CN113512382B - Peelable adhesive and preparation method and application thereof - Google Patents

Peelable adhesive and preparation method and application thereof Download PDF

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CN113512382B
CN113512382B CN202110856107.6A CN202110856107A CN113512382B CN 113512382 B CN113512382 B CN 113512382B CN 202110856107 A CN202110856107 A CN 202110856107A CN 113512382 B CN113512382 B CN 113512382B
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adhesive
peelable adhesive
parts
solvent
peelable
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CN113512382A (en
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叶振文
夏建文
黄明起
刘彬灿
易玉玺
刘献伟
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Shenzhen Samcien Semiconductor Materials Co ltd
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Shenzhen Samcien Semiconductor Materials Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

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  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
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  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention provides a peelable adhesive and a preparation method and application thereof. The method of making the peelable adhesive comprises the steps of: mixing and reacting an acrylate monomer, a hardening agent, a UV photoinitiator, a polynitrogen compound, an optional diluent and an optional solvent to obtain the peelable adhesive. The adhesive has the characteristics of strong adhesive force and easy peeling after UV light irradiation, and can be used for semiconductor material layering.

Description

Peelable adhesive and preparation method and application thereof
Technical Field
The invention belongs to the technical field of semiconductor material layering processing, and particularly relates to a peelable adhesive and a preparation method and application thereof.
Background
When tiny components such as wafers are ground, various silicon wafers, packaging substrates, ceramics, glass, crystal fine electronic parts, glass, metal plates and the like are processed, an adhesive tape is generally required to be used for fixing the tiny components, so that damage caused by movement of the components in a cutting process is avoided. In addition, when the local surface of a certain component needs to be polished in the etching, washing or coating process, in order to protect other parts which do not need to be processed from being affected, the parts which do not need to be processed are firstly covered by the adhesive tape, and then peeled off after the processing is finished. However, when the adhesive tape is used for fixing, the adhesive strength needs to be high, a high peeling force is required during processing, if the peeling force is too large, the situation that components are damaged when the adhesive tape is removed is easy to occur, and if the adhesion force is too small, complete fixing is easy to occur, and the prior art generally adopts a peelable adhesive tape for treatment.
Currently, many studies have been made on releasable adhesive tapes. For example, CN111334216A discloses a dual anti-adhesive film, which comprises a substrate layer, an anti-adhesive layer and a release layer sequentially attached to each other; the substrate layer is made for PET, PO, PVC material, and release layer is PET release film, and the visbreaking layer is made by coating the substrate layer surface on by visbreaking adhesive composition, visbreaking adhesive composition includes following component: acrylate pressure sensitive adhesive resin, multifunctional oligomer or multifunctional monomer composition, a cross-linking agent, foaming microcapsules, a photoinitiator and a solvent. CN109439216A discloses a heating viscosity-reducing protective film formed by processing a heating viscosity-reducing adhesive, which comprises a base material, wherein a heating viscosity-reducing adhesive layer is arranged at the top of the base material, the heating viscosity-reducing adhesive layer is formed by coating the heating viscosity-reducing adhesive on the base material and curing the coating, and the heating viscosity-reducing adhesive layer is prepared by mixing resin, a curing agent, a solvent, a self-expanding microsphere foaming agent, toner and an OBSH foaming agent. CN110577807A discloses but UV and dual mode visbreaking's protection film, including the substrate layer, the top of substrate layer is equipped with UV barrier layer, adhesive linkage and heating visbreaking glue film from top to bottom in proper order, the bottom of substrate layer is equipped with UV visbreaking glue film and leaves type paper layer from top to bottom in proper order, the UV barrier layer the adhesive linkage the heating visbreaking glue film the substrate layer UV visbreaking glue film with it is fixed to be the bonding between the type paper layer. Although these anti-adhesive films have a strong tack, which decreases after heating and is easily peeled off, they still require heating to effect peeling, and are therefore limited in application by the temperature resistance of the device being processed.
