CN111987447A - Antenna module and communication equipment with encapsulation - Google Patents
Antenna module and communication equipment with encapsulation Download PDFInfo
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- CN111987447A CN111987447A CN202010898174.XA CN202010898174A CN111987447A CN 111987447 A CN111987447 A CN 111987447A CN 202010898174 A CN202010898174 A CN 202010898174A CN 111987447 A CN111987447 A CN 111987447A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
Abstract
The invention discloses an antenna module with a package, which comprises a PCB, an integrated circuit chip fixedly connected to the bottom surface of the PCB, an auxiliary circuit, a connecting assembly, a packaging layer, an antenna unit, a metal block array and an antenna feed network, wherein the PCB is formed by stacking a plurality of metal layers, the antenna unit and the metal block array are respectively positioned on different metal layers on one side of the PCB far away from the integrated circuit chip, the antenna feed network is positioned on the metal layer on one side of the PCB close to the integrated circuit chip, one end of the antenna feed network is connected with the integrated circuit chip, the other end of the antenna feed network provides feed for the antenna unit, and the metal block array is formed by arranging a plurality of discrete metal blocks.
Description
Technical Field
The invention belongs to the field of antenna design, and particularly relates to an antenna module with a package and communication equipment.
Background
With the evolution of the fifth generation communication technology, communication devices are moving toward low latency, high reliability and large bandwidth. Millimeter waves are gradually pushed on the stage of fifth-generation communication technology because of their short wavelength and wide bandwidth to meet these demands more easily. But the millimeter wave wavelength is short, so that the transmission loss of the millimeter wave communication system is sensitive to the length in both circuit and space. Therefore, the concept of "packaged antenna" integrating an antenna and a chip is gradually used to design millimeter wave communication systems.
At present, a PCB used for packaging an antenna is generally formed by laminating a core board and a prepreg. In order to increase the operating bandwidth of the antenna, multiple layers of prepregs need to be stacked to increase the height of the antenna. Usually, the residual copper rate between the antenna prepregs is very low, so that the prepreg flow is serious, the thickness of the prepregs after lamination is reduced, the bandwidth of the antenna is further reduced, bubbles are easily generated, and the production yield of the packaged antenna is further reduced.
Disclosure of Invention
The invention aims to provide an antenna module with a package and communication equipment, which can increase the residual copper rate of a PCB (printed Circuit Board) of the packaged antenna, further increase the working bandwidth of the antenna and increase the production yield of the packaged antenna.
In order to solve the problems, the technical scheme of the invention is as follows:
an antenna module with a package comprises a PCB, an integrated circuit chip, an auxiliary circuit, a connecting assembly and a packaging layer, wherein the integrated circuit chip, the auxiliary circuit, the connecting assembly and the packaging layer are fixedly connected to the bottom surface of the PCB;
the PCB is formed by stacking a plurality of metal layers, the antenna unit and the metal block array are respectively positioned on different metal layers on one side of the PCB, which is far away from the integrated circuit chip, the antenna feed network is positioned on the metal layer on one side of the PCB, which is close to the integrated circuit chip, one end of the antenna feed network is connected with the integrated circuit chip, and the other end of the antenna feed network provides feed for the antenna unit;
the metal block array is formed by arranging a plurality of discrete metal blocks.
Preferably, the antenna feed network is a coupled feed or a probe direct feed or a dual probe feed.
Preferably, the antenna unit comprises a plurality of first antenna units, and the metal block array comprises a plurality of first metal block arrays;
PCB is piled up by six layers of metal levels and forms, from last to being first metal level, second metal level, third metal level, fourth metal level, fifth metal level and the sixth metal level down in proper order, a plurality of first antenna element array arrange in on the first metal level, it is a plurality of first metal block array arrange in on the second metal level, the quantity of antenna feed network with the quantity of first antenna element is unanimous, and is a plurality of antenna feed network arrange in on the fifth metal level, it is a plurality of the one end of antenna feed network is respectively through metallized via hole and a plurality of first antenna element one-to-one links to each other, and is a plurality of the other end of antenna feed network all with integrated circuit chip links to each other.
