal fuse additive manufacturing substrate according to an embodiment;
FIG. 2 is a schematic structural view of FIG. 1 with the splash cover removed;
FIG. 3 is a cross-sectional view of FIG. 1;
FIG. 4 is a schematic view of the internal structure of the base plate of FIG. 1;
FIG. 5 is a top view of FIG. 4;
FIG. 6 is a schematic view of the structure of the substrate shown in FIG. 1;
FIG. 7 is a schematic structural view of the splash-proof cover plate of FIG. 1;
FIG. 8 is a flow chart illustrating a method for cooling a metal fuse additive manufacturing substrate according to an embodiment.
In the drawing, a bottom plate 10, a lifting lug 11, a cooling circuit 20, a cooling baffle 21, a liquid storage chamber 30, an overflow groove 31, a micro water pump 32, a liquid injection hole 33, a substrate 40, a substrate clamp 41, a forming piece 50, a splash-proof cover plate 60 and a through hole 61.
Detailed Description
In order that the invention may be more clearly understood, the invention is described in further detail below by means of specific embodiments in conjunction with the appended drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 to 7, there is provided a cooling apparatus for a metal fuse additive manufacturing substrate, including: a base plate 10, a cooling circuit 20, a liquid storage chamber 30, a base plate 40, a molding 50, and a splash-proof cover plate 60; the cooling loop 20 and the liquid storage chamber 30 are both arranged on the bottom plate 10, and cooling liquid flows in the cooling loop 20; the liquid storage chamber 30 is arranged around the cooling loop 20 and is communicated with the cooling loop 20 through an overflow groove 31, the overflow groove 31 is arranged at the upper end of the liquid storage chamber 30, the liquid storage chamber 30 is also connected with a micro water pump 32, and cooling liquid in the liquid storage chamber 30 is conveyed to the cooling loop 20 through the micro water pump 32; the substrate 40 is arranged on the cooling circuit 20 and is fixed with the cooling circuit 20 through the substrate clamp 41, and the forming piece 50 is arranged on the substrate 40; a splash cover 60 is disposed on the cooling circuit 20 through the molding 50 and mates with the base plate 10.
In this embodiment, the cooling circuit 20 and the liquid storage chamber 30 are both disposed on the bottom plate 10, a cooling liquid flows in the cooling circuit 20, the liquid storage chamber 30 is disposed around the cooling circuit 20 and is communicated with the remaining cooling circuit through the overflow groove 31, the overflow groove 31 is disposed at the upper end of the liquid storage chamber 30, the liquid storage chamber 30 is further connected with the micro water pump 32, the cooling liquid in the liquid storage chamber 30 is conveyed to the cooling circuit 20 through the micro water pump 32, the substrate 40 is disposed on the cooling circuit and is fixed with the cooling circuit 20 through the substrate clamp 41, the forming member 50 is disposed on the substrate 40, the anti-splashing cover plate 60 is disposed on the cooling circuit 20 through the forming member 50 and is matched with the bottom plate 10, thereby achieving an effect of automatically circulating and cooling the substrate, ensuring the largest area of the substrate to contact the cooling liquid, improving cooling efficiency and cooling effect, realizing continuous work of additive manufacturing, and simultaneously realizing quick replacement of the substrate through substrate clamp.
Specifically, the splash cover 60 is provided with a through hole 61, and the molding member 50 can pass through the through hole 61 to be matched with the base plate 10 when the splash cover 60 is installed. In addition, the anti-spattering cover plate 60 can ensure that the fuse wire additive manufacturing spatters fall into the cooling liquid, and simultaneously, the purpose of protecting the whole cooling circuit is achieved.
Wherein, lifting lugs 11 are arranged on both sides of the bottom plate 10.
The cooling circuit 20 is formed by gaps between the plurality of cooling baffles 21, and a cooling liquid flows between the plurality of cooling baffles 21.
Specifically, a plurality of baffles 21 are arranged on the base plate 10, and gaps between the baffles constitute a cooling circuit 20, and a cooling liquid flows between the gaps, thereby achieving cooling of the substrate 40.
Wherein, a plurality of cooling baffles 21 are arranged in an L-shaped central symmetry, a return character shape or a labyrinth shape.