Therefore, it is of great practical significance to develop an adhesive which has high adhesiveness and can be easily peeled off without leaving any residue only by irradiation with UV light without heating.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a peelable adhesive and a preparation method and application thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a releasable adhesive prepared from a combination of an acrylate monomer, a hardener, a UV photoinitiator, and a polyaza compound.
According to the invention, the addition of the UV photoinitiator enables the adhesive to age and debond after being irradiated by UV light, so that the peeling of the adhesive is promoted; meanwhile, the multi-nitrogen compound is adopted, and after UV light irradiation, free radical reaction can occur to generate gas, while the traditional foaming microsphere needs to be baked at high temperature and the internal material is decomposed to generate gas expansion. In contrast, the polynitrogen compound does not need extra high-temperature baking and the introduction of the foaming microspheres can greatly reduce the cohesive force and the adhesive force of the adhesive tape. Therefore, the multi-nitrogen compound is adopted to replace the traditional foaming microspheres, the viscosity of the adhesive can be enhanced, after UV irradiation, free radical reaction can be carried out without heating to generate bubbles, the peeling of the adhesive is promoted, and the adhesive can realize residue-free peeling with the semiconductor material in the delamination of the semiconductor material.
Preferably, the amount of the acrylate monomer in the preparation raw material is 40 to 60 parts by weight, for example, 41 parts, 42 parts, 45 parts, 46 parts, 48 parts, 50 parts, 51 parts, 52 parts, 53 parts, 54 parts, 55 parts, 56 parts, 57 parts, 58 parts or 59 parts, and specific point values therebetween, which are included in the range are not exhaustive for brevity and conciseness.
Preferably, the acrylate monomer comprises any one of epoxy acrylate, polyester acrylate or amino acrylate or a combination of at least two thereof.
Preferably, the hardener is used in the preparation raw material in an amount of 0.6 to 1 part by weight, for example, 0.62 part, 0.64 part, 0.65 part, 0.7 part, 0.75 part, 0.8 part, 0.82 part, 0.85 part, 0.90 part, 0.95 part, or 0.99 part, and specific point values therebetween are not exhaustive, and for the sake of brevity, specific point values included in the range are not enumerated in the present invention.
Preferably, the hardener comprises an aromatic polyisocyanate and/or a hexamethylene diisocyanate trimer.
In the present invention, the amount of the UV photoinitiator in the preparation raw material is 0.4 to 1 part by weight, for example, 0.42 part, 0.45 part, 0.5 part, 0.52 part, 0.55 part, 0.6 part, 0.65 part, 0.7 part, 0.75 part, 0.8 part, 0.85 part, 0.9 part or 0.95 part, and specific point values between the above point values are not exhaustive, and specific point values included in the range are not limited for brevity and conciseness.
Preferably, the UV photoinitiator comprises any one of 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-propanone or ethyl 2,4, 6-trimethylbenzoylphosphonate or a combination of at least two thereof.
Preferably, the amount of the polyaza compound in the raw materials for preparation is 1 to 3 parts by weight, for example, 1.1 part, 1.3 parts, 1.5 parts, 1.7 parts, 2.0 parts, 2.2 parts, 2.5 parts, 2.7 parts or 2.9 parts, and specific values therebetween, and the invention is not exhaustive and for the sake of brevity only the specific values included in the range. Preferably, the polyazagen compound includes any one of an aromatic azide compound, an aromatic diazo compound, or a bisaziridine-based compound, or a combination of at least two thereof.
In the present invention, the raw material for preparation further comprises 2 to 5 parts by weight of diluent, for example, 2.2 parts, 2.5 parts, 2.8 parts, 3 parts, 3.2 parts, 3.5 parts, 4 parts, 4.2 parts, 4.5 parts, 4.8 parts or 4.9 parts, and specific values therebetween are not limited to space and for the sake of brevity, and the specific values included in the range are not exhaustive.
Preferably, the diluent comprises any one or a combination of at least two of ethoxyethoxyethyl acrylate, 2-phenoxyethyl acrylate or propoxylated glycerol triacrylate.
In the invention, the diluent can participate in the crosslinking reaction of the adhesive on one hand, and can play a role in reducing the viscosity of a reaction system on the other hand, and when the diluent is contained in the preparation raw materials, no solvent needs to be added.
