CN109587959A - A kind of pcb board automatic production method - Google Patents
A kind of pcb board automatic production method Download PDFInfo
- Publication number
- CN109587959A CN109587959A CN201910087436.1A CN201910087436A CN109587959A CN 109587959 A CN109587959 A CN 109587959A CN 201910087436 A CN201910087436 A CN 201910087436A CN 109587959 A CN109587959 A CN 109587959A
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- Prior art keywords
- plate
- copper
- wiring board
- machine
- film
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Abstract
The invention discloses a kind of pcb board automatic production methods, including the heavy copper of the sawing sheet-internal layer dry film interior laminate-of-brownification process-and plate electricity-outer-layer film drying-plating electricity gold-wet green oil-plating golden finger-spray tin turmeric processing step, specific step is as follows: sawing sheet: aniseed being split into various fineves according to specification cutting using automatic cutting machine, pass through angle rounding machine rounding plate angle dirt end, plate is washed using board-washing machine after air-drying, plate is put in oven and is heated, typewriting mark is marked after plate is taken out after plate is cooling；The dry film of internal layer: being put into chemical cleaning machine for plate by handling device, successively completes cleaning by washing, microetch, high-pressure washing, circulating water wash, water suction, high wind drying and the secondary drying of hot wind；High degree of automation of the present invention, entire pcb board high production efficiency, and during production, pcb board damage is low.
Description
Technical field
The present invention relates to pcb board automated production field, specially a kind of pcb board automatic production method.
Background technique
Pcb board is also known as printed circuit board, printed wiring board, and abbreviation printed board is cut into a scale using insulation board as substrate
It is very little, at least have a conductive pattern thereon, and be furnished with hole (such as component hole, fastener hole, plated through-hole), is used to replace previous
The chassis of device electronic component, and realize the interconnection between electronic component, since this plate is using electronic printing
Art production, therefore referred to as " print " circuit board；It is inapt that habit " printed wiring board ", which is referred to as " printed circuit ", because
It is only routed in printed board there is no " printed element ".
In actual application, the degree of automation is low for existing pcb board automatic production method, in most processing steps
It needs largely manually to be participated in, entire pcb board production efficiency is low, and during production, manual operation be easy to cause PCB
Dash-board injury.
Summary of the invention
The purpose of the present invention is to provide a kind of pcb board automatic production methods, in order to overcome above-mentioned pcb board production method
In actual application, the degree of automation is low, needs largely manually to be participated in most processing steps, entire pcb board
The technical issues of production efficiency is low, and during production, and manual operation be easy to cause pcb board to damage.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of pcb board automatic production method, including the sawing sheet-internal layer dry film interior laminate-of-brownification process-are heavy
Copper and plate electricity-outer-layer film drying-plating electricity gold-wet green oil-plating golden finger-spray tin turmeric processing step, specific steps are such as
Under:
Sawing sheet: aniseed is split into fines according to specification cutting using automatic cutting machine, passes through angle rounding machine rounding plate angle dirt
End washes plate using board-washing machine after air-drying, plate is put in oven and is heated, is typewrited after taking out plate after plate is cooling
Mark is marked；
The dry film of internal layer: being put into chemical cleaning machine for plate by handling device, successively passes through washing, microetch, high pressure water
Wash, cleaning is completed in circulating water wash, water suction, high wind drying and the secondary drying of hot wind, by plate immigration clean room, rumble film machine exists
After sticking one layer of photosensitive material dry film on copper sheet surface, plate surface is dusted by automatic dust-binding machine, plate is passed through
The baked plate of Wan Cheng, cooling and ejecting plate after the photosensitive oil machine of rumble expose after clapping the film toward plate face by exposure machine, form line pattern, according to
It is secondary to pass through Na2CO3Solution, HCl and CuCl2The photosensitive material exposed on solution and NaOH solution dissolution route, to line map
Shape is completed to determine；
Brownification process: by wiring board by be put into handling device be transported in brown oxidation level production line complete to wiring board
Surface carries out copper face processing；
Interior laminate: plate-laying: by melanism plate, P piece according to P piece, cut P piece, row P piece, row brownification plate complete arrangement, medium temperature
Degree is maintained at 19 ± 2 DEG C, relative humidity: 30-50%, dustiness: grit≤10K/ cubic feet of 1.0 μm of diameter or more；It is folded
Plate: overlapping line using Automatic dismounting-plate, the P piece that heap is folded be automatically separated, and covers upper copper foil；Pressing plate: Vacuum Heat is used
Press, which generates high temperature and pressure, makes epoxy resin complete the final conversion by molecule cross-link semi-solid preparation state to reticular structure hardening state,
Middle bonding cycle is hot pressing 2 hours, is cold-pressed 1 hour；Tear plate open: the semi-finished product pressed disassembled out, to lamination semi-finished product and
Steel plate is separated；Cutting plate: using cutting, cutter device completes outer ledge modification and drafting board is thick；
Heavy copper and plate electricity: after carrying out drilling processing to wiring board, it is three-in-one that wiring board is placed in de-smear, heavy copper and plate electricity
Automatic assembly line goes out layers of copper in the product of perforated plate inner hole deposition, then passes through by chemical plating method after interior laminate, drilling