Preferably, the first metal block array includes a central first metal block array and peripheral first metal block arrays arranged around the central first metal block array, the central first metal block arrays are respectively located under the first antenna units in a one-to-one correspondence manner, and there is no overlapping area between projections of the peripheral first metal block arrays on the first metal layer and the first antenna units.
Preferably, the metal blocks constituting the first metal block array have a regular hexagonal shape.
Preferably, the first antenna element is circular or triangular or rectangular or elliptical.
Preferably, the metal blocks constituting the first metal block array have an outer dimension smaller than an operating wavelength of the first antenna element.
Preferably, the antenna unit includes a plurality of first antenna units and a plurality of second antenna units, and the metal block array includes a plurality of first metal block arrays, a plurality of second metal block arrays, and a plurality of third metal block arrays;
the PCB is formed by stacking ten metal layers, and sequentially comprises a first metal layer, a second metal layer, a third metal layer, a fourth metal layer, a fifth metal layer, a sixth metal layer, a seventh metal layer, an eighth metal layer, a ninth metal layer and a tenth metal layer from top to bottom, wherein a plurality of first antenna unit arrays are arranged on the third metal layer, a plurality of second antenna unit arrays are arranged on the first metal layer, a plurality of first metal block arrays are arranged on the fourth metal layer, a plurality of second metal block arrays are arranged on the third metal layer along the circumferential direction of the first antenna units, a plurality of third metal block arrays are arranged on the second metal layer, the number of the antenna feed networks is consistent with the number of the first antenna units, and a plurality of the antenna feed networks are arranged on the ninth metal layer, one ends of the antenna feed networks are respectively connected with the first antenna units in a one-to-one correspondence mode through metallized through holes, and the other ends of the antenna feed networks are connected with the integrated circuit chip.
Preferably, the projection of the second antenna unit on the third metal layer has an overlapping region with the first antenna unit, and has no overlapping region with the second metal block array.
Preferably, the first metal block array includes a central first metal block array and peripheral first metal block arrays arranged around the central first metal block array, the central first metal block arrays are respectively located under the first antenna units in a one-to-one correspondence manner, and there is no overlapping area between projections of the peripheral first metal block arrays on the third metal layer and the first antenna units.
Preferably, the third metal block array includes a central third metal block array and a peripheral third metal block array arranged around the central third metal block array, a projection of the central third metal block array on the third metal layer is located in the first antenna unit, a projection of the central third metal block array on the first metal layer is located in the second antenna unit, a projection of the peripheral third metal block array on the first metal layer is located outside the first antenna unit, and a projection of the peripheral third metal block array on the first metal layer is located outside the second antenna unit.
Preferably, the metal blocks constituting the first metal block array have a regular hexagonal shape, the metal blocks constituting the second metal block array have a regular hexagonal shape, and the metal blocks constituting the third metal block array have a regular hexagonal shape.
Preferably, the first antenna unit is circular or triangular or rectangular or elliptical, and the second antenna unit is circular or triangular or rectangular or elliptical.
Preferably, the external dimension of the metal block constituting the first metal block array is smaller than the operating wavelengths of the first antenna unit and the second antenna unit, the external dimension of the metal block constituting the second metal block array is smaller than the operating wavelengths of the first antenna unit and the second antenna unit, and the external dimension of the metal block constituting the third metal block array is smaller than the operating wavelengths of the first antenna unit and the second antenna unit.
Preferably, the outer surface of the encapsulation layer is provided with a shielding layer.
Preferably, the integrated circuit chip is a millimeter wave phased array chip.
Preferably, the auxiliary circuit comprises a capacitor or a resistor or an inductor.
Preferably, the connection assembly is a BGA straight ball or connector.
Based on the same inventive concept, the invention also provides communication equipment comprising the antenna module with the package.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following advantages and positive effects:
1) the invention provides an antenna module with a package, which comprises a PCB, an integrated circuit chip fixedly connected to the bottom surface of the PCB, an auxiliary circuit, a connecting assembly and a packaging layer, and also comprises an antenna unit, a metal block array and an antenna feed network, wherein the PCB is formed by stacking a plurality of metal layers, the antenna unit and the metal block array are respectively positioned on different metal layers on one side of the PCB far away from the integrated circuit chip, the antenna feed network is positioned on the metal layer on one side of the PCB close to the integrated circuit chip, one end of the antenna feed network is connected with the integrated circuit chip, the other end of the antenna feed network provides feed for the antenna unit, and the metal block array is formed by arranging a plurality of discrete metal block arrays, so that the residual copper rate of the packaged antenna PCB can be increased, the working bandwidth of an antenna can be further increased, and the production yield of.