Preferably, the raw materials for preparation also include 8-12 parts by weight of solvent, such as 8.2 parts, 8.5 parts, 8.8 parts, 9 parts, 9.5 parts, 10 parts, 10.5 parts, 11 parts, 11.5 parts, 11.8 parts or 11.9 parts, and the specific values therebetween, which are not limited by space and for the sake of brevity, the invention is not exhaustive.
Preferably, the solvent includes any one of an ester solvent, a ketone solvent or an aromatic hydrocarbon solvent or a combination of at least two thereof.
Preferably, the solvent comprises any one of ethyl acetate, butyl acetate, toluene, xylene or methyl isobutyl ketone or a combination of at least two thereof.
In a second aspect, the present invention provides a method of producing a peelable adhesive according to the first aspect, the method comprising the steps of: mixing and reacting an acrylate monomer, a hardening agent, a UV photoinitiator, a polynitrogen compound, an optional diluent and an optional solvent to obtain the peelable adhesive.
In the present invention, the reaction is carried out under stirring.
Preferably, the reaction temperature is 10 to 30 ℃, for example, 12 ℃, 14 ℃, 15 ℃, 16 ℃, 18 ℃, 20 ℃, 22 ℃, 24 ℃, 26 ℃ or 28 ℃, and the specific values therebetween are limited by space and for the sake of brevity, and the invention is not exhaustive of the specific values included in the ranges.
Preferably, the rotation speed of the stirring is 400 to 1500rpm, for example, 500rpm, 600rpm, 700rpm, 800rpm, 900rpm, 1000rpm, 1100rpm, 1200rpm, 1300rpm, 1400rpm or 1450rpm, and specific values therebetween, which are not exhaustive for the invention and are included in the range for brevity.
Preferably, the reaction time is 15-30 min, for example, 16min, 18min, 20min, 22min, 24min, 25min, 26min, 28min or 29min, and the specific values therebetween are not exhaustive, and for brevity and clarity, the invention is not intended to be exhaustive.
In a third aspect, the present invention provides the use of a peelable adhesive according to the first aspect in delamination of a semiconducting material.
Preferably, the semiconductor material comprises a silicon carbide ingot and/or a silicon wafer.
Preferably, the method of layering semiconductor materials comprises the steps of:
(1) Carrying out laser modification on a semiconductor material to obtain a modified solid;
(2) Sequentially arranging the peelable adhesive and the base plates on two sides of the modified solid obtained in the step (1), and then moving the two base plates to layer the modified solid to obtain 2 solid peeling layers with the peelable adhesive and the base plates adhered to one side in sequence;
(3) And (3) irradiating the substrate side of the solid stripping layer with the adhesive and the substrate adhered to one side in sequence, which is obtained in the step (2), with UV light, and stripping the strippable adhesive and the substrate to obtain the solid stripping layer.
Preferably, the substrate comprises any one of polymethyl methacrylate, polycarbonate, optical quartz glass or soda-lime ultraviolet glass.
Preferably, the peelable adhesive is provided by applying a glue of peelable adhesive to both sides of the modified solid.
Preferably, the peelable adhesive is prepared by coating glue solution of the peelable adhesive on two sides of a substrate to form a double-sided tape, and then adhering the double-sided tape to two sides of the modified solid.
Preferably, the substrate is a PET release film.
Preferably, the moving method of step (2) comprises warping and/or reverse stretching.
Preferably, the UV light irradiation in step (3) is performed for 10 to 40s, for example, 12s, 15s, 20s, 22s, 25s, 30s, 32s, 35s, 36s, 37s, 38s or 39s, and specific values therebetween are not exhaustive, and for brevity and clarity, the invention is not limited to the specific values included in the range.
