CN113571258B - Method for replacing HJT photovoltaic low-temperature silver paste with metal composite paste - Google Patents
Method for replacing HJT photovoltaic low-temperature silver paste with metal composite paste Download PDFInfo
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- CN113571258B CN113571258B CN202110950840.4A CN202110950840A CN113571258B CN 113571258 B CN113571258 B CN 113571258B CN 202110950840 A CN202110950840 A CN 202110950840A CN 113571258 B CN113571258 B CN 113571258B
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 100
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 67
- 239000004332 silver Substances 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000002905 metal composite material Substances 0.000 title claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 49
- 239000002131 composite material Substances 0.000 claims abstract description 42
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 239000010949 copper Substances 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 238000005507 spraying Methods 0.000 claims abstract description 23
- 239000002002 slurry Substances 0.000 claims abstract description 17
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 5
- 125000002091 cationic group Chemical group 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 abstract description 11
- 238000007650 screen-printing Methods 0.000 abstract description 7
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052710 silicon Inorganic materials 0.000 abstract description 5
- 239000010703 silicon Substances 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000005286 illumination Methods 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 26
- 239000010408 film Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 238000007639 printing Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- -1 hexafluoroantimonate Chemical compound 0.000 description 5
- 229910021417 amorphous silicon Inorganic materials 0.000 description 4
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 4
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 3
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- BZYAZRQBOJRREG-UHFFFAOYSA-N acetic acid;ethane-1,2-diol Chemical compound CC(O)=O.CC(O)=O.OCCO BZYAZRQBOJRREG-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- ITZGNPZZAICLKA-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) 7-oxabicyclo[4.1.0]heptane-3,4-dicarboxylate Chemical compound C1C2OC2CC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 ITZGNPZZAICLKA-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- HXDLWJWIAHWIKI-UHFFFAOYSA-N 2-hydroxyethyl acetate Chemical compound CC(=O)OCCO HXDLWJWIAHWIKI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 150000001412 amines Chemical group 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- XTDYIOOONNVFMA-UHFFFAOYSA-N dimethyl pentanedioate Chemical compound COC(=O)CCCC(=O)OC XTDYIOOONNVFMA-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011267 electrode slurry Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- DRRZZMBHJXLZRS-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]cyclohexanamine Chemical compound CO[Si](C)(OC)CCCNC1CCCCC1 DRRZZMBHJXLZRS-UHFFFAOYSA-N 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a method for replacing HJT photovoltaic low-temperature silver paste by metal composite paste, which comprises the following steps: (1) Respectively filling copper paste and silver paste into containers connected with an inner nozzle and an outer nozzle of the double-layer gun head; (2) Coating composite slurry on the surface of the battery piece according to a preset pattern by using a double-layer gun head; (3) And the composite metal electrode is solidified and formed, so that the lap joint with the battery piece is realized. By the preparation method, the composite metal electrode with the double-layer structure is prepared on the surface of the battery piece, wherein the inner layer is a copper paste layer, the outer layer is a silver paste layer, and the electrode meets the conductivity and the welding tension and simultaneously greatly reduces the cost of raw materials. Compared with the traditional screen printing mode, the method for preparing the electrode by spraying avoids the problem of silicon wafer damage caused by pressure in the processing process, and the prepared electrode has larger aspect ratio, thereby being beneficial to increasing the illumination area and improving the photoelectric conversion efficiency.
Description
Technical Field
The invention relates to the technical field of photovoltaic cells, in particular to a method for replacing HJT photovoltaic low-temperature silver paste with metal composite paste.
Background
HJT cells (heterojunction solar cells) are in the rapid industrialized development stage due to the characteristics of low preparation process temperature, high pressure and high efficiency, low temperature coefficient, low attenuation, symmetrical structure, capability of generating electricity on both sides and the like. The precondition for realizing double-sided power generation is that the electrode is manufactured by printing silver paste on both sides of the HJT battery, the silver paste consumption is more than 3 times of that of the traditional battery, and the low-temperature silver paste for the HJT battery is more expensive, so that the production cost of the HJT battery is greatly increased.
