CN113556870A - Circuit board, fixing method and device thereof, storage medium and electronic device - Google Patents

Circuit board, fixing method and device thereof, storage medium and electronic device Download PDF

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Publication number
CN113556870A
CN113556870A CN202110725112.3A CN202110725112A CN113556870A CN 113556870 A CN113556870 A CN 113556870A CN 202110725112 A CN202110725112 A CN 202110725112A CN 113556870 A CN113556870 A CN 113556870A
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CN
China
Prior art keywords
group
stamp
pad
pads
circuit board
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110725112.3A
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Chinese (zh)
Inventor
柴亮
戴伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Haier Technology Co Ltd
Haier Smart Home Co Ltd
Original Assignee
Qingdao Haier Technology Co Ltd
Haier Smart Home Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Haier Technology Co Ltd, Haier Smart Home Co Ltd filed Critical Qingdao Haier Technology Co Ltd
Priority to CN202110725112.3A priority Critical patent/CN113556870A/en
Publication of CN113556870A publication Critical patent/CN113556870A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The invention discloses a circuit board, a fixing method and a fixing device thereof, a storage medium and an electronic device. Wherein, the circuit board includes: the bottom plate comprises a first group of bonding pads and a second group of bonding pads which are oppositely arranged; the stamp hole circuit board comprises a first group of stamp holes and a second group of stamp holes which are arranged oppositely, wherein each stamp hole in the first group of stamp holes corresponds to each bonding pad in the first group of bonding pads one by one, and each stamp hole in the second group of stamp holes corresponds to each bonding pad in the second group of bonding pads one by one; the plurality of elastic devices are used for fixing the stamp hole circuit board on the bottom plate, wherein the first end of each elastic device is fixed on the first sub-pad of one pad, and the second end of each elastic device exerts acting force on the stamp hole corresponding to one pad, so that the technical problem that the stamp hole circuit board is difficult to effectively fix on the bottom plate is solved.

Description

Circuit board, fixing method and device thereof, storage medium and electronic device
Technical Field
The invention relates to the field of circuits, in particular to a circuit board, a fixing method and a fixing device thereof, a storage medium and an electronic device.
Background
At present, when a stamp hole circuit board is produced and tested, a spring card needle or a clamp and other row and column jigs are usually used for fixing on a bottom plate of the circuit; and in use, is typically welded directly to the base plate.
However, both of the above two methods have certain inconvenience, wherein the row jig such as the spring clip pin or the clamp needs at least two steps during production and test, that is, the stamp hole circuit board is placed first, and then the spring clip pin or the clamp is fixed; the postage stamp hole circuit board is directly welded on the bottom plate, so that the damaged postage stamp hole circuit board is difficult to disassemble, the bottom plate can be damaged due to improper operation, and the postage stamp hole circuit board is difficult to effectively fix on the bottom plate.
Aiming at the technical problem that the stamp hole circuit board in the related art is difficult to be effectively fixed on the bottom plate, no effective solution is provided at present.
Disclosure of Invention
The embodiment of the invention provides a circuit board, a fixing method and a fixing device thereof, a storage medium and an electronic device, and at least solves the technical problem that a stamp hole circuit board is difficult to effectively fix on a bottom plate.
According to one embodiment of the present invention, a circuit board is provided. The circuit board may include: the bottom plate comprises a first group of bonding pads and a second group of bonding pads which are oppositely arranged; the stamp hole circuit board comprises a first group of stamp holes and a second group of stamp holes which are arranged oppositely, wherein each stamp hole in the first group of stamp holes corresponds to each bonding pad in the first group of bonding pads one by one, and each stamp hole in the second group of stamp holes corresponds to each bonding pad in the second group of bonding pads one by one; and a plurality of elastic devices for fixing the stamp hole circuit board on the bottom plate, wherein a first end of each elastic device is fixed on the first sub-pad of one pad, and a second end of each elastic device applies acting force to the stamp hole corresponding to one pad.
In one exemplary embodiment, one pad includes a second sub-pad adjacent to the first sub-pad, the second sub-pad being a through-hole of the chassis, and the second end of each elastic device passes through the corresponding second sub-pad.
In an exemplary embodiment, the second end of each of the elastic devices contacts both a side of the corresponding second sub-pad and a side of the stamp hole.
In one exemplary embodiment, each resilient device is in a displaced state prior to the postage stamp hole circuit board being secured to the base plate and upon the second end of each resilient device contacting a corresponding postage stamp hole.
In an exemplary embodiment, the force applied by the second end of the resilient member to the corresponding stamp hole has a first direction, and the force applied by the second end of the resilient member to the corresponding stamp hole has a second direction, the first direction and the second direction being opposite.
In an exemplary embodiment, each elastic device has a U-shaped leaf spring structure.
