CN113564593A - 一种改善塑胶表面镀层结合力的方法 - Google Patents
一种改善塑胶表面镀层结合力的方法 Download PDFInfo
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- 239000004033 plastic Substances 0.000 title claims abstract description 37
- 229920003023 plastic Polymers 0.000 title claims abstract description 37
- 239000011248 coating agent Substances 0.000 title claims abstract description 28
- 238000000576 coating method Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000001746 injection moulding Methods 0.000 claims abstract description 49
- 239000002184 metal Substances 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 238000002347 injection Methods 0.000 claims abstract description 23
- 239000007924 injection Substances 0.000 claims abstract description 23
- 238000009713 electroplating Methods 0.000 claims abstract description 20
- 238000007747 plating Methods 0.000 claims abstract description 17
- 239000000126 substance Substances 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 53
- 239000000463 material Substances 0.000 claims description 20
- 239000011241 protective layer Substances 0.000 claims description 15
- 239000002131 composite material Substances 0.000 claims description 10
- 238000007788 roughening Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 238000010329 laser etching Methods 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 3
- 239000004697 Polyetherimide Substances 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 229920010524 Syndiotactic polystyrene Polymers 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229920001601 polyetherimide Polymers 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 238000002161 passivation Methods 0.000 claims 1
- 238000001465 metallisation Methods 0.000 abstract description 8
- 239000010949 copper Substances 0.000 description 13
- 230000003746 surface roughness Effects 0.000 description 8
- 239000002904 solvent Substances 0.000 description 7
- 238000005488 sandblasting Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 239000003365 glass fiber Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000006223 plastic coating Substances 0.000 description 2
