CN113497072B - LED display convenient to repair and repair method thereof - Google Patents
LED display convenient to repair and repair method thereof Download PDFInfo
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- CN113497072B CN113497072B CN202010192513.2A CN202010192513A CN113497072B CN 113497072 B CN113497072 B CN 113497072B CN 202010192513 A CN202010192513 A CN 202010192513A CN 113497072 B CN113497072 B CN 113497072B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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Abstract
The invention relates to the technical field of light emitting diodes, in particular to an LED display convenient to repair and a repair method thereof, wherein the repair method comprises the following steps: the LED chip comprises a planarization layer and a circuit layer, wherein a first preparation electrode and a second preparation electrode which are used for being connected with a spare LED chip are arranged on the planarization layer; the first and second prepared electrodes are respectively communicated with a thin film transistor in the circuit layer and a power line grounding end; a groove is formed in the planarization layer, the first and second preparation electrodes respectively extend towards the side edges of the groove, the bottom of the groove is respectively connected with a first contact electrode and a second contact electrode, an onboard LED chip is accommodated in the groove, and two electrodes in the onboard LED chip are respectively connected with the first contact electrode and the second contact electrode; the top of the onboard LED chip does not exceed the notch of the groove. According to the invention, the standby LED chip can be bonded above the original position without picking up the onboard LED chip from the display backboard; which greatly improves the production efficiency.
Description
Technical Field
The invention relates to the technical field of light emitting diodes, in particular to an LED display convenient to repair and a repair method for the LED display.
Background
The Micro light-emitting diode (Micro LED), namely the light-emitting diode Micro and matrixing technology, has the advantages of good stability, long service life and operation temperature, simultaneously has the advantages of low power consumption, color saturation, high reaction speed, strong contrast and the like of the LED, and has great application prospect.
The display screen made of the micro light-emitting diode is the mainstream development direction of display equipment in the future; in the existing process, each LED chip on the display back plate needs to be detected after the LED chip is transferred to the display back plate, and when the damaged or poor-contact LED chip is found, the damaged or poor-contact LED chip needs to be replaced; in the existing repair and replacement process, the damaged LED chip needs to be picked up from the display backplane, and then the good LED chip is bonded at the corresponding position again; the process is complicated and not beneficial to the rapid production of the product.
Disclosure of Invention
In order to overcome the above-mentioned drawbacks, the present invention provides an LED display and a repair and replacement method thereof, which facilitate quick replacement of LED chips.
The purpose of the invention is realized by the following technical scheme:
the invention relates to an LED display convenient to repair, which comprises:
the display back panel comprises a substrate, a circuit layer and a planarization layer which are sequentially arranged, wherein a first prepared electrode and a second prepared electrode are arranged on the surface of one side, away from the circuit layer, of the planarization layer, and the first prepared electrode and the second prepared electrode are used for being connected with a standby LED chip;
the first preparation electrode and the second preparation electrode are respectively communicated with a thin film transistor in the circuit layer and a power line grounding end through a through hole in the planarization layer;
a groove is arranged on the planarization layer and is arranged between the first preparation electrode and the second preparation electrode;
the first prepared electrode and the second prepared electrode respectively extend to the bottom of the groove along the side wall of the groove to form a first electrode extension part and a second electrode extension part, the first electrode extension part and the second electrode extension part are respectively connected with a first contact electrode and a second contact electrode at the bottom of the groove, an on-board LED chip is contained in the groove, and the on-board LED chip is a flip-chip LED chip;
a first on-board chip electrode and a second on-board chip electrode in the on-board LED chip are respectively welded with the first contact electrode and the second contact electrode; the top of the on-board LED chip does not exceed the groove notch.
In the present invention, a gap exists between the side wall of the groove and the on-board LED chip.
In the present invention, an insulating material is filled between the outer sidewall of the on-board LED chip and the first and second electrode extensions.
In the invention, the distance from the surface of one side of the first preparation electrode, which is far away from the planarization layer, to the surface of the circuit layer is a first distance; the distance from one side surface of the second preparation electrode, which is far away from the planarization layer, to the surface of the circuit layer is a second distance; the first distance is equal to the second distance.
In the invention, the distance from the surface of one side of the first preparation electrode, which is far away from the planarization layer, to the surface of the circuit layer is a first distance; the distance from one side surface of the second preparation electrode, which is far away from the planarization layer, to the surface of the circuit layer is a second distance; the first distance is not equal to the second distance.