Preferably, the power density of the UV light irradiation in the step (3) is 300-500 mW/cm 2 For example, 320mW/cm 2 、350mW/cm 2 、400mW/cm 2 、420mW/cm 2 、440mW/cm 2 、450mW/cm 2 、480mW/cm 2 Or 490mW/cm 2 And the specific values between the foregoing, are not intended to be exhaustive or to limit the invention to the precise values encompassed within the scope, for reasons of brevity and clarity.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the adhesive has stronger adhesive force before UV light irradiation by introducing the UV photoinitiator and the polynitrogen compound into the adhesive component, and can be debonded without heating after UV light irradiation, and when the adhesive is applied to semiconductor material delamination, the adhesive has the following effects:
(1) Compared with the traditional wire saw cutting, the method has the advantages that the processing cost is low, the thickness of the stripped semiconductor material wafer is as low as 100 mu m, the kerf loss is small, the total thickness change is as low as 2 mu m, the method is compatible with wafers of various sizes, the number of wafers produced by each crystal ingot is increased by 1.4-1.5 times, and the like;
(2) Compared with the cold splitting technology, the method has the advantages of simple and convenient operation, no need of dangerous liquid nitrogen soaking and the like;
(3) The adhesive and the stripping layer of the semiconductor material can be completely stripped without residue, and the procedures of soaking solvent, cleaning solvent and the like are not needed, so that the production efficiency is greatly improved, the cost is reduced, and the large-scale production of fragile materials such as silicon carbide and the like is facilitated.
Drawings
FIG. 1 is a view showing 2 SiC wafers of the present invention, to each of which double-sided adhesive and glass plate are sequentially adhered, obtained in step (2) of application example 1;
FIG. 2 shows 2 SiC wafers completely peeled from the adhesive and the glass plate, obtained in step (3) of application example 1 of the present invention.
Detailed Description
The technical solution of the present invention is further described below by way of specific embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
The following examples and comparative examples of the present invention use materials including:
(1) Acrylate ester monomer: mitsubishi chemical corporation, N4001;
(2) Hardening agent: l75, bayer, germany, CAS:98-67-9;
(3) UV photoinitiator: basff, germany, IRGACURE 184;
(4) A polyaza compound: 1-benzyl-3-p-tolyltriazene, western experiment, CAS:17683-09-9;
(5) Diluent agent: 2- (2-ethoxyethoxy) ethyl acrylate, birk chemical, SR256;
(6) Foaming microspheres: songban oil pharmaceutical Co., ltd, MSH-380.
Examples 1 to 8
Examples 1-8 provide a releasable adhesive prepared from a combination of an acrylate monomer, a hardener, a UV photoinitiator, a polyaza compound, optionally a diluent, and optionally a solvent, the formulation of each component being as shown in table 1.
The method of making the peelable adhesive comprises the steps of: adding an acrylate monomer N4001, a hardening agent L75, a UV photoinitiator 184 and a polynitrogen compound into a beaker, mixing, reacting for 15min under the stirring of 500rpm, and then removing bubbles by ultrasonic treatment for 30min at the power of 100W to obtain a glue solution of the peelable adhesive.
TABLE 1
Figure BDA0003184013860000081
Comparative example 1
Comparative example 1 provides a peelable adhesive which differs from example 1 in that the starting materials for its preparation do not contain a polynitrogen compound. The other raw material components, the amounts thereof and the releasable adhesive thereof were prepared in the same manner as in example 1.
Comparative example 2
Comparative example 2 provides a releasable adhesive which differs from example 1 in that the starting materials for its preparation do not contain a UV photoinitiator. The other raw material components, the amounts thereof and the releasable adhesive thereof were prepared in the same manner as in example 1.
Comparative example 3
Comparative example 3 provides a peelable adhesive which differs from example 1 in that foamed microspheres are used instead of the polynitrogen compound in the starting material for its preparation. The other raw material components, the amounts thereof and the releasable adhesive thereof were prepared in the same manner as in example 1.
Comparative example 4
Comparative example 4 provides a thermal release adhesive tape revaloha in the east of japan.