Drawings
Fig. 1 is a cross-sectional view of an antenna module with a package according to an embodiment of the present invention;
FIG. 2 is a schematic plan view of a first metal layer of the PCB of FIG. 1;
FIG. 3 is a schematic plan view of a second metal layer of the PCB of FIG. 1;
fig. 4 is a cross-sectional view of an antenna module with a package according to a second embodiment of the present invention;
FIG. 5 is a schematic plan view of a third metal layer of the PCB of FIG. 4;
FIG. 6 is a schematic plan view of a first metal layer of the PCB of FIG. 4;
FIG. 7 is a schematic plan view of a second metal layer of the PCB of FIG. 4;
fig. 8 is a schematic diagram of a feeding position of an antenna module with a package according to a third embodiment of the present invention;
fig. 9 is a simulation result diagram of the reflection coefficient of an antenna module with a package according to a third embodiment of the present invention;
fig. 10 is a diagram of simulation results of the same-polarization different-unit isolation of the antenna module with package according to the third embodiment of the present invention;
fig. 11 is a diagram of simulation results of different polarization isolation degrees of the same unit of an antenna module with a package according to a third embodiment of the present invention;
fig. 12 is a schematic plan view of a second antenna unit with an encapsulated antenna module according to a fourth embodiment of the present invention;
fig. 13 is a schematic plan view of a third metal block array with an encapsulated antenna module according to a fourth embodiment of the present invention;
fig. 14 is a schematic plan view of a first antenna element and a second metal block array of an antenna module with a package according to a fourth embodiment of the present invention.
Description of reference numerals:
1: a PCB; 101: a first metal layer; 102: a second metal layer; 103: a third metal layer; 104: a fourth metal layer; 105: a fifth metal layer; 106: a sixth metal layer; 107: a seventh metal layer; 108: an eighth metal layer; 109: a ninth metal layer; 110: a tenth metal layer; 2: an antenna unit; 201: a first antenna element; 202: a second antenna element; 3: an array of metal blocks; 301: a first array of metal blocks; 3011: a central first array of metal blocks; 3012: a surrounding first array of metal blocks; 302: a second array of metal blocks; 303: a third array of metal blocks; 3031: a central third metal block array; 3032: a surrounding third array of metal blocks; 4: an antenna feed network; 5: an integrated circuit chip; 6: an auxiliary circuit; 7: a connecting assembly; 8: a packaging layer; 9: and a shielding layer.
Detailed Description
The following provides a detailed description of an antenna module with a package and a communication device according to the present invention with reference to the accompanying drawings. Advantages and features of the present invention will become apparent from the following description and from the claims.
The invention provides an antenna module with a package and communication equipment, which aim to solve the problems that residual copper rate between prepregs in the conventional packaged antenna is low, the flowing glue is serious, the thickness of the prepregs after lamination is reduced, the bandwidth of the antenna is reduced, bubbles are easy to generate, and the production yield of the packaged antenna is reduced.
An antenna module with a package comprises a PCB, an integrated circuit chip, an auxiliary circuit, a connecting assembly and a packaging layer, wherein the integrated circuit chip, the auxiliary circuit, the connecting assembly and the packaging layer are fixedly connected to the bottom surface of the PCB;
the PCB is formed by stacking a plurality of metal layers, the antenna unit and the metal block array are respectively positioned on different metal layers on one side of the PCB, which is far away from the integrated circuit chip, the antenna feed network is positioned on the metal layer on one side of the PCB, which is close to the integrated circuit chip, one end of the antenna feed network is connected with the integrated circuit chip, and the other end of the antenna feed network provides feed for the antenna unit;
the metal block array is formed by arranging a plurality of discrete metal block arrays.
Preferably, the antenna feed network is a coupled feed or a probe direct feed or a dual probe feed.
Five examples are shown below.