In order to reduce the cost of the paste, searching for alternative paste is one of the main trends, wherein copper has good conductivity and low cost and is gradually used for replacing the traditional silver paste for electronic printing, but the chemical property of copper is relatively active and is easy to oxidize or corrode, so that the conductivity of copper is influenced. In order to improve the stability of copper in the use process, copper powder is coated in situ by adopting relatively inert conductive metal to form composite metal particles, and the method has the advantages of complex preparation process and uneven coating; or directly plating a metal protective layer such as bismuth, indium and the like on the surface of the copper wire to form alloy copper-clad alloy, wherein the bismuth and the indium are high in price and manufacturing cost, and the conductive metal wire is used as an electrode and is small in welding tension and easy to peel.
In addition, electrodes are manufactured on the surface of the battery piece through the traditional screen printing process, the aspect ratio of electrode grid lines is generally smaller than 0.5 due to the restriction of printing pressure, screen structure and other factors, the photoelectric efficiency of the battery is not improved, and the pressure applied to the silicon wafer in the printing process can damage the silicon wafer. In order to reduce the manufacturing cost of the electrode and avoid extra damage to the battery during manufacturing the electrode, the invention provides a method for preparing a composite metal electrode on the surface of a HJT photovoltaic cell.
Disclosure of Invention
In order to solve the problems, the invention provides a method for replacing HJT photovoltaic low-temperature silver paste by using metal composite paste, wherein a composite metal electrode with a copper paste layer as an inner layer and a silver paste layer as an outer layer is manufactured on the surface of a HJT photovoltaic cell through a double-layer gun head, the manufacturing process is simple and easy to operate, the conductivity and the stability are met, the production cost is greatly reduced, the width of the electrode manufactured by the method is larger, the reduction of the width of the electrode is facilitated, the illumination area is increased, and the photoelectric conversion efficiency of the photovoltaic cell is improved.
The invention provides a method for replacing HJT photovoltaic low-temperature silver paste by metal composite paste, which comprises the following steps:
(1) Providing a double-layer gun head, wherein the double-layer gun head comprises an inner nozzle and an outer nozzle, the outer nozzle is sleeved on the outer side of the inner nozzle, and a certain gap is reserved between the outer nozzle and the inner nozzle; respectively filling copper paste and silver paste into containers connected with the inner nozzle and the outer nozzle of the double-layer gun head;
(2) Coating composite slurry on the surface of the battery piece according to a preset pattern by utilizing the double-layer gun head;
(3) And heating the surface of the battery piece to heat, solidify and form the composite slurry, and realize the lap joint of the composite metal material and the battery piece.
And preparing composite metal slurry of silver slurry coated copper slurry by using a gun head with an inner-outer double-layer structure, and curing the composite metal slurry on the surface of the battery piece to form the composite metal electrode. Compared with the electrode prepared by pure silver paste or copper paste, the method of wrapping the copper paste by the silver paste reduces the use of the silver paste in the electrode, avoids the defects of easy oxidization and instability of copper in the air, and greatly reduces the cost of the paste while meeting the conductivity and stability.
Further, the copper paste comprises the following components by weight: 82-95wt% of mixed metal powder, 0.5-10wt% of epoxy resin, 0.01-0.2wt% of thermal cationic curing agent, 0.1-3wt% of additive and 0.5-5wt% of solvent.
Further, the mixed metal powder comprises micrometer copper powder and nanometer silver powder, wherein the mass ratio of the micrometer copper powder to the nanometer silver powder is 20-100:1; the particle size of the micrometer copper powder is 1-5 mu m, and the particle size of the nanometer silver powder is 10-500nm.
Further, the silver paste comprises the following components by weight: 82-95wt% of silver powder, 0.5-10wt% of epoxy resin, 0.01-0.2wt% of thermal cationic curing agent, 0.1-3wt% of additive and 0.5-5wt% of solvent.
