CN113495436A - Photoetching machine for intelligently manufacturing photoelectronic elements - Google Patents
Photoetching machine for intelligently manufacturing photoelectronic elements Download PDFInfo
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- CN113495436A CN113495436A CN202110790892.XA CN202110790892A CN113495436A CN 113495436 A CN113495436 A CN 113495436A CN 202110790892 A CN202110790892 A CN 202110790892A CN 113495436 A CN113495436 A CN 113495436A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000001259 photo etching Methods 0.000 title claims abstract description 14
- 238000004140 cleaning Methods 0.000 claims abstract description 40
- 239000000428 dust Substances 0.000 claims abstract description 23
- 238000001179 sorption measurement Methods 0.000 claims abstract description 17
- 230000005693 optoelectronics Effects 0.000 claims abstract description 14
- 230000000694 effects Effects 0.000 claims description 29
- 238000005507 spraying Methods 0.000 claims description 16
- 238000001459 lithography Methods 0.000 claims description 9
- 210000003437 trachea Anatomy 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 65
- 239000007921 spray Substances 0.000 description 11
- 239000003344 environmental pollutant Substances 0.000 description 10
- 231100000719 pollutant Toxicity 0.000 description 10
- 239000002245 particle Substances 0.000 description 8
- 230000009182 swimming Effects 0.000 description 8
- 238000001089 thermophoresis Methods 0.000 description 7
- 238000007664 blowing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001962 electrophoresis Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000009991 scouring Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000013139 quantization Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229940095676 wafer product Drugs 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
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- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
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- Public Health (AREA)
- Environmental & Geological Engineering (AREA)
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- Plasma & Fusion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a photoetching machine for intelligently manufacturing optoelectronic elements, which structurally comprises: the device comprises a control cabinet, a processing bin, a working table plate, a bracket, a wafer and a constant cleaning device, wherein an exposure assembly and a mechanical arm are arranged in the processing bin, the bracket is fixed on the mechanical arm, the wafer is placed on the bracket, the constant cleaning device is arranged around a through hole of the working table plate, the constant cleaning device consists of an adsorption bin, a fixed seat and a dust cleaning assembly, the fixed seat is fixed on the through hole of the working table plate, the adsorption bin is embedded into the through hole of the working table plate and fixed on the inner wall of the fixed seat, and the dust cleaning assembly is fixed at the top end of the fixed seat.
Description
Technical Field
The invention relates to the field of electronic element manufacturing, in particular to a photoetching machine for intelligently manufacturing optoelectronic elements.
Background
When the photoetching equipment works, light enters from the top of a projection objective lens of an exposure assembly, the exposure treatment is carried out on a product to be detected after the light is adjusted by an objective lens group, some photoetching machines receive wafers through a tray on a manipulator, when the photoetching of the wafers on the tray is finished, the manipulator can drive the tray and the wafers to move out, and workers carry out loading and unloading operation at the moment;
in the above steps, there may be the following cases: 1. in an exposure assembly of the processing bin, a top objective lens is usually directly exposed in the internal environment of photoetching equipment, the light incident surface of the top objective lens is particularly easily polluted by chemical molecules, particles and the like, and the pollutants are easily scattered and settled in the processing bin and fall onto a wafer; 2. the movement of the mechanical arm drives the wafer to be communicated with the inside and the outside of the processing bin, and the movement of the mechanical arm can cause metal abrasion and friction volatilization of lubricating oil, so that chemical molecular pollution, particle pollution and the like are caused to the wafer.
Above two kinds of circumstances all can cause the wafer surface to receive the pollution, reduce the light transmissivity of whole wafer, reduce the imaging effect, and then influence the quality of wafer product, nevertheless do not have the mechanism or the equipment of solving to this problem among the existing equipment, and clear up through the manual work, and it is great to receive the influence of factors such as operating personnel's proficiency for the clearance effect diverse is difficult to have the standard of unified quantization.
Disclosure of Invention
In order to solve the problems, the invention provides a photoetching machine for intelligently manufacturing optoelectronic elements.