According to another embodiment of the invention, a method for fixing the circuit board is also provided. The method can comprise the following steps: determining a target bonding pad in the first group of bonding pads and the second group of bonding pads, wherein the first group of bonding pads and the second group of bonding pads are oppositely arranged on the bottom plate, and stamp holes are not fixed on the target bonding pads; determining target stamp holes corresponding to the target bonding pads on the first group of stamp holes and the second group of stamp holes, wherein the first group of stamp holes and the second group of stamp holes are arranged on the stamp hole circuit board in an opposite mode, each stamp hole in the first group of stamp holes corresponds to each bonding pad in the first group of bonding pads one by one, and each stamp hole in the second group of stamp holes corresponds to each bonding pad in the second group of bonding pads one by one; and acquiring a target elastic device corresponding to the target stamp hole, controlling the first end of the target elastic device to be fixed on the first sub-pad of the target pad, applying an acting force to the target stamp hole by the second end of each elastic device so as to fix the target stamp hole on the target pad, and returning to the step of determining the target pad in the first group of pads and the second group of pads until each pad in the first group of pads and the second group of pads is fixed with the corresponding stamp hole.
According to another embodiment of the invention, a fixing device of the circuit board is further provided. The electronic device may include: the first determining unit is used for determining a target bonding pad in the first group of bonding pads and the second group of bonding pads, wherein the first group of bonding pads and the second group of bonding pads are oppositely arranged on the bottom plate, and stamp holes are not fixed on the target bonding pads; the second determining unit is used for determining target stamp holes corresponding to the target bonding pads on the first group of stamp holes and the second group of stamp holes, wherein the first group of stamp holes and the second group of stamp holes are arranged on the stamp hole circuit board in an opposite mode, each stamp hole in the first group of stamp holes corresponds to each bonding pad in the first group of bonding pads one by one, and each stamp hole in the second group of stamp holes corresponds to each bonding pad in the second group of bonding pads one by one; and the control unit is used for acquiring a target elastic device corresponding to the target stamp hole, controlling the first end of the target elastic device to be fixed on the first sub-pad of the target pad, applying an acting force to the target stamp hole by the second end of each elastic device so as to fix the target stamp hole on the target pad, and returning to the step of determining the target pad in the first group of pads and the second group of pads until the corresponding stamp hole is fixed on each pad in the first group of pads and the second group of pads.
According to still another embodiment of the present invention, there is also provided a computer-readable storage medium. The computer-readable storage medium includes a stored program, wherein the program, when executed by a processor, performs the above-described circuit board fixing method.
According to still another embodiment of the invention, an electronic device is also provided. The electronic device may include a memory in which a computer program is stored, and a processor configured to execute the method of fixing the circuit board of the embodiment of the present invention by the computer program.
By the invention, a circuit board is introduced, comprising: the bottom plate comprises a first group of bonding pads and a second group of bonding pads which are oppositely arranged; the stamp hole circuit board comprises a first group of stamp holes and a second group of stamp holes which are arranged oppositely, wherein each stamp hole in the first group of stamp holes corresponds to each bonding pad in the first group of bonding pads one by one, and each stamp hole in the second group of stamp holes corresponds to each bonding pad in the second group of bonding pads one by one; and a plurality of elastic devices for fixing the stamp hole circuit board on the bottom plate, wherein a first end of each elastic device is fixed on the first sub-pad of one pad, and a second end of each elastic device applies acting force to the stamp hole corresponding to one pad. That is, one end of the elastic device of the application is fixed on the sub-pad of one pad of the bottom plate, and the other end applies acting force to the stamp hole, so that the stamp hole circuit board is conveniently and quickly fixed on the bottom plate without an additional fixing device, and the structure is simple, when the stamp hole circuit board and the bottom plate need to be disassembled, the stamp hole circuit board can be directly pulled out from the bottom plate through the external force, so that the disassembly between the stamp hole circuit board and the bottom plate is quick, the elastic device can be directly applied to production, test and use, thereby avoiding that the stamp hole circuit board is at least firstly placed and then the spring clamp pin or the clamp is fixed when the spring clamp pin or the clamp is used for production and test, avoiding that the stamp hole circuit board is difficult to disassemble and the bottom plate is damaged due to improper operation, but the cost of after-sale maintenance is increased when the bottom plate and the stamp hole circuit board are completely replaced, and solving the technical problem that the stamp hole circuit board is difficult to be effectively fixed on the bottom plate, the technical effect of effectively fixing the stamp hole circuit board on the bottom plate is achieved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
FIG. 1 is a schematic diagram of a circuit board according to an embodiment of the present invention;
fig. 2 is a block diagram of a hardware structure of a method for fixing a circuit board according to an embodiment of the present invention;
fig. 3 is a flowchart of a method for fixing a circuit board according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a U-shaped pin according to an embodiment of the present invention;
FIG. 5 is a schematic view of a pad of a backplane according to an embodiment of the present invention;
FIG. 6 is a schematic view of a postage stamp aperture secured to a pad of a base plate in accordance with an embodiment of the present invention;
FIG. 7 is a schematic view of a postage stamp hole circuit board secured to a base plate according to an embodiment of the present invention;
FIG. 8 is a schematic view of a postage stamp hole circuit board and base plate combination according to an embodiment of the present invention;
fig. 9 is a schematic view of a fixing device of a circuit board according to an embodiment of the invention.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The embodiment of the invention provides a circuit board.
Fig. 1 is a schematic diagram of a circuit board according to an embodiment of the present invention. As shown in fig. 1, the circuit board 10 may include: a base plate 11, a postage stamp hole circuit board 12, and a plurality of resilient devices 13.
And a bottom plate 11 including a first group of pads and a second group of pads arranged oppositely.
