CN218525735U

CN218525735U - Electronic device

Info

Publication number: CN218525735U
Application number: CN202222932990.5U
Authority: CN
Inventors: 余忠儒; 吴韦汎
Original assignee: Advanced Semiconductor Engineering Inc
Current assignee: Advanced Semiconductor Engineering Inc
Priority date: 2022-11-03
Filing date: 2022-11-03
Publication date: 2023-02-24
Anticipated expiration: 2032-11-03

Abstract

The application discloses an electronic device, this electronic device includes: an antenna substrate having a cavity, wherein the cavity has an antenna coupling resonant cavity; the radio frequency chip is arranged in the cavity and outside the antenna coupling resonant cavity; and the shielding spacer is arranged in the cavity and used for separating the radio frequency chip from the antenna coupling resonant cavity in the cavity. The technical scheme can at least reduce the interference from the radio frequency chip, thereby improving the efficiency of the antenna.

Description

Electronic device

Technical Field

The present application relates to the field of semiconductor and antenna technology, and more particularly, to an electronic device.

Background

Referring to fig. 1, in a conventional antenna module, an RFIC (Radio Frequency Integrated Circuit) chip 10 and an antenna 12 are stacked to reduce the package size, i.e., reduce the size in the X-Y plane. However, under the requirement of thinning the package (reducing the size in the direction Z), as shown in fig. 2A, the RFIC chip 20 is conventionally disposed in the cavity 25 to which the antenna 22 is coupled. However, configuring the RFIC chip 20 in the cavity 25 may interfere with antenna 22 coupling, and even if a chip barrier (scale shielding) layer 29 is provided on the RFIC chip 20, performance of the antenna 22 may still be affected.

With reference to fig. 2A and 2B, in the layout design of the antennas 22 and the RFIC chip 20, the RFIC chip 20 is disposed among the antennas 22, and this configuration of the RFIC chip 20 may also interfere with the surrounding antennas 22, so that the performance of the antennas 22 is poor.

Further, depending on antenna design requirements, a specific distance greater than 1/2 of the wavelength of the electromagnetic wave needs to be maintained between each antenna 22 and the RFIC chip 20, and between each antenna 22 in the X-Y plane. This results in a larger footprint without more space for integrating other components. On the other hand, the substrate 28 at the top of the cavity 25 is not easily maintained parallel, and the substrate 28 in the middle may collapse downward with respect to the substrates 28 in the side positions, which may adversely affect the antenna performance. On the other hand, the electrical connection 24 at the edge region of the RFIC chip 20 may be Grounded (GND) to help the RFIC chip 20 dissipate heat. However, in the structure shown in fig. 2A and 2B, the ground area of the RFIC chip 20 is small, the heat dissipation is poor, and the heat generated by the RFIC chip 20 may affect the transmission characteristics of the radio frequency traces 32 between the RFIC chip 20 and the antennas 22.

SUMMERY OF THE UTILITY MODEL

In view of the above problems in the prior art, the present application provides an electronic device that at least reduces interference from an rf chip, thereby improving antenna performance.

According to an aspect of the present application, there is provided an electronic device including: an antenna substrate having a cavity, wherein the cavity has an antenna coupling resonant cavity; the radio frequency chip is arranged in the cavity and outside the antenna coupling resonant cavity; and the shielding spacer is arranged in the cavity and used for separating the radio frequency chip from the antenna coupling resonant cavity in the cavity.

In some embodiments, the shielding spacer extends from a first side of the antenna substrate to a second side opposite the first side.

In some embodiments, an antenna is disposed on the antenna substrate, and the shielding spacer includes shielding elements disposed at intervals in an extending direction of the shielding spacer to reduce electromagnetic wave interference between the radio frequency chip and the antenna.

In some embodiments, the antenna substrate has a first region and a second region adjacent to the first region, the antenna is disposed in the first region, and the rf chip is disposed under the second region, wherein the second region and the shielding spacer form a shielding wall to block transmission of electromagnetic waves in at least two directions.