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910003322 NiCu Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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Abstract
本发明属于塑胶表面金属化技术领域,特别涉及一种改善塑胶表面镀层结合力的方法,包括:使用型面具有粗糙度的注塑模具注塑注塑件;在所述注塑件的表面直接化学镀和/或电镀金属镀层。本发明所提供的改善塑胶表面镀层结合力的方法,可有效降低注塑件表面金属化的成本,并且在满足金属镀层结合力为5B的前提下,可获质量更轻、尺寸稳定性更好的塑胶器件。
Description
技术领域
本发明属于塑胶表面金属化技术领域,特别涉及一种改善塑胶表面镀层结合力的方法。
背景技术
现如今,塑胶材料被广泛应用,塑胶件已成为家电、汽车、手机、基站、医疗器械、照明电器中不可或缺的部件。与金属件相比,塑胶件不仅可以实现很好的金属质感,而且能减轻制品重量,在有效改善塑料外观及装饰性的同时,也改善了其在电、热及耐蚀等方面的性能。为了实现塑胶件的上述特点,通常需要在塑胶表面进行金属化,目的是将塑胶件的表面披覆上金属,不但增加美观,且补偿塑料的缺点,赋予金属的性质,充分发挥塑料及金属的特性于一体。
目前天线振子、滤波器等基站通信相关的器件均有塑料解决方案,且未来塑料解决方案占比会越来越多。而塑料器件代替金属器件则必须在塑胶器件表面进行金属化。目前,现有的天线振子、滤波器等塑胶器件金属化的方案有电镀和化学镀等金属化方案。以天线振子金属化方案为例,塑胶金属化的一般步骤为:1.注塑打样;2.注塑件进行喷砂前处理,使表面粗化;3.在粗化后的注塑件表面化镀一层薄薄的镍层;4.电镀增厚金属镀层。为了提高金属层与基材之间的结合力,必须将基材粗化。通常采用喷砂的方法来使基材表面粗糙度增加,但这种工艺方法较繁琐,工艺成本大。因此,行业内急需找到一种工艺简单,且满足镀层结合力要求的塑胶金属化方案来降低成本。
发明内容
为了克服上述现有技术的缺陷,本发明所要解决的技术问题是:解决传统注塑件表面粗化工艺复杂的问题。
为了解决上述技术问题,本发明采用的技术方案为:一种改善塑胶表面镀层结合力的方法,包括:
使用型面具有粗糙度的注塑模具注塑注塑件;
在所述注塑件的表面直接化学镀和/或电镀金属镀层。
本发明的有益效果在于:在注塑件注塑阶段,通过在注塑模具型面进行预粗糙化处理,以获得表面具有一定粗糙度且粗糙度可控的注塑件,从而免去对注塑件表面进行喷砂粗化处理,节省成本;并且,通过免去对注塑件表面进行喷砂粗化处理,在保证金属镀层结合力符合要求的前提下,可获质量更轻、尺寸稳定性更好的塑胶器件。
具体实施方式
为详细说明本发明的技术内容、所实现目的及效果,以下结合实施方式予以说明。
一种改善塑胶表面镀层结合力的方法,包括:
使用型面具有粗糙度的注塑模具注塑注塑件;
在所述注塑件的表面直接化学镀和/或电镀金属镀层。
需要说明的是,所述注塑件的表面粗糙度由注塑模具的型面粗糙度所限定的,即在一种实施方式中,操作人员可根据注塑件表面粗糙度的需求对注塑模具的型面粗糙度进行调节,以获得表面粗糙度符合要求的注塑件。
优选的,所述注塑件的基材包括但不限于填料增强型聚醚酰亚胺复合材料、填料增强型聚苯硫醚复合材料、填料增强型间规聚苯乙烯复合材料和液晶聚合物等复合材料中的一种。
优选的,所述填料包括但不限于玻璃纤维、碳纤维等,所述填料的含量在5~40%。
进一步的,所述金属镀层包括由内向外依次层叠设置的种子层、中间层和保护层,所述种子层包括底层和外层,所述底层的材质为Ti、Cr、Ni/Cr、Ni/Cu合金中的一种,所述外层的材质为Cu。
进一步的,所述中间层的材质为Cu,所述保护层的材质为Ag、Au或Sn。
进一步的,所述种子层的厚度小于1μm,所述中间层的厚度为2~45μm,所述保护层的厚度为2~5μm。
进一步的,一种改善塑胶表面镀层结合力的方法,包括如下步骤:
S1、在所述注塑模具的型面进行粗糙化处理,并通过所述注塑模具注塑得到表面具有粗糙度的注塑件;
S2、在注塑件的表面依次进行化学镀、镭雕、第一次电镀、蚀刻、第二次电镀,以获得表面具有金属镀层且金属镀层的百格结合力为5B的注塑件。
优选的,包括如下步骤:
1、注塑:利用高速注塑机将基材材料在型面已预粗糙化至一定粗糙度的注塑模具内注塑成型,得到注塑件。
2、化学镀:在注塑件表面进行化学镀,以获得种子层。
3、镭雕:在功率为25~30W,激光的频率为20~60kHz,激光的速度500~5000mm/s的工作参数下,利用紫外(UV)激光器在所述注塑件表面镭雕出清晰、完整的功能线路。
4、电镀:在所述功能线路上电镀中间层,以使所述种子层的外层铜层加厚至8~25μm。
5、蚀刻:利用化学溶剂退去注塑件表面金属层除所述功能线路以外的部分。
6、电镀保护层:在功能线路上电镀一层保护层,以获得表面具有金属镀层的注塑件。
其中,所述镭雕和蚀刻为可选步骤,可根据实际的工艺要求进行选择。
其中,所述化学溶剂包括硫酸、过硫化钠及双氧水的复配溶剂,所述复配溶剂中硫酸的占比为40~80%、过硫化钠的占比为10~30%以及双氧水的占比为10~30%。