Example one
Referring to fig. 1 to 3, the present embodiment provides an antenna module with a package, including a PCB1, an integrated circuit chip 5 fixedly connected to a bottom surface of the PCB1, an auxiliary circuit 6, a connecting assembly 7, a package layer 8, an antenna unit 2, a metal block array 3, and an antenna feed network 4;
the PCB1 is formed by stacking six metal layers, namely a first metal layer 101, a second metal layer 102, a third metal layer 103, a fourth metal layer 104, a fifth metal layer 105 and a sixth metal layer 106 from top to bottom in sequence;
referring to fig. 2, the antenna unit 2 includes a plurality of first antenna units 201, the plurality of first antenna units 201 are arranged on the first metal layer 101 in an array, the plurality of first antenna units 201 are uniformly arranged at equal intervals, in this embodiment, in order to increase the gain of the antenna module, the number of the first antenna units 201 is four, actually is not limited to four, the number of the first antenna units may be increased or decreased appropriately according to the actual application scenario, the four first antenna units 201 are arranged in an array of four rows, and the first antenna units 201 may be circular, triangular, rectangular, elliptical, or other polygonal shapes;
referring to fig. 3, the metal block array 3 includes a plurality of first metal block arrays 301, the plurality of first metal block arrays 301 are arranged on the second metal layer 102, the first metal block arrays 301 are composed of a plurality of discrete metal block units, the metal block units may be in any shape such as square, circular, triangular, etc., the first metal block arrays 301 may also be a combination of metal block units in various shapes, in this embodiment, the metal block units are preferably regular hexagons, and have a more compact arrangement mode in the same area, so as to improve the residual copper ratio of the second metal layer 102 of the PCB1 to the maximum extent; in addition, in order not to reduce the operating bandwidth of the first antenna element 201 and not to change the resonant frequency of the first antenna element 201, the external dimensions of the metal block elements constituting the first metal block array 301 are smaller than the operating wavelength of the first antenna element 201;
referring to fig. 3, in order not to reduce the operating bandwidth of the first antenna element 201 and not to change the resonant frequency of the first antenna element 201, the first metal block array 301 includes a central first metal block array 3011 and a peripheral first metal block array 3012 arranged around the central first metal block array 3011, and the central first metal block arrays 3011 are respectively located under the first antenna elements 201 one by one, there is no overlapping area between the projection of the peripheral first metal block arrays 3012 on the first metal layer 101 and the first antenna elements 201, by arranging the first metal block array 301 in this way, the copper residue ratio of the second metal layer 102 of the PCB1 can be increased without reducing the operating bandwidth of the first antenna element 201 and without changing the resonant frequency of the first antenna element 201, the glue flowing of the prepreg between the top layer and the second layer in the PCB production process can be reduced, and the reduction of the thickness of the prepreg can be restrained;
in the embodiment, the first metal module array 301 includes one layer, and in practical application, the number of layers of the first metal module array 301 may be set according to the number of prepregs;
the number of the antenna feed networks 4 is the same as that of the first antenna elements 201, the plurality of antenna feed networks 4 are arranged on the fifth metal layer 105, in this embodiment, one ends of the plurality of antenna feed networks 4 are respectively connected with the plurality of first antenna elements 201 through metallized via holes in a one-to-one correspondence manner, but the antenna feed networks 4 may also select other feed modes such as coupling feed or dual probe feed, and the like, and the other ends of the plurality of antenna feed networks 4 are connected with the integrated circuit chip 5;
in this embodiment, the integrated circuit chip 5 is a millimeter wave phased array chip, which can change the feeding amplitude and phase of the first antenna element 201, and thus can realize beam scanning of the antenna module with package. The auxiliary circuit 6 includes a capacitor, a resistor, an inductor, or the like, and is used to ensure the normal and stable operation of the integrated circuit chip 5. The packaging layer 8 is used for plastically packaging the integrated circuit chip 5 and the auxiliary circuit 6, and the reliability of the antenna module with the package can be improved. The connection component 7 is one of a BGA (ball grid array) straight ball or a connector, and is used for realizing connection between an antenna module with a package and an external mainboard, and in any connection mode, at least a radio frequency line, a control signal line, a power line and a ground wire are required to be connected with the external mainboard.