In this embodiment, the backplane 11 may be a backplane of a circuit, which may be an application circuit in a modular circuit design. The bottom plate 11 of this embodiment may include a first group of pads and a second group of pads, which are correspondingly disposed on the bottom plate 11, for example, the first group of pads is disposed on the left side of the bottom plate 11, the second group of pads is disposed on the right side of the bottom plate 11, and the number of pads included in the first group of pads is the same as the number of pads included in the second group of pads.
The stamp hole circuit board 12 comprises a first set of stamp holes and a second set of stamp holes which are arranged oppositely, wherein each stamp hole in the first set of stamp holes corresponds to each pad in the first set of pads one by one, and each stamp hole in the second set of stamp holes corresponds to each pad in the second set of pads one by one.
In this embodiment, the postage stamp aperture circuit board 12, i.e., the postage stamp board, may be disposed above the base plate 11 and may include a first set of postage stamp apertures and a second set of postage stamp apertures that are disposed opposite to each other in the same manner as the first set of pads and the second set of pads are disposed, for example, the first set of pads is disposed on the left side of the base plate 11, the second set of pads is disposed on the right side of the base plate 11, the first set of postage stamp apertures is disposed on the left side of the postage stamp aperture circuit board 12, and the second set of postage stamp apertures is disposed on the right side of the postage stamp aperture circuit board 12.
Optionally, each stamp hole in the first set of stamp holes of the embodiment corresponds to each pad in the first set of pads one to one, that is, each stamp hole in the first set of stamp holes has a corresponding pad in the first resource pad, which needs to be fixed on the corresponding pad; each stamp hole of the second set of stamp holes of this embodiment corresponds one-to-one to each pad of the second set of pads, i.e., each stamp hole of the second set of stamp holes has a corresponding one of the pads in the second resource pad that needs to be secured to the corresponding one of the pads.
A plurality of resilient members 13 for securing the postage stamp hole circuit board to the base plate, wherein a first end of each resilient member 13 is secured to a first sub-pad of a pad and a second end of each resilient member 13 applies a force to a postage stamp hole corresponding to a pad.
The elastic device 13 of this embodiment is a flip-chip structure, which may include a first end and a second end for fixing the postage stamp hole circuit board to the base plate, and optionally, each pad on the base plate includes a first sub-pad, and the first end of each elastic device 13 is fixed to the first sub-pad of one pad, wherein the first end may be a first pin, which may be soldered to the first sub-pad, and the second end of each elastic device 13 may apply a force to the postage stamp hole corresponding to the above-mentioned one pad, wherein the second end may be a second pin. It should be noted that the above-mentioned acting force of this embodiment not only can make each stamp hole in the stamp hole circuit board 12 fixed on the corresponding pad of the bottom plate 11, but also can make the stress balance between the stamp hole circuit board 12 and the bottom plate 11, so as to achieve the purpose of fixing the stamp hole circuit board 12 on the bottom plate 11 without additional fixing device. When the stamp hole circuit board 12 and the bottom plate 11 need to be detached, the stamp hole circuit board 12 is directly pulled out of the bottom plate 11 through external force, so that the stamp hole circuit board 12 and the bottom plate 11 can be rapidly installed and detached.
The above-described scheme of this embodiment is further described below.
Optionally, one of the pads includes a second sub-pad adjacent to the first sub-pad, the second sub-pad is a through hole of the bottom plate, and the second end of each elastic device passes through the corresponding second sub-pad.
In this embodiment, each pad of the postage stamp hole circuit board includes a first sub-pad and a second sub-pad, the second sub-pad is adjacent to the first sub-pad, the first sub-pad is used for fixing a first end of a corresponding elastic device, the second sub-pad is used for fixing a second end of the corresponding elastic device, the second end of the elastic device passes through the corresponding second sub-pad and can move in the second sub-pad, namely, the second end of the elastic device is a moving end (moving pin).
Optionally, the second end of each elastic device contacts both a side of the corresponding second sub-pad and a side of the stamp hole.
In this embodiment, the length of the portion of each elastic member where the second end contacts the side of the corresponding second sub-pad and the side of the stamp hole may be equal to or approximately equal to the sum of the thickness of the second sub-pad and the thickness of the stamp hole.
Alternatively, the first end and the second end of the elastic device are parallel and may transition through an arc, for example, the elastic device may have a U-shaped leaf spring structure and may have a U-shaped pin, such that the length of the portion of each elastic device contacting the side of the corresponding second sub-pad and the side of the stamp hole may be equal to the sum of the thickness of the second sub-pad and the thickness of the stamp hole.
Alternatively, each resilient member is in a displaced state prior to the postage stamp hole circuit board being secured to the base plate and upon the second end of each resilient member contacting a corresponding postage stamp hole.
In this embodiment, each of the resilient members is moved by the force applied to the stamp aperture until the stamp aperture circuit board is secured to the base plate before the securement between the stamp aperture circuit board and the base plate has reached a stable condition and while the second end of each resilient member is in contact with the corresponding stamp aperture.
Optionally, the second end of the elastic device corresponding to each pad in the first set of pads exerts a force on the corresponding stamp hole in a first direction, and the second end of the elastic device corresponding to each pad in the second set of pads exerts a force on the corresponding stamp hole in a second direction, the first direction and the second direction being opposite.
