CN215644982U - Millimeter wave antenna module and communication equipment - Google Patents
Millimeter wave antenna module and communication equipment Download PDFInfo
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- CN215644982U CN215644982U CN202121201192.4U CN202121201192U CN215644982U CN 215644982 U CN215644982 U CN 215644982U CN 202121201192 U CN202121201192 U CN 202121201192U CN 215644982 U CN215644982 U CN 215644982U
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Abstract
The utility model discloses a millimeter wave antenna module and communication equipment, which comprise a first bonding gold wire, a PCB (printed circuit board) and an impedance matching network, wherein the first bonding gold wire is arranged on the PCB; the impedance matching network is positioned on one side of the PCB; the PCB is provided with a groove matched with the radio frequency chip in size at one side and used for placing the radio frequency chip; one end of the first bonding gold wire is connected with the impedance matching network, the other end of the first bonding gold wire is used for being connected with the radio frequency chip, a gap exists between the first bonding gold wire and the PCB, the bonding gold wire is used as an antenna by adopting a gold wire bonding process, the gap is arranged between the bonding gold wire and the PCB, and a groove is arranged on one side of the PCB for placing the radio frequency chip, so that the bonding gold wire can be arranged in vacuum without being arranged on the PCB, therefore, the PCB only needs to consider the wiring of a low-frequency circuit, the separation of the antenna and the low-frequency circuit is realized, the layer number of the PCB is reduced, the design complexity of the antenna module is reduced, and the cost is further reduced.
Description
Technical Field
The utility model relates to the technical field of antennas, in particular to a millimeter wave antenna module and communication equipment.
Background
In 5G terminal devices, millimeter wave antennas have become a significant trend, and since in the millimeter wave band, the antennas need to be designed into active arrays to compensate for propagation loss in vacuum, and since precision control and cost requirements of mass production are considered, manufacturers tend to adopt aip (antenna in package), i.e. a solution of packaged antennas.
In order to meet some high-performance requirements of the antenna, such as large bandwidth, high gain, high shielding performance, or pattern uniformity, a multilayer PCB process needs to be adopted for the packaged antenna, and 2-3 layers of PCBs are also needed for wiring of peripheral circuits of the active chip, such as a connection circuit with a power chip, a connection circuit with a digital chip, and a series of low-frequency signal circuits such as an ESD (electrostatic discharge) protection circuit, and in addition, in consideration of the high isolation requirement between the low-frequency circuit and the antenna, the number of layers of the PCB needs to be increased to completely avoid signal problems such as coupling and crosstalk between the low-frequency circuit and the antenna, and these factors cause the number of layers of the circuit of the antenna module and the design complexity of the PCB is high, thereby causing the cost of the antenna module to rise sharply.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is as follows: provided are a millimeter wave antenna module and a communication device, which can reduce the design complexity of the antenna module.
In order to solve the technical problems, the utility model adopts the technical scheme that:
a millimeter wave antenna module comprises a first bonding gold wire, a PCB and an impedance matching network;
the impedance matching network is positioned on one side of the PCB;
the PCB is provided with a groove matched with the radio frequency chip in size at one side and used for placing the radio frequency chip;
one end of the first bonding gold wire is connected with the impedance matching network, the other end of the first bonding gold wire is used for being connected with the radio frequency chip, and a gap exists between the first bonding gold wire and the PCB.
Furthermore, the first bonding gold wires correspond to the impedance matching networks one to one;
the impedance matching network is arranged at two ends of the one side of the PCB;
each impedance matching network is respectively connected with one end of one first bonding gold wire.
Furthermore, the PCB comprises a dielectric layer, a low-frequency circuit region, a metal layer and an antenna ground corresponding to the impedance matching network;
the dielectric layer is arranged on one side of the impedance matching network far away from the first bonding gold wire;
the antenna ground and the low-frequency circuit region are positioned on the same plane and are arranged on one side of the dielectric layer close to the impedance matching network, and a gap is reserved between the antenna ground and the low-frequency circuit region;
the metal layer is arranged on one side of the dielectric layer far away from the antenna ground and the low-frequency circuit area.
Furthermore, the chip also comprises a second bonding gold wire and a chip interconnection wire;
the chip interconnection line is arranged on one side of the PCB, which is far away from the impedance matching network, and is used for connecting the radio frequency chip with other chips;
one end of the second bonding gold wire is connected with the chip interconnection wire, and the other end of the second bonding gold wire is used for being connected with the radio frequency chip.
