CN113539864A - Full-automatic electronic element packaging process - Google Patents
Full-automatic electronic element packaging process Download PDFInfo
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- CN113539864A CN113539864A CN202110814752.1A CN202110814752A CN113539864A CN 113539864 A CN113539864 A CN 113539864A CN 202110814752 A CN202110814752 A CN 202110814752A CN 113539864 A CN113539864 A CN 113539864A
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- electronic element
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- packaging substrate
- epoxy resin
- clamping
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- 238000012858 packaging process Methods 0.000 title claims abstract description 21
- 238000004806 packaging method and process Methods 0.000 claims abstract description 74
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 239000003822 epoxy resin Substances 0.000 claims abstract description 48
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 48
- 239000000853 adhesive Substances 0.000 claims abstract description 38
- 230000001070 adhesive effect Effects 0.000 claims abstract description 38
- 239000003292 glue Substances 0.000 claims abstract description 17
- 238000009832 plasma treatment Methods 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 150000003377 silicon compounds Chemical class 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims description 34
- 238000006243 chemical reaction Methods 0.000 claims description 20
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 claims description 15
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims description 10
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 10
- 235000019445 benzyl alcohol Nutrition 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 description 8
- 229920006332 epoxy adhesive Polymers 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a full-automatic electronic component packaging process, which comprises the following steps: s1, placing the electronic element and the packaging substrate into a vacuum chamber, and carrying out plasma treatment on the electronic element and the packaging substrate in the presence of gas containing organic silicon compounds; s2, preheating the electronic element after plasma treatment; s3, placing the preheated electronic element on a sucker of packaging equipment, coating an epoxy resin adhesive on a packaging substrate by using a glue dispensing mechanism, and sequentially moving the packaging substrate to the positions below the glue dispensing mechanism and the sucker through a clamping mechanism to bond the electronic element with the packaging substrate through the epoxy resin adhesive; and S4, placing the packaging substrate bonded with the electronic element in a curing box for curing, and completing the packaging process.
Description
Technical Field
The invention relates to the technical field of electronic element packaging, in particular to a full-automatic electronic element packaging process.
Background
Packaging means that circuit pins on a silicon chip are connected and led to external joints by using wires so as to be connected with other devices; the package form refers to a housing for mounting a semiconductor integrated circuit chip. The chip is not only used for mounting, fixing, sealing, protecting the chip and enhancing the electric heating performance, but also connected to pins of the packaging shell through the connection points on the chip by leads, and the pins are connected with other devices through the leads on the printed circuit board, thereby realizing the connection of the internal chip and an external circuit. Because the chip must be isolated from the outside to prevent the electrical performance degradation caused by the corrosion of the chip circuit by impurities in the air. On the other hand, the packaged chip is more convenient to mount and transport.
When the existing electronic element is packaged, a large amount of manpower and material resources are consumed, the packaging steps are complicated, the workload is large, meanwhile, the existing packaging effect is poor, and the electronic element is easy to fall off.
In order to solve the above-mentioned drawbacks, a technical solution is now provided.
Disclosure of Invention
The invention aims to provide a full-automatic electronic component packaging process.
The technical problems to be solved by the invention are as follows:
when the existing electronic element is packaged, a large amount of manpower and material resources are consumed, the packaging steps are complicated, the workload is large, meanwhile, the existing packaging effect is poor, and the electronic element is easy to fall off.
The purpose of the invention can be realized by the following technical scheme:
a full-automatic electronic component packaging process comprises the following steps:
s1, placing the electronic element and the packaging substrate into a vacuum chamber, and carrying out plasma treatment on the electronic element and the packaging substrate in the presence of gas containing organic silicon compounds;
s2, preheating the electronic element after plasma treatment;
s3, placing the preheated electronic element on a sucker of packaging equipment, coating an epoxy resin adhesive on a packaging substrate by using a glue dispensing mechanism, and sequentially moving the packaging substrate to the positions below the glue dispensing mechanism and the sucker through a clamping mechanism to bond the electronic element with the packaging substrate through the epoxy resin adhesive;
and S4, placing the packaging substrate bonded with the electronic element in a curing box for curing, and completing the packaging process.
