CN113571257B - Method for improving lap joint of silver paste and nano silver wire conductive film - Google Patents
Method for improving lap joint of silver paste and nano silver wire conductive film Download PDFInfo
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- CN113571257B CN113571257B CN202110832629.2A CN202110832629A CN113571257B CN 113571257 B CN113571257 B CN 113571257B CN 202110832629 A CN202110832629 A CN 202110832629A CN 113571257 B CN113571257 B CN 113571257B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention discloses a method for improving lap joint of silver paste and a nano silver wire conductive film, which comprises the following specific steps: (1) Mixing silver paste with an alkaline amine reagent to obtain uniform mixed slurry; (2) Printing the mixed slurry on the conductive film, heating and baking, and successfully bonding the silver slurry with the nano silver wires in the conductive film below. Because the alkaline amine reagent has corrosion effect on the protective resin layer above the conductive film, the silver paste can permeate into the resin layer to be overlapped with the nano silver wire, so that the overlapping area of the silver paste and the nano silver wire is increased, the overlapping impedance is reduced, and the touch function of the conductive film with the nano silver wire is improved. In addition, the tolerance of the nano silver conductive film to the thickness of the surface protection layer and the printing area of silver paste is improved. The conductive film can meet the lap joint requirement while improving the scratch resistance of the conductive film under the action of a relatively thicker protective layer, and can also be used on products with smaller silver paste printing area.
Description
Technical Field
The invention relates to the field of conductive touch materials, in particular to a method for improving lap joint of silver paste and a nano silver wire conductive film.
Background
The nano silver wire is used as one of the most fire novel touch materials in recent years, has the advantages of good conductivity, strong bending resistance, high transmittance, mature mass production technology and the like, and is the nano technology most likely to replace ITO as the conductive touch material at present. The nano silver wire, the high polymer resin, the additive and other components are prepared into the ink which is easy to coat and disperse, and the ink is coated on the substrate, and then a resin layer is coated on the surface to protect the nano silver, but the increase of the protective layer can influence the lap joint of silver paste and the nano silver wire, increase the contact resistance, and further influence the signal transmission and the use of products. Therefore, how to realize the construction of silver paste and nano silver wires in the presence of a protective layer with sufficient thickness is an urgent problem to be solved.
The current method for improving the lap joint of silver paste and nano silver wires mainly comprises the following steps: the thickness of the nano silver conductive film formula is reduced, wherein the thickness of the surface protective layer is mainly reduced, the protective effect of the protective layer on the nano silver wire is reduced, the scratch is increased, and the yield is reduced; in addition, the square resistance is reduced by increasing the content of silver nanowires in the conductive film, the probability of contact between silver paste and the silver nanowires is improved, but the method increases the cost, and the haze of the conductive film is increased due to the increase of the content of the silver nanowires; in addition, there are methods of reducing contact resistance between silver paste and nano silver wire by increasing design overlap area or adjusting structure, but these methods have limitations, are complicated to manufacture and have high cost.
Disclosure of Invention
The invention provides a method for improving the lap joint of silver paste and a nano silver wire conductive film, which is characterized in that alkaline amine reagents are added into special silver paste, and in the heating and baking process, the silver paste can be embedded into a protective layer due to the corrosion effect of the amine reagents on the protective layer, so that the lap joint of the silver paste and the nano silver wire is promoted.
In order to solve the technical problems, the invention provides the following technical scheme:
the first aspect of the invention provides a method for improving lap joint of silver paste and a nano silver wire conductive film, wherein the conductive film sequentially comprises a protective layer, a nano silver wire conductive layer and a substrate layer from top to bottom, and the method comprises the following steps:
(1) Mixing silver paste with an alkaline amine reagent to obtain uniform mixed slurry;
(2) Printing the mixed slurry on a conductive film, heating and baking, and embedding part of the silver slurry after heating and baking into a protective layer to overlap with the nano silver wires.
