CN113543496A - Rubberizing equipment - Google Patents

Rubberizing equipment Download PDF

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Publication number
CN113543496A
CN113543496A CN202111083508.9A CN202111083508A CN113543496A CN 113543496 A CN113543496 A CN 113543496A CN 202111083508 A CN202111083508 A CN 202111083508A CN 113543496 A CN113543496 A CN 113543496A
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CN
China
Prior art keywords
circuit board
station
bottom plate
adhesive tape
rubberizing
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Granted
Application number
CN202111083508.9A
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Chinese (zh)
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CN113543496B (en
Inventor
张箭宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Teridge Technology Co ltd
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Shenzhen Teridge Technology Co ltd
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Priority to CN202111083508.9A priority Critical patent/CN113543496B/en
Publication of CN113543496A publication Critical patent/CN113543496A/en
Application granted granted Critical
Publication of CN113543496B publication Critical patent/CN113543496B/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a rubberizing device which comprises a rack, a material picking device and a rubberizing device, wherein a workbench is arranged on the rack, and a bottom plate storage station, a circuit board storage station and a rubberizing station are formed on the workbench; the material picking device is arranged on the workbench to sequentially pick the bottom plate and the circuit board from the bottom plate material storing station and the circuit board material storing station and to be stacked on the rubberizing station; the adhesive tape sticking device is arranged on the workbench to stick an adhesive tape on the bottom plate and the circuit board in the adhesive tape sticking station and cut the adhesive tape. The technical scheme of this application can reduce the rubberizing in-process foreign matter and be infected with the risk, reduces intensity of labour, improves production efficiency.

Description

Rubberizing equipment
Technical Field
The invention relates to the technical field of patches, in particular to a rubberizing device.
Background
Before the surface mounting of the printed circuit board, the printed circuit board needs to be placed on a jig base plate, and then a high-temperature adhesive tape is attached to fix the printed circuit board and protect golden fingers on the printed circuit board. However, at present, the process is finished manually outside the production line, and the gold fingers are carried, assembled and glued manually, so that the problem of oxidation of the gold fingers caused by contamination of foreign matters or hand sweat is easily caused, the labor intensity is high, and the production efficiency is low.
Disclosure of Invention
The invention mainly aims to provide a rubberizing device, aiming at reducing the risk of contamination of foreign matters in the rubberizing process, reducing the labor intensity and improving the production efficiency.
In order to achieve the above object, the present invention provides a pasting device, comprising:
the automatic gluing machine comprises a machine frame, wherein a workbench is arranged on the machine frame, and a bottom plate storage station, a circuit board storage station and a gluing station are formed on the workbench;
the material picking device is arranged on the workbench, so that the bottom plate and the circuit board are picked from the bottom plate storage station and the circuit board storage station in sequence and are stacked on the rubberizing station; and
and the adhesive tape sticking device is arranged on the workbench so as to stick the adhesive tape on the bottom plate and the circuit board in the adhesive tape sticking station and cut the adhesive tape.
Optionally, the rubberizing device comprises:
the adhesive tape slitting component is arranged on the workbench and used for placing adhesive tape rolls and slitting the adhesive tapes; and
the adhesive tape pasting assembly is arranged on the workbench and used for picking up the adhesive tape in the adhesive tape slitting assembly and pasting the adhesive tape on the bottom plate and the circuit board in the adhesive tape pasting station.
Optionally, the tape slitting assembly comprises:
the adhesive tape rack is arranged on the workbench and used for placing adhesive tape rolls;
the clamping mechanism is arranged on the workbench and used for clamping the free end of the adhesive tape roll;
the driving piece is in transmission connection with the adhesive tape rack and/or the clamping mechanism so as to drive the clamping mechanism and the adhesive tape rack to approach or separate from each other; and
the adhesive tape shearing mechanism is arranged on the workbench so as to cut off the adhesive tape between the adhesive tape rack and the clamping mechanism.
Optionally, the tape applicator assembly comprises:
a first suction attachment;
the first lifting mechanism is in transmission connection with the first suction accessory, and the first suction accessory is driven by the first lifting mechanism to lift so as to suck or paste the adhesive tape; and
the first translation mechanism is in transmission connection with the first lifting mechanism, and the first lifting mechanism is driven by the first translation mechanism to move back and forth between the rubberizing station and the adhesive tape slitting component.
Optionally, the work table comprises:
the workbench body is provided with the bottom plate material storage station and the circuit board material storage station; and
the conveying device is arranged on the workbench body and provided with a conveying rail, the rubberizing station is formed on the conveying rail, the material picking device sequentially picks up the bottom plate and the circuit boards and is placed on the conveying rail in a stacked mode, and the stacked bottom plate and the stacked circuit boards can enter and exit the rubberizing station along the conveying rail.
Optionally, the gluing device further comprises a first blocking device located at an outlet end of the gluing station to block the bottom plate and the circuit board from advancing or to allow the bottom plate and the circuit board to pass;
and/or the rubberizing equipment further comprises a second blocking device positioned at the inlet end of the rubberizing station so as to block the bottom plate and the circuit board from advancing or to allow the bottom plate and the circuit board to pass;
and/or the bottom plate material storage station and the circuit board material storage station are respectively positioned on two sides of the conveying track, and the moving direction of the material picking device is consistent with the arrangement direction of the bottom plate material storage station and the circuit board material storage station and is perpendicular to the conveying direction of the conveying track so as to sequentially pick up the bottom plate and the circuit boards and stack the bottom plate and the circuit boards in the conveying track.
Optionally, the material picking device comprises a first picking assembly and a second picking assembly, the first picking assembly is used for picking the bottom plate in the bottom plate storage station and placing the bottom plate in the gluing station, and the second picking assembly is used for picking the circuit board in the circuit board storage station and placing the circuit board above the bottom plate in the gluing station.