In the present invention, the spare LED chip includes: the LED chip comprises a spare chip light-emitting layer, wherein a first spare chip semiconductor layer and a second spare chip semiconductor layer are respectively connected to two sides of the spare chip light-emitting layer, a first spare chip electrode and a second spare chip electrode are respectively connected to one sides, away from the light-emitting layer, of the first spare chip semiconductor layer and the second spare chip semiconductor layer, and the first spare chip electrode and the second spare chip electrode are respectively used for being welded with the first spare electrode and the second spare electrode; the epitaxy part of the standby LED chip is arranged on the surface of the onboard LED chip.
In the present invention, a gap is present between the epitaxial portion in the on-board LED chip and the first preliminary electrode and the second preliminary electrode.
In the invention, a thin film transistor contact point and a power line grounding terminal contact point are arranged at the bottom end of the planarization layer, the thin film transistor contact point is communicated with the first prepared electrode through a first through hole, and the power line grounding terminal contact point is communicated with the second prepared electrode through a second through hole; the first through hole and the second through hole are filled with conductive materials.
In the invention, the number of the grooves in the planarization layer is more than one, and each groove contains one on-board LED chip.
The invention is a method for repairing the LED display which is convenient to repair and comprises the following steps:
when the onboard LED chip on the display back plate is detected to be damaged, fusing a first electrode extending part and a second electrode extending part on the side wall of the groove where the onboard LED chip is located, and enabling a first prepared electrode and a second prepared electrode to be disconnected with a first contact electrode and a second contact electrode respectively;
placing an upper spare LED chip above the on-board LED chip, and enabling a first spare chip electrode and a second spare chip electrode in the spare LED chip to be respectively aligned with the first spare electrode and the second spare electrode;
and bonding the first spare chip electrode and the second spare chip electrode in the spare LED chip with the first spare electrode and the second spare electrode respectively.
In the LED display, the onboard LED chip is arranged in the groove of the flattening layer, and the preparation electrode is arranged on the surface of the flattening layer, so when the onboard LED chip is detected to be damaged in the production process, the replacement can be completed by cutting off the electrode extension part between the preparation electrode and the contact electrode and directly bonding the standby LED chip on the preparation electrode, and the onboard LED chip can be bonded above the original position without picking up the onboard LED chip from the display back plate; the production efficiency of the product is greatly improved, and the rapid production of the product is facilitated.
Drawings
For the purpose of easy explanation, the present invention will be described in detail with reference to the following preferred embodiments and the accompanying drawings.
Fig. 1 is a schematic cross-sectional structural view of an LED display according to embodiment 1 of the present invention before repair;
fig. 2 is an exploded schematic view of an LED display according to embodiment 1 of the present invention before repair;
FIG. 3 is a schematic cross-sectional view of a repaired LED display according to embodiment 1 of the present invention;
fig. 4 is a schematic cross-sectional structural view of an LED display according to embodiment 2 of the present invention before repair;
FIG. 5 is a schematic cross-sectional view of a repaired LED display according to embodiment 2 of the present invention;
fig. 6 is a schematic workflow diagram of a repair method of an LED display according to embodiment 3 of the present invention;
fig. 7 is a schematic diagram illustrating the operation principle of step S101 in embodiment 3 of the present invention;
fig. 8 is a schematic diagram illustrating an operation principle of step S102 in embodiment 3 of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are used merely for convenience in describing the present invention and for simplification of the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the recited features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless otherwise explicitly stated or limited. Either mechanically or electrically. They may be directly connected or indirectly connected through intervening media, or may be connected through the interconnection of two elements or through the interaction of two elements. Specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
Example 1
An embodiment of an LED display for facilitating repair of the present invention is described in detail below with reference to fig. 1 to 3, which include:
a display backplane 100, the display backplane 100 comprising: a substrate 101, a circuit layer 102 and a planarization layer 103 disposed from bottom to top, wherein the substrate 101 may include a transparent glass material, such as: silicon dioxide (SiO 2). The substrate 101 may also comprise a transparent plastic material, such as: organic materials such as polyether sulfone (PES), polyacrylate (PAR), polyether imide (PEI), polyethylene terephthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide, polycarbonate (PC), cellulose Triacetate (TAC), or cellulose propionate (CAP); the circuit layer 102 includes a driving circuit for driving the LED chip, such as: a Thin Film Transistor (TFT), a gate line, a signal line, and the like; the planarization layer 103 covers the circuit layer 102 to eliminate the step difference on the circuit layer 102 and planarize it. The planarization layer 103 may include organic materials such as: polymethyl methacrylate (PMMA) or Polystyrene (PS), a polymer derivative having a phenol group, a propylene-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, or any combination thereof.
