CN113543625B - Production line body structure of patch product and production method thereof - Google Patents

Abstract

The production line structure of the patch product of the invention comprises: a first wire body; a second wire body; two unification tracks have: the transport trolley drives the first rail and the second rail to move; first line body, second line body are connected with two unification tracks through first track and second track respectively, and first track has: a first track front inductor and a first track rear inductor; the second track has: inductor and second track after inductor before the second track, after the inductor senses the paster product after first track, first track stops carrying, and the travelling bogie drives a rail and docks with first track, and after the inductor senses the paster product after the second track, the second track stops carrying, and the travelling bogie drives two rails and docks with the second track. According to the invention, two production line bodies pass through the two-in-one track, so that the cost input and the equipment floor area are saved, the space utilization rate and the output of unit floor area are improved, and the production requirement of consumer electronic products is met.

Description

Production line body structure of patch product and production method thereof

Technical Field

The invention relates to a production line structure for processing a patch product and a production method thereof, in particular to a production line structure for processing a patch product and a production method thereof.

Background

At present, with the continuous development of science and technology and the continuous demand of the market for the personalization and diversification of products, especially for consumer electronic products such as: the requirements of smart phones, tablet computers, smart home appliances and the like are higher and higher, and the traditional large-scale production mode with single variety, long production period and large production batch of each product has to be correspondingly changed to the mode of multi-variety, short production period and small-batch production.

To meet the above requirements of consumers, high-speed chip mounters are now widely used to produce chip mounters in electronic products, such as: an Integrated Circuit Chip (IC Chip) and a Printed Circuit Board (PCB) adopt a new generation of SMT (Surface Mount Technology), namely a Surface assembly Technology, which can greatly promote the miniaturization and the multifunctionality of electronic products and provide conditions for mass production and low-defect-rate production.

The SMT line body used at present carries out the step of paster, generally includes in proper order: the feeding machine is used for feeding, the printing machine is used for printing, the chip mounter is used for chip mounting, and the reflow soldering machine is used for reflow soldering, and moreover, the equipment used in every two adjacent steps is connected through the rail, so that the material transfer is completed.

However, if the above-mentioned SMT processing line body is used to produce a plurality of patch products, the number of the SMT processing line bodies needs to be corresponding, and thus, the multiple line bodies not only occupy a large area and have low production efficiency, but also have high corresponding production cost, and are difficult to meet the production requirements of the existing consumer electronic products.

Further, realization of an efficient automatic processing line is also a technical problem to be improved in the art.

Disclosure of Invention

In view of the above technical problems in the prior art, an object of the present invention is to provide a production line structure of a patch product and a production method thereof, which can improve space utilization and save production cost.

The production line structure of the patch product of the invention comprises: a first wire body having: the system comprises a first feeding machine, a first printing machine and a first chip mounter, wherein adjacent devices are connected through a rail; a second wire body having: the adjacent equipment is connected through a rail; two unification tracks have: the transport trolley drives the first rail and the second rail to move; reflow soldering, wherein the first wire body and the second wire body are respectively connected with the two-in-one rail through a first rail and a second rail, and the two-in-one rail is connected with the reflow soldering; the first track has: the system comprises a first track front sensor and a first track rear sensor, wherein when the first track front sensor senses a surface mounted product, the first track is used for conveying, and when the first track rear sensor senses the surface mounted product, the first track stops conveying; the second track has: the conveying trolley comprises a second track front sensor and a second track rear sensor, when the second track front sensor senses a paster product, the second track is used for conveying, when the second track rear sensor senses the paster product, the second track stops conveying, when the first track rear sensor senses the paster product, the first track stops conveying, the conveying trolley drives the first track to be in butt joint with the first track, when the second track rear sensor senses the paster product, the second track stops conveying, and the conveying trolley drives the second track to be in butt joint with the second track.