Optionally, the first picking assembly comprises a second adsorption part, a second lifting mechanism and a second translation mechanism, the second lifting mechanism is in transmission connection with the second adsorption part, the second adsorption part is driven by the second lifting mechanism to lift so as to suck or place a bottom plate, the second translation mechanism is in transmission connection with the second lifting mechanism, and the second lifting mechanism is driven by the second translation mechanism to reciprocate between the gluing station and the bottom plate storage station;
and/or, the second picking assembly comprises a third adsorption piece, a third lifting mechanism and a third translation mechanism, the third lifting mechanism is in transmission connection with the third adsorption piece, the third adsorption piece is driven by the third lifting mechanism to lift so as to absorb or place the circuit board, the third translation mechanism is in transmission connection with the third lifting mechanism, and the third translation mechanism is driven by the third translation mechanism to move back and forth between the rubberizing station and the circuit board storage station.
Optionally, the rubberizing apparatus further includes a bottom plate carrying device, the bottom plate carrying device includes a bottom plate carrying platform and a fourth lifting mechanism, the bottom plate carrying platform is disposed at the bottom plate storage station, and the fourth lifting mechanism is in transmission connection with the bottom plate carrying platform to drive the bottom plate carrying platform to lift;
and/or, rubberizing equipment still includes circuit board and bears the device, circuit board bears the device and includes circuit board load-bearing platform and fifth elevating system, circuit board load-bearing platform locates circuit board storage station, fifth elevating system with circuit board load-bearing platform transmission is connected in order to order about circuit board load-bearing platform goes up and down.
Optionally, the rubberizing equipment further comprises an ion fan, and the ion fan is arranged on the workbench and faces the rubberizing station.
According to the rubberizing equipment, a bottom plate storage station for placing a bottom plate and a circuit board storage station for placing a circuit board are arranged on a workbench of a rack, a material picking device is arranged to sequentially take out the bottom plate and the circuit board from the bottom plate storage station and the circuit board storage station and stack the bottom plate and the circuit board in the rubberizing station, and a rubberizing device intercepts adhesive tapes with required lengths and sticks the adhesive tapes to the stacked circuit board and bottom plate to complete one-time assembling and rubberizing process. According to the technical scheme, manual intervention is not needed in the whole assembling and rubberizing process, the risk of contamination of foreign matters in the rubberizing process is reduced, the labor intensity is reduced, and the production efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a block diagram of an embodiment of the taping device of the present invention;
FIG. 2 is a block diagram of the taping device of FIG. 1 from another perspective;
fig. 3 is a partially enlarged view of fig. 2.
The reference numbers illustrate:
reference numerals Name (R) Reference numerals Name (R)
100 Rubberizing equipment 30 Rubberizing device
10 Rack 31 Adhesive tape slitting assembly
11 Working table 32 Adhesive tape sticking assembly
111 Workbench body 40 First blocking device
112 Conveying device 41 Roller wheel
1121 Conveying guide rail 50 Second blocking device
1122 Driving mechanism 60 Bottom plate bearing device
20 Material picking device 61 Bottom plate bearing platform
21 First pickingAssembly 62 Fourth lifting mechanism
211 Second adsorption piece 70 Circuit board bearing device
212 Second lifting mechanism 71 Circuit board bearing platform
213 Second translation mechanism 72 Fifth lifting mechanism
22 Second picking assembly 80 Ion fan
221 Third adsorption piece 200 Base plate
222 Third lifting mechanism 300 Circuit board
223 Third translation mechanism
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The present invention provides a tape application apparatus 100.
Referring to fig. 1, in some embodiments of the pasting device 100 of the present invention, the pasting device 100 includes:
the automatic gluing machine comprises a machine frame 10, wherein a workbench 11 is arranged on the machine frame 10, and a bottom plate storage station, a circuit board storage station and a gluing station are formed on the workbench 11;
the material picking device 20 is arranged on the workbench 11, so that the base plate 200 and the circuit boards 300 are picked from the base plate storage station and the circuit board storage station in sequence and are stacked on the gluing station; and
and the adhesive tape sticking device 30 is arranged on the workbench 11, so that an adhesive tape is stuck on the bottom plate 200 and the circuit board 300 in the adhesive tape sticking station and is cut.
Specifically, the adhesive tape attaching device 100 of the present application is applied to a preparation process before attaching the printed circuit board 300, before the circuit board 300 is subjected to the attaching process, the circuit board 300 needs to be placed on the jig base plate 200, and then a high temperature adhesive tape is attached to protect the gold finger (i.e., the pad for soldering on the circuit board 300) on the printed circuit board 300, so as to fix the printed circuit board 300 on the jig base plate 200. The rubberizing device 100 comprises a machine frame 10 serving as an installation foundation, the machine frame 10 is provided with a workbench 11, and a bottom plate storage station and a circuit board storage station are arranged on the workbench 11, wherein the bottom plate storage station is used for storing the bottom plates 200, a plurality of bottom plates 200 can be stacked on the bottom plate storage station, or the bottom plates 200 can be arranged side by side; similarly, the circuit board storage station is used for storing the circuit boards 300, and may be a plurality of circuit boards 300 stacked on the bottom board storage station, or a plurality of circuit boards 300 placed side by side, and preferably, the bottom board 200 and the circuit boards 300 are stacked and stored respectively, so as to reduce the occupied space and the volume of the equipment. Meanwhile, a material picking device 20 is arranged in the rubberizing device 100, the material picking device 20 may be a clamping device, a suction cup device or a lifting device, so as to sequentially transfer the bottom plate 200 in the bottom plate storage station and the circuit board 300 in the circuit board storage station to the rubberizing station on the workbench 11, and place the circuit board 300 on the bottom plate 200, at this time, the rubberizing device 30 sticks a high-temperature adhesive tape to the circuit board 300 and the bottom plate 200, the high-temperature adhesive tape can protect golden fingers on the circuit board 300, and the circuit board 300 can be fixed on the bottom plate 200. When the tape sticking device 30 sticks the bottom plate 200 and the circuit board 300, the tape may be attached to the bottom plate 200 and the circuit board 300 and then cut off, or the cut tape may be attached to the bottom plate 200 and the circuit board 300 after being cut to a desired length; and the cutting structure for cutting the adhesive tape and the attaching structure for pressing the adhesive tape to the base plate 200 and the circuit board 300 may be provided on the same structure or may be provided separately, which is not limited herein.
