CN113484696A - Intelligent insulator flashover analysis system - Google Patents
Intelligent insulator flashover analysis system Download PDFInfo
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- CN113484696A CN113484696A CN202110544947.9A CN202110544947A CN113484696A CN 113484696 A CN113484696 A CN 113484696A CN 202110544947 A CN202110544947 A CN 202110544947A CN 113484696 A CN113484696 A CN 113484696A
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- 239000012212 insulator Substances 0.000 title claims abstract description 91
- 238000004458 analytical method Methods 0.000 title claims abstract description 19
- 238000006243 chemical reaction Methods 0.000 claims abstract description 80
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 50
- 238000004891 communication Methods 0.000 claims abstract description 26
- 238000005070 sampling Methods 0.000 claims description 54
- 239000003990 capacitor Substances 0.000 claims description 37
- 230000003321 amplification Effects 0.000 claims description 33
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 33
- 230000006698 induction Effects 0.000 claims description 20
- 239000011258 core-shell material Substances 0.000 claims description 18
- 230000006870 function Effects 0.000 abstract description 3
- 206010033799 Paralysis Diseases 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 230000005291 magnetic effect Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000011897 real-time detection Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 238000010835 comparative analysis Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- 230000001939 inductive effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
- G01R31/1245—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of line insulators or spacers, e.g. ceramic overhead line cap insulators; of insulators in HV bushings
Abstract
The invention discloses an intelligent insulator flashover analysis system, which comprises a signal collector arranged on an insulator, wherein a ferromagnetic core, a PCB circuit board and a power supply module are arranged in the signal collector; the PCB is provided with an acquisition circuit and a microprocessor MCU, the acquisition circuit is connected with the ferromagnetic core and a signal acquisition end of the microprocessor MCU, and a communication end of the microprocessor MCU is connected with a wireless communication module; a memory and a register are arranged in the microprocessor MCU, and a timer is connected with the timing end of the microprocessor MCU; the power module comprises a low-power-consumption conversion unit, a power end of the low-power-consumption conversion unit is connected with a solar cell panel and a standby battery, a power control end and a power input end of the microprocessor MCU are both connected with the low-power-consumption conversion unit, and the low-power-consumption conversion unit is connected with the acquisition circuit. Has the advantages that: whole equipment structure is compact, gathers accurately, has effectively improved flashover early warning function, and more effectual power supply system tripping operation is paralysed.
Description
Technical Field
The invention relates to the technical field of insulators, in particular to an intelligent insulator flashover analysis system.
Background
As a large number of insulators are used on a power supply line in China, the insulator is one of the insulators, which is shown in figure 1. Particularly, in places such as railway systems, transformer substations and the like, a large number of high-voltage insulators are used, so that the working state of the insulators is directly related to whether a power supply line is safe or not. The method has great significance for providing the running condition of the high-voltage insulator for the power supply line.
The insulator is in the use process, the phenomenon of flashover (the phenomenon of discharging on the surface of an insulating project) often appears, the insulator can cause tripping of a substation when the flashover is serious, and even if the insulator can be switched on again after the tripping phenomenon appears, the insulator can also influence the power utilization.
In order to avoid tripping of a substation caused by insulator flashover, a method for regularly cleaning insulators is generally adopted at present. Taking the Jing Hu high-speed rail as an example, a heavily-polluted area is cleaned twice by manpower in one year; in general, the section is manually cleaned once in three years, and is rinsed once in a year. Although the cleaning frequency is much higher than the requirement of the iron standard, the situation of insulator flashover cannot be effectively avoided.
Because effective data and methods are not used as support, the insulators in the light pollution area are cleaned under the condition of cleanness, and maintenance cost is greatly wasted; in the heavily polluted area, the cleaning frequency is insufficient, and the cleaning quality can not meet the requirement.
Based on above-mentioned defect, need design one set of equipment to the serious condition of insulator surface flashover, detect and signal processing insulator surface to transmit detected signal to the staff through remote communication, clean in time with the suggestion.
Disclosure of Invention
Aiming at the problems, the invention provides an intelligent insulator flashover analysis system, which is characterized in that a signal collector is designed, a ferromagnetic core is used for sensing the surface of an insulator to obtain the surface dust condition, and detection data are analyzed in a microprocessor and then sent to a far end, so that the flashover early warning function is effectively improved, and the trip paralysis of a power supply system is effectively avoided.
In order to achieve the purpose, the invention adopts the following specific technical scheme:
an intelligent insulator flashover analysis system comprises a signal collector arranged on an insulator, wherein a ferromagnetic core, a PCB circuit board and a power supply module are arranged in the signal collector;
the PCB circuit board is provided with an acquisition circuit and a microprocessor MCU, the acquisition circuit is connected with the ferromagnetic core and is used for acquiring insulator induction signals generated by induction of the ferromagnetic core, the acquisition circuit is also connected with a signal acquisition end of the microprocessor MCU, and a communication end of the microprocessor MCU is connected with a wireless communication module and is used for communicating with a handheld terminal; a memory and a register are arranged in the microprocessor MCU, and a timing end of the microprocessor MCU is connected with a timer;
the power module comprises a low-power-consumption conversion unit, a power end of the low-power-consumption conversion unit is connected with a solar cell panel and a standby battery, a power control end and a power input end of the microprocessor MCU are both connected with the low-power-consumption conversion unit, and the low-power-consumption conversion unit is connected with the acquisition circuit.
