CN113574671A

CN113574671A - Image sensor package, module and method of manufacturing the same

Info

Publication number: CN113574671A
Application number: CN202080019363.3A
Authority: CN
Inventors: 徐光元; 朴钟洙
Original assignee: Hana Micron Co Ltd
Current assignee: Hana Micron Co Ltd
Priority date: 2019-04-08
Filing date: 2020-04-06
Publication date: 2021-10-29
Also published as: WO2020209557A1; KR20200118667A; KR102252490B1

Abstract

The image sensor package of the present invention includes: a substrate; an optical sensor attached to an upper surface of the substrate; a metal wire for electrically connecting the substrate and the optical sensor; a barrier portion attached to a periphery of an upper surface of the substrate; a top glass supported by the barrier; a first optical structure disposed below the top glass; and a second optical structure disposed above the optical sensor. According to the structure of the present invention as described above, the light path is formed in each pixel unit of the light sensor, thereby having an effect of enhancing the light condensing function.

Description

Image sensor package, module and method of manufacturing the same

Technical Field

The present invention relates to an image sensor package, a module and a method of manufacturing the same, and more particularly, to an image sensor package, a module and a method of manufacturing the same, as follows: is disposed at a lower portion of an Organic Light Emitting Diode (OLED) panel, other display panels, which do not use a backlight (backlight), to perform a light sensing operation.

Background

Generally, an image sensor (image sensor) used in a mobile phone, a digital camera, a digital video camera, an automobile sensor, life engineering, a robot, a medical device, or the like is a semiconductor device that takes an optical image and converts the image into an electrical signal, and is configured by a light sensing portion that senses light and a logic circuit portion that processes the sensed light using the electrical signal and converts the light into data.

In order to improve the sensing sensitivity of such an image sensor, efforts are being made to increase the proportion of the area of the sensing array region in the entire image sensor device. However, such efforts are limited in a limited area due to the inability to fundamentally remove the logic circuit area.

Therefore, in order to improve the light sensitivity and the light condensing efficiency, a light condensing technique of converting an optical path incident to an area other than the sensing array area to the sensing array area or inducing light to each unit pixel is required.

In particular, when the optical unit is disposed in the sensor array region, if the unit pixels are misaligned with the optical unit, an optical effect cannot be expected.

Documents of the prior art

Patent document

Korean laid-open patent No. 10-2008-0074773

Disclosure of Invention

Technical problem

Accordingly, the present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide an image sensor package, a module, and a method of manufacturing the same, as follows: an optical path is formed at each pixel of the light sensor, and optical alignment between the prism and the lens is improved to allow normal transmission of optical signals.

Another object of the present invention is to provide an image sensor package, a module, and a method of manufacturing the same, as follows: a space margin is secured between the photo sensor and the top glass, and a light path is formed at each pixel of the photo sensor.

Technical scheme

According to a feature of the present invention for achieving the object as described above, an image sensor package of the present invention includes: a substrate; an optical sensor attached to an upper surface of the substrate; a metal wire for electrically connecting the substrate and the optical sensor; a barrier portion attached to a periphery of an upper surface of the substrate; a top glass supported by the barrier; a first optical structure disposed below the top glass; and a second optical structure disposed above the optical sensor. As the above substrate, a module substrate including a signal processing element, a memory element, a driving integrated circuit, a socket for external connection, and the like as a driving section capable of performing an additional function of the optical sensor may be used.

According to another feature of the present invention, an image sensor package manufacturing method of the present invention includes: preparing bare glass; forming a plurality of prisms and one or more dummy structures on a lower surface of the bare glass; cutting the bare glass to form top glass; laminating a photoresist pattern on an upper surface of the optical sensor; forming a plurality of microlenses on an upper surface of the photoresist pattern; a step of bonding the optical sensor to a substrate chip; bonding the substrate and the photosensor wire; bonding the barrier portion to the substrate dam; and bonding the top glass to the barrier portion with a glass adhesive member on the barrier portion.