In order to achieve the purpose, the invention is realized by the following technical scheme: a photoetching machine for intelligently manufacturing optoelectronic elements structurally comprises: the device comprises a control cabinet, a processing bin, a working table plate, a bracket, a wafer and a constant cleaning device, wherein the control cabinet is fixed on the left side of the processing bin, an exposure assembly and a mechanical arm are arranged in the processing bin, the working table plate is horizontally arranged in the processing bin and positioned below the exposure assembly, a through hole in the shape of a trapezoid is formed in the working table plate, the bracket is fixed on the mechanical arm and abuts against the through hole of the working table plate, the wafer is placed on the bracket, the constant cleaning device is arranged around the through hole of the working table plate in a surrounding mode, the constant cleaning device comprises an adsorption bin, a fixed seat and a dust cleaning assembly, the fixed seat is annular and fixed on the through hole of the working table plate, the diameter of the inner wall of the fixed seat is equal to that of the through hole of the working table plate, the adsorption bin is embedded into the through hole of the working table plate and fixed on the inner wall of the fixed seat, and the dust cleaning assembly is fixed at the top end of the fixed seat, the centers of all parts of the constant-cleaning device are positioned on the axis of the through hole of the workbench plate.
Preferably, the structure of the adsorption bin comprises: negative pressure chamber shell, filter screen, gas port, negative pressure chamber shell is pipe form and inside and is the cavity, negative pressure chamber shell top is held level with the top of fixing base, the top at negative pressure chamber shell inboard is established to the gas port, the filter screen is established at the inside middle section of negative pressure chamber shell, the outside of negative pressure chamber shell bottom is encircleed and is equipped with the negative pressure trachea, the negative pressure trachea is connected with outside negative pressure pump, negative pressure trachea's level is less than the level of filter screen, breathes in through the negative pressure pump, makes the interior negative pressure that produces of negative pressure chamber shell to breathe in through the gas port inwards, adsorb the filter screen in to negative pressure chamber shell with the pollutant of wafer top.
Preferably, the air port surrounds and points to the bracket and the wafer, the horizontal height of the bottom end of the air port is lower than that of the top of the wafer, and the horizontal height of the top end of the air port is higher than that of the top of the wafer, so that the horizontal height range of the wafer can be in the adsorption range of the negative pressure cavity shell.
Preferably, the components of the dust cleaning assembly comprise: the ring is spouted in air swimming ring, activity, the air swimming ring is the ring form and inside is the cavity, the air swimming ring inboard is equipped with the opening, the activity is spouted the ring and is annular and block on the inboard opening of air swimming ring, the activity is spouted the ring and is the clearance block with air swimming ring, the air swimming ring outside is encircleed and is equipped with the gas blow pipe, the gas blow pipe is connected with outside air pump, and outside air pump passes through the gas blow pipe and pressurizes to the intra-annular air feed of air swimming, then spouts the ring through the activity with clean gas blowout, carries out the air current to wafer surface and wafer upper portion subregion and erodees, blows away the pollutant, and the cooperation adsorbs the storehouse simultaneously and siphons away the pollutant, keeps the clean and tidy in wafer surface and wafer upper portion subregion.
Preferably, the activity is spouted and is right trapezoid and the directional activity of hypotenuse and spout the centre of a circle department of ring under the ring sidedness visual angle, the activity is spouted and is equipped with air-pushed chamber, push pedal, nozzle on the ring, the air-pushed chamber is circular-arc and establishes in the outside that the ring was spouted in the activity, the push pedal is equipped with five and establishes at air-pushed intracavity side, six parts are evenly separated into with the air-pushed chamber to the push pedal, the nozzle is established and is spouted the inboard just directional activity of ring and spout the centre of a circle of ring in the activity, the nozzle is equipped with six and corresponding with air-pushed intracavity divided six parts, and when the air-pushed intra-annular is full of gas, the intra-annular gas of air-pushed chamber can gush into, thereby spouts a tangential thrust of ring for the activity through the push pedal of striking slope to it is rotatory to drive the activity and spout the ring.
Preferably, the nozzle is thin flat and is made of rubber, the opening of the nozzle is in a shape of large upper end and small lower end, the rear end opening of the nozzle is fixed on the movable spray ring and communicated with the air pushing cavity, the front end opening of the nozzle points to the wafer at the center of the movable spray ring, the air spraying range of the front end opening of the nozzle is vertical sheet, the length of the projection of the air spraying range of the nozzle on the wafer is larger than the radius of the wafer, when the air in the air pushing cavity rushes into the air pushing cavity, the air is sprayed out from the thin flat nozzle to enable the air to be sprayed into sheets, and the air is driven by the rotation of the movable spray ring, so that the air sprayed out of the nozzle scrapes the surface of the wafer, the wind power borne by the dust particles on the surface of the wafer is lateral force, and the cleaning effect is enhanced.