Further, the packaging structure also comprises a packaging body;
the packaging body is arranged on one side of the PCB and used for wrapping the first bonding gold wire.
In order to solve the technical problem, the utility model adopts another technical scheme that:
a communication device comprises the millimeter wave antenna module.
The utility model has the beneficial effects that: the bonding gold wire is used as an antenna by adopting a gold wire bonding process, one end provided with the bonding gold wire is connected with the impedance matching network, the other end is connected with the radio frequency chip, a gap is arranged between the bonding gold wire and the PCB, and a groove is arranged on one side of the PCB for placing the radio frequency chip, so that the bonding gold wire can be arranged in vacuum without being arranged on the PCB, the PCB only needs to consider the wiring of the low-frequency circuit, the separation of the antenna and the low-frequency circuit is realized, the layer number of the PCB is reduced, the design complexity of the antenna module is reduced, and the cost is further reduced.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a millimeter wave antenna module according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an internal structure of a millimeter wave antenna module according to an embodiment of the present invention;
fig. 3 is a side view of an internal structure of a millimeter wave antenna module according to an embodiment of the present invention;
fig. 4 is a bottom view of an internal structure of a millimeter wave antenna module loading package according to an embodiment of the present invention;
fig. 5 is a schematic diagram of an overall structure of a millimeter wave antenna module loading package according to an embodiment of the present invention;
description of reference numerals:
1. a first gold bonding wire; 2. a PCB; 21. a dielectric layer; 22. a low frequency circuit region; 23. a metal layer; 24. an antenna ground; 3. an impedance matching network; 4. a second gold bonding wire; 5. a chip interconnection line; 51. a vertical portion; 52. a belt-like portion; 6. a package body; 7. and a radio frequency chip.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1, a millimeter wave antenna module includes a first gold bonding wire, a PCB and an impedance matching network;
the impedance matching network is positioned on one side of the PCB;
the PCB is provided with a groove matched with the radio frequency chip in size at one side and used for placing the radio frequency chip;
one end of the first bonding gold wire is connected with the impedance matching network, the other end of the first bonding gold wire is used for being connected with the radio frequency chip, and a gap exists between the first bonding gold wire and the PCB.
From the above description, the beneficial effects of the present invention are: the bonding gold wire is used as an antenna by adopting a gold wire bonding process, one end provided with the bonding gold wire is connected with the impedance matching network, the other end is connected with the radio frequency chip, a gap is arranged between the bonding gold wire and the PCB, and a groove is arranged on one side of the PCB for placing the radio frequency chip, so that the bonding gold wire can be arranged in vacuum without being arranged on the PCB, the PCB only needs to consider the wiring of the low-frequency circuit, the separation of the antenna and the low-frequency circuit is realized, the layer number of the PCB is reduced, the design complexity of the antenna module is reduced, and the cost is further reduced.
Furthermore, the first bonding gold wires correspond to the impedance matching networks one to one;
the impedance matching network is arranged at two ends of the one side of the PCB;
each impedance matching network is respectively connected with one end of one first bonding gold wire.
According to the description, the antenna formed by the plurality of bonding gold wires can increase the gain of the antenna as much as possible and improve the radiation intensity of the antenna module under the condition of meeting the small size, and the bonding gold wires correspond to the impedance matching networks one to one, so that the impedance matching of the antenna is realized, the resonant frequency of the antenna reaches the target working frequency, the maximum output power is obtained, and the performance of the antenna is improved.
Furthermore, the PCB comprises a dielectric layer, a low-frequency circuit region, a metal layer and an antenna ground corresponding to the impedance matching network;
the dielectric layer is arranged on one side of the impedance matching network far away from the first bonding gold wire;
the antenna ground and the low-frequency circuit region are positioned on the same plane and are arranged on one side of the dielectric layer close to the impedance matching network, and a gap is reserved between the antenna ground and the low-frequency circuit region;
the metal layer is arranged on one side of the dielectric layer far away from the antenna ground and the low-frequency circuit area.
As can be seen from the above description, the PCB is only provided with the dielectric layer, the low frequency circuit region, the metal layer and the antenna ground, and only the wiring of the low frequency circuit needs to be considered, so that the number of layers of the PCB is reduced, thereby reducing the cost and the size of the antenna.
