CN113496657A - Manufacturing method of hot melt adhesive mold and LED display module - Google Patents
Manufacturing method of hot melt adhesive mold and LED display module Download PDFInfo
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- CN113496657A CN113496657A CN202010203730.7A CN202010203730A CN113496657A CN 113496657 A CN113496657 A CN 113496657A CN 202010203730 A CN202010203730 A CN 202010203730A CN 113496657 A CN113496657 A CN 113496657A
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- 239000004831 Hot glue Substances 0.000 title claims abstract description 96
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000011324 bead Substances 0.000 claims abstract description 45
- 239000003292 glue Substances 0.000 claims abstract description 37
- 239000010410 layer Substances 0.000 claims description 40
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000007731 hot pressing Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
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- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- -1 Polyethylene Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 3
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
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- 239000011347 resin Substances 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
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- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Abstract
The invention discloses a hot melt adhesive die and a manufacturing method of an LED display module, and belongs to the technical field of LED display screen processing. The manufacturing method of the LED display module comprises the following steps: providing an LED lamp panel, wherein the lamp surface of the LED lamp panel is equally divided into a plurality of square areas, and each square area comprises 2N LED lamp beads; providing a hot melt adhesive mold, wherein a plurality of square grooves are formed in the surface of one side of the hot melt adhesive mold, and each square groove is provided with a plurality of convex ribs which are in one-to-one correspondence with a plurality of lamp seams in a corresponding square area; after glue with preset capacity is injected into each square groove of the hot melt adhesive mold in sequence, the LED lamp panel lamp is buckled into the hot melt adhesive mold face down, the LED lamp panel lamp is placed in a preset environment for curing treatment, and after the glue is completely solidified, the hot melt adhesive mold and redundant glue clots are removed to obtain the LED display module. According to the technical scheme, the damp-proof and anti-collision performance of the LED display module can be greatly improved, and the modularization phenomenon can not be generated.
Description
Technical Field
The invention relates to the technical field of LED display screen processing, in particular to a hot melt adhesive die and a manufacturing method of an LED display module.
Background
With the progress of technology and the market demand, LED display screens are developing toward smaller and smaller dot spacing to display finer and finer pictures, but this also brings another problem: because realize little dot interval, need little LED lamp pearl, and little LED lamp pearl can lead to the welding area undersize for the bonding strength between LED lamp pearl and PCB board reduces, thereby leads to the more and more fragile of booth apart from LED display screen, leads to LED lamp pearl to drop because of colliding with easily in transportation, dismouting and maintenance process. On the other hand, the condition that the lamp is dead due to short circuit caused by the fact that moisture easily enters the LED lamp bead due to the packaging factor exists at present.
In order to solve the above problems, a so-called GOB process is developed in the market recently, i.e. a layer of glue is coated on the surface of an LED module to achieve waterproof, moisture-proof and anti-collision effects, but the process has the disadvantages of difficult maintenance, severe modularization effect after assembling into a large screen, and the like. Therefore, some packaging manufacturers have developed 4-in-1 integrated packaged LED lamp beads, that is, 4 full-color LED lamp beads are packaged together. Therefore, the bonding strength between the LED lamp beads and the PCB is enhanced, the anti-collision performance of the LED display module is enhanced, and the SMT pasting efficiency is improved. However, the lamp pins still leak, so the packaging does not solve the problem of moisture resistance, and meanwhile, the reject ratio of the lamp beads is increased to 4 times due to the fact that 4 lamp beads are packaged together, and the cost of glue and a BT (Bismaleimide Triazine) board (resin-based copper clad laminate) for packaging is increased.
Disclosure of Invention
The invention mainly aims to provide a method for manufacturing a hot melt adhesive die and an LED display module, and aims to solve the technical problems that the traditional small-space LED display screen is poor in anti-collision performance and cannot be protected against moisture in the prior art.
In order to achieve the above object, the present invention provides a method for manufacturing a hot melt adhesive mold, which is suitable for a manufacturing process of an LED display module, the method comprising the steps of: providing a metal mold, wherein a plurality of square blocks are convexly arranged on the surface of one side of the metal mold, a plurality of transverse grooves and a plurality of longitudinal grooves are arranged on each square block, and a preset interval is arranged between every two adjacent square blocks; providing a hot melt adhesive layer, and placing the hot melt adhesive layer on a hot pressing platform; and placing the metal mold in the hot melt adhesive layer, and heating and pressurizing the metal mold after the plurality of square blocks are tightly attached to the hot melt adhesive layer to obtain the hot melt adhesive mold.