In this embodiment, the second end of the elastic device corresponding to each pad in the first group of pads is pressed against the corresponding stamp hole, and the directions of the acting forces may be the first direction, and the second end of the elastic device corresponding to each pad in the second group of pads is pressed against the corresponding stamp hole, and the directions of the acting forces may be the second direction, so that the acting force of the stamp hole circuit board on the bottom board reaches a balanced state, and the stamp hole circuit board is fixed on the bottom board.
Optionally, to prevent vibration in the floor-mounted device, such as a washing machine, automobile, etc., that may be addressed during operation, this embodiment may further include a securing mechanism on the floor and the postage stamp hole circuit board, such as a removable securing mechanism at an opposite location of the postage stamp holes to prevent loosening of a stuck postage stamp hole circuit board. Wherein, the fixing device can be a spring clip needle or a fixture or other line fixture.
Alternatively, if the device to which the base plate is mounted is not subject to vibration, then no additional fixtures may be added to the base plate and the postage stamp hole circuit board.
In the circuit board of this embodiment, the first end of each elastic device is fixed to the first sub-pad of one pad, the second end of each elastic device directly applies a force to the stamp hole corresponding to one pad, thereby the stamp hole circuit board is fixed on the bottom plate without an additional fixing device and has simple structure, when the stamp hole circuit board and the bottom plate need to be disassembled, the stamp hole circuit board can be directly pulled out from the bottom plate through external force, so that the stamp hole circuit board and the bottom plate can be quickly assembled and disassembled, and can be directly applied to production, test and use, therefore, the situation that the stamp hole circuit board is placed at least first and then the spring clamping pin or the clamp is fixed when the spring clamping pin or the clamp is used for production and test is avoided, the situation that the stamp hole circuit board is difficult to disassemble and the bottom plate is damaged due to improper operation is also avoided, but after-sale maintenance cost is increased due to the fact that the bottom plate and the stamp hole circuit board are completely replaced. The connecting and fixing device can be used for production and testing, and can also be used as a connecting and fixing device of the stamp hole circuit board and the bottom plate in mass production products.
The method embodiments provided in the embodiments of the present application may be executed in a computer terminal or a similar computing device. Taking the example of the method running on a computer terminal as an example, fig. 2 is a hardware structure block diagram of a method for fixing a circuit board according to an embodiment of the present invention. As shown in fig. 2, the computer terminal may include one or more processors 202 (only one is shown in fig. 2), wherein the processors 202 may include, but are not limited to, a Microprocessor (MPU) or a Programmable Logic Device (PLD), and a memory 204 for storing data, and in an exemplary embodiment, the computer terminal may further include a transmission device 206 for communication function and an input/output device 208. It will be understood by those skilled in the art that the structure shown in fig. 2 is only an illustration, and is not intended to limit the structure of the computer terminal. For example, the computer terminal may also include more or fewer components than shown in FIG. 2, or have a different configuration with equivalent functionality to that shown in FIG. 2 or more functionality than that shown in FIG. 2.
The memory 204 can be used for storing computer programs, for example, software programs and modules of application software, such as computer programs corresponding to the signal interferometry method in the embodiment of the present invention, and the processor 202 executes various functional applications and data processing by running the computer programs stored in the memory 204, so as to implement the method described above. Memory 204 may include high speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 204 may further include memory located remotely from the processor 202, which may be connected to a computer terminal over a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The transmission means 206 is used for receiving or transmitting data via a network. Specific examples of the network described above may include a wireless network provided by a communication provider of the computer terminal. In one example, the transmission device 206 includes a Network adapter (NIC), which can be connected to other Network devices through a base station so as to communicate with the internet. In one example, the transmission device 206 can be a Radio Frequency (RF) module, which is used for communicating with the internet in a wireless manner.
In this embodiment, a method for fixing a circuit board is provided, which is applied to the computer terminal described above, and fig. 3 is a flowchart of a method for fixing a circuit board according to an embodiment of the present invention. As shown in fig. 3, the method may include the steps of:
step S302, target bonding pads are determined in the first group of bonding pads and the second group of bonding pads, wherein the first group of bonding pads and the second group of bonding pads are oppositely arranged on the bottom plate, and stamp holes are not fixed on the target bonding pads.
In the technical solution provided in the above step S302, the backplane may be a backplane of a circuit, and the circuit may be an application circuit in a modular circuit design. The bottom plate of this embodiment may include a first group of pads and a second group of pads, which are correspondingly disposed on the bottom plate, for example, the first group of pads is disposed on the left side of the bottom plate, the second group of pads is disposed on the right side of the bottom plate, and the number of pads included in the first group of pads is the same as the number of pads included in the second group of pads.
The embodiment defines a destination pad in the first set of pads and the second set of pads, which may be any pad in the first set of pads and the second set of pads to which a postage stamp hole is not secured.
Step S304, determining target stamp holes corresponding to the target bonding pads on the first group of stamp holes and the second group of stamp holes, wherein the first group of stamp holes and the second group of stamp holes are oppositely arranged on the stamp hole circuit board, each stamp hole in the first group of stamp holes corresponds to each bonding pad in the first group of bonding pads one by one, and each stamp hole in the second group of stamp holes corresponds to each bonding pad in the second group of bonding pads one by one.
