CN113484697A - Insulator leakage analysis system and method - Google Patents
Insulator leakage analysis system and method Download PDFInfo
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- CN113484697A CN113484697A CN202110545846.3A CN202110545846A CN113484697A CN 113484697 A CN113484697 A CN 113484697A CN 202110545846 A CN202110545846 A CN 202110545846A CN 113484697 A CN113484697 A CN 113484697A
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- 239000012212 insulator Substances 0.000 title claims abstract description 191
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- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
- G01R31/1245—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of line insulators or spacers, e.g. ceramic overhead line cap insulators; of insulators in HV bushings
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Abstract
The invention discloses an insulator leakage analysis system and a method, wherein the analysis system comprises a microprocessor MCU and a power supply module, a signal acquisition end of the microprocessor MCU is connected with an acquisition circuit, the acquisition circuit is used for acquiring an insulator induction signal of a signal acquisition device, a memory and a register are arranged in the microprocessor MCU, and a communication end of the microprocessor MCU is connected with a wireless communication module and is used for communicating with a handheld terminal; and the timing end of the microprocessor MCU is connected with a timer. And an analysis method is set based on an analysis system, so that the functions of detection, data processing, signal transmission and the like of the surface of the insulator string are realized. The working performance of the insulator is ensured, and the working reliability of the insulator is improved.
Description
Technical Field
The invention relates to the technical field of insulator flashover, in particular to an insulator leakage analysis system and method.
Background
Because insulators are used on a power supply line in large quantities in China, particularly high-voltage insulators are used in places such as railway systems, transformer substations and the like in large quantities, the working state of the insulators is directly related to whether the power supply line is safe or not. The method has great significance for providing the running condition of the high-voltage insulator for the power supply line.
The insulator is in the use process, the phenomenon of flashover (the phenomenon of discharging on the surface of an insulating project) often appears, the insulator can cause tripping of a substation when the flashover is serious, and even if the insulator can be switched on again after the tripping phenomenon appears, the insulator can also influence the power utilization.
In order to avoid tripping of a substation caused by insulator flashover, a method for regularly cleaning insulators is generally adopted at present. Taking the Jing Hu high-speed rail as an example, a heavily-polluted area is cleaned twice by manpower in one year; in general, the section is manually cleaned once in three years, and is rinsed once in a year. Although the cleaning frequency is much higher than the requirement of the iron standard, the situation of insulator flashover cannot be effectively avoided.
Because effective data, a system and a method are not used as support, the insulators in the light pollution area are cleaned under the condition of cleanness, and a large amount of maintenance cost is wasted; in the heavily polluted area, the cleaning frequency is insufficient, and the cleaning quality can not meet the requirement.
Based on the defects, detection needs to be performed for the serious condition of insulator surface flashover, and a control system is developed based on a detection technology to perform reasonable detection and analysis. So as to make a reasonable and basis sweeping plan for targeted cleaning.
Disclosure of Invention
In order to solve the problems, the invention provides an insulator leakage analysis system and method, and the insulator leakage analysis system is designed to detect dust on the surface of an insulator in real time, analyze detection data in a microprocessor and upload the detection data to a handheld terminal.
In order to achieve the purpose, the invention adopts the following specific technical scheme:
the utility model provides an insulator leakage analysis system which the key technology lies in: the system comprises a microprocessor MCU and a power supply module, wherein a signal acquisition end of the microprocessor MCU is connected with an acquisition circuit, the acquisition circuit is used for acquiring an insulator induction signal by a signal acquisition device, a memory and a register are arranged in the microprocessor MCU, and a communication end of the microprocessor MCU is connected with a wireless communication module and is used for communicating with a handheld terminal; the timing end of the microprocessor MCU is connected with a timer;
the power module comprises a low-power-consumption conversion unit, a power end of the low-power-consumption conversion unit is connected with a solar cell panel and a standby battery, a power control end and a power input end of the microprocessor MCU are both connected with the low-power-consumption conversion unit, and the low-power-consumption conversion unit is connected with the acquisition circuit.
Through the design, an analysis system is established, the acquisition circuit is designed and connected to the microprocessor, and the insulator induction signals acquired by the acquisition circuit are acquired, analyzed and sent through the connection with the microprocessor and the equipment arranged in the microprocessor. And a low-power consumption conversion unit is designed to reasonably supply power to the whole analysis process, so that the electric energy is saved, the working time and the service life of the acquisition system are guaranteed, and the maintenance times are reduced.
According to a further technical scheme, the acquisition circuit comprises a current sampling module, a signal amplification module, a waveform turning module and an analog-to-digital conversion module; the sampling input end of the current sampling module is used for acquiring an insulator sensing signal, and the sampling output end of the current sampling module is connected with the signal acquisition end of the microprocessor MCU after passing through the signal amplification module, the waveform overturning module and the analog-to-digital conversion module; the power supply driving end of the low-power-consumption conversion module is connected with the analog-to-digital conversion module, and the power supply output end of the low-power-consumption conversion module is connected with the current sampling module, the signal amplification module, the waveform overturning module, the analog-to-digital conversion module and the microprocessor MCU.
According to the electromagnetic induction principle, weak current is generated according to a magnetic core, a current signal is sampled and obtained by the magnetic core, and is transmitted to a microprocessor after sampling, amplification, waveform inversion and mode conversion, so that current signal collection is realized.
In a still further technical solution, the current sampling module includes an operational amplifier U14, an inverting input terminal of the operational amplifier U14 is grounded through a resistor R2 and a sampling resistor R28, a common terminal of the resistor R2 and the sampling resistor R28 serves as a sampling input terminal of the current sampling module, a non-inverting input terminal of the operational amplifier U14 is grounded through a resistor R1, an output terminal of the operational amplifier U14 is connected to the inverting input terminal of the operational amplifier U14 through a resistor R33, an output terminal of the operational amplifier U14 is connected to one end of a capacitor C11, and the other end of the capacitor C11 serves as a sampling output terminal of the current sampling module;
the signal amplification module comprises an operational amplifier U13, the positive phase of the operational amplifier U13 is connected with one end of a resistor R22 through a resistor R23, the other end of the resistor R22 is used as the amplification input end of the signal amplification module, the amplification input end of the signal amplification module is used for being connected with the sampling output end of the current sampling module, the common end of the resistor R23 and the resistor R22 is grounded through a capacitor C39, the reverse phase input end of the operational amplifier U13 is grounded through a resistor R25, the output end of the operational amplifier U13 is connected with the reverse phase input end of the operational amplifier U13 through a resistor R26, the output end of the operational amplifier U13 is connected with one end of a capacitor C2, and the other end of the capacitor C2 is used as the amplification output end of the signal amplification module.
