CN113571872A - Internal matching chip antenna and manufacturing method thereof - Google Patents
Internal matching chip antenna and manufacturing method thereof Download PDFInfo
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- CN113571872A CN113571872A CN202110852823.7A CN202110852823A CN113571872A CN 113571872 A CN113571872 A CN 113571872A CN 202110852823 A CN202110852823 A CN 202110852823A CN 113571872 A CN113571872 A CN 113571872A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
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Abstract
The invention relates to the technical field of chip antennas, and particularly discloses an internal matching chip antenna and a manufacturing method thereof, wherein the internal matching chip antenna comprises a substrate, a plurality of first bottom plates and a plurality of second bottom plates, wherein the plurality of first bottom plates are arranged on two sides of the substrate, and the substrate and the first bottom plates are both provided with a plurality of metal patterns which are matched with each other to form an internal matching assembly; one of the second bottom plates is arranged below the substrate and is positioned at the lower side of the first bottom plate farthest from the substrate; the rest second bottom plates are arranged above the substrate at intervals and are positioned on the upper side of the first bottom plate farthest from the substrate; a plurality of first bottom plates and/or a plurality of second bottom plates above the substrate are provided with a plurality of metal patterns matched with each other to form an antenna; the antenna and the inner matching component are connected through a first connecting piece. The matching circuit is arranged in the chip antenna, the substrate, the first bottom plate and the second bottom plate are fully utilized, the matching assembly is prevented from occupying the space of the PCB, and the manufacturing cost is reduced.
Description
Technical Field
The invention relates to the technical field of chip antennas, in particular to an internal matching chip antenna and a manufacturing method thereof.
Background
Chip antennas are limited in size and require the use of miniaturized designs. The miniaturization technologies such as meander technology and short circuit loading all generate additional inductive reactance and capacitive reactance, which affect the impedance matching and radiation performance of the antenna.
At present, external matching circuits (Pi, T, L networks) are generally used to improve antenna impedance matching, increase antenna bandwidth, and optimize antenna radiation performance.
The external matching circuit occupies the space of the PCB board, and additional cost is also increased.
Disclosure of Invention
The invention aims to provide an internal matching chip antenna and a manufacturing method thereof, which aim to solve the problems that an external matching circuit occupies the space of a PCB and the cost is increased in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, the present invention provides an internal matching chip antenna, including:
a substrate;
the first bottom plates are arranged on two sides of the substrate, metal patterns are arranged on the substrate and the first bottom plates, and the metal patterns on the substrate and the first bottom plates are matched with each other to form an inner matching assembly;
a plurality of second bottom plates, wherein one of the second bottom plates is arranged below the substrate and positioned at the lower side of the first bottom plate farthest from the substrate; the rest of the second bottom plates are arranged above the substrate at intervals and are positioned on the upper side of the first bottom plate farthest from the substrate; a plurality of first bottom plates and/or a plurality of second bottom plates above the substrate are/is provided with metal patterns, and the metal patterns on the plurality of first bottom plates and/or the plurality of second bottom plates above the substrate are/is mutually matched to form an antenna; the antenna and the inner matching component are connected through a first connecting piece; an antenna feed pad and an antenna ground pad are arranged on the lower side of the first bottom plate below the substrate; the antenna feed pad and the antenna ground pad are connected to the antenna, respectively.
Preferably, the inner matching component comprises an LC circuit component.
Preferably, the LC circuit assembly is connected in series with the antenna, and the connection points are all at the front end of the antenna.
Preferably, the LC circuit assembly is connected in parallel with the antenna, and the connection points are both at the front end of the antenna; an external grounding pad is arranged on the lower side of the first bottom plate below the substrate; the external ground pad is connected to the LC circuit assembly.
Preferably, at least one external ground pad is provided.
Preferably, a fixing pad is disposed on the lower side of the first base plate under the substrate, and is used for fixing the internal matching chip antenna.