A first prepared electrode 104 and a second prepared electrode 105 are arranged on the upper surface of the planarization layer 103, and the first prepared electrode 104 and the second prepared electrode 105 are used for being connected with a first spare chip electrode 301 and a second spare chip electrode 302 in a spare LED chip 300; wherein the spare LED chip 300 includes: the epitaxial part is composed of a spare chip light-emitting layer 303, a first spare chip semiconductor layer 304 and a second spare chip semiconductor layer 305, the first spare chip semiconductor layer 304 and the second spare chip semiconductor layer 305 are respectively connected to two sides of the spare chip light-emitting layer 303, and a first spare chip electrode 301 and a second spare chip electrode 302 are respectively connected to the outer sides of the first spare chip semiconductor layer 304 and the second spare chip semiconductor layer 305;
a thin film transistor contact 106 and a power line ground terminal contact 107 are arranged at the bottom end of the planarization layer 103, the thin film transistor contact 106 is communicated with the first prepared electrode 104 through a first through hole 108, and the power line ground terminal contact 107 is communicated with the second prepared electrode 105 through a second through hole 109; the first through hole 108 and the second through hole 109 are filled with conductive materials;
more than one groove 110 is formed in the planarization layer 103, the first preliminary electrode 104 and the second preliminary electrode 105 are respectively arranged on two sides of a notch of the groove 110, and the distance from the surface of one side of the first preliminary electrode 104, which is far away from the planarization layer 103, to the surface of the circuit layer 102 is a first distance H1; the distance from the surface of the second preliminary electrode 105 on the side away from the planarization layer 103 to the surface of the circuit layer 102 is a second distance H2; the first distance H1 is equal to the second distance H2; the first and second preliminary electrodes 104 and 105 extend along the sidewall of the groove 110 to the bottom of the groove 110 to form a first electrode extension 111 and a second electrode extension 112, and the first electrode extension 111 and the second electrode extension 112 are respectively connected with a first contact electrode 113 and a second contact electrode 114 at the bottom of the groove 110; wherein the first preliminary electrode 104, the first electrode extension 111, and the first contact electrode 113 are integrally formed, the second preliminary electrode 105, the second electrode extension 112, and the second contact electrode 114 are integrally formed, and the first preliminary electrode 104, the first electrode extension 111, the first contact electrode 113, the second preliminary electrode 105, the second electrode extension 112, the second contact electrode 114, and the conductive material are made of materials such as aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), or copper (Cu);
the recess 110 accommodates therein a board-mounted LED chip 200, wherein the board-mounted LED chip 200 includes: the chip-on-board structure comprises a first chip-on-board electrode 201 and a second chip-on-board electrode 202 which are separated from each other, wherein the upper end of the second chip-on-board electrode 202 is connected with a second chip-on-board semiconductor layer 205, and a first chip-on-board semiconductor layer 203 and a chip-on-board light-emitting layer 204 are sequentially connected with the second chip-on-board semiconductor layer 205 above the first chip-on-board electrode 201; first and second on-board chip electrodes 202 in the on-board LED chip 200 are connected to the first and second contact electrodes 113 and 114, respectively; the width W of the groove 110 is larger than the width W1 of the board-mounted LED chip 200, namely, a gap exists between the side wall of the groove 110 and the board-mounted LED chip 200; the height H1 of the top of the on-board LED chip 200 does not exceed the height H of the notch of the groove 110. Therefore, the groove 110 can completely accommodate the onboard LED chip 200, and prevent the onboard LED chip 200 from protruding out of the surface of the display back plate 100, so that the standby LED chip 300 can be smoothly installed on the display back plate 100 without taking out the onboard LED chip 200; the width W2 of the epitaxial portion of the spare LED chip 300 is not greater than the width W of the recess 110, so that there is a gap between the epitaxial portion and the first and second preliminary electrodes 104 and 105.