Application example 1
Application example 1 provides a method of delaminating a silicon carbide ingot, the method of delaminating a silicon carbide ingot comprising the steps of:
(1) Carrying out laser modification on the silicon carbide crystal ingot to obtain a modified silicon carbide crystal ingot;
(2) After double faced adhesive tapes are attached to two sides of the modified silicon carbide crystal ingot obtained in the step (1), covering glass sheets on two sides, pressing for 30min by using a 3kg weight to ensure the uniformity of the surface in the pressing process, and clamping four corners of the glass sheets by using a mechanical arm to vertically stretch until the silicon carbide crystal ingot is peeled off to obtain 2 silicon carbide wafers with the double faced adhesive tapes and the glass sheets adhered to one side in sequence, as shown in figure 1; the double-sided adhesive is prepared by scraping the glue solution of the peelable adhesive provided in the embodiment 1 on the surface of a PET release film at the speed of 200mm/min, drying to remove part of the solvent, and baking at 40 ℃ for 18h, wherein the thickness of the double-sided adhesive is 120 microns;
(3) And (3) irradiating UV light from the glass plate side for 30s on the silicon carbide wafer with the double-sided adhesive and the glass sheet adhered to one side of the silicon carbide wafer obtained in the step (2) in sequence, wherein the power of the UV light irradiation is 400W, so that the double-sided adhesive is peeled from the surfaces of the silicon carbide wafer and the glass sheet, and the silicon carbide wafer is obtained. As shown in fig. 2, the double-sided tape (peelable adhesive) was peeled off from the silicon carbide wafer and the glass plate without leaving any residue.
Application examples 2-8 and comparative application examples 1-4
Application examples 2 to 8 and comparative application examples 1 to 4 respectively provide a method of delaminating a silicon carbide ingot, which is different from application example 1 in that the releasable adhesives of step (2) for preparing a double-sided tape are the releasable adhesives provided in examples 2 to 8 and comparative examples 1 to 4, respectively.
And (3) performance testing:
peeling off the silicon carbide crystal ingot by the semiconductor material layering method provided in application examples 1-8 and comparative application examples 1-4 respectively, and observing and recording the peeling condition of the crystal ingot and the adhesive-free residue on the surface; the stripping test is repeated for 5 times, the stripping degree is easy when the number of complete stripping times of the crystal ingot is n, n is more than or equal to 4 and less than or equal to 5, the stripping degree is medium when n =3, and the stripping degree is difficult when n is less than 3; the number of times of complete peeling and no residue of the adhesive is m, and when m is not less than 4 and not more than 5, the degree of peeling is easy, when m =3, the degree of peeling is medium, and when m < 3, the degree of peeling is difficult. The results are shown in Table 2.
TABLE 2
Figure BDA0003184013860000101
Figure BDA0003184013860000111
As can be seen from the data in table 2, the present invention provides a peelable adhesive which can completely peel off a solid body when applied to a laminate of solid materials, does not require heating, and can be peeled off from the peeled solid body without leaving any residue after UV light irradiation.
When the polyaza compound is absent from the components of the adhesive, the adhesive is difficult to peel from the delaminated solid, leaving a residue after peeling. When the content of the hardener in the adhesive is too high, delamination by solids can be achieved, but since the adhesive force is too high, the relative content of the polyazacompound is reduced, making it difficult to peel off the adhesive from the delaminated solids. When the content of the hardener in the adhesive is too small, the adhesive force is lowered, and complete peeling of the solid cannot be achieved.
The applicant states that the present invention is illustrated by the above examples of the releasable adhesive of the present invention and the preparation method and application thereof, but the present invention is not limited to the above examples, i.e. it does not mean that the present invention must be carried out by relying on the above process steps. It will be apparent to those skilled in the art that any modification of the present invention, equivalent substitutions of selected materials and additions of auxiliary components, selection of specific modes and the like, which are within the scope and disclosure of the present invention, are contemplated by the present invention.

Claims (26)

1. A releasable adhesive without the need of heating, characterized in that the releasable adhesive is prepared from a raw material comprising a combination of an acrylate monomer, a hardener, a UV photoinitiator and a polynitrogen compound;
the dosage of the acrylate monomer in the preparation raw material is 40-60 parts by weight;
the amount of the hardener in the preparation raw material is 0.6-1 part by weight;
the dosage of the polynitrogen compound in the preparation raw materials is 1 to 3 parts by weight.