Preferably, the push plate is in a flash type three-section bending shape, the three sections of the push plate are not parallel or perpendicular to the nozzle, the pushing force of wind power is enhanced, and meanwhile, the three sections are bent, so that the wind entering the air pushing cavity to the nozzle has left and right impact force, the nozzle slightly swings, and the lateral wind power applied to dust particles on the surface of the wafer is enhanced.
Advantageous effects
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the constant-cleaning device is arranged on the working table surface, clean gas provided by the air-swimming ring is sprayed out by the movable spraying ring, the surface of the wafer and the upper part area of the wafer are subjected to air flow scouring, negative pressure generated in the negative pressure cavity shell is utilized to suck air inwards, pollutants above the wafer are adsorbed to the filter screen in the negative pressure cavity shell, and the surface of the wafer and the upper part area of the wafer are kept clean.
2. When the air-bearing ring is filled with air, the air in the air-bearing ring can flow into the air pushing cavity, and the inclined pushing plate is impacted to provide tangential pushing force for the movable spraying ring so as to drive the movable spraying ring to rotate, the air is sprayed out from the thin flat nozzle to be sprayed into a sheet shape and driven by the rotation of the movable spraying ring, so that the air sprayed out from the nozzle scrapes the surface of the wafer, and the wind power on dust particles on the surface of the wafer is a lateral force, thereby enhancing the cleaning effect.
3. The invention sets the push plate into a flash type three-section bending shape, and the three sections of the push plate are not parallel or vertical to the nozzle, thereby strengthening the driving force of wind power, and simultaneously, the three-section bending enables the wind entering the air pushing cavity to the nozzle to have left and right impact force, thereby enabling the nozzle to slightly swing and strengthening the lateral wind power to which the dust particles on the surface of the wafer are subjected.
Drawings
FIG. 1 is a schematic diagram of an external view of a lithography machine for intelligently manufacturing optoelectronic devices according to the present invention.
Fig. 2 is a schematic front sectional structure view of the constant-net device of the invention with detached components.
Fig. 3 is a schematic diagram of a partial front cross-sectional structure of the constant-net device of the invention.
Fig. 4 is a schematic top view of the adsorption bin of the present invention.
FIG. 5 is a schematic top view of the dust cleaning assembly of the present invention.
FIG. 6 is a schematic three-dimensional structure of the dust cleaning assembly of the present invention.
FIG. 7 is a schematic top view of the push plate of the present invention.
FIG. 8 is a schematic front view of a nozzle according to the present invention
In the figure: the device comprises a control cabinet-1, a processing bin-2, a workbench plate-3, a bracket-4, a wafer-5, a constant cleaning device-6, an adsorption bin-61, a fixed seat-62, a dust cleaning component-63, a negative pressure cavity shell-611, a filter screen-612, an air port-613, an air swimming ring-631, a movable spraying ring-632, an air pushing cavity-6321, a push plate-6322, a nozzle-6323, a negative pressure air pipe-A and an air blowing pipe-B.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
Example 1
As shown in fig. 1 to 3, the present invention provides a lithography machine for intelligent manufacturing of optoelectronic devices, which comprises: the device comprises a control cabinet 1, a processing bin 2, a working table plate 3, a bracket 4, a wafer 5 and a constant cleaning device 6, wherein the control cabinet 1 is fixed at the left side of the processing bin 2, an exposure component and a mechanical arm are arranged in the processing bin 2, the working table plate 3 is horizontally arranged in the processing bin 2 and is positioned below the exposure component, a through hole with a trapezoidal outline is arranged on the working table plate 3, the bracket 4 is fixed on the mechanical arm and is propped against the through hole of the working table plate 3, the wafer 5 is arranged on the bracket 4, the constant cleaning device 6 is arranged around the through hole of the working table plate 3 in a surrounding manner, the constant cleaning device 6 comprises an adsorption bin 61, a fixed seat 62 and a dust cleaning component 63, the fixed seat 62 is annular, the fixed seat 62 is fixed on the through hole of the working table plate 3, the diameter of the inner wall of the fixed seat 62 is equal to the diameter of the through hole of the working table plate 3, the adsorption bin 61 is embedded into the through hole of the working table plate 3 and is fixed on the inner wall of the fixed seat 62, the dust cleaning assembly 63 is fixed at the top end of the fixed seat 62, and the centers of all the parts of the constant cleaning device 6 are all positioned on the axis of the through hole of the working bedplate 3.