And, an insulating material 115 is filled between the outer sidewall of the on-board LED chip 200 and the first and second electrode extensions 111 and 112. Which effectively prevents the occurrence of a short circuit phenomenon due to the contact of the on-board LED chip 200 with the first and second electrode extensions 111 and 112.
In the present embodiment, the on-board LED chip 200 and the spare LED chip 300 are both micrometer (μm) level LED chips.
Example 2
Another embodiment of the LED display for easy repair according to the present invention is described in detail below with reference to fig. 4 to 5, which includes:
a display backplane 100, the display backplane 100 comprising: a substrate 101, a circuit layer 102 and a planarization layer 103 disposed from bottom to top, wherein the substrate 101 may include a transparent glass material, such as: silicon dioxide (SiO 2). The substrate 101 may also comprise a transparent plastic material, such as: organic materials such as polyether sulfone (PES), polyacrylate (PAR), polyether imide (PEI), polyethylene terephthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide, polycarbonate (PC), cellulose Triacetate (TAC), or cellulose propionate (CAP); the circuit layer 102 includes a driving circuit for driving the LED chip, such as: thin film transistors, gate lines, signal lines, and the like; the planarization layer 103 covers the circuit layer 102, and can eliminate the step difference on the circuit layer 102 to planarize it. The planarization layer 103 may include organic materials such as: polymethyl methacrylate (PMMA) or Polystyrene (PS), a polymer derivative having a phenol group, a propylene-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-tolyl polymer, a vinyl alcohol-based polymer, or any combination thereof.
A first prepared electrode 104 and a second prepared electrode 105 are arranged on the upper surface of the planarization layer 103, and the first prepared electrode 104 and the second prepared electrode 105 are used for being connected with a first spare chip electrode 301 and a second spare chip electrode 302 in a spare LED chip 300; wherein the spare LED chip 300 includes: the epitaxial part is composed of a spare chip light-emitting layer 303, a first spare chip semiconductor layer 304 and a second spare chip semiconductor layer 305, the first spare chip semiconductor layer 304 and the second spare chip semiconductor layer 305 are respectively connected to two sides of the spare chip light-emitting layer 303, and a first spare chip electrode 301 and a second spare chip electrode 302 are respectively connected to the outer sides of the first spare chip semiconductor layer 304 and the second spare chip semiconductor layer 305;
a thin film transistor contact 106 and a power line ground terminal contact 107 are arranged at the bottom end of the planarization layer 103, the thin film transistor contact 106 is communicated with the first prepared electrode 104 through a first through hole 108, and the power line ground terminal contact 107 is communicated with the second prepared electrode 105 through a second through hole 109; the first through hole 108 and the second through hole 109 are filled with conductive materials;
more than one groove 110 is formed in the planarization layer 103, the first preliminary electrode 104 and the second preliminary electrode 105 are respectively arranged on two sides of a notch of the groove 110, and the distance from the surface of one side of the first preliminary electrode 104, which is far away from the planarization layer 103, to the surface of the circuit layer 102 is a first distance H1; the distance from the surface of the second preliminary electrode 105 on the side away from the planarization layer 103 to the surface of the circuit layer 102 is a second distance H2; the first distance H1 is not equal to the second distance H2; in the present embodiment, the surface heights of the planarization layers 103 on the two sides of the notch of the groove 110 may be set to be different, or the thickness of the first preliminary electrode 104 and the thickness of the second preliminary electrode 105 may be set to be different, so as to set the horizontal height H1 of the first preliminary electrode 104 to be different from the horizontal height H2 of the second preliminary electrode 105, in the present embodiment, specifically, the horizontal height H1 of the first preliminary electrode 104 is lower than the horizontal height H2 of the second preliminary electrode 105; the clamping of the spare LED chip 300 is facilitated, and the situation that the spare LED chip 300 cannot work normally due to the fact that the first spare chip electrode 301 and the second spare chip electrode 302 in the spare LED chip 300 are arranged in an inverted mode can be prevented. The first preliminary electrode 104 and the second preliminary electrode 105 extend to the bottom of the groove 110 along the sidewall of the groove 110 to form a first electrode extension 111 and a second electrode extension 112, and the first electrode extension 111 and the