By adopting the scheme, R28 is a sampling resistor, and the current can be adjusted by adjustment. The ratio of R33 and R2 is the amplification factor, and the C1 filter capacitor filters the DC bias voltage. After passing through the acquisition circuit, the discharge signal of the insulator leakage current sampling ferromagnetic core can be converted into a weak current signal. And the size of the sampling resistor can be set and adjusted according to the environment of the insulator so as to accurately obtain the weak current.
Because the surface discharge amount of the insulator is small, the sampling current generated by the ferromagnetic core is very small, so that an electric signal which is easier to process can be obtained after the signal amplification module amplifies the sampling current.
The waveform inversion module comprises a comparator U15, an operational amplifier U1 and an analog switch chip U11, wherein a positive phase input end of the comparator U15 is connected with one end of a resistor R24, the other end of the resistor R24, one end of a resistor R31 and one end of a resistor R18 are common ends of the comparator U15, the positive phase input end of the resistor R15, the one end of the resistor R31 and the one end of the resistor R18, and the common ends are used as waveform signal input ends of the waveform inversion module; a diode D2 and a diode D1 which are connected in reverse direction are connected in parallel between a positive phase input end and an inverse phase input end of the comparator U15, the inverse phase input end of the comparator U15 is grounded, the output end of the comparator U15 is connected with a high level power supply end of the comparator U15 through a resistor R17, the output end of the comparator U15 is connected with a digital control input end of the analog switch chip U11 through a resistor R32, a first normally open switch input end NO1 of the analog switch chip U11 is connected with the other end of the resistor R31, the positive phase input end of the operational amplifier U1 is grounded, the inverse phase input end of the operational amplifier U1 is connected with the other end of the resistor R18, the inverse phase input end of the operational amplifier U1 is grounded through a capacitor C3, the output end of the operational amplifier U1 is connected with the inverse phase input end of the operational amplifier U1 through a resistor R19 and a capacitor C4 which are connected in parallel, and the output end of the operational amplifier U1 is connected with the first switch chip 11 through a resistor R30 The input end is connected, and the signal output end of the analog switch chip U11 is used as the waveform signal output end of the waveform inversion module and is used for being connected with the analog signal input end of the analog-to-digital conversion module.
By adopting the overturning circuit, the acquired waveform on the negative axis side of the sine waveform is overturned to the positive axis side, so that the sine waveform is transformed into 'steamed bread wave', and the subsequent processing and comparison of signals are facilitated. For smaller adopted current, the current can be ignored, and for larger peak current, due to possible factors such as error acquisition, further processing is carried out. The processing signals are all positive values, and the processing steps and contents can be effectively simplified.
The further technical scheme is as follows: the analog-to-digital conversion module comprises an analog-to-digital conversion chip U3 and an operational amplifier U4, wherein the model of the analog-to-digital conversion chip U3 is AD7091R _ 5;
a positive phase input end of the operational amplifier U4 is used as an analog signal input end of the analog-to-digital conversion module and is used for being connected with a waveform signal output end of the waveform inversion module, an output end of the operational amplifier U4 is connected with an inverted phase input end of the operational amplifier U4, an output end of the operational amplifier U4 is grounded through a resistor R15 and a capacitor C23, a common end of the resistor R15 and the capacitor C23 is connected with a positive phase input end of the operational amplifier U4 through a resistor R74, a common end of the resistor R74 and the capacitor C23 is connected with a first signal input end VIN0 of the analog-to-digital conversion chip U3, and a digital output end of the analog-to-digital conversion chip U3 is used as a digital signal output end of the analog-to-digital conversion module and is used for being connected with the microprocessor MCU; a fourth signal input terminal VIN4 of the analog-to-digital conversion chip U3 is connected to the power driving terminal of the low power consumption conversion module.
By adopting the scheme, analog signals obtained by sampling can be subjected to digital conversion so as to be converted into data which can be identified by a microprocessor, and subsequent signal analysis is facilitated.
The further technical scheme is as follows: the waveform signal output end of the waveform turning module is also connected with a window module, the window module comprises a comparator U10A, a comparator U10B and a window reference value setting chip U9, and the model of the window reference value setting chip U9 is LTC1662CMS 8;
a reference signal input end of the window reference value setting chip U9 is used for acquiring a reference setting signal of the microprocessor MCU, a reference end REF of the window reference value setting chip U9 is connected with a reference voltage output chip U25, and the reference voltage output chip U25 is REF3325 AIDCKR;
the high-level output end of a reference signal of the window reference value setting chip U9 is connected with the inverted input end of the comparator U10A, the non-inverted input end of the comparator U10A is connected with the waveform signal output end of the waveform turning module, and the output end of the comparator U10A is connected with the window high-level feedback input end of the microprocessor MCU;
the low level output end of the reference signal of the window reference value setting chip U9 is connected with the inverting input end of the comparator U10B, the non-inverting input end of the comparator U10B is connected with the waveform signal output end of the waveform turning module, and the output end of the comparator U10B is connected with the window low level feedback input end of the microprocessor MCU.
And comparing and analyzing the obtained steamed bun waveform data by adopting a window module, and giving a threshold value to the window module by the microprocessor so as to obtain a set signal of a threshold value interval and feeding the set signal back to the microprocessor.
The further technical scheme is as follows: the low-power conversion module comprises a micro-power management chip U18 and a low-power supply chip U17, wherein the model of the micro-power management chip U18 is bq25504, and the model of the low-power supply chip U17 is TPS 61220;
a pin VIN _ DC of the micro power management chip U18 is grounded through a capacitor C62 and a capacitor C61, the pin VIN _ DC of the micro power management chip U18 is grounded through a resistor R40, a resistor R42 and a resistor R44, and the pin VIN _ DC of the micro power management chip U18 is used for connecting a solar cell panel and a standby battery; a VSTOR (voltage switch over) end of a pin of the micro-power management chip U18 is used as a power supply driving end of the low-power conversion module;
little power consumption management chip U18's pin VSTOR end still through resistance R36 with low-power consumption power supply chip U17's pin VIN is connected, low-power consumption power supply chip U17's pin L still through electric capacity L4 with low-power consumption power supply chip U17's pin VIN is connected, low-power consumption power supply chip U17's pin VIN is through electric capacity C59 ground connection, low-power consumption power supply chip U17's pin VOUT is through electric capacity C53 ground connection, low-power consumption power supply chip U17's pin VOUT is as the power output of low-power consumption conversion module.
Adopt above-mentioned step, utilize solar cell panel and the stand-by battery who arranges on the insulator, supply power and drive to whole circuit, when solar cell panel electric quantity is not enough, adopt the stand-by battery power supply, effectual saving electric quantity, increase of service life.