Specifically, the arrangement of the cooling baffles 21 can be in an L-shaped central symmetry, a zigzag shape or a labyrinth shape, and flow paths are constructed as many as possible, so that the largest area of the substrate 40 is ensured to contact with the cooling liquid, the cooling of the substrate 40 is accelerated, and meanwhile, the effective supporting strength and the unevenness of the substrate panel after installation can be ensured, thereby achieving the purposes of smooth feeding and discharging of the cooling liquid and optimal cooling effect.
Wherein, the substrate clamp 41 is provided with a strip-shaped hole, and the fastening bolt passes through the strip-shaped hole to be fixed with the cooling baffle 21.
Specifically, the substrate clamp 41 is used for fixing the substrate 40, and is provided with strip-shaped holes, so that the substrate clamp can adapt to substrates 40 with more sizes through the strip-shaped holes, the periphery of the substrate 40 is guaranteed to be compressed, and the substrate 40 is prevented from deforming in the additive manufacturing process; the fastening bolts pass through the strip-shaped holes to be fixed with the cooling baffle 21, so that the base plate 40 is stably installed and can be quickly replaced.
The micro-pump 32 is connected to a liquid injection pipe for injecting the cooling liquid into the cooling circuit 20 through a liquid injection hole provided in the liquid storage chamber 30.
Specifically, the micro-water pump 32 is connected with a liquid injection pipe, and the liquid injection pipe injects the cooling liquid into the cooling circuit 20 through a liquid injection hole formed in the liquid storage chamber 30, so that the self-circulation of the cooling liquid in the device is ensured, the liquid level height of the cooling liquid is accurately controlled, the deformation of the substrate is prevented, and the reliability of the working quality of additive manufacturing is improved.
Wherein, the liquid injection hole 33 is higher than the overflow groove 31.
Specifically, the liquid injection hole 33 is higher than the overflow groove 31 at the height of the liquid storage chamber 30, and prevents the cooling liquid from flowing back.
In one embodiment, as shown in fig. 8, there is provided a metal fuse additive manufacturing substrate cooling method, including the steps of:
step S101, arranging a forming piece on a substrate, and fixing the substrate on a cooling loop through substrate clamping;
step S102, starting a micro water pump to inject cooling liquid in a liquid storage chamber into a cooling loop, and when the liquid level of the cooling liquid reaches an overflow groove, returning the cooling liquid to the liquid storage chamber through the overflow groove;
in step S103, the substrate is cooled by the flow of the cooling liquid in the cooling circuit.
In this embodiment, the cooling the substrate by the cooling device specifically includes: firstly, arranging a forming piece on a substrate, fixing the substrate on a cooling loop through substrate clamping, starting a micro water pump to inject cooling liquid in a liquid storage chamber into the cooling loop, and when the liquid level of the cooling liquid reaches the height of an overflow groove, refluxing to the liquid storage chamber through the overflow groove; the base plate is cooled through flowing of the cooling liquid in the cooling loop, the cooling liquid overflowing from the overflow groove in the cooling loop enters the liquid storage chamber, and the cooling liquid of the liquid storage chamber is replenished through the liquid injection hole through the micro water pump, so that self-circulation cooling is realized, the cooling efficiency of the base plate is improved, a better cooling effect is achieved, and deformation of the base plate in the material increase manufacturing process is avoided.
Wherein, step S103 further includes: and in the cooling process, the height of the liquid level in the cooling loop is controlled not to exceed the thickness center line of the substrate through the overflow groove.
Specifically, the overflow groove can control the inflow of cooling liquid, and ensure that the liquid level in the cooling loop does not exceed the central line of the thickness of the substrate, thereby avoiding the overflow of the cooling liquid due to overhigh liquid level.
The present invention is described in further detail with reference to specific embodiments, and the specific embodiments are not to be considered as limited to the description. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.

