CN111816665A - Display panel and display device - Google Patents

Display panel and display device Download PDF

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Publication number
CN111816665A
CN111816665A CN202010604418.9A CN202010604418A CN111816665A CN 111816665 A CN111816665 A CN 111816665A CN 202010604418 A CN202010604418 A CN 202010604418A CN 111816665 A CN111816665 A CN 111816665A
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China
Prior art keywords
layer
substrate
crack
display panel
display area
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CN202010604418.9A
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Chinese (zh)
Inventor
邓冰
苏伯昆
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Hefei Visionox Technology Co Ltd
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Hefei Visionox Technology Co Ltd
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Priority to CN202010604418.9A priority Critical patent/CN111816665A/en
Publication of CN111816665A publication Critical patent/CN111816665A/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate

Abstract

The invention discloses a display panel and a display device, wherein the display panel comprises: a substrate; the packaging structure is positioned on one side of the substrate; the dam and the crack blocking structure are positioned in the non-display area and positioned on the same side of the substrate as the packaging structure, and the crack blocking structure is positioned on one side of the dam away from the display area; wherein one end of the crack barrier structure far away from the substrate is arranged beyond one end of the dam far away from the substrate. The crack separation structure can separate the effect that the crack of the inorganic packaging layer extends to the display area, can also prevent the overflow of the organic packaging layer, can save a dam relative to the prior art, and then can reduce the frame of the display panel, and achieve the effect of a narrow frame.

Description

Display panel and display device
Technical Field
The present application relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
With the development of information technology, display panels play an increasingly indispensable role in the life of people, and in use, people seek high screen occupation ratio and put forward higher and higher requirements on the frame narrowing of the display panels.
However, in the conventional display panel, the bezel is large, and an ideal narrow bezel effect cannot be achieved, so that the user experience of the display panel is still further improved.
Disclosure of Invention
In view of this, the present application provides a display panel and a display device to reduce a frame of the display panel and achieve an effect of a narrow frame.
In a first aspect, an embodiment of the present invention provides a display panel, which is divided into a display area and a non-display area disposed around the display area, and includes: a substrate; the packaging structure is positioned on one side of the substrate; the dam and the crack blocking structure are positioned in the non-display area and positioned on the same side of the substrate as the packaging structure, and the crack blocking structure is positioned on one side of the dam away from the display area; wherein one end of the crack barrier structure far away from the substrate is arranged beyond one end of the dam far away from the substrate.
Optionally, the width of the crack barrier structure gradually decreases along the direction from the package structure to the substrate.
Optionally, the crackle separation structure is for falling trapezoidal, the crackle separation structure includes inside wall, lateral wall and diapire, the diapire is close to the base plate sets up, the inside wall is located the lateral wall with between the display area, wherein, the inside wall with the contained angle of diapire is first interior angle, the lateral wall with the contained angle of diapire is the second interior angle, first interior angle is less than or equal to the second interior angle, just the second interior angle is the obtuse angle.
Optionally, the second interior angle is greater than or equal to 120 °.
Optionally, crackle separation structure includes inside wall, lateral wall and diapire, the diapire is close to the base plate sets up, the inside wall is located the lateral wall with between the display area, the inside wall is a plane, and the perpendicular to the diapire sets up, the lateral wall forms the ladder shape.
Optionally, the encapsulation structure includes a first inorganic encapsulation layer, a second inorganic encapsulation layer and an organic encapsulation layer, the first inorganic encapsulation layer and the second inorganic encapsulation layer are separately disposed on two sides of the organic encapsulation layer, the first inorganic encapsulation layer is disposed on one side of the second inorganic encapsulation layer close to the substrate, along the stacking direction of the first inorganic encapsulation layer and the second inorganic encapsulation layer, one end of the crack blocking structure far away from the substrate exceeds the end of the first inorganic encapsulation layer far away from the surface of one side of the substrate.
Optionally, the thin film transistor layer, the planarization layer and the light-emitting layer are located between the substrate and the package structure and arranged along a stacking direction of the substrate and the package structure, the light-emitting layer includes a pixel defining layer, and a surface of one side of the pixel defining layer, which is far away from the substrate, includes an isolation pillar; the crack barrier structure comprises a first barrier structure, a second barrier structure and a third barrier structure which are sequentially stacked along the stacking direction of the substrate and the packaging structure, wherein the first barrier structure and the planarization layer are made of the same material and on the same layer, the second barrier structure and the pixel limiting layer are made of the same material and on the same layer, and the third barrier structure and the isolation column are made of the same material and on the same layer.
