CN113540201A - Display substrate and display device - Google Patents
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- CN113540201A CN113540201A CN202110818067.6A CN202110818067A CN113540201A CN 113540201 A CN113540201 A CN 113540201A CN 202110818067 A CN202110818067 A CN 202110818067A CN 113540201 A CN113540201 A CN 113540201A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
- H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
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Abstract
The display substrate and the display device provided by the present disclosure include: a substrate including a display region and a non-display region adjacent to the display region; the inorganic packaging layer is positioned on the substrate and completely covers the display area and extends from the display area to the non-display area; the inorganic packaging layer is arranged on the substrate base plate, the substrate base plate is arranged on the inorganic packaging layer, the substrate base plate is arranged on the substrate base plate, the inorganic packaging layer is arranged on the substrate base plate, the substrate base plate is arranged on the substrate base plate, and the substrate base plate is provided with a plurality of mutually separated partition structures which are arranged between the inorganic packaging layer and the substrate base plate and surround the display area or are arranged by surrounding the display area in the non-display area, wherein the structural parameters of at least one partition structure are different from those of other partition structures, so that the inorganic packaging layer is arranged on the at least one partition structure in a disconnected mode, and the inorganic packaging layer is arranged on the other partition structures in a continuous mode. The inorganic packaging layer can be disconnected at the position of at least one partition structure due to different wrapping properties of the inorganic packaging layer on the partition structures with different structural parameters, so that cracks can be limited in a non-display area, the cracks are prevented from extending to a display area, and the packaging reliability is improved.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display substrate and a display device.
Background
Organic electroluminescent devices (OLEDs), which are a new type of light emitting devices, have shown great potential applications in the fields of displays and lighting, and thus have received strong attention from both academic and industrial fields. In the display field, the organic electroluminescent device has advantages of self-luminescence, fast response, wide viewing angle, high brightness, bright color, lightness and thinness, etc. compared with a Liquid Crystal Display (LCD), and is considered as a next generation display technology.
Disclosure of Invention
The embodiment of the disclosure provides a display substrate and a display device, which are used for improving packaging reliability.
Therefore, an embodiment of the present disclosure provides a display substrate, including:
the display device comprises a substrate base plate, a display area and a non-display area, wherein the substrate base plate comprises the display area and the non-display area adjacent to the display area;
the inorganic packaging layer is positioned on the substrate and completely covers the display area and extends from the display area to the non-display area;
the inorganic packaging layer is arranged on the substrate base plate, the substrate base plate is arranged on the inorganic packaging layer, the substrate base plate is arranged on the substrate base plate, the inorganic packaging layer is arranged on the substrate base plate, the substrate base plate is arranged in the non-display area in a surrounding mode, the substrate base plate is arranged on the substrate base plate in a surrounding mode, and the substrate base plate is arranged on the substrate base plate in a surrounding mode.
Optionally, in the display substrate provided in the embodiment of the present disclosure, the partition structure includes a first partition, a second partition and a third partition that are sequentially arranged along a direction away from the substrate, and orthogonal projections of the first partition and the third partition on the substrate respectively completely cover an orthogonal projection of the second partition on the substrate;
the distance from the edge of the orthographic projection of the third partition part of the at least one partition structure on the substrate base plate to the adjacent edge of the orthographic projection of the second partition part on the substrate base plate is greater than the corresponding distance of the other partition structures.
Optionally, in the display substrate provided in an embodiment of the present disclosure, a difference between a distance from an edge of the orthographic projection of the third partition in the at least one partition structure to an adjacent edge of the orthographic projection of the second partition in the substrate and a corresponding distance in the other partition structures is greater than or equal to 1 μm.
Optionally, in the display substrate provided in an embodiment of the present disclosure, a height of the second partition of the at least one partition structure in a direction perpendicular to the substrate is greater than a height of the second partition of the other partition structures in the direction perpendicular to the substrate.