Electric plating of whole board method completes the hole conductive copper of wiring board, and conductive copper is with a thickness of 0.2-0.6mil；
Outer-layer film drying: Plate grinder pickling PCB surface is used, in clean room, automatic film applicator is in plate face copper foil table
One layer of photosensitive material in face paste makees master slice by exposure using the black film, the image on the black film is transferred to the yellow film, is exposed
The clappers post-exposure of yellow film aligning is passed through Na using developing machine by machine2CO3Solution exposes copper after dissolving unexposed material
Face forms route；
Plating electricity gold: being put into graphic plating production line for wiring board, removes plate face oxide layer and pollutant using detergent,
After sodium peroxydisulfate and sulfuric acid microetch plate face, by wiring board by the complete golden automatic assembly line of plate electricity, one layer is plated on nickel coating
Layer gold；
Wet green oil: the oxidation film of plate surface is removed and carries out roughening treatment to surface by volcanic ash Plate grinder, and screen printer is logical
It crosses halftone and coats one layer of uniform green oil film, film thickness requirement are as follows: it is baked to be placed in Di temperature Sui Dao by 0.4-1.6mil for wiring board in plate face
Precuring is completed in furnace and vertical single oven, and then exposure machine pass through the yellow film to non-developing section carry out the irradiation of UV light with
And plate-punching machine Na2CO3Unexposed portion is rinsed by liquid medicine, finally by high temperature Sui Dao oven and Dan Men oven to plate face
Green oil carry out hot setting；
Plate golden finger: by plating golden finger production line, wiring board successively passes through microetch, activation, nickel plating and gold-plated, in nickel table
The plating of layer gold is completed on face；
Spray tin turmeric: wiring board is carried to horizontal tin-spraying line by handling device, by the slicker solder of melting and by hot wind
Leveling, completes slicker solder covering on clean copper face, and wiring board passes sequentially through acidity and remove after heavy nickel gold production line automatically
Lower plate is completed after oil, microetch, activation, electroless nickel and electroless gold.
As a further solution of the present invention: the temperature of the clean room is maintained at 20 ± 3 DEG C, and relative humidity is 55 ±
5%, dustiness is 0.5 μm or more grit≤10K/ cubic feet, and temperature is 20 ± 5 DEG C in the PE machine beer hole room, relatively wet
Degree: 40-60%.
As a further solution of the present invention: the work step of the heavy copper and plate electricity are as follows:
After overactivation, acceleration corresponding steps processing, Nonconductor surface is uniform-distribution with the palladium of catalytic activity on hole wall
Layer, under the catalysis and alkaline condition of palladium metal, formaldehyde can dissociate the hydrogen for aoxidizing and generating reproducibility, HCHO+OH-→HCOO+
H2；Then copper ion is reduced: Cu2++H2+2OH-→Cu+2H2O, the chemical layers of copper of precipitation make the base of self catalysis, make Cu2+
It is reduced into metallic copper on the basis of being catalyzed, completes desired chemical layers of copper in rapid succession.
As a further solution of the present invention: described except oil temperature is 40 DEG C ± 5 DEG C, the microetch temperature is 30 DEG C -45
DEG C, the copper facing temperature is 21 DEG C -32 DEG C, and the tin plating temperature is 25 DEG C ± 5 DEG C.
As a further solution of the present invention: the handling device in the dry film of internal layer includes track, electronic slide, peace
Seat, atmospheric pressure pole, fixed plate, mounting plate, first sliding groove, fastener, slide plate, second sliding slot and absorbent module are filled, outside the track
Side is equipped with electronic slide, and the electronic slide side is equipped with mounting base, is equipped with atmospheric pressure pole at the top of the mounting base, described
Atmospheric pressure pole bottom end passes through mounting base and is equipped with fixed plate, and fixed plate bottom both ends are mounted on mounting plate, pacify described in both ends
First sliding groove is offered at the top of loading board, several slide plates is installed below mounting plate described in the both ends, the fastener passes through
Several slide plate both ends are connect by first sliding groove with both ends mounting plate, offer second sliding slot at the top of several described slide plates,
Several absorbent modules are installed on the inside of the second sliding slot.
As a further solution of the present invention: the fastener includes screw bolt and nut, and the bolt end head passes through first
Sliding slot and nut are cooperatively connected.
As a further solution of the present invention: the absorbent module includes support rod, sucker and nut, outside the support rod
Upper side offers screw thread, and the outer side-lower of the support rod is equipped with baffle, and the support rod bottom end is equipped with sucker, the branch
Strut top offers connecting hole, and the support bar top passes through second sliding slot and nut is cooperatively connected.
As a further solution of the present invention: the track installation is in the top of pcb board automatic production line.
As a further solution of the present invention: the use operating procedure of the device are as follows:
Step 1: track and pcb board automatic production line are coupled, by unscrewing absorption group in actual production process
Then the nut of part installs several absorbent modules according to wiring board in the second sliding slot in slide plate, tighten nut and complete admittedly
It is fixed, unscrew the nut of fastener, spacing and number of the adjusting slider in mounting plate；
Step 2: it is extended by atmospheric pressure pole and the adsorption structure of bottom is driven to contact with wiring board, by sucker in pulsometer
Under the action of wiring board is subjected to absorption fixation, then atmospheric pressure pole is shunk, and passes through that electronic slide is mobile in orbit to complete position
Variation equally operates atmospheric pressure pole elongation and puts down wiring board completion carrying after position is mobile.
