CN112662337A - Non-silicon UV (ultraviolet) anti-adhesion film and preparation method thereof - Google Patents
Non-silicon UV (ultraviolet) anti-adhesion film and preparation method thereof Download PDFInfo
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Abstract
The invention relates to the technical field of anti-adhesive films, in particular to a non-silicon UV anti-adhesive film and a preparation method thereof, wherein the anti-adhesive film sequentially comprises a first substrate layer, a non-silicon release layer, an acrylate layer, a bottom coating and a second substrate layer from top to bottom; the first substrate layer and the second substrate layer are both organic films; the non-silicon release layer is coated and fixed on the first base material layer; the non-silicon UV anti-sticking film is more environment-friendly and the viscosity of the acrylate colloid is more stable.
Description
Technical Field
The invention relates to the technical field of anti-sticking films, in particular to a non-silicon UV anti-sticking film and a preparation method thereof.
Background
With the rapid development of semiconductor manufacturing technology, the performance requirements for the functional protection film in the manufacturing process are also higher and higher. In the processes of wafer grinding, wafer cutting, packaging substrate and the like, a special protective film is usually used to fix the wafer in order to prevent the wafer from shifting. The protective film for fixing is required to have a viscosity of 20N/25mm or more when bonding a wafer, and is required to have a viscosity of 0.1N/25mm or less in a peeling process in order to prevent damage to the wafer due to excessive viscosity at the later stage of processing. The prior art generally uses a UV anti-sticking film for processing, the UV anti-sticking film keeps high viscosity during fixing, so that the position of a wafer is stable, the UV anti-sticking film is subjected to UV illumination processing after cutting operation is completed, the viscosity is rapidly reduced from high viscosity to low viscosity, and then the UV anti-sticking film on the wafer is torn off.
However, since the release film in the existing UV adhesive reducing film is usually an organic silicon release film made of an organic silicon release agent, with time change, part of small molecules of silicone oil of the organic silicon release agent migrate to the surface of the acrylate adhesive layer of the UV adhesive reducing film, thereby seriously affecting the cohesive strength of the colloid and causing the viscosity of the acrylate adhesive layer to be reduced in different degrees. Moreover, if the transfer degree of the organic silicon release agent is too high, after the UV anti-adhesive film is attached to the surface of the wafer, part of silicone oil small molecules can migrate to the surface of the wafer, so that the surface energy of the wafer is too low, and the mechanical property of the surface at the later stage is affected.
In view of this, the development of the non-silicon UV anti-sticking film and the preparation method thereof have important values for preventing the silicone oil from migrating to the surface of the wafer and keeping the viscosity of the acrylate adhesive stable.
Disclosure of Invention
The invention aims to provide a non-silicon UV anti-sticking film and a preparation method thereof, aiming at the defects and shortcomings of the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that:
the non-silicon UV anti-adhesive film comprises a first base material layer, a non-silicon release layer, an acrylate layer, a bottom coating and a second base material layer from top to bottom in sequence; the first substrate layer and the second substrate layer are both organic films; the non-silicon release layer is coated and fixed on the first base material layer; the base coat is coated on the second base material layer, and the non-silicon release layer and the base coat are adhered and fixed by the acrylate layer.
Further, the organic thin film is any one of a PET film, a PO film, a PP film and a PE film, the surface roughness Ra value of the organic thin film is 0.01-0.6 mu m, and the surface tension is 38-60 dyn/cm.
Further, the thickness of the first substrate layer is 25-100 μm, and the thickness of the non-silicon release layer is 0.2-1 μm; the thickness of the acrylate layer is 5-20 mu m; the thickness of the bottom coating is 1-4 mu m; the thickness of the second substrate layer is 25-100 mu m.
Further, the non-silicon release agent and the solvent are mixed into a non-silicon release agent preparation solution, and the non-silicon release agent preparation solution is coated on the first substrate layer and baked and solidified into the non-silicon release layer.