Further, the preheating temperature in the step S2 is 45-55 ℃, and the time is 50-60 min.
Further, the preparation method of the epoxy resin adhesive comprises the following steps:
taking the following raw materials in parts by weight: 40-50 parts of benzyl alcohol, 25-35 parts of isophorone diamine, 16-20 parts of EP-16 epoxy resin and 5-8 parts of triethanolamine, adding the benzyl alcohol and the isophorone diamine into a reaction kettle at room temperature, stirring, adding the EP-16 epoxy resin into the reaction kettle after uniformly stirring, then stirring, adding the triethanolamine after uniformly stirring, heating the reaction kettle to 70-80 ℃, reacting at a constant temperature for 1h, cooling to 25-30 ℃ after the reaction is finished, and subpackaging to obtain the epoxy resin adhesive.
Further, the curing temperature in the step S4 is 75-80 ℃, and the time is 4-5 h.
Further, the operation process of the packaging apparatus in step S3 is as follows:
firstly, placing a packaging substrate in a clamping groove, clamping the packaging substrate through a clamping mechanism, and moving the packaging substrate to a position right below a dispensing mechanism through a clamping motor;
secondly, stirring the epoxy resin adhesive by a glue dispensing motor, and allowing the stirred epoxy resin adhesive to enter a glue dispensing funnel from the through groove and drip onto the packaging substrate;
and thirdly, continuously moving the clamping table to be under the sucker through the clamping motor, adsorbing the electronic element by using the sucker, simultaneously starting the second telescopic cylinder, driving the output end of the second telescopic cylinder to push the electronic element on the sucker to be bonded with the packaging substrate through the epoxy resin adhesive, and finishing the packaging process.
The invention has the beneficial effects that:
the invention utilizes the epoxy resin adhesive for encapsulation, has better sealing performance compared with other materials, can be directly buried in soil for utilization for some special instruments, and cannot be decomposed; through carrying out plasma treatment on the electronic element, the electronic element is not easy to fall off and delaminate, the electronic element and the packaging substrate are good in waterproofness, weather resistance and corrosion resistance, and the electronic element or the packaging substrate can be protected well for a long time.
According to the invention, the clamping motor is arranged to enable the packaging substrate to freely move between the dispensing mechanism and the sucker, so that the dispensing and packaging can be conveniently and closely connected, the integrity and the continuity of equipment are improved, the automation of the equipment is improved, the manpower and material resources are saved, and the production cost is greatly reduced.
Through setting up clamping mechanism, make the tight motor drive threaded rod of clamp rotate to drive the thread bush and slide on the threaded rod, thereby drive the encapsulation base plate that presss from both sides on the tight platform of clamp and move, press from both sides tight fixedly through the clamp spring and the clamp plate of pressing from both sides tight inslot to encapsulation base plate, the operation of the follow-up point of being convenient for is glued, improves the quality and the precision of point.
Through setting up some mechanism of gluing, make some glue motor drive first axis of rotation and rotate, thereby it stirs the epoxy adhesive to drive helical blade rotation, prevent that its self from bonding together, the effect is glued to the influence point, first axis of rotation rotates the second dead lever that drives on the first dead lever simultaneously and rotates, thereby it further stirs to drive hybrid blade to the epoxy adhesive, improve stirring efficiency, be connected through the rotation that sets up second axis of rotation and second dead lever, when making hybrid blade and epoxy adhesive contact, hybrid blade can carry out self along with the drive of epoxy adhesive and rotate, further improve stirring efficiency.
Drawings
The invention is described in further detail below with reference to the figures and specific embodiments.
FIG. 1 is a process flow for the packaging of the present invention;
FIG. 2 is a schematic structural diagram of the packaging apparatus of the present invention;
FIG. 3 is a schematic view of the clamping mechanism of the present invention;
FIG. 4 is a schematic view of the internal structure of the clamping table of the present invention;
FIG. 5 is a schematic structural view of the dispensing mechanism of the present invention;
FIG. 6 is a side view of a second fixation rod of the present invention;
fig. 7 is a rear view of a second support plate of the present invention.
