CN113571257A - Method for improving lap joint of silver paste and nano silver wire conductive film - Google Patents
Method for improving lap joint of silver paste and nano silver wire conductive film Download PDFInfo
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- CN113571257A CN113571257A CN202110832629.2A CN202110832629A CN113571257A CN 113571257 A CN113571257 A CN 113571257A CN 202110832629 A CN202110832629 A CN 202110832629A CN 113571257 A CN113571257 A CN 113571257A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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Abstract
The invention discloses a method for improving lapping of silver paste and a nano silver wire conductive film, which comprises the following specific steps: (1) mixing silver paste with an alkaline amine reagent to obtain uniform mixed slurry; (2) and printing the mixed slurry on a conductive film, heating and baking, and successfully lapping the silver paste with the nano silver wires in the conductive film below. Because alkaline amine reagent has the corrosive action to the protection resin layer of conducting film top, make silver thick liquid permeate to in the resin layer with the overlap joint of nanometer silver line, increased the overlap joint area of silver thick liquid and nanometer silver line to reduce the overlap joint impedance, improve the touch-control function of nanometer silver line conducting film. In addition, the tolerance of the nano silver conductive film to the thickness of the surface protective layer and the printing area of the silver paste is improved. The conductive film can meet the overlapping requirement while improving the scratch resistance under the action of a relatively thick protective layer, and can also be used on products with small silver paste printing areas.
Description
Technical Field
The invention relates to the field of conductive touch materials, in particular to a method for improving lap joint of silver paste and a nano silver wire conductive film.
Background
The nano silver wire is one of the most fierce novel touch materials in recent years, has the advantages of good conductivity, strong bending resistance, high transmittance, mature mass production technology and the like, and is the nanotechnology which is most likely to replace ITO (indium tin oxide) as a conductive touch material at present. Usually, the nano silver wire, the polymer resin, the additive and other components are prepared into ink which is easy to coat and disperse, and the ink is coated on a substrate, and then a resin layer is coated on the surface to protect the nano silver, but the increase of the protective layer can affect the lap joint of the silver paste and the nano silver wire, increase the contact resistance, and further affect the transmission of signals and the use of products. Therefore, how to realize the construction of silver paste and nano silver wires under the condition that a protective layer with enough thickness exists is a problem which needs to be solved urgently.
The existing methods for improving the lap joint of silver paste and nano silver wires mainly comprise the following steps: the thickness of the formula of the nano silver conductive film is reduced, wherein the thickness of the surface protective layer is mainly reduced, and the method can reduce the protective effect of the protective layer on the nano silver wire, so that the scratching is increased, and the yield is reduced; in addition, the sheet resistance is reduced by increasing the content of the silver nanowires in the conductive film, and the probability of contact between silver paste and the silver nanowires is improved, but the method increases the cost, and the haze of the conductive film is increased due to the increase of the content of the silver nanowires; in addition, there are methods of increasing the designed overlapping area or adjusting the structure to reduce the contact resistance between the silver paste and the silver nanowire, but these methods have limitations, complicated manufacturing and high cost.
Disclosure of Invention
The invention provides a method for improving the lapping of silver paste and a nano silver wire conductive film, which is characterized in that alkaline amine reagents are added into special silver paste, and in the heating and baking process, due to the corrosion effect of the amine reagents on a protective layer, the silver paste can be embedded into the protective layer, so that the lapping of the silver paste and the nano silver wire is promoted.
In order to solve the technical problems, the invention provides the following technical scheme:
the invention provides a method for improving lap joint of silver paste and a nano silver wire conductive film, wherein the conductive film comprises a protective layer, a nano silver wire conductive layer and a substrate layer from top to bottom, and the method comprises the following steps:
(1) mixing silver paste with an alkaline amine reagent to obtain uniform mixed slurry;
(2) and printing the mixed slurry on a conductive film, heating and baking, and partially embedding the silver paste into the protective layer after heating and baking to lap with the nano silver wire.
Further, the silver paste comprises the following components in parts by weight: 5-15 parts of high polymer resin, 50-80 parts of conductive silver powder, 10-30 parts of organic solvent, 0.5-2 parts of curing agent and 2-5 parts of additive.
Further, the polymer resin is one or more of vinyl chloride-vinyl acetate resin, terpene resin, epoxy modified polyurethane, epoxy modified acrylic resin, epoxy modified polyester resin, melamine formaldehyde resin, vinyl chloride-vinyl acetate copolymer resin, bisphenol A unsaturated polyester resin and bisphenol A epoxy resin.
The high polymer resin used in the silver paste is high-toughness alkali-resistant corrosion-resistant resin, so that the resin in the silver paste is prevented from being corroded by the addition of an amine reagent, and the forming, stability and the like of the silver paste are further influenced.
Further, the particle size of the conductive silver powder is 0.5 μm to 20 μm, preferably 0.5 μm to 6 μm.
Further, the organic solvent is one or more of butyl butyrate, dimethyl malonate, diethyl oxalate, diethyl succinate, diethyl glutarate, diethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate, tributyl citrate, terpineol, diethylene glycol methyl ether and diethylene glycol propyl ether.