Further, the silver powder comprises micron silver powder and nanometer silver powder, wherein the mass ratio of the micron silver powder to the nanometer silver powder is 20-100:1; the particle size of the micrometer silver powder is 1-5 mu m, and the particle size of the nanometer silver powder is 10-500nm.
The conductive filler in the copper slurry and the silver slurry is the combined filler of the microparticles and the nanoparticles, and the nano conductive particles are added into the filler to fill gaps among the microparticles, so that the conductivity is improved.
Further, the thermal cationic curing agent is an amine blocked hexafluoroantimonate and/or a boron trifluoride-monoethylamine complex.
Further, the additive is one or more of carboxyl liquid nitrile rubber, polysulfide rubber, liquid silicone rubber, polyether, polysulfone, polyimide, 3-aminopropyl triethoxysilane, 3-aminopropyl trimethoxysilane, 3-glycidoxy propyl trimethoxysilane, 3- [ (2, 3) -glycidoxy ] propyl methyl dimethoxy silane, N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane, 3-methacryloxypropyl trimethoxysilane and N-aminoethyl-3-aminopropyl methyl dimethoxy silane.
Further, the solvent is one or more of butyl carbitol, butyl carbitol acetate, ethylene glycol butyl ether, ethylene glycol, propylene glycol methyl ether, alcohol ester twelve and dimethyl glutarate.
Further, the double-layer gun head also comprises a controller, wherein the controller is used for controlling the pressure intensity of the inner nozzle and the outer nozzle.
Further, the spraying pressure of the inner nozzle is controlled to be 0.1-2MPa by the controller, and the spraying pressure of the outer nozzle is controlled to be 0.1-2MPa.
Further, the outer nozzle and the inner nozzle are both circular; the diameter of the inner nozzle is 5-800 μm, and the diameter of the outer nozzle is 10-1000 μm.
Further, the shape of the inner and outer nozzles can be designed according to practical requirements, such as ellipse, square, etc.
Further, the gap between the inner and outer nozzles is 1-50 μm; the duty ratio of copper paste and silver paste in the composite metal paste can be regulated and controlled by regulating the size of the inner nozzle and the outer nozzle and the gap between the inner nozzle and the outer nozzle so as to meet different performance requirements.
Further, in the spraying process, the distance between the lowest part of the outer nozzle and the surface of the battery piece is 0.1-5mm, and the angle between the lower surface of the gun head and the surface of the battery piece is 30-90 degrees.
Further, the coating rate is 50-200mm/s.
Further, the heating temperature is 130-230 ℃.
Further, the heating time is 10-80min.
Furthermore, the metal composite paste can be applied to other photoelectric products to play a role in transmitting current.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention adopts the gun head with a double-layer structure to prepare the composite metal electrode on the surface of the HJT battery, the inner layer of the composite electrode is a copper paste layer, the outer layer of the composite electrode is a silver paste layer, the silver paste layer is uniformly wrapped on the surface of the copper paste layer, wherein the silver paste and the copper paste are mutually diffused and crosslinked at the juncture of the silver paste and the copper paste to form a whole of silver-coated copper with gradually increasing silver paste concentration from inside to outside, which is beneficial to improving the welding tension of the electrode after solidification and is not easy to fall off.
2. Compared with the traditional screen printing process, the method has the advantages that the electrode is prepared on the surface of the battery by adopting a spraying method, and pressure is not required to be applied in the processing process, so that stress damage to the silicon wafer is avoided; in addition, the metal electrode prepared by the method has larger height-width ratio (0.4-1), the theoretical value of the corresponding electrode width is smaller, the illumination area of the solar cell can be further increased, and the conversion efficiency of the solar cell is further improved.
3. The silver-coated copper composite metal electrode prepared by the invention has the advantages that the inner copper slurry layer is a main conductive layer, and the outer silver slurry layer is used as the conductive layer, and meanwhile, the inner copper slurry layer is protected, so that the whole composite metal electrode has good conductivity and stability, and compared with the traditional pure silver slurry electrode, the cost of electrode slurry is greatly reduced.