Compared with original technology, beneficial effects of the present invention:
1, the pcb board automatic production line can raise labour productivity, and stabilize and increase product quality, improve labour item
Part, reduction production occupied area, reduces production cost, shortens the production cycle, guarantee production smoothing, there is significant economic effect
Benefit, the process that automatic production line was operated or controlled automatically by regulated procedure or instruction in the case where unmanned intervene,
Its target is " steady, quasi-, fast ", use automatic assembly line not only can people from heavy manual labor, part mental labour with
And freed in severe, dangerous working environment, and the organ dysfunction of people can be extended, labor productivity is greatlyd improve,
Guarantee the superior in quality of the pcb board produced simultaneously；
2, handling device used in pcb board automatic production line assembles the entire production line completion simultaneously, passes through
The carrying in pcb board production process is rapidly completed in handling device；
3, in the actual production process by unscrewing the nut of absorbent module, then basis in the second sliding slot in slide plate
Wiring board installs several absorbent modules, tightens nut and completes to fix, unscrews the nut of fastener, adjusting slider is in mounting plate
Then spacing and number are completed to carry convenient for completing to adjust according to the pcb board actually carried by sucker suction pcb board, guarantee
The high efficiency and energy saving of carrying.
Detailed description of the invention
In order to facilitate the understanding of those skilled in the art, the present invention will be further described below with reference to the drawings.
Fig. 1 is handling device structural schematic diagram of the present invention.
Fig. 2 is a-quadrant enlarged drawing in Fig. 1 of the present invention.
Fig. 3 is the handling device other side of the present invention structural schematic diagram.
In figure: 1, track；2, electronic slide；3, mounting base；4, atmospheric pressure pole；5, fixed plate；6, mounting plate；7, first is sliding
Slot；8, fastener；9, slide plate；10, second sliding slot；11, absorbent module.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with embodiment, it is clear that described reality
Applying example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is general
Logical technical staff all other embodiment obtained without creative efforts belongs to what the present invention protected
Range.
It please refers to shown in Fig. 1-3, a kind of pcb board automatic production method, including the dry film-ectonexine of sawing sheet-internal layer
The heavy copper of the interior laminate-drilling-of middle inspection-brownification process-and the full plate electricity gold-of plate electricity-outer-layer film drying-graphic plating-
Outer layer etching-wet green oil-wrongly written or mispronounced character-plating golden finger-spray tin process-turmeric process-sharp processing processing step, it is specific to walk
It is rapid as follows:
Sawing sheet: aniseed is split into fines according to specification cutting using automatic cutting machine, passes through angle rounding machine rounding plate angle dirt
End is washed plate using board-washing machine after air-drying, by the dust impurities wash clean on trigger and is air-dried, will be in plate Fang Ru oven
Heating improves plate stability, takes out plate after plate is cooling, is marked using word mark machine in edges of boards typewriting mark；
The dry film of internal layer: being put into chemical cleaning machine for plate, successively by washing, microetch, high-pressure washing, circulating water wash,
Water suction, high wind drying and the secondary drying of hot wind, remove the surface Cu oxide, rubbish, be roughened the surface Cu, Reinforced Cu surface with
Binding force between photosensitive oil or dry film, plate is moved into clean room, is sticked one layer of sense on copper sheet surface using rumble film machine
Luminescent material dry film is dusted plate surface by automatic dust-binding machine, and plate by the baked plate of the photosensitive You Ji of rumble, cooling and is gone out
Plate makes on its copper face one layer of photosensitive oil of photosensitive material on rumble, is exposed after clapping the film in plate face using exposure machine, forms line
Road figure, uses Na2CO3Photosensitive material dissolution unexposed in plate face is left the part exposed and forms route, made by solution
With HCl and CuCl2The copper face that solution etching off does not have photosensitive material to protect forms route, reuses NaOH solution dissolution route
On the photosensitive material that has exposed, plate is moved into PE machine beer hole room, the use of PE hydraulic cutting presser is AOI and typesetting beer Guan Weikong；
Examine in ectonexine: electronic tester detects wiring board open circuit, and AOI optical detector detects wiring board plate face
Defect, using review machine to detecting that defect places under repair, broken line repairing instrument is repaired route quit a post and thus leave it vacant and is fallen into, room Wen Wendu: 22 ± 3
DEG C, relative humidity: 30-65%, it is finally that wiring board Fang Ru Baked Lu is baked dry；
Brownification process: wiring board is put into brown oxidation level production line successively by entering plate-oil removing-three-level washing-
Preimpregnation-palm fibre oxidation-three-level washing-hot DI washing-dry plate-ejecting plate completes operation, completes copper face processing to production plate,
Internal layer copper foil surface generates layer of oxide layer to promote engaging force of the multilayer circuit board in pressing between copper foil and epoxy resin；
Interior laminate: plate-laying: melanism plate, P piece are arranged as required, select P piece → cut P piece → row P piece → row's brownification
Plate → row's P piece, temperature: 19 ± 2 DEG C, relative humidity: 30~50%, dustiness: 1.0 μm of diameter or more of grit≤10K/ cubes
Foot；Lamination: overlapping line using LO3 Automatic dismounting-plate, the P piece that heap is folded be automatically separated, and covers upper copper foil, completes pressure
Preparation before plate is identical as plate-laying environment；Pressing plate: using vacuum hotpressing machine generate high temperature and pressure make epoxy resin complete by
For molecule cross-link semi-solid preparation state to the final conversion of reticular structure hardening state, bonding cycle is hot pressing 2 hours, is cold-pressed 1 hour；It tears open