And further, mixing a primer and deionized water to form a primer preparation solution, coating the primer preparation solution on the second substrate layer, and baking and curing to form the primer.
Further, fully mixing the acrylate adhesive and the diluent until the acrylate adhesive and the diluent are completely dispersed into an acrylate preparation solution, and adding a curing agent and a photoinitiator into the acrylate preparation solution to obtain an acrylate preparation solution containing the curing agent and the photoinitiator; and coating the acrylate solution containing the curing agent and the photoinitiator on the base coat, and baking and curing to obtain the acrylate glue layer.
In order to solve the technical problems, the invention adopts the technical scheme that: the method comprises the following steps:
a. mixing 9-11 parts by weight of non-silicon release agent and 81-99 parts by weight of solvent, heating to 55 ℃, and completely dissolving the non-silicon release agent in the solvent to form a concentrated non-silicon release agent solution; adding 810-990 parts by weight of solvent into the concentrated non-silicon release agent preparation solution, fully and uniformly mixing to form a diluted non-silicon release agent preparation solution, coating the diluted non-silicon release agent preparation solution on a first substrate layer, baking at the temperature of 80-100 ℃ for 30-120 seconds, and curing to form a non-silicon release layer;
b. fully stirring 90-110 parts by weight of a primer and 20-30 parts by weight of deionized water until the mixture is completely dispersed to form a primer preparation solution, coating the primer preparation solution on a second substrate layer, and baking at the temperature of 60-110 ℃ for 30-60 seconds to solidify into a primer layer;
c. adding 5-20 parts by weight of a diluting solvent for dissolving a curing agent into 0.05-3.0 parts by weight of the curing agent to prepare a curing agent; in addition, fully mixing 90-110 parts by weight of acrylate gum and 5-20 parts by weight of diluting solvent until completely dispersing into an acrylate preparation solution; adding all the curing reagents prepared in the step into the acrylic ester prepared liquid obtained in the step, and fully stirring to obtain acrylic ester prepared liquid containing the curing reagents; adding 0.5-4.0 parts by weight of photoinitiator into the acrylic ester preparation solution, and fully stirring; coating the acrylate preparation solution containing the photoinitiator on a base coat, and baking at the temperature of 80-100 ℃ for 30-120 seconds to solidify into an acrylate adhesive layer;
d. c, sticking and fixing the acrylate adhesive layer in the step c on the non-silicon release layer to form an uncured non-silicon UV (ultraviolet) adhesive reducing film; placing the uncured non-silicon UV visbreaking film in a curing room at the temperature of 25-60 ℃ for 48-168 hours to obtain the fully cured non-silicon UV visbreaking film.
Compared with the prior art, the invention has the beneficial effects that:
1. the release film is coated with the non-silicon release layer, so that the migration of silicone oil to the surface of the wafer is reduced, and the mechanical property of the surface of the wafer in the subsequent use process is ensured.
2. The silicone oil content in the formula is zero, so that the environment is protected.
3. The primer design is added, the adhesive force of the acrylate layer and the base material is enhanced, so that the UV adhesive reducing film does not generate cohesion reduction, and the viscosity stability of the acrylate colloid can be kept for a long time.
Detailed Description
The present invention will now be described in detail with reference to specific examples, which are provided for illustration only and are not intended to be limiting.
Example 1:
a. the first substrate layer is an organic film with the surface roughness Ra value of 0.6 mu m, the surface tension of 38dyn/cm and the thickness of 50 mu m; mixing 10 parts by weight of non-silicon release agent and 91 parts by weight of solvent, heating to 55 ℃, and completely dissolving the non-silicon release agent in the solvent to form concentrated non-silicon release agent solution; adding 810 parts by weight of solvent into the concentrated non-silicon release agent preparation solution, fully and uniformly mixing to form a diluted non-silicon release agent preparation solution, coating the diluted non-silicon release agent preparation solution on a first substrate layer, and baking at the temperature of 90 ℃ for 30 seconds to solidify into a non-silicon release layer with the thickness of 0.5 mu m;
the non-silicon release agent is any one of a reaction product of a carbamate-polyethylene compound, a copolymer of maleic acid monostearyl ester and ethyl acrylate, and a complex of stearic acid and hydroxyethyl cellulose; the solvent is any one or combination of more of ethyl acetate, butanone, acetone, isopropanol and toluene.