ADVANTAGEOUS EFFECTS OF INVENTION

As described above, the following effects can be expected according to the structure of the present invention.

First, an optical structure is disposed between the photosensor and the top glass to improve the light condensing function, and the prism and the lens are made to correspond to each other to further improve the light condensing effect of each pixel unit.

Second, the light transmission path is uniformly formed by using each pixel of the photo sensor by arranging each prism and each lens perpendicularly by using a dummy structure.

Thirdly, a photoresist pattern is further laminated under the optical structure, thereby making the light transmission path parallel and enhancing the light source transmission effect.

Fourth, the space between the photo sensor and the top glass is adjusted by adjusting the photoresist pattern, and a space margin of the metal wire soldered thereto is secured.

Fifth, the interval between the photo sensor and the top glass is adjusted by using the dummy structure, and the interval can be uniformly formed throughout the entire pixel array area, and thus light can be uniformly incident.

Sixth, foreign substances and the like can be prevented from flowing between the optical structures by the dummy structures.

Drawings

Fig. 1 to 3 are sectional views respectively showing structures of image sensor packages according to various embodiments of the present invention.

Fig. 4a to 4g are sectional views illustrating the manufacturing method of fig. 1, respectively.

Fig. 5 is a sectional view illustrating a structure of an image sensor module including the image sensor package of the present invention.

Description of reference numerals

100: image sensor package 110: substrate

120: the optical sensor 130: metal wire

140: the barrier portion 150: top glass

160: first optical structure 170: second optical structure

180: photoresist pattern

Detailed Description

The advantages, features and methods of accomplishing the same will become more apparent from the detailed description of the embodiments with reference to the drawings. However, the present invention is not limited to the embodiments disclosed below, and various embodiments different from each other may be implemented, and the embodiments only make the disclosure of the present invention more complete, and the present invention is provided to enable those skilled in the art to fully understand the scope of the present invention, and the present invention is defined only by the scope of the claims. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.

The embodiments described in the present specification are described with reference to plan views and sectional views, which are ideal exemplary views of the present invention. Therefore, the form of the illustration may be modified according to manufacturing techniques and/or allowable errors, etc. Therefore, the embodiments of the present invention are not limited to the specific forms shown, and include modifications of forms produced by manufacturing processes. Accordingly, the regions illustrated in the drawings have exemplary attributes, and the shapes of the regions illustrated in the drawings are used to illustrate specific forms of the regions of the original, and do not limit the scope of the invention.

Hereinafter, preferred embodiments of the image sensor of the present invention having the above-described structure will be described in detail with reference to the accompanying drawings.

Referring to fig. 1, an image sensor package 100 includes: a substrate 110; an optical sensor 120 mounted on the upper surface of the substrate 110; a metal line 130 for electrically connecting the substrate 110 and the light sensor 120; a barrier 140 attached to the periphery of the upper surface of the substrate 110; a top glass 150 supported by the barrier 140; a first optical structure 160 disposed at a lower portion of the top glass 150; and a second optical structure 170 disposed on the upper portion of the optical sensor 120.

The barrier 140 is provided at a height sufficient to ensure a space margin, so that the metal wire 130 is soldered to the photosensor 120. For example, the height of the barrier 140 is at least greater than the sum of the thickness of the photosensor 120 and the thickness of the first optical structure 160 and the second optical structure 170 in a state of overlapping each other.

In particular, in the embodiment of the present invention, in order to ensure the aforementioned space margin, a photoresist pattern 180 is further included between the light sensor 120 and the second optical structure 170. The photoresist pattern 180 is provided not only in a thickness sufficient to secure a space margin but also in a thickness suitable for forming a light path to transmit a light signal to each pixel of the light sensor 120.

The substrate 110 may include a flexible Printed Circuit Board (PCB) and a rigid printed circuit board. The substrate 110 includes a chip attach region where the photo sensor 120 is packaged and a surrounding region where a plurality of substrate pads (no reference numeral) are arranged. In order to electrically connect the optical sensor 120 to an external device, a wiring pattern (not shown) is formed inside, and in particular, a bump (not shown) using a Surface Mount Technology (SMT) is provided on a lower portion.