Therefore, it can be understood that, in the gluing device 100 of the present invention, a board storage station for placing the bottom board 200 and a circuit board storage station for placing the circuit boards 300 are disposed on the working table 11 of the machine frame 10, and the material picking device 20 is disposed to sequentially take out the bottom board 200 and the circuit boards 300 from the board storage station and the circuit board storage station to be stacked and placed in the gluing station, and the gluing device 30 cuts the adhesive tape of a required length and adheres the adhesive tape to the stacked circuit boards 300 and the bottom board 200, thereby completing a single assembly and gluing process. According to the technical scheme, manual intervention is not needed in the whole assembling and rubberizing process, the risk of contamination of foreign matters in the rubberizing process is reduced, the labor intensity is reduced, and the production efficiency is improved.
Referring to fig. 2, in some embodiments of the adhesive applying apparatus 100 of the present invention, the adhesive applying device 30 includes:
the adhesive tape slitting component 31 is arranged on the workbench 11 and used for placing adhesive tape rolls and slitting adhesive tapes; and
and the tape pasting assembly 32 is arranged on the workbench 11, and is used for picking up the tape in the tape slitting assembly 31 and pasting the tape on the bottom plate 200 and the circuit board 300 in the gluing station.
In the solution of the foregoing embodiment, in the tape pasting apparatus 100, the tape is cut by the tape pasting device 30 and is adhered to the base plate 200 and the circuit board 300. In this embodiment, the tape pasting device 30 includes a tape slitting component 31 and a tape pasting component 32, where the tape slitting component 31 is used for placing a tape roll and slitting a tape with a desired length, the tape pasting component 32 is used for taking out the tape in the tape slitting component 31 to paste on the bottom plate 200 and the circuit board 300 in the pasting station, and the tape in the tape slitting component 31 may be cut off by the tape slitting component 31 after the tape in the tape slitting component 31 is torn out by the tape pasting component 32; it is also possible to make the tape slitting assembly 31 cut the tape by a desired length and then take out the tape cut by the tape applying assembly 32 and apply it to the base plate 200 and the circuit board 300.
In some embodiments of the taping device 100 of the present invention, the tape slitting assembly 31 comprises:
the adhesive tape rack is arranged on the workbench 11 and used for placing adhesive tape rolls;
the clamping mechanism is arranged on the workbench 11 and used for clamping the free end of the adhesive tape roll;
the driving piece is in transmission connection with the adhesive tape rack and/or the clamping mechanism so as to drive the clamping mechanism and the adhesive tape rack to approach or separate from each other; and
the adhesive tape shearing mechanism is arranged on the workbench 11 so as to cut off the adhesive tape between the adhesive tape rack and the clamping mechanism.
In the solution of the foregoing embodiment, the tape pasting device 30 includes a tape slitting assembly 31 and a tape pasting assembly 32 to slit and paste the tape onto the bottom board 200 and the circuit board 300. In this embodiment, the tape cutting assembly 31 includes a tape holder, which is disposed on the worktable 11 and is used for placing a tape roll, and the tape roll is usually sleeved on the tape roll and can rotate on the tape holder; the clamping mechanism of the tape slitting assembly 31 is disposed on the worktable 11, and at least one of the clamping mechanism and the tape holder is slidably disposed so that the tape holder and the clamping mechanism can approach and separate from each other, wherein the clamping mechanism clamps a free end of a tape roll in the tape holder when approaching the tape holder, and then the tape holder and the clamping mechanism separate from each other to tear the tape by a required length, at this time, the tape pasting assembly 32 adsorbs the tape between the tape holder and the clamping mechanism, and the tape shearing mechanism shears the tape between the tape holder and the clamping mechanism, so that the tape pasting assembly 32 can move the cut tape to a tape pasting station to paste the bottom plate 200 and the circuit board 300. Further, the tape slitting assembly 31 is provided with a driving element, and the driving element is in transmission connection with at least one of the clamping mechanism and the tape dispenser to drive the clamping mechanism and the tape dispenser to approach and separate from each other, so that the automation degree of the tape pasting device 100 is improved, and the labor intensity is reduced. Meanwhile, in the embodiment, the tape cutting mechanism cuts the tape after the tape is torn out and the tape adhering component 32 sucks the tape, so that the tape can be prevented from being wound by itself without stress after the tape is cut first and is not convenient for the tape adhering component 32 to pick up the tape.
In some embodiments, the tape cutting mechanism includes a blade and a driving member, the driving member is in driving connection with the blade to drive the blade into and out of between the clamping mechanism and the tape holder, so as to cut the tape after the tape is torn out and the tape is sucked by the tape adhering assembly 32; of course, the tape cutting mechanism may be similar to a scissors cutting mechanism, and is not limited herein.
Referring to fig. 1, in some embodiments of the taping apparatus 100 of the present invention, the tape application assembly 32 includes:
a first suction attachment;
the first lifting mechanism is in transmission connection with the first suction accessory, and the first suction accessory is driven by the first lifting mechanism to lift so as to suck or paste the adhesive tape; and
and the first translation mechanism is in transmission connection with the first lifting mechanism, and the first lifting mechanism is driven by the first translation mechanism to move back and forth between the rubberizing station and the adhesive tape slitting component 31.