In the figure, 1, a workbench; 2. a first support plate; 3. a second support plate; 4. a clamping mechanism; 401. a clamping chamber; 402. clamping the motor; 403. a threaded rod; 404. a threaded sleeve; 405. a slider; 406. a slide bar; 407. a first sliding groove; 408. a clamping table; 409. a clamping groove; 410. a clamping spring; 411. a clamping plate; 5. a second sliding groove; 6. connecting blocks; 7. a first telescopic cylinder; 8. a glue dispensing mechanism; 801. a glue dispensing chamber; 802. a connecting rod; 803. a dispensing motor; 804. a first rotating shaft; 805. a helical blade; 806. a first fixing lever; 807. a second fixing bar; 808. a second rotating shaft; 809. a mixing blade; 810. a through groove; 811. dispensing a hopper; 9. a fixing plate; 10. a second telescopic cylinder; 11. and (4) sucking discs.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description of the embodiments, structures, features and effects according to the present invention will be made with reference to the accompanying drawings and preferred embodiments.
Example 1
A full-automatic electronic component packaging process comprises the following steps:
s1, placing the electronic element and the packaging substrate into a vacuum chamber, and carrying out plasma treatment on the electronic element and the packaging substrate in the presence of gas containing organic silicon compounds;
s2, preheating the electronic element after plasma treatment;
s3, placing the preheated electronic element on a sucker 11 of packaging equipment, coating epoxy resin adhesive on a packaging substrate by using a dispensing mechanism 8, and sequentially moving the packaging substrate to the positions below the dispensing mechanism 8 and the sucker 11 through a clamping mechanism 4 to bond the electronic element with the packaging substrate through the epoxy resin adhesive;
and S4, placing the packaging substrate bonded with the electronic element in a curing box for curing, and completing the packaging process.
The preheating temperature in step S2 was 45 ℃ and the time was 50 min.
The preparation method of the epoxy resin adhesive comprises the following steps:
taking the following raw materials in parts by weight: 40 parts of benzyl alcohol, 25 parts of isophorone diamine, 16 parts of EP-16 epoxy resin and 5 parts of triethanolamine, adding the benzyl alcohol and the isophorone diamine into a reaction kettle at room temperature, stirring, adding the EP-16 epoxy resin into the reaction kettle after uniform stirring, then stirring, adding the triethanolamine after uniform stirring, heating the reaction kettle to 70 ℃, reacting for 1 hour at a constant temperature, cooling to 25 ℃ after the reaction is finished, and subpackaging to obtain the epoxy resin adhesive.
The curing temperature in step S4 was 75 ℃ and the curing time was 4 hours.
Example 2
A full-automatic electronic component packaging process comprises the following steps:
s1, placing the electronic element and the packaging substrate into a vacuum chamber, and carrying out plasma treatment on the electronic element and the packaging substrate in the presence of gas containing organic silicon compounds;
s2, preheating the electronic element after plasma treatment;
s3, placing the preheated electronic element on a sucker 11 of packaging equipment, coating epoxy resin adhesive on a packaging substrate by using a dispensing mechanism 8, and sequentially moving the packaging substrate to the positions below the dispensing mechanism 8 and the sucker 11 through a clamping mechanism 4 to bond the electronic element with the packaging substrate through the epoxy resin adhesive;
and S4, placing the packaging substrate bonded with the electronic element in a curing box for curing, and completing the packaging process.
The preheating temperature in step S2 was 50 ℃ for 55 min.
The preparation method of the epoxy resin adhesive comprises the following steps:
taking the following raw materials in parts by weight: 45 parts of benzyl alcohol, 30 parts of isophorone diamine, 18 parts of EP-16 epoxy resin and 6 parts of triethanolamine, adding the benzyl alcohol and the isophorone diamine into a reaction kettle at room temperature, stirring, adding the EP-16 epoxy resin into the reaction kettle after uniform stirring, then stirring, adding the triethanolamine after uniform stirring, heating the reaction kettle to 75 ℃, reacting for 1 hour at a constant temperature, cooling to 28 ℃ after the reaction is finished, and subpackaging to obtain the epoxy resin adhesive.