Preferably, the antenna further comprises a shielding component, wherein the shielding component is used for reducing mutual interference between the inner matching component and the antenna; the shielding assembly comprises a second metal through hole, a metal shielding layer and/or a metal protective layer.
In another aspect, the present invention provides a method for manufacturing an antenna, for preparing an internal matching chip antenna according to any one of the above aspects, including the following steps:
s01, forming a substrate by using a first dielectric material;
s02, preparing a plurality of first bottom plates on the upper surface and the lower surface of the substrate by using a second dielectric material respectively, and preparing a plurality of metal patterns matched with each other on the substrate and the plurality of first bottom plates to form an inner matching assembly;
s03, preparing a plurality of second bottom plates on the first bottom plate which is above the substrate and farthest from the substrate, and preparing a plurality of metal patterns which are matched with each other on the plurality of first bottom plates and/or the plurality of second bottom plates to form an antenna; the antenna and the internal matching component are connected through a first connecting piece; preparing a layer of second bottom plate below the first bottom plate which is below the substrate and farthest from the substrate; preparing an antenna feed pad, an antenna grounding pad and an external grounding pad on a first side of a second bottom plate below the substrate, wherein the first side is far away from the substrate; the antenna feed pad and the antenna grounding pad are respectively connected with the antenna, and the internal matching component is connected with the external grounding pad.
Preferably, the substrate and/or the second chassis is a PCB board, a metal layer is laid on the substrate and/or the second chassis, and then a metal pattern constituting the antenna is prepared by an etching or engraving process.
Preferably, the second medium material is glue, the first base plate is formed after the glue is dried, the metal layer is laid on the first base plate, and then the metal pattern forming the inner matching component is prepared through an etching process.
The invention has the beneficial effects that:
the invention provides an internal matching chip antenna and a manufacturing method thereof, wherein the internal matching chip antenna comprises a substrate, a plurality of first bottom plates and a plurality of second bottom plates, internal matching components are arranged on the substrate and the first bottom plates, antennas are arranged on the first bottom plates and/or the second bottom plates, a matching circuit is arranged inside the chip antenna, the positions of the substrate, the first bottom plates and the second bottom plates are fully utilized, the space occupying a PCB is avoided, and the manufacturing cost is reduced.
Drawings
FIG. 1 is a schematic diagram of an internal matching chip antenna according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for manufacturing an internal antenna according to an embodiment of the present invention.
In the figure:
1. a substrate;
2. a first base plate;
3. a second base plate;
4. an antenna;
5. an LC circuit assembly.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Where the terms "first position" and "second position" are two different positions, and where a first feature is "over", "above" and "on" a second feature, it is intended that the first feature is directly over and obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
Example one
As shown in fig. 1, the arrow direction in fig. 1 is upward, the present embodiment provides an internal matching chip antenna, which includes a substrate 1, a plurality of first bottom plates 2 and a plurality of second bottom plates 3, wherein the plurality of first bottom plates 2 are disposed on two sides of the substrate 1, the substrate 1 and the first bottom plates 2 are both provided with metal patterns, and the metal patterns on the substrate 1 and the first bottom plates 2 are mutually matched to form an internal matching component; one of the second base plates 3 is disposed below the substrate 1 and on the lower side of the first base plate 2 farthest from the substrate 1; the rest second bottom plates 3 are arranged above the substrate 1 at intervals and are positioned on the upper side of the first bottom plate 2 farthest from the substrate 1; the plurality of first bottom plates 2 and/or the plurality of second bottom plates 3 above the substrate 1 are provided with metal patterns, and the metal patterns on the plurality of first bottom plates 2 and/or the plurality of second bottom plates 3 above the substrate 1 are matched with each other to form an antenna 4; optionally, several metal patterns on the second base plate 3 above the substrate 1 cooperate to form an antenna 4; the antenna 4 is connected with the inner matching assembly through a first connecting piece; an antenna feed pad and an antenna ground pad are arranged on the lower side of the first bottom plate 2 below the substrate 1; the antenna feed pad and the antenna ground pad are connected to the antenna 4, respectively. The underside of the first base plate 2 below the substrate 1 is also provided with an antenna fixing pad for fixing an internal matching chip antenna. In other embodiments, the metal patterns on the first and second backplanes 2, 3 over the substrate 1 cooperate to form the antenna 4. This arrangement allows some or all of the first substrate 2 to be provided with both the metal pattern forming the inner matching component and the metal pattern forming the antenna 4. The degree of compactness of the chip antenna is improved, and the size is reduced.