Through the design, the signal collector with the ferromagnetic core is arranged on the surface of the insulator, and the ferromagnetic core is adopted to collect the discharge signal on the surface of the insulator by combining the magnetic induction principle to obtain the induced current. And the insulator is acquired by a connected acquisition circuit to realize real-time detection, and the insulator with the signal acquisition is installed on a power grid to be detected so as to improve the power supply reliability of the power grid. The acquisition circuit is connected with the microprocessor, the microprocessor acquires, analyzes, processes and sends the acquired sensing signals, the insulator flashover analysis is displayed, and related personnel are quickly and accurately informed to clean and clean the insulator.
Furthermore, the signal collector comprises two collector shells symmetrically arranged on the outer wall of the insulator, the two collector shells are buckled on the outer wall of the insulator and then hinged, each collector shell comprises an upper cover, a lower cover and an outer circular side wall which are connected, and the three collector shells and the outer wall of the insulator surround to form a collecting cavity;
a semi-circular ferromagnetic core shell and a semi-circular circuit cavity shell are arranged in the acquisition cavity of each acquisition device shell; the size and the shape of the ferromagnetic core shell and the circuit cavity shell are matched with those of the collector shell.
By adopting the scheme, the collector is arranged on the outer wall of the insulator in a surrounding manner, so that the circumferential detection of the insulator can be realized, the detection precision is improved, and the form of circumferential installation is adopted, so that the insulator detection device can adapt to most insulator shapes. In order to facilitate the buckling of the two collector shells, the two end parts of the two collector shells are provided with buckling lugs. In order to realize wired output of the signals acquired by the acquisition circuit, a threading hole is formed in one of the collector shells. A semi-circular ferromagnetic core shell and a semi-circular circuit cavity shell are respectively arranged in the two collector shells, and a circumferential surrounding ring is just formed after buckling for installing the ferromagnetic core and the circuit.
The further technical scheme is as follows: ferromagnetic core shell bottom is fixed collector shell upper cover, ferromagnetic core shell open-top and butt are in circuit chamber shell bottom, circle lateral wall butt is in ferromagnetic core shell on the insulator outer wall, ferromagnetic core shell tip opening and butt are in on the end cover of collector shell, ferromagnetic core has been placed to the inside detachable of ferromagnetic core shell.
By adopting the scheme, the top of the ferromagnetic core shell is open and is abutted against the bottom of the circuit chamber shell, the two ferromagnetic cores are fixed in the ferromagnetic core shell, the ferromagnetic cores are not easy to shake, and the design is compact.
The further technical scheme is as follows: the top cap of circuit cavity shell with collector shell upper cover butt, the inside arrangement of circuit cavity shell has acquisition circuit, circuit cavity shell tip sets up circuit chamber through-hole, circuit cavity shell tip butt is in on the end cover of collector shell, circuit cavity shell inside arrangement has at least one PCB circuit board with stand-by battery, one of them cover installation has on the collector shell lateral wall solar cell panel.
By adopting the scheme, the circuit cavity is formed inside the circuit cavity shell to arrange the PCB, and the circuit is reasonably arranged on the circuit board according to the requirement. In order to increase the sealing performance of the circuit chamber, a waterproof pad is provided on the cover surface side of the top cover of the circuit chamber housing. In order to acquire solar energy and convert the solar energy into electric energy capable of supplying power, a solar cell panel is arranged on the outer side wall of the collector shell, so that the solar energy is effectively absorbed and utilized.
The further technical scheme is as follows: the acquisition circuit comprises a current sampling module, a signal amplification module, a waveform turning module and an analog-to-digital conversion module;
the sampling input end of the current sampling module is used for acquiring an insulator sensing signal, and the sampling output end of the current sampling module is connected with the signal acquisition end of the microprocessor MCU after passing through the signal amplification module, the waveform overturning module and the analog-to-digital conversion module;
the power supply driving end of the low-power-consumption conversion module is connected with the analog-to-digital conversion module, and the power supply output end of the low-power-consumption conversion module is connected with the current sampling module, the signal amplification module, the waveform overturning module, the analog-to-digital conversion module and the microprocessor MCU.
According to the electromagnetic induction principle, weak current is generated according to a magnetic core, a current signal is sampled and obtained by the magnetic core, and is transmitted to a microprocessor after sampling, amplification, waveform inversion and mode conversion, so that current signal collection is realized.
In order to realize communication and improve communication effect, the outer wall of the ferromagnetic core shell or the outer wall of the circuit cavity shell is provided with the wireless communication module.
The further technical scheme is as follows: the current sampling module comprises an operational amplifier U14, wherein the inverting input end of the operational amplifier U14 is grounded through a resistor R2 and a sampling resistor R28, the common end of the resistor R2 and the sampling resistor R28 is used as the sampling input end of the current sampling module, the non-inverting input end of the operational amplifier U14 is grounded through a resistor R1, the output end of the operational amplifier U14 is connected with the inverting input end of the operational amplifier U14 after passing through a resistor R33, the output end of the operational amplifier U14 is connected with one end of a capacitor C11, and the other end of the capacitor C11 is used as the sampling output end of the current sampling module;
wherein, R28 is a sampling resistor, and the current can be adjusted by adjustment. The ratio of R33 and R2 is the amplification factor, and the C1 filter capacitor filters the DC bias voltage. After passing through the acquisition circuit, the discharge signal of the insulator leakage current sampling ferromagnetic core can be converted into a weak current signal. And the size of the sampling resistor can be set and adjusted according to the environment of the insulator so as to accurately obtain the weak current.
The further technical scheme is as follows: the signal amplification module comprises an operational amplifier U13, the positive phase of the operational amplifier U13 is connected with one end of a resistor R22 through a resistor R23, the other end of the resistor R22 is used as the amplification input end of the signal amplification module, the amplification input end of the signal amplification module is used for being connected with the sampling output end of the current sampling module, the common end of the resistor R23 and the resistor R22 is grounded through a capacitor C39, the reverse phase input end of the operational amplifier U13 is grounded through a resistor R25, the output end of the operational amplifier U13 is connected with the reverse phase input end of the operational amplifier U13 through a resistor R26, the output end of the operational amplifier U13 is connected with one end of a capacitor C2, and the other end of the capacitor C2 is used as the amplification output end of the signal amplification module.