Furthermore, the chip also comprises a second bonding gold wire and a chip interconnection wire;
the chip interconnection line is arranged on one side of the PCB, which is far away from the impedance matching network, and is used for connecting the radio frequency chip with other chips;
one end of the second bonding gold wire is connected with the chip interconnection wire, and the other end of the second bonding gold wire is used for being connected with the radio frequency chip.
As can be seen from the above description, the radio frequency chip is connected to other chips through the interconnection wire and the bonding gold wire, so that the antenna module can be connected to more chips, thereby improving the performance of the antenna in various aspects.
Further, the packaging structure also comprises a packaging body;
the packaging body is arranged on one side of the PCB and used for wrapping the first bonding gold wire.
As can be seen from the above description, the package body is disposed to wrap the first gold bonding wire to form a packaged antenna, so as to further reduce the size of the antenna.
Another embodiment of the present invention provides a communication device, which includes the above millimeter wave antenna module.
The antenna module can be applied to devices of a 5G millimeter wave communication system, such as handheld mobile devices, and the following description is made by way of specific embodiments:
example one
Referring to fig. 1-4, a millimeter wave antenna module includes a first gold bonding wire 1, a PCB2 and an impedance matching network 3;
the impedance matching network 3 is located on one side of the PCB 2;
the PCB2 is provided with a groove matched with the radio frequency chip 7 in size at one side for placing the radio frequency chip 7;
one end of the first gold bonding wire 1 is connected with the impedance matching network 3, the other end of the first gold bonding wire is used for being connected with the radio frequency chip 7, and a gap exists between the first gold bonding wire 1 and the PCB 2;
specifically, as shown in fig. 1 and 2, the PCB2 includes a dielectric layer 21, a low frequency circuit region 22, a metal layer 23, and an antenna ground 24 corresponding to the impedance matching network 3;
the dielectric layer 21 is arranged on one side of the impedance matching network 3 far away from the first gold bonding wire 1;
the antenna ground 24 and the low-frequency circuit region 22 are positioned on the same plane and are both arranged on one side of the dielectric layer 21 close to the impedance matching network 3, and a gap is formed between the antenna ground 24 and the low-frequency circuit region 22;
in an alternative embodiment, as shown in fig. 2, the low frequency circuit region 22 is disposed on two sides of the rf chip 7;
the metal layer 23 is arranged on one side of the dielectric layer 21 far away from the antenna ground 24 and the low-frequency circuit region 22;
as shown in fig. 2 and 3, further comprises a second gold bonding wire 4 and a chip interconnection wire 5;
the chip interconnection line 5 is arranged on one side of the PCB2 away from the impedance matching network 3, and is used for connecting the radio frequency chip 7 with other chips;
one end of the second bonding gold wire 4 is connected with the chip interconnection wire 5, and the other end of the second bonding gold wire is used for being connected with the radio frequency chip 7;
specifically, as shown in fig. 3 and 4, the chip interconnection line 5 includes a vertical portion 51 and a strip portion 52, one end of the vertical portion 51 is connected to the second gold bonding wire 4, and the other end is connected to the strip portion 52; the other end of the band portion 52 is connected to other chips;
the first bonding gold wire 1 is used as an antenna unit, the second bonding gold wire 4 is used as a low-frequency signal wire, and the diameter of the first bonding gold wire 1 is larger than that of the second bonding gold wire 4;
in addition, the antenna module also comprises a chip part which comprises a control chip, a radio frequency chip 7 and a power chip, wherein the control chip controls the radio frequency chip 7, the power chip provides power for the radio frequency chip 7, and the radio frequency chip 7 provides signals for the antenna; the rf chip 7 includes a phase shifter and an amplifier, wherein the phase shifter is capable of providing a phase difference between the units to realize beam scanning, and the amplifier is used for compensating for loss of the phase shifter.