In the solution of the foregoing embodiment, the tape pasting device 30 includes a tape slitting assembly 31 and a tape pasting assembly 32 to slit and paste the tape onto the bottom board 200 and the circuit board 300. In this embodiment, the tape adhering assembly 32 includes a first suction component, a first lifting mechanism and a first translation mechanism, wherein the first suction component is connected to the first lifting mechanism in a transmission manner, the first lifting mechanism is connected to the first translation mechanism in a transmission manner, the first translation mechanism drives the first lifting mechanism and the first suction component to move back and forth in the tape pasting station and the tape slitting assembly 31, so as to repeatedly pick up the tape in the tape slitting assembly 31 and adhere to the bottom plate 200 and the circuit board 300 in the tape pasting station, and the first lifting mechanism drives the first suction component to move up and down in the positions of the tape slitting assembly 31 and the tape pasting station respectively, so as to suck the tape in the tape slitting assembly 31 and press and adhere the tape to the bottom plate 200 and the circuit board 300 in the tape pasting station. Usually, first inhale annex for the sucking disc, and can set up two or more than two sucking discs according to actual demand and be used for adsorbing the sticky tape, improve the stability that the sticky tape shifted.
Further, in some embodiments, the first translating mechanism includes a first rail extending along a first direction and a second rail extending along a second direction, the first direction and the second direction are respectively consistent with the extending direction of the two side edges perpendicular to the bottom plate 200, the first lifting mechanism is slidably disposed on the first rail to slide along the first direction, and the first rail is slidably disposed on the second rail to enable the first rail and the second rail to slide along the second direction, so that the degree of freedom of the first suction device is improved, and the first suction device sequentially moves to the four side edges of the bottom plate 200 to adhere the adhesive tape.
Referring to fig. 2, in some embodiments of the adhesive applying apparatus 100 of the present invention, the working table 11 includes:
the workbench body 111 is provided with the bottom plate material storage station and the circuit board material storage station; and
the conveying device 112 is arranged on the workbench body 111, the conveying device 112 is provided with a conveying rail, the rubberizing station is formed on the conveying rail, and the material picking device 20 sequentially picks the bottom plate 200 and the circuit boards 300 and is stacked on the conveying rail, so that the stacked bottom plate 200 and the circuit boards 300 enter and exit the rubberizing station along the conveying rail.
In the technical solution of the foregoing embodiment, in the gluing device 100, the base plate 200 in the base plate storage station and the circuit board 300 in the circuit board storage station are sequentially stacked and placed in the gluing station by the material pickup device 20. In this embodiment, the rubberizing apparatus 100 further includes a conveying device 112, the conveying device 112 is disposed on the workbench body 111 and is provided with a conveying track for conveying the product, and the conveying track is formed with the rubberizing station. At this time, the picking device 20 sequentially stacks the bottom plate 200 in the bottom plate storage station and the circuit board 300 in the circuit board storage station in the conveying track, the conveying device 112 conveys the bottom plate 200 and the circuit board 300 to the rubberizing station, and after the rubberizing is completed, the bottom plate 200 and the circuit board 300 are conveyed from the rubberizing station to the next process, so that automatic blanking of the rubberizing equipment 100 is realized. In this embodiment, the arrangement of the conveying device 112 may facilitate the arrangement of each device in the tape adhering apparatus 100, and the material picking device 20 only needs to place the bottom plate 200 and the circuit board 300 on the conveying device 112, so that the position arrangement and the spatial layout of each device may be more flexible; meanwhile, a plurality of sets of products can be placed into the conveying track and are sequentially conveyed by the conveying device 112, namely, one or more material waiting stations are formed at the upstream of the gluing station, and a plurality of sets of stacked bottom plates 200 and circuit boards 300 are placed into the conveying track, so that the picking device 20 is not required to be started to place the next set of products after the gluing is finished in the gluing station, and the production efficiency is improved.
It should be noted that, when a set of stacked bottom plate 200 and circuit board 300 enters the rubberizing station, the bottom plate 200 and circuit board 300 need to be retained in the rubberizing station for the required rubberizing time, and meanwhile, when the material waiting station is provided, the bottom plate 200 and circuit board 300 in the material waiting station are also prevented from colliding with each other when entering the rubberizing station, and at this time, the bottom plate 200 and circuit board 300 can be retained in the rubberizing station for the required rubberizing time by stopping the operation of the conveying device 112 or by providing a blocking device in the following embodiment.
In some embodiments, the rack 10 further includes a housing, the housing is provided with a discharge port communicated with the inside of the housing, the discharge port is arranged corresponding to the output end of the penetrating device, and the housing is arranged to prevent impurities from entering the attaching area, so as to reduce the risk that foreign matters contaminate the circuit board 300.
Referring to fig. 2, in some embodiments of the rubberizing apparatus 100 according to the present invention, the conveying device 112 includes two conveying rails 1121, the two conveying rails 1121 are disposed at intervals along a direction perpendicular to a conveying direction on the working table 11, the conveying track is formed between the two conveying rails 1121, and at least one of the conveying rails 1121 is slidably disposed to adjust a width of the conveying track.
In the solution of the foregoing embodiment, the adhesive applying apparatus 100 is provided with a conveying device 112 to convey the products to be welded so as to realize automatic loading and unloading of the products. In this embodiment, the transferring device 112 includes two transferring rails 1121, and at least one of the two transferring rails 1121 is slidably disposed on the working table 11 to adjust the distance between the two transferring rails 1121, so as to adjust the width of the transferring track to use the bottom plate 200 with different sizes, thereby improving the applicability of the tape sticking apparatus 100.
In some embodiments, a guide rod is disposed between the two transport rails 1121, an extending direction of the guide rod is consistent with an arrangement direction of the two transport rails 1121, and the guide rod is disposed so that the transport rails 1121 always keep parallel when moving relatively, thereby preventing the transport rails 1121 from being deviated.
With further reference to fig. 3, in some embodiments, the transfer device 112 includes a drive mechanism 1122, and the drive mechanism 1122 is drivingly connected to the slidable transfer rails 1121 to move the transfer rails 1121 toward and away from each other. With this arrangement, the automation degree of the rubberizing apparatus 100 can be improved, and the distance between the two conveying rails 1121 does not need to be manually adjusted to adapt to the base plates 200 with different sizes.