Optionally, a film layer is disposed between the hot melt adhesive layer and the hot pressing platform.
Optionally, the heating and pressurizing treatment is to apply a pressure of 0.1Mpa to 10Mpa to the metal mold placed on the hot melt adhesive layer, and meanwhile, the heating temperature is 70 ℃ to 150 ℃, and the duration of the whole process is 10s to 360 s.
Optionally, the width of the transverse groove or the longitudinal groove is greater than 0.1mm and smaller than the width of the light slit of the LED lamp bead; the depth of the transverse groove or the longitudinal groove is larger than 0.1mm and smaller than the height of the LED lamp bead.
Optionally, the thickness of the hot melt adhesive layer is greater than 1/10 heights of the LED lamp beads, and is less than or equal to 6/5 heights of the LED lamp beads.
Optionally, the material of the hot melt adhesive layer is any one of EVA (Ethylene-Vinyl Acetate Copolymer), PE (Polyethylene), PP (Polypropylene), PA (Polyamide), PEs (polyether sulfone resin), PO (Propylene Oxide), and TPU (Thermoplastic polyurethane elastomer rubber).
Optionally, the film layer is made of PET (Polyethylene Terephthalate) or PC (Polycarbonate).
In addition, in order to achieve the above object, the present invention further provides a method for manufacturing an LED display module, the method comprising the steps of: providing an LED lamp panel, wherein the lamp surface of the LED lamp panel is equally divided into a plurality of square areas, each square area comprises 2N LED lamp beads, and N is a positive integer greater than or equal to 2; providing a hot melt adhesive mold, wherein a plurality of square grooves are formed in the surface of one side of the hot melt adhesive mold, the square grooves and the square areas are arranged in a one-to-one correspondence mode, each square groove is matched with the corresponding square area, and each square groove is provided with a plurality of convex ribs in one-to-one correspondence with the lamp seams in the corresponding square area; sequentially injecting glue with a preset volume into each square groove of the hot melt adhesive mold, and then downwards buckling the LED lamp panel lamp into the hot melt adhesive mold, so that all the LED lamp beads in each square area are correspondingly placed in the corresponding square grooves; placing the LED lamp panel buckled into the hot melt adhesive mold in a preset environment for curing treatment, and removing the hot melt adhesive mold and redundant glue clots after the glue is completely solidified to obtain an LED display module; wherein, the hot melt adhesive mould is prepared by the preparation method.
Optionally, the size of each square is smaller than the preset size value of the square area, and the preset size value includes that the length of each square is 0.05mm to 0.1mm larger than the length of the corresponding square area, and the width of each square is 0.05mm to 0.1mm larger than the width of the corresponding square area.
Optionally, the preset volume of glue is such that the volume of glue in each of the square grooves is 1/3 to 1 square groove deep.
According to the manufacturing method of the hot melt adhesive mold and the LED display module, when the LED display module is manufactured, the LED lamp panel is provided, the lamp surface of the LED lamp panel is equally divided into the plurality of square areas, and each square area comprises 2N LED lamp beads. Then, provide a hot melt adhesive mould, this hot melt adhesive mould's a side surface is provided with a plurality of square grooves, and each square groove all is equipped with a plurality of fins with a plurality of light seam one-to-one in the corresponding square region. And then, after glue with a preset volume is sequentially injected into each square groove of the hot melt adhesive mold, the LED lamp panel lamp is downwards buckled into the hot melt adhesive mold, so that all the LED lamp beads in each square area are correspondingly arranged in the corresponding square grooves. And finally, placing the LED lamp panel buckled into the hot melt adhesive mold in a preset environment for curing treatment, and removing the hot melt adhesive mold and redundant glue clots after the glue is completely solidified to obtain the LED display module. It can be seen that, according to the LED display module obtained by the manufacturing method, every 2N LED lamp beads are coated by glue, so that the anti-collision performance of the LED display module lamp beads is enhanced, and meanwhile, due to the existence of the plurality of convex ribs of each square groove, gaps still exist among every 2N LED lamp beads, and the effect that the module directly using 2N to be combined with 1 lamp bead patch is the same as the non-modularization effect can be achieved. Therefore, the technical scheme can greatly improve the moisture-proof and anti-collision performance of the LED display module and can not generate the modularization phenomenon.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a flow chart of a method for manufacturing a hot melt adhesive mold according to an embodiment of the present invention.
Fig. 2 is a schematic structural view of the hot melt adhesive mold in the manufacturing method shown in fig. 1.
Fig. 3 is a block flow diagram of a method for manufacturing a LED display module according to an embodiment of the invention.