Further, the silver paste comprises the following components in parts by weight: 5-15 parts of high polymer resin, 50-80 parts of conductive silver powder, 10-30 parts of organic solvent, 0.5-2 parts of curing agent and 2-5 parts of additive.
Further, the high polymer resin is one or more of vinyl chloride resin, terpene resin, epoxy modified polyurethane, epoxy modified acrylic resin, epoxy modified polyester resin, melamine formaldehyde resin, vinyl chloride-vinyl acetate copolymer resin, bisphenol A type unsaturated polyester resin and bisphenol A type epoxy resin.
The high polymer resin used in the silver paste is high-toughness alkali-resistant corrosion-resistant resin, so that the addition of amine reagents can be prevented from corroding the resin in the silver paste, and further the forming, stability and the like of the silver paste are affected.
Further, the particle diameter of the conductive silver powder is 0.5 μm to 20. Mu.m, preferably 0.5 μm to 6. Mu.m.
Further, the organic solvent is one or more of butyl butyrate, dimethyl malonate, diethyl oxalate, diethyl succinate, diethyl glutarate, diethylene glycol diethyl ether acetate, diethylene glycol butyl ether acetate, tributyl citrate, terpineol, diethylene glycol methyl ether and diethylene glycol propyl ether.
Further, the curing agent is a blocked isocyanate with a deblocking temperature of less than 150 ℃.
Further, the additive is one or more of white carbon black, methyl benzoate, ethyl benzoate, glycerol, benzyl alcohol, polyethylene glycol and conductive graphene.
Further, the alkaline amine reagent is one or more of ammonia water, 2-amino-2-methyl-1-propanol, 2, 6-diethyl-4-methylaniline, N-dimethylethanolamine, N-diethylethanolamine and GC-2795.
Further, the mass ratio of the alkaline amine reagent in the mixed slurry is 0.1-5%.
Further, the printing is specifically: and printing the mixed slurry onto the aged conductive film by screen printing according to a preset pattern.
Further, the heating temperature is 60-200 ℃.
Further, the heating time is 20-120min.
Further, the material of the protective layer is polycarbonate, polyurethane or acrylic ester.
Further, the thickness of the protective layer is 50-500nm.
The alkaline amine reagent is used as a special etchant, can be compatible with special silver paste, has a corrosion effect on the resin of the protective layer, can accelerate corrosion under the high temperature effect, and breaks the polymer chain of the resin, so that the surface layer structure of the resin coated with the alkaline amine reagent becomes loose, thereby being beneficial to the penetration of the silver paste; in addition, the organic amine reagent can volatilize at high temperature, and no residual problem is generated.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the alkaline amine reagent is added into the special silver paste, and in the heating and baking process, the silver paste can be embedded into the protective layer by utilizing the corrosion effect of the alkaline amine reagent on the protective layer, so that the lap joint area of the silver paste and the silver nanowire is increased, the lap joint impedance is reduced, the electric signal is easy to transmit, the sensitivity of the touch control function of the nano silver conductive film is improved, the process is simple and easy to operate, the cost is low, and the effect is obvious.
2. The method provided by the invention can reduce the lap resistance between the silver paste and the nano silver conductive film, the improvement on the lap resistance is more remarkable along with the reduction of the area of the silver paste, and the limitation can be avoided for small-size products which can not reduce the lap resistance by increasing the area of the silver paste, so that the method provided by the invention has good application prospect in reducing the lap resistance between the silver paste and the conductive film in the small-size products.
3. The method provided by the invention can reduce the lap resistance of silver paste and nano silver wires, can improve the tolerance of the nano silver conductive film to the thickness of the surface protective layer, has enough thickness to achieve the protection effect on the silver nano wires, does not influence the lap joint of the silver paste and the nano silver wires, and is beneficial to improving the scratch resistance of the conductive film.