Optionally, the thin film transistor layer includes a gate electrode layer, an interlayer dielectric layer, and a source drain electrode layer, which are sequentially disposed along the stacking direction of the substrate and the package structure, and the crack blocking structure is disposed on a surface of one side of the interlayer dielectric layer, which is far away from the substrate.
Optionally, the thickness of the crack barrier structure is recorded as T, and T is greater than or equal to 4 micrometers and less than or equal to 6 micrometers.
In a second aspect, an embodiment of the present invention further provides a display device, including any one of the display panels described above.
According to the technical scheme of the embodiment of the invention, the dam and the crack blocking structure are arranged in the non-display area, the dam and the crack blocking structure are sequentially arranged along the direction far away from the display area, and one end of the crack blocking structure far away from the substrate exceeds one end of the dam far away from the substrate, so that the crack blocking structure not only can play a role in blocking cracks of the inorganic packaging layer from extending to the display area, but also can prevent the organic packaging layer in the packaging structure from overflowing.
Drawings
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of another display panel provided in the embodiment of the present application;
fig. 3 is a schematic top view of a display panel according to an embodiment of the present disclosure.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In a display panel in the prior art, for example, an Organic Light-Emitting Diode (OLED) display panel needs to be packaged by a packaging structure to prevent water and oxygen from invading and corroding the display panel, wherein a film packaging structure is typical, the film packaging structure is generally formed by laminating an Organic packaging layer and an inorganic layer, the inorganic layer has a better function of preventing water and oxygen from invading, the Organic packaging layer is disposed between the inorganic layers to prevent water and oxygen on the one hand and provide a stress buffering function on the other hand, but the material for forming the Organic packaging layer has fluidity, two dams are generally disposed, generally, a first dam near a display area is used for limiting a boundary surface of the Organic packaging layer, if the Organic packaging layer overflows, current is limited by a second dam far away from the display area, but the arrangement of the two dams causes a wider frame of the display panel, therefore, the existing display panel can not realize narrow-frame display.
For solving this defect, the application provides a display panel, as figure 1, through keeping away from crackle separation structure the one end of base plate surpasses the dykes and dams are kept away from the one end setting of base plate, and then make the crackle separation structure can effectively separate the crackle of inorganic encapsulated layer and extend to the display area, simultaneously, the organic encapsulated layer that prevents among the encapsulated structure that can be fine takes place the overflow, can reach the effect of narrow frame for prior art.
The application provides a display panel, including: a substrate 101; a package structure 102 located at one side of the substrate 101; a dam 103 and a crack barrier structure 104 located in the non-display area BA and located on the same side of the substrate 101 as the encapsulation structure 102, wherein the crack barrier structure 104 is located on a side of the dam 103 away from the display area AA; wherein an end of the crack stop structure 104 remote from the substrate 101 is disposed beyond an end of the dam 103 remote from the substrate 101.
Referring to fig. 1 to 3, the non-display area BA of the display panel includes a dam 103 and a crack blocking structure 104, and the dam 103 and the crack blocking structure 104 are sequentially disposed along a direction away from the display area AA, the encapsulation structure 102 at least includes an organic encapsulation layer 1022, a material of the organic encapsulation layer 1022 has fluidity, and the dam 103 is used for defining an edge of the organic encapsulation layer 1022 to play a role of preventing overflow; after the display panel completes the packaging process, it needs to perform cutting processing at the edge position, the edge position of the display panel is provided with an inorganic layer shadow area, when the shadow area is cut, a crack can be generated on the inorganic layer, when the crack propagates to the display area AA, the packaging failure can be caused, the crack blocking structure 104 is arranged between the cutting line C and the display area AA, specifically, between the cutting line C and the dam 103, and one end of the crack blocking structure 104, which is far away from the substrate 101, is arranged beyond one end of the dam 103, which is far away from the substrate 101, so that, on one hand, the inorganic layer in the packaging structure 102 can be disconnected at the position of the crack blocking structure 104, the crack cannot extend to the display area AA along the inorganic packaging layer, on the other hand, the overflow of the organic packaging layer 1022 can be further prevented, a dam is omitted compared with the prior art, and.
It can be understood that in the embodiment of the present application, in the non-display area BA, including the dam 103 and the crack blocking structure 104, the dam 103 and the crack blocking structure 104 are both disposed around the display area AA, and the crack blocking structure 104 is located on a side of the dam 103 away from the display area AA, the number of the dams 103 may be one, and compared with the prior art that has two dams, the bezel width of the display panel is reduced.
In one embodiment, the width of the crack stop structure 104 gradually decreases along the direction from the package structure 102 to the substrate 101.