Fig. 4 is a schematic structural diagram of the LED lamp panel in the manufacturing method shown in fig. 3.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example one
As shown in fig. 1, a method for manufacturing a hot melt adhesive mold according to an embodiment of the present invention is applicable to a manufacturing process of an LED display module, and the manufacturing method specifically includes the following steps:
step S110: providing a metal mould, wherein a plurality of square blocks are convexly arranged on the surface of one side of the metal mould, a plurality of transverse grooves and a plurality of longitudinal grooves are arranged on each square block, and a preset interval is arranged between every two adjacent square blocks.
Specifically, the material of the metal mold may be steel, aluminum alloy, copper, etc., preferably aluminum alloy. The metal mold is machined through CNC. The surface of the processed metal mold is subjected to sand blasting treatment, and the size of sand used for the sand blasting treatment is 100-300 meshes, preferably 200-300 meshes. A plurality of square blocks are convexly arranged on the surface of one side of the metal die, and the height of each square block is the same as that of an LED lamp bead of the LED display module. Each square block is provided with a plurality of transverse grooves and a plurality of longitudinal grooves, and adjacent square blocks are spaced at preset intervals. The length of the transverse groove is the same as that of the transverse direction of the corresponding square block, and the length of the longitudinal groove is the same as that of the longitudinal direction of the corresponding square block. The specific arrangement positions and specific number of the plurality of transverse grooves and the plurality of longitudinal grooves are related to the specific packaging mode of the LED display module, and four-in-one packaging (four LED lamp beads which are adjacent from top to bottom and are packaged together) is taken as an example. The width of the transverse groove or the longitudinal groove is more than 0.1mm and less than the width of the lamp seam; the depth of the transverse groove or the longitudinal groove is greater than 0.1mm and smaller than the height of the LED lamp bead.
In addition, the size of each square is also related to the square area formed between the corresponding four LED lamp beads, namely the size of each square is larger than the preset size value of the corresponding square area, specifically, the length of each square is larger than the length of the corresponding square area by 0.05mm to 0.1mm, and the width of each square is larger than the width of the corresponding square area by 0.05mm to 0.1 mm.
Step S120: providing a hot melt adhesive layer, and placing the hot melt adhesive layer on a hot pressing platform.
Specifically, in order to avoid the problem that the hot melt adhesive layer is not easy to take off after being heated and pressurized on the hot pressing platform, a thin film layer is arranged between the hot melt adhesive layer and the hot pressing platform. The material of the hot melt adhesive layer is any one of EVA, PE, PP, PA, PES, PO and TPU, and preferably EVA. The thickness of hot melt adhesive layer is greater than 1/10 height of above-mentioned LED lamp pearl, is less than or equal to 6/5 height of above-mentioned LED lamp pearl. The material of the film layer is PET or PC, preferably PET. The thickness of hot melt adhesive layer is greater than 1/10 heights of above-mentioned LED lamp pearl, and for saving cost, the thickness of hot melt adhesive layer is less than or equal to 6/5 heights of above-mentioned LED lamp pearl. This hot melt adhesive layer can adopt integral type structural design with this thin layer, forms a complex film promptly, and this complex film is formed by hot melt adhesive film and PET or PC membrane complex, and the best is that hot melt adhesive film and PET membrane complex form.
Step S130: and placing the metal mold on the hot melt adhesive layer, and heating and pressurizing the square blocks after the square blocks are tightly attached to the hot melt adhesive layer to obtain the hot melt adhesive mold.
Specifically, after the hot melt adhesive layer is placed on the hot pressing platform, the metal mold is placed on the hot melt adhesive layer, and the square blocks are tightly attached to the hot melt adhesive layer, at the moment, the hot pressing platform is used for heating and pressurizing the whole hot melt adhesive layer, specifically, the metal mold placed on the hot melt adhesive composite film is applied with a pressure of 0.1Mpa to 10Mpa, meanwhile, the heating temperature is 70 ℃ to 150 ℃, and the duration time of the whole process is 10s to 360 s. After the heat and pressure treatment is finished, as shown in fig. 2, the hot melt adhesive layer covers one surface of the square block of the metal mold to form a square groove 210, and a protruding rib 220 perpendicular to each other is further protruded in the square groove 210 (corresponding to the transverse groove and the longitudinal groove perpendicular to each other on the square block of the metal mold), so as to obtain the hot melt adhesive mold 200 in the present embodiment.