The curing temperature in step S4 was 78 ℃ and the curing time was 4.5 h.
Example 3
A full-automatic electronic component packaging process comprises the following steps:
s1, placing the electronic element and the packaging substrate into a vacuum chamber, and carrying out plasma treatment on the electronic element and the packaging substrate in the presence of gas containing organic silicon compounds;
s2, preheating the electronic element after plasma treatment;
s3, placing the preheated electronic element on a sucker 11 of packaging equipment, coating epoxy resin adhesive on a packaging substrate by using a dispensing mechanism 8, and sequentially moving the packaging substrate to the positions below the dispensing mechanism 8 and the sucker 11 through a clamping mechanism 4 to bond the electronic element with the packaging substrate through the epoxy resin adhesive;
and S4, placing the packaging substrate bonded with the electronic element in a curing box for curing, and completing the packaging process.
The preheating temperature in step S2 was 55 deg.C, and the time was 60 min.
The preparation method of the epoxy resin adhesive comprises the following steps:
taking the following raw materials in parts by weight: 50 parts of benzyl alcohol, 35 parts of isophorone diamine, 20 parts of EP-16 epoxy resin and 8 parts of triethanolamine, adding the benzyl alcohol and the isophorone diamine into a reaction kettle at room temperature, stirring, adding the EP-16 epoxy resin into the reaction kettle after uniform stirring, then stirring, adding the triethanolamine after uniform stirring, heating the reaction kettle to 70 ℃, reacting for 1 hour at a constant temperature, cooling to 30 ℃ after the reaction is finished, and subpackaging to obtain the epoxy resin adhesive.
The curing temperature in step S4 was 80 ℃ and the curing time was 5 hours.
Referring to fig. 1-7, the encapsulating apparatus in the above embodiment includes a worktable 1, two first supporting plates 2 symmetrically distributed are fixed on two sides of the upper surface of the worktable 1, a second supporting plate 3 is fixed between the top ends of the two first supporting plates 2 at the side close to each other, and a clamping mechanism 4 is arranged below the second supporting plate 3;
the clamping mechanism 4 comprises a clamping chamber 401 fixed with the upper surface of the workbench 1, a clamping motor 402 is fixed on one side of the outside of the clamping chamber 401, a threaded rod 403 is fixed at the output end of the clamping motor 402, the threaded rod 403 penetrates through the clamping chamber 401 and is rotatably connected with the inner side wall of the clamping chamber 401, a threaded sleeve 404 is sleeved on the outer surface of the threaded rod 403, the threaded sleeve 404 is in threaded connection with the threaded rod 403, a sliding block 405 is fixed at the bottom of the threaded sleeve 404, the bottom of the sliding block 405 is in sliding connection with the inner bottom end of the clamping chamber 401, two symmetrically distributed sliding rods 406 are fixed at the top of the threaded sleeve 404, a first sliding groove 407 matched with the sliding rods 406 is formed at the top of the clamping chamber 401, the two sliding rods 406 penetrate through the first sliding groove 407 and are in sliding connection with the first sliding groove 407, and a clamping table 408 is fixed between the top ends of the two sliding rods 406;
the upper surface of the clamping table 408 is provided with a clamping groove 409, the clamping groove 409 is used for placing a packaging substrate, two side walls inside the clamping groove 409 are fixedly provided with clamping springs 410 which are symmetrically distributed, one end of each clamping spring 410, which is far away from the inner wall of the clamping groove 409, is fixedly provided with a clamping plate 411, and the bottom of each clamping plate 411 is slidably connected with the bottom end inside the clamping groove 409. Through setting up clamping mechanism 4, make clamping motor 402 drive threaded rod 403 rotate to drive thread bush 404 and slide on threaded rod 403, thereby drive the encapsulation base plate on the clamp platform 408 and remove, press from both sides tight fixedly through clamping spring 410 and the clamp plate 411 in the clamp groove 409 to the encapsulation base plate, the operation of the follow-up point of being convenient for is glued, improves the quality and the precision of point.
