CN113518030B - 双模模间协同方法及电力物联网络系统 - Google Patents
双模模间协同方法及电力物联网络系统 Download PDFInfo
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- H04L45/00—Routing or path finding of packets in data switching networks
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CN114087727B (zh) * | 2021-11-11 | 2023-08-15 | 珠海格力节能环保制冷技术研究中心有限公司 | 无线配对方法、装置、系统、上下位机节点及空调机组 |
CN114339466B (zh) * | 2021-12-17 | 2023-08-29 | 苏州卓智创芯电子科技有限公司 | 一种hplc和微功率无线设备混装的抄表系统及方法 |
CN114465705B (zh) * | 2022-04-08 | 2022-06-17 | 北京智芯微电子科技有限公司 | 信标时隙分配方法、装置及设备 |
CN116708274B (zh) * | 2023-08-09 | 2023-10-20 | 北京智芯微电子科技有限公司 | 多模异构网络的路由规划方法及系统、通信设备 |
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CN101694739B (zh) * | 2009-10-10 | 2011-04-20 | 江苏省电力公司南京供电公司 | 一种双通道多功能电能信息采集器及其通讯方法 |
CN102832971B (zh) * | 2012-09-05 | 2014-11-05 | 重庆市电力公司电力科学研究院 | 一种基于电力线通信的协同组网系统及通信方法 |
CN103400492B (zh) * | 2013-06-24 | 2016-12-28 | 深圳市国电科技通信有限公司 | 融合电力线和无线通信的双模通信芯片及采集设备 |
US20160006842A1 (en) * | 2014-07-02 | 2016-01-07 | Qualcomm Incorporated | Frame format supporting enhanced features in a communication network |
CN106301475B (zh) * | 2016-09-22 | 2020-04-21 | 湖南华烨智能通信技术股份有限公司 | 基于电力线载波通信的系统、桥接节点及方法 |
CN108449115B (zh) * | 2018-01-04 | 2020-09-08 | 北京智芯微电子科技有限公司 | 基于信噪比优选的载波和无线物理层融合的系统及方法 |
CN110138703B (zh) * | 2018-09-11 | 2021-08-24 | 深圳市国芯智源微电子有限公司 | 基于ieee1901.1通信标准的电力双模通信方法 |
CN110191029B (zh) * | 2019-04-25 | 2022-01-07 | 深圳市国电科技通信有限公司 | 一种基于有线和无线的混合双模组网方法 |
CN110176948A (zh) * | 2019-06-26 | 2019-08-27 | 杭州罗万信息科技有限公司 | LoRa+PLC双模内置模块及使用该模块的通讯结构和通讯方法 |
CN111601317A (zh) * | 2020-04-27 | 2020-08-28 | 国网河北省电力有限公司电力科学研究院 | 一种hplc和hrf异构网络的组网方法 |
CN111583614A (zh) * | 2020-04-30 | 2020-08-25 | 广东电网有限责任公司 | 一种适用于电能表的LoRa和载波双模内置通信模块 |
CN111864876B (zh) * | 2020-07-06 | 2022-04-29 | 国网思极紫光(青岛)微电子科技有限公司 | 双模通信单元的供电方法、双模通信单元及智能电能表 |
CN112165722A (zh) * | 2020-09-14 | 2021-01-01 | 山东电工电气集团有限公司 | 一种适用于低压配电台区的通信方法 |
CN113015229B (zh) * | 2020-12-29 | 2022-09-30 | 国家电网有限公司 | 基于电力线载波和无线的双模融合自组网的组网方法 |
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Address after: 100192 building 3, A District, Dongsheng science and Technology Park, Zhongguancun, 66 Haidian District West Road, Beijing. Patentee after: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY Co.,Ltd. Patentee after: Qingdao Zhixin Semiconductor Technology Co.,Ltd. Patentee after: STATE GRID CORPORATION OF CHINA Patentee after: STATE GRID INFORMATION & TELECOMMUNICATION GROUP Co.,Ltd. Address before: 100192 building 3, A District, Dongsheng science and Technology Park, Zhongguancun, 66 Haidian District West Road, Beijing. Patentee before: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY Co.,Ltd. Patentee before: State Grid Sigi Ziguang (Qingdao) Microelectronics Technology Co.,Ltd. Patentee before: STATE GRID CORPORATION OF CHINA Patentee before: STATE GRID INFORMATION & TELECOMMUNICATION GROUP Co.,Ltd. |
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