Optionally, in the display substrate provided in an embodiment of the present disclosure, a difference between a height of the second partition of the at least one partition structure in a direction perpendicular to the substrate and a height of the second partition of the other partition structure in the direction perpendicular to the substrate is greater than or equal to
Optionally, in the display substrate provided in this disclosure, at least one of the other partition structures is located between the at least one partition structure and the display area.
Optionally, in the display substrate provided in this disclosure, all of the other partition structures are located between the at least one partition structure and the display area.
Optionally, in the display substrate provided in this disclosure, at least one of the other partition structures is located between the at least one partition structure and the display area, and the rest of the other partition structures are located on a side of the at least one partition structure away from the display area.
Optionally, in the display substrate provided in an embodiment of the present disclosure, the inorganic encapsulation layer includes a first inorganic encapsulation layer and a second inorganic encapsulation layer that are stacked;
the display substrate further comprises an organic encapsulation layer between the first inorganic encapsulation layer and the second inorganic encapsulation layer;
the organic packaging layer completely covers the display area and extends from the display area to the non-display area, and the organic packaging layer is arranged at each partition structure in a disconnected mode.
Optionally, in the display substrate provided in the embodiment of the present disclosure, the display substrate further includes: the switching electrode is positioned between the inorganic packaging layer and the substrate base plate in the display area, and the anode is positioned between the switching electrode and the inorganic packaging layer, and the switching electrode is electrically connected with the anode;
the partition structure and the switching electrode are arranged in the same layer and the same material.
Optionally, in the display substrate provided in this disclosure, the non-display area is located around the display area, and the non-display area on one side of the display area includes a binding area;
in the non-display area including the binding area, the isolation structures extend along the direction in which the binding area points to the display area on both sides of an area between the binding area and the display area, and in the other non-display areas, the isolation structures are arranged around the display area.
Optionally, in the display substrate provided in the embodiments of the present disclosure, the shape of the display substrate is a circle, an ellipse, or a heart.
Optionally, in the display substrate provided in the embodiment of the present disclosure, the display substrate further includes an insulating structure and an anode metal sequentially located on a side of the partition structure away from the substrate in the non-display area, where the anode metal is in contact with the partition structure through a through hole penetrating through the insulating structure.
Optionally, in the display substrate provided in this disclosure, an orthogonal projection of the anode metal on the substrate is located in an orthogonal projection of the third partition on the substrate, and an orthogonal projection of the insulating structure on the substrate is located in an orthogonal projection of the anode metal on the substrate.
Based on the same inventive concept, the embodiment of the present disclosure provides a display device, which includes the display substrate provided by the embodiment of the present disclosure.
The beneficial effects of this disclosure are as follows:
the display substrate and the display device provided by the embodiment of the disclosure comprise a substrate, wherein the substrate comprises a display area and a non-display area adjacent to the display area; the inorganic packaging layer is positioned on the substrate and completely covers the display area and extends from the display area to the non-display area; the partition structures are separated from each other and located between the inorganic packaging layer and the substrate base plate, the partition structures are arranged in a non-display area in a surrounding mode or are arranged in a surrounding mode in a display area, and the structural parameters of at least one partition structure are different from those of other partition structures, so that the inorganic packaging layer is disconnected and arranged in the position of the at least one partition structure, and the partition structures are continuously arranged in the positions of the other partition structures. Because each partition structure is positioned in the non-display area, and the wrapping performance of the inorganic packaging layer to the partition structures with different structural parameters is different, the inorganic packaging layer can be disconnected at least one partition structure with the structural parameters different from those of other partition structures, so that cracks possibly generated in the cutting process can be limited in the non-display area, the cracks are effectively prevented from expanding to the display area, and the packaging reliability is improved.