In the technical solution provided by step S304 of the present application, the postage stamp hole circuit board may be disposed above the bottom board, and may include a first group of postage stamp holes and a second group of postage stamp holes, where the first group of postage stamp holes and the second group of postage stamp holes are disposed oppositely in a manner the same as that of the first group of pads and the second group of pads, for example, the first group of pads is disposed on the left side of the bottom board, the second group of pads is disposed on the right side of the bottom board, the first group of postage stamp holes is disposed on the left side of the postage stamp hole circuit board, and the second group of postage stamp holes is disposed on the right side of the postage stamp hole circuit board.
Optionally, each stamp hole in the first set of stamp holes of the embodiment corresponds to each pad in the first set of pads one to one, that is, each stamp hole in the first set of stamp holes has a corresponding pad in the first resource pad, which needs to be fixed on the corresponding pad; each stamp hole of the second set of stamp holes of this embodiment corresponds one-to-one to each pad of the second set of pads, i.e., each stamp hole of the second set of stamp holes has a corresponding one of the pads in the second resource pad that needs to be secured to the corresponding one of the pads.
After the destination pads are identified in the first and second sets of pads, the embodiment may identify a destination stamp hole corresponding to the destination pads on the first and second sets of stamp holes, i.e., once the destination pads are identified, the embodiment uniquely identifies the corresponding destination stamp holes.
Step S306, a target elastic device corresponding to the target stamp hole is obtained, the first end of the target elastic device is controlled to be fixed to the first sub-pad of the target pad, the second end of each elastic device exerts an acting force on the target stamp hole to enable the target stamp hole to be fixed on the target pad, and the step of determining the target pad in the first group of pads and the second group of pads is returned until the corresponding stamp hole is fixed to each pad in the first group of pads and the second group of pads.
In the technical solution provided by step S306 of the present application, the elastic device is a leaf spring type structure, and may include a first end and a second end, where the first end and the second end are used to fix the postage stamp hole circuit board on the bottom plate, optionally, each pad on the bottom plate includes a first sub-pad, and the first end of each elastic device is fixed to the first sub-pad of one pad, where the first end may be a first pin, which may be soldered on the first sub-pad, and the second end of each elastic device may apply an acting force to the postage stamp hole corresponding to the above one pad, and the second end may be a second pin.
Optionally, after the second determining step is performed, the embodiment may obtain a target elastic device corresponding to the target stamp hole from the plurality of elastic devices, and control the first end of the target elastic device to be fixed to the first sub-pad of the target pad, and the second end of each elastic device applies a force to the target stamp hole, so that the second end of each elastic device passes through the corresponding second sub-pad to fix the target stamp hole on the target pad, and continue to re-determine the target pad from the first set of pads and the second set of pads until each pad of the first set of pads and the second set of pads is fixed with the corresponding stamp hole.
It should be noted that the acting force of the embodiment not only can fix each stamp hole in the stamp hole circuit board on the corresponding pad of the bottom plate, but also can balance the stress between the stamp hole circuit board and the bottom plate, thereby achieving the purpose of fixing the stamp hole circuit board on the bottom plate without an additional fixing device. When the stamp hole circuit board and the bottom plate need to be disassembled, the stamp hole circuit board is directly pulled out from the bottom plate through external force, so that the stamp hole circuit board and the bottom plate can be quickly assembled and disassembled.
In order to better understand the above circuit board, the following describes the above solution with reference to an alternative embodiment, but the solution of the embodiment of the present invention is not limited thereto.
The stamp hole circuit board is widely used in modular circuit design and application, and can be directly welded on a bottom plate of an application circuit without a connector, thereby saving cost and space.
In the production and test of the stamp hole circuit board, row and column jigs such as spring clamp pins or clamps are mostly used for realizing the connection and fixation of contacts, the stamp hole circuit board needs to be placed firstly and then fixed by a pressing or clamping device, for example, the stamp hole circuit board is fixed on a bottom plate by the spring clamp pins or the clamps, the test of corresponding functions can be carried out after the fixation, and the stamp hole circuit board is removed according to the opposite steps of the fixation after the test is finished, thereby leading the stamp hole circuit board to be fixed on the bottom plate complexly; in use, the stamp hole circuit board is mostly directly welded on the bottom plate (sometimes, the stamp hole circuit board is directly welded on the bottom plate in test), but one problem that the stamp hole circuit board cannot be avoided after mass production is that after sale, the damaged stamp hole circuit board is difficult to disassemble, the bottom plate can be damaged due to improper operation, but after sale maintenance cost is increased due to the fact that the bottom plate and the stamp hole circuit board are completely replaced.
This embodiment can solve the above-mentioned problems, and the stamp hole circuit board can be fixed on the bottom plate by using a U-shaped spring sheet structure (U-shaped pin, or similar U-shaped pin), and the fixing and the removal are direct.
Fig. 4 is a schematic diagram of a U-shaped pin according to an embodiment of the invention. As shown in fig. 4, the U-shaped pin may have an a-pin and a B-pin. Alternatively, the a pin and the B pin of this embodiment may be parallel or approximately parallel to each other, and the a pin and the B pin may transition through a circular arc.