2. The releasable adhesive of claim 1 wherein the acrylate monomer comprises any one of an epoxy acrylate, a polyester acrylate, or an amino acrylate, or a combination of at least two thereof.
3. The peelable adhesive of claim 1 wherein the hardener comprises an aromatic polyisocyanate and/or a hexamethylene diisocyanate trimer.
4. The releasable adhesive of claim 1 wherein the amount of UV photoinitiator in the starting materials is from 0.4 to 1 part by weight.
5. The releasable adhesive of claim 1 wherein the UV photoinitiator comprises any one or a combination of at least two of 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-propanone, or ethyl 2,4, 6-trimethylbenzoylphosphonate.
6. The releasable adhesive of claim 1 wherein the polyazo compound comprises any one of an aromatic azide compound, an aromatic diazo compound, or a bis-aziridine based compound, or a combination of at least two thereof.
7. The peelable adhesive of claim 1 further comprising from 2 to 5 parts by weight of a diluent in said starting materials.
8. The releasable adhesive of claim 7 wherein the diluent comprises any one of or a combination of at least two of ethoxyethoxyethyl acrylate, 2-phenoxyethyl acrylate, or propoxylated glycerol triacrylate.
9. The releasable adhesive of claim 1 further comprising 8 to 12 parts by weight of a solvent in the starting materials.
10. The releasable adhesive of claim 9 wherein the solvent comprises any one of an ester solvent, a ketone solvent, or an aromatic hydrocarbon solvent, or a combination of at least two thereof.
11. The peelable adhesive of claim 10 wherein said solvent comprises any one or a combination of at least two of ethyl acetate, butyl acetate, toluene, xylene or methyl isobutyl ketone.
12. A method of preparing a peelable adhesive according to any one of claims 1 to 11, comprising the steps of: mixing and reacting an acrylate monomer, a hardener, a UV photoinitiator, a polynitrogen compound, an optional diluent and an optional solvent to obtain the peelable adhesive.
13. The method of claim 12, wherein the reaction is carried out under agitation.
14. The method of claim 13, wherein the stirring is performed at a speed of 400 to 1500rpm.
15. The method of claim 12, wherein the reaction temperature is 10 to 30 ℃.
16. The method of claim 12, wherein the reaction time is 15 to 30min.
17. Use of a peelable adhesive according to any of claims 1-11 for delamination of semiconductor materials.
18. Use according to claim 17, wherein the semiconductor material comprises a silicon carbide ingot and/or a silicon wafer.
19. Use according to claim 17, wherein the method of layering semiconductor materials comprises the steps of:
(1) Carrying out laser modification on a semiconductor material to obtain a modified solid;
(2) Sequentially arranging the peelable adhesive and the base plates on two sides of the modified solid obtained in the step (1), and then moving the two base plates to layer the modified solid to obtain 2 solid peeling layers with one sides sequentially adhered with the peelable adhesive and the base plates;
(3) And (3) irradiating the substrate side of the solid stripping layer with the adhesive and the substrate adhered to one side in sequence, which is obtained in the step (2), with UV light, and stripping the strippable adhesive and the substrate to obtain the solid stripping layer.
20. The use of claim 19, wherein the substrate comprises any one of polymethylmethacrylate, polycarbonate, optical quartz glass or soda-lime ultraviolet glass.
21. The use of claim 19, wherein the peelable adhesive is provided by applying a glue of peelable adhesive to both sides of the modified solid.
22. The use of claim 21, wherein the peelable adhesive is provided by applying a glue of peelable adhesive to both sides of a substrate to prepare a double sided tape and then adhering the double sided tape to both sides of the modified solid.
23. The use of claim 22, wherein the substrate is a PET release film.
24. The use of claim 19, wherein the moving of step (2) comprises warping and/or reverse stretching.
25. The use of claim 19, wherein the UV light of step (3) is irradiated for a time of 10 to 40 seconds.
26. The use of claim 19, wherein the UV light of step (3) is irradiated at a power density of 300 to 500mW/cm 2 。
CN202110856107.6A 2021-07-28 2021-07-28 Peelable adhesive and preparation method and application thereof Active CN113512382B (en)

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