Drawings
FIG. 1 is a schematic view of a display substrate according to the related art;
FIGS. 2 and 3 are electron micrographs of cracks generated in an inorganic encapsulating layer according to the related art, respectively;
fig. 4 is a schematic structural diagram of a display substrate according to an embodiment of the disclosure;
FIG. 5 is a schematic cross-sectional view taken along line I-II of FIG. 4;
FIG. 6 is a schematic view of a second partition structure of FIG. 5;
FIG. 7 is a schematic view of the first partition structure of FIG. 5;
FIG. 8 is an electron microscope image of batch deposited 2 μm thick inorganic encapsulation layers provided by an embodiment of the disclosure;
FIG. 9 is an electron microscope image of an inorganic encapsulation layer deposited alone to a thickness of 1 μm provided by an embodiment of the disclosure;
fig. 10 is a schematic view illustrating another structure of a display substrate according to an embodiment of the disclosure;
FIG. 11 is a schematic cross-sectional view taken along line V-VI in FIG. 10;
FIG. 12 is a schematic view of a further cross-sectional structure taken along line V-VI in FIG. 10;
FIG. 13 is a schematic cross-sectional view taken along line V-VI in FIG. 10;
FIG. 14 is a schematic view of a further cross-sectional structure taken along line V-VI in FIG. 10;
FIG. 15 is a schematic cross-sectional view taken along line III-IV of FIG. 3 or FIG. 10;
FIG. 16 is a schematic view of another cross-sectional structure taken along line I-II of FIG. 4;
fig. 17 is a flowchart of a method for manufacturing a display substrate according to an embodiment of the disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. It should be noted that the sizes and shapes of the various figures in the drawings are not to scale, but are merely intended to illustrate the present disclosure. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in the description and claims does not indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. "inner", "outer", "upper", "lower", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
As shown in fig. 1, in the related art, the encapsulation layer TFE is made by using an Open Mask (Open Mask) with a conventional shape (e.g., square), so that the encapsulation layer TFE is larger than the special-shaped (e.g., circular) substrate 01, and a cutter wheel is usually required to cut off the encapsulation layer TFE beyond the special-shaped substrate 01. However, in the cutting process of the cutter wheel, as shown in fig. 2 and fig. 3, the cutting stress may cause cracks (Crack) to be generated in the inorganic encapsulation film (CVD) in the encapsulation layer TFE, and water, oxygen, etc. in the air may intrude into the display area (AA) along the cracks, which seriously affects the encapsulation reliability of the irregular display product.
In order to solve at least the above problems in the related art, embodiments of the present disclosure provide a display substrate, as shown in fig. 4 and 5, including:
a substrate base plate 101, wherein the substrate base plate 101 comprises a display area AA and a non-display area BB adjacent to the display area AA; specifically, fig. 4 shows that the non-display area BB surrounds the display area AA; in some embodiments, a hole may be formed in the display area AA to mount a camera or the like at the punched position, where the punched position may be the non-display area BB, and the display area AA surrounds the non-display area BB;
the inorganic packaging layer 102 is positioned on the substrate 101, and the inorganic packaging layer 102 completely covers the display area AA and extends from the display area AA to the non-display area BB;
a plurality of mutually separated partition structures 103 located between the inorganic encapsulation layer 102 and the substrate base plate 101, wherein the partition structures 103 are disposed around the display area AA in the non-display area BB or disposed around the display area AA, and a structural parameter of at least one partition structure 103 is different from a structural parameter of other partition structures 103, so that the inorganic encapsulation layer 102 is disconnected at the at least one partition structure 103 and is continuously disposed at the other partition structures 103. For convenience of description, hereinafter, each of the above-mentioned at least one partition structure 103 is referred to as a first partition structure 1031, and each of the above-mentioned other partition structures 103 is referred to as a second partition structure 1032.
In the display substrate provided by the embodiment of the disclosure, since each partition structure 103 is located in the non-display area BB and the encapsulation properties of the inorganic encapsulation layer 102 to the first partition structure 1031 and the second partition structure 1032 which have different structural parameters are different, the inorganic encapsulation layer 102 can be disconnected at the first partition structure 1031 and be continuous at the second partition structure 1032, and therefore, a crack which may be generated in a cutting process can be limited to the non-display area BB, so that the crack is effectively prevented from spreading to the display area AA, and the packaging reliability and the cutting yield are further improved. In addition, the cutting stress does not influence the packaging reliability, so the requirements on a cutting area and a cutting process are reduced, and the cutting window is improved.