Fig. 5 is a schematic diagram of a pad of a backplane according to an embodiment of the present invention. As shown in FIG. 5, the pads of the backplane are special pads, where C is used to denote a first sub-pad of the backplane pad, D is used to denote a second sub-pad of the backplane pad, and E is used to denote a single postage stamp hole of a postage stamp hole circuit board.
FIG. 6 is a schematic view of a stamp hole secured to a pad of a base plate in accordance with an embodiment of the present invention. As shown in fig. 6, the a pin of the U-shaped pin is soldered to the first sub-pad C; a pin B penetrates through the second sub-bonding pad D, and the pin B is a movable pin; e is the state of the single stamp hole of the stamp hole circuit board when being fixed to the pad of the base plate, and E and the stitch B are mutually pressed, thereby achieving the purpose of fixing the single stamp hole to the pad of the base plate.
FIG. 7 is a schematic view of a postage stamp hole circuit board secured to a base plate according to an embodiment of the present invention. As shown in fig. 7, the bottom board includes a first group of pads and a second group of pads that are disposed opposite to each other, where the first group of pads may be pads in a left column and include 6 pads, and the second group of pads may be pads in a right column and include 6 pads; the stamp hole circuit board comprises a first group of stamp holes and a second group of stamp holes which are arranged oppositely, wherein the first group of stamp holes can be stamp holes in a left side column and comprise 6 stamp holes, and the second group of bonding pads can be stamp holes in a right side column and comprise 6 stamp holes.
In this embodiment, each stamp hole 721 corresponds one-to-one to each pad (including the first sub-pad 711 and the second sub-pad 712); a plurality of U-shaped pins 73 for securing the postage stamp hole circuit board to the base plate, wherein a first end of each spring 73 is secured to a first sub-pad 711 of one pad, the second sub-pad 712 is a through-hole of the base plate, and a second end of each spring 73 passes through the second sub-pad 712 of one pad and applies a force to a postage stamp hole 722 corresponding to one pad.
It should be noted that only one stamp hole 721, the first sub-pad 711, the second sub-pad 712, and the elastic device 73 are illustrated in fig. 7, and the relationship among the other stamp holes, the first sub-pad, the second sub-pad, and the elastic device is the same as that described above, and therefore, the description thereof is omitted.
FIG. 8 is a schematic view of a postage stamp hole circuit board and base plate combination according to an embodiment of the present invention. As shown in FIG. 8, after the postage stamp hole circuit board 81 may be assembled on top of and below the backplane 82, the assembled postage stamp hole circuit board 81 may be connected to the backplane 82 via the connector 83 to other circuit development boards that may include core devices that require the use of the postage stamp hole circuit board 82 and backplane 82.
Optionally, to prevent vibration of the device to which the base plate is attached, such as a washing machine or an automobile, the embodiment may include removable fixtures at opposite locations of the postage stamp holes to prevent loosening of the captured postage stamp hole circuit board.
This embodiment uses U type shell fragment formula structure, can be fast, simply fix stamp hole circuit board on the bottom plate, simple structure, and installation and dismantlement are swift for stamp hole circuit board can be fixed effectively on the bottom plate, can be used for the production test, also can be used to in the volume production product as stamp hole circuit board and bottom plate be connected and fixing device, and need not extra fixing device.
Through the above description of the embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but the former is a better implementation mode in many cases. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal device (such as a mobile phone, a computer, a server, or a network device) to execute the method according to the embodiments of the present invention.
In this embodiment, a fixing device for a circuit board is further provided, and the device is used to implement the above embodiments and preferred embodiments, and the description of the device is omitted. As used below, the term "unit" may be a combination of software and/or hardware that implements a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, implementations in hardware or a combination of software and hardware are also possible and contemplated.
Fig. 9 is a schematic view of a fixing device of a circuit board according to an embodiment of the invention. As shown in fig. 9, the fixing device 90 of the circuit board may include: a first determining unit 91, a second determining unit 92 and a control unit 93.
The first determining unit 91 is configured to determine a target pad in a first group of pads and a second group of pads, wherein the first group of pads and the second group of pads are arranged on the bottom plate in an opposite manner, and the target pad is not fixed with a stamp hole.
The second determining unit 92 is configured to determine destination stamp holes corresponding to the destination pads on the first group of stamp holes and the second group of stamp holes, where the first group of stamp holes and the second group of stamp holes are arranged on the stamp hole circuit board in an opposite manner, each stamp hole in the first group of stamp holes corresponds to each pad in the first group of pads one to one, and each stamp hole in the second group of stamp holes corresponds to each pad in the second group of pads one to one.
And the control unit 93 is used for acquiring a target elastic device corresponding to the target stamp hole, controlling a first end of the target elastic device to be fixed to the first sub-pad of the target pad, applying an acting force to the target stamp hole by a second end of each elastic device so as to fix the target stamp hole on the target pad, and executing the step of determining the target pad in the first group of pads and the second group of pads until the corresponding stamp hole is fixed to each pad in the first group of pads and the second group of pads.