In other embodiments, the number of layers of the metal pattern constituting the antenna 4 may be 2 to 8 layers. Preferably, in this embodiment, specifically, the number of layers of the antenna 4 is 4, and the metal patterns are electrically connected through the metal through holes. The overall size of the antenna 4 is 3.2mm 1.6mm 0.8mm, the working bandwidth is expanded to 6 GHz-8.75 GHz, and the radiation efficiency is achieved to be greater than 84% in the working frequency band.
Of course, in other embodiments, the type and model of the antenna 4 are not limited, and the shapes of the metal patterns of the respective layers may be adjusted according to requirements to form other types or types of antennas 4.
In this embodiment, the internal matching chip antenna includes a substrate 1, a plurality of first bottom plates 2 and a plurality of second bottom plates 3, the internal matching components are arranged on the substrate 1 and the first bottom plates 2, the antennas 4 are arranged on the first bottom plates 2 and/or the second bottom plates 3, the matching circuit is arranged in the chip antenna, the positions of the substrate 1, the first bottom plates 2 and the second bottom plates 3 are fully utilized, the space occupied by the matching components on the PCB is avoided, and the manufacturing cost is reduced.
Regarding the internal matching component, in this embodiment, optionally, the internal matching component includes an LC circuit component 5, where the LC circuit component 5 includes a capacitor, an inductor, and/or a resistor, and a specific connection manner may be set according to design requirements to form different resonant circuits. By disposing the LC circuit module 5 inside the chip antenna, the internal space of the internal chip antenna can be effectively utilized, and the performance of the antenna 4 can be improved.
Alternatively, the number of layers of the metal pattern constituting the LC circuit assembly 5 may be 2 to 12 layers. Preferably, in the present embodiment, the number of layers of the metal pattern constituting the LC circuit assembly 5 is 6.
Specifically, the 6-layer metal patterns cooperate with each other to form the LC circuit assembly 5, and the LC circuit assembly 5 is equivalent in effect to an electronic assembly including: the capacitor 1 of 0.6pF farad, the inductance 1 of 6nH, wherein, 0.6pF capacitor and antenna 4 are established ties, and the inductance of 6nH is parallelly connected with capacitor and antenna 4 respectively.
Of course, in other embodiments, the type and model of the LC circuit assembly 5 are not limited, and the shapes of the metal patterns of the respective layers may be adjusted as required to form other types or types of LC circuit assemblies 5.
In this embodiment, regarding the connection manner of the LC circuit component 5 and the antenna 4, optionally, the LC circuit component 5 is connected in parallel with the antenna 4, the connection points are all at the front end of the antenna 4, and an external ground pad is disposed on the lower side of the first base plate 2 below the substrate 1; the LC circuit component 5 is connected with the external grounding pad through a reserved metal through hole. This arrangement prevents the LC circuit assembly 5 from breaking the original current loop of the antenna 4. In particular, the connection point is located at the connection of the 50 ohm line and the antenna 4. By the parallel connection of the LC circuit assembly 5 and the antenna 4, the impedance matching of the antenna 4 and the radiation efficiency in the wide band are improved.
Of course, in other embodiments, the LC circuit assembly 5 may also be connected in series with the antenna 4, with the connection points all at the front end of the antenna 4. The above arrangement can also improve the impedance matching of the antenna 4 and the radiation efficiency in a wide band.