Example two
Referring to fig. 4 to 7, the present embodiment provides an antenna module with a package, including a PCB1, an integrated circuit chip 5 fixedly connected to a bottom surface of the PCB1, an auxiliary circuit 6, a connecting assembly 7, a package layer 8, an antenna unit 2, a metal block array 3, and an antenna feed network 4;
the PCB1 is formed by stacking ten metal layers, which are a first metal layer 101, a second metal layer 102, a third metal layer 103, a fourth metal layer 104, a fifth metal layer 105, a sixth metal layer 106, a seventh metal layer 107, an eighth metal layer 108, a ninth metal layer 109 and a tenth metal layer 110 in sequence from top to bottom;
the antenna unit 2 includes a plurality of first antenna units 201 and a plurality of second antenna units 202, on the basis of the first embodiment, the second antenna units 202 are added above the first antenna units 201, and the plurality of first antenna units 201 are arranged in an array on the third metal layer 103, as shown in fig. 5, the arrangement and shape of the first antenna units 201 are the same as those in the first embodiment, a second metal block array 302 is further disposed around the first antenna units 201, the second metal block array 302 and the first antenna units 302 are located on the same layer, that is, on the third metal layer 103, and the second metal block array 302 is not in physical contact with the first antenna units 201; the second metal block array 302 is composed of a plurality of discrete metal block units, the shape of the metal block units can be any shape such as square, round, triangle, etc., the second metal block array 302 can also be a combination of metal block units with various shapes, in this embodiment, the shape of the metal block units is preferably regular hexagon, which has a more compact arrangement mode in the same area, and can improve the residual copper rate of the third metal layer 103 of the PCB1 to the maximum extent. In addition, in order not to reduce the operating bandwidth of the first antenna element 201 and the second antenna element 202 and not to change the resonant frequency of the first antenna element and the second antenna element, the maximum external dimension of the metal block element is much smaller than the operating wavelength of the first antenna element 201 and the second antenna element 202;
as shown in fig. 6, the second antenna elements 202 are arranged on the first metal layer 101 in an array, the projection of the second antenna elements 202 on the third metal layer 103 has an overlapping area with the first antenna elements 201, and has no overlapping area with the second metal block array 302, and the second antenna elements 202 are circular, and may also be triangular, rectangular, elliptical, or other polygonal shapes. In order to increase the gain of the antenna module, the number of the second antenna units 202 is also set to be four, which is not limited to four actually, and the number of the second antenna units 202 can be increased or decreased appropriately according to the actual application scenario;
as shown in fig. 7, in this embodiment, on the basis of the first embodiment, a second metal block array 302 and a third metal block array 303 are added above the first metal block array 301, the arrangement and shape of the first metal block array 301 are the same as those of the first embodiment, and not described here, wherein the second metal block array 302 is arranged on the third metal layer 103 along the circumferential direction of the first antenna unit 201, as described above; the third metal block array 303 is disposed between the first antenna unit 201 and the second antenna unit 202, the third metal block array 303 is composed of a plurality of discrete metal block units, the shape of the metal block units may be any shape such as square, circle, triangle, etc., the third metal block array 303 may also be a combination of metal block units of various shapes, in this embodiment, the shape of the metal block units is preferably regular hexagon, which has a more compact arrangement mode in the same area, and can maximally improve the residual copper ratio of the second metal layer 102 of the PCB 1. In addition, in order not to reduce the operating bandwidth of the first antenna element 201 and the second antenna element 202 and not to change the resonant frequency of the first antenna element 201 and the second antenna element 202. The maximum external dimension of the metal block unit is far smaller than the working wavelength of the first antenna unit 201 and the second antenna unit 202;