In some embodiments, in the above display substrate provided in the embodiments of the present disclosure, as shown in fig. 5 to 7, the partition structure 103 may include a first partition 31, a second partition 32, and a third partition 33 sequentially arranged along a direction Z away from the substrate 101, and orthographic projections of the first partition 31 and the third partition 33 on the substrate 101 respectively completely cover orthographic projections of the second partition 32 on the substrate 101, so that the partition structure 103 appears as an "i" shape (RIB); in some embodiments, the structural parameters of the partition structure 103 may include a distance (also referred to as Tip) from an edge of the orthographic projection of the third partition 33 of the partition structure 103 on the substrate base plate 101 to an adjacent edge of the orthographic projection of the second partition 32 on the substrate base plate 101, and in particular, in order to effectively partition the inorganic encapsulation layer 102, a distance w1 from the edge of the orthographic projection of the third partition 33 of the first partition structure 1031 on the substrate base plate 101 to the adjacent edge of the orthographic projection of the second partition 32 on the substrate base plate 101 may be set to be greater than a corresponding distance w2 of the second partition structure 1032.
In some embodiments, the difference between the distance w1 from the edge of the orthographic projection of the first partition structure 1031 on the substrate base plate 101 to the adjacent edge of the second partition 32 on the orthographic projection of the substrate base plate 101 and the corresponding distance w2 in the second partition structure 1032 (i.e., w1-w2) may be greater than or equal to 1 μm. Exemplarily, the distance w2 from the edge of the orthographic projection of the third partition 33 of the second partition structure 1032 to the adjacent edge of the orthographic projection of the second partition 32 on the substrate 101 is in the range of 0.03 μm to 0.05 μm, and the distance w1 from the edge of the orthographic projection of the third partition 33 of the first partition structure 1031 to the adjacent edge of the orthographic projection of the second partition 32 on the substrate 101 may be in the range of 1.03 μm to 1.05 μm.
In some embodiments, in the above-mentioned display substrate provided by the embodiments of the present disclosure, as shown in fig. 5 to 7, the structural parameter of the partition structure 103 may include a height of the second partition 32 of the partition structure 1031 in the direction Z perpendicular to the substrate base plate 101, and specifically, in order to effectively partition the inorganic encapsulation layer 102, a height h1 of the second partition 32 of the first partition structure 1031 in the direction Z perpendicular to the substrate base plate 101 may be set to be greater than a height h2 of the second partition 32 of the second partition structure 1032 in the direction Z perpendicular to the substrate base plate 101.
In some embodiments, the difference between the height h1 of the second partition 32 of the first partition structure 1031 in the direction Z perpendicular to the substrate base plate 101 and the height h2 of the second partition 32 of the second partition structure 1032 in the direction Z perpendicular to the substrate base plate 101 (i.e., h1-h2) may be greater than or equal to
For example, the height h2 of the second partition 32 of the second partition structure 1032 in the direction Z perpendicular to the substrate base plate 101 may be
The second partition portion 32 of the height h1 of the first partition structure 1031 may be greater than or equal to the substrate base plate 101 direction Z
In the present disclosure, at least one of the height h1 of the second partition portion 32 of the first partition structure 1031 in the direction Z perpendicular to the substrate 101 and the distance w1 from the edge of the orthographic projection of the third partition portion 33 of the first partition structure 1031 on the substrate 101 to the adjacent edge of the orthographic projection of the second partition portion 32 on the substrate 101 satisfies the above condition, so that the inorganic encapsulation layer 102 can be partitioned. However, the inventor finds out in process verification that the thickness and the deposition times of the inorganic encapsulation layer 102 have a certain influence on the partition effect, which is specifically shown in that the thicker the inorganic encapsulation layer 102 is, the more the deposition times are, the better the encapsulation and the coverage