The second sliding groove 5 that the symmetric distribution was seted up to the one side that two first backup pads 2 were close to each other, and one side sliding connection of second sliding groove 5 has connecting block 6, and the upper surface both sides of workstation 1 are fixed with the first telescopic cylinder 7 of symmetric distribution, and the output of two first telescopic cylinder 7 is fixed with the bottom of two connecting blocks 6 respectively.
A dispensing mechanism 8 is arranged on one side of the second support plate 3, the dispensing mechanism 8 comprises a dispensing chamber 801, an epoxy resin adhesive is placed in the dispensing chamber 801, connecting rods 802 are symmetrically distributed and fixed at two outer ends of the dispensing chamber 801, one end of each connecting rod 802 far away from the dispensing chamber 801 is fixed with one side of each connecting block 6, a dispensing motor 803 is fixed at the top end of the outer portion of the dispensing chamber 801, a first rotating shaft 804 is fixed at the output end of the dispensing motor 803, the first rotating shaft 804 penetrates through the dispensing chamber 801 and is rotatably connected with the top of the dispensing chamber 801, a helical blade 805 is fixed on the outer surface of the first rotating shaft 804, the helical blade 805 is used for stirring the epoxy resin adhesive to prevent the epoxy resin adhesive from being adhered together, and the dispensing effect is affected, first fixing rods 806 are symmetrically distributed and fixed on two sides of the top end of the first rotating shaft 804, a second fixing rod 807 is fixed at the bottom of the first fixing rod 806 far away from the first rotating shaft 804, the front end and the rear end of the second fixing rod 807 are rotatably connected with two symmetrically distributed second rotating shafts 808, the top and the bottom of the second rotating shafts 808 are fixed with symmetrically distributed mixing blades 809, the bottom of the dispensing chamber 801 is provided with a through groove 810, the external bottom end of the dispensing chamber 801 is fixed with a dispensing funnel 811, and the dispensing funnel 811 is communicated with the dispensing chamber 801 through the through groove 810. Through setting up some gum machine 8, make some gum machine 803 drive first rotation axis 804 and rotate, thereby drive helical blade 805 and rotate and stir the epoxy adhesive, prevent that its self from bonding together, the effect is glued to the influence point, first rotation axis 804 rotates the second dead lever 807 that drives on the first dead lever 806 simultaneously and rotates, thereby it further stirs to drive hybrid blade 809 to the epoxy adhesive, improve stirring efficiency, be connected through the rotation that sets up second rotation axis 808 and second dead lever 807, when making hybrid blade 809 contact with the epoxy adhesive, hybrid blade 809 can carry out self along with the drive of epoxy adhesive and rotate, further improve stirring efficiency.
One side that the dispensing mechanism 8 was kept away from to second backup pad 3 is fixed with fixed plate 9, and the top of fixed plate 9 is fixed with the flexible cylinder 10 of second, and the output of the flexible cylinder 10 of second passes fixed plate 9 and is fixed with sucking disc 11, and sucking disc 11 is used for adsorbing electronic component to bond it and packaging substrate mutually through the flexible cylinder 10 of second, accomplish the encapsulation process.