According to the production line structure of the patch product, two production lines pass through the two-in-one track, so that the cost input of a machine table is saved, the occupied area of equipment is saved, the space utilization rate is improved, the output of unit occupied area is improved, the production requirement of consumer electronic products is met, meanwhile, the automatic conveying of the production line is realized, the labor cost is saved, and the production efficiency is greatly improved.

Further, in the above production line structure of the patch product, the one rail has: a front rail sensor and a rear rail sensor; the two rails have: a second rail front sensor and a second rail rear sensor; when the front sensor of the first rail and the rear sensor of the first rail cannot sense the surface mounted products, the first rail carries out conveying action, and when the front sensor of the second rail and the rear sensor of the second rail cannot sense the surface mounted products, the second rail carries out conveying action. Like this, can realize the automatic transport of the production line body, save the cost of labor, promote productivity ratio greatly.

In addition, in the production line structure of the patch product, when the first rail rear sensor and the second rail rear sensor sense the patch product at the same time, the first rail and the first rail are preferably butted to convey the patch product. Like this, can avoid the paster product confusion to appear on two production line bodies, ensure the transport rate of accuracy of paster product.

In addition, in the production line structure of the chip products, when the first track rear sensor and the second track rear sensor sense the chip products at the same time, the first track continuously carries out chip product conveying actions twice and completes the chip product conveying actions, and when the second track does not carry out conveying actions, the second track is preferably butted with the second track to carry out chip product conveying. Like this, can avoid the paster product confusion to appear on two production line bodies, ensure the transport rate of accuracy of paster product, simultaneously, the production progress of two production line bodies of balance.

In addition, in the production line structure of the above patch product, the two-in-one rail and the reflow soldering are connected by a double-gauge rail, and the double-gauge rail includes: a dual-rail track one track and a dual-rail track two track, the dual-rail track one track having: a double-track-one-track front sensor and a double-track-one-track rear sensor; the double-rail two-rail comprises: a double-track two-track front sensor and a double-track two-track rear sensor, when the double-track one-track front sensor senses a paster product, the double-track one-track carries out conveying action, and conveying the surface mounted products to the reflow soldering, and when the front sensor of the double-track and double-track tracks senses the surface mounted products, the double-track and double-track tracks carry out conveying action to convey the surface mounted products to the reflow soldering. Like this, can avoid two production line bodies to go up the paster product confusion and appear, ensure the transport rate of accuracy of paster product.

In addition, in the production line structure of the surface mounted products, when the double-track one-track rear sensor and the double-track two-track rear sensor simultaneously sense that the surface mounted products pass through and convey information of the surface mounted products, the conveying action of the track with longer waiting time on the two-in-one track is preferentially carried out. Like this, can avoid the paster product confusion to appear on two production line bodies, ensure the transport rate of accuracy of paster product, simultaneously, also can balance the production progress of two production line bodies.

In addition, in the production line body structure of above-mentioned paster product, still include: the cleaning machine and the material receiving machine are sequentially connected with the reflow soldering through a rail. Like this, can constitute the full-automatic production line body, realize the automatic transport of the production line body, save the cost of labor, promote productivity ratio greatly.

Also, the present invention provides a method for producing a patch product, comprising: the method comprises the following steps that firstly, feeding, printing and surface mounting of a surface mounting product are carried out through a first line body and a second line body; a second step of transporting the patch products from the first line body or the second line body through a transport trolley of a two-in-one rail; and thirdly, performing reflow soldering on the patch product through reflow soldering.

According to the production line structure of the patch product and the production method thereof, two production lines pass through the two-in-one rail, so that the machine cost input is saved, the equipment floor area is saved, the space utilization rate is improved, the output of unit floor area is improved, the production requirement of consumer electronic products is met, meanwhile, the automatic conveying of the production lines is realized, the labor cost is saved, and the production efficiency is greatly improved.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiment(s) of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural view of a production line structure layout of a patch product of the present invention.

Fig. 2 is a schematic structural diagram of the two-in-one rail and the front and rear rails according to the present invention.