of the partition structure 103 is, and the more the inorganic encapsulation layer is not easily broken, as shown in fig. 8 and 9. Specifically, electron microscope (SEM) images of batch deposition of 2 μm batches of inorganic encapsulation layer 102 and deposition of 1 μm of inorganic encapsulation layer 102 alone are shown in fig. 8 and 9, respectively. Therefore, in a specific implementation, in order to block the inorganic encapsulation layer 102, the height h1 of the second blocking portion 32 of the first blocking structure 1031 in the direction Z perpendicular to the substrate base plate 101 and the adjacent edge distance w1 from the edge of the orthographic projection of the third blocking portion 33 of the first blocking structure 1031 on the substrate base plate 101 to the orthographic projection of the second blocking portion 32 on the substrate base plate 101 can be flexibly adjusted according to the thickness and the deposition times of the inorganic encapsulation layer 102. Specifically, the height h1 of the second partition part 32 of the first partition structure 1031 in the direction Z perpendicular to the substrate base plate 101 and/or the distance w1 of the third partition part 33 of the first partition structure 1031 in the orthographic projection of the substrate base plate 101 to the adjacent edge of the second partition part 32 in the orthographic projection of the substrate base plate 101 increases with the increase in the thickness of the inorganic encapsulation layer 102 and the increase in the number of depositions, that is, the height h1 of the second partition part 32 of the first partition structure 1031 in the direction Z perpendicular to the substrate base plate 101 and/or the distance w 25 of the third partition part 33 of the first partition structure 1031 in the orthographic projection of the substrate base plate 101 to the adjacent edge 1 of the second partition part 32 in the orthographic projection of the substrate base plate 101 are in positive correlation with the thickness and the number of depositions of the inorganic encapsulation layer 102.
In some embodiments, since the first partition structures 1031 are located at partition positions of the inorganic encapsulation layer 102, in order to avoid package failure caused by too close of the partitioned inorganic encapsulation layer 102 to the display area AA, at least one of the second partition structures 1032 may be located between the first partition structures 1031 and the display area AA, as shown in fig. 5, 10 to 12. Alternatively, as shown in fig. 5 and 11, the second partition structure 1032 is located entirely between the first partition structure 1031 and the display area AA; alternatively, as shown in fig. 12, a part of the second partition structures 1032 is located between the first partition structure 1031 and the display area AA, and the rest of the second partition structures 1032 are located on a side of the first partition structure 1031 away from the display area AA.
Since the inorganic encapsulation layers 102 in the region between the partition structure 103 and the display area AA are continuously disposed, when the region between the partition structure 103 and the display area AA is large, even if the inorganic encapsulation layer 102 is broken at the partition structure 103 closest to the display area AA, a good encapsulation effect of the inorganic encapsulation layer 102 can still be ensured. Based on this, in some embodiments, as shown in fig. 13 and 14, when the minimum distance d1 between the partition structure 103 and the display area AA is greater than the minimum distance d2 between the partition structure 1031 and the display area AA in fig. 11 and 12, at least a portion of the higher first partition structure 1031 may be disposed to intersect with the lower second partition structure 1032 closer to the display area AA.
In some embodiments, in the above display substrate provided by the embodiments of the present disclosure, as shown in fig. 5, the inorganic encapsulation layer 102 includes a first inorganic encapsulation layer 1021 and a second inorganic encapsulation layer 1022 which are stacked; the display substrate may further include an organic encapsulation layer 104 between the first inorganic encapsulation layer 1021 and the second inorganic encapsulation layer 1022; the organic encapsulation layer 104 completely covers the display area AA and extends from the display area AA to the non-display area BB, and the organic encapsulation layer 104 is disconnected at each partition structure 103 (including all the first partition structures 1031 and all the second partition structures 1032) to enhance the encapsulation effect.