in this embodiment, in order not to reduce the operating bandwidths of the first and second antenna units 201 and 202 and not to change the resonant frequencies of the first and second antenna units 201 and 202, the third metal block array 303 includes a central third metal block array 3031 and a peripheral third metal block array 3032 arranged around the central third metal block array 3031, a projection of the central third metal block array 3031 on the third metal layer 103 is located in the first antenna unit 201, a projection of the central third metal block array 3031 on the first metal layer 101 is located in the second antenna unit 202, a projection of the peripheral third metal block array 3032 on the first metal layer 101 is located outside the first antenna unit 201, and a projection of the peripheral third metal block array 3032 on the first metal layer 101 is located outside the second antenna unit 202, and the third metal block array 303 is configured in such a way that the operating bandwidths of the first and second antenna units are not reduced and the first and second antenna units are not changed, Under the condition of the resonant frequency of the second antenna unit, the residual copper rate of the second metal layer 102 of the PCB1 is improved, so that the gummosis of the prepreg between the top layer and the second layer in the PCB production process can be reduced, and the reduction of the thickness of the prepreg can be restrained;
in this embodiment, a layer of the third metal module array 303 is included, and in actual application, the number of layers of the third metal module array 303 may be set according to the number of prepregs;
the number of the antenna feed networks 4 is the same as that of the first antenna elements 201, and the plurality of antenna feed networks 4 are arranged on the ninth metal layer 109, in this embodiment, one ends of the plurality of antenna feed networks 4 are respectively connected with the plurality of first antenna elements 201 through metallized via holes in a one-to-one correspondence manner, but the antenna feed networks 4 may also select other feed manners such as coupling feed or dual probe feed, and the like, which is not limited herein, and meanwhile, the antenna feed networks 4 may also feed the second antenna elements 202, and the other ends of the plurality of antenna feed networks 4 are all connected with the integrated circuit chip 5;
in this embodiment, the integrated circuit chip 5 is a millimeter wave phased array chip, which can change the feeding amplitude and phase of the first antenna element 201, and thus can realize beam scanning of the antenna module with package. The auxiliary circuit 6 includes a capacitor, a resistor, an inductor, or the like, and is used to ensure the normal and stable operation of the integrated circuit chip 5. The packaging layer 8 is used for plastically packaging the integrated circuit chip 5 and the auxiliary circuit 6, and the reliability of the antenna module with the package can be improved. The connecting assembly 7 is one of a BGA (ball grid array) straight ball or a connector and is used for realizing the connection between an antenna module with a package and an external mainboard, and at least a radio frequency line, a control signal line, a power line and a ground wire are required to be connected with the external mainboard in any connecting mode;
optionally, the outer surface of the encapsulation layer 8 is provided with a shielding layer 9, the shielding layer 9 is made of a metal material, on one hand, the shielding layer is used for reducing electromagnetic interference of the antenna module with the encapsulation from the outside, and on the other hand, the shielding layer is used for increasing heat dissipation of the antenna module with the encapsulation.
EXAMPLE III
Referring to fig. 8 to 11, the present embodiment provides another antenna module with a package, the frame structure of the antenna module is the same as that of the antenna module provided in the second embodiment, and the following mainly describes the differences between the second embodiment and the present embodiment;
in this embodiment, the PCB1 is formed by laminating 12 layers of prepregs, a core board and 12 layers of copper foils, wherein 6 layers of prepregs and 6 layers of copper foils are located on one side of the core board, and the remaining 6 layers of prepregs and 6 layers of copper foils are located on the other side of the core board, that is, the prepregs and the copper foils are symmetrically distributed along the core board;
the present embodiment includes a first antenna element 201, a second antenna element 202, a second metal block array 302, and a multilayer third metal block array 303. The antenna feed network 4 is directly connected to the first antenna elements 201 through the metalized via, each first antenna element 201 includes two antenna feed networks 4, and is configured to implement two polarization modes in which the first antenna elements 201 are perpendicular to each other, generally +0 degrees and +90 degrees, or +45 degrees and-45 degrees, as shown in fig. 8, in this embodiment, the polarization modes of +45 degrees and-45 degrees are adopted, a schematic diagram of a feed position of the first antenna element 201 is shown in fig. 8, 2011 represents a feed position generating polarization of +45 degrees, and 2012 represents a feed position generating polarization of-45 degrees.