Drawings
FIG. 1 is a schematic diagram of a silver nanowire conductive film treated with silver paste without alkaline amine reagent;
FIG. 2 is a schematic diagram of a silver nanowire conductive film treated with silver paste with an alkaline amine reagent;
FIG. 3 is a schematic diagram of a silver paste splice test design;
fig. 4 is a graph of the "lap impedance" test of a different silver paste treated nano-silver wire conductive film.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the invention and practice it.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The experimental methods used in the following examples are conventional methods unless otherwise specified, and materials, reagents, etc. used, unless otherwise specified, are commercially available.
Embodiment one: preparation of nano silver wire conductive film treated by special silver paste
The nano silver conductive film is subjected to aging pretreatment at 150 ℃ for 50min, special silver paste (according to parts by weight, each component in the silver paste is 70 parts of silver powder, 10 parts of epoxy modified polyester resin, 16 parts of diethylene glycol methyl ether, 1 part of isocyanate and 3 parts of polyethylene glycol) is printed on the aged conductive film by screen printing according to a drawing (shown in figure 3), and the conductive film is baked at 140 ℃ for 40min for high-temperature curing.
The schematic diagram of the conductive film after the curing treatment is shown in fig. 1, wherein (1) is a silver paste block, (2) is a nano silver wire, (3) a protective layer, (4) is a conductive layer, and (5) is a basal layer, and the silver paste is cured above the protective layer, so that the area overlapped with the nano silver wire is extremely small, and the overlap resistance is large.
Embodiment two: preparation of nano silver wire conductive film treated by special silver paste and alkaline amine reagent
The nano silver conductive film is subjected to aging pretreatment at 150 ℃ for 50min, special silver paste (according to parts by weight, each component in the silver paste comprises 70 parts of silver powder, 10 parts of epoxy modified polyester resin, 16 parts of diethylene glycol methyl ether, 1 part of isocyanate and 3 parts of polyethylene glycol) and 1.5wt% of a mixed material of 2-amino-2-methyl-1-propanol are printed on the aged conductive film by screen printing according to a drawing (shown in figure 3), and the conductive film is baked at 140 ℃ for 40min for high-temperature curing.
The schematic diagram of the conductive film after the curing treatment is shown in fig. 2, wherein in the diagram, (1) is a silver paste block, (2) is a nano silver wire, (3) is a protective layer, (4) is a conductive layer, and (5) is a basal layer, and the silver paste is embedded into the protective layer, so that the overlapping area of the silver block and the nano silver wire is greatly increased, and the overlapping resistance is effectively reduced.
Embodiment III: silver paste lap joint test
On the same nano silver conductive film, the printing area is 1 x 1mm respectively 2 、4*0.5mm 2 、6*0.8mm 2 An array with a spacing of 1mm was prepared according to examples one and two, and the array structure was as shown in fig. 3, and the resistance between two adjacent silver paste blocks of different conductive silver arrays was tested using a multimeter to dial the position of the resistor.
The test results are shown in fig. 4, wherein the characteristic silver paste is a conductive silver array treated by the characteristic silver paste, the characteristic silver paste+a is a conductive silver array treated by the characteristic silver paste+the alkaline amine reagent, and according to the test results, the resistance between the silver paste blocks in the conductive silver array added with the organic amine reagent is smaller than the resistance between the silver paste blocks only with the characteristic silver paste under the condition that the printing area is the same, and the larger the overlap impedance difference value is along with the reduction of the printing area, the result shows that the overlap impedance between the silver paste and the nano silver conductive film can be reduced by adding the alkaline amine reagent, and particularly, the effect is more remarkable under the condition that the printing area is smaller.
According to the invention, the alkaline amine reagent is added into the silver paste, and the alkaline amine reagent can corrode the resin of the protective layer covered by the alkaline amine reagent, so that the silver paste can infiltrate into the protective layer, the lap joint area between the silver paste and the nano silver wire is increased, the lap joint impedance between the silver paste and the nano silver conductive film is reduced, and along with the smaller printing area of the silver paste, the effect of the method on reducing the lap joint resistance is more remarkable, so that the method has good application prospect in improving the lap joint resistance of small-size electronic products.