The light sensor 120 includes an image sensor. The Image sensor is not limited to a cis (cmos Image sensor) Image sensor. May include a charge-coupled device (CCD) image sensor.

The light sensor 120 is bonded to the chip attach region of the substrate 110 using the die attach member 114. The die attach part 114 may include a Die Attach Film (DAF). A sensor array region is formed on the upper portion of the light sensor 120. Also, a sensor pad (not numbered) connected to the metal wire 112 may be provided around the upper portion.

The metal line 130 is used to electrically connect the substrate pad on the upper surface of the substrate 110 and the sensor pad on the upper surface of the optical sensor 120. In this case, when a pair of pads is connected, the metal wire 112 is formed by wire bonding suitable for a batch process.

However, in the present invention, no additional molding process is provided in order to protect the metal line 140, and thus, is located inside the air cavity provided through the top glass 150. Therefore, the air cavity between the photo sensor 120 and the top glass 150 needs to secure a sufficient space margin for the metal line 140.

The barrier 140 is mounted around the substrate 110. May be attached to the substrate 110 using a dam adhesive film (DA F).

The top glass 150 is fixed to the barrier 140 and is attached by a glass adhesive member 152. Such an adhesive member 152 may use an Ultraviolet (UV) adhesive layer. The top glass 150 may be coated in various ways such as color coating. Or a protective film may also be formed.

A height difference is formed at the upper face edge of the barrier 140 to firmly bond the top glass 150 and the barrier 140. For example, a chamfered equal width blade saw (saw) may be utilized to remove a portion of the upper face edge. The aforementioned ultraviolet ray bonding means 152 may be applied to the aforementioned level difference surface.

The second optical structure 170 includes a microlens provided on the photoresist pattern 180. The first optical structure 160 includes a prism provided on the top glass 150. That is, the photosensor 120 includes each unit pixel (pixel) in the sensor array region, and the microlenses and prisms may be arranged so as to correspond to the pixels.

In this case, each microlens is disposed between each prism. Further, the microlenses need to be arranged so as to be disposed between the prisms, and a dummy structure described later can be a reference for such arrangement. The microlenses may be made of acrylic or silicon substance having a prescribed refractive index for air.

A dummy structure 162 is also provided between the light sensor 120 and the top glass 150. The dummy structure 162 performs a function of adjusting the interval between the light sensor 120 and the top glass 150.

Also, the dummy structure 162 performs a dam (dam) function of preventing the glass bonding member 152 and other foreign substances from penetrating into the first and second

optical structures

160 and 170. For example, the

optical structures

160, 170 perform a function of improving refraction and diffusion of incident light between the photosensor 120 and the top glass 150, and preferably, there is no foreign substance except for the respective structures.

The lower end of dummy structure 162 is at the same height as the prism as described above to perform the cofferdam function. Thus, the height of the dummy structures 162 may be substantially the same as the height of the prisms. The dummy structures 162 may be provided simultaneously in the process of forming the prisms.

In this case, the dummy structure 162 may be provided with the same material and shape as the prism. The material (material) of the dummy structure 162 is the same as the prism, but the shape (shape) thereof may be different. For example, in order to effectively perform the cofferdam function, the dummy structure 162 may have a quadrangular or rhombic shape.

The photoresist pattern 180 may include an epoxy-containing acrylic copolymer, a phenol resin, a filler, a curing accelerator, a hydroxyl or carboxyl compound, a radiation-polymerizing compound, and a photoinitiator. In the photoresist pattern 180, the refractive index is greater than 1, and light incident on each unit pixel is condensed on each unit pixel without being distorted, thereby preventing reflection.

Referring to fig. 2, an Optical Clear Adhesive (OCA) 200 is further included between the first optical structure 160 and the top glass 150 according to another embodiment of the present invention.