Claims (9)

1. A metal fuse additive manufacturing substrate cooling apparatus, comprising: the device comprises a bottom plate, a cooling circuit, a liquid storage chamber, a base plate, a forming piece and a splash-proof cover plate; the cooling loop and the liquid storage chamber are both arranged on the bottom plate, and cooling liquid flows in the cooling loop; the liquid storage chamber is arranged around the cooling loop and is communicated with the cooling loop through an overflow groove, the overflow groove is arranged at the upper end of the liquid storage chamber, the liquid storage chamber is also connected with a micro water pump, and cooling liquid in the liquid storage chamber is conveyed to the cooling loop through the micro water pump; the substrate is arranged on the cooling loop and fixed with the cooling loop through substrate clamping, and the forming piece is arranged on the substrate; the splash cover is disposed on the cooling circuit through the form and mates with the base plate.
2. The cooling device for a metal fuse additive manufacturing substrate according to claim 1, wherein lifting lugs are arranged on two sides of the bottom plate.
3. The cooling device for a metal fuse additive manufacturing substrate according to claim 1, wherein the cooling circuit is formed by a gap between a plurality of cooling baffles, and a cooling liquid flows between the plurality of cooling baffles.
4. The metal fuse additive manufacturing substrate cooling device according to claim 3, wherein the cooling baffles are arranged in an L-shaped central symmetry, a zigzag shape or a labyrinth shape.
5. The cooling device for metal fuse additive manufacturing substrate according to claim 3, wherein a strip-shaped hole is formed in the substrate holder, and a fastening bolt penetrates through the strip-shaped hole to be fixed with the cooling baffle.
6. The cooling device for metal fuse additive manufacturing substrate according to claim 1, wherein a liquid injection pipe is connected to the micro water pump, and the liquid injection pipe injects a cooling liquid into the cooling circuit through a liquid injection hole provided in the liquid storage chamber.
7. The cooling device for a metal fuse additive manufacturing substrate according to claim 6, wherein the liquid injection hole is higher than the overflow tank.
8. A cooling method for a metal fuse additive manufacturing substrate, which adopts the cooling device for the metal fuse additive manufacturing substrate as claimed in any one of claims 1 to 7, and is characterized by comprising the following steps:
arranging a forming piece on a substrate, and fixing the substrate on a cooling circuit by clamping the substrate;
starting a micro water pump to inject cooling liquid in the liquid storage chamber into a cooling loop, and when the liquid level of the cooling liquid reaches an overflow groove, refluxing to the liquid storage chamber through the overflow groove;
the substrate is cooled by the flow of the cooling fluid in the cooling circuit.
9. The method of claim 8, wherein the cooling the substrate by flowing a cooling fluid in a cooling circuit, further comprises:
and in the cooling process, the height of the liquid level in the cooling loop is controlled not to exceed the thickness center line of the substrate through the overflow groove.
CN202110857857.5A 2021-07-28 2021-07-28 Metal fuse additive manufacturing substrate cooling device and method Active CN113579255B (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN202110857857.5A CN113579255B (en) 2021-07-28 2021-07-28 Metal fuse additive manufacturing substrate cooling device and method

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CN113579255B true CN113579255B (en) 2023-03-28

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Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7521652B2 (en) * 2004-12-07 2009-04-21 3D Systems, Inc. Controlled cooling methods and apparatus for laser sintering part-cake
WO2020025949A1 (en) * 2018-08-03 2020-02-06 Renishaw Plc Powder bed fusion apparatus and methods
CN109202084B (en) * 2018-11-16 2020-09-22 昆山晶微新材料研究院有限公司 Array jet type large-size full-equiaxed crystal aluminum alloy ingot additive manufacturing equipment and method
CN112828314B (en) * 2021-03-17 2023-07-25 广东华研智能科技有限公司 Dot matrix material adding device with building block type water-cooling material adding module and material adding method

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