In the fixing device of the circuit board of the embodiment, one end of the elastic device is fixed on the sub-pad of one pad of the bottom plate, and the other end exerts acting force on the stamp hole, so that the stamp hole circuit board is conveniently and quickly fixed on the bottom plate without an additional fixing device, and the structure is simple, when the stamp hole circuit board and the bottom plate need to be disassembled, the stamp hole circuit board can be directly pulled out from the bottom plate through external force, so that the disassembly between the stamp hole circuit board and the bottom plate is quick, the fixing device can be directly applied to production, test and use, thereby avoiding that the spring clamping pin or the clamp is used for at least firstly placing the stamp hole circuit board and then fixing the spring clamping pin or the clamp during production and test, avoiding the difficulty in disassembling the stamp hole circuit board, damaging the bottom plate due to improper operation, but increasing the post-maintenance cost due to the complete replacement of the bottom plate and the stamp hole circuit board, the technical problem that the stamp hole circuit board is difficult to effectively fix on the bottom plate is solved, and the technical effect of effectively fixing the stamp hole circuit board on the bottom plate is achieved.
Embodiments of the present invention also provide a computer readable storage medium comprising a stored program, wherein the program when executed by a processor performs the steps of any of the method embodiments described above.
Alternatively, in the present embodiment, the above-mentioned computer-readable storage medium may be configured to store a computer program for executing the steps of:
s1, determining a target pad in the first group of pads and the second group of pads, wherein the first group of pads and the second group of pads are oppositely arranged on the bottom plate, and stamp holes are not fixed on the target pad;
s2, determining target stamp holes corresponding to the target bonding pads on the first group of stamp holes and the second group of stamp holes, wherein the first group of stamp holes and the second group of stamp holes are oppositely arranged on the stamp hole circuit board, each stamp hole in the first group of stamp holes corresponds to each bonding pad in the first group of bonding pads one by one, and each stamp hole in the second group of stamp holes corresponds to each bonding pad in the second group of bonding pads one by one;
and S3, acquiring a target elastic device corresponding to the target stamp hole, controlling the first end of the target elastic device to be fixed on the first sub-pad of the target pad, and applying an acting force to the target stamp hole by the second end of each elastic device so as to fix the target stamp hole on the target pad and returning until each pad in the first group of pads and the second group of pads is fixed with a corresponding stamp hole.
In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to: various media capable of storing computer programs, such as a usb disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a removable hard disk, a magnetic disk, or an optical disk.
For specific examples in this embodiment, reference may be made to the examples described in the above embodiments and exemplary embodiments, and details of this embodiment are not repeated herein.
Embodiments of the present invention also provide an electronic device comprising a memory having a computer program stored therein and a processor arranged to run the computer program to perform the steps of any of the above method embodiments.
Optionally, in this embodiment, the processor may be configured to execute the following steps by a computer program:
s1, determining a target pad in the first group of pads and the second group of pads, wherein the first group of pads and the second group of pads are oppositely arranged on the bottom plate, and stamp holes are not fixed on the target pad;
s2, determining target stamp holes corresponding to the target bonding pads on the first group of stamp holes and the second group of stamp holes, wherein the first group of stamp holes and the second group of stamp holes are oppositely arranged on the stamp hole circuit board, each stamp hole in the first group of stamp holes corresponds to each bonding pad in the first group of bonding pads one by one, and each stamp hole in the second group of stamp holes corresponds to each bonding pad in the second group of bonding pads one by one;
and S3, acquiring a target elastic device corresponding to the target stamp hole, controlling the first end of the target elastic device to be fixed on the first sub-pad of the target pad, and applying an acting force to the target stamp hole by the second end of each elastic device so as to fix the target stamp hole on the target pad and returning until each pad in the first group of pads and the second group of pads is fixed with a corresponding stamp hole.
In an exemplary embodiment, the electronic apparatus may further include a transmission device and an input/output device, wherein the transmission device is connected to the processor, and the input/output device is connected to the processor.
For specific examples in this embodiment, reference may be made to the examples described in the above embodiments and exemplary embodiments, and details of this embodiment are not repeated herein.
It will be apparent to those skilled in the art that the various modules or steps of the invention described above may be implemented using a general purpose computing device, they may be centralized on a single computing device or distributed across a network of computing devices, and they may be implemented using program code executable by the computing devices, such that they may be stored in a memory device and executed by the computing device, and in some cases, the steps shown or described may be performed in an order different than that described herein, or they may be separately fabricated into various integrated circuit modules, or multiple ones of them may be fabricated into a single integrated circuit module. Thus, the present invention is not limited to any specific combination of hardware and software.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A circuit board, comprising:
the bottom plate comprises a first group of bonding pads and a second group of bonding pads which are oppositely arranged;
the stamp hole circuit board comprises a first group of stamp holes and a second group of stamp holes which are arranged oppositely, wherein each stamp hole in the first group of stamp holes corresponds to each bonding pad in the first group of bonding pads one by one, and each stamp hole in the second group of stamp holes corresponds to each bonding pad in the second group of bonding pads one by one;
and the elastic devices are used for fixing the stamp hole circuit board on the bottom plate, wherein the first end of each elastic device is fixed on the first sub-bonding pad of one bonding pad, and the second end of each elastic device exerts acting force on the stamp hole corresponding to one bonding pad.
2. The circuit board of claim 1, wherein one of the pads comprises a second sub-pad adjacent to the first sub-pad, the second sub-pad being a through-hole of the bottom plate, and the second end of each of the elastic devices passes through the corresponding second sub-pad.