At least one external ground pad is provided. And each external ground pad is close to the front end of the antenna 4 and far away from the radiation loop of the antenna 4.
Optionally, the lower side of the first base plate 2 below the substrate 1 is provided with a fixing pad for fixing the internal matching chip antenna. The connection between the internal matching chip antenna and the external circuit is more convenient due to the arrangement.
Optionally, the first connection member is a metal via. The metal through holes are conductive column structures penetrating through the substrate 1, the first bottom plate 2 and/or the second bottom plate 3, and can penetrate through the substrate 1, the first bottom plate 2 and/or the second bottom plate 3 according to requirements. It should be noted that the metal through holes are conventional in the art, and therefore, the specific structure and the preparation method thereof are not described herein. In other embodiments, the metal through hole can be replaced by a semi-metal through hole, and the cross section of the semi-metal through hole is semicircular, so that the size of the chip antenna is reduced, and meanwhile, the material and the cost are saved.
Optionally, the inner matching chip antenna further comprises a shielding component for reducing mutual interference between the inner matching component and the antenna 4. In particular, the shielding assembly includes a metal via, a metal shielding layer, and/or a metal sheath. The metal sheath comprises a metal sheath arranged on the periphery of the substrate 1, the first bottom plate 2 and/or the second bottom plate 3. The metal vias may be replaced by semi-metal vias. The metal protection layer is prepared by a side metallization technique, and it should be noted that the preparation of the metal through hole and the side metallization technique are conventional in the art, and the specific preparation method thereof is not described herein again. The semi-metal through hole and the metal protective layer can reduce the size occupied during connection, and the size of the chip antenna is further reduced.
Optionally, the material of the metal via, the metal shielding layer and/or the metal protecting layer may be a conductive metal such as copper, silver, etc.
Example two
As shown in fig. 2, the present embodiment further provides a method for manufacturing an antenna, which is used to prepare the internal matching chip antenna, and includes the following steps:
s01, the substrate 1 is formed using the first dielectric material.
S02, preparing a plurality of first base plates 2 on the upper and lower surfaces of the substrate 1 using the second dielectric material, respectively, and preparing a plurality of metal patterns on the substrate 1 and the plurality of first base plates 2 to be fitted to each other to form inner matching members.
S03, preparing a plurality of second bottom plates 3 on the first bottom plate 2 above the substrate 1 and farthest from the substrate 1, and preparing a plurality of metal patterns matched with each other on the plurality of first bottom plates 2 and/or the plurality of second bottom plates 3 to form the antenna 4; the antenna 4 is connected with the inner matching assembly through a first connecting piece; preparing a layer of second bottom plate 3 below the first bottom plate 2 which is below the substrate 1 and is farthest away from the substrate 1; preparing an antenna feed pad, an antenna grounding pad, an antenna fixing pad and an external grounding pad on a first side, away from the substrate 1, of the second bottom plate 3 below the substrate 1; the antenna feed pad and the antenna grounding pad are respectively connected with the antenna 4, and the internal matching component is connected with the external grounding pad. It should be noted that the connection between the antenna feed pad and the antenna ground pad and the antenna 4 is conventional in the art, and therefore, the detailed connection manner thereof is not described herein again.
Specifically, the method comprises the following steps:
s01, preparing the substrate 1 using the first dielectric material.
S02, preparing a first metal pattern and a second metal pattern on the upper and lower surfaces of the substrate 1, respectively.
S03, preparing the first and second backplanes 2, 3 using the second dielectric material on the side of the first and second metal patterns facing away from the substrate 1, respectively.
S04, a third metal pattern and a fourth metal pattern are respectively formed on the side of the first base plate 2 facing away from the substrate 1 and the side of the second base plate 3 facing away from the substrate 1.