Referring to fig. 2, in some embodiments of the pasting device 100 of the present invention, the pasting device 100 further includes a first blocking device 40 at an exit end of the pasting station to block the bottom board 200 and the circuit board 300 from advancing or to allow the bottom board 200 and the circuit board 300 to pass;
and/or, the gluing device 100 further comprises a second blocking device 50 at the inlet end of the gluing station to block the advance or release of the base plate 200 and the circuit board 300 from the base plate 200 and the circuit board 300.
In the technical solution of the foregoing embodiment, the stacked bottom plate 200 and the circuit board 300 are used as a set of product, and the conveyor 112 is arranged in the tape pasting device 100 to realize automatic loading and unloading of the product, so that the waiting station can be arranged to improve the production efficiency. In this embodiment, the rubberizing apparatus 100 further comprises a first blocking device 40 located at the outlet end of said rubberizing station to block the advance or release of the products; at this time, the first blocking device 40 may be a telescopic device, and the telescopic end of the telescopic device is made to enter and exit the outlet end of the rubberizing station; the first blocking device 40 can also be an electromagnetic adsorption device, and the product is blocked to advance or release by controlling the magnetic on-off of the electromagnet, in this embodiment, the start and stop of the conveying device 112 can be controlled without repeating the start and stop of the conveying device 112 by the arrangement of the first blocking device 40, so that the time loss in the process of starting and stopping the conveying device 112 can be eliminated, and the production efficiency is improved.
Similarly, in some embodiments, the rubberizing apparatus 100 further includes a second blocking device 50 located at the inlet end of the rubberizing station to block the product from advancing or discharging, at this time, through the setting of the second blocking device 50, when there is a product being rubberized at the rubberizing station, the bottom plate 200 and the circuit board 300 located in the waiting station upstream of the rubberizing station can be prevented from entering the rubberizing station, so as to avoid product collision and improve the use safety, through the setting of the second blocking device 50, the start and stop of the conveyor 112 can be controlled without repetition, so that the time loss in the process of starting and stopping the conveyor 112 can be eliminated, and the production efficiency is improved. The second blocking device 50 may be a telescopic device, and a telescopic end of the telescopic device is made to enter and exit an inlet end of the rubberizing station; the second blocking device 50 may also be an electromagnetic adsorption device, and blocks the product from advancing or releasing by controlling the magnetic on-off of the electromagnet.
It should be noted that, in this embodiment, the first blocking device 40 and the second blocking device 50 may be disposed at the same time, or only one of them may be disposed according to the actual use situation, for example, the second blocking device 50 may not be disposed when the material waiting station is not disposed, the first blocking device 40 may not be disposed when the first blocking device 40 is not required to be sent out through the conveying device 112, and the first blocking device 40 and the second blocking device 50 may be of the same type of structure, or may be of different structures, which is not limited herein.
In some embodiments of the rubberizing devices 100 of the invention, said first blocking means 40 comprise:
a first blocking member, which is arranged downstream of the rubberizing station in the conveying direction of the conveyor 112; and
the first driving piece is in transmission connection with the first blocking piece, and the first blocking piece is driven by the first driving piece to ascend or descend so as to block the product from advancing or discharging.
In the solution of the foregoing embodiment, the gluing device 100 is provided with a conveying device 112 for conveying the product jig and the product, and a first blocking device 40 for retaining the product in the gluing station for the required gluing time. In this embodiment, the first blocking device 40 includes a first blocking member and a first driving member, the first blocking member is arranged in a lifting manner and driven by the first driving member to lift into and out of the conveying track to block or release the product; it can be understood that, when the product got into the rubberizing station, first driving piece ordered about first blockking and rises to get into the transfer orbit and continue the antedisplacement in order to block the product, at this moment, can need not to close the location that the conveying subassembly can realize the product, and then accomplish the rubberizing in the rubberizing station, treats the rubberizing and accomplishes the back, and first driving piece orders about first blockking and moves down to let pass product tool and product, wait for the product that carries on next and reach the rubberizing station. In this embodiment, the first driving element may be, but is not limited to, a driving motor or an air cylinder, and the transmission connection relationship between the first driving element and the first blocking element may be, but is not limited to, a screw transmission, a gear transmission or a link transmission. Usually, the first driving member is a cylinder, and the first blocking member may be a piston of the cylinder or an independent workpiece fixedly connected to the piston of the cylinder, which is not limited herein.
Referring to fig. 3, in some embodiments of the rubberizing apparatus 100 according to the present invention, the first blocking member is a roller 41, and a rotation axis of the roller 41 is perpendicular to a transmission direction of the conveying track.
In the technical solution of the foregoing embodiment, the first blocking device 40 is disposed in the rubberizing apparatus 100, so that the first driving member drives the first blocking member to lift and lower to enter and exit the conveying track, thereby blocking or releasing the product. In this embodiment, the first blocking member is a roller 41, the rotation axis of the roller 41 is perpendicular to the conveying direction of the conveying device 112, at this time, when the first blocking member exits the conveying track and is located below the conveying track, the bottom plate 200 moves forward under the conveying of the conveying device 112, at this time, the first blocking member abuts against the bottom surface of the bottom plate 200 and rotates along with the forward movement of the bottom plate 200, so as to reduce the friction between the product and the first blocking device 40 while supporting the product, and improve the stability of the product in operation.
In some embodiments of the rubberizing devices 100 of the invention, said second blocking means 50 comprise:
a second stop, provided upstream of the rubberizing station along the conveying direction of the conveyor 112; and
the second driving piece is in transmission connection with the second blocking piece, and the second blocking piece is driven by the second driving piece to ascend or descend so as to block the product from advancing or releasing.