b. The second substrate layer is an organic film with the surface roughness Ra value of 0.01 mu m, the surface tension of 60dyn/cm and the thickness of 50 mu m; fully stirring 90 parts by weight of primer and 30 parts by weight of deionized water until the mixture is completely dispersed into primer preparation liquid, coating the primer preparation liquid on a second substrate layer, and baking at the temperature of 110 ℃ for 60 seconds to solidify into a primer layer with the thickness of 4 mu m; the primer is any combination of a mixture of NBR and polyamide, a grafting reactant of NR, butyl methacrylate and methacrylamide, a reactant of SBS and phenolic resin, a mixture of chlorinated rubber, a substance containing active hydrogen, polyisocyanate and an ethylene-vinyl acetate copolymer.
c. Adding 5 parts by weight of a diluting solvent for dissolving the curing agent into 0.05 part by weight of the curing agent to prepare a curing agent; in addition, 100 parts by weight of acrylate glue and 20 parts by weight of diluting solvent are fully mixed until the acrylate compound liquid is completely dispersed; adding all the curing reagents prepared in the step into the acrylic ester prepared liquid obtained in the step, and fully stirring to obtain acrylic ester prepared liquid containing the curing reagents; adding 4 parts by weight of photoinitiator into the acrylic ester solution, and fully stirring; coating the acrylate solution containing the photoinitiator on a base coat, baking for 120 seconds at the temperature of 80 ℃ to solidify into an acrylate adhesive layer with the thickness of 5 mu m; in the step, the method needs to be carried out in an environment without the influence of UV rays;
the acrylate is formed by the reaction of an acrylate hard monomer, an acrylate soft monomer and an acrylate functional monomer, and the acrylate pressure-sensitive adhesive contains hydroxyl, carboxyl and amido;
the curing agent is one or a combination of more of trimethylene diisocyanate, tetramethylene diisocyanate, 1, 2-propylene diisocyanate, 2, 3-butylene diisocyanate, 1, 3-butylene diisocyanate and dodecamethylene diisocyanate;
the photoinitiator is one or more of benzoin dimethyl ether, benzophenone, benzoylbenzoic acid, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-methyl phenyl propyl, 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-acetone, 2,4,6- (trimethylbenzoyl) -diphenyl phosphorus oxide, alkane-1-ketone and DR-575.
d. C, sticking and fixing the acrylate adhesive layer in the step c on the non-silicon release layer to form an uncured non-silicon UV (ultraviolet) adhesive reducing film; placing the uncured non-silicon UV visbreaking film in a curing room at the temperature of 60 ℃ for 48 hours to obtain the fully cured non-silicon UV visbreaking film.
Example 2:
a. the first substrate layer is an organic film with the surface roughness Ra value of 0.01 mu m, the surface tension of 50dyn/cm and the thickness of 50 mu m; mixing 9 parts by weight of non-silicon release agent and 80 parts by weight of solvent, heating to 55 ℃, and completely dissolving the non-silicon release agent in the solvent to form concentrated non-silicon release agent solution; adding 900 parts by weight of solvent into the concentrated non-silicon release agent preparation solution, fully and uniformly mixing to form a diluted non-silicon release agent preparation solution, coating the diluted non-silicon release agent preparation solution on a first substrate layer, and baking at the temperature of 100 ℃ for 70 seconds to solidify into a non-silicon release layer with the thickness of 1 mu m;
the non-silicon release agent is any one of a reaction product of a carbamate-polyethylene compound, a copolymer of maleic acid monostearyl ester and ethyl acrylate, and a complex of stearic acid and hydroxyethyl cellulose; the solvent is any one or combination of more of ethyl acetate, butanone, acetone, isopropanol and toluene.