Drawings
FIG. 1 is a schematic illustration of a preparation process;
FIG. 2 is a cross-sectional view of a composite metal electrode;
fig. 3 is a schematic structural view of a HJT cell with composite metal paste as an electrode;
wherein, 1 and 8 are copper slurry layers; 2. 7 is a silver paste layer; 3 is an outer nozzle; 4 is an inner nozzle; 5 is a controller; 6 is a solar cell; 9 is a metal composite electrode; 10 is a first transparent conductive oxide film; 11 is a p-type amorphous silicon film; 12 is a first intrinsic amorphous silicon thin film; 13 is an n-type silicon wafer; 14 is a second intrinsic amorphous silicon thin film; 15 is an n-type amorphous silicon film; and 16 is a second transparent conductive oxide film.
Specific implementation;
the present invention will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the invention and practice it.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The experimental methods used in the following examples are conventional methods unless otherwise specified, and materials, reagents, etc. used, unless otherwise specified, are commercially available.
Examples: HJT battery prepared by taking metal composite slurry as electrode
Copper paste a:86 parts of copper powder (83 parts of micrometer copper powder and 3 parts of nanometer silver powder), 8 parts of hydrogenated bisphenol A epoxy resin, 0.2 part of amine-blocked hexafluoroantimonate, 1.8 parts of 3-glycidoxypropyl trimethoxysilane and 4 parts of ethylene glycol acetic acid acetate;
copper paste B:86 parts of copper powder (83 parts of micrometer copper powder, 3 parts of nanometer silver powder), 8 parts of 4, 5-epoxycyclohexane-1, 2-dicarboxylic acid diglycidyl ester, 0.2 part of boron trifluoride-monoethylamine complex, 1.8 parts of 3-methacryloxypropyl trimethoxysilane and 4 parts of butyl carbitol.
Silver paste a:86 silver powder (83 parts of micron silver powder, 3 parts of nanometer silver powder), 8 parts of hydrogenated bisphenol A epoxy resin, 0.2 part of amine-blocked hexafluoroantimonate, 1.8 parts of 3-glycidoxypropyl trimethoxysilane and 4 parts of ethylene glycol acetate;
silver paste B:86 parts of silver powder (83 parts of micron silver powder, 3 parts of nano silver powder), 8 parts of 4, 5-epoxycyclohexane-1, 2-dicarboxylic acid diglycidyl ester, 0.2 part of boron trifluoride-monoethylamine complex, 1.8 parts of 3-methacryloxypropyl trimethoxysilane and 4 parts of butyl carbitol.
Gun head A: an inner diameter of 40 μm and an outer diameter of 70 μm;
gun head B: an inner diameter of 44 μm and an outer diameter of 79 μm;
gun head C: the inner diameter was 48 μm and the outer diameter was 88. Mu.m.
Preparation of sample 1: and respectively filling the copper paste A and the silver paste A into a container connected with an inner nozzle and an outer nozzle of the gun head A, spraying composite paste on transparent conductive oxide films (TCOs) on the upper surface and the lower surface of the HJT battery according to a preset pattern, and baking at 180 ℃ for 30min after spraying to solidify the composite metal paste on the surfaces of the TCOs, wherein the line width of the composite metal electrode is 80 mu m and the line height is 36 mu m.
Preparation of sample 2: and respectively filling the copper paste A and the silver paste A into a container connected with an inner nozzle and an outer nozzle of the gun head B, spraying composite paste on transparent conductive oxide films (TCOs) on the upper surface and the lower surface of the HJT battery according to a preset pattern, and baking at 180 ℃ for 30min after spraying to solidify the composite metal paste on the surfaces of the TCOs, wherein the linewidth of the composite metal electrode is 89 mu m and the lineheight is 48 mu m.
Preparation of sample 3: and respectively filling the copper paste A and the silver paste A into a container connected with an inner nozzle and an outer nozzle of the gun head C, spraying composite paste on transparent conductive oxide films (TCOs) on the upper surface and the lower surface of the HJT battery according to a preset pattern, and baking at 180 ℃ for 30min after spraying to solidify the composite metal paste on the surfaces of the TCOs, wherein the linewidth of the composite metal electrode is 100 mu m and the lineheight is 56 mu m.