从上述描述可知,在种子层的外层铜层的基础上大幅度增加铜层的厚度以提高所述天线振子金属层的导电性能,以及通过在功能线路上电镀保护层,以防止种子层和中间层中铜层被氧化,并且易于焊接,同时避免焊接时所述功能线路变形或变色,保护所述功能线路,减少外力对所述功能线路造成的损伤。
需要说明的是,在实际的生产过程中,注塑件表面的粗糙等级与注塑模具型面粗糙等级之间一般相差1~2个等级,因此注塑模具型面的粗糙度可根据实际需求的注塑件表面粗糙度进行调节。举例上来说,当注塑件表面粗糙度要求分别为3μm、5μm和7μm时,则注塑模具的型面粗糙度分别优选为1μm、3μm和5μm。
需要说明的是,在本申请中,所述化学镀为在一定条件下,水溶液中的金属离子被还原剂还原,并且沉淀到注塑件表面上的过程。
还需要说明的是,在本申请中,所述型面为注塑模具型腔中与基材直接接触并使基材塑造成型的所有面的总称。
实施例一
一种改善塑胶镀层结合力的方法,所述基材为碳纤维增强的聚醚酰亚胺复合材料,其中碳纤维含量为30%,种子层底层材料为Ti(约50nm),外层材料为Cu(约250nm);中间层材料为Cu(约7μm);保护层材料为Ag(约5μm)。
一种改善塑胶镀层结合力的方法,包括如下步骤:
1、注塑:利用高速注塑机将基材材料在型面已预粗糙化至一定粗糙度的注塑模具(型面粗糙度为1μm、3μm和5μm)内注塑成型,分别得到不同粗糙度的注塑件(表面粗糙度为3μm、5μm和7μm)。
2、化学镀:在注塑件表面进行化学镀,以获得种子层。
3、镭雕:在功率为25~30W,激光的频率为20~60kHz,激光的速度500~5000mm/s的工作参数下,利用紫外(UV)激光器在所述注塑件表面镭雕出清晰、完整的功能线路。
4、电镀:在所述功能线路上电镀中间层,以使所述种子层的外层铜层加厚至7.25μm。
5、蚀刻:利用化学溶剂退去注塑件表面金属层除所述功能线路以外的部分。
6、电镀保护层:在功能线路上电镀一层保护层,以获得表面具有金属镀层的注塑件。
实施例二
与实施例一的不同之处在于:基材为玻璃纤维增强聚苯硫醚复合材料,其中玻璃纤维含量为40%,种子层底层材料为Cr(约50nm),外层材料为Cu(约250nm);中间层材料为Cu(约7μm);保护层材料为Au(约2μm)。
实施例三
与实施例一的不同之处在于:基材为玻璃纤维增强间规聚苯乙烯复合材料,其中玻璃纤维含量为40%,种子层底层材料为NiCu合金(约50nm),外层材料为Cu(约250nm);中间层材料为Cu(约7μm);保护层材料为Sn(约5μm)。
实施例四
与实施例一的不同之处在于:基材为液晶聚合物。
检测例
基于ASTM D3359–09E2方法分别检测实施例一至四所获得的注塑件表面金属镀层的百格结合力,具体分别为化学镀后金属层以及电镀保护层后金属层的百格结合力,以及电镀保护层后金属层的形态变化,具体参数如表1所示。
表1
综上所述,本发明提供的改善塑胶表面镀层结合力的方法,在注塑件注塑阶段,通过在注塑模具型面进行预粗糙化处理,以获得表面具有一定粗糙度且粗糙度可控的注塑件,从而免去对注塑件表面进行喷砂粗化处理,节省成本;并且,通过免去对注塑件表面进行喷砂粗化处理,在保证金属镀层结合力符合要求的前提下,可获质量更轻、尺寸稳定性更好的塑胶器件。同时,通过所述改善塑胶表面镀层结合力的方法所获得的表面具有金属镀层的注塑件可适用于天线振子、滤波器等通信设备的使用。
以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书内容所作的等同变换,或直接或间接运用在相关的技术领域,均同理包括在本发明的专利保护范围内。
Claims (6)
1.一种改善塑胶表面镀层结合力的方法,其特征在于,包括:
使用型面具有粗糙度的注塑模具注塑注塑件;
在所述注塑件的表面直接化学镀和/或电镀金属镀层。
2.根据权利要求1所述改善塑胶表面镀层结合力的方法,其特征在于,所述注塑件的基材为填料增强型聚醚酰亚胺复合材料、填料增强型聚苯硫醚复合材料、填料增强型间规聚苯乙烯复合材料或液晶聚合物。
3.根据权利要求1所述改善塑胶表面镀层结合力的方法,其特征在于,所述金属镀层包括由内向外依次层叠设置的种子层、中间层和保护层,所述种子层包括底层和外层,所述底层的材质为Ti、Cr、Ni/Cr、Ni/Cu合金中的一种,所述外层的材质为Cu。
4.根据权利要求3所述改善塑胶表面镀层结合力的方法,其特征在于,所述中间层的材质为Cu,所述保护层的材质为Ag、Au或Sn。
5.根据权利要求3所述改善塑胶表面镀层结合力的方法,其特征在于,所述种子层的厚度小于1μm,所述中间层的厚度为2~45μm,所述保护层的厚度为2~5μm。
6.根据权利要求1至5任一项所述改善塑胶表面镀层结合力的方法,其特征在于,包括如下步骤:
S1、在所述注塑模具的型面进行粗糙化处理,并通过所述注塑模具注塑得到表面具有粗糙度的注塑件;
S2、在注塑件的表面依次进行化学镀、镭雕、第一次电镀、蚀刻、第二次电镀,以获得表面具有金属镀层且金属镀层的百格结合力为5B的注塑件。
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