In the technical solution of the foregoing embodiment, a material waiting station is further formed on the conveying track, the material waiting station is located in front of the rubberizing station along the conveying direction of the conveying track, and a second blocking device 50 is provided to make the product stay in the material waiting station for the required rubberizing time, so that the product in the rubberizing station is rubberized and removed. In this embodiment, the second blocking device 50 includes a second blocking member and a second driving member, the second blocking member is arranged in a lifting manner and driven by the second driving member to lift into and out of the conveying track to block or release the product; it can be understood, when being provided with a plurality of products in the transfer orbit, one of them product gets into the rubberizing station, other products are just arranged in other in proper order and are waited to expect the station, the second driving piece orders about the second to stop the piece and rise and get into the transfer orbit in order to stop the product that waits to expect in the station and continue the antedisplacement this moment, at this moment, can need not to close the transmission subassembly and can realize the lock of product and release, and then treat that the product in the rubberizing station is accomplished the rubberizing and is shifted out the back, the second driving piece orders about the second and stops the piece and move down, in order to release product tool and product, make the product that waits to expect in the station get into the rubberizing station. In this embodiment, the second driving element may be, but is not limited to, a driving motor, an air cylinder, or the like, and the transmission connection relationship between the second driving element and the second blocking element may be, but is not limited to, a screw transmission, a gear transmission, or a link transmission. Usually, the second driving member is a cylinder, and the second blocking member may be a piston of the cylinder or an independent workpiece fixedly connected to the piston of the cylinder, which is not limited herein.
In some embodiments of the rubberizing devices 100 according to the invention, said second stop is a roller, the rotation axis of which is perpendicular to the transmission direction of said conveying track.
In the technical solution of the foregoing embodiment, the second blocking device 50 is disposed in the rubberizing apparatus 100, so as to drive the second blocking member to lift up and down through the second driving member to enter and exit the conveying track, thereby blocking or releasing the product. In this embodiment, the second blocking member is a roller, the rotation axis of the roller is perpendicular to the conveying direction of the conveying device 112, at this time, when the second blocking member exits the conveying track and is located below the conveying track, the bottom plate 200 moves forward under the conveying of the conveying device 112, and at this time, the second blocking member abuts against the bottom surface of the bottom plate 200 and rotates along with the forward movement of the bottom plate 200, so as to reduce the friction between the product and the second blocking device 50 while supporting the product, and improve the stability of the product in operation.
Referring to fig. 2, in some embodiments of the adhesive applying apparatus 100 of the present invention, the board storing stations and the circuit board storing stations are respectively located at two sides of the conveying track, and the moving direction of the material picking device 20 is consistent with the arrangement direction of the board storing stations and the circuit board storing stations and perpendicular to the conveying direction of the conveying track, so as to sequentially pick up the boards 200 and the circuit boards 300 and stack the boards on the conveying track.
So set up, so as to make bottom plate storage station, circuit board storage station and transfer orbit's the position of arranging draw close relatively, reduce the displacement who picks up material device 20, improve the work piece and pick up efficiency.
Referring to fig. 3, in some embodiments of the gluing device 100 of the present invention, the picking apparatus 20 includes a first picking assembly 21 and a second picking assembly 22, the first picking assembly 21 is used for picking the base plate 200 in the base plate stock station and placing the base plate in the gluing station; the second picking assembly 22 is used for picking up the circuit boards 300 in the circuit board stock station and placing the circuit boards above the bottom plate 200 in the rubberizing station.
In the technical solution of the foregoing embodiment, the pick-up device 20 is disposed in the gluing device 100 to sequentially take out the base board 200 and the circuit boards 300 from the base board storage station and the circuit board storage station, and stack them in the gluing station. In this embodiment, the picking device 20 includes a first picking assembly 21 and a second picking assembly 22, the first picking assembly 21 is used for picking the bottom plate 200 in the bottom plate storage station and placing the bottom plate in the gluing station; the second picking assembly 22 is used for picking up the circuit boards 300 in the circuit board storage station and placing the circuit boards above the bottom plate 200 in the rubberizing station; with the arrangement, the bottom plate 200 and the circuit board 300 can be taken out from the bottom plate storage station and the circuit board storage station at the same time, and only the sequence of placing the bottom plate 200 and the circuit board 300 in the rubberizing station needs to be controlled; compared with the method that only one picking assembly is arranged to sequentially pick up the bottom plate 200 and the circuit board 300, the moving path of the single picking assembly is reduced, the loss is reduced, and the production efficiency is improved. The first picking assembly 21 and the second picking assembly 22 may be any one of a mechanical claw and a suction assembly, and are not limited herein.
Referring to fig. 3, in some embodiments of the adhesive applying apparatus 100 of the present invention, the first picking assembly 21 includes a second absorption member 211, a second lifting mechanism 212 and a second translation mechanism 213, the second lifting mechanism 212 is in transmission connection with the second absorption member 211, the second absorption member 211 is driven by the second lifting mechanism 212 to lift and lower so as to absorb or place the bottom plate 200, the second translation mechanism 213 is in transmission connection with the second lifting mechanism 212, and the second lifting mechanism 212 is driven by the second translation mechanism 213 to reciprocate between the adhesive applying station and the bottom plate storage station.
In the solution of the foregoing embodiment, the first picking assembly 21 is disposed in the gluing device 100 and is used for taking the bottom plate 200 out of the bottom plate storage station and placing the bottom plate in the gluing station. In this embodiment, the first picking assembly 21 includes a second absorption part 211, a second lifting mechanism 212 and a second translation mechanism 213, the second lifting mechanism 212 is in transmission connection with the second absorption part 211, the second absorption part 211 is driven by the second lifting mechanism 212 to lift to absorb or place the base plate 200, the second translation mechanism 213 is in transmission connection with the second lifting mechanism 212, and the second lifting mechanism 212 is driven by the second translation mechanism 213 to reciprocate between the gluing station and the base plate storage station, so as to pick up the base plate 200 to perform loading. In this embodiment, the second adsorption piece 211 can set up a plurality ofly, and a plurality of second adsorption pieces 211 intervals set up to exert more stable lift to bottom plate 200, and each position atress is even, improves the stability of transportation.
Referring to fig. 3, in some embodiments of the adhesive applying apparatus 100 of the present invention, the second picking assembly 22 includes a third suction member 221, a third lifting mechanism 222 and a third translation mechanism 223, the third lifting mechanism 222 is in driving connection with the third suction member 221, the third suction member 221 is driven by the third lifting mechanism 222 to lift and lower so as to suck or place the circuit board 300, the third translation mechanism 223 is in driving connection with the third lifting mechanism 222, and the third lifting mechanism 222 is driven by the third translation mechanism 223 to reciprocate between the adhesive applying station and the circuit board storing station.