In some embodiments, in the display substrate provided in the embodiments of the present disclosure, as shown in fig. 15, the display substrate may further include: a via electrode 105 disposed between the inorganic sealing layer 102 and the substrate base plate 101 in the display area AA, and an anode 106 disposed between the via electrode 105 and the inorganic sealing layer 102, wherein the via electrode 105 is electrically connected to the anode 106, and the partition structure 103 and the via electrode 105 are disposed in the same layer and material as each other, so as to reduce the number of films and the number of masks.
In the present disclosure, the "same layer" refers to a layer structure formed by forming a film layer for forming a specific pattern by the same film formation process and then performing a patterning process by using the same mask plate. That is, one mask (also called as a photomask) is corresponding to one patterning process. Depending on the specific pattern, one patterning process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous, and the specific patterns may be at the same height or have the same thickness, or may be at different heights or have different thicknesses.
In addition, as shown in fig. 5 and 15, the transfer electrode 105 is used specifically for connecting the transistor 107 and the anode 106. The display substrate may further include: a buffer layer 108, a first gate insulating layer 109, a second gate insulating layer 110, a capacitor 111, an interlayer dielectric layer 112, a first insulating layer 113, a first planarization layer 114, a second insulating layer 115, a second planarization layer 116, a pixel defining layer 117, a light emitting function layer 118, a cathode 119, a Filler layer (Filler)120, a package Dam (Dam)121, a protective Cover (Cover)122, and the like.
In some embodiments, in the display substrate provided in the embodiments of the present disclosure, as shown in fig. 4, the non-display area BB is located around the display area AA, and the non-display area BB on the display area AA side includes a binding area PB; in a non-display area BB (e.g. a lower non-display area) comprising a binding area PB, the barrier structure 103 extends along a direction Y in which the binding area PB points to the display area AA on both sides of an area between the binding area PB and the display area AA, and in other non-display areas BB (e.g. left, right and upper non-display areas), the barrier structure 103 is arranged around the display area AA. With such an arrangement, the signal lines in the display substrate can be electrically connected with the driving chip (IC) of the bonding region PB in the region between the portions of the isolation structure 103 extending along the direction Y, so that the signal lines are prevented from being overlapped with the isolation structure 103, thereby reducing the coupling capacitance on the signal lines and facilitating the improvement of the display effect.
In some embodiments, in the display substrate provided in the embodiments of the present disclosure, the shape of the display substrate may be a circle, an ellipse, a heart, or the like, which is not limited herein.
In some embodiments, in the display substrate provided in the embodiments of the present disclosure, as shown in fig. 16, an insulating structure 115 'and an anode metal 106' sequentially located on a side of the partition structure 103 facing away from the substrate base plate 101 in the non-display region BB may be further included, where the anode metal 106 'is in contact with the partition structure 103 through a through hole penetrating through the insulating structure 115'. In specific implementation, the anode metal 106' in the non-display area BB and the anode 106 in the display area AA are fabricated by the same mask process. The insulating structure 115' is a remaining pattern of the second insulating layer 115 in the non-display area AA.
In some embodiments, the orthographic projection of the anode metal 106 ' on the substrate base plate 101 may be located in the orthographic projection of the third partition 33 on the substrate base plate 101, and the orthographic projection of the insulating structure 115 ' on the substrate base plate 101 is located in the orthographic projection of the anode metal 106 ' on the substrate base plate 101, so as to facilitate the manufacturing of the partition structure 103 located below the anode metal 106 ' and the insulating structure 115 ' into an "i" shape.
In addition, the present disclosure also provides a manufacturing method of the display substrate, and for convenience of understanding, only the manufacturing of the partition structure 103 is described below, and for the manufacturing process of each component in the display area AA, reference may be made to related technologies, and details are not described herein.