The above-described embodiments are merely preferred embodiments for fully explaining the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutions and modifications will occur to those skilled in the art based on the present invention, and are intended to be within the scope of the present invention. The protection scope of the invention is subject to the claims.
Claims (6)
1. The method for improving the lap joint of the silver paste and the nano silver wire conductive film is characterized by comprising the following steps of:
(1) Mixing silver paste with ammonia water and/or alkaline amine reagent to obtain mixed slurry;
(2) Printing the mixed slurry on a conductive film, heating and baking, and embedding part of the silver slurry after heating and baking into a protective layer to overlap with the nano silver wire;
the silver paste comprises the following components in parts by weight: 5-15 parts of high polymer resin, 50-80 parts of conductive silver powder, 10-30 parts of organic solvent, 0.5-2 parts of curing agent and 2-5 parts of additive; the high polymer resin is one or more of vinyl chloride-vinyl acetate copolymer resin, terpene resin, epoxy modified polyurethane, epoxy modified acrylic resin, epoxy modified polyester resin, melamine formaldehyde resin, vinyl chloride-vinyl acetate copolymer resin and bisphenol A type unsaturated polyester resin;
the alkaline amine reagent is one or more of 2-amino-2-methyl-1-propanol, 2, 6-diethyl-4-methylaniline, N-dimethylethanolamine, N-diethylethanolamine and GC-2795; the mass ratio of the ammonia water and/or the alkaline amine reagent in the mixed slurry is 0.1-5%.
2. The method for improving the lap joint of silver paste and a nano silver wire conductive film according to claim 1, wherein the printing is specifically as follows: and printing the mixed slurry onto the aged conductive film by screen printing according to a preset pattern.
3. The method for improving the lap joint of silver paste and a silver nanowire conductive film according to claim 1, wherein the heating temperature is 60-200 ℃.
4. The method for improving the lap joint of silver paste and the nano-silver wire conductive film according to claim 1, wherein the heating time is 20-120min.
5. The method for improving the lap joint of silver paste and the nano-silver wire conductive film according to claim 1, wherein the material of the protective layer is polycarbonate, polyurethane or acrylic ester.
6. The method for improving the lap joint of silver paste and a nano-silver wire conductive film according to claim 1, wherein the thickness of the protective layer is 50-500nm.
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| WO2020000897A1 (en) * | 2018-06-30 | 2020-01-02 | 云谷（固安）科技有限公司 | Touch panel and fabrication method therefor, and display device |
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| JP2014032792A (en) * | 2012-08-02 | 2014-02-20 | Toray Ind Inc | Conductive laminate and display body made using the same |
| US20190357360A1 (en) * | 2016-12-29 | 2019-11-21 | 3M Innovative Properties Company | Methods for Preparing Electrically Conductive Patterns and Articles Containing Electrically Conductive Patterns |
| CN108984025A (en) * | 2018-06-28 | 2018-12-11 | 湖南兴威新材料有限公司 | Single-layer double-side electrode of capacitance type touch control screen and preparation method thereof |
| CN109101134A (en) * | 2018-08-17 | 2018-12-28 | 芜湖伦丰电子科技有限公司 | A method of improving touch screen function piece contact resistance |
| CN110218446A (en) * | 2019-06-10 | 2019-09-10 | 慧迈材料科技(广东)有限公司 | A kind of thermally conductive silver paste preparation method of polyimides |
| CN110444318B (en) * | 2019-08-21 | 2020-08-21 | 合肥微晶材料科技有限公司 | Flexible transparent conducting film with high overlapping efficiency and excellent bending resistance for nano-silver wires |
| CN110689995B (en) * | 2019-09-24 | 2021-07-20 | 深圳市善柔科技有限公司 | Silver nanowire conductive film and preparation method thereof |
| CN111599511A (en) * | 2020-06-17 | 2020-08-28 | 苏州绘格光电科技有限公司 | Transparent conductive film and preparation method thereof |
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| WO2020000897A1 (en) * | 2018-06-30 | 2020-01-02 | 云谷（固安）科技有限公司 | Touch panel and fabrication method therefor, and display device |
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