S05, respectively preparing a third bottom plate and a fourth bottom plate using the second dielectric material on a side of the third metal pattern facing away from the substrate 1 and a side of the fourth metal pattern facing away from the substrate 1.
S06, respectively preparing a fifth metal pattern and a sixth metal pattern on a side of the third base plate facing away from the substrate 1 and a side of the fourth base plate facing away from the substrate 1.
S07, preparing a plurality of layers of first antenna 4 bottom plates and a second antenna 4 bottom plate by using a third dielectric material on the side, away from the substrate 1, of the fifth metal pattern and the side, away from the substrate 1, of the sixth metal pattern respectively; and preparing a plurality of antenna 4 metal layers in a plurality of first elastic bottom plates to form an antenna 4, and preparing an antenna feed pad, an antenna ground pad, an antenna fixing pad and an external ground pad on one side of a second antenna 4 bottom plate far away from the substrate 1, wherein the antenna feed pad and the antenna ground pad are connected with the antenna 4 through reserved metal through holes, the first metal pattern, the second metal pattern, the third metal pattern, the fourth metal pattern, the fifth metal pattern and the sixth metal pattern are connected through the reserved metal through holes to form an internal matching component, the external ground pad and the internal matching component are connected through the reserved metal through holes, and the antenna fixing pad is used for fixing the internal matching chip antenna.
Optionally, the substrate 1 and/or the second base plate 3 is a PCB, a metal layer is laid on the substrate 1 and/or the second base plate 3, and then a metal pattern constituting the antenna 4 is prepared by etching or engraving. The process for manufacturing the circuit by adopting the PCB as the substrate is mature and has low cost.
In this embodiment, preferably, the second dielectric material is glue, and preferably is a prepreg, where the prepreg includes a resin and a reinforcing material. The resin is a thermoplastic resin, such as epoxy resin, bismaleimide triazine, polyimide and other various resins, and the reinforcing material is one or a composite material of glass fiber cloth and paper base.
In the process of pressing the plate, the glue is melted into liquid through high temperature and high pressure, then high molecular polymerization reaction is carried out to obtain solid polymer, and the metal layer (namely copper foil) and the metal layer, the metal layer and the substrate 1, the metal layer and the first bottom plate 2 or the metal layer and the second bottom plate 3 are bonded together.
When the metal pattern matching assembly is used, a prepreg is placed on a substrate 1, a metal layer is laid on the prepreg, the prepreg is melted and solidified to form a first bottom plate 2, the substrate 1 is fixedly connected with the metal layer, a metal pattern of the matching assembly in the assembly is prepared through an etching process, the prepreg and the metal layer are laid, the prepreg is melted and solidified to form the first bottom plate 1, two metal layers are fixedly connected, and the prepreg between the two metal layers plays roles of bonding, insulating and bearing. After the inner matching assembly is prepared, laying a prepreg and a PCB, melting the prepreg, solidifying the prepreg and the PCB, and fixedly connecting the PCB to the inner matching assembly; and then laying a prepreg and a metal layer, melting the prepreg, solidifying the prepreg and fixing the metal layer on the PCB, wherein the prepreg plays a role in bonding. Specifically, the inner matching component is formed by a first metal pattern, a second metal pattern, a third metal pattern, a fourth metal pattern, a fifth metal pattern and a sixth metal pattern. The process has high precision and can meet the preparation requirement of the LC circuit component 5.