As shown in fig. 3 and 4, the structure of the adsorption bin 61 includes: the negative pressure cavity shell 611 is in a circular tube shape, the inside of the negative pressure cavity shell 611 is a cavity, the top end of the negative pressure cavity shell 611 is flush with the top end of the fixing seat 62, the air port 613 is arranged at the top end of the inner side of the negative pressure cavity shell 611, the filter screen 612 is arranged at the middle section of the inner side of the negative pressure cavity shell 611, a negative pressure air pipe A is arranged around the outer side of the bottom of the negative pressure cavity shell 611 and connected with an external negative pressure pump, the horizontal height of the negative pressure air pipe A is lower than that of the filter screen 612, air is sucked through the negative pressure pump, negative pressure is generated in the negative pressure cavity shell 611, and therefore air is sucked inwards through the air port 613, and pollutants above the wafer are adsorbed onto the filter screen 612 in the negative pressure cavity shell 611.
Example 2
As shown in fig. 1 to 3, the present invention provides a lithography machine for intelligent manufacturing of optoelectronic devices, which comprises: the device comprises a control cabinet 1, a processing bin 2, a working table plate 3, a bracket 4, a wafer 5 and a constant cleaning device 6, wherein the control cabinet 1 is fixed at the left side of the processing bin 2, an exposure component and a mechanical arm are arranged in the processing bin 2, the working table plate 3 is horizontally arranged in the processing bin 2 and is positioned below the exposure component, a through hole with a trapezoidal outline is arranged on the working table plate 3, the bracket 4 is fixed on the mechanical arm and is propped against the through hole of the working table plate 3, the wafer 5 is arranged on the bracket 4, the constant cleaning device 6 is arranged around the through hole of the working table plate 3 in a surrounding manner, the constant cleaning device 6 comprises an adsorption bin 61, a fixed seat 62 and a dust cleaning component 63, the fixed seat 62 is annular, the fixed seat 62 is fixed on the through hole of the working table plate 3, the diameter of the inner wall of the fixed seat 62 is equal to the diameter of the through hole of the working table plate 3, the adsorption bin 61 is embedded into the through hole of the working table plate 3 and is fixed on the inner wall of the fixed seat 62, the dust cleaning assembly 63 is fixed at the top end of the fixed seat 62, and the centers of all the parts of the constant cleaning device 6 are all positioned on the axis of the through hole of the working bedplate 3.
As shown in fig. 3 and 4, the structure of the adsorption bin 61 includes: the negative pressure cavity shell 611 is in a circular tube shape, the inside of the negative pressure cavity shell 611 is a cavity, the top end of the negative pressure cavity shell 611 is flush with the top end of the fixing seat 62, the air port 613 is arranged at the top end of the inner side of the negative pressure cavity shell 611, the filter screen 612 is arranged at the middle section of the inner side of the negative pressure cavity shell 611, a negative pressure air pipe A is arranged around the outer side of the bottom of the negative pressure cavity shell 611 and connected with an external negative pressure pump, the horizontal height of the negative pressure air pipe A is lower than that of the filter screen 612, air is sucked through the negative pressure pump, negative pressure is generated in the negative pressure cavity shell 611, and therefore air is sucked inwards through the air port 613, and pollutants above the wafer are adsorbed onto the filter screen 612 in the negative pressure cavity shell 611.
As shown in fig. 3 and 4, the gas port 613 surrounds and points to the pedestal 4 and the wafer 5, the bottom end of the gas port 613 has a lower level than the top of the wafer 5, and the top end of the gas port 613 has a higher level than the top of the wafer 5, so as to ensure that the wafer is located in a level range within the suction range of the sub-pressure chamber shell 611.
As shown in fig. 3, 5 and 6, the components of the dust cleaning assembly 63 include: ring 632 is spouted in thermophoresis ring 631, activity, thermophoresis ring 631 is the ring form and inside cavity that is, thermophoresis ring 631 inboard is equipped with the opening, ring 632 is spouted in the activity is annular and the block is on the inboard opening of thermophoresis ring 631, ring 632 and thermophoresis ring 631 are the clearance block for the activity, the thermophoresis ring 631 outside is encircleed and is equipped with gas blow pipe B, gas blow pipe B is connected with the outside air pump, and the pressurization of supplying air in outside air pump passes through gas blow pipe B to thermophoresis ring 631, then spouts the clear gaseous blowout through activity, carries out the air current to wafer 5 surface and wafer 5 upper portion region and erodees, blows away the pollutant, and the cooperation adsorbs storehouse 61 simultaneously siphons away the pollutant, keeps wafer 5 surface and wafer 5 upper portion region's clean and tidy.