The key technology of the method for analyzing the leakage of the insulator is as follows:
presetting parameters: setting the power consumption mode of the low-power-consumption conversion unit: standby mode, working mode, sleep mode, stop mode; setting an insulator induction signal trigger threshold corresponding to the conversion from the sleep mode to the working mode; setting a working mode, wherein the working mode comprises an insulator sensing signal acquisition period T and acquisition times n in the insulator sensing signal acquisition period; setting a standby mode communication wakeup time t 2;
establishing a connection relation of an insulator leakage analysis system, and entering an insulator leakage analysis method, wherein the method comprises the following steps:
s1, the microprocessor MCU enters a standby mode, the communication wake-up time countdown of the standby mode is started, after the communication wake-up time t2 of the standby mode is reached, the microprocessor MCU acquires a wake-up instruction sent by the handheld terminal, and the microprocessor MCU controls the wireless communication module to establish communication connection with the handheld terminal;
s2, generating an insulator induction signal trigger threshold by the microprocessor MCU;
s3, acquiring an insulator sensing signal of a signal acquisition device by a microprocessor MCU, triggering the microprocessor MCU to enter a working mode after the insulator sensing signal exceeds an insulator sensing signal triggering threshold value, and starting to acquire the insulator sensing signal according to an insulator sensing signal acquisition period T and an acquisition frequency n in the insulator sensing signal acquisition period to obtain working mode acquisition data;
s4, comparing and calculating the data acquired in the working mode by the microprocessor MCU to obtain an induction calculation data set of the current acquisition period;
wherein the induction calculation data set at least comprises induction maximum value Vmax, induction minimum value Vmin and induction energy value
Induction peak value Vmax-Vmin and induction average value V;
s5, comparing the induction calculation data sets of the current acquisition period and the previous acquisition period by the microprocessor MCU to obtain an insulator flashover judgment result; and the insulator flashover judgment result is stored in the memory and the register;
if the induction calculation data set of the current period exceeds the induction calculation data set of the previous period, judging that the insulator is in a flashover and easy-to-send state, otherwise, judging that the insulator is not in the flashover and easy-to-send state;
s6, the microprocessor MCU controls the wireless communication module to send the insulator flashover judgment results in the memory and the register to the handheld terminal, and then the handheld terminal enters a sleep mode;
s7, after the microprocessor MCU acquires the sleep interrupt signal, entering a shutdown mode, and counting down the set time of the shutdown mode; when the stop mode count-down time is reached, the process returns to step S3.
Through the steps, the microprocessor MCU wakes up by countdown after establishing communication connection with the handheld terminal, and combines the acquired insulator sensing signal and the generated insulator sensing signal to trigger a threshold value to obtain whether the insulator string has the phenomenon or risk of flashover. And transmitting the insulator flashover judgment result to a remote handheld terminal through communication. The handheld terminal can be all devices which can realize communication, such as a smart phone, a computer and the like.
According to a further technical scheme, the insulator sensing signal triggering threshold comprises an initial insulator sensing signal triggering threshold and a corrected insulator sensing signal triggering threshold;
when the microprocessor MCU generates the initial insulator induction signal trigger threshold, presetting initial insulator induction signal trigger threshold induction generation time t 1; after step S2, the microprocessor MCU starts to acquire the insulator sensing signals acquired by the acquisition circuit, and at the same time controls the timer to start initial triggering, sensing and triggering threshold generation timing, and after the timer timing time reaches the insulator sensing signal triggering threshold sensing generation time t1, generates the signal ranges of all insulator sensing signals within the set initial insulator sensing signal triggering threshold sensing generation time t1 as an initial insulator sensing signal triggering threshold;
when the microprocessor MCU generates the correction insulator induction signal triggering threshold value:
if a high peak signal appears in the data collected by the working mode in the previous collection period T, the insulator sensing signal trigger high-limit threshold TH _ H and the insulator sensing signal trigger low-limit threshold TH _ L in the corrected insulator sensing signal trigger threshold of the current collection period are increased by X1 times relative to the corrected insulator sensing signal trigger threshold of the previous period;
if a valley-peak signal appears in the data collected in the working mode in the previous collection period T, the insulator sensing signal trigger high-limit threshold TH _ H and the insulator sensing signal trigger low-limit threshold TH _ L in the corrected insulator sensing signal trigger threshold of the current collection period are reduced by X1 times relative to the corrected insulator sensing signal trigger threshold of the previous collection period.
In the scheme, the insulator induction signal trigger threshold is generated after being collected in real time according to the field installation environment, and a correction link is further arranged to perform self-adaptive correction on the insulator induction signal trigger threshold, so that the authenticity of the insulator needing to be cleaned is improved, and the reliability of the whole circuit and an analysis system is improved. The whole system has strong adaptability and can be used in various insulator string installation environments.
The further technical scheme is as follows:
when the microprocessor MCU is in a standby mode:
when entering a standby mode, the microprocessor MCU is in a low power consumption state; the memory and the register in the microprocessor MCU are in a low power consumption state; the acquisition circuit is in a low power consumption state; the wireless communication module connected with the microprocessor MCU is in a low power consumption state; the timer connected with the microprocessor MCU is in a working state;
when the standby mode is entered and exceeds the standby mode communication wake-up time t2, the wireless communication module connected with the microprocessor MCU is in a working state; the timer connected with the microprocessor MCU is in a working state; the memory and the register in the microprocessor MCU are in a low power consumption state; the acquisition circuit is in a low power consumption state;
after the wireless communication module establishes communication connection with the handheld terminal, the acquisition circuit and the microprocessor MCU are in a working state; the wireless communication module is in a working state; the memory and the register are in a low power consumption state;
when the microprocessor MCU is in a working mode;
the microprocessor MCU, the acquisition circuit, the wireless communication module, the timer, the memory and the register are all in working states;
when the microprocessor MCU is in a sleep mode;
the acquisition circuit, the wireless communication module, the timer, the memory and the register are all in a low power consumption state;
when the microprocessor mcu (k) is in the sleep mode, if any peak insulator sensing signal is received, the microprocessor mcu (k) is awakened by the peak insulator sensing signal, and the process goes to step S3;
when the microprocessor MCU is in a stop mode;
the acquisition circuit, the wireless communication module and the timer are in a low power consumption state; the memory and the register are both in working state.
According to the scheme, under different mode environments, the internal operation of the microprocessor MCU is reasonably designed, electric energy is reasonably utilized, and the electric energy is effectively saved.
The invention has the beneficial effects that: through designing the insulator leakage analysis system, the acquisition circuit is designed and connected to the microprocessor, insulator sensing signals are uploaded to the microprocessor MCU in real time, and internal comparison analysis and transmission are realized through the microprocessor MCU. And a low-power consumption conversion unit is designed to reasonably supply power to the whole analysis process, so that the electric energy is saved, the working time and the service life of the acquisition system are guaranteed, and the maintenance times are reduced. And combining an insulator leakage analysis method, reasonably decomposing the steps of awakening the whole system, producing an insulator induction signal trigger threshold value and analyzing and calculating the insulator induction signal, so that the MCU can smoothly run.