Example two
As shown in fig. 3, a second embodiment of the present invention provides a method for manufacturing an LED display module, which specifically includes the following steps:
step S210: the LED lamp panel is provided, the lamp surface of the LED lamp panel is equally divided into a plurality of square areas, each square area comprises 2N LED lamp beads, and N is a positive integer greater than or equal to 2.
Specifically, as shown in fig. 4, the lamp surface of the LED lamp panel 100 is equally divided into a plurality of square areas 110, each square area 110 includes four adjacent LED lamp beads 120, that is, N in this embodiment is 2. For those skilled in the art, the range of each square region 110 can be expanded according to the actual packaging requirement, so that each square region 110 includes more LED beads 120, and finally, 2N-in-one packages are formed for a plurality of LED beads 120 in each square region 110, and it is only necessary that N is a positive integer greater than or equal to 2.
Step S220: the hot melt adhesive mold is characterized in that a plurality of square grooves are formed in one side surface of the hot melt adhesive mold, the square grooves are arranged in a one-to-one correspondence mode with a plurality of square areas, each square groove is matched with the corresponding square area, and each square groove is provided with a plurality of convex ribs in one-to-one correspondence with a plurality of lamp seams in the corresponding square area.
Specifically, as shown in fig. 2 and 4, the hot melt adhesive mold 200 is manufactured by the manufacturing method in the first embodiment, a plurality of square grooves 210 are formed on a surface of one side of the hot melt adhesive mold 200, the plurality of square grooves 210 are arranged in one-to-one correspondence with the plurality of square regions 110, each square groove 210 is adapted to a corresponding square region 110, each square groove 210 is provided with a plurality of ribs 220 in one-to-one correspondence with the plurality of light slits 130 in the corresponding square region 110, so that each square groove 210 is divided into a plurality of small square grooves (not labeled in the figures) in one-to-one correspondence with all the LED lamp beads 120 in the corresponding square region 110. Because each square region 110 of this embodiment includes four adjacent LED lamp beads 120 from top to bottom, from left to right, therefore, set up two crisscross protruding ribs 220 in each square groove 210 of this embodiment to form four adjacent small square grooves from top to bottom, from left to right.
Step S130: after glue with preset volume is injected into each square groove of the hot melt adhesive mold in sequence, the LED lamp panel lamp is buckled into the hot melt adhesive mold face downwards, and all the LED lamp beads in each square area are correspondingly arranged in the corresponding square grooves.
Specifically, as shown in fig. 2 and 3, after glue with a preset volume is sequentially injected into each square groove 210 of the hot melt adhesive mold 200 (the glue with the preset volume is such that the volume of the glue in each square groove 210 is 1/3 to the depth of 1 square groove 210), the lamp of the LED lamp panel 100 is then buckled into the hot melt adhesive mold 200 in a downward facing manner, so that all LED lamp beads 120 in each square area 110 are correspondingly placed in the corresponding square grooves 210, i.e., all LED lamp beads 120 are soaked by the glue in the corresponding square grooves 210, and simultaneously, all LED lamp beads 120 in each square area 110 are separated by the corresponding protruding ribs 220. The glue in the step is any one of epoxy resin glue, PU (Polyurethane) glue, UV (Ultraviolet) glue or silicone resin glue.
Step S140: and placing the LED lamp panel buckled into the hot melt adhesive mold in a preset environment for curing treatment, and removing the hot melt adhesive mold and redundant glue clots after the glue is completely solidified to obtain the LED display module.
Specifically, as shown in fig. 2 and 4, after the LED lamp panel 100 is inserted into the hot melt adhesive mold 200 in a downward manner through the above steps, the LED lamp panel inserted into the hot melt adhesive mold may be placed in a preset environment for curing, specifically, in order to overcome possible deformation of the LED lamp panel 100, the back surface of the LED lamp panel 100 is pressed by a pressing block, and the weight of the pressing block is 0.5-5 kg. Then, the whole LED lamp panel 100 buckled in the hot melt adhesive mold 200 is cured at a certain temperature, wherein the curing temperature is from room temperature to 60 ℃. After the curing is completed, the hot melt adhesive mold 200 is removed, and then redundant glue clots around the LED lamp panel 100 are cut off by CNC processing or a dicing saw, so as to obtain an LED display module in which every 4 (or 2N, N is greater than or equal to 2) LED lamp beads are coated with glue.