In some embodiments, the electronic device further comprises a radio frequency substrate for supporting the radio frequency chip, the shielding spacer, and the antenna substrate; the antenna substrate is provided with an antenna, the radio frequency substrate comprises a radio frequency wire, and the radio frequency wire extends through the lower part of the shielding spacer to be electrically connected with the radio frequency chip and the antenna.

In some embodiments, the radio frequency substrate further comprises a feed element aligned with and for electrically coupling with the antenna of the antenna substrate.

In some embodiments, the antenna substrate and the shielding spacer are a unitary structure.

In some embodiments, the rf substrate includes a heat dissipation region located below the rf chip.

In some embodiments, the electronic device further includes a support disposed at an opposite side of the cavity and supporting the antenna substrate, the support including a shielding element for reducing electromagnetic wave interference of the radio frequency chip.

In some embodiments, the shielding element, the shielding spacer, and the antenna substrate over the radio frequency chip collectively form a shielding wall.

According to the technical scheme, the shielding spacer is used for separating the radio frequency chip from the antenna coupling resonant cavity, so that the interference of the radio frequency chip to the antenna coupling resonant cavity can be at least avoided.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic cross-sectional view of a conventional antenna module.

Fig. 2A and 2B are a cross-sectional view and a top view of another antenna module in the prior art.

Fig. 3 is a cross-sectional schematic view of an electronic device according to an embodiment of the application.

Fig. 4 is a schematic top view of the connection of the rf chip and the plurality of antenna elements in the electronic device shown in fig. 3.

Fig. 5A and 5B are schematic top views of the electronic device of fig. 3, respectively, according to various embodiments of the present application.

Fig. 6 is a schematic cross-sectional view of an electronic device according to another embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments that can be derived from the embodiments given herein by a person of ordinary skill in the art are intended to be within the scope of the present disclosure.

Fig. 3 is a cross-sectional schematic view of an electronic device 100 according to an embodiment of the application. Referring to fig. 3, the electronic device 100 includes an antenna substrate 110, and the antenna substrate 110 has a cavity 180. The cavity 180 includes an antenna coupling resonant cavity 182. The electronic device 100 also includes a radio frequency chip 120 (e.g., an RFIC chip) and a shielding spacer 150. The shielding spacer 150 is disposed in the cavity 180, and the shielding spacer 150 separates the rf chip 120 from the antenna coupling resonant cavity 182, such that the rf chip 120 is disposed in the cavity 180 and outside the antenna coupling resonant cavity 182. By separating the rf chip 120 from the antenna coupling resonant cavity 182 by the shielding spacer 150, interference of the rf chip 120 with the antenna coupling resonant cavity 182 can be avoided.

An antenna 112 is provided on the antenna substrate 110. The antenna 112 and the antenna coupling cavity 182 may be located on opposite sides of the antenna substrate 110 in the direction Z. The antenna 112 is located above the antenna coupling cavity 182. In the embodiment, the antenna 112 uses the dielectric material of the antenna substrate 110 as the antenna substrate, and the dielectric material of the antenna substrate 110 is generally a low-k dielectric material, which can ensure the good performance of the antenna 112.

The electronic device 100 further includes an rf substrate 130, and the rf substrate 130 is used to support the rf chip 120, the shielding spacer 150, and the antenna substrate 110. The shielding spacer 150 extends from the antenna substrate 110 in the direction Z to connect with the radio frequency substrate 130. Rf substrate 130 includes an antenna 132, antenna 132 being aligned with a corresponding antenna 112 on antenna substrate 110 and electrically coupled to antenna 112, antenna 132 on rf substrate 130 may serve as a feed element for antenna 112 on antenna substrate 110 to electrically couple to antenna 112. Thus, the antenna 132 may also be referred to as a feeding element. In some embodiments, the

respective antennas

112, 132 are millimeter wave antennas. In some embodiments, the location of the antenna 112 on the antenna substrate 110 and the antenna 132 on the rf substrate 130 may have different configurations. For example, the antenna 112 on the antenna substrate 110 may be configured to protrude from the surface of the antenna substrate 110, and the antenna 132 on the rf substrate 130 may be configured to be embedded in the rf substrate 130.