Referring to fig. 8, there are ten first antenna elements 201 and second arrays of antenna elements 202, there are ten second arrays of metal blocks 302 on the same level as the first antenna elements 201, and there are five third arrays of metal blocks 303, ten on each level, and the second antenna elements 202 are used to increase the bandwidth of the first antenna elements 201. The antenna layer adopts six layers of prepregs for pressing and is used for improving the height of the antenna, and further the bandwidth of the antenna is improved. The third metal block array 303 is located between the prepregs and used for reducing the gummosis of the prepregs, so that the thickness of the prepregs is prevented from being reduced, bubbles generated in pressing are reduced, and the production yield of the PCB is improved;
in this embodiment, the first antenna unit 201 and the second antenna unit 202 located at two ends of the antenna module are both dummy units, and no signal is fed in, so as to ensure that the eight array elements have similar amplitude-phase characteristics, thereby increasing a scanning angle of the antenna module with a package;
fig. 9, fig. 10 and fig. 11 are respectively a reflection coefficient, an isolation between different cells of the same polarization, and an isolation between different polarizations of the same cell simulated in this embodiment, and it can be seen that the antenna module provided in this embodiment can cover three frequency bands N257, N258 and N261.
Example four
Referring to fig. 12 to 14, in the present embodiment, another antenna module with a package is provided, and on the basis of the second embodiment, the arrangement manner of the antenna elements and the metal block array is changed, and the antenna module provided in the present embodiment is a 4 × 4 millimeter wave phased array antenna module, which can implement beam scanning in a two-dimensional space. In this embodiment, as in the second embodiment, a plurality of integrated circuit chips are used, and the chip feeding network is combined to one rf input port, and the connection component is a BGA (ball grid array) direct ball for connecting the rf input port, the power line, the control signal line, and the ground line to the motherboard. Fig. 12 is a schematic plan view of the second antenna unit 202, the second antenna unit 202 adopts a 4 × 4 array arrangement, fig. 13 is a schematic plan view of the third metal block array 303, fig. 14 is a schematic plan view of the first antenna unit 201 and the second metal block array 302, and by arranging the second metal block array 302, the present embodiment realizes an increase in bandwidth of the 4 × 4 mm wave phased array antenna module, and improves the production yield of such packaged antennas.
EXAMPLE five
Based on the same concept, the present embodiment further provides a communication device including the antenna module with a package according to any one of the first to fourth embodiments.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, it is still within the scope of the present invention if they fall within the scope of the claims of the present invention and their equivalents.
Claims (19)
1. An antenna module with a package comprises a PCB, an integrated circuit chip fixedly connected to the bottom surface of the PCB, an auxiliary circuit, a connecting assembly and a package layer, and is characterized by further comprising an antenna unit, a metal block array and an antenna feed network;
the PCB is formed by stacking a plurality of metal layers, the antenna unit and the metal block array are respectively positioned on different metal layers on one side of the PCB, which is far away from the integrated circuit chip, the antenna feed network is positioned on the metal layer on one side of the PCB, which is close to the integrated circuit chip, one end of the antenna feed network is connected with the integrated circuit chip, and the other end of the antenna feed network provides feed for the antenna unit;
the metal block array is formed by arranging a plurality of discrete metal blocks.
2. The antenna module with package of claim 1, wherein the antenna feed network is a coupled feed or a probe direct feed or a dual probe feed.
3. The antenna module with package as recited in claim 2, wherein the antenna element comprises a first plurality of antenna elements, and the array of metal blocks comprises a first plurality of arrays of metal blocks;
PCB is piled up by six layers of metal levels and forms, from last to being first metal level, second metal level, third metal level, fourth metal level, fifth metal level and the sixth metal level down in proper order, a plurality of first antenna element array arrange in on the first metal level, it is a plurality of first metal block array arrange in on the second metal level, the quantity of antenna feed network with the quantity of first antenna element is unanimous, and is a plurality of antenna feed network arrange in on the fifth metal level, it is a plurality of the one end of antenna feed network is respectively through metallized via hole and a plurality of first antenna element one-to-one links to each other, and is a plurality of the other end of antenna feed network all with integrated circuit chip links to each other.
4. The antenna module with the package according to claim 3, wherein the first metal block array comprises a central first metal block array and a peripheral first metal block array arranged around the central first metal block array, the central first metal block arrays are respectively located right below the first antenna elements in a one-to-one correspondence, and there is no overlapping area between the projection of the peripheral first metal block array on the first metal layer and the first antenna elements.
5. The antenna module with package as claimed in claim 3, wherein the shape of the metal blocks constituting the first metal block array is a regular hexagon.
6. The antenna module with package as claimed in claim 3, wherein the first antenna element is circular or triangular or rectangular or elliptical.