By adopting the scheme, because the surface discharge amount of the insulator is small, the sampling current generated by the ferromagnetic core is very small, and an electrical signal which is easier to process can be obtained after the signal amplification module amplifies the sampling current.
The further technical scheme is as follows: the waveform overturning module comprises a comparator U15, an operational amplifier U1 and an analog switch chip U11, wherein a positive phase input end of the comparator U15 is connected with one end of a resistor R24, the other end of the resistor R24, one end of a resistor R31 and one end of a resistor R18 are common ends of the comparator U15 and the resistor R31, and the common ends are used as waveform signal input ends of the waveform overturning module; a diode D2 and a diode D1 which are connected in reverse direction are connected in parallel between the positive phase input end and the negative phase input end of the comparator U15, the negative phase input end of the comparator U15 is grounded, the output end of the comparator U15 is connected with the high level power supply end of the comparator U15 through a resistor R17, the output end of the comparator U15 is connected with the digital control input end of the analog switch chip U11 through a resistor R32, the first normally open switch input end NO1 of the analog switch chip U11 is connected with the other end of a resistor R31, the positive phase input end of the operational amplifier U1 is grounded, the negative phase input end of the operational amplifier U1 is connected with the other end of a resistor R18, the negative phase input end of the operational amplifier U1 is also connected with the ground through a capacitor C3, the output end of the operational amplifier U1 is connected with the negative phase input end of the operational amplifier U1 through a resistor R19 and a capacitor C4 which are connected in parallel, the output end of the operational amplifier U1 is connected with the first normally closed switch input end of the analog switch chip U11 through a resistor R30, and the signal output end of the analog switch chip U11 is used as the waveform signal output end of the waveform turning module and is used for being connected with the analog signal input end of the analog-to-digital conversion module.
By adopting the overturning circuit, the acquired waveform on the negative axis side of the sine waveform is overturned to the positive axis side, so that the sine waveform is transformed into 'steamed bread wave', and the subsequent processing and comparison of signals are facilitated. For smaller adopted current, the current can be ignored, and for larger peak current, due to possible factors such as error acquisition, further processing is carried out. The processing signals are all positive values, and the processing steps and contents can be effectively simplified.
The further technical scheme is as follows: the analog-to-digital conversion module comprises an analog-to-digital conversion chip U3 and an operational amplifier U4, wherein the model of the analog-to-digital conversion chip U3 is AD7091R _ 5;
a positive phase input end of the operational amplifier U4 is used as an analog signal input end of the analog-to-digital conversion module and is used for being connected with a waveform signal output end of the waveform inversion module, an output end of the operational amplifier U4 is connected with an inverted phase input end of the operational amplifier U4, an output end of the operational amplifier U4 is grounded through a resistor R15 and a capacitor C23, a common end of the resistor R15 and the capacitor C23 is connected with a positive phase input end of the operational amplifier U4 through a resistor R74, a common end of the resistor R74 and the capacitor C23 is connected with a first signal input end VIN0 of the analog-to-digital conversion chip U3, and a digital output end of the analog-to-digital conversion chip U3 is used as a digital signal output end of the analog-to-digital conversion module and is used for being connected with the microprocessor MCU; a fourth signal input terminal VIN4 of the analog-to-digital conversion chip U3 is connected to the power driving terminal of the low power consumption conversion module.
By adopting the steps, analog signals obtained by sampling can be subjected to digital conversion so as to be converted into data which can be identified by a microprocessor, and subsequent signal analysis is facilitated.
The further technical scheme is as follows: the waveform signal output end of the waveform turning module is also connected with a window module, the window module comprises a comparator U10A, a comparator U10B and a window reference value setting chip U9, and the model of the window reference value setting chip U9 is LTC1662CMS 8;
the reference signal input end of the window reference value setting chip U9 is used for acquiring the microprocessor MCU reference setting signal, the reference end REF of the window reference value setting chip U9 is connected with a reference voltage output chip U25, and the model of the reference voltage output chip U25 is REF3325 AIDCKR;
the high-level output end of a reference signal of the window reference value setting chip U9 is connected with the inverted input end of the comparator U10A, the non-inverted input end of the comparator U10A is connected with the waveform signal output end of the waveform turning module, and the output end of the comparator U10A is connected with the window high-level feedback input end of the microprocessor MCU;
the low level output end of the reference signal of the window reference value setting chip U9 is connected with the inverting input end of the comparator U10B, the non-inverting input end of the comparator U10B is connected with the waveform signal output end of the waveform turning module, and the output end of the comparator U10B is connected with the window low level feedback input end of the microprocessor MCU.
And comparing and analyzing the obtained steamed bun waveform data by adopting a window module, and giving a threshold value to the window module by the microprocessor so as to obtain a set signal of a threshold value interval and feeding the set signal back to the microprocessor.
The low-power conversion module comprises a micro-power management chip U18 and a low-power supply chip U17, wherein the model of the micro-power management chip U18 is bq25504, and the model of the low-power supply chip U17 is TPS 61220;
a pin VIN _ DC of the micro power management chip U18 is grounded through a capacitor C62 and a capacitor C61, the pin VIN _ DC of the micro power management chip U18 is grounded through a resistor R40, a resistor R42 and a resistor R44, and the pin VIN _ DC of the micro power management chip U18 is used for connecting a solar cell panel and a standby battery; a VSTOR (voltage switch over) end of a pin of the micro-power management chip U18 is used as a power supply driving end of the low-power conversion module;
little power consumption management chip U18's pin VSTOR end still through resistance R36 with low-power consumption power supply chip U17's pin VIN is connected, low-power consumption power supply chip U17's pin L still through electric capacity L4 with low-power consumption power supply chip U17's pin VIN is connected, low-power consumption power supply chip U17's pin VIN is through electric capacity C59 ground connection, low-power consumption power supply chip U17's pin VOUT is through electric capacity C53 ground connection, low-power consumption power supply chip U17's pin VOUT is as the power output of low-power consumption conversion module.