Plate: disassembling out using LO3 system by the semi-finished product pressed, completes the separation of lamination semi-finished product and steel plate；Cutting plate: benefit respectively
Plate is torn open with lath cutter, milling target drone, CCD puncher, gong machine, edge polisher, word mark machine and calibrator completion, point dotted line, is cut greatly
Plate, milling copper sheet, punching, the forming of gong side, edging, typewriting mark and drafting board are thick, laminate sharp processing, preliminarily forming；
Drilling: wiring board is divided into doubling plate and multi-layer board, doubling plate: after nail-plate, production plate and aluminium flake being successively placed in
On board, using drilling machine complete drill, remove plate, move back nail and remove aluminium flake and bottom plate, while making marks in edges of boards, after inspection under
Process；Multi-layer board: putting fixture on board, playing pipe position nail, puts bottom plate on fixture, putting production plate on bottom plate, puts
Aluminium flake is put on plate, completes to drill using drilling machine, removes aluminium flake, lower plate makes marks in edges of boards, lower process, work after inspection
Temperature is 20 ± 5 DEG C, humidity Wei≤60%, in the circuit board holes drilled through or blind hole, to establish channel between layers；
Heavy copper and plate electricity: wiring board is placed in de-smear, heavy copper and the three-in-one automatic assembly line of plate electricity, completes heavy copper and plate
Electricity goes out a thin layer of high density and careful in the product of perforated plate inner hole deposition by chemical plating method after interior laminate, drilling
Layers of copper, the hole conductive copper of one layer of 0.2-0.6mil thickness is then obtained by electric plating of whole board method；
Outer-layer film drying: using Plate grinder pickling PCB surface, and in clean room, plate face copper foil surface by pasting automatically
Film machine sticks one layer of photosensitive material, makees master slice by exposure using the black film, the image on the black film is transferred to the yellow film, is exposed
The clappers post-exposure of yellow film aligning, the effect of exposure are that the image on the black film is transferred to the yellow film by exposing by ray machine
On, ammonium hydroxide developing machine is that the yellow film exposed is become clear, clearly demarcated pattern, overprotection by ammonium hydroxide developing machine
The effect of film is to stick a strata ethyl ester protective film on the medicine face of the yellow film to prevent from wiping flower, using developing machine, passes through
Na2CO3Expose copper face after unexposed material is dissolved and form route, prepares for the plating of lower process and turn pattern thereon
It moves on in plate face；
Graphic plating: being put into graphic plating production line for wiring board, removes plate face oxide layer and pollutant using detergent,
Sodium peroxydisulfate and sulfuric acid microetch plate face, activate plate face, enhance PT/PP between binding force, then after vitriol lixiviation copper facing and
It is tin plating, the pollutant generated in pre-treatment and copper cylinder is removed, in order to thicken in hole and route layers of copper, quality of coating is improved, to reach
The requirement of client only plays intermediate protective effect in order to which protection circuit is to facilitate erosion plate, carries out in hole and plated on circuit surface, with complete
At the requirement of plating copper thickness；
Full plate electricity gold: by wiring board by the complete golden automatic assembly line of plate electricity, one layer is plated on nickel coating and meets client
It is required that the layer gold of thickness；
Outer layer etching: graphic plating completes later wiring board, and after overetch, etching off logicalnot circuit layers of copper exposes route
The forming of last route is completed in part；
Wet green oil: the oxidation film of plate surface is removed and carries out roughening treatment to surface by volcanic ash Plate grinder, green to enhance
The binding force of oil and wiring board plate face, screen printer coat one layer of uniform green oil film, usual film thickness requirement in plate face by halftone
Are as follows: wiring board is placed in precuring in Di temperature Sui Dao oven and vertical Dan Men oven by 0.4~1.6mil, and and then exposure machine is logical
It crosses the yellow film and the irradiation of UV light and plate-punching machine Na is carried out to non-developing section2CO3Unexposed portion is rinsed by liquid medicine, most
Hot setting is carried out to the green oil of plate face by high temperature Sui Dao oven and Dan Men oven afterwards, to enhance its surface hardness, heat-resisting punching
Performance and chemical resistance are hit, stamps one layer of uniform photosensitive green oil film in the circuit board, to achieve the purpose that anti-welding, insulation；
Wrongly written or mispronounced character: white characters are printed by halftone in the circuit board using screen printer, it is baked that wiring board is then put into Sui Dao
Furnace stamps identifier with white thermo-cured ink assist side plate face relevant range using hot setting character, with facilitate plug-in unit and
Repair circuit wrongly written or mispronounced character silk-screen room；
Plate golden finger: by plating golden finger production line, wiring board successively passes through microetch, activation, nickel plating and gold-plated, in nickel table
The plating of layer gold is completed on face；
Spray tin process: wiring board passes through horizontal tin-spraying line, and wiring board is by the slicker solder of melting and by hot air leveling, clean
A thin layer of slicker solder is covered on net copper face, protection circuit plate copper face is not oxidized, the welding after enhancement line plate inserted component
Performance；
Turmeric process: wiring board by automatically sink nickel gold production line after, pass sequentially through acid deoiling, microetch, activation, without electricity
Lower plate is completed after solution nickel and electroless gold；
Sharp processing: by gong machine to wiring board sharp processing, V cheats machine and processes to the V-shaped groove of special customer requirement, hydraulic cutting presser
Wiring board is formed, hand gong machine and bevelling machine process the processing of wiring board periphery and goldfinger bevel, and lath cutter is cut
Wiring board, finally by the plate face dust and dirt of board-washing machine cleaning gong plate and beer plate.