Specifically, as shown in fig. 17, the method for manufacturing the display substrate may include the following steps:
the first step is as follows: in the non-display area BB of the substrate 101, a buffer layer 108, a first gate insulating layer 109, a first gate metal layer 123 where a first electrode of the capacitor 111 is located, a second gate metal layer 124 where a second electrode of the capacitor 111 is located, an interlayer dielectric layer 112 having a first via in a design area of the isolation structure 103, a first conductive structure 125 of the same material located in the design area of the isolation structure 103 and at the same layer as the source of the transistor 106, a first insulating layer 113 having a second via in the design area of the isolation structure 103, and a second conductive structure 103 'located in the design area of the isolation structure 103 and at the same layer as the via electrode and at the same material are sequentially formed, wherein the first conductive structure 125 is electrically connected to the second gate metal layer 124 through the first via, and the second conductive structure 103' is electrically connected to the first conductive structure 125 through the second via.
The second step is that: a second insulating layer 115 is formed on the layer on which the second conductive structure 103 'is located, and a third via is formed in the second insulating layer 115 in the middle region of the second conductive structure 103'.
The third step: an anode metal 106 ' is formed in the designed region of the isolation structure 103 such that the anode metal 106 ' is electrically connected to the second conductive structure 103 ' through the third via. Of course, since the isolation structure 103 is located in the non-display area BB, and the non-display area BB has no display function, the anode metal 106' in the design area of the isolation structure 103 may or may not be provided, and is not particularly limited.
The fourth step: the second insulating layer 115 above the second conductive structure 103 'is etched away by a dry etching process, leaving the second insulating layer 115 shielded by the anode metal 106, resulting in an insulating structure 115'. And then, performing transverse etching on the metal of the second conductive structure 103' by a wet etching process to obtain the I-shaped partition structure 103. In specific implementation, the partition structures 103 with different heights can be obtained by forming the second conductive structures 103' with different thicknesses, and the distance that the third partition 33 in the partition structure 103 exceeds the second partition 32 on a single side is controlled by adjusting the wet etching time and the like, so as to obtain the first partition structure 1031 and the second partition structure 1032 with different specifications. Alternatively, the first partition structure 1031 and the second partition structure 1032 with different specifications and requirements may be manufactured separately. Since the "i" shaped partition structure 103 is similar to the process of manufacturing the "i" shaped metal component in the related art, it will not be described in detail here.
It should be noted that, in the manufacturing method provided in the embodiment of the present disclosure, the patterning process related to forming each layer structure may include not only some or all of the processes of deposition, photoresist coating, mask masking, exposure, development, etching, and photoresist stripping, but also other processes, and specifically, a pattern to be patterned is formed in an actual manufacturing process, which is not limited herein. For example, a post-bake process may also be included after development and before etching.
The deposition process may be a chemical vapor deposition method, a plasma enhanced chemical vapor deposition method, or a physical vapor deposition method, which is not limited herein; the Mask used in the Mask process may be a Half-Tone Mask (Half Tone Mask), a Single Slit diffraction Mask (Single Slit Mask) or a Gray Tone Mask (Gray Tone Mask), which is not limited herein; the etching may be dry etching or wet etching, and is not limited herein.
Based on the same inventive concept, the embodiment of the present disclosure further provides a display device, which includes the display substrate provided by the embodiment of the present disclosure. Since the principle of the display device to solve the problem is similar to that of the display substrate, the display device can be implemented according to the embodiment of the display substrate, and repeated descriptions are omitted.
In some embodiments, the display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, an intelligent watch, a fitness wrist strap, and a personal digital assistant. The display device includes but is not limited to: radio frequency unit, network module, audio output & input unit, sensor, display unit, user input unit, interface unit, memory, processor, and power supply. In addition, it may be understood by those skilled in the art that the above-described structure does not constitute a limitation of the above-described display device provided by the embodiments of the present disclosure, in other words, more or less components described above may be included in the above-described display device provided by the embodiments of the present disclosure, or some components may be combined, or different component arrangements may be provided.
It will be apparent to those skilled in the art that various changes and modifications can be made in the present disclosure without departing from the spirit and scope of the disclosure. Thus, if such modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include such modifications and variations as well.