Through the low-power-consumption conversion module, electric energy is reasonably provided for the microprocessor and the acquisition circuit according to the working state modes of the microprocessor and the acquisition circuit, at least four modes such as a standby mode, a working mode, a sleep mode and a stop mode are arranged in the microprocessor, and the corresponding power consumption is different in each mode.
When the microprocessor MCU is in a standby mode:
the microprocessor MCU is in a low power consumption state; the memory and the register in the microprocessor MCU are in a low power consumption state; the acquisition circuit is in a low power consumption state; the wireless communication module connected with the microprocessor MCU is in a low power consumption state; the timer connected with the microprocessor MCU is in a working state; when the standby mode is entered and exceeds the standby mode communication wake-up time t2, the wireless communication module connected with the microprocessor MCU is in a working state; the timer connected with the microprocessor MCU is in a working state; the memory and the register in the microprocessor MCU are in a low power consumption state; the acquisition circuit is in a low power consumption state; after the wireless communication module establishes communication connection with the handheld terminal, the acquisition circuit and the microprocessor MCU are in a working state; the wireless communication module is in a working state; the memory and the register are in a low power consumption state;
when the microprocessor MCU is in a working mode;
the microprocessor MCU, the acquisition circuit, the wireless communication module, the timer, the memory and the register are all in working states;
when the microprocessor MCU is in a sleep mode;
the acquisition circuit, the wireless communication module, the timer, the memory and the register are all in a low power consumption state;
when the microprocessor MCU is in a stop mode;
the acquisition circuit, the wireless communication module and the timer are in a low power consumption state; the memory and the register are both in working state.
And under the low power consumption state and the working state, the power supply is adjusted through the low power consumption conversion module, and the adjustment control process is controlled by the microprocessor.
The microprocessor analyzes and controls the induction information and the mode and comprises the following steps:
s1, the microprocessor MCU enters a standby mode, the communication wake-up time countdown of the standby mode is started, after the communication wake-up time t2 of the standby mode is reached, the microprocessor MCU acquires a wake-up instruction sent by the handheld terminal, and the microprocessor MCU controls the wireless communication module to establish communication connection with the handheld terminal;
s2, generating an insulator induction signal trigger threshold by the microprocessor MCU;
s3, acquiring an insulator sensing signal of a signal acquisition device by a microprocessor MCU, triggering the microprocessor MCU to enter a working mode after the insulator sensing signal exceeds an insulator sensing signal triggering threshold value, and starting to acquire the insulator sensing signal according to an insulator sensing signal acquisition period T and an acquisition frequency n in the insulator sensing signal acquisition period to obtain working mode acquisition data;
s4, comparing and calculating the data acquired in the working mode by the microprocessor MCU to obtain an induction calculation data set of the current acquisition period;
wherein the induction calculation data set at least comprises induction maximum value Vmax, induction minimum value Vmin and induction energy value
Induction peak value Vmax-Vmin and induction average value V;
s5, comparing the induction calculation data sets of the current acquisition period and the previous acquisition period by the microprocessor MCU to obtain an insulator flashover judgment result; and the insulator flashover judgment result is stored in the memory and the register;
if the induction calculation data set of the current period exceeds the induction calculation data set of the previous period, judging that the insulator is in a flashover and easy-to-send state, otherwise, judging that the insulator is not in the flashover and easy-to-send state;
s6, the microprocessor MCU controls the wireless communication module to send the insulator flashover judgment results in the memory and the register to the handheld terminal, and then the handheld terminal enters a sleep mode;
when the microprocessor MCU is in a sleep mode, if any peak insulator sensing signal is received, the microprocessor MCU is awakened by the peak insulator sensing signal, and the step S3 is skipped;
s7, after the microprocessor MCU acquires the sleep interrupt signal, entering a shutdown mode, and counting down the set time of the shutdown mode; when the stop mode count-down time is reached, the process returns to step S3.
The invention has the beneficial effects that: the method comprises the steps of installing the ferromagnetic core on the surface of an insulator, and collecting discharge signals on the surface of the insulator by adopting the ferromagnetic core in combination with a magnetic induction principle to obtain collected analog signals. And the insulator is acquired by an acquisition circuit to realize real-time detection, and the insulator with the signal acquisition function is installed on a power grid to be detected so as to improve the power supply reliability of the power grid. Collector simple structure, easily installation, strong adaptability can be according to the collector size that this application provided of the change of the size adaptability of insulator to reach the purpose of accurate detection. And the insulator induction signals are uploaded to the microprocessor MCU in real time, and internal comparative analysis and transmission are realized through the microprocessor MCU. And a low-power consumption conversion unit is designed to reasonably supply power to the whole analysis process, so that the electric energy is saved, the working time and the service life of the acquisition system are guaranteed, and the maintenance times are reduced.