second electrode extension 112 are respectively connected with a first contact electrode 113 and a second contact electrode 114 at the bottom of the groove 110; wherein the first preliminary electrode 104, the first electrode extension 111, and the first contact electrode 113 are integrally formed, the second preliminary electrode 105, the second electrode extension 112, and the second contact electrode 114 are integrally formed, and the first preliminary electrode 104, the first electrode extension 111, the first contact electrode 113, the second preliminary electrode 105, the second electrode extension 112, the second contact electrode 114, and the conductive material are made of a material such as aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), or copper (Cu);
the recess 110 accommodates therein a board-mounted LED chip 200, wherein the board-mounted LED chip 200 includes: the chip-on-board structure comprises a first chip-on-board electrode 201 and a second chip-on-board electrode 202 which are separated from each other, wherein the upper end of the second chip-on-board electrode 202 is connected with a second chip-on-board semiconductor layer 205, and a first chip-on-board semiconductor layer 203 and a chip-on-board light-emitting layer 204 are sequentially connected with the second chip-on-board semiconductor layer 205 above the first chip-on-board electrode 201; first and second on-board chip electrodes 202 in the on-board LED chip 200 are connected to the first and second contact electrodes 113 and 114, respectively; the width W of the groove 110 is greater than the width W1 of the on-board LED chip 200, i.e., there is a gap between the side wall of the groove 110 and the on-board LED chip 200; the height H1 of the top of the on-board LED chip 200 does not exceed the height H of the notch of the groove 110. Therefore, the groove 110 can completely accommodate the onboard LED chip 200, and prevent the onboard LED chip 200 from protruding out of the surface of the display back plate 100, so that the standby LED chip 300 can be smoothly installed on the display back plate 100 without taking out the onboard LED chip 200; the width W2 of the epitaxial portion of the spare LED chip 300 is not greater than the width W of the recess 110, so that a gap exists between the epitaxial portion and the first and second preliminary electrodes 104 and 105.
Further, an insulating material 115 is filled between the outer sidewall of the on-board LED chip 200 and the first electrode extension 111 and the second electrode extension 112. Which effectively prevents the occurrence of a short circuit phenomenon due to the contact of the on-board LED chip 200 with the first and second electrode extensions 111 and 112.
In the present embodiment, the on-board LED chip 200 and the spare LED chip 300 are both micrometer (μm) level LED chips.
Example 3
An embodiment of the method for repairing an LED display according to the present invention is described below with reference to fig. 6 to 8, which includes:
s101, fusing electrode extension parts on side walls of grooves
When the onboard LED chips 200 on the display back plate 100 are detected to be damaged, the first electrode extension parts 111 and the second electrode extension parts 112 on the side walls of the grooves 110 where the onboard LED chips 200 are located are respectively fused through laser heating or array repair equipment, so that the first prepared electrodes 104 and the second prepared electrodes 105 are respectively disconnected with the first contact electrodes 113 and the second contact electrodes 114; thereby breaking the electrical connection between the on-board LED chip 200 within the recess 110 and the circuit layers.
S102, placing an upper standby LED chip above an onboard LED chip
Placing an upper spare LED chip 300 above the on-board LED chip 200, and aligning a first spare chip electrode 301 and a second spare chip electrode 302 in the spare LED chip 300 with the first spare electrode 104 and the second spare electrode 105 on the display back plate 100 respectively; preferably, in the present embodiment, the horizontal height H1 of the first preliminary electrode 104 is different from the horizontal height H2 of the second preliminary electrode 105, so the heights of the first preliminary chip electrode 301 and the second preliminary chip electrode 302 in the preliminary LED chip 300 are also different, which can quickly distinguish the two preliminary electrodes and effectively avoid the occurrence of the electrode inversion phenomenon.
S103, bonding the standby LED chip to the display back plate
Bonding the first spare chip electrode 301 and the second spare chip electrode 302 in the spare LED chip 300 to the first spare electrode 104 and the second spare electrode 105, respectively; the spare LED chip 300 receives an electrical signal through the first and second spare electrodes 105 on the display back panel 100 to perform a normal driving; and the on-board LED chip 200 will not operate since the on-board LED chip 200 has broken electrical connection with the circuit layer.