b. The second substrate layer is an organic film with the surface roughness Ra value of 0.6 mu m, the surface tension of 38dyn/cm and the thickness of 50 mu m; fully stirring 110 parts by weight of primer and 25 parts by weight of deionized water until the mixture is completely dispersed into primer preparation liquid, coating the primer preparation liquid on a second substrate layer, and baking at the temperature of 60 ℃ for 30 seconds to solidify into a primer layer with the thickness of 1 mu m; the primer is any combination of a mixture of NBR and polyamide, a grafting reactant of NR, butyl methacrylate and methacrylamide, a reactant of SBS and phenolic resin, a mixture of chlorinated rubber, a substance containing active hydrogen, polyisocyanate and an ethylene-vinyl acetate copolymer.
c. Adding 20 parts by weight of a diluting solvent for dissolving the curing agent into 3 parts by weight of the curing agent to prepare a curing agent; in addition, fully mixing 110 parts by weight of acrylate gum and 5 parts by weight of diluting solvent until completely dispersing to obtain an acrylate preparation solution; adding all the curing reagents prepared in the step into the acrylic ester prepared liquid obtained in the step, and fully stirring to obtain acrylic ester prepared liquid containing the curing reagents; adding 0.5 part by weight of photoinitiator into the acrylic ester solution, and fully stirring; coating the acrylic ester solution containing the photoinitiator on a base coat, and baking at the temperature of 95 ℃ for 30 seconds to solidify into an acrylic ester adhesive layer with the thickness of 10 mu m; in the step, the method needs to be carried out in an environment without the influence of UV rays;
the acrylate is formed by the reaction of an acrylate hard monomer, an acrylate soft monomer and an acrylate functional monomer, and the acrylate pressure-sensitive adhesive contains hydroxyl, carboxyl and amido;
the curing agent is one or a combination of more of trimethylene diisocyanate, tetramethylene diisocyanate, 1, 2-propylene diisocyanate, 2, 3-butylene diisocyanate, 1, 3-butylene diisocyanate and dodecamethylene diisocyanate;
the photoinitiator is one or more of benzoin dimethyl ether, benzophenone, benzoylbenzoic acid, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-methyl phenyl propyl, 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-acetone, 2,4,6- (trimethylbenzoyl) -diphenyl phosphorus oxide, alkane-1-ketone and DR-575.
d. C, sticking and fixing the acrylate adhesive layer in the step c on the non-silicon release layer to form an uncured non-silicon UV (ultraviolet) adhesive reducing film; placing the uncured non-silicon UV visbreaking film in a curing room with the temperature of 25 ℃ for 168 hours to obtain the fully cured non-silicon UV visbreaking film.
Example 3:
a. the first substrate layer is an organic film with the surface roughness Ra value of 0.3 mu m, the surface tension of 60dyn/cm and the thickness of 50 mu m; mixing 11 parts by weight of non-silicon release agent and 99 parts by weight of solvent, heating to 55 ℃, and completely dissolving the non-silicon release agent in the solvent to form concentrated non-silicon release agent solution; adding 990 parts by weight of solvent into the concentrated non-silicon release agent preparation solution, fully and uniformly mixing to form a diluted non-silicon release agent preparation solution, coating the diluted non-silicon release agent preparation solution on a first substrate layer, and baking at the temperature of 80 ℃ for 120 seconds to solidify into a non-silicon release layer with the thickness of 0.2 mu m;
the non-silicon release agent is any one of a reaction product of a carbamate-polyethylene compound, a copolymer of maleic acid monostearyl ester and ethyl acrylate, and a complex of stearic acid and hydroxyethyl cellulose; the solvent is any one or combination of more of ethyl acetate, butanone, acetone, isopropanol and toluene.