Drawings
Fig. 1 is a schematic view of a structure of an insulator according to a conventional art;
FIG. 2 is a schematic view of a three-dimensional structure for mounting a signal collector according to the present invention;
FIG. 3 is a front view of a signal collector of the present invention;
FIG. 4 is a schematic cross-sectional view A-A of FIG. 3;
FIG. 5 is an enlarged schematic view of B in FIG. 4;
FIG. 6 is a schematic perspective view of a signal collector;
FIG. 7 is a schematic perspective view of a collector housing;
FIG. 8 is a perspective view of a ferromagnetic core housing;
FIG. 9 is a schematic perspective view of a circuit chamber housing;
FIG. 10 is a block diagram of inductive signaling control according to the present invention;
FIG. 11 is a circuit diagram of the current sampling module of FIG. 10;
FIG. 12 is a circuit diagram of the signal amplification block of FIG. 10;
FIG. 13 is a circuit diagram of the waveform flipping module of FIG. 10;
FIG. 14 is a circuit diagram of the analog to digital conversion module of FIG. 10;
FIG. 15 is a circuit diagram of the layout of the microprocessor of FIG. 10;
FIG. 16 is a circuit diagram of the low power conversion module of FIG. 10;
fig. 17 is a circuit diagram of the window module of fig. 10.
Detailed Description
The following provides a more detailed description of the embodiments and the operation of the present invention with reference to the accompanying drawings.
An intelligent insulator flashover analysis system comprises a signal collector 2 installed on an insulator 1, wherein the installation effect figure is detailed as shown in fig. 2, a ferromagnetic core 3, a PCB circuit board 8 and a power supply module D are arranged in the signal collector 2, and the detailed description is provided in fig. 4 and 5.
In this embodiment, an acquisition circuit 4 and a microprocessor MCUK are arranged on the PCB circuit board 8, referring to fig. 10, the acquisition circuit 4 is connected to the ferromagnetic core 3 and is configured to acquire an insulator induction signal generated by induction of the ferromagnetic core 3, the acquisition circuit 4 is further connected to a signal acquisition end of the microprocessor MCUK, and a communication end of the microprocessor MCUK is connected to a wireless communication module W and is configured to communicate with a handheld terminal; a memory K1 and a register K3 are arranged in the microprocessor MCUK, and a timer K2 is connected to the timing end of the microprocessor MCUK;
referring to fig. 10, the power module D includes a low power consumption conversion unit D1, a power supply end of the low power consumption conversion unit D1 is connected to a solar panel D2 and a backup battery D3, a power control end and a power input end of the microprocessor MCUK are both connected to the low power consumption conversion unit D1, and the low power consumption conversion unit D1 is connected to the acquisition circuit 4.
As can be seen from fig. 6 and 7, the signal collector 2 includes two collector shells 5 symmetrically disposed on the outer wall of the insulator 1, the two collector shells 5 are hinged after being fastened on the outer wall of the insulator 1, each collector shell 5 includes an upper cover, a lower cover and an outer circular side wall which are connected, and the three are surrounded with the outer wall of the insulator 1 to form a collecting chamber Q;
referring to fig. 5, a semi-circular ferromagnetic core housing 6 and a semi-circular circuit chamber housing 7 are disposed in the collection chamber Q of each collector housing 5;
referring to fig. 9 and 8, it can be seen that the ferromagnetic core housing 6, circuit chamber housing 7 are sized and shaped to accommodate the collector housing 5.
In the present embodiment, as can be seen from fig. 5, the bottom of the ferromagnetic core housing 6 is fixed on the upper cover of the collector housing 5, the top of the ferromagnetic core housing 6 is open and abuts against the bottom of the circuit chamber housing 7, the inner circular sidewall of the ferromagnetic core housing 6 abuts against the outer wall of the insulator 1, the end of the ferromagnetic core housing 6 is open and abuts against the end cover of the collector housing 5, and the ferromagnetic core 3 is detachably placed inside the ferromagnetic core housing 6.
Referring to fig. 5 and 4, it can also be seen that the top cover of the circuit chamber housing 7 abuts against the upper cover of the collector housing 5, a circuit cavity through hole is formed in the end of the circuit chamber housing 7, the end of the circuit chamber housing 7 abuts against the end cover of the collector housing 5, one PCB circuit board 8 and the spare battery D3 are arranged inside each circuit chamber housing 7, and the solar panel D2 is mounted on the side wall of one collector housing 5 in a covering manner.
As can be seen from fig. 10, the acquisition circuit 4 includes a current sampling module 41, a signal amplifying module 42, a waveform inverting module 43, and an analog-to-digital conversion module 44; the sampling input end of the current sampling module 41 is used for acquiring an insulator sensing signal, and the sampling output end of the current sampling module 41 is connected with the signal acquisition end of the microprocessor MCUK after passing through the signal amplification module 42, the waveform inversion module 43 and the analog-to-digital conversion module 44;
the power supply driving end of the low power consumption conversion module D1 is connected to the analog-to-digital conversion module 44, and the power supply output end of the low power consumption conversion module D1 is connected to the current sampling module 41, the signal amplification module 42, the waveform inversion module 43, the analog-to-digital conversion module 44, and the microprocessor MCUK.
Referring to fig. 11, the current sampling module 41 includes an operational amplifier U14, in this embodiment, the model of the operational amplifier U14 is SGM8049-1XN 5G; the inverting input end of the operational amplifier U14 is grounded through a resistor R2 and a sampling resistor R28, the common end of the resistor R2 and the sampling resistor R28 serves as the sampling input end of the current sampling module 41, the non-inverting input end of the operational amplifier U14 is grounded through a resistor R1, the output end of the operational amplifier U14 is connected with the inverting input end of the operational amplifier U14 through a resistor R33, the output end of the operational amplifier U14 is connected with one end of a capacitor C11, and the other end of the capacitor C11 serves as the sampling output end of the current sampling module 41;
referring to fig. 12, the signal amplification block 42 includes an operational amplifier U13 of the same type as the operational amplifier U13 of the current sampling block 41, U14. Specifically, the positive phase of the operational amplifier U13 is connected to one end of a resistor R22 through a resistor R23, the other end of the resistor R22 serves as the amplification input terminal VIN of the signal amplification module 42, the amplification input terminal of the signal amplification module 42 is used for being connected to the sampling output terminal of the current sampling module 41, the common terminal of the resistor R23 and the resistor R22 is grounded through a capacitor C39, the inverting input terminal of the operational amplifier U13 is grounded through a resistor R25, the output terminal of the operational amplifier U13 is connected to the inverting input terminal of the operational amplifier U13 through a resistor R26, the output terminal of the operational amplifier U13 is connected to one end of a capacitor C2, and the other end of the capacitor C2 serves as the amplification output terminal VOUT of the signal amplification module 42.