Drawings
FIG. 1 is a block diagram of the system architecture of the present invention;
FIG. 2 is a circuit diagram of a current sampling module in the acquisition circuit;
FIG. 3 is a circuit diagram of a signal amplification module in the acquisition circuit;
FIG. 4 is a circuit diagram of a waveform inversion module in the acquisition circuit; FIG. 5 is a circuit diagram of an analog-to-digital conversion module in the acquisition circuit;
FIG. 6 is a circuit diagram of the MCU layout in the acquisition circuit;
FIG. 7 is a circuit diagram of a low power conversion module in the acquisition circuit;
FIG. 8 is a circuit diagram of a window module in the acquisition circuit;
FIG. 9 is a flow chart of insulator leakage analysis method steps;
FIG. 10 is a schematic perspective view of a signal collector;
FIG. 11 is a schematic view of a three-dimensional structure for mounting a signal collector;
FIG. 12 is a front view of a signal collector;
FIG. 13 is a schematic cross-sectional view A-A of FIG. 12;
FIG. 14 is an enlarged schematic view of B of FIG. 13;
FIG. 15 is a schematic perspective view of a collector housing;
FIG. 16 is a perspective view of a ferromagnetic core housing;
fig. 17 is a schematic perspective view of a circuit chamber housing.
Detailed Description
The following provides a more detailed description of the embodiments and the operation of the present invention with reference to the accompanying drawings.
An insulator leakage analysis system can be seen by combining a figure 1, and comprises a microprocessor MCU K and a power supply module D, wherein a signal acquisition end of the microprocessor MCU K is connected with an acquisition circuit 4, the acquisition circuit 4 is used for acquiring an insulator induction signal of the signal acquisition device, a memory K1 and a register K3 are arranged in the microprocessor MCU K, and a communication end of the microprocessor MCU K is connected with a wireless communication module W and is used for communicating with a handheld terminal; the timing end of the microprocessor MCU K is connected with a timer K2;
in this embodiment, as can also be seen from fig. 1, the power module D includes a low power conversion unit D1, a power supply end of the low power conversion unit D1 is connected to the solar cell panel D2 and the backup battery D3, a power control end and a power input end of the microprocessor MCU K are both connected to the low power conversion unit D1, and the low power conversion unit D1 is connected to the acquisition circuit 4.
In the present embodiment, the backup battery D3 is a capacitor battery.
Referring to fig. 1, the acquisition circuit 4 includes a current sampling module 41, a signal amplifying module 42, a waveform inverting module 43, and an analog-to-digital conversion module 44;
the sampling input end of the current sampling module 41 is used for acquiring an insulator sensing signal, and the sampling output end of the current sampling module 41 is connected with the signal acquisition end of the microprocessor MCU K after passing through the signal amplification module 42, the waveform inversion module 43 and the analog-to-digital conversion module 44;
the power supply driving end of the low power consumption conversion module D1 is connected with the analog-to-digital conversion module 44, and the power supply output end of the low power consumption conversion module D1 is connected with the current sampling module 41, the signal amplification module 42, the waveform inversion module 43, the analog-to-digital conversion module 44 and the microprocessor MCU K.
In this embodiment, referring to fig. 2, the current sampling module 41 includes an operational amplifier U14, an inverting input terminal of the operational amplifier U14 is grounded through a resistor R2 and a sampling resistor R28, a common terminal of the resistor R2 and the sampling resistor R28 serves as a sampling input terminal of the current sampling module 41, a non-inverting input terminal of the operational amplifier U14 is grounded through a resistor R1, an output terminal of the operational amplifier U14 is connected to the inverting input terminal of the operational amplifier U14 through a resistor R33, an output terminal of the operational amplifier U14 is connected to one end of a capacitor C11, and as can be seen in connection with fig. 2 and fig. 1, the other end of the capacitor C11 serves as a sampling output terminal of the current sampling module 41.
Referring to fig. 3, the signal amplifying module 42 includes an operational amplifier U13, the positive phase of the operational amplifier U13 is connected to one end of a resistor R22 through a resistor R23, the other end of the resistor R22 serves as an amplifying input end of the signal amplifying module 42, the amplifying input end of the signal amplifying module 42 is used for being connected to the sampling output end of the current sampling module 41, the common end of the resistor R23 and a resistor R22 is grounded through a capacitor C39, the inverting input end of the operational amplifier U13 is grounded through a resistor R25, the output end of the operational amplifier U13 is connected to the inverting input end of the operational amplifier U13 through a resistor R26, and the output end of the operational amplifier U13 is connected to one end of a capacitor C2, as can be seen in conjunction with fig. 1 and fig. 3, the other end of the capacitor C2 serves as the amplifying output end of the signal amplifying module 42.
Referring to fig. 4, the waveform flipping module 43 includes a comparator U15, an operational amplifier U1, and an analog switch chip U11, wherein a positive phase input terminal of the comparator U15 is connected to one end of a resistor R24, the other end of the resistor R24, one end of a resistor R31, and one end of a resistor R18 are common terminals, and the common terminals are used as waveform signal input terminals of the waveform flipping module 43; a diode D2 and a diode D1 which are reversely connected are connected in parallel between a positive phase input end and an negative phase input end of the comparator U15, the negative phase input end of the comparator U15 is grounded, the output end of the comparator U15 is connected with a high level power supply end of the comparator U15 through a resistor R17, the output end of the comparator U15 is connected with a digital control input end of an analog switch chip U11 through a resistor R32, a first normally open switch input end NO1 of the analog switch chip U11 is connected with the other end of the resistor R31, the positive phase input end of the operational amplifier U1 is grounded, the negative phase input end of the operational amplifier U1 is connected with the other end of the resistor R18, the negative phase input end of the operational amplifier U1 is grounded through a capacitor C3, the output end of the operational amplifier U1 is connected with the negative phase input end of the operational amplifier U1 through a resistor R19 and a capacitor C4 which are connected in parallel, the output end of the operational amplifier U1 is connected with the first normally closed switch input end of the analog switch chip U11 through a resistor R30, the signal output end of the analog switch chip U11 is used as the waveform signal output end of the waveform flipping module 43, and is connected to the analog signal input end of the analog-to-digital conversion module 44.