In the description of the present specification, reference to the terms "one embodiment", "some embodiments", "an illustrative embodiment", "an example", "a specific example", or "some examples" and the like means that a specific feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. An LED display that facilitates repair, comprising:
the display back panel comprises a substrate, a circuit layer and a planarization layer which are sequentially arranged, wherein a first prepared electrode and a second prepared electrode are arranged on the surface of one side of the planarization layer, which is far away from the circuit layer, and the first prepared electrode and the second prepared electrode are used for being connected with a standby LED chip; wherein the spare LED chip includes: the LED chip comprises a standby chip luminous layer, wherein a first standby chip semiconductor layer and a second standby chip semiconductor layer are respectively connected to two sides of the standby chip luminous layer, and the standby chip luminous layer, the first standby chip semiconductor layer and the second standby chip semiconductor layer form an epitaxial part of the standby LED chip; the first spare chip electrode and the second spare chip electrode are respectively used for being welded with the first spare electrode and the second spare electrode;
the first preparation electrode and the second preparation electrode are respectively communicated with a thin film transistor in the circuit layer and a power line grounding end through a through hole in the planarization layer;
a groove is arranged on the planarization layer, the groove is arranged between the first preparation electrode and the second preparation electrode, and the width of the groove is larger than that of the epitaxial part of the spare LED chip;
the first prepared electrode and the second prepared electrode respectively extend to the bottom of the groove along the side wall of the groove to form a first electrode extension part and a second electrode extension part, the first electrode extension part and the second electrode extension part are respectively connected with a first contact electrode and a second contact electrode at the bottom of the groove, an on-board LED chip is contained in the groove, and the on-board LED chip is a flip-chip LED chip;
a first on-board chip electrode and a second on-board chip electrode in the on-board LED chip are respectively welded with the first contact electrode and the second contact electrode; the top of the on-board LED chip does not exceed the groove notch.
2. The LED display facilitating repair of claim 1, wherein a gap exists between a sidewall of the recess and the board-mounted LED chip.
3. The repair friendly LED display as claimed in claim 2, wherein an insulating material is filled between the outer sidewall of the on-board LED chip and the first and second electrode extensions.
4. The LED display facilitating repair of claim 3, wherein a surface of a side of the first preliminary electrode facing away from the planarization layer is a first distance from a surface of the circuit layer; the distance from the surface of one side, which is far away from the planarization layer, of the second preparation electrode to the surface of the circuit layer is a second distance; the first distance is equal to the second distance.
5. The LED display facilitating repair of claim 3, wherein a surface of a side of the first preliminary electrode facing away from the planarization layer is a first distance from a surface of the circuit layer; the distance from the surface of one side of the second preparation electrode, which is far away from the planarization layer, to the surface of the circuit layer is a second distance; the first distance is not equal to the second distance.
6. The LED display facilitating repair of claim 1, wherein a bottom end of the planarization layer is provided with a thin film transistor contact point and a power line ground contact point, the thin film transistor contact point being in communication with the first preliminary electrode through a first through hole, the power line ground contact point being in communication with the second preliminary electrode through a second through hole; the first through hole and the second through hole are filled with conductive materials.
7. The LED display facilitating repair of claim 6, wherein the number of grooves in the planarization layer is more than one, and each groove accommodates one of the onboard LED chips.
8. A method of repairing an LED display facilitating repair as claimed in any one of claims 1 to 7, comprising:
when the onboard LED chip on the display back plate is detected to be damaged, fusing a first electrode extending part and a second electrode extending part on the side wall of the groove where the onboard LED chip is located, and enabling a first prepared electrode and a second prepared electrode to be disconnected with a first contact electrode and a second contact electrode respectively;
placing an upper spare LED chip above the on-board LED chip, and enabling a first spare chip electrode and a second spare chip electrode in the spare LED chip to be respectively aligned with the first spare electrode and the second spare electrode;
and bonding the first spare chip electrode and the second spare chip electrode in the spare LED chip with the first spare electrode and the second spare electrode respectively.
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| CN117832111B (en) * | 2024-03-01 | 2024-07-30 | 上海聚跃检测技术有限公司 | Chip failure analysis test repair method |
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Address after: 402760 No.69, Wushan Road, Biquan street, Bishan District, Chongqing Patentee after: Chongqing Kangjia Optoelectronic Technology Co.,Ltd. Country or region after: China Address before: 402760 No.69, Wushan Road, Biquan street, Bishan District, Chongqing Patentee before: Chongqing Kangjia Photoelectric Technology Research Institute Co.,Ltd. Country or region before: China |