Specifically, one end of the crack stop structure 104 away from the substrate 101 has the maximum width, and the width of the crack stop structure 104 gradually decreases along the direction close to the substrate 101, so that the inorganic encapsulation layer can be broken at the position of the crack stop structure 104, and further, the crack generated by cutting is prevented from extending to the display area AA.
In an embodiment, the crack blocking structure 104 is an inverted trapezoid, the crack blocking structure 104 includes an inner side wall, an outer side wall and a bottom wall, the bottom wall is close to the substrate 101, the inner side wall is located the outer side wall and between the display areas AA, wherein the inner side wall and the included angle of the bottom wall are first inner angles, the outer side wall and the included angle of the bottom wall are second inner angles, the first inner angles are smaller than or equal to the second inner angles, and the second inner angles are obtuse angles.
Specifically, referring to fig. 1, the longitudinal cross section of the crack blocking structure 104 is an inverted trapezoid, the longitudinal cross section is a cross section perpendicular to the substrate 101, the width of the crack blocking structure 104 gradually decreases along the direction from the package structure 102 to the substrate 101, and a second inner angle between the outer side wall of the crack blocking structure 104 and the bottom wall is an obtuse angle, so that the inorganic package layer can be broken at the position of the crack blocking structure 104, and further, the crack generated by cutting is prevented from extending to the display area AA.
In one embodiment, the second interior angle is greater than or equal to 120.
By setting the second internal angle to be equal to or larger than 120 degrees, an effective slope is formed between the crack blocking structure 104 and the array substrate, and the crack blocking structure 104 can better break the inorganic packaging layer and prevent the extension of the cutting crack. On the other hand, the second inner angle may be set to be not greater than 145 °, the second inner angle should not be too large under the requirements of height and strength, the crack blocking structure 104 has sufficient strength by setting the second inner angle to be not greater than 145 °, and the end of the crack blocking structure 104 away from the substrate 101 is not too wide under the requirement of height, thereby being beneficial to ensuring the narrow frame effect of the display panel. Illustratively, the second interior angle may be 125 °, 130 °, 140 °, to which the present embodiment is not limited.
In one embodiment, the crack barrier structure 104 includes an inner sidewall, an outer sidewall and a bottom wall, the bottom wall is close to the substrate 101, the inner sidewall is located between the outer sidewall and the display area AA, the inner sidewall is a plane and perpendicular to the bottom wall, and the outer sidewall forms a step shape.
Referring to fig. 2, the width of the crack barrier structure 104 is gradually reduced along the direction close to the substrate 101, the inner sidewall of the crack barrier structure 104 is a plane perpendicular to the bottom wall, and the outer sidewall forms a step shape, so that the top end of the crack barrier structure 104 opposite to the bottom wall has the maximum width, and the width is gradually reduced from the top end to the bottom wall, which can well break the inorganic encapsulation layer and prevent the crack from extending to the display area. Specifically, the planarization layer 107, the pixel defining layer 106, and the isolation pillars may be etched at positions corresponding to the crack blocking structures 104 by a plurality of patterning processes, one side edge corresponding to the inner sidewall is aligned with one side edge corresponding to the outer sidewall, and one side edge corresponding to the outer sidewall is aligned with one side edge, respectively, to form a preform in which the inner and outer sidewalls are both planar and perpendicular to the substrate 101, further, a surface of one side of the planarization layer 107 away from the display region in the preform is processed by an ashing process to form a first blocking structure 1041, a width of the first blocking structure 1041 is smaller than a width of the third blocking structure 1043, which can well break the inorganic encapsulation layer, at this time, the first blocking structure 1041 is made of an organic material, it can be understood that the second blocking structure 1042 may also be made of an organic material, and similarly processed by an ashing process to obtain a second blocking structure 1042 having a width smaller than the first blocking structure 1041, the above is only an exemplary description, the first barrier structure 1041, the second barrier structure 1042, and the third barrier structure may not be fabricated on the same layer as the material layer of the display region, or may be separately formed after completing the fabrication of each material layer of the display region.
The outer side wall of the crack barrier structure 104 is in a step shape, so that the inorganic packaging layer can be well disconnected, and the propagation of cutting cracks to the display area AA is blocked; the inside wall of the crack blocking structure 104 is a plane and perpendicular to the bottom wall of the crack blocking structure 104, so that the inorganic packaging layer can form a more complete water and oxygen blocking system with the inside wall of the crack blocking structure 104, and the effect of preventing water and oxygen intrusion is improved.