The

antennas

112 and 132 may be aligned in the direction Z in a one-to-one correspondence. The plurality of antennas 112 and the plurality of antennas 132 share one antenna coupling resonant cavity 182, and the electromagnetic waves are emitted by coupling resonance of the antenna coupling resonant cavity 182. One antenna 112 and a corresponding one antenna 132 may form one antenna unit, and each antenna unit may be used as any one of a transmission end (Tx) or a reception end (Rx). For example, in fig. 3, it is shown that antenna 112 and corresponding antenna 132 are antenna units Rx1 and Rx2, respectively, which serve as receiving ends.

Fig. 4 shows a schematic top view of the connection of the rf chip 120 and the plurality of antenna units Rx1-Rx3, tx1 in the electronic device 100 shown in fig. 3. It should be understood that the shielding spacers 150 between the rf chip 120 and the plurality of antenna units Rx1-Rx3, tx1 are not shown in fig. 4 for clarity of illustrating the connections of the rf chip 120 and the plurality of antenna units Rx1-Rx3, tx 1. In connection with fig. 3 and 4, a total of four antenna units Rx1-Rx3, tx1 are schematically shown, wherein the antenna units Rx1-Rx3 serve as receiving terminals and the antenna unit Tx1 serves as transmitting terminal.

In contrast to the conventional configuration in which the RFIC chip 20 is disposed between the plurality of antennas 22 (as shown in fig. 2B), the present application arranges the plurality of antenna units Rx1-Rx3, tx1 on the same side of the rf chip 120. Referring to fig. 3 and 4, the shielding spacer 150 is used to separate the rf chip 120 from the plurality of antenna units Rx1-Rx3, tx1 (i.e., the plurality of antennas 112, 132), and the shielding spacer 150 can reduce interference, such as Electromagnetic (EM) interference, between the rf chip 120 and each of the

antennas

112, 132, thereby improving antenna performance. Moreover, since the shielding spacer 150 separates the rf chip 120 from the plurality of antenna units Rx1-Rx3, tx1, the interference between the rf chip 120 and the plurality of antenna units Rx1-Rx3, tx1 can be reduced, and therefore, it is not necessary to reduce the interference by maintaining a large distance between the rf chip 120 and the adjacent antenna units (such as the antenna units Rx1 and Rx3 in fig. 4), and therefore, the distance between the rf chip 120 and the adjacent antenna units (such as the antenna units Rx1 and Rx3 in fig. 4) can be reduced, so as to reduce the size of the electronic device 100 in the X-Y plane, and the saved space can be used for integrating other components, for example. The distance characteristic of the respective antennas 112, 132 (the distance between the respective antennas is greater than 1/2 wavelength of electromagnetic waves) may also be better. In addition, since the shielding spacer 150 is disposed in the cavity 180 of the antenna substrate 110, the shielding spacer 150 can be used to support the antenna substrate 110 on the cavity 180, so that the antenna substrate 110 above the cavity 180 can be kept parallel, thereby further improving the antenna performance.

With continued reference to fig. 3 and 4, the rf substrate 130 includes an rf trace 135. The rf trace 135 extends through the shielding spacer 150 to electrically connect the rf chip 120 and the corresponding

antennas

112, 132. Specifically, the rf trace 135 passes under the shielding spacer 150 and is directly electrically connected to the rf chip 120 and the antenna 132 on the rf substrate 130, and the antenna 132 is used as a feeding element and is coupled to the antenna 112 on the antenna substrate 110, so that the rf trace 135 can electrically connect the rf chip 120 and the antenna 112 on the antenna substrate 110.

Referring to fig. 3, in some embodiments, the antenna substrate 110 and the shielding spacer 150 may be a unitary structure. In particular, the shielding spacer 150 may include a layer of dielectric material 151. The material of the dielectric material layer 151 is the same as the dielectric material of the antenna substrate 110, and the dielectric material layer 151 and the antenna substrate 110 are an integral structure. In such embodiments, the shielding spacer 150 and the cavity 180 may be obtained by removing a portion of the original antenna substrate 110, which may reduce the height error.