Referring to fig. 13, the waveform flipping module 43 includes a comparator U15, an operational amplifier U1, and an analog switch chip U11, in this embodiment, the comparator U15 is SGM 8701; the positive phase input end of the comparator U15 is connected with one end of the resistor R24, the other end of the resistor R24, one end of the resistor R31 and one end of the resistor R18 are common ends of the three, and the common end is used as the waveform signal input end of the waveform inverting module 43; a diode D2 and a diode D1 which are reversely connected are connected in parallel between a positive phase input end and a negative phase input end of the comparator U15, the negative phase input end of the comparator U15 is grounded, the output end of the comparator U15 is connected with a high level power supply end of the comparator U15 through a resistor R17, the output end of the comparator U15 is connected with a digital control input end of the analog switch chip U11 through a resistor R32, wherein the model of the analog switch chip U11 is SGM 5018. The first normally open switch input end NO1 of the analog switch chip U11 is connected with the other end of the resistor R31, the non-inverting input end of the operational amplifier U1 is grounded, the inverting input end of the operational amplifier U1 is connected with the other end of the resistor R18, the inverting input end of the operational amplifier U1 is also grounded through the capacitor C3, the output end of the operational amplifier U1 is connected with the inverting input end of the operational amplifier U1 through the resistor R19 and the capacitor C4 which are connected in parallel, the output end of the operational amplifier U1 is connected with the first normally closed switch input end of the analog switch chip U11 through the resistor R30, and the signal output end of the analog switch chip U11 is used as the waveform signal output end of the waveform flipping module 43 and is used for connecting the analog signal input end of the analog-to-digital conversion module 44.
Referring to fig. 14, the analog-to-digital conversion module 44 includes an analog-to-digital conversion chip U3 and an operational amplifier U4, where the model of the analog-to-digital conversion chip U3 is AD7091R _ 5; the model of the operational amplifier U4 is SGM 8041. In this embodiment, referring to fig. 14 and fig. 15, a positive phase input terminal of the operational amplifier U4 is used as an analog signal input terminal of the analog-to-digital conversion module 44 to be connected to a waveform signal output terminal of the waveform inversion module 43, an output terminal of the operational amplifier U4 is connected to an inverted phase input terminal of the operational amplifier U4, an output terminal of the operational amplifier U4 is grounded via a resistor R15 and a capacitor C23, a common terminal of the resistor R15 and the capacitor C23 is connected to a positive phase input terminal of the operational amplifier U4 via a resistor R74, a common terminal of the resistor R74 and the capacitor C23 is connected to a first signal input terminal VIN0 of the analog-to-digital conversion chip U3, and a digital output terminal of the analog-to-digital conversion chip U3 is used as a digital signal output terminal of the analog-to-digital conversion module 44 to be connected to the microprocessor MCUK, and the microprocessor refers to fig. 15; a fourth signal input terminal VIN4 of the analog-to-digital conversion chip U3 is connected to the power driving terminal of the low power consumption conversion module D1.
As can be seen from fig. 17 and 10, the waveform signal output terminal of the waveform flipping module 43 is further connected to a window module 47, where the window module 47 includes a comparator U10A, a comparator U10B, and a window reference value setting chip U9, and the window reference value setting chip U9 is of a type LTC1662CMS 8; the reference signal input end of the window reference value setting chip U9 is configured to obtain the microprocessor MCUK reference setting signal, where, referring to fig. 15, the chip signal of the microprocessor is: STM32L152C8T 6.
A reference end REF of the window reference value setting chip U9 is connected with a reference voltage output chip U25, and the model of the reference voltage output chip U25 is REF3325 AIDCKR;
in this embodiment, the high-level output terminal of the reference signal of the window reference value setting chip U9 is connected to the inverting input terminal of the comparator U10A, the non-inverting input terminal of the comparator U10A is connected to the waveform signal output terminal of the waveform inversion module 43, and the output terminal of the comparator U10A is connected to the high-level feedback input terminal of the window of the microprocessor MCUK; the low level output terminal of the reference signal of the window reference value setting chip U9 is connected to the inverting input terminal of the comparator U10B, the non-inverting input terminal of the comparator U10B is connected to the waveform signal output terminal of the waveform flipping module 43, and the output terminal of the comparator U10B is connected to the window low level feedback input terminal of the microprocessor MCUK.
Referring to fig. 16, the low power conversion module D1 includes a micro power management chip U18 and a low power supply chip U17, where the model of the micro power management chip U18 is bq25504, and the model of the low power supply chip U17 is TPS 61220;
a pin VIN _ DC of the micro power management chip U18 is grounded through a capacitor C62 and a capacitor C61, a pin VIN _ DC of the micro power management chip U18 is grounded through a resistor R40, a resistor R42 and a resistor R44, and the pin VIN _ DC of the micro power management chip U18 is used for connecting a solar cell panel D2 and a standby battery D3; a VSTOR (voltage switch over) end of the micro-power management chip U18 is used as a power driving end of the low-power conversion module D1;
the little power consumption management chip U18's pin VSTOR end still through resistance R36 with low-power consumption power supply chip U17's pin VIN is connected, low-power consumption power supply chip U17's pin L still through electric capacity L4 with low-power consumption power supply chip U17's pin VIN is connected, low-power consumption power supply chip U17's pin VIN is through electric capacity C59 ground connection, low-power consumption power supply chip U17's pin VOUT is through electric capacity C53 ground connection, low-power consumption power supply chip U17's pin VOUT is as low-power consumption conversion module D1's power output end.