The working principle is as follows:
when the packaging substrate clamp is used, a packaging substrate is firstly placed in the clamping groove 409, the two clamping springs 410 are used for pushing the two clamping plates 411 to mutually approach to clamp and fix the packaging substrate, the clamping motor 402 is started to drive the output end of the clamping motor to drive the threaded rod 403 to rotate, the threaded rod 403 is in threaded connection with the threaded sleeve 404, the threaded sleeve 404 is driven to slide on the threaded rod 403 by matching with the sliding connection of the sliding block 405 and the clamping chamber 401, and therefore the sliding rod 406 drives the clamping table 408 to move in the horizontal direction until the clamping table moves to the position right below the glue dispensing mechanism 8;
the glue dispensing motor 803 is started, the output end of the glue dispensing motor is driven to drive the first rotating shaft 804 to rotate, so that the spiral blade 805 is driven to rotate to stir the epoxy resin adhesive, meanwhile, the first rotating shaft 804 rotates to drive the second fixing rod 807 on the first fixing rod 806 to rotate, so that the mixing blade 809 is driven to further stir the epoxy resin adhesive, through the rotary connection of the second rotating shaft 808 and the second fixing rod 807, when the mixing blade 809 rotates to be in contact with the epoxy resin adhesive, the mixing blade 809 can rotate by itself along with the driving of the epoxy resin adhesive, the stirring effect is enhanced, and the stirred epoxy resin adhesive enters the glue dispensing funnel 811 from the through groove 810 and drops on the packaging substrate;
and continuously starting the clamping motor 402 to enable the clamping table 408 to continuously move to the position right below the sucker 11, sucking the electronic element by using the sucker 11, simultaneously starting the second telescopic cylinder 10, driving the output end of the second telescopic cylinder to push the electronic element on the sucker 11 to be bonded with the packaging substrate by using the epoxy resin adhesive, and finishing the packaging process.
Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (5)
1. A full-automatic electronic component packaging process is characterized by comprising the following steps:
s1, placing the electronic element and the packaging substrate into a vacuum chamber, and carrying out plasma treatment on the electronic element and the packaging substrate in the presence of gas containing organic silicon compounds;
s2, preheating the electronic element after plasma treatment;
s3, placing the preheated electronic element on a sucker (11) of packaging equipment, coating epoxy resin adhesive on a packaging substrate by using a glue dispensing mechanism (8), and sequentially moving the packaging substrate to the positions below the glue dispensing mechanism (8) and the sucker (11) through a clamping mechanism (4) to bond the electronic element with the packaging substrate through the epoxy resin adhesive;
and S4, placing the packaging substrate bonded with the electronic element in a curing box for curing, and completing the packaging process.
2. The process of claim 1, wherein the preheating temperature in step S2 is 45-55 ℃ for 50-60 min.
3. The full-automatic electronic component packaging process according to claim 1, wherein the preparation method of the epoxy resin adhesive comprises the following steps:
taking the following raw materials in parts by weight: 40-50 parts of benzyl alcohol, 25-35 parts of isophorone diamine, 16-20 parts of EP-16 epoxy resin and 5-8 parts of triethanolamine, adding the benzyl alcohol and the isophorone diamine into a reaction kettle at room temperature, stirring, adding the EP-16 epoxy resin into the reaction kettle after uniformly stirring, then stirring, adding the triethanolamine after uniformly stirring, heating the reaction kettle to 70-80 ℃, reacting at a constant temperature for 1h, cooling to 25-30 ℃ after the reaction is finished, and subpackaging to obtain the epoxy resin adhesive.
4. The process of claim 1, wherein the curing temperature in step S4 is 75-80 ℃ for 4-5 h.
5. The fully automatic electronic component packaging process according to claim 1, wherein the packaging device in step S3 operates as follows:
firstly, placing a packaging substrate in a clamping groove (409), clamping the packaging substrate through a clamping mechanism (8), and moving the packaging substrate to the position right below a dispensing mechanism (8) through a clamping motor (402);
secondly, stirring the epoxy resin adhesive by a glue dispensing motor (803), and allowing the stirred epoxy resin adhesive to enter a glue dispensing funnel (811) from a through groove (810) and drip onto the packaging substrate;
and thirdly, continuously moving the clamping table (408) to be under the sucker (11) through the clamping motor (402), adsorbing the electronic element by using the sucker (11), simultaneously starting the second telescopic cylinder (10), driving the output end of the second telescopic cylinder to push the electronic element on the sucker (11) to be adhered with the packaging substrate through an epoxy resin adhesive, and finishing the packaging process.
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