As shown in fig. 5-8, the movable spray ring 632 is a right trapezoid with a cross-sectional side angle and the inclined side points to the center of the movable spray ring 632, the movable spray ring 632 is provided with an air pushing cavity 6321, a push plate 6322 and a nozzle 6323, the air pushing cavity 6321 is arc-shaped and is disposed outside the movable spray ring 632, the push plate 6322 is provided with five pieces and is disposed inside the air pushing cavity 6321, the push plate 6322 uniformly partitions the air pushing cavity 6321 into six parts, the nozzle 6323 is disposed inside the movable spray ring 632 and points to the center of the movable spray ring 632, the nozzle 6323 is provided with six pieces and corresponds to the six parts partitioned inside the air pushing cavity 6321, when the air pushing ring 631 is filled with air, the air inside the air pushing cavity 6321 can flow in, and a tangential thrust is given to the movable spray ring 632 by striking the inclined push plate 6322, so as to drive the movable spray ring 632 to rotate.
As shown in fig. 7 and 8, the nozzle 6323 is thin and flat and made of rubber, the through opening of the nozzle 6323 is in a shape of "large upper end and small lower end", the rear end opening of the nozzle 6323 is fixed on the movable nozzle ring 632 and is communicated with the air pushing cavity 6321, the front end opening of the nozzle 6323 is directed to the wafer 5 at the center of the movable nozzle ring 632, the air spraying range of the front end opening of the nozzle 6323 is vertical and flaky, the length of the air spraying range projected on the wafer 5 of the nozzle 6323 is greater than the radius of the wafer 5, when the air in the air pushing cavity 6321 rushes into the air pushing cavity 631, the air is sprayed from the thin and flat nozzle 6323, so that the air is sprayed into a sheet shape and is driven by the rotation of the movable nozzle ring 632, so that the air sprayed from the nozzle 6323 scrapes the surface of the wafer 5, and the wind force applied to the dust particles on the surface of the wafer 5 is a lateral force, thereby enhancing the cleaning effect.
As shown in fig. 7, the push plate 6322 is a flash three-segment bent shape, three segments of the push plate 6322 are not parallel or perpendicular to the nozzles 6323, so as to enhance the driving force of the wind power, and the three segments are bent to make the wind entering the air pushing cavity 6321 to the nozzles 6323 have impact forces in the left and right directions, so that the nozzles 6323 slightly swing to enhance the lateral wind power to the dust particles on the surface of the wafer 5.
The working principle of the present invention is explained as follows:
placement of wafer 5: moving out the mechanical arm in the processing bin 2, placing the wafer 5 on the bracket 4, then moving the mechanical arm into the processing bin 2, moving the bracket 4 upwards to be propped against the through hole of the working table plate 3, and thus completing the arrangement of the wafer 5;
and (3) photoetching work: the control cabinet 1 controls an exposure component in the processing bin 2 to carry out photoetching operation on the wafer 5, and meanwhile, the manipulator controls the bracket 4 to move to carry out photoetching on the whole wafer 5, and at the moment, the working table plate 3 and the constant cleaning device 6 move along with the position of the bracket 4;
operation of the constant cleaning device 6:
firstly, an external air pump supplies air and pressurizes the inside of the air electrophoresis ring 631 through an air blowing pipe B, the air in the air electrophoresis ring 631 flows into an air pushing cavity 6321, the air impacts an inclined pushing plate 6322 to provide tangential pushing force for the movable spraying ring 632 to drive the movable spraying ring 632 to rotate, meanwhile, the air is sprayed out from a thin and flat nozzle 6323 to enable the air to be sprayed into a sheet shape and to be driven by the rotation of the movable spraying ring 632, so that the air sprayed out from the nozzle 6323 scrapes the surface of the wafer 5, wind power borne by dust particles on the surface of the wafer 5 is lateral force, and the surface of the wafer 5 and partial area on the upper portion of the wafer 5 are subjected to air flow scouring;
secondly, the negative pressure pump sucks air to generate negative pressure in the negative pressure cavity shell 611, so that air is sucked inwards through the air port 613, and pollutants above the wafer are adsorbed onto the filter screen 612 to the inside of the negative pressure cavity shell 611;
thereby keeping the surface of the wafer 5 and the partial area on the wafer 5 clean.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (7)
1. A photoetching machine for intelligently manufacturing optoelectronic elements structurally comprises: switch board (1), processing storehouse (2), work platen (3), bracket (4), wafer (5), permanent clean device (6), the left side in processing storehouse (2) is fixed in switch board (1), there are exposure subassembly and manipulator in processing storehouse (2), work platen (3) set up in processing storehouse (2) and are located the below of exposure subassembly, be equipped with the through-hole on work platen (3), bracket (4) are fixed on the manipulator and are pushed up on the through-hole of work platen (3), wafer (5) are placed on bracket (4), permanent clean device (6) are encircleed and are established around the through-hole of work platen (3), its characterized in that:
the constant-cleaning device (6) is composed of an adsorption bin (61), a fixed seat (62) and a dust cleaning assembly (63), the fixed seat (62) is fixed on a through hole of the working table plate (3), the diameter of the inner wall of the fixed seat (62) is equal to that of the through hole of the working table plate (3), the adsorption bin (61) is embedded into the through hole of the working table plate (3) and fixed on the inner wall of the fixed seat (62), the dust cleaning assembly (63) is fixed at the top end of the fixed seat (62), and the centers of all parts of the constant-cleaning device (6) are located on the axis of the through hole of the working table plate (3).
