CN113480769A - Preparation method of high-temperature-resistant antistatic non-silicon release film - Google Patents
Preparation method of high-temperature-resistant antistatic non-silicon release film Download PDFInfo
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- CN113480769A CN113480769A CN202110862094.3A CN202110862094A CN113480769A CN 113480769 A CN113480769 A CN 113480769A CN 202110862094 A CN202110862094 A CN 202110862094A CN 113480769 A CN113480769 A CN 113480769A
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- silicon release
- temperature