As can be seen from fig. 5, the analog-to-digital conversion module 44 includes an analog-to-digital conversion chip U3 and an operational amplifier U4, where the model of the analog-to-digital conversion chip U3 is AD7091R _ 5; a positive phase input end of the operational amplifier U4 is used as an analog signal input end of the analog-to-digital conversion module 44 and is used for being connected with a waveform signal output end of the waveform inversion module 43, an output end of the operational amplifier U4 is connected with an inverted phase input end of the operational amplifier U4, an output end of the operational amplifier U4 is grounded through a resistor R15 and a capacitor C23, a common end of a resistor R15 and a capacitor C23 is connected with a positive phase input end of the operational amplifier U4 through a resistor R74, a common end of the resistor R74 and a capacitor C23 is connected with a first signal input end VIN0 of the analog-to-digital conversion chip U3, and a digital output end of the analog-to-digital conversion chip U3 is used as a digital signal output end of the analog-to-digital conversion module 44 and is used for being connected with the microprocessor MCU K, see fig. 6 and fig. 5; a fourth signal input terminal VIN4 of the analog-to-digital conversion chip U3 is connected to the power driving terminal of the low power consumption conversion module D1.
Referring to fig. 1, the waveform signal output terminal of the waveform flipping module 43 is further connected to a window module 47.
In the present embodiment, referring to fig. 8, the window module 47 includes a comparator U10A, a comparator U10B, and a window reference value setting chip U9, in the present embodiment, the model number of the window reference value setting chip U9 is LTC1662CMS 8; a reference signal input end of the window reference value setting chip U9 is used for acquiring a microprocessor MCU K reference setting signal, a reference end REF of the window reference value setting chip U9 is connected to a reference voltage output chip U25, and in the present embodiment, the reference voltage output chip U25 is REF3325 AIDCKR; the high-level output end of the reference signal of the window reference value setting chip U9 is connected with the inverting input end of the comparator U10A, the non-inverting input end of the comparator U10A is connected with the waveform signal output end of the waveform flipping module 43, in this embodiment, the output end of the comparator U10A is connected with the high-level feedback input end of the window of the microprocessor MCU K;
the low level output end of the reference signal of the window reference value setting chip U9 is connected with the inverting input end of the comparator U10B, the non-inverting input end of the comparator U10B is connected with the waveform signal output end of the waveform turning module 43, and the output end of the comparator U10B is connected with the low level feedback input end of the window of the microprocessor MCU K.
Referring to fig. 7, the low power conversion module D1 includes a micro power management chip U18 and a low power supply chip U17, in this embodiment, the micro power management chip U18 is a bq 25504. In this embodiment, the power supply chip with low power consumption has a model number of TPS61220 of U17;
a pin VIN _ DC of the micro power management chip U18 is grounded through a capacitor C62 and a capacitor C61, a pin VIN _ DC of the micro power management chip U18 is grounded through a resistor R40, a resistor R42 and a resistor R44, and the pin VIN _ DC of the micro power management chip U18 is used for connecting a solar cell panel D2 and a spare battery D3; a VSTOR (voltage switch over) end of a pin of the micro-power management chip U18 is used as a power driving end of the low-power conversion module D1; the VSTOR end of the micro-power management chip U18 is also connected with a pin VIN of a low-power supply chip U17 through a resistor R36, a pin L of the low-power supply chip U17 is also connected with a pin VIN of a low-power supply chip U17 through a capacitor L4, the pin VIN of the low-power supply chip U17 is grounded through a capacitor C59, a pin VOUT of the low-power supply chip U17 is grounded through a capacitor C53, and a pin VOUT of the low-power supply chip U17 serves as a power output end of the low-power conversion module D1.
An insulator leakage analysis method comprises the following steps of: setting the power consumption mode of the low power consumption conversion unit D1: standby mode, working mode, sleep mode, stop mode; setting an insulator induction signal trigger threshold corresponding to the conversion from the sleep mode to the working mode, wherein the insulator induction signal trigger threshold is set; setting a working mode, wherein the working mode comprises an insulator sensing signal acquisition period T and acquisition times n in the insulator sensing signal acquisition period; setting a standby mode communication wakeup time t 2;
in this embodiment, the insulator sensing signal acquisition period T is 2h, and the acquisition times are 12 times within 2 hours;
in this embodiment, the standby mode communication wakeup time t2 is 30 s;
establishing a connection relation of the insulator leakage analysis system, referring to fig. 11, entering a step of the insulator leakage analysis method:
s1, the microprocessor MCU K enters a standby mode, starts standby mode communication wakeup countdown, and after the standby mode communication wakeup time reaches 30S, the microprocessor MCU K acquires a wakeup instruction sent by the handheld terminal and controls the wireless communication module W to establish communication connection with the handheld terminal;
in this embodiment, when the microprocessor MCU K is in the standby mode:
when entering a standby mode, the microprocessor MCU K is in a low power consumption state; a memory K1 and a register K3 in the microprocessor MCU K are in a low power consumption state; the acquisition circuit 4 is in a low power consumption state; the wireless communication module W connected with the microprocessor MCU K is in a low power consumption state; a timer K2 connected with the microprocessor MCU K is in a working state;
s2, generating an insulator induction signal trigger threshold by the microprocessor MCU K;
s3, acquiring an insulator sensing signal of the signal acquisition device by the microprocessor MCU K, triggering the microprocessor MCU K when the insulator sensing signal exceeds an insulator sensing signal triggering threshold value, entering a working mode, and starting to acquire the insulator sensing signal according to an insulator sensing signal acquisition period T and the acquisition times n in the insulator sensing signal acquisition period to obtain working mode acquisition data;
s4, comparing and calculating the data acquired in the working mode by the microprocessor MCU K to obtain an induction calculation data set of the current acquisition period;
wherein the induction calculation data set at least comprises induction maximum value Vmax, induction minimum value Vmin and induction energy value
Induction peak value Vmax-Vmin and induction average value V;
s5, comparing the induction calculation data sets of the current acquisition period and the previous acquisition period by the microprocessor MCU K to obtain an insulator flashover judgment result; the insulator flashover judgment result is stored in a memory K1 and a register K3;
if the induction calculation data set of the current period exceeds the induction calculation data set of the previous period, judging that the insulator is in a flashover and easy-to-send state, otherwise, judging that the insulator is not in the flashover and easy-to-send state;
when the standby mode is entered and exceeds the standby mode communication wake-up time t2, the wireless communication module W connected with the microprocessor MCU K is in a working state; a timer K2 connected with the microprocessor MCU K is in a working state; a memory K1 and a register K3 in the microprocessor MCU K are in a low power consumption state; the acquisition circuit 4 is in a low power consumption state;
after the wireless communication module W establishes communication connection with the handheld terminal, the acquisition circuit 4 and the microprocessor MCU K are in working states; the wireless communication module W is in a working state; the memory K1 and the register K3 are in a low power consumption state;
when the microprocessor MCU K is in a working mode;
the microprocessor MCU K, the acquisition circuit 4, the wireless communication module W, the timer K2, the memory K1 and the register K3 are all in working states;
s6, the microprocessor MCU K controls the wireless communication module W to send the insulator flashover judgment results in the memory K1 and the register K3 to the handheld terminal, and then the handheld terminal enters a sleep mode;
in this embodiment, when the microprocessor MCU K is in sleep mode;
the acquisition circuit 4, the wireless communication module W, the timer K2, the memory K1 and the register K3 are all in a low power consumption state;
when the microprocessor mcu (k) is in the sleep mode, if any peak insulator sensing signal is received, the microprocessor mcu (k) is awakened by the peak insulator sensing signal, and the process goes to step S3;
s7, after the microprocessor MCU K obtains the sleep interrupt signal, entering a shutdown mode and setting the shutdown mode; after the shutdown mode setting is completed, the process returns to step S3.