The temperature of clean room is maintained at 20 ± 3 DEG C, and relative humidity is 55 ± 5%, dustiness be 0.5 μm or more grit≤
10K/ cubic feet, temperature is 20 ± 5 DEG C in the room of the machine beer hole PE, relative humidity: 40-60%.
The work step of heavy copper and plate electricity are as follows:
After overactivation, acceleration corresponding steps processing, Nonconductor surface is uniform-distribution with the palladium of catalytic activity on hole wall
Layer, under the catalysis and alkaline condition of palladium metal, formaldehyde can dissociate the hydrogen for aoxidizing and generating reproducibility, HCHO+OH-→HCOO+
H2；Then copper ion is reduced: Cu2++H2+2OH-→Cu+2H2O, the chemical layers of copper of precipitation make the base of self catalysis, make Cu2+
It is reduced into metallic copper on the basis of being catalyzed, completes desired chemical layers of copper in rapid succession.
Except oil temperature is 40 DEG C ± 5 DEG C, microetch temperature is 30 DEG C -45 DEG C, and copper facing temperature is 21 DEG C -32 DEG C, tin plating temperature
It is 25 DEG C ± 5 DEG C.
Handling device in the dry film of internal layer includes track 1, electronic slide 2, mounting base 3, atmospheric pressure pole 4, fixed plate 5, peace
Loading board 6, first sliding groove 7, fastener 8, slide plate 9, second sliding slot 10 and absorbent module 11 are equipped with electronic slide on the outside of track 1
2, electronic 2 side of slide is equipped with mounting base 3, and atmospheric pressure pole 4 is equipped at the top of mounting base 3, and 4 bottom end of atmospheric pressure pole passes through mounting base 3
Fixed plate 5 is installed, 5 bottom both ends of fixed plate are mounted on mounting plate 6, first sliding groove 7 are offered at the top of both ends mounting plate 6,
Several slide plates 9 are installed, fastener 8 passes through first sliding groove 7 for several 9 both ends of slide plate and both ends below both ends mounting plate 6
Mounting plate 6 connects, several 9 tops of slide plate offer second sliding slot 10, several absorption are equipped on the inside of second sliding slot 10
Component 11.
Fastener 8 includes screw bolt and nut, and bolt end head passes through first sliding groove 7 and nut is cooperatively connected, convenient for by tight
Firmware 8 guarantees that first sliding groove 7 is adjusted and fixed in slide plate 9.
Absorbent module 11 includes support rod, sucker and nut, and the outer upper side of support rod offers screw thread, on the outside of support rod under
Side is equipped with baffle, and support rod bottom end is equipped with sucker, and supporting bar top offers connecting hole, and it is sliding that support bar top passes through second
Slot 10 and nut are cooperatively connected, and adjust spacing and increase and decrease absorption group convenient for guaranteeing that absorbent module 11 is mobile in second sliding slot 10
11 numbers of part.
Track 1 is mounted on the top of pcb board automatic production line, convenient for being used cooperatively with production line.
The use operating procedure of the device are as follows:
Step 1: track 1 and pcb board automatic production line are coupled, by unscrewing absorption in actual production process
Then the nut of component 11 installs several absorbent modules 11 according to wiring board in the second sliding slot 10 in slide plate 9, tightens spiral shell
Mother completes to fix, and unscrews the nut of fastener 8, spacing and number of the adjusting slider 9 in mounting plate 6；
Step 2: it is extended by atmospheric pressure pole 4 and the adsorption structure of bottom is driven to contact with wiring board, by sucker in pulsometer
Under the action of wiring board is subjected to absorption fixation, then atmospheric pressure pole 4 is shunk, and completes position by the way that electronic slide 2 is mobile on track 1
Variation is set, the elongation of atmospheric pressure pole 4 is equally operated after position is mobile and puts down wiring board completion carrying.