Preparation of sample 4: and respectively filling the copper paste B and the silver paste B into a container connected with an inner nozzle and an outer nozzle of the gun head A, spraying composite paste on transparent conductive oxide films (TCOs) on the upper surface and the lower surface of the HJT battery according to a preset pattern, and baking at 180 ℃ for 30min after spraying to solidify the composite metal paste on the surfaces of the TCOs, wherein the line width of the composite metal electrode is 82 mu m and the line height is 40 mu m.
Preparation of sample 5: and respectively filling the copper paste B and the silver paste B into a container connected with an inner nozzle and an outer nozzle of the gun head B, spraying composite paste on transparent conductive oxide films (TCOs) on the upper surface and the lower surface of the HJT battery according to a preset pattern, and baking at 180 ℃ for 30min after spraying to solidify the composite metal paste on the surfaces of the TCOs, wherein the linewidth of the composite metal electrode is 90 mu m and the lineheight is 50 mu m.
Preparation of sample 6: and respectively filling the copper paste B and the silver paste B into a container connected with an inner nozzle and an outer nozzle of the gun head C, spraying composite paste on transparent conductive oxide films (TCOs) on the upper surface and the lower surface of the HJT battery according to a preset pattern, and baking at 180 ℃ for 30min after spraying to solidify the composite metal paste on the surfaces of the TCOs, wherein the linewidth of the composite metal electrode is 101 mu m and the lineheight is 54 mu m.
Wherein, each parameter setting of samples 1 to 6 at the time of spraying is as follows in table 1:
TABLE 1 values of experimental parameters at spraying of samples 1 to 6
Comparative example: HJT battery prepared by using silver paste as electrode
Silver paste: 86 silver powder (83 parts of micron silver powder, 3 parts of nanometer silver powder), 8 parts of hydrogenated bisphenol A epoxy resin, 0.2 part of amine-blocked hexafluoroantimonate, 1.8 parts of 3-glycidoxypropyl trimethoxysilane and 4 parts of ethylene glycol acetic acid acetate
Comparative example 1: printing silver paste on the TCO surface of the HJT battery according to a preset pattern by screen printing, baking at 180 ℃ for 30min, and solidifying the silver paste on the TCO surface to form an electrode, wherein the line width of the electrode is 80 mu m, and the height of the electrode is 28 mu m.
Comparative example 2: printing silver paste on the TCO surface of the HJT battery according to a preset pattern by screen printing, baking at 180 ℃ for 30min, and curing the silver paste on the TCO surface to form an electrode, wherein the line width of the electrode is 90 mu m, and the height of the electrode is 27 mu m.
Comparative example 3: printing silver paste on the TCO surface of the HJT battery according to a preset pattern by screen printing, baking at 180 ℃ for 30min, and curing the silver paste on the TCO surface to form an electrode, wherein the line width of the electrode is 100 mu m, and the height of the electrode is 30 mu m.
Performance comparison
The samples 1 to 6 and comparative examples 1 to 3 were divided into 3 groups according to the line width, and the aspect ratio, resistivity, welding tension and photoelectric conversion efficiency of each electrode were calculated or tested, and the relevant parameters are shown in table 2 below:
table 2 performance test data for examples and comparative examples
The results show that the line width of the samples in each group of comparison groups is similar, but the aspect ratio of the metal composite electrode prepared by the spraying method is larger than that of the pure silver paste electrode prepared by screen printing; the resistivity of the composite electrode prepared by coating the copper paste with the silver paste is slightly higher than that of a pure silver paste electrode in a comparative example, the resistance of the electrode is in direct proportion to the resistivity and in inverse proportion to the cross section area, and the wire height of the metal composite electrode is larger than that of the pure silver paste electrode under the condition of similar wire width, so that the resistance of the metal composite electrode is similar to that of the pure silver paste electrode, and the photoelectric conversion efficiency of a HJT battery prepared by the metal composite electrode is generally slightly higher than that of the comparative example.