For example, for a space margin of the metal line 130 between the upper face of the light sensor 120 and the lower face of the top glass 150, the gap thereof is at least 200 μm. In general, when the thickness of each prism is 40 μm, the thickness of the photoresist pattern 180 provided needs to be 160 μm or more. However, if the thickness of the photoresist pattern 180 is increased to 150 μm or more, light passing through the prism may be refracted or distorted, and thus cannot be infinitely expanded. Therefore, the optical paste 200 is also provided on the first optical structure 160.

Referring to fig. 3, in another embodiment of the present invention, the optical glue as described above requires an additional process, and thus, the spatial margin can be ensured by increasing the thickness of the first optical structure.

For example, the prism 300 is generally formed by repeatedly arranging peak portions and valley portions in a pointed shape, is integrally formed, and can provide a pointed shape only at one side surface thereof.

In this case, the total height of the prism 300 is 90 μm or more, and the heights of the valleys and the peaks are equally provided at 40 μm or more. Therefore, a thickness of about 50 μm can be compensated by the prism main body.

Hereinafter, a method for manufacturing an image sensor package according to the present invention will be described with reference to fig. 4a to 4 g.

Referring to fig. 4a, a bare glass G provided with a first optical structure 160 and a dummy structure 162 is provided on one side.

First, the original bare glass G is prepared. The bare glass G is not limited to glass and may include transparent plastic. A prism or another first optical structure 160 is formed on the lower surface of the bare glass G. The dummy structures 162 may be fabricated simultaneously with the first optical structures 160 or sequentially. If the dummy structures 162 are formed simultaneously for the convenience of the manufacturing process, the dummy structures 162 may be formed of the same material and shape as the prisms.

The bare glass G may be integrated with the first optical structure 160 and/or the dummy structure 162. That is, a prism or the like can be manufactured by processing one side surface of the bare glass G. Alternatively, the first optical structure 162 and the like may be welded to the bare glass G.

The bare glass G includes a plurality of top glasses 150, and thus, the cutting lines S dividing the respective top glasses 150 may be marked on the bare glass G. For example, the cutting line S may be marked by a diamond sawing (diamond sawing) process.

Referring to fig. 4b, the bare glass G is separated into the respective top glasses 150. The bare glass G is separated into the respective top glasses 150 by a cutting (sawing) process.

Referring to fig. 4c, a photoresist pattern 180 is laminated on an upper portion of the light sensor 120, and the second optical structures 170 are again arrayed on the photoresist pattern 180.

Referring to fig. 4d, the light sensor 120 is die-bonded to the substrate 110 using the die bonding part 114.

Referring to fig. 4e, the substrate 110 and the photosensor 120 are wire bonded. For example, the substrate 110 and the photosensor 120 are electrically connected using a chip on wire bonding (chip on wire bonding) process.

Referring to fig. 4f, the barrier portion 140 is mounted on the substrate 110. Further, the barrier portion 140 is dam-bonded by the dam adhesive member 116.

Referring to fig. 4g, a glass adhesive member 152 is coated on the level difference surface of the barrier 140, and the top glass 150 and the barrier 140 are bonded to each other by the glass adhesive member 152.

In this case, the first optical structures 160 and the second optical structures 170 are aligned by the identification marks in a state where the top glass 150 faces downward by air suction or the like, and the dummy structures 162 are aligned.

Fig. 5 is a view illustrating an image sensor module including an image sensor package. Referring to fig. 5, the image sensor module 1000 uses an extensible module substrate 1300 to which an image sensor package can be connected outside of a side thereof, and in the module substrate, a driving part including an external coupling socket 1310, a signal processing element 1320, a driving integrated circuit 1330, a memory element (not shown), or the like can be packaged at an upper portion of the module substrate 1300.

As described above, the technical idea of the present invention is as follows: in a Chip On Board (COB) type image sensor package in which an optical sensor is attached to a package substrate and electrically connected using a wire bonding technique, prisms are arranged so as to correspond to microlenses with the microlenses interposed therebetween, thereby forming an optical path per unit pixel. Those skilled in the art can make various modifications within the scope of the basic technical idea of the present invention as described above.