Compared with original technology, beneficial effects of the present invention:
1, the pcb board automatic production line can raise labour productivity, and stabilize and increase product quality, improve labour item
Part, reduction production occupied area, reduces production cost, shortens the production cycle, guarantee production smoothing, there is significant economic effect
Benefit, the process that automatic production line was operated or controlled automatically by regulated procedure or instruction in the case where unmanned intervene,
Its target is " steady, quasi-, fast ", use automatic assembly line not only can people from heavy manual labor, part mental labour with
And freed in severe, dangerous working environment, and the organ dysfunction of people can be extended, labor productivity is greatlyd improve,
Guarantee the superior in quality of the pcb board produced simultaneously；
2, handling device used in pcb board automatic production line assembles the entire production line completion simultaneously, passes through
The carrying in pcb board production process is rapidly completed in handling device；
3, in the actual production process by unscrewing the nut of absorbent module 11, the then second sliding slot 10 in slide plate 9
It is interior that several absorbent modules 11 are installed according to wiring board, it tightens nut and completes to fix, unscrew the nut of fastener 8, adjusting slider 9
It is then complete by sucker suction pcb board convenient for completing to adjust according to the pcb board actually carried in the spacing and number of mounting plate 6
At carrying, guarantee the high efficiency and energy saving carried.
Present invention disclosed above preferred embodiment is only intended to help to illustrate the present invention.There is no detailed for preferred embodiment
All details are described, are not limited the invention to the specific embodiments described.Obviously, according to the content of this specification,
It can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to better explain the present invention
Principle and practical application, so that skilled artisan be enable to better understand and utilize the present invention.The present invention is only
It is limited by claims and its full scope and equivalent.
Claims (9)
1. a kind of pcb board automatic production method, which is characterized in that including the dry film of sawing sheet-internal layer-brownification process-internal layer
The heavy copper of pressing plate-and plate electricity-outer-layer film drying-plating electricity gold-wet green oil-plating golden finger-spray tin turmeric processing step, tool
Steps are as follows for body:
Sawing sheet: aniseed is split into fines according to specification cutting using automatic cutting machine, passes through angle rounding machine rounding plate angle dirt end, benefit
After being air-dried with board-washing machine to plate washing, plate is put in oven and is heated, typewriting mark is marked after the cooling taking-up plate of plate
Note；
The dry film of internal layer: being put into chemical cleaning machine for plate by handling device, successively passes through washing, microetch, high-pressure washing, follows
Cleaning is completed in ring washing, water suction, high wind drying and the secondary drying of hot wind, plate is moved into clean room, rumble film machine is in copper sheet
After sticking one layer of photosensitive material dry film on surface, plate surface is dusted by automatic dust-binding machine, plate is passed through into rumble sense
The baked plate of Wan Cheng, cooling and ejecting plate after gloss oil machine expose after clapping the film toward plate face by exposure machine, form line pattern, successively pass through
Cross Na2CO3Solution, HCl and CuCl2The photosensitive material exposed on solution and NaOH solution dissolution route, it is complete to line pattern
At determination；
Brownification process: by wiring board by be put into handling device be transported in brown oxidation level production line complete to PCB surface
Carry out copper face processing；
Interior laminate: plate-laying: by melanism plate, P piece according to P piece, cut P piece, row P piece, row brownification plate complete arrangement, wherein temperature protect
It holds at 19 ± 2 DEG C, relative humidity: 30-50%, dustiness: grit≤10K/ cubic feet of 1.0 μm of diameter or more；Lamination: benefit
Line is overlapped with Automatic dismounting-plate, the P piece that heap is folded is automatically separated, and covers upper copper foil；Pressing plate: it is produced using vacuum hotpressing machine
Raw high temperature and pressure makes epoxy resin complete the final conversion by molecule cross-link semi-solid preparation state to reticular structure hardening state, wherein pressing
Period is hot pressing 2 hours, is cold-pressed 1 hour；Tear plate open: the semi-finished product pressed disassembled out, to lamination semi-finished product and steel plate into
Row separation；Cutting plate: using cutting, cutter device completes outer ledge modification and drafting board is thick；
Heavy copper and plate electricity: after carrying out drilling processing to wiring board, it is three-in-one automatic that wiring board is placed in de-smear, heavy copper and plate electricity
Production line goes out layers of copper in the product of perforated plate inner hole deposition, then passes through full plate by chemical plating method after interior laminate, drilling
Electro-plating method completes the hole conductive copper of wiring board, and conductive copper is with a thickness of 0.2-0.6mil；
Outer-layer film drying: using Plate grinder pickling PCB surface, and in clean room, automatic film applicator is pasted in plate face copper foil surface
Upper one layer of photosensitive material makees master slice by exposure using the black film, the image on the black film is transferred to the yellow film, exposure machine will
Yellow film aligning clappers post-exposure passes through Na using developing machine2CO3Solution exposes copper face shape after dissolving unexposed material
At route；
Plating electricity gold: being put into graphic plating production line for wiring board, removes plate face oxide layer and pollutant, over cure using detergent
After sour sodium and sulfuric acid microetch plate face, by wiring board by the complete golden automatic assembly line of plate electricity, one layer of layer gold is plated on nickel coating；
Wet green oil: the oxidation film of plate surface is removed and carries out roughening treatment to surface by volcanic ash Plate grinder, and screen printer passes through net
Version coats one layer of uniform green oil film in plate face, film thickness requirement are as follows: 0.4-1.6mil, by wiring board be placed in Di temperature Sui Dao oven with
Precuring is completed in vertical single oven, and then exposure machine passes through the yellow film to the progress UV light irradiation of non-developing section and punching
Trigger Na2CO3Unexposed portion is rinsed by liquid medicine, finally by high temperature Sui Dao oven and Dan Men oven to the green of plate face
Oil carries out hot setting；
Plate golden finger: by plating golden finger production line, wiring board successively passes through microetch, activation, nickel plating and gold-plated, on nickel surface
Complete the plating of layer gold；
Spray tin turmeric: wiring board is carried to horizontal tin-spraying line by handling device, by the slicker solder of melting and by hot air leveling,
Complete slicker solder covering on clean copper face, wiring board passes sequentially through acid deoiling, micro- by being sunk after nickel gold production line automatically
Lower plate is completed after erosion, activation, electroless nickel and electroless gold.