The shielding spacers 150 further include shielding elements 153, and the layer of dielectric material 151 encapsulates each shielding element 153. The shielding member 153 may be formed of a metal material. The shielding element 153 may be more beneficial in reducing interference between the rf chip 120 and the

respective antennas

112, 132.

Fig. 5A and 5B respectively illustrate schematic top views of the electronic device 100 of fig. 3 according to different embodiments of the present application, wherein fig. 5A and 5B respectively illustrate different shielding spacers 150.

In the embodiment shown in fig. 5A, the shielding spacer 150 extends from the first side 118 to the second side 119 opposite the first side 118 of the antenna substrate 110 between the rf chip 120 and the plurality of antenna units Rx1-Rx3, tx1 (i.e., the plurality of

antennas

112, 132 in fig. 3), such that the shielding spacer 150 separates the rf chip 120 from the plurality of antenna units Rx1-Rx3, tx 1. The shielding element 153 of the shielding spacer 150 extends continuously in the dielectric material layer 151 to reduce electromagnetic interference between the rf chip 120 and the plurality of antenna units Rx1-Rx3, tx 1. In some embodiments, the shielding element 153 intersects each of the radio frequency traces 135 in a top view.

In the embodiment shown in fig. 5B, the shielding spacer 150 extends from the first side 118 to the second side 119 of the antenna substrate 110. The shielding spacer 150 includes a plurality of shielding members 153 arranged at intervals in a direction from the first side 118 to the second side 119. The plurality of shield members 153 are spaced apart by a layer 151 of dielectric material. The plurality of shielding elements 153 may be through holes spaced apart in the layer of dielectric material 151. The shielding elements 153 may also reduce electromagnetic interference between the rf chip 120 and the antenna units Rx1-Rx3, tx 1. The spacing distance between the plurality of shielding members 153 may be adjusted as needed. The smaller the spacing distance is, the better the effect of reducing the electromagnetic wave interference is.

Referring back to fig. 3, the electronic device 100 further includes a support 160 disposed at an opposite side of the cavity 180, and the support 160 may be used to support the antenna substrate 110. The support 160 includes a dielectric material layer 161. In some embodiments, the material of the dielectric material layer 161 is the same as the dielectric material of the antenna substrate 110, and the dielectric material layer 161 and the antenna substrate 110 are a unitary structure. In such embodiments, the shielding spacer 150, the cavity 180 and the support 160 may be obtained by removing a portion of the original antenna substrate 110, such a process may reduce the height error. The support 160 may further include a shielding element 163 encapsulated by the dielectric material layer 161. The shielding member 163 may be formed of a metal material. The shielding element 163 in the support 160 may reduce electromagnetic wave interference of the rf chip 120.

In some embodiments, shielding element 153 in shielding spacer 150 and shielding element 163 in support 160 may be connected to rf substrate 130 by solder connections 134, respectively. In some embodiments, the shielding element 163 in the shielding spacer 150 and the shielding element 153 in the support 160 may be Grounded (GND) in the rf substrate 130.

According to some embodiments, the rf substrate 130 further includes a heat dissipation region 170 located below the rf chip 120. Specifically, the rf chip 120 is electrically connected to the rf substrate 130 by a plurality of electrical connections 124 engaging a plurality of solder connections 134. Wherein, the electrical connection element 124 closer to the

antennas

112 and 132 among the plurality of electrical connection elements 124 is connected to the corresponding rf trace 135 to connect to the corresponding antenna 132. Other areas under the rf chip 120 may be used as the heat dissipation area 170, and the heat dissipation area 170 is used for dissipating heat of the rf chip 120. The rf chip 120 and the rf substrate 130 are formed with an underfill 190, and the underfill 190 may encapsulate the electrical connectors 124 and the solder connectors 134.