3. The circuit board of claim 2, wherein the second end of each of the resilient members contacts both a side of the corresponding second sub-pad and a side of the stamp hole.
4. The circuit board of claim 1, wherein each of the resilient members is in a displaced state prior to the postage stamp hole circuit board being secured to the base plate and upon the second end of each of the resilient members contacting the corresponding postage stamp hole.
5. The circuit board of claim 1, wherein the force applied by the second end of the resilient member to the corresponding stamp aperture has a first direction for each of the first set of pads, and the force applied by the second end of the resilient member to the corresponding stamp aperture has a second direction for each of the second set of pads, the first and second directions being opposite.
6. The circuit board according to any one of claims 1 to 5, wherein the structure of each elastic device is a U-shaped leaf spring structure.
7. A method of securing a circuit board, comprising:
determining a target bonding pad in a first group of bonding pads and a second group of bonding pads, wherein the first group of bonding pads and the second group of bonding pads are arranged on the bottom plate in an opposite mode, and stamp holes are not fixed on the target bonding pads;
determining target stamp holes corresponding to the target bonding pads on a first group of stamp holes and a second group of stamp holes, wherein the first group of stamp holes and the second group of stamp holes are arranged on a stamp hole circuit board in an opposite mode, each stamp hole in the first group of stamp holes corresponds to each bonding pad in the first group of bonding pads one by one, and each stamp hole in the second group of stamp holes corresponds to each bonding pad in the second group of bonding pads one by one;
and acquiring a target elastic device corresponding to the target stamp hole, controlling a first end of the target elastic device to be fixed to a first sub-pad of the target pad, applying an acting force to the target stamp hole by a second end of each elastic device so as to fix the target stamp hole on the target pad, and returning to the step of determining the target pad in the first group of pads and the second group of pads until each pad in the first group of pads and the second group of pads is fixed with a corresponding stamp hole.
8. A fixing device for a circuit board, comprising:
the first determining unit is used for determining a target bonding pad in a first group of bonding pads and a second group of bonding pads, wherein the first group of bonding pads and the second group of bonding pads are arranged on the bottom plate in an opposite mode, and stamp holes are not fixed in the target bonding pads;
the second determination unit is used for determining target stamp holes corresponding to the target bonding pads on a first group of stamp holes and a second group of stamp holes, wherein the first group of stamp holes and the second group of stamp holes are arranged on a stamp hole circuit board in an opposite mode, each stamp hole in the first group of stamp holes corresponds to each bonding pad in the first group of bonding pads one by one, and each stamp hole in the second group of stamp holes corresponds to each bonding pad in the second group of bonding pads one by one;
and the control unit is used for acquiring a target elastic device corresponding to the target stamp hole, controlling the first end of the target elastic device to be fixed to the first sub-pad of the target pad, and applying an acting force to the target stamp hole by the second end of each elastic device so as to fix the target stamp hole on the target pad, and returning to the step of determining the target pad in the first group of pads and the second group of pads until a corresponding stamp hole is fixed to each pad in the first group of pads and the second group of pads.
9. A computer-readable storage medium, comprising a stored program, wherein the program, when executed by a processor, performs the method of claim 7.
10. An electronic device comprising a memory and a processor, characterized in that the memory has stored therein a computer program, the processor being arranged to execute the method of claim 7 by means of the computer program.
CN202110725112.3A 2021-06-29 2021-06-29 Circuit board, fixing method and device thereof, storage medium and electronic device Pending CN113556870A (en)

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CN202110725112.3A CN113556870A (en) 2021-06-29 2021-06-29 Circuit board, fixing method and device thereof, storage medium and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110725112.3A CN113556870A (en) 2021-06-29 2021-06-29 Circuit board, fixing method and device thereof, storage medium and electronic device

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Citations (5)

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Publication number Priority date Publication date Assignee Title
US6404648B1 (en) * 2001-03-30 2002-06-11 Hewlett-Packard Co. Assembly and method for constructing a multi-die integrated circuit
CN108072832A (en) * 2018-01-26 2018-05-25 深圳市布谷鸟科技有限公司 A kind of test fixture of the pcb board with stamp hole
CN209247976U (en) * 2018-12-19 2019-08-13 四川虹美智能科技有限公司 A kind of test fixture of printed circuit board
CN111194137A (en) * 2020-03-03 2020-05-22 广州致远电子有限公司 High-performance intelligent core board
CN211090144U (en) * 2019-09-12 2020-07-24 上海东软载波微电子有限公司 Printed circuit board structure and clamp of stamp hole module thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6404648B1 (en) * 2001-03-30 2002-06-11 Hewlett-Packard Co. Assembly and method for constructing a multi-die integrated circuit
CN108072832A (en) * 2018-01-26 2018-05-25 深圳市布谷鸟科技有限公司 A kind of test fixture of the pcb board with stamp hole
CN209247976U (en) * 2018-12-19 2019-08-13 四川虹美智能科技有限公司 A kind of test fixture of printed circuit board
CN211090144U (en) * 2019-09-12 2020-07-24 上海东软载波微电子有限公司 Printed circuit board structure and clamp of stamp hole module thereof
CN111194137A (en) * 2020-03-03 2020-05-22 广州致远电子有限公司 High-performance intelligent core board

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Application publication date: 20211026