2. a kind of pcb board automatic production method according to claim 1, which is characterized in that the temperature of the clean room
20 ± 3 DEG C are maintained at, relative humidity is 55 ± 5%, and dustiness is 0.5 μm or more grit≤10K/ cubic feet, the PE machine
Temperature is 20 ± 5 DEG C in the room of beer hole, relative humidity: 40-60%.
3. a kind of pcb board automatic production method according to claim 1, which is characterized in that the heavy copper and plate electricity
Work step are as follows:
After overactivation, acceleration corresponding steps processing, Nonconductor surface is uniform-distribution with the palladium layers of catalytic activity on hole wall,
Under the catalysis and alkaline condition of palladium metal, formaldehyde can dissociate the hydrogen for aoxidizing and generating reproducibility, HCHO+OH-→HCOO+H2；Then
Copper ion is reduced: Cu2++H2+2OH-→Cu+2H2O, the chemical layers of copper of precipitation make the base of self catalysis, make Cu2+It is urging
It is reduced into metallic copper on the basis of change, completes desired chemical layers of copper in rapid succession.
4. a kind of pcb board automatic production method according to claim 1, which is characterized in that described except oil temperature is 40
DEG C ± 5 DEG C, the microetch temperature is 30 DEG C -45 DEG C, and the copper facing temperature is 21 DEG C -32 DEG C, and the tin plating temperature is 25 DEG C ± 5
℃。
5. a kind of pcb board automatic production method according to claim 1, which is characterized in that in the dry film of internal layer
Handling device include track (1), electronic slide (2), mounting base (3), atmospheric pressure pole (4), fixed plate (5), mounting plate (6),
One sliding slot (7), fastener (8), slide plate (9), second sliding slot (10) and absorbent module (11), track (1) outside are equipped with
Electronic slide (2), electronic slide (2) side are equipped with mounting base (3), are equipped with atmospheric pressure pole at the top of the mounting base (3)
(4), atmospheric pressure pole (4) bottom end passes through mounting base (3) and is equipped with fixed plate (5), and fixed plate (5) the bottom both ends are respectively mounted
Have mounting plate (6), offered first sliding groove (7) at the top of mounting plate (6) described in both ends, below mounting plate (6) described in the both ends
Several slide plates (9) are installed, the fastener (8) passes through first sliding groove (7) and installs several slide plate (9) both ends and both ends
Plate (6) connection, several described slide plates (9) tops offer second sliding slot (10), installation on the inside of the second sliding slot (10)
There are several absorbent modules (11).
6. a kind of pcb board automatic production method according to claim 5, which is characterized in that the fastener (8) includes
Screw bolt and nut, the bolt end head passes through first sliding groove (7) and nut is cooperatively connected.
7. a kind of pcb board automatic production method according to claim 5, which is characterized in that the absorbent module (11)
Including support rod, sucker and nut, the outer upper side of the support rod offers screw thread, and the outer side-lower of the support rod is equipped with gear
Plate, the support rod bottom end are equipped with sucker, and the supporting bar top offers connecting hole, and the support bar top passes through second
Sliding slot (10) and nut are cooperatively connected.
8. a kind of pcb board automatic production method according to claim 5, which is characterized in that the track (1) is mounted on
The top of pcb board automatic production line.
9. a kind of pcb board automatic production method according to claim 5, which is characterized in that the use of the device operates
Step are as follows:
Step 1: track (1) is coupled with pcb board automatic production line, by unscrewing absorption group in actual production process
The nut of part (11) then installs several absorbent modules (11) according to wiring board in the second sliding slot (10) in slide plate (9),
It tightens nut to complete to fix, unscrews the nut of fastener (8), spacing and number of the adjusting slider (9) in mounting plate (6)；
Step 2: it is extended by atmospheric pressure pole (4) and the adsorption structure of bottom is driven to contact with wiring board, by sucker in pulsometer
Wiring board is subjected to absorption fixation under effect, then atmospheric pressure pole (4) is shunk, and has been moved on track (1) by electronic slide (2)
At change in location, atmospheric pressure pole (4) elongation is equally operated after position is mobile and puts down wiring board completion carrying.