In the figure: 1. the system comprises a first wire body, 2, a second wire body, 3, a first feeding machine, 4, a first feeding machine, 5, a first printing machine, 6, a second printing machine, 7, a first chip mounter, 8, a second chip mounter, 9, a first rail, 10, a second rail, 11, a rail, 12, a two-in-one rail, 14, a double-rail, 15, reflow soldering, 16, a rail, 17, a cleaning machine, 18, a rail, 19, a receiving machine, 20, a transport trolley, 9a, a front first rail sensor, 9b, a rear first rail sensor, 10a, a second track front sensor, 10b, a second track rear sensor, 21, a track, 21a, a first track front sensor, 21b, a first track rear sensor, 22, a second track, 22a, a second track front sensor, 22b, a second track rear sensor, 141, a dual track first track, 141a, a dual track first track front sensor, 141b, a dual track first track rear sensor, 142, a dual track second track, 142a, a dual track second track front sensor, 142b, a dual track second track rear sensor.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments. It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict.

The following detailed description is exemplary in nature and is intended to provide further explanation of the invention as claimed. Unless otherwise defined, all technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention.

Fig. 1 is a schematic structural view of a production line structure layout of a patch product of the present invention, and as shown in the drawing, the production line structure of the patch product of the present invention includes: the chip mounter comprises a first line body 1, a second line body 2, a first feeding machine 3, a second feeding machine 4, a first printing machine 5, a second printing machine 6, a first chip mounter 7, a second chip mounter 8, a first rail 9, a second rail 10, a rail 11, a rail 12, a two-in-one rail 13, a double-rail 14, reflow soldering 15, a rail 16, a cleaning machine 17, a rail 18 and a material receiving machine 19.

The first wire body 1 consists of a first feeding machine 3, a first printing machine 5, a track 11 and a first chip mounter 7; the second wire body 2 is composed of a second feeding machine 4, a second printing machine 6, a rail 12 and a second chip mounter 8. The first wire body 1 and the second wire body 2 are respectively connected with the two-in-one track 13 through the first track 9 and the second track 10.

As shown in fig. 1, a first line body 1 and a second line body 2 are two parallel production line bodies, and in the first line body 1, a first feeder 3 conveys a mounted product to a first printer 5 for printing, and then conveys the mounted product to a first mounting machine 7 for mounting through a rail 11. Similarly, the second wire 2 is also subjected to the same process as the first wire 1. Like this, can print and the paster is handled to different paster products or a plurality of paster products simultaneously on first line body 1 and second line body 2 respectively, realize the paster product simultaneous processing production of multiple type or a plurality of number, satisfied the demand of production variety.

Here, between material loading machine and the printing machine, and between printing machine and the chip mounter, whether the response of sensing equipment to the paster product has or not carries out the sending of the required signal of material loading or transport, when realizing automated production, also can guarantee that each paster product carries out every process, prevent the emergence of processing badness and production defect.

The first bobbin 1 and the second bobbin 2 are connected to the two-in-one rail 13 through the first rail 9 and the second rail 10, respectively, and the mounted products on the first bobbin 1 and the second bobbin 2 are conveyed to the two-in-one rail 13 through the first rail 9 and the second rail 10.

Here, as shown in fig. 2, the first rail 9 is provided with a first rail front sensor 9a on a side close to the first chip mounter 7, and a first rail rear sensor 9b on a side close to the two-in-one rail 13. Similarly, a second track front sensor 10a is disposed on the second track 10 near the second chip mounter 8, and a second track rear sensor 10b is disposed on the second track near the two-in-one track 13. When the first track front sensor 9a and/or the second track front sensor 10a sense the patch product, the first track 9 and/or the second track 10 starts to perform a conveying action, and the patch product is conveyed to the two-in-one track 13.