b. The second substrate layer is an organic film with the surface roughness Ra value of 0.3 mu m, the surface tension of 50dyn/cm and the thickness of 50 mu m; fully stirring 100 parts by weight of primer and 20 parts by weight of deionized water until the mixture is completely dispersed into primer preparation liquid, coating the primer preparation liquid on a second substrate layer, and baking at the temperature of 75 ℃ for 45 seconds to solidify into a primer layer with the thickness of 2 microns; the primer is any combination of a mixture of NBR and polyamide, a grafting reactant of NR, butyl methacrylate and methacrylamide, a reactant of SBS and phenolic resin, a mixture of chlorinated rubber, a substance containing active hydrogen, polyisocyanate and an ethylene-vinyl acetate copolymer.
c. Adding 12 parts by weight of a diluting solvent for dissolving the curing agent into 1.7 parts by weight of the curing agent to prepare a curing agent; in addition, fully mixing 90 parts by weight of acrylate gum and 12 parts by weight of diluting solvent until completely dispersing to obtain an acrylate preparation solution; adding all the curing reagents prepared in the step into the acrylic ester prepared liquid obtained in the step, and fully stirring to obtain acrylic ester prepared liquid containing the curing reagents; adding 2.2 parts by weight of photoinitiator into the acrylic ester solution, and fully stirring; coating the acrylate solution containing the photoinitiator on a base coat, and baking at 110 ℃ for 75 seconds to solidify into an acrylate adhesive layer with the thickness of 20 mu m; in the step, the method needs to be carried out in an environment without the influence of UV rays;
the acrylate is formed by the reaction of an acrylate hard monomer, an acrylate soft monomer and an acrylate functional monomer, and the acrylate pressure-sensitive adhesive contains hydroxyl, carboxyl and amido;
the curing agent is one or a combination of more of trimethylene diisocyanate, tetramethylene diisocyanate, 1, 2-propylene diisocyanate, 2, 3-butylene diisocyanate, 1, 3-butylene diisocyanate and dodecamethylene diisocyanate;
the photoinitiator is one or more of benzoin dimethyl ether, benzophenone, benzoylbenzoic acid, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-methyl phenyl propyl, 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-acetone, 2,4,6- (trimethylbenzoyl) -diphenyl phosphorus oxide, alkane-1-ketone and DR-575.
d. C, sticking and fixing the acrylate adhesive layer in the step c on the non-silicon release layer to form an uncured non-silicon UV (ultraviolet) adhesive reducing film; placing the uncured non-silicon UV visbreaking film in a curing room at the temperature of 50 ℃ for 100 hours to obtain the fully cured non-silicon UV visbreaking film.
Table 1 shows the data of the three examples of the present invention.
| Detecting items | Example 1 | Example 2 | Example 3 |
| (ii) residual tack ratio | 97% | 97.50% | 97% |
| ② silicone oil transfer content of acrylate adhesive layer (%) | 0 | 0 | 0 |
| ③ value of viscosity change (gf/inch) | 7 | 5 | 6 |
| Fourthly, residual glue | Whether or not | Whether or not | Whether or not |
Compared with the prior art, the invention has the beneficial effects that:
1. the release film is coated with the non-silicon release layer, so that the migration of silicone oil to the surface of the wafer is reduced, and the mechanical property of the surface of the wafer in the subsequent use process is ensured.
2. The silicone oil content in the formula is zero, so that the environment is protected.
3. The primer design is added, the adhesive force of the acrylate layer and the base material is enhanced, so that the UV adhesive reducing film does not generate cohesion reduction, and the viscosity stability of the acrylate colloid can be kept for a long time.
The foregoing is for the purpose of illustrating the invention only and various simple changes and modifications within the spirit of the invention made by those skilled in the art should fall within the scope of the invention.
Claims (7)
1. A non-silicon UV anti-adhesive film, characterized by: the anti-sticking film comprises a first substrate layer, a non-silicon release layer, an acrylate layer, a bottom coating and a second substrate layer from top to bottom in sequence; the first substrate layer and the second substrate layer are both organic films; the non-silicon release layer is coated and fixed on the first base material layer; the base coat is coated on the second base material layer, and the non-silicon release layer and the base coat are adhered and fixed by the acrylate layer.