Further, the curing agent is blocked isocyanate with deblocking temperature lower than 150 ℃.
Further, the additive is one or more of white carbon black, methyl benzoate, ethyl benzoate, glycerol, benzyl alcohol, polyethylene glycol and conductive graphene.
Further, the alkaline amine reagent is one or more of ammonia water, 2-amino-2-methyl-1-propanol, 2, 6-diethyl-4-methylaniline, N-dimethylethanolamine, N-diethylethanolamine and GC-2795.
Further, the mass ratio of the alkaline amine reagent in the mixed slurry is 0.1-5%.
Further, the printing specifically comprises: and printing the mixed slurry on the conductive film after the aging treatment by utilizing screen printing according to a preset pattern.
Further, the heating temperature is 60-200 ℃.
Further, the heating time is 20-120 min.
Further, the material of the protective layer is polycarbonate, polyurethane or acrylate.
Further, the thickness of the protective layer is 50-500 nm.
The alkaline amine reagent serving as a special etchant is compatible with special silver paste, but has a corrosion effect on resin of a protective layer, and can accelerate corrosion under the action of high temperature, and a polymer chain of the resin is broken, so that the surface structure of the resin coated with the alkaline amine reagent becomes loose, and the penetration of the silver paste is facilitated; in addition, the organic amine reagent can be volatilized at high temperature, and the residue problem is not generated.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the alkaline amine reagent is added into the special silver paste, and the silver paste can be embedded into the protective layer by utilizing the corrosive action of the alkaline amine reagent on the protective layer in the heating and baking process, so that the lap joint area of the silver paste and the silver nanowire is increased, the lap joint impedance is reduced, the electric signal is easy to transmit, the sensitivity of the touch function of the nano silver conductive film is improved, the process is simple and easy to operate, the cost is low, and the effect is obvious.
2. The method provided by the invention can reduce the overlap resistance between the silver paste and the nano silver conductive film, the improvement on the overlap resistance is more obvious along with the reduction of the area of the silver paste, and the method provided by the invention can avoid the limitation on a small-size product which cannot reduce the overlap resistance by increasing the area of the silver paste, so that the method has a good application prospect in the aspect of reducing the overlap resistance between the silver paste and the conductive film in the small-size product.
3. The method provided by the invention not only can reduce the lap resistance of the silver paste and the nano silver wire, but also can improve the tolerance of the nano silver conductive film to the thickness of the surface protective layer, so that the nano silver conductive film has enough thickness to achieve the protection effect on the silver nanowire, and meanwhile, the lap joint of the silver paste and the nano silver wire is not influenced, thereby being beneficial to improving the scratch resistance of the conductive film.
Drawings
FIG. 1 is a schematic diagram of a nano-silver wire conductive film treated with silver paste without adding an alkaline amine reagent;
FIG. 2 is a schematic diagram of a nano-silver wire conductive film treated with silver paste added with alkaline amine reagent;
FIG. 3 is a design drawing of a silver paste lap joint test;
fig. 4 is a test chart of "lap resistance" of the conductive film of the nano silver wire processed by different silver pastes.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The experimental methods used in the following examples are conventional methods unless otherwise specified, and materials, reagents and the like used therein are commercially available without otherwise specified.
The first embodiment is as follows: preparation of nano silver wire conductive film treated by special silver paste
The nano-silver conductive film is subjected to heat preservation for 50min at 150 ℃ for aging pretreatment, special silver paste (the silver paste comprises 70 parts of silver powder, 10 parts of epoxy modified polyester resin, 16 parts of diethylene glycol monomethyl ether, 1 part of isocyanate and 3 parts of polyethylene glycol in parts by weight) is printed on the aged conductive film by utilizing screen printing according to a drawing (shown in figure 3), and the aged conductive film is baked at 140 ℃ for 40min for high-temperature curing.
The schematic diagram of the cured conductive film is shown in fig. 1, in which (i) the silver paste is a silver paste block, (ii) the nano silver wire, (iii) the protective layer, (iv) the conductive layer, (iv) the substrate layer, and the silver paste is cured above the protective layer, and the area overlapping with the nano silver wire is extremely small, resulting in a large overlap resistance.
Example two: preparation of nano silver wire conductive film treated by special silver paste and alkaline amine reagent
The nano-silver conductive film is subjected to heat preservation for 50min at 150 ℃ for aging pretreatment, a special silver paste (according to parts by weight, the silver paste comprises 70 parts of silver powder, 10 parts of epoxy modified polyester resin, 16 parts of diethylene glycol monomethyl ether, 1 part of isocyanate and 3 parts of polyethylene glycol) and 1.5 wt% of a mixed material of 2-amino-2-methyl-1-propanol are printed on the aged conductive film by utilizing screen printing according to a drawing (shown in figure 3), and the mixed material is baked at 140 ℃ for 40min for high-temperature curing.