The two-in-one track 13 further comprises a transport trolley 20, the transport trolley 20 is provided with a first rail 21 and a second rail 22, and the transport trolley 20 can drive the first rail 21 and the second rail 22 to move. On the rail 21, a front rail sensor 21a is disposed near the first rail 9, and a rear rail sensor 21b is disposed near the reflow soldering 15. Similarly, the second rail 22 is provided with a second rail front sensor 22a on the side close to the second rail 10 and a second rail rear sensor 22b on the side close to the reflow soldering 15.

Furthermore, when the first track rear sensor 9b or the second track rear sensor 10b senses the chip product, the first track 9 or the second track 10 stops the conveying action and transmits a signal to the transportation trolley 20 of the two-in-one track 13, the transportation trolley 20 drives the first track 21 or the second track 22 to move to the first track 9 or the second track 10, the butt joint with the first track 9 or the second track 10 is completed, and the chip product is conveyed to the first track 21 or the second track 22. In addition, after the docking is completed, when neither the front one-rail sensor 21a nor the rear one-rail sensor 21b senses the mounted product, a signal to be mounted is transmitted to the first rail 9, and the first rail 9 starts to perform a conveying operation. Similarly, after the docking is completed, when neither the front two-rail sensor 22a nor the rear two-rail sensor 22b senses the mounted product, a signal for the mounted product is transmitted to the second rail 10, and the second rail 10 starts to perform a conveying operation.

Like this, through inductor 9b behind the first track of setting on first track 9 to and inductor 10b behind the second track of setting on second track 10, judge that the paster product that needs to carry out transmission is from the first line body 1 or the second line body 2, simultaneously, two unification tracks 13 also through the transmission signal from inductor 9b behind the first track or inductor 10b behind the second track, control travelling bogie 20 goes to butt joint first track 9 or second track 10, transmit the paster product through a rail 21 or two rails 22.

In addition, through setting up inductor 21a, inductor 21b behind the one rail before the one rail 21 of travelling bogie 20 and the one rail on two rails 22, and inductor 22a before two rails, the induction signal of inductor 22b behind two rails, control two unification tracks 13 to send the transmission signal of paster product to first track 9 or second track 10, promptly, travelling bogie 20 transmits the paster product to reflow soldering 15 after, just can send the transmission signal that will paster product to first line body 1 and second line body 2 immediately, like this, just can promote the transmission efficiency of paster product greatly. Meanwhile, automatic conveying of the production line body can be achieved, and labor cost is saved.

The two-in-one rail 13 and the reflow soldering 15 are connected by a two-rail 14, the two-rail 14 includes a two-rail one-rail 141 and a two-rail 142, and a two-rail one-rail front sensor 141a is disposed on the two-rail one-rail 141 near the two-in-one rail 13 and a two-rail one-rail rear sensor 141b is disposed on the reflow soldering 15. Similarly, a front sensor 142a of the two-rail is disposed on the two-rail 142 near the two-in-one rail 13, and a rear sensor 142b of the two-rail is disposed on the two-rail 142 near the reflow soldering 15.

When the front sensor 21a of the two-in-one track 13 senses the mounted product, the first track 21 starts to perform a conveying operation to convey the mounted product to the reflow soldering device 15, when the rear sensor 21b of the first track senses the mounted product, the first track 21 stops conveying operation, the transport trolley 20 drives the first track 21 to move to the dual-track 14, the first track 21 is abutted with the first track 141 of the dual-track, when the front sensor 141a of the dual-track first track senses the mounted product, the conveying trolley starts to convey the mounted product to the reflow soldering device 15 through the first track 141 of the dual-track, and when the rear sensor 141b of the dual-track first track senses the mounted product to pass through, a signal of the mounted product is transmitted to the first track 21 of the two-in-one track 13, and the first track 21 starts to perform a conveying operation. Similarly, when the front sensor 22a of the two-rail two-in-one rail 13 senses a mounted product, the two rails 22 start to perform a conveying operation to convey the mounted product to the reflow soldering 15, when the rear sensor 22b of the two rails senses the mounted product, the two rails 22 stop conveying operation, the transportation cart 20 drives the two rails 22 to move to the two-rail 14, the two rails 22 are abutted to the two-rail 142, when the front sensor 142a of the two-rail senses the mounted product, the two-rail 142 starts to convey the mounted product to the reflow soldering 15, and when the rear sensor 142b of the two-rail senses the mounted product, the two-rail 22 of the two-in-one rail 13 transmits a signal of the mounted product to the two rails 22, and the two rails 22 start to perform a conveying operation.