It should be noted that the above description is not intended to limit the present invention, and the present invention is not limited to the above examples, and those skilled in the art may make variations, modifications, additions or substitutions within the spirit and scope of the present invention.
Claims (10)
1. The utility model provides an intelligence insulator flashover analytic system which characterized in that: the signal acquisition device comprises a signal acquisition device (2) arranged on an insulator (1), wherein a ferromagnetic core (3), a PCB circuit board (8) and a power supply module (D) are arranged in the signal acquisition device (2);
an acquisition circuit (4) and a microprocessor MCU (K) are arranged on the PCB circuit board (8), the acquisition circuit (4) is connected with the ferromagnetic core (3) and is used for acquiring insulator induction signals generated by the ferromagnetic core (3) through induction, the acquisition circuit (4) is also connected with a signal acquisition end of the microprocessor MCU (K), and a communication end of the microprocessor MCU (K) is connected with a wireless communication module (W) and is used for communicating with a handheld terminal; a memory (K1) and a register (K3) are arranged in the microprocessor MCU (K), and a timer (K2) is connected to the timing end of the microprocessor MCU (K);
the power module (D) comprises a low-power-consumption conversion unit (D1), a power supply end of the low-power-consumption conversion unit (D1) is connected with a solar cell panel (D2) and a standby battery (D3), a power control end and a power input end of the microprocessor MCU (K) are connected with the low-power-consumption conversion unit (D1), and the low-power-consumption conversion unit (D1) is connected with the acquisition circuit (4).
2. The intelligent insulator flashover analysis system of claim 1, wherein: the signal collector (2) comprises two collector shells (5) symmetrically arranged on the outer wall of the insulator (1), the two collector shells (5) are buckled on the outer wall of the insulator (1) and then hinged, each collector shell (5) comprises an upper cover, a lower cover and an outer circle side wall which are connected, and the three parts and the outer wall of the insulator (1) are surrounded to form a collecting cavity (Q);
a semi-circular ferromagnetic core shell (6) and a semi-circular circuit cavity shell (7) are arranged in the collection cavity (Q) of each collector shell (5); the size and the shape of the ferromagnetic core shell (6) and the circuit cavity shell (7) are matched with those of the collector shell (5).
3. The intelligent insulator flashover analysis system of claim 2, wherein: ferromagnetic core shell (6) bottom is fixed collector shell (5) upper cover, open-top and butt are in ferromagnetic core shell (6) top circuit chamber shell (7) bottom, circle lateral wall butt is in ferromagnetic core shell (6) on the insulator (1) outer wall, opening of ferromagnetic core shell (6) tip and butt are in on the end cover of collector shell (5), ferromagnetic core (3) have been placed to ferromagnetic core shell (6) inside detachable.
4. The intelligent insulator flashover analysis system of claim 3, wherein: the top cap of circuit cavity housing (7) with collector shell (5) upper cover butt, the inside of circuit cavity housing (7) has arranged acquisition circuit (4), circuit cavity housing (7) tip sets up circuit chamber through-hole, circuit cavity housing (7) tip butt is in on the end cover of collector shell (5), circuit cavity housing (7) inside has arranged at least one PCB circuit board (8) with spare battery (D3), one of them cover and install on collector shell (5) lateral wall solar cell panel (D2).
5. The intelligent insulator flashover analysis system according to claim 1 or 4, characterized in that: the acquisition circuit (4) comprises a current sampling module (41), a signal amplification module (42), a waveform inversion module (43) and an analog-to-digital conversion module (44);
the sampling input end of the current sampling module (41) is used for acquiring an insulator sensing signal, and the sampling output end of the current sampling module (41) is connected with the signal acquisition end of a microprocessor MCU (K) after passing through a signal amplification module (42), a waveform inversion module (43) and an analog-to-digital conversion module (44);
the power supply driving end of the low-power-consumption conversion module (D1) is connected with the analog-to-digital conversion module (44), and the power supply output end of the low-power-consumption conversion module (D1) is connected with the current sampling module (41), the signal amplification module (42), the waveform inversion module (43), the analog-to-digital conversion module (44) and the microprocessor MCU (K).
6. The intelligent insulator flashover analysis system of claim 5, characterized in that: the current sampling module (41) comprises an operational amplifier U14, the inverting input terminal of the operational amplifier U14 is grounded through a resistor R2 and a sampling resistor R28, the common end of the resistor R2 and the sampling resistor R28 is used as the sampling input terminal of the current sampling module (41), the non-inverting input terminal of the operational amplifier U14 is grounded through a resistor R1, the output terminal of the operational amplifier U14 is connected with the inverting input terminal of the operational amplifier U14 through a resistor R33, the output terminal of the operational amplifier U14 is connected with one end of a capacitor C11, and the other end of the capacitor C11 is used as the sampling output terminal of the current sampling module (41);
the signal amplification module (42) comprises an operational amplifier U13, wherein the positive phase of the operational amplifier U13 is connected with one end of a resistor R22 through a resistor R23, the other end of the resistor R22 is used as the amplification input end of the signal amplification module (42), the amplification input end of the signal amplification module (42) is used for being connected with the sampling output end of the current sampling module (41), the common end of the resistor R23 and the resistor R22 is grounded through a capacitor C39, the reverse phase input end of the operational amplifier U13 is grounded through a resistor R25, the output end of the operational amplifier U13 is connected with the reverse phase input end of the operational amplifier U13 through a resistor R26, the output end of the operational amplifier U13 is connected with one end of a capacitor C2, and the other end of the capacitor C2 is used as the amplification output end of the signal amplification module (42).