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| CN201910087436.1A CN109587959A (en) | 2019-01-29 | 2019-01-29 | A kind of pcb board automatic production method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910087436.1A CN109587959A (en) | 2019-01-29 | 2019-01-29 | A kind of pcb board automatic production method |
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ID=65918129
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| CN201910087436.1A Pending CN109587959A (en) | 2019-01-29 | 2019-01-29 | A kind of pcb board automatic production method |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110139493A (en) * | 2019-04-29 | 2019-08-16 | 深圳市科路迪机械设备有限公司 | Pcb board cleans line |
| CN110225662A (en) * | 2019-06-11 | 2019-09-10 | 宁波市镇海锂安电子有限公司 | A kind of lithium battery protection board production process and device |
| CN110923797A (en) * | 2019-11-08 | 2020-03-27 | 东莞市国瓷新材料科技有限公司 | Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning |
| CN112261785A (en) * | 2020-10-19 | 2021-01-22 | 陈圆圆 | Integrated circuit board processing device |
| CN112867290A (en) * | 2021-01-06 | 2021-05-28 | 湖北共铭电路有限公司 | Reinforced PCB and processing technology thereof |
| CN113369722A (en) * | 2021-04-30 | 2021-09-10 | 武汉华工激光工程有限责任公司 | Clap clamp plate structure, feeding mechanism and IC support plate processing equipment |
| CN113543625A (en) * | 2021-07-14 | 2021-10-22 | 华天科技(南京)有限公司 | Production line body structure of patch product and production method thereof |
| CN114012284A (en) * | 2021-12-07 | 2022-02-08 | 南京国阳电子有限公司 | Laser drilling method for multilayer circuit board |
| CN114245582A (en) * | 2021-12-16 | 2022-03-25 | 深圳市昶东鑫线路板有限公司 | Flexible circuit board processing intelligent manufacturing equipment |
| CN114226997A (en) * | 2021-12-10 | 2022-03-25 | 深圳市豪鹏达科技有限公司 | Flexible film sheet cutting equipment and cutting method |
| CN114340210A (en) * | 2022-03-17 | 2022-04-12 | 四川英创力电子科技股份有限公司 | Manufacturing equipment and manufacturing method of printed circuit board with embedded gold leads |
| CN114348337A (en) * | 2022-01-11 | 2022-04-15 | 珠海中京电子电路有限公司 | Production method, device and application for solving exposure connection line of pretreatment film pasting |
| CN114472248A (en) * | 2022-01-21 | 2022-05-13 | 泰州科聚新材料技术研究院有限公司 | Washing device for waste liquid of photosensitive material plate |
| CN116984898A (en) * | 2023-07-19 | 2023-11-03 | 广东合正科技有限公司 | Full-automatic production system for processing circuit board backing plate |
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| CN110225662B (en) * | 2019-06-11 | 2022-04-01 | 宁波市镇海锂安电子有限公司 | Production process and device for lithium battery protection board |
| CN110225662A (en) * | 2019-06-11 | 2019-09-10 | 宁波市镇海锂安电子有限公司 | A kind of lithium battery protection board production process and device |
| CN110923797A (en) * | 2019-11-08 | 2020-03-27 | 东莞市国瓷新材料科技有限公司 | Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning |
| CN112261785A (en) * | 2020-10-19 | 2021-01-22 | 陈圆圆 | Integrated circuit board processing device |
| CN112261785B (en) * | 2020-10-19 | 2021-12-17 | 嘉兴桀华电子科技有限公司 | Integrated circuit board processing device |
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| CN113369722A (en) * | 2021-04-30 | 2021-09-10 | 武汉华工激光工程有限责任公司 | Clap clamp plate structure, feeding mechanism and IC support plate processing equipment |
| CN113369722B (en) * | 2021-04-30 | 2023-03-10 | 武汉华工激光工程有限责任公司 | Clap clamp plate structure, feeding mechanism and IC support plate processing equipment |
| CN113543625A (en) * | 2021-07-14 | 2021-10-22 | 华天科技(南京)有限公司 | Production line body structure of patch product and production method thereof |
| CN114012284A (en) * | 2021-12-07 | 2022-02-08 | 南京国阳电子有限公司 | Laser drilling method for multilayer circuit board |
| CN114226997A (en) * | 2021-12-10 | 2022-03-25 | 深圳市豪鹏达科技有限公司 | Flexible film sheet cutting equipment and cutting method |
| CN114226997B (en) * | 2021-12-10 | 2024-01-30 | 深圳市豪鹏达科技有限公司 | Flexible film sheet cutting equipment |
| CN114245582A (en) * | 2021-12-16 | 2022-03-25 | 深圳市昶东鑫线路板有限公司 | Flexible circuit board processing intelligent manufacturing equipment |
| CN114348337A (en) * | 2022-01-11 | 2022-04-15 | 珠海中京电子电路有限公司 | Production method, device and application for solving exposure connection line of pretreatment film pasting |
| CN114472248A (en) * | 2022-01-21 | 2022-05-13 | 泰州科聚新材料技术研究院有限公司 | Washing device for waste liquid of photosensitive material plate |
| CN114472248B (en) * | 2022-01-21 | 2022-12-16 | 泰州科聚新材料技术研究院有限公司 | Washing device for waste liquid of photosensitive material plate |
| CN114340210A (en) * | 2022-03-17 | 2022-04-12 | 四川英创力电子科技股份有限公司 | Manufacturing equipment and manufacturing method of printed circuit board with embedded gold leads |
| CN116984898A (en) * | 2023-07-19 | 2023-11-03 | 广东合正科技有限公司 | Full-automatic production system for processing circuit board backing plate |
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Application publication date: 20190405 |
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