Here, when the first track back sensor 9b and the second track back sensor 10b simultaneously sense the patch products, the one rail 21 of the two-in-one track 13 is preferentially operated to convey the patch products. In addition, when the operation of conveying the patch products is completed by the first rail 21 twice continuously and the operation of conveying the patch products is not performed by the second rail 22, the operation of conveying the patch products is performed by the second rail 22 preferentially.

In addition, when the dual-rail one-rail rear sensor 141b and the dual-rail two-rail rear sensor 142b simultaneously sense the passing of the mounted products and transmit signals of the mounted products, the operation of conveying the mounted products is performed by a rail with a longer waiting time on the two-in-one rail 13.

As shown in fig. 1, the mounted product is conveyed to a reflow furnace 15 through a double-rail 14, subjected to a reflow process, conveyed to a cleaning machine 17 through a rail 16, subjected to a cleaning process, and conveyed to a receiving machine 19 through a rail 18 to be recovered, thereby completing the production process of the mounted product.

Here, in the present invention, the number of the produced lines may be set according to the number of kinds or the production amount of the produced patch products, for example, third and fourth lines may be provided in parallel with the first line 1 and the second line 2, and the same number of tracks as the number of lines may be provided in the two-in-one track 13 accordingly.

It will be appreciated by those skilled in the art that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The embodiments disclosed above are therefore to be considered in all respects as illustrative and not restrictive. All changes which come within the scope of or equivalence to the invention are intended to be embraced therein.

Claims (5)

1. A production line body structure of paster product which characterized in that includes:

a first wire (1) having: the system comprises a first feeding machine (3), a first printing machine (5) and a first chip mounter (7), wherein adjacent devices are connected through a rail (11);

a second wire (2) having: the system comprises a second feeding machine (4), a second printing machine (6) and a second chip mounter (8), wherein adjacent devices are connected through a rail (12);

a two-in-one track (13) having: the device comprises a transport trolley (20), a first rail (21) and a second rail (22), wherein the transport trolley (20) drives the first rail (21) and the second rail (22) to move;

reflow soldering (15) is carried out to the chip product,

the first wire body (1) and the second wire body (2) are respectively connected with the two-in-one rail (13) through a first rail (9) and a second rail (10), and the two-in-one rail (13) is connected with the reflow soldering (15);

the first rail (9) has: the device comprises a first track front sensor (9 a) and a first track rear sensor (9 b), wherein when the first track front sensor (9 a) senses a paster product, the first track (9) carries out conveying, and when the first track rear sensor (9 b) senses the paster product, the first track (9) stops conveying;

the second rail (10) has: a second track front sensor (10 a) and a second track rear sensor (10 b), when the second track front sensor (10 a) senses a patch product, the second track (10) carries out conveying, when the second track rear sensor (10 b) senses the patch product, the second track (10) stops conveying,

when the first track rear sensor (9 b) senses a patch product, the first track (9) stops conveying, the transport trolley (20) drives the first track (21) to be in butt joint with the first track (9), when the second track rear sensor (10 b) senses the patch product, the second track (10) stops conveying, and the transport trolley (20) drives the second track (22) to be in butt joint with the second track (10);

the one rail (21) has: a pre-track sensor (21 a) and a post-track sensor (21 b);

the two rails (22) have: a two-rail front sensor (22 a) and a two-rail rear sensor (22 b);