In summary, as shown in the above description, the metal composite electrode with silver paste coated with copper paste is prepared on the surface of the HJT battery sheet by using the double-layer gun head through the spraying method, compared with the pure silver paste electrode, the silver paste consumption is greatly reduced, and thus the preparation cost of the HJT battery is reduced, the reduction of the silver paste consumption does not greatly affect the resistance and the welding tension of the electrode under the same line width due to the good conductivity of the copper paste and the larger aspect ratio of the metal composite electrode, and the photoelectric conversion efficiency of the HJT battery using the metal composite electrode is generally slightly higher than that of the HJT battery prepared by using the pure silver paste as the electrode.
The above-described embodiments are merely preferred embodiments for fully explaining the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutions and modifications will occur to those skilled in the art based on the present invention, and are intended to be within the scope of the present invention. The protection scope of the invention is subject to the claims.
Claims (8)
1. A method for replacing HJT photovoltaic low-temperature silver paste with metal composite paste, comprising the steps of:
(1) Providing a double-layer gun head, wherein the double-layer gun head comprises an inner nozzle and an outer nozzle, the outer nozzle is sleeved on the outer side of the inner nozzle, and a gap between the outer nozzle and the inner nozzle is 1-50 mu m; respectively filling copper paste and silver paste into containers connected with the inner nozzle and the outer nozzle of the double-layer gun head; the double-layer gun head also comprises a controller, wherein the controller is used for controlling the pressure intensity of the inner nozzle and the outer nozzle;
(2) Coating composite slurry on the surface of the battery piece according to a preset pattern by utilizing the double-layer gun head;
(3) And heating the surface of the battery piece to heat, solidify and form the composite slurry, and realize the lap joint of the composite metal material and the battery piece.
2. A method of replacing HJT photovoltaic low temperature silver paste with a metal composite paste according to claim 1, wherein the copper paste comprises the following components in weight percent: 82-95wt% of mixed metal powder, 0.5-10wt% of epoxy resin, 0.01-0.2wt% of thermal cationic curing agent, 0.1-3wt% of additive and 0.5-5wt% of solvent; the mixed metal powder comprises micrometer copper powder and nanometer silver powder, wherein the mass ratio of the micrometer copper powder to the nanometer silver powder is 20-100:1; the particle size of the micrometer copper powder is 1-5 mu m, and the particle size of the nanometer silver powder is 10-500nm.
3. A method of replacing HJT photovoltaic low temperature silver paste with a metal composite paste according to claim 1, wherein the silver paste comprises the following components in weight percent: 82-95wt% of silver powder, 0.5-10wt% of epoxy resin, 0.01-0.2wt% of thermal cationic curing agent, 0.1-3wt% of additive and 0.5-5wt% of solvent; the silver powder comprises micron silver powder and nanometer silver powder, wherein the mass ratio of the micron silver powder to the nanometer silver powder is 20-100:1; the particle size of the micrometer silver powder is 1-5 mu m, and the particle size of the nanometer silver powder is 10-500nm.
4. The method for replacing HJT photovoltaic low-temperature silver paste with metal composite paste according to claim 1, wherein the internal nozzle spraying pressure is controlled to be 0.1-2MPa and the external nozzle spraying pressure is controlled to be 0.1-2MPa by the controller.
5. The method of replacing HJT photovoltaic low temperature silver paste with a metal composite paste according to claim 1, wherein the outer and inner nozzles are both circular; the diameter of the inner nozzle is 5-800 μm, and the diameter of the outer nozzle is 10-1000 μm.
6. A method for replacing HJT photovoltaic low temperature silver paste with a metal composite paste according to claim 1, wherein in step (2) the coating rate is 50-200mm/s.
7. A method for replacing HJT photovoltaic low temperature silver paste with a metal composite paste according to claim 1, wherein in step (3) the heating temperature is 130-230 ℃.
8. The method of replacing HJT photovoltaic low temperature silver paste with a metal composite paste according to claim 1, wherein in step (3), the heating time is 10 to 80 minutes.
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