Claims (15)
1. A display substrate, comprising:
the display device comprises a substrate base plate, a display area and a non-display area, wherein the substrate base plate comprises the display area and the non-display area adjacent to the display area;
the inorganic packaging layer is positioned on the substrate and completely covers the display area and extends from the display area to the non-display area;
the inorganic packaging layer is arranged on the substrate base plate, the substrate base plate is arranged on the inorganic packaging layer, the substrate base plate is arranged on the substrate base plate, the inorganic packaging layer is arranged on the substrate base plate, the substrate base plate is arranged in the non-display area in a surrounding mode, the substrate base plate is arranged on the substrate base plate in a surrounding mode, and the substrate base plate is arranged on the substrate base plate in a surrounding mode.
2. The display substrate according to claim 1, wherein the partition structure comprises a first partition, a second partition and a third partition sequentially arranged along a direction away from the substrate, and the orthographic projections of the first partition and the third partition on the substrate respectively completely cover the orthographic projection of the second partition on the substrate;
the distance from the edge of the orthographic projection of the third partition part of the at least one partition structure on the substrate base plate to the adjacent edge of the orthographic projection of the second partition part on the substrate base plate is greater than the corresponding distance of the other partition structures.
3. The display substrate of claim 2, wherein a difference between a distance from an edge of the orthographic projection of the third partition in the at least one partition structure to an adjacent edge of the orthographic projection of the second partition in the substrate base and a corresponding distance in the other partition structures is greater than or equal to 1 μm.
4. The display substrate according to claim 2, wherein the second partition of the at least one partition structure has a height in a direction perpendicular to the substrate base plate that is greater than a height of the second partitions of the other partition structures in the direction perpendicular to the substrate base plate.
5. The display substrate according to claim 4, wherein a difference between a height of the second partition of the at least one partition structure in a direction perpendicular to the substrate base plate and a height of the second partition of the other partition structure in the direction perpendicular to the substrate base plate is greater than or equal to
6. The display substrate of any one of claims 1-5, wherein at least one of the other partition structures is located between the at least one partition structure and the display area.
7. The display substrate of claim 6, wherein all of the other partition structures are located between the at least one partition structure and the display area.
8. The display substrate of claim 6, wherein at least one of the other partition structures is located between the at least one partition structure and the display area, and the others are located on a side of the at least one partition structure away from the display area.
9. The display substrate of any one of claims 1-5, wherein the inorganic encapsulation layer comprises a first inorganic encapsulation layer and a second inorganic encapsulation layer in a stacked arrangement;
the display substrate further comprises an organic encapsulation layer between the first inorganic encapsulation layer and the second inorganic encapsulation layer;
the organic packaging layer completely covers the display area and extends from the display area to the non-display area, and the organic packaging layer is arranged at each partition structure in a disconnected mode.
10. The display substrate of any one of claims 1-5, further comprising: the switching electrode is positioned between the inorganic packaging layer and the substrate base plate in the display area, and the anode is positioned between the switching electrode and the inorganic packaging layer, and the switching electrode is electrically connected with the anode;
the partition structure and the switching electrode are arranged in the same layer and the same material.
11. The display substrate of claim 10, wherein the non-display area is located around the display area, the non-display area on a side of the display area including a binding area;
in the non-display area including the binding area, the isolation structures extend along the direction in which the binding area points to the display area on both sides of an area between the binding area and the display area, and in the other non-display areas, the isolation structures are arranged around the display area.
12. The display substrate of any one of claims 1-5, wherein the display substrate is circular, elliptical, or heart-shaped in shape.
13. The display substrate according to any one of claims 2 to 5, further comprising an insulating structure and an anode metal in the non-display region on a side of the partition structure facing away from the substrate base in this order, wherein the anode metal is in contact with the partition structure through a via hole penetrating the insulating structure.
14. The display substrate of claim 13, wherein an orthographic projection of the anode metal on the substrate base is within an orthographic projection of the third partition on the substrate base, and wherein an orthographic projection of the insulating structure on the substrate base is within an orthographic projection of the anode metal on the substrate base.
15. A display device comprising the display substrate according to any one of claims 1 to 14.
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| CN113540201B (en) | 2024-04-23 |
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