when the front first rail sensor (21 a) and the rear first rail sensor (21 b) cannot sense the chip products, the first rail (9) carries out conveying action, and when the front second rail sensor (22 a) and the rear second rail sensor (22 b) cannot sense the chip products, the second rail (10) carries out conveying action;

when the first track rear sensor (9 b) and the second track rear sensor (10 b) sense the patch products simultaneously, the first track (9) is preferably butted with the first track (21) for conveying the patch products;

when the first track rear sensor (9 b) and the second track rear sensor (10 b) sense patch products simultaneously, the first track (21) carries out patch product conveying actions twice continuously and finishes the patch product conveying actions, and when the second track (22) does not carry out conveying actions, the second track (10) and the second track (22) are preferably butted to carry out patch product conveying.

2. Production line body structure of a patch product according to claim 1,

the two-in-one rail (13) is connected with the reflow soldering (15) through a double-rail (14), and the double-rail (14) is provided with: a dual-rail track one rail (141) and a dual-rail track two rail (142), the dual-rail track one rail (141) having: a dual-rail-track-front sensor (141 a) and a dual-rail-track-rear sensor (141 b); the two-rail (142) has: the double-track rail two-track front sensor (142 a) and the double-track rail two-track rear sensor (142 b) are arranged, when the double-track rail one-track front sensor (141 a) senses a chip-mounted product, the double-track rail one-track (141) carries out conveying action to convey the chip-mounted product to the reflow soldering (15), and when the double-track rail two-track front sensor (142 a) senses the chip-mounted product, the double-track rail two-track (142) carries out conveying action to convey the chip-mounted product to the reflow soldering (15).

3. A production line body structure of a patch product according to claim 2,

when the double-track one-track rear sensor (141 b) and the double-track two-track rear sensor (142 b) sense that the chip-mounted products pass through at the same time and convey the information of the chip-mounted products, the two-in-one track (13) is preferably used for conveying the products with longer waiting time.

4. A production line body structure of a patch product according to any one of claims 1 to 3, further comprising:

the cleaning machine (17) and the material receiving machine (19) are sequentially connected with the reflow soldering machine (15) through a rail (16) and a rail (18).

5. A method of manufacturing a patch product, comprising:

the method comprises the following steps that firstly, feeding, printing and surface mounting of a surface mounting product are carried out through a first line body (1) and a second line body (2);

a second step of transporting the patch product from the first thread body (1) or the second thread body (2) by a transport trolley (20) of a two-in-one track (13);

thirdly, performing reflow soldering on the chip product through reflow soldering (15);

the first line body (1) and the second line body (2) are respectively connected with the two-in-one track (13) through a first track (9) and a second track (10);

the first track (9) has: the device comprises a first track front sensor (9 a) and a first track rear sensor (9 b), wherein when the first track front sensor (9 a) senses a paster product, the first track (9) carries out conveying, and when the first track rear sensor (9 b) senses the paster product, the first track (9) stops conveying;

the second rail (10) has: a second track front sensor (10 a) and a second track rear sensor (10 b), when the second track front sensor (10 a) senses a patch product, the second track (10) conveys the patch product, when the second track rear sensor (10 b) senses the patch product, the second track (10) stops conveying the patch product,

the two-in-one rail (13) has: the device comprises a transport trolley (20), a first rail (21) and a second rail (22), wherein the transport trolley (20) drives the first rail (21) and the second rail (22) to move;

when the first track rear sensor (9 b) senses a patch product, the first track (9) stops conveying, the transport trolley (20) drives the first track (21) to be in butt joint with the first track (9), when the second track rear sensor (10 b) senses the patch product, the second track (10) stops conveying, and the transport trolley (20) drives the second track (22) to be in butt joint with the second track (10);

when the first rail rear inductor (9 b) and the second rail rear inductor (10 b) simultaneously induce patch products, the first rail (9) is preferably butted with the first rail (21) to convey the patch products.

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