According to the manufacturing method of the hot melt adhesive mold and the LED display module, when the LED display module is manufactured, the LED lamp panel is provided, the lamp surface of the LED lamp panel is equally divided into the plurality of square areas, and each square area comprises 2N LED lamp beads. Then, provide a hot melt adhesive mould, this hot melt adhesive mould's a side surface is provided with a plurality of square grooves, and each square groove all is equipped with a plurality of fins with a plurality of light seam one-to-one in the corresponding square region. And then, after glue with a preset volume is sequentially injected into each square groove of the hot melt adhesive mold, the LED lamp panel lamp is downwards buckled into the hot melt adhesive mold, so that all the LED lamp beads in each square area are correspondingly arranged in the corresponding square grooves. And finally, placing the LED lamp panel buckled into the hot melt adhesive mold in a preset environment for curing treatment, and removing the hot melt adhesive mold and redundant glue clots after the glue is completely solidified to obtain the LED display module. It can be seen that, according to the LED display module obtained by the manufacturing method, every 2N LED lamp beads are coated by glue, so that the anti-collision performance of the LED display module lamp beads is enhanced, and meanwhile, due to the existence of the plurality of convex ribs of each square groove, gaps still exist among every 2N LED lamp beads, and the effect that the module directly using 2N to be combined with 1 lamp bead patch is the same as the non-modularization effect can be achieved. Therefore, the technical scheme can greatly improve the moisture-proof and anti-collision performance of the LED display module and can not generate the modularization phenomenon.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and the scope of protection is still within the scope of the invention.
Claims (10)
1. The manufacturing method of the hot melt adhesive mold is suitable for the manufacturing process of the LED display module, and is characterized by comprising the following steps:
providing a metal mold, wherein a plurality of square blocks are convexly arranged on the surface of one side of the metal mold, a plurality of transverse grooves and a plurality of longitudinal grooves are arranged on each square block, and a preset interval is arranged between every two adjacent square blocks;
providing a hot melt adhesive layer, and placing the hot melt adhesive layer on a hot pressing platform;
and placing the metal mold in the hot melt adhesive layer, and heating and pressurizing the metal mold after the plurality of square blocks are tightly attached to the hot melt adhesive layer to obtain the hot melt adhesive mold.
2. The method of claim 1, wherein a film layer is disposed between the hot melt adhesive layer and the hot press platen.
3. The method according to claim 1, wherein the heating and pressing treatment is performed by applying a pressure of 0.1Mpa to 10Mpa to the metal mold placed on the hot-melt adhesive layer, and at a heating temperature of 70 ℃ to 150 ℃ for a duration of 10s to 360 s.
4. The manufacturing method of claim 1, wherein the width of the transverse groove or the longitudinal groove is greater than 0.1mm and smaller than the width of the light slit of the LED display module; the depth of the transverse groove or the longitudinal groove is larger than 0.1mm and smaller than the height of the LED lamp beads of the LED display module.
5. The manufacturing method of claim 1, wherein the thickness of the hot melt adhesive layer is greater than 1/10 height of the LED beads of the LED display module and less than or equal to 6/5 height of the LED beads of the LED display module.
6. The manufacturing method of claim 1, wherein the material of the hot melt adhesive layer is any one of EVA, PE, PP, PA, PES, PO and TPU.
7. The method of claim 2, wherein the film layer is made of PET or PC.
8. The manufacturing method of the LED display module is characterized by comprising the following steps:
providing an LED lamp panel, wherein the lamp surface of the LED lamp panel is equally divided into a plurality of square areas, each square area comprises 2N LED lamp beads, and N is a positive integer greater than or equal to 2;
providing a hot melt adhesive mold, wherein a plurality of square grooves are formed in the surface of one side of the hot melt adhesive mold, the square grooves and the square areas are arranged in a one-to-one correspondence mode, each square groove is matched with the corresponding square area, and each square groove is provided with a plurality of convex ribs in one-to-one correspondence with the lamp seams in the corresponding square area;
sequentially injecting glue with a preset volume into each square groove of the hot melt adhesive mold, and then downwards buckling the LED lamp panel lamp into the hot melt adhesive mold, so that all the LED lamp beads in each square area are correspondingly placed in the corresponding square grooves;
placing the LED lamp panel buckled into the hot melt adhesive mold in a preset environment for curing treatment, and removing the hot melt adhesive mold and redundant glue clots after the glue is completely solidified to obtain an LED display module;
wherein the hot melt adhesive mold is made by the method of any one of claims 1-7.
9. The method according to claim 8, wherein the predetermined size of each square is smaller than the predetermined size of the square area, and comprises a length of each square being 0.05mm to 0.1mm larger than a length of the corresponding square area and a width of each square being 0.05mm to 0.1mm larger than a width of the corresponding square area.
10. The method of claim 8, wherein the predetermined volume of glue is such that the volume of glue in each of the square grooves is 1/3 to 1 square groove depth.
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