Industrial applicability

The present invention has industrial applicability in that the structure of an image sensor package is changed by using the laws of nature to improve light collection efficiency per pixel.

Claims

1. An image sensor package, comprising:

a substrate;

an optical sensor attached to an upper surface of the substrate;

a metal wire for electrically connecting the substrate and the optical sensor;

a barrier portion attached to a periphery of an upper surface of the substrate;

a top glass supported by the barrier;

a first optical structure disposed below the top glass; and

and a second optical structure disposed above the optical sensor.

2. The image sensor package of claim 1, further comprising a photoresist pattern between the photo sensor and the second optical structure.

3. The image sensor package of claim 2,

the second optical structure comprises a microlens,

the first optical structure may comprise a prism,

the photosensor includes a plurality of unit pixels in a sensor array region, and the microlens and the prism are arranged so as to correspond to each pixel.

4. The image sensor package of claim 3, further comprising a dummy structure between the photoresist pattern and the top glass.

5. The image sensor package according to claim 4, wherein each of the microlenses is disposed between each of the prisms, and the dummy structures are alignment marks of each of the microlenses and each of the prisms.

6. The image sensor package of claim 5, wherein the height of the dummy structures is the same as the height of the prisms.

7. The image sensor package according to claim 3, wherein the prism is integrally formed in a shape of a cusp in which valleys and crests are repeatedly arranged on one side surface, a total height of the prism is 90 μm or more, and heights of the valleys and crests are 40 μm or more.

8. The image sensor package of claim 3,

an optical cement is also provided on the lower portion of the top glass,

the first optical structures are arranged on the optical adhesive.

9. An image sensor module, comprising:

a module substrate;

an optical sensor attached to an upper surface of the module substrate;

a metal wire for electrically connecting the module substrate and the optical sensor;

a barrier portion attached to a periphery of an upper surface of the module substrate;

a top glass supported by the barrier;

a first optical structure disposed below the top glass;

a second optical structure disposed above the optical sensor; and

and an optical sensor driving unit disposed outside the upper surface of the module substrate.

10. The image sensor module according to claim 9, wherein the photosensor driver includes at least one of a signal processing element, a memory element, a driver integrated circuit, and an external connection socket as a driver capable of performing an additional function of the photosensor.

11. The image sensor module of claim 9, further comprising a photoresist pattern between the light sensor and the second optical structure.

12. The image sensor module of claim 11,

the second optical structure comprises a microlens,

the first optical structure may comprise a prism,

13. The image sensor module of claim 12, further comprising dummy structures between the photoresist pattern and the top glass.

14. The image sensor module of claim 13, wherein each of the microlenses is disposed between each of the prisms, and the dummy structures are alignment marks of each of the microlenses and each of the prisms.

15. The image sensor module of claim 14, wherein the height of the dummy structure is the same as the height of the prism.

16. The image sensor module according to claim 12, wherein the prism is integrally formed in a shape of a cusp in which valleys and crests are repeatedly arranged on one side surface, a total height of the prism is 90 μm or more, and heights of the valleys and crests are 40 μm or more.

17. The image sensor module of claim 12,

an optical cement is also provided on the lower portion of the top glass,

the first optical structures are arranged on the optical adhesive.

18. An image sensor package manufacturing method, comprising:

preparing bare glass;

forming a plurality of prisms and one or more dummy structures on a lower surface of the bare glass;

cutting the bare glass to form top glass;

laminating a photoresist pattern on an upper surface of the optical sensor;

forming a plurality of microlenses on an upper surface of the photoresist pattern;

a step of bonding the optical sensor to a substrate chip;

bonding the substrate and the photosensor wire;

bonding the barrier portion to the substrate dam; and

and bonding the top glass to the barrier portion by a glass adhesive member on the barrier portion.

19. The method of claim 18, wherein the step of bonding the top glass to the barrier portion comprises the step of disposing each of the microlenses between each of the prisms.

20. An image sensor module, comprising:

the image sensor package of claim 1;

a display panel disposed on an upper portion of the image sensor package; and

and a module substrate in which the image sensor package is packaged.