In the solution of the foregoing embodiment, the second picking assembly 22 is disposed in the gluing device 100 and is used for taking out the circuit board 300 from the circuit board storage station and placing the circuit board in the gluing station. In this embodiment, the second picking assembly 22 includes a third suction member 221, a third lifting mechanism 222 and a third translation mechanism 223, the third lifting mechanism 222 is connected to the third suction member 221 in a driving manner, the third suction member 221 is driven by the third lifting mechanism 222 to lift for sucking or placing the circuit board 300, the third translation mechanism 223 is connected to the third lifting mechanism 222 in a driving manner, and the third lifting mechanism 222 is driven by the third translation mechanism 223 to reciprocate between the pasting station and the circuit board storing station, so as to pick up the circuit board 300 to perform loading. In this embodiment, the third adsorption member 221 may be disposed in a plurality of, and the third adsorption members 221 are disposed at intervals to apply a more stable lifting force to the circuit board 300, and each position is stressed uniformly, so as to improve the stability of the transfer process.
Referring to fig. 2, in some embodiments of the rubberizing apparatus 100 of the present invention, the rubberizing apparatus 100 further includes a bottom plate carrying device 60, the bottom plate carrying device 60 includes a bottom plate carrying platform 61 and a fourth lifting mechanism 62, the bottom plate carrying platform 61 is disposed at the bottom plate storage station, and the fourth lifting mechanism 62 is in transmission connection with the bottom plate carrying platform 61 to drive the bottom plate carrying platform 61 to lift;
and/or, the rubberizing apparatus 100 further includes a circuit board carrying device 70, the circuit board carrying device 70 includes a circuit board carrying platform 71 and a fifth lifting mechanism 72, the circuit board carrying platform 71 is disposed at the circuit board storage station, and the fifth lifting mechanism 72 is in transmission connection with the circuit board carrying platform 71 to drive the circuit board carrying platform 71 to lift.
In the technical solution of the foregoing embodiment, the workbench 11 of the tape sticking apparatus 100 is provided with a bottom board storage station for placing the bottom board 200 and a circuit board storage station for placing the circuit board 300. In this embodiment, the rubberizing apparatus 100 further includes a bottom plate carrying device 60, the bottom plate carrying device 60 includes a bottom plate carrying platform 61 and a fourth lifting mechanism 62, the bottom plate carrying platform 61 is disposed at the bottom plate storage station, and the fourth lifting mechanism 62 is in transmission connection with the bottom plate carrying platform 61 to drive the bottom plate carrying platform 61 to lift; it is easy to understand, at this moment, can set up a plurality of bottom plates 200 range upon range of on bottom plate load-bearing platform 61, pick up when material device 20 picks up bottom plate 200 one by one, fourth elevating system 62 orders about bottom plate load-bearing platform 61 and progressively rises preset height, and preset height is mostly the thickness of single bottom plate 200 to make the bottom plate 200 of the superiors be in same high position all the time, be convenient for pick up material device 20 and pick up, thereby avoid appearing the empty condition of grabbing, ensure to pick up material device 20 and pick up bottom plate 200.
Of course, as an alternative embodiment, if the bottom plate carrying platform 61 is not lifted, the material picking device 20 may be lowered by a preset distance every time the material picking device picks up the bottom plate 200, and it may also be ensured that the material picking device 20 picks up the bottom plate 200.
Similarly, in some embodiments, the tape pasting apparatus 100 further includes a circuit board carrying device 70, the circuit board carrying device 70 includes a circuit board carrying platform 71 and a fifth lifting mechanism 72, the circuit board carrying platform 71 is disposed at the circuit board storage station, and the fifth lifting mechanism 72 is in transmission connection with the circuit board carrying platform 71 to drive the circuit board carrying platform 71 to lift; it is easy to understand, at this moment, can set up a plurality of circuit boards 300 range upon range of on circuit board load-bearing platform 71, when picking up material device 20 picks up circuit board 300 one by one, fifth elevating system 72 orders about circuit board load-bearing platform 71 and progressively rises preset height, and preset height is mostly the thickness of single circuit board 300 to make the circuit board 300 of the superiors be in same high position all the time, be convenient for pick up material device 20 and pick up, thereby avoid appearing empty circumstances of grabbing, ensure to pick up material device 20 and pick up circuit board 300.
In this embodiment, only one of the circuit board carrying device 70 and the bottom board carrying device 60 may be provided, and the material picking device 20 may be controlled to perform the lifting action according to different setting conditions, which is not limited herein.
Further, in some embodiments, the pick-up device 20 includes a first pick-up assembly 21 and a second pick-up assembly 22, the first pick-up assembly 21 is used for picking up the base boards 200 in the base board stock station and placing the base boards in the rubberizing station; the second picking assembly 22 is adapted to pick up a circuit board 300 from the circuit board magazine station and place it over the base plate 200 in the taping station. Then, only one of the circuit board carrier 70 and the board carrier 60 may be provided, and the picking assembly corresponding to the device without the lifting mechanism may be driven to descend by a predetermined distance step by step.
Referring to fig. 2, in some embodiments of the adhesive applying apparatus 100 of the present invention, the adhesive applying apparatus 100 further includes an ion fan 80, and the ion fan 80 is disposed on the worktable 11 and faces the adhesive applying station.