In some embodiments, the rf chip 120 is grounded in the rf substrate 130 through the electrical connection 124 and the solder connection 134 over the heat dissipation region 170. The heat dissipation region 170 may be adjacent to an edge 129 of the rf chip 120 distal from the shielding spacer 150. The heat dissipation region 170 may extend from under the rf chip 120, past the edge 129, and outside the edge 129. In some embodiments, the heat dissipation area 170 is larger than the area under the rf chip 120 occupied by the rf trace 135. By disposing the plurality of

antennas

112 and 132 at one side of the rf chip 120 and disposing the plurality of antennas side by side (side by side) with the rf chip 120 in the X-Y plane, a larger heat dissipation area 170 and a larger ground area can be provided below the rf chip 120, thereby improving the heat dissipation performance when the rf chip 120 generates heat, and reducing the influence of the heat generated by the rf chip 120 on the rf trace 135 and the

antennas

112 and 132.

Fig. 6 is a schematic cross-sectional view of an electronic device 200 according to another embodiment of the present application. In the embodiment shown in fig. 6, the supporting member 160, the shielding spacer 150 and the antenna substrate 110 above the rf chip 120 together form a shielding wall. Specifically, the antenna substrate 110 includes a first region 110a, and a second region 110b adjacent to the first region 110 a. The first region 110a and the second region 110b are on opposite sides of the shield spacer 150. A plurality of antennas 112 are disposed on the first region 110a, and an rf chip 120 is disposed under the second region 110b.

In the present embodiment, the shielding element 157 is disposed in the second region 110b, and the shielding element 157 extends from the top of the shielding element 163 in the connection support 160 to the top of the shielding element 153 in the shielding spacer 150 to constitute the shielding wall 159. The shielding wall 159 may block electromagnetic wave transmission in at least two directions. For example, the shielding

elements

163 and 153 on both sides of the shielding wall 159 may block the transmission of electromagnetic waves in the lateral direction, and the shielding element 157 in the second region 110b may block the transmission of electromagnetic waves in the direction from the rf chip 120 to above the antenna substrate 110. The shielding wall 159 may prevent the rf chip 120 from external EM interference and/or prevent the rf chip 120 from EM interference.

Other aspects of the electronic device 200 shown in fig. 6 may be similar to those described above with reference to fig. 3-4, and the electronic device 200 shown in fig. 6 may have the benefits described above with respect to the electronic device 100 and will not be repeated here.

The above description is only a preferred embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements and the like that are made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. An electronic device, comprising:

an antenna substrate having a cavity, wherein the cavity has an antenna coupling resonant cavity;

the radio frequency chip is arranged in the cavity and outside the antenna coupling resonant cavity;

and the shielding spacer is arranged in the cavity and used for separating the radio frequency chip from the antenna coupling resonant cavity in the cavity.

2. The electronic device of claim 1,

the shielding spacer extends from a first side of the antenna substrate to a second side opposite the first side.

3. The electronic device of claim 1,

the antenna substrate is provided with an antenna, and the shielding spacer comprises shielding elements which are arranged at intervals in the extending direction of the shielding spacer so as to reduce electromagnetic wave interference between the radio frequency chip and the antenna on the antenna substrate.

4. The electronic device of claim 1,

the antenna substrate is provided with a first area and a second area adjacent to the first area, the antenna is arranged in the first area, the radio frequency chip is arranged below the second area,

the second region and the shielding spacer form a shielding wall together to block the transmission of electromagnetic waves in at least two directions.

5. The electronic device of claim 1, further comprising:

a radio frequency substrate for supporting the radio frequency chip, the shielding spacer and the antenna substrate;

the antenna substrate is provided with an antenna, the radio frequency substrate comprises a radio frequency wire, and the radio frequency wire extends through the lower part of the shielding spacer to electrically connect the radio frequency chip and the antenna on the antenna substrate.

6. The electronic device of claim 5,

the radio frequency substrate also includes a feed element aligned with the antenna on the antenna substrate and for electrically coupling with the antenna.

7. The electronic device of claim 1,

the antenna substrate and the shielding spacer are of an integral structure.

8. The electronic device of claim 5,

the radio frequency substrate comprises a heat dissipation area positioned below the radio frequency chip.

9. The electronic device of claim 4, further comprising:

and a support disposed at an opposite side of the cavity and supporting the antenna substrate, the support including a shielding element for reducing electromagnetic wave interference of the radio frequency chip.

10. The electronic device of claim 9,

the shielding element, the shielding spacer and the antenna substrate above the radio frequency chip together form a shielding wall.