In this embodiment, when the microprocessor MCU K is in the stop mode; the acquisition circuit 4, the wireless communication module W and the timer K2 are in a low power consumption state; both memory K1 and register K3 are in an operative state.
In this embodiment, the insulator sensing signal triggering threshold includes an initial insulator sensing signal triggering threshold and a corrected insulator sensing signal triggering threshold.
When the microprocessor MCU K generates an initial insulator induction signal trigger threshold, presetting initial insulator induction signal trigger threshold induction generation time t 1; after the step S2 is further performed, the microprocessor MCU K starts to acquire the insulator induction signal acquired by the acquisition circuit 4, and at the same time, controls the timer K2 to start the initial trigger induction trigger threshold generation timing, and generates the initial insulator induction signal trigger threshold after the timing time of the timer K2 reaches the insulator induction signal trigger threshold induction generation time t 1;
in this embodiment, the initial insulator sensing signal trigger threshold sensing generation time T1 is equal to the insulator sensing signal acquisition period T, and both are set to be 2 h.
When the microprocessor MCU K generates and corrects the triggering threshold value of the insulator induction signal:
if a high peak signal appears in the data collected in the working mode in the previous insulator sensing signal collection period T, the insulator sensing signal trigger high-limit threshold TH _ H and the insulator sensing signal trigger low-limit threshold TH _ L in the corrected insulator sensing signal trigger threshold of the current collection period are increased by X1 times relative to the corrected insulator sensing signal trigger threshold of the previous period;
if a valley-peak signal appears in the data collected in the working mode in the previous insulator sensing signal collection period T, the insulator sensing signal trigger high-limit threshold TH _ H and the insulator sensing signal trigger low-limit threshold TH _ L in the corrected insulator sensing signal trigger threshold of the current collection period are reduced by X1 times relative to the corrected insulator sensing signal trigger threshold of the previous period.
In the present embodiment, X1 is set to 0.2.
In this embodiment, as can be seen from fig. 10 and 11, the signal collector 2 is installed on the surface of the insulator 1, the ferromagnetic core 3 is disposed inside the signal collector 2, and the ferromagnetic core 3 is used for being connected to the collecting circuit 4 and obtaining an induced current, in this embodiment, the induced current is an insulator induced signal.
As can be seen from fig. 1, 13 and 14, the signal collector 2 includes two collector shells 5 symmetrically disposed on the outer wall of the insulator 1, the two collector shells 5 are hinged after being buckled on the outer wall of the insulator 1, each collector shell 5 includes an upper cover, a lower cover and an outer circular side wall, which are connected, and the three and the outer wall of the insulator 1 surround to form a collecting cavity Q.
In this embodiment, referring to fig. 15, snap lugs are provided at the end of the harvester housing 5.
In this embodiment, referring to fig. 1, one end of the two collector housings 5 are not hinged by a hinge, and the other end is fastened by bolts and nuts.
In this embodiment, the signal collector 2 is installed on one side of the suspension ring end of the insulator 1, and in order to adapt to the suspension ring structure of the insulator 1, after the bottom of the collector housing 5 of the signal collector 2 is fastened, the bottom of the collector housing abuts against the surface of the insulator 1, so that the sealing performance of the signal collector 2 is improved.
In the present embodiment, referring to fig. 14, 16 and 17, a half-circular ferromagnetic core housing 6 and a half-circular circuit chamber housing 7 are disposed in the collection chamber Q of each collector housing 5;
as can be seen in connection with fig. 15-17, ferromagnetic core housing 6, circuit chamber housing 7 are sized and shaped to accommodate collector housing 5.
Referring to fig. 13 and 14, the bottom of the ferromagnetic core housing 6 is fixed on the upper cover of the collector housing 5, the top of the ferromagnetic core housing 6 is open and is abutted against the bottom of the circuit chamber housing 7, the inner circular side wall of the ferromagnetic core housing 6 is abutted against the outer wall of the insulator 1, the end of the ferromagnetic core housing 6 is open and is abutted against the end cover of the collector housing 5, and the ferromagnetic core 3 is detachably placed in the ferromagnetic core housing 6.
Referring to fig. 14, the top cover of the circuit chamber housing 7 abuts against the upper cover of the collector housing 5, the acquisition circuit 4 is arranged inside the circuit chamber housing 7, a circuit cavity through hole is formed in the end portion of the circuit chamber housing 7, the end portion of the circuit chamber housing 7 abuts against the end cover of the collector housing 5, at least one PCB circuit board 8 and a spare battery D3 are arranged inside the circuit chamber housing 7, and the acquisition circuit 4 is arranged on the PCB circuit board 8.
In this embodiment, a waterproof gasket is further disposed on the top cover side of the circuit chamber housing 7 to improve the sealing performance of the circuit chamber.
It should be noted that the above description is not intended to limit the present invention, and the present invention is not limited to the above examples, and those skilled in the art may make variations, modifications, additions or substitutions within the spirit and scope of the present invention.
Claims (10)
1. An insulator leakage analysis system, its characterized in that: the insulator induction signal acquisition device comprises a microprocessor MCU (K) and a power supply module (D), wherein a signal acquisition end of the microprocessor MCU (K) is connected with an acquisition circuit (4), the acquisition circuit (4) is used for acquiring an insulator induction signal, a memory (K1) and a register (K3) are arranged in the microprocessor MCU (K), and a communication end of the microprocessor MCU (K) is connected with a wireless communication module (W) and is used for communicating with a handheld terminal; the timing end of the microprocessor MCU (K) is connected with a timer (K2);
the power module (D) comprises a low-power-consumption conversion unit (D1), a power supply end of the low-power-consumption conversion unit (D1) is connected with a solar cell panel (D2) and a standby battery (D3), a power control end and a power input end of the microprocessor MCU (K) are connected with the low-power-consumption conversion unit (D1), and the low-power-consumption conversion unit (D1) is connected with the acquisition circuit (4).