Alternatively, at least two external ground pads are provided, and each external ground pad is located at the front end of the antenna 4.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. An internal matching chip antenna, comprising:
a substrate (1);
the plurality of first bottom plates (2) are arranged on two sides of the substrate (1), metal patterns are arranged on the substrate (1) and the first bottom plates (2), and the metal patterns on the substrate (1) and the first bottom plates (2) are matched with each other to form an inner matching assembly;
a plurality of second bottom plates (3), wherein one of the second bottom plates (3) is arranged below the substrate (1) and is positioned at the lower side of the first bottom plate (2) farthest from the substrate (1); the rest of the second bottom plates (3) are arranged above the substrate (1) at intervals and are positioned on the upper side of the first bottom plate (2) farthest from the substrate (1); a plurality of first bottom plates (2) and/or a plurality of second bottom plates (3) above the substrate (1) are provided with metal patterns, and the metal patterns on the plurality of first bottom plates (2) and/or the plurality of second bottom plates (3) above the substrate (1) are matched with each other to form an antenna (4); the antenna (4) and the inner matching assembly are connected through a first connecting piece; an antenna feed pad and an antenna ground pad are arranged on the lower side of the first bottom plate (2) below the substrate (1); the antenna feed pad and the antenna ground pad are respectively connected with the antenna (4).
2. The internal matching chip antenna according to claim 1, characterized in that said internal matching component comprises an LC circuit component (5).
3. The inter-matching chip antenna according to claim 2, characterized in that the LC circuit assembly (5) is connected in series with the antenna (4) with connection points all at the front end of the antenna (4).
4. The inter-matching chip antenna according to claim 2, characterized in that the LC circuit assembly (5) is connected in parallel with the antenna (4) with connection points all at the front end of the antenna (4); an external grounding pad is arranged on the lower side of the first bottom plate (2) below the substrate (1); the external ground pad is connected with the LC circuit component (5).
5. The inter-matched chip antenna as recited in claim 4, wherein at least one external ground pad is provided.
6. The inter-matching chip antenna according to claim 1, characterized in that the underside of the first base plate (2) below the substrate (1) is provided with fixing pads for fixing the inter-matching chip antenna.
7. The internal matching chip antenna according to claim 1, further comprising a shielding component for reducing mutual interference between said internal matching component and said antenna (4); the shielding assembly comprises a second metal through hole, a metal shielding layer and/or a metal protective layer.
8. A method for manufacturing an antenna for manufacturing an internal matching chip antenna according to any one of claims 1 to 7, comprising the steps of:
s01, forming a substrate (1) by using a first dielectric material;
s02, preparing a plurality of first bottom plates (2) on the upper surface and the lower surface of the substrate (1) by using a second dielectric material respectively, and preparing a plurality of metal patterns which are matched with each other on the substrate (1) and the plurality of first bottom plates (2) to form an inner matching component;
s03, preparing a plurality of second bottom plates (3) on the first bottom plate (2) which is above the substrate (1) and farthest from the substrate (1), and preparing a plurality of metal patterns which are matched with each other on the plurality of first bottom plates (2) and/or the plurality of second bottom plates (3) to form an antenna (4); the antenna (4) is connected with the inner matching assembly through a first connecting piece; preparing a layer of second bottom plate (3) below a first bottom plate (2) which is below the substrate (1) and farthest from the substrate (1); preparing an antenna feed pad, an antenna grounding pad and an external grounding pad on a first side, away from the substrate (1), of a second bottom plate (3) below the substrate (1); the antenna feed pad and the antenna grounding pad are respectively connected with the antenna (4), and the internal matching component is connected with the external grounding pad.
9. Method for manufacturing an antenna according to claim 8, characterized in that the substrate (1) and/or the second body (3) is a PCB board, a metal layer is laid on the substrate (1) and/or the second body (3), and then the metal pattern constituting the antenna (4) is prepared by etching or engraving process.
10. The method of claim 8, wherein the second dielectric material is glue, the first substrate (2) is formed after the glue is dried, the metal layer is laid on the first substrate (2), and then the metal pattern constituting the inner matching member is prepared by an etching process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110852823.7A CN113571872A (en) | 2021-07-27 | 2021-07-27 | Internal matching chip antenna and manufacturing method thereof |
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| CN202110852823.7A CN113571872A (en) | 2021-07-27 | 2021-07-27 | Internal matching chip antenna and manufacturing method thereof |
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| CN (1) | CN113571872A (en) |
Citations (13)
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Application publication date: 20211029 |