In one embodiment, the encapsulation structure 102 includes a first inorganic encapsulation layer 1021, a second inorganic encapsulation layer 1023, and an organic encapsulation layer 1022, the first inorganic encapsulation layer 1021 and the second inorganic encapsulation layer 1023 are respectively disposed on two sides of the organic encapsulation layer 1022, the first inorganic encapsulation layer 1021 is disposed on one side of the second inorganic encapsulation layer 1023 close to the substrate 101, and one end of the crack barrier structure 104 away from the substrate 101 is disposed beyond one side surface of the first inorganic encapsulation layer 1021 away from the substrate 101 along a stacking direction of the first inorganic encapsulation layer 1021 and the second inorganic encapsulation layer 1023.
The package structure 102 includes a first inorganic package layer 1021, an organic package layer 1022, and a second inorganic package layer 1023 stacked in sequence, where the first package layer 1021 at least covers the display area AA and the dam 103, a distance between the first inorganic package layer 1021 corresponding to the dam 102 and the substrate 101 is denoted as D1, a distance between one end of the crack barrier structure 104 away from the substrate 101 and the substrate 101 is denoted as D2, where D1 is smaller than D2, and thus, when the organic package layer 1022 overflows between the dam 103 and the crack barrier structure 104, the crack barrier structure 104 can better prevent overflow.
In one embodiment, the display panel includes a thin film transistor layer, a planarization layer 107, and a light-emitting layer 105 disposed between the substrate 101 and the encapsulation structure 102 and along a stacking direction of the substrate 101 and the encapsulation structure 102, the light-emitting layer 105 includes a pixel defining layer 106, and a side surface of the pixel defining layer 106 away from the substrate includes isolation pillars (not shown);
along the stacking direction of the substrate 101 and the package structure 102, the crack barrier structure 104 includes a first barrier structure 1041, a second barrier structure 1042, and a third barrier structure 1043, which are sequentially stacked, where the first barrier structure 1041 and the planarization layer 107 are made of the same material and in the same layer, the second barrier structure 1042 and the pixel definition layer 106 are made of the same material and in the same layer, and the third barrier structure 1043 and the isolation pillar are made of the same material and in the same layer. The planarization layer 107 and the pixel defining layer 106 may be made of organic or inorganic materials, and the isolation pillars may be made of inorganic materials. Specifically, the first blocking structure 1041, the second blocking structure 1042, and the third blocking structure 1043 may be formed by a single patterning process or multiple patterning processes, and it is understood that the crack blocking structure 104 may also be formed separately and not formed in the same layer as the planarization layer 107, the pixel defining layer 106, and the isolation pillar.
In one embodiment, the thin film transistor layer includes a gate layer 1082, an interlayer dielectric layer 1085, and a source/drain electrode layer 1081 sequentially disposed along a stacking direction of the substrate 101 and the package structure 102, and the crack blocking structure 104 is disposed on a surface of one side of the interlayer dielectric layer 1085, which is far away from the substrate 101.
Specifically, a thin film transistor layer is disposed in the display area AA, and the thin film transistor layer includes an active layer 1083, a gate layer 1082, and a source drain electrode layer 1081, where the source drain electrode layer 1081 includes a source electrode and a drain electrode, the source electrode and the drain electrode are respectively connected to the active layer 1083 through vias, the thin film transistor layer further includes a gate insulating layer 1084 located between the active layer 1083 and the gate layer 1082, a planarization layer 11 is further disposed between the source drain electrode layer 1081 and the light-emitting layer 105, the planarization layer 11 can make a surface of the substrate 101 on which the thin film transistor structure is formed more flat, so as to form a light-emitting unit thereon, a buffer layer 109 is further disposed between the thin film transistor layer and the substrate 101, and the crack blocking structure is disposed on a side surface of the interlayer dielectric.
In one embodiment, the thickness of the crack stop feature 104 is denoted as T, and T is 4 microns or less and 6 microns or less.
Specifically, T is not less than 4 microns and not more than 6 microns in thickness of the crack blocking structure 104, on one hand, the inorganic encapsulation layer can be effectively disconnected, the cutting crack is prevented from extending to the display area AA, on the other hand, when the organic encapsulation layer 1022 overflows between the dam 103 and the crack blocking structure 104, a further anti-overflow effect can be better exerted, and compared with the prior art, a dam can be omitted, so that the display panel can realize narrow-frame display. The inventor researches and discovers that when the thickness T of the crack blocking structure 104 is greater than or equal to 4 micrometers and less than or equal to 6 micrometers, compared with the prior art, two dams can be omitted, the crack blocking structure 104 can play a role in blocking the cutting cracks from extending to the display area AA on the one hand, and can play a role in preventing the organic packaging layer 1022 from overflowing on the other hand, the display panel only realizes the role in preventing the organic packaging layer 1022 from overflowing through the crack blocking structure 104, and does not need to additionally arrange the dam 103, so that the frame of the display panel is further reduced, and the narrow-frame effect is achieved.