2. The non-silicon UV detackifying film of claim 1, wherein: the organic film is any one of a PET film, a PO film, a PP film and a PE film, the surface roughness Ra value of the organic film is 0.01-0.6 mu m, and the surface tension is 38-60 dyn/cm.
3. The non-silicon UV detackifying film of claim 1, wherein: the thickness of the first substrate layer is 25-100 mu m, and the thickness of the non-silicon release layer is 0.2-1 mu m; the thickness of the acrylate layer is 5-20 mu m; the thickness of the bottom coating is 1-4 mu m; the thickness of the second substrate layer is 25-100 mu m.
4. The non-silicon UV detackifying film of claim 1, wherein: the non-silicon release agent preparation solution is coated on the first substrate layer and baked and solidified into the non-silicon release layer.
5. The non-silicon UV detackifying film of claim 1, wherein: and mixing the primer and deionized water to obtain a primer preparation solution, coating the primer preparation solution on the second substrate layer, and baking and curing to obtain the primer.
6. The non-silicon UV detackifying film of claim 1, wherein: fully mixing acrylate glue and a diluting solvent until the acrylate glue and the diluting solvent are completely dispersed into an acrylate preparation liquid, and adding a curing agent and a photoinitiator into the acrylate preparation liquid to obtain the acrylate preparation liquid containing the curing agent and the photoinitiator; and coating the acrylate solution containing the curing agent and the photoinitiator on the base coat, and baking and curing to obtain the acrylate glue layer.
7. The method for preparing a non-silicon UV detackifying film according to any one of claims 1 to 6, wherein:
a. mixing 9-11 parts by weight of non-silicon release agent and 81-99 parts by weight of solvent, heating to 55 ℃, and completely dissolving the non-silicon release agent in the solvent to form a concentrated non-silicon release agent solution; adding 810-990 parts by weight of solvent into the concentrated non-silicon release agent preparation solution, fully and uniformly mixing to form a diluted non-silicon release agent preparation solution, coating the diluted non-silicon release agent preparation solution on a first substrate layer, baking at the temperature of 80-100 ℃ for 30-120 seconds, and curing to form a non-silicon release layer;
b. fully stirring 90-110 parts by weight of a primer and 20-30 parts by weight of deionized water until the mixture is completely dispersed to form a primer preparation solution, coating the primer preparation solution on a second substrate layer, and baking at the temperature of 60-110 ℃ for 30-60 seconds to solidify into a primer layer;
c. adding 5-20 parts by weight of a diluting solvent for dissolving a curing agent into 0.05-3.0 parts by weight of the curing agent to prepare a curing agent; in addition, fully mixing 90-110 parts by weight of acrylate gum and 5-20 parts by weight of diluting solvent until completely dispersing into an acrylate preparation solution; adding all the curing reagents prepared in the step into the acrylic ester prepared liquid obtained in the step, and fully stirring to obtain acrylic ester prepared liquid containing the curing reagents; adding 0.5-4.0 parts by weight of photoinitiator into the acrylic ester preparation solution, and fully stirring; coating the acrylate preparation solution containing the photoinitiator on a base coat, and baking at the temperature of 80-100 ℃ for 30-120 seconds to solidify into an acrylate adhesive layer;
d. c, sticking and fixing the acrylate adhesive layer in the step c on the non-silicon release layer to form an uncured non-silicon UV (ultraviolet) adhesive reducing film; placing the uncured non-silicon UV visbreaking film in a curing room at the temperature of 25-60 ℃ for 48-168 hours to obtain the fully cured non-silicon UV visbreaking film.
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Cited By (1)
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| CN111057474A (en) * | 2019-12-24 | 2020-04-24 | 合肥乐凯科技产业有限公司 | Adhesive for UV (ultraviolet) anti-adhesive film and UV anti-adhesive film thereof |
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