2. The insulator leakage analysis system according to claim 1, wherein: the acquisition circuit (4) comprises a current sampling module (41), a signal amplification module (42), a waveform inversion module (43) and an analog-to-digital conversion module (44);
the sampling input end of the current sampling module (41) is used for acquiring an insulator sensing signal, and the sampling output end of the current sampling module (41) is connected with the signal acquisition end of a microprocessor MCU (K) after passing through a signal amplification module (42), a waveform inversion module (43) and an analog-to-digital conversion module (44);
the power supply driving end of the low-power-consumption conversion module (D1) is connected with the analog-to-digital conversion module (44), and the power supply output end of the low-power-consumption conversion module (D1) is connected with the current sampling module (41), the signal amplification module (42), the waveform inversion module (43), the analog-to-digital conversion module (44) and the microprocessor MCU (K).
3. The insulator leakage analysis system according to claim 2, wherein:
the current sampling module (41) comprises an operational amplifier U14, the inverting input terminal of the operational amplifier U14 is grounded through a resistor R2 and a sampling resistor R28, the common end of the resistor R2 and the sampling resistor R28 is used as the sampling input terminal of the current sampling module (41), the non-inverting input terminal of the operational amplifier U14 is grounded through a resistor R1, the output terminal of the operational amplifier U14 is connected with the inverting input terminal of the operational amplifier U14 through a resistor R33, the output terminal of the operational amplifier U14 is connected with one end of a capacitor C11, and the other end of the capacitor C11 is used as the sampling output terminal of the current sampling module (41);
the signal amplification module (42) comprises an operational amplifier U13, wherein the positive phase of the operational amplifier U13 is connected with one end of a resistor R22 through a resistor R23, the other end of the resistor R22 is used as the amplification input end of the signal amplification module (42), the amplification input end of the signal amplification module (42) is used for being connected with the sampling output end of the current sampling module (41), the common end of the resistor R23 and the resistor R22 is grounded through a capacitor C39, the reverse phase input end of the operational amplifier U13 is grounded through a resistor R25, the output end of the operational amplifier U13 is connected with the reverse phase input end of the operational amplifier U13 through a resistor R26, the output end of the operational amplifier U13 is connected with one end of a capacitor C2, and the other end of the capacitor C2 is used as the amplification output end of the signal amplification module (42).
4. An insulator leakage analysis system according to claim 3, wherein:
the waveform inverting module (43) comprises a comparator U15, an operational amplifier U1 and an analog switch chip U11, wherein a positive phase input end of the comparator U15 is connected with one end of a resistor R24, the other end of the resistor R24, one end of a resistor R31 and one end of a resistor R18 are common ends of the three, and the common ends are used as waveform signal input ends of the waveform inverting module (43); a diode D2 and a diode D1 which are connected in reverse direction are connected in parallel between a positive phase input end and an inverse phase input end of the comparator U15, the inverse phase input end of the comparator U15 is grounded, the output end of the comparator U15 is connected with a high level power supply end of the comparator U15 through a resistor R17, the output end of the comparator U15 is connected with a digital control input end of the analog switch chip U11 through a resistor R32, a first normally open switch input end NO1 of the analog switch chip U11 is connected with the other end of the resistor R31, the positive phase input end of the operational amplifier U1 is grounded, the inverse phase input end of the operational amplifier U1 is connected with the other end of the resistor R18, the inverse phase input end of the operational amplifier U1 is grounded through a capacitor C3, the output end of the operational amplifier U1 is connected with the inverse phase input end of the operational amplifier U1 through a resistor R19 and a capacitor C4 which are connected in parallel, and the output end of the operational amplifier U1 is connected with the first switch chip 11 through a resistor R30 The input end of the analog switch chip U11 is connected, and the signal output end of the analog switch chip U11 is used as the waveform signal output end of the waveform inversion module (43) and is connected with the analog signal input end of the analog-to-digital conversion module (44).
5. The insulator leakage analysis system according to claim 4, wherein:
the analog-to-digital conversion module (44) comprises an analog-to-digital conversion chip U3 and an operational amplifier U4, wherein the model of the analog-to-digital conversion chip U3 is AD7091R _ 5;
a positive phase input end of the operational amplifier U4 is used as an analog signal input end of the analog-to-digital conversion module (44) and is used for being connected with a waveform signal output end of the waveform inversion module (43), an output end of the operational amplifier U4 is connected with an inverted phase input end of the operational amplifier U4, an output end of the operational amplifier U4 is grounded through a resistor R15 and a capacitor C23, a common end of the resistor R15 and the capacitor C23 is connected with a positive phase input end of the operational amplifier U4 through a resistor R74, a common end of the resistor R74 and a capacitor C23 is connected with a first signal input end 0 of the analog-to-digital conversion chip U3, and a digital output end of the analog-to-digital conversion chip U3 is used as a digital signal output end of the analog-to-digital conversion module (44) and is used for being connected with the microprocessor mcu (k); a fourth signal input end VIN4 of the analog-to-digital conversion chip U3 is connected with a power driving end of the low power consumption conversion module (D1).
6. The insulator leakage analysis system according to claim 5, wherein: the waveform signal output end of the waveform overturning module (43) is further connected with a window module (47), the window module (47) comprises a comparator U10A, a comparator U10B and a window reference value setting chip U9, and the model of the window reference value setting chip U9 is LTC1662CMS 8;
a reference signal input end of the window reference value setting chip U9 is used for acquiring a reference setting signal of the microprocessor mcu (k), a reference end REF of the window reference value setting chip U9 is connected to a reference voltage output chip U25, and the reference voltage output chip U25 is REF3325 AIDCKR;
the high-level output end of the reference signal of the window reference value setting chip U9 is connected with the inverting input end of the comparator U10A, the non-inverting input end of the comparator U10A is connected with the waveform signal output end of the waveform flipping module (43), and the output end of the comparator U10A is connected with the high-level feedback input end of the window of the microprocessor MCU (K);
the low level output end of the reference signal of the window reference value setting chip U9 is connected with the inverting input end of the comparator U10B, the non-inverting input end of the comparator U10B is connected with the waveform signal output end of the waveform flipping module (43), and the output end of the comparator U10B is connected with the window low level feedback input end of the microprocessor MCU (K).