The embodiment of the invention also provides a display device which comprises any one of the display panels.
The display device can be an electronic device with a display screen, such as a mobile phone, a personal computer, an intelligent watch, an intelligent bracelet and the like.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A display panel divided into a display area and a non-display area provided around the display area, comprising:
a substrate;
the packaging structure is positioned on one side of the substrate;
the dam and the crack blocking structure are positioned in the non-display area and positioned on the same side of the substrate as the packaging structure, and the crack blocking structure is positioned on one side of the dam away from the display area;
wherein one end of the crack barrier structure far away from the substrate is arranged beyond one end of the dam far away from the substrate.
2. The display panel according to claim 1, wherein the width of the crack stop structure gradually decreases in a direction from the encapsulation structure toward the substrate.
3. The display panel according to claim 2, wherein the crack blocking structure is an inverted trapezoid, the crack blocking structure includes an inner sidewall, an outer sidewall, and a bottom wall, the bottom wall is disposed close to the substrate, the inner sidewall is disposed between the outer sidewall and the display area, wherein an included angle between the inner sidewall and the bottom wall is a first inner angle, an included angle between the outer sidewall and the bottom wall is a second inner angle, the first inner angle is smaller than or equal to the second inner angle, and the second inner angle is an obtuse angle.
4. The display panel of claim 3, wherein the second interior angle is greater than or equal to 120 °.
5. The display panel according to claim 2, wherein the crack barrier structure comprises an inner sidewall, an outer sidewall and a bottom wall, the bottom wall is disposed near the substrate, the inner sidewall is disposed between the outer sidewall and the display area, the inner sidewall is a plane and perpendicular to the bottom wall, and the outer sidewall forms a step shape.
6. The display panel of claim 1, wherein the encapsulation structure comprises a first inorganic encapsulation layer, a second inorganic encapsulation layer, and an organic encapsulation layer, the first inorganic encapsulation layer and the second inorganic encapsulation layer are respectively disposed on two sides of the organic encapsulation layer, and the first inorganic encapsulation layer is disposed on one side of the second inorganic encapsulation layer close to the substrate, and one end of the crack blocking structure away from the substrate is disposed beyond one side surface of the first inorganic encapsulation layer away from the substrate along a stacking direction of the first inorganic encapsulation layer and the second inorganic encapsulation layer.
7. The display panel according to claim 1, comprising a thin film transistor layer, a planarization layer, and a light-emitting layer disposed between the substrate and the encapsulation structure and along a stacking direction of the substrate and the encapsulation structure, wherein the light-emitting layer comprises a pixel defining layer, and a surface of the pixel defining layer on a side away from the substrate comprises a spacer;
the crack barrier structure comprises a first barrier structure, a second barrier structure and a third barrier structure which are sequentially stacked along the stacking direction of the substrate and the packaging structure, wherein the first barrier structure and the planarization layer are made of the same material and on the same layer, the second barrier structure and the pixel limiting layer are made of the same material and on the same layer, and the third barrier structure and the isolation column are made of the same material and on the same layer.
8. The display panel of claim 7, wherein the thin film transistor layer comprises a gate layer, an interlayer dielectric layer and a source drain electrode layer, which are sequentially arranged along a stacking direction of the substrate and the package structure, and the crack blocking structure is arranged on a surface of one side of the interlayer dielectric layer, which is far away from the substrate.
9. The display panel according to claim 1, wherein the thickness of the crack barrier structure is denoted as T, and T is 4 micrometers and less than 6 micrometers.
10. A display device comprising the display panel according to any one of claims 1 to 9.
CN202010604418.9A 2020-06-29 2020-06-29 Display panel and display device Pending CN111816665A (en)

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CN113097418A (en) * 2021-03-30 2021-07-09 京东方科技集团股份有限公司 Display panel, manufacturing method of display panel and display device
CN113540201A (en) * 2021-07-20 2021-10-22 合肥京东方卓印科技有限公司 Display substrate and display device
CN114361371A (en) * 2022-01-12 2022-04-15 京东方科技集团股份有限公司 Display substrate and display panel
WO2022262033A1 (en) * 2021-06-16 2022-12-22 武汉华星光电技术有限公司 Display panel and mobile terminal
WO2024027117A1 (en) * 2022-08-02 2024-02-08 维信诺科技股份有限公司 Display panel, display device, and preparation method for display panel
CN113540201B (en) * 2021-07-20 2024-04-23 合肥京东方卓印科技有限公司 Display substrate and display device

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