7. The antenna module with package of claim 3, wherein the metal blocks comprising the first array of metal blocks have a physical dimension less than an operating wavelength of the first antenna element.
8. The packaged antenna module of claim 2, wherein the antenna elements comprise a plurality of first antenna elements and a plurality of second antenna elements, and the array of metal blocks comprises a plurality of first arrays of metal blocks, a plurality of second arrays of metal blocks, and a plurality of third arrays of metal blocks;
the PCB is formed by stacking ten metal layers, and sequentially comprises a first metal layer, a second metal layer, a third metal layer, a fourth metal layer, a fifth metal layer, a sixth metal layer, a seventh metal layer, an eighth metal layer, a ninth metal layer and a tenth metal layer from top to bottom, wherein a plurality of first antenna unit arrays are arranged on the third metal layer, a plurality of second antenna unit arrays are arranged on the first metal layer, a plurality of first metal block arrays are arranged on the fourth metal layer, a plurality of second metal block arrays are arranged on the third metal layer along the circumferential direction of the first antenna units, a plurality of third metal block arrays are arranged on the second metal layer, the number of the antenna feed networks is consistent with the number of the first antenna units, and a plurality of the antenna feed networks are arranged on the ninth metal layer, one ends of the antenna feed networks are respectively connected with the first antenna units in a one-to-one correspondence mode through metallized through holes, and the other ends of the antenna feed networks are connected with the integrated circuit chip.
9. The antenna module with package of claim 8, wherein a projection of the second antenna element on the third metal layer has an overlapping area with the first antenna element and no overlapping area with the second array of metal blocks.
10. The antenna module with the package according to claim 8, wherein the first metal block array comprises a central first metal block array and a peripheral first metal block array arranged around the central first metal block array, the central first metal block arrays are respectively located right below the first antenna elements in a one-to-one correspondence, and there is no overlapping area between the projection of the peripheral first metal block array on the third metal layer and the first antenna elements.
11. The packaged antenna module of claim 8, wherein the third metal block array comprises a central third metal block array and a peripheral third metal block array arranged around the central third metal block array, a projection of the central third metal block array on the third metal layer is located in the first antenna unit, a projection of the central third metal block array on the first metal layer is located in the second antenna unit, a projection of the peripheral third metal block array on the first metal layer is located outside the first antenna unit, and a projection of the peripheral third metal block array on the first metal layer is located outside the second antenna unit.
12. The antenna module with package as claimed in claim 8, wherein the shape of the metal blocks constituting the first metal block array is a regular hexagon, the shape of the metal blocks constituting the second metal block array is a regular hexagon, and the shape of the metal blocks constituting the third metal block array is a regular hexagon.
13. The antenna module with package as claimed in claim 8, wherein the first antenna element is circular or triangular or rectangular or elliptical and the second antenna element is circular or triangular or rectangular or elliptical.
14. The antenna module with package of claim 8, wherein the metal blocks comprising the first metal block array have a smaller outer dimension than the operating wavelengths of the first and second antenna elements, the metal blocks comprising the second metal block array have a smaller outer dimension than the operating wavelengths of the first and second antenna elements, and the metal blocks comprising the third metal block array have a smaller outer dimension than the operating wavelengths of the first and second antenna elements.
15. The antenna module with package as claimed in claim 8, wherein an outer surface of the encapsulation layer is provided with a shielding layer.
16. The packaged antenna module of claim 1, wherein the integrated circuit chip is a millimeter wave phased array chip.
17. The antenna module with package of claim 1, wherein the auxiliary circuit comprises a capacitance or a resistance or an inductance.
18. The packaged antenna module of claim 1, wherein the connection component is a BGA straight ball or a connector.
19. A communication device comprising the antenna module with package of any one of claims 1 to 18.
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| CN202010898174.XA CN111987447A (en) | 2020-08-31 | 2020-08-31 | Antenna module and communication equipment with encapsulation |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010898174.XA CN111987447A (en) | 2020-08-31 | 2020-08-31 | Antenna module and communication equipment with encapsulation |
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| CN113571872A (en) * | 2021-07-27 | 2021-10-29 | 安徽安努奇科技有限公司 | Internal matching chip antenna and manufacturing method thereof |
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