7. The insulator leakage analysis system according to claim 5, wherein:
the low-power conversion module (D1) comprises a micro-power management chip U18 and a low-power supply chip U17, wherein the model of the micro-power management chip U18 is bq25504, and the model of the low-power supply chip U17 is TPS 61220;
a pin VIN _ DC of the micro power consumption management chip U18 is grounded through a capacitor C62 and a capacitor C61, the pin VIN _ DC of the micro power consumption management chip U18 is grounded through a resistor R40, a resistor R42 and a resistor R44, and the pin VIN _ DC of the micro power consumption management chip U18 is used for connecting a solar cell panel (D2) and a spare battery (D3); a VSTOR (voltage switch over) end of a pin of the micro-power management chip U18 is used as a power supply driving end of the low-power conversion module (D1);
little power consumption management chip U18's pin VSTOR end still through resistance R36 with low-power consumption power supply chip U17's pin VIN is connected, low-power consumption power supply chip U17's pin L still through electric capacity L4 with low-power consumption power supply chip U17's pin VIN is connected, low-power consumption power supply chip U17's pin VIN is through electric capacity C59 ground connection, low-power consumption power supply chip U17's pin VOUT is through electric capacity C53 ground connection, low-power consumption power supply chip U17's pin VOUT is as the power output of low-power consumption conversion module (D1).
8. An insulator leakage analysis method is characterized in that:
presetting parameters: setting a power consumption mode of a low power consumption conversion unit (D1): standby mode, working mode, sleep mode, stop mode; setting an insulator induction signal trigger threshold corresponding to the conversion from the sleep mode to the working mode, wherein the insulator induction signal trigger threshold is set; setting a working mode, wherein the working mode comprises an insulator sensing signal acquisition period T and acquisition times n in the insulator sensing signal acquisition period; setting a standby mode communication wakeup time t 2;
establishing a connection relation of an insulator leakage analysis system, and entering an insulator leakage analysis method, wherein the method comprises the following steps:
s1, the microprocessor MCU (K) enters a standby mode, starts to count down the standby mode communication awakening time, and after the standby mode communication awakening time t2 is up and the microprocessor MCU (K) acquires an awakening instruction sent by the handheld terminal, the microprocessor MCU (K) controls the wireless communication module (W) to establish communication connection with the handheld terminal;
s2, generating an insulator induction signal triggering threshold value by a microprocessor MCU (K);
s3, acquiring an insulator sensing signal by a microprocessor MCU (K), triggering the microprocessor MCU (K) when the insulator sensing signal exceeds an insulator sensing signal triggering threshold value, entering a working mode, and starting to acquire the insulator sensing signal according to the insulator sensing signal acquisition period T and the acquisition times n in the insulator sensing signal acquisition period to obtain working mode acquisition data;
s4, comparing and calculating the data acquired by the working mode by a microprocessor MCU (K) to obtain an induction calculation data set of the current acquisition period;
wherein the induction calculation data set at least comprises induction maximum value Vmax, induction minimum value Vmin and induction energy value
Induction peak value Vmax-Vmin and induction average value V;
s5, comparing the induction calculation data sets of the current acquisition period and the previous acquisition period by a microprocessor MCU (K) to obtain an insulator flashover judgment result; and the insulator flashover judgment result is stored in the memory (K1) and the register (K3);
if the induction calculation data set of the current period exceeds the induction calculation data set of the previous period, judging that the insulator is in a flashover and easy-to-send state, otherwise, judging that the insulator is not in the flashover and easy-to-send state;
s6, a microprocessor MCU (K) controls a wireless communication module (W) to send the insulator flashover judgment results in the memory (K1) and the register (K3) to the handheld terminal, and then the handheld terminal enters a sleep mode;
s7, after the microprocessor MCU (K) acquires the sleep interrupt signal, entering a shutdown mode, and counting down the set time of the shutdown mode; when the stop mode count-down time is reached, the process returns to step S3.
9. The insulator leakage analysis method according to claim 8, characterized in that: the insulator sensing signal triggering threshold comprises an initial insulator sensing signal triggering threshold and a corrected insulator sensing signal triggering threshold;
when the microprocessor MCU (K) generates the initial insulator sensing signal triggering threshold, presetting initial insulator sensing signal triggering threshold sensing generation time t 1; after the step S2 is further performed, the microprocessor mcu (K) starts to acquire the insulator sensing signal acquired by the acquisition circuit (4), and controls the timer (K2) to start to generate and time the initial trigger sensing threshold, and after the timer (K2) reaches the insulator sensing signal trigger threshold sensing generation time t1, the initial insulator sensing signal trigger threshold is generated;
when the microprocessor MCU (K) generates the correction insulator induction signal triggering threshold value:
if a high peak signal appears in the data collected by the working mode in the previous collection period T, the insulator sensing signal trigger high-limit threshold TH _ H and the insulator sensing signal trigger low-limit threshold TH _ L in the corrected insulator sensing signal trigger threshold of the current collection period are increased by X1 times relative to the corrected insulator sensing signal trigger threshold of the previous period;
if a valley-peak signal appears in the data collected in the working mode in the previous collection period T, the insulator sensing signal trigger high-limit threshold TH _ H and the insulator sensing signal trigger low-limit threshold TH _ L in the corrected insulator sensing signal trigger threshold of the current collection period are reduced by X1 times relative to the corrected insulator sensing signal trigger threshold of the previous collection period.
10. The insulator leakage analysis method according to claim 8, characterized in that: when the microprocessor mcu (k) is in standby mode:
when entering the standby mode, the microprocessor MCU (K) is in a low power consumption state; the memory (K1) and the register (K3) in the microprocessor MCU (K) are in a low power consumption state; the acquisition circuit (4) is in a low power consumption state; the wireless communication module (W) connected with the microprocessor MCU (K) is in a low power consumption state; a timer (K2) connected with the microprocessor MCU (K) is in a working state;
when entering the standby mode and exceeding the standby mode communication wake-up time t2, the wireless communication module (W) connected with the microprocessor MCU (K) is in a working state; a timer (K2) connected with the microprocessor MCU (K) is in a working state; the memory (K1) and the register (K3) in the microprocessor MCU (K) are in a low power consumption state; the acquisition circuit (4) is in a low power consumption state;
after the wireless communication module (W) establishes communication connection with the handheld terminal, the acquisition circuit (4) and the microprocessor MCU (K) are in working states; the wireless communication module (W) is in a working state; the memory (K1) and the register (K3) are in a low power consumption state;
when the microprocessor MCU (K) is in a working mode;
the microprocessor MCU (K), the acquisition circuit (4), the wireless communication module (W), the timer (K2), the memory (K1) and the register (K3) are all in working states;
when the microprocessor mcu (k) is in sleep mode;
the acquisition circuit (4), the wireless communication module (W), the timer (K2), the memory (K1) and the register (K3) are all in a low power consumption state;
when the microprocessor mcu (k) is in the sleep mode, if any peak insulator sensing signal is received, the microprocessor mcu (k) is awakened by the peak insulator sensing signal, and the process goes to step S3;
when the microprocessor mcu (k) is in stop mode;
the acquisition circuit (4), the wireless communication module (W) and the timer (K2) are in a low power consumption state; the memory (K1) and the register (K3) are both in an operative state.
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