Example two
Referring to fig. 2 and 5, the difference between the present embodiment and the first embodiment is that the specific structure of the first gold bonding wire is defined:
the first bonding gold wires 1 correspond to the impedance matching networks 3 one by one;
the impedance matching network 3 is disposed at both ends of the one side of the PCB 2;
each impedance matching network 3 is respectively connected with one end of one first bonding gold wire 1;
as shown in fig. 2, the number of the first bonding gold wires 1 is 4, and the first bonding gold wires correspond to the impedance matching networks 3 one to one, so that impedance matching of the antenna is realized, the resonant frequency of the antenna reaches a target working frequency, the maximum output power is obtained, and the performance of the antenna is improved;
specifically, as shown in fig. 5, the package further includes a package body 6;
the package body 6 is disposed on the side of the PCB2 and is used for wrapping the first gold bonding wire 1;
in an alternative embodiment, a thickness of high DK (dielectric constant) glue may be applied to the side of the PCB2 as a package 6 to wrap the first gold wire bond 1 to form a packaged antenna, further reducing the antenna size.
EXAMPLE III
A communication device comprising a millimeter wave antenna module according to one or two of the above embodiments.
In summary, the millimeter wave antenna module and the communication device provided by the utility model include a first gold bonding wire, a PCB and an impedance matching network; the impedance matching network is positioned on one side of the PCB; the PCB is provided with a groove matched with the radio frequency chip in size at one side and used for placing the radio frequency chip; one end of the first bonding gold wire is connected with the impedance matching network, the other end of the first bonding gold wire is used for being connected with the radio frequency chip, and a gap is formed between the first bonding gold wire and the PCB; the first bonding gold wires correspond to the impedance matching networks one to one; the impedance matching network is arranged at two ends of the one side of the PCB; each impedance matching network is connected with one end of one first bonding gold wire respectively; the packaging structure also comprises a packaging body; the packaging body is arranged on one side of the PCB and used for wrapping the first bonding gold wire, the bonding gold wire is used as an antenna by adopting a gold wire bonding process, a gap is arranged between the bonding gold wire and the PCB, and a groove is formed in one side of the PCB and used for placing a radio frequency chip, so that the bonding gold wire can be arranged in vacuum without being arranged on the PCB.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (6)
1. A millimeter wave antenna module is characterized by comprising a first bonding gold wire, a PCB and an impedance matching network;
the impedance matching network is positioned on one side of the PCB;
the PCB is provided with a groove matched with the radio frequency chip in size at one side and used for placing the radio frequency chip;
one end of the first bonding gold wire is connected with the impedance matching network, the other end of the first bonding gold wire is used for being connected with the radio frequency chip, and a gap exists between the first bonding gold wire and the PCB.
2. The millimeter wave antenna module according to claim 1, wherein the first gold bonding wire is in one-to-one correspondence with the impedance matching network;
the impedance matching network is arranged at two ends of the one side of the PCB;
each impedance matching network is respectively connected with one end of one first bonding gold wire.
3. The millimeter wave antenna module according to claim 1, wherein the PCB comprises a dielectric layer, a low frequency circuit region, a metal layer and an antenna ground corresponding to the impedance matching network;
the dielectric layer is arranged on one side of the impedance matching network far away from the first bonding gold wire;
the antenna ground and the low-frequency circuit region are positioned on the same plane and are arranged on one side of the dielectric layer close to the impedance matching network, and a gap is reserved between the antenna ground and the low-frequency circuit region;
the metal layer is arranged on one side of the dielectric layer far away from the antenna ground and the low-frequency circuit area.
4. The millimeter wave antenna module according to claim 1, further comprising a second gold bonding wire and a chip interconnection wire;
the chip interconnection line is arranged on one side of the PCB, which is far away from the impedance matching network, and is used for connecting the radio frequency chip with other chips;
one end of the second bonding gold wire is connected with the chip interconnection wire, and the other end of the second bonding gold wire is used for being connected with the radio frequency chip.
5. The millimeter-wave antenna module of claim 1, further comprising a package;
the packaging body is arranged on one side of the PCB and used for wrapping the first bonding gold wire.
6. A communication device comprising a millimeter wave antenna module according to any of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121201192.4U CN215644982U (en) | 2021-05-31 | 2021-05-31 | Millimeter wave antenna module and communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121201192.4U CN215644982U (en) | 2021-05-31 | 2021-05-31 | Millimeter wave antenna module and communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215644982U true CN215644982U (en) | 2022-01-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121201192.4U Active CN215644982U (en) | 2021-05-31 | 2021-05-31 | Millimeter wave antenna module and communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215644982U (en) |
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2021
- 2021-05-31 CN CN202121201192.4U patent/CN215644982U/en active Active
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