2. A lithography machine for intelligent fabrication of optoelectronic components according to claim 1, wherein: the structure of the adsorption bin (61) comprises: negative pressure chamber shell (611), filter screen (612), gas port (613), negative pressure chamber shell (611) are pipe form and inside cavity that is, the top at negative pressure chamber shell (611) inboard is established in gas port (613), the inside middle section at negative pressure chamber shell (611) is established in filter screen (612), the outside of negative pressure chamber shell (611) bottom is around being equipped with negative pressure trachea (A), negative pressure trachea (A) is connected with outside negative pressure pump, the level of negative pressure trachea (A) is less than the level of filter screen (612).
3. A lithography machine for intelligent fabrication of optoelectronic components according to claim 2, wherein: the gas port (613) surrounds and points to the bracket (4) and the wafer (5), the level of the bottom end of the gas port (613) is lower than that of the top of the wafer (5), and the level of the top end of the gas port (613) is higher than that of the top of the wafer (5).
4. A lithography machine for intelligent fabrication of optoelectronic components according to claim 1, wherein: the components of the dust cleaning assembly (63) include: ring (632) is spouted in pneumatics ring (631), activity, ring (631) is the ring form and inside is the cavity, the pneumatics ring (631) inboard is equipped with the opening, ring (632) is spouted in the activity and is annular and block on the inboard opening of pneumatics ring (631), ring (632) is spouted for the clearance block with ring (631) is spouted in the activity, the outside of pneumatics ring (631) is encircleed and is equipped with gas blow pipe (B), gas blow pipe (B) is connected with the air pump of outside.
5. A lithography machine for intelligent fabrication of optoelectronic components according to claim 4, wherein: it pushes away chamber (6321), push pedal (6322), nozzle (6323) to be equipped with the gas on ring (632) to move about, the gas pushes away chamber (6321) and for circular-arc and establish the outside that spouts ring (632) in the activity, push pedal (6322) are equipped with five and establish and push away chamber (6321) inboardly at the gas, push pedal (6322) push away chamber (6321) with the gas and evenly separate into six parts, establish in activity spout the centre of a circle that ring (632) are inboard and point to the activity and spout ring (632), nozzle (6323) are equipped with six and push away the chamber (6321) interior six parts of separated corresponding with the gas.
6. A lithography machine for intelligent fabrication of optoelectronic components according to claim 5, wherein: the wafer spraying device is characterized in that the nozzle (6323) is thin and flat and is made of rubber, an opening at the rear end of the nozzle (6323) is fixed on the movable spraying ring (632) and communicated with the air pushing cavity (6321), an opening at the front end of the nozzle (6323) points to the wafer (5), the air spraying range of the opening at the front end of the nozzle (6323) is vertical and flaky, and the length of the projection of the air spraying range of the nozzle (6323) on the wafer (5) is greater than the radius of the wafer (5).
7. A lithography machine for intelligent fabrication of optoelectronic components according to claim 5, wherein: the push plate (6322) is in a flash three-section bending shape, and three sections of the push plate (6322) are not parallel or perpendicular to the nozzle (6323).
Priority Applications (1)
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