7. The intelligent insulator flashover analysis system of claim 5, wherein: the waveform inverting module (43) comprises a comparator U15, an operational amplifier U1 and an analog switch chip U11, wherein a positive phase input end of the comparator U15 is connected with one end of a resistor R24, the other end of the resistor R24, one end of a resistor R31 and one end of a resistor R18 are common ends of the three, and the common ends are used as waveform signal input ends of the waveform inverting module (43); a diode D2 and a diode D1 which are connected in reverse direction are connected in parallel between a positive phase input end and an inverse phase input end of the comparator U15, the inverse phase input end of the comparator U15 is grounded, the output end of the comparator U15 is connected with a high level power supply end of the comparator U15 through a resistor R17, the output end of the comparator U15 is connected with a digital control input end of the analog switch chip U11 through a resistor R32, a first normally open switch input end NO1 of the analog switch chip U11 is connected with the other end of the resistor R31, the positive phase input end of the operational amplifier U1 is grounded, the inverse phase input end of the operational amplifier U1 is connected with the other end of the resistor R18, the inverse phase input end of the operational amplifier U1 is grounded through a capacitor C3, the output end of the operational amplifier U1 is connected with the inverse phase input end of the operational amplifier U1 through a resistor R19 and a capacitor C4 which are connected in parallel, and the output end of the operational amplifier U1 is connected with the first switch chip 11 through a resistor R30 The input end of the analog switch chip U11 is connected, and the signal output end of the analog switch chip U11 is used as the waveform signal output end of the waveform inversion module (43) and is connected with the analog signal input end of the analog-to-digital conversion module (44).
8. The intelligent insulator flashover analysis system of claim 5, wherein: the analog-to-digital conversion module (44) comprises an analog-to-digital conversion chip U3 and an operational amplifier U4, wherein the model of the analog-to-digital conversion chip U3 is AD7091R _ 5;
a positive phase input end of the operational amplifier U4 is used as an analog signal input end of the analog-to-digital conversion module (44) and is used for being connected with a waveform signal output end of the waveform inversion module (43), an output end of the operational amplifier U4 is connected with an inverted phase input end of the operational amplifier U4, an output end of the operational amplifier U4 is grounded through a resistor R15 and a capacitor C23, a common end of the resistor R15 and the capacitor C23 is connected with a positive phase input end of the operational amplifier U4 through a resistor R74, a common end of the resistor R74 and a capacitor C23 is connected with a first signal input end 0 of the analog-to-digital conversion chip U3, and a digital output end of the analog-to-digital conversion chip U3 is used as a digital signal output end of the analog-to-digital conversion module (44) and is used for being connected with the microprocessor mcu (k); a fourth signal input end VIN4 of the analog-to-digital conversion chip U3 is connected with a power driving end of the low power consumption conversion module (D1).
9. The intelligent insulator flashover analysis system of claim 5, wherein: the waveform signal output end of the waveform overturning module (43) is further connected with a window module (47), the window module (47) comprises a comparator U10A, a comparator U10B and a window reference value setting chip U9, and the model of the window reference value setting chip U9 is LTC1662CMS 8;
a reference signal input end of the window reference value setting chip U9 is used for acquiring a reference setting signal of the microprocessor mcu (k), a reference end REF of the window reference value setting chip U9 is connected to a reference voltage output chip U25, and the reference voltage output chip U25 is REF3325 AIDCKR;
the high-level output end of the reference signal of the window reference value setting chip U9 is connected with the inverting input end of the comparator U10A, the non-inverting input end of the comparator U10A is connected with the waveform signal output end of the waveform flipping module (43), and the output end of the comparator U10A is connected with the high-level feedback input end of the window of the microprocessor MCU (K);
the low level output end of the reference signal of the window reference value setting chip U9 is connected with the inverting input end of the comparator U10B, the non-inverting input end of the comparator U10B is connected with the waveform signal output end of the waveform flipping module (43), and the output end of the comparator U10B is connected with the window low level feedback input end of the microprocessor MCU (K).
10. The intelligent insulator flashover analysis system of claim 5, wherein: the low-power conversion module (D1) comprises a micro-power management chip U18 and a low-power supply chip U17, wherein the model of the micro-power management chip U18 is bq25504, and the model of the low-power supply chip U17 is TPS 61220;
a pin VIN _ DC of the micro power consumption management chip U18 is grounded through a capacitor C62 and a capacitor C61, the pin VIN _ DC of the micro power consumption management chip U18 is grounded through a resistor R40, a resistor R42 and a resistor R44, and the pin VIN _ DC of the micro power consumption management chip U18 is used for connecting a solar cell panel (D2) and a spare battery (D3); a VSTOR (voltage switch over) end of a pin of the micro-power management chip U18 is used as a power supply driving end of the low-power conversion module (D1);
little power consumption management chip U18's pin VSTOR end still through resistance R36 with low-power consumption power supply chip U17's pin VIN is connected, low-power consumption power supply chip U17's pin L still through electric capacity L4 with low-power consumption power supply chip U17's pin VIN is connected, low-power consumption power supply chip U17's pin VIN is through electric capacity C59 ground connection, low-power consumption power supply chip U17's pin VOUT is through electric capacity C53 ground connection, low-power consumption power supply chip U17's pin VOUT is as the power output of low-power consumption conversion module (D1).
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