According to the technical scheme, automatic feeding of the bottom plate 200 and the circuit board 300 is achieved through the material picking device 20 in the rubberizing device 100, and automatic rubberizing is achieved through the rubberizing device 30. In this embodiment, be equipped with ion fan 80 in rubberizing equipment 100, ion fan 80 sets up towards the rubberizing station, can eliminate the static that bottom plate 200 and circuit board 300 transported, equipment and rubberizing process produced, avoids destroying circuit board 300, improves the safety in utilization of automatic rubberizing process, and the setting of ion fan 80, is favorable to the separation of high temperature sticky tape and rubberizing device 30, improves the rubberizing quality.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. A rubberizing apparatus, characterized by comprising:
the automatic gluing machine comprises a machine frame, wherein a workbench is arranged on the machine frame, and a bottom plate storage station, a circuit board storage station and a gluing station are formed on the workbench;
the material picking device is arranged on the workbench, so that the bottom plate and the circuit board are picked from the bottom plate storage station and the circuit board storage station in sequence and are stacked on the rubberizing station; and
and the adhesive tape sticking device is arranged on the workbench so as to stick the adhesive tape on the bottom plate and the circuit board in the adhesive tape sticking station and cut the adhesive tape.
2. The rubberizing device according to claim 1, wherein said rubberizing means comprises:
the adhesive tape slitting component is arranged on the workbench and used for placing adhesive tape rolls and slitting the adhesive tapes; and
the adhesive tape pasting assembly is arranged on the workbench and used for picking up the adhesive tape in the adhesive tape slitting assembly and pasting the adhesive tape on the bottom plate and the circuit board in the adhesive tape pasting station.
3. The taping apparatus of claim 2, wherein the tape slitting assembly comprises:
the adhesive tape rack is arranged on the workbench and used for placing adhesive tape rolls;
the clamping mechanism is arranged on the workbench and used for clamping the free end of the adhesive tape roll;
the driving piece is in transmission connection with the adhesive tape rack and/or the clamping mechanism so as to drive the clamping mechanism and the adhesive tape rack to approach or separate from each other; and
the adhesive tape shearing mechanism is arranged on the workbench so as to cut off the adhesive tape between the adhesive tape rack and the clamping mechanism.
4. The taping apparatus of claim 2, wherein the taping assembly includes:
a first suction attachment;
the first lifting mechanism is in transmission connection with the first suction accessory, and the first suction accessory is driven by the first lifting mechanism to lift so as to suck or paste the adhesive tape; and
the first translation mechanism is in transmission connection with the first lifting mechanism, and the first lifting mechanism is driven by the first translation mechanism to move back and forth between the rubberizing station and the adhesive tape slitting component.
5. The rubberizing device according to claim 1, wherein said work station comprises:
the workbench body is provided with the bottom plate material storage station and the circuit board material storage station; and
the conveying device is arranged on the workbench body and provided with a conveying rail, the rubberizing station is formed on the conveying rail, the material picking device sequentially picks up the bottom plate and the circuit boards and is placed on the conveying rail in a stacked mode, and the stacked bottom plate and the stacked circuit boards can enter and exit the rubberizing station along the conveying rail.
6. The taping apparatus of claim 5, further comprising a first blocking device at an exit end of the taping station to block advancement or clearance of the base plate and circuit board;
and/or the rubberizing equipment further comprises a second blocking device positioned at the inlet end of the rubberizing station so as to block the bottom plate and the circuit board from advancing or to allow the bottom plate and the circuit board to pass;
and/or the bottom plate material storage station and the circuit board material storage station are respectively positioned on two sides of the conveying track, and the moving direction of the material picking device is consistent with the arrangement direction of the bottom plate material storage station and the circuit board material storage station and is perpendicular to the conveying direction of the conveying track so as to sequentially pick up the bottom plate and the circuit boards and stack the bottom plate and the circuit boards in the conveying track.
7. The taping apparatus of claim 1, wherein the pick-up device includes a first pick-up assembly for picking up a board in the magazine of boards and placing the board in the taping station, and a second pick-up assembly for picking up a board in the magazine of boards and placing the board above the board in the taping station.
8. The gluing device according to claim 7, wherein the first picking assembly comprises a second adsorption member, a second lifting mechanism and a second translation mechanism, the second lifting mechanism is in transmission connection with the second adsorption member, the second adsorption member is driven by the second lifting mechanism to lift so as to suck or place a base plate, the second translation mechanism is in transmission connection with the second lifting mechanism, and the second lifting mechanism is driven by the second translation mechanism to reciprocate between the gluing station and the base plate storage station;
and/or, the second picking assembly comprises a third adsorption piece, a third lifting mechanism and a third translation mechanism, the third lifting mechanism is in transmission connection with the third adsorption piece, the third adsorption piece is driven by the third lifting mechanism to lift so as to absorb or place the circuit board, the third translation mechanism is in transmission connection with the third lifting mechanism, and the third translation mechanism is driven by the third translation mechanism to move back and forth between the rubberizing station and the circuit board storage station.
9. The laminating machine of claim 1, further comprising a base plate carrying device, wherein said base plate carrying device comprises a base plate carrying platform and a fourth lifting mechanism, said base plate carrying platform is disposed at said base plate storage station, and said fourth lifting mechanism is in driving connection with said base plate carrying platform to drive said base plate carrying platform to lift;
and/or, rubberizing equipment still includes circuit board and bears the device, circuit board bears the device and includes circuit board load-bearing platform and fifth elevating system, circuit board load-bearing platform locates circuit board storage station, fifth elevating system with circuit board load-bearing platform transmission is connected in order to order about circuit board load-bearing platform goes up and down.
10. A gumming device as claimed in any one of claims 1 to 9, further comprising an ion fan provided on said work table and arranged towards said gumming station.
CN202111083508.9A 2021-09-16 2021-09-16 Rubberizing equipment Active CN113543496B (en)

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CN117142232A (en) * 2023-10-30 2023-12-01 宁德时代新能源科技股份有限公司 Rubberizing device, rubberizing method and battery processing equipment

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CN211334568U (en) * 2019-11-29 2020-08-25 深圳市特瑞吉科技有限公司 Film pasting mechanism
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CN105752635A (en) * 2016-05-18 2016-07-13 广州超音速自动化科技股份有限公司 Production line for conveying circuit boards
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CN117142232B (en) * 2023-10-30 2024-02-23 宁德时代新能源科技股份有限公司 Rubberizing device, rubberizing method and battery processing equipment

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