The schematic diagram of the cured conductive film is shown in fig. 2, wherein the silver paste blocks, the nano silver wires, the protective layer, the conductive layer, the substrate layer and the silver paste are embedded in the protective layer, so that the overlapping area of the silver blocks and the nano silver wires is greatly increased, and the overlapping resistance is effectively reduced.
Example three: silver paste lap joint test
Printing the nano silver conductive film with the area of 1 x 1mm on the same nano silver conductive film2、4*0.5mm2、6*0.8mm2Arrays with the spacing of 1mm, conductive silver arrays treated by special silver paste and alkaline amine reagents according to the first and second embodiments, the array structure is shown in fig. 3, a universal meter is used for dialing to the position of a resistor, and two adjacent silver paste blocks of different conductive silver arrays are respectively testedThe resistance of (2).
The test result is shown in fig. 4, where the special silver paste is a conductive silver array processed by the special silver paste, and the special silver paste + a is a conductive silver array processed by the special silver paste + alkaline amine reagent, and it can be known from the test result that the resistance between the silver paste blocks in the conductive silver array added with the organic amine reagent is smaller than the resistance between the silver paste blocks only with the special silver paste under the condition of the same printing area, and the larger the difference value of the lap joint impedance is along with the reduction of the printing area, the result shows that the lap joint impedance between the silver paste and the nano silver conductive film can be reduced by adding the alkaline amine reagent, and especially under the condition of the small printing area, the effect is more significant.
According to the results, the alkaline amine reagent is added into the silver paste, and the alkaline amine reagent can corrode resin of the protective layer covered by the alkaline amine reagent, so that the silver paste can permeate into the protective layer, the overlapping area between the silver paste and the nano silver wire is increased, the overlapping impedance between the silver paste and the nano silver conductive film is reduced, and along with the smaller printing area of the silver paste, the method has a more remarkable effect on reducing the overlapping resistance, and therefore, the method has a good application prospect in the aspect of improving the overlapping resistance of small-size electronic products.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (10)
1. The method for improving the lap joint of the silver paste and the nano silver wire conductive film is characterized in that the conductive film sequentially comprises a protective layer, a nano silver wire conductive layer and a basal layer from top to bottom, and comprises the following steps:
(1) mixing silver paste with an alkaline amine reagent to obtain mixed slurry;
(2) and printing the mixed slurry on a conductive film, heating and baking, and partially embedding the silver paste into the protective layer after heating and baking to lap with the nano silver wire.
2. The method for improving the overlapping of the silver paste and the conductive film of the nano silver wire according to claim 1, wherein the silver paste comprises the following components in parts by weight: 5-15 parts of high polymer resin, 50-80 parts of conductive silver powder, 10-30 parts of organic solvent, 0.5-2 parts of curing agent and 2-5 parts of additive.
3. The method of claim 2, wherein the polymer resin is one or more of a vinyl chloride-vinyl acetate resin, a terpene resin, an epoxy-modified polyurethane, an epoxy-modified acrylic resin, an epoxy-modified polyester resin, a melamine-formaldehyde resin, a vinyl chloride-vinyl acetate copolymer resin, a bisphenol A unsaturated polyester resin, and a bisphenol A epoxy resin.
4. The method for improving the lapping of the silver paste and the conductive film of the nano silver wire according to claim 1, wherein the alkaline amine reagent is one or more of ammonia water, 2-amino-2-methyl-1-propanol, 2, 6-diethyl-4-methylaniline, N-dimethylethanolamine, N-diethylethanolamine and GC-2795.
5. The method for improving the lapping of the silver paste and the conductive film of the nano silver wire according to claim 1, wherein in the step (1), the mass ratio of the alkaline amine reagent in the mixed slurry is 0.1-5%.
6. The method for improving the lapping of the silver paste and the conductive film of the nano silver wire according to claim 1, wherein the printing specifically comprises: and printing the mixed slurry on the conductive film after the aging treatment by utilizing screen printing according to a preset pattern.
7. The method for improving the lapping of the silver paste and the conductive film of the nano silver wire according to claim 1, wherein the heating temperature is 60-200 ℃.
8. The method for improving the overlapping of the silver paste and the conductive film of the nano silver wire according to claim 1, wherein the heating time is 20-120 min.
9. The method for improving the lapping of the silver paste and the conductive film of the nano silver wire according to claim 1, wherein the material of the protective layer is polycarbonate, polyurethane or acrylate.
10. The method for improving the lapping of the silver paste and the conductive film of the nano silver wire according to claim 1, wherein the thickness of the protective layer is 50-500 nm.
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2021
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Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014032792A (en) * | 2012-08-02 | 2014-02-20 | Toray Ind Inc | Conductive laminate and display body made using the same |
| US20190357360A1 (en) * | 2016-12-29 | 2019-11-21 | 3M Innovative Properties Company | Methods for Preparing Electrically Conductive Patterns and Articles Containing Electrically Conductive Patterns |
| CN108984025A (en) * | 2018-06-28 | 2018-12-11 | 湖南兴威新材料有限公司 | Single-layer double-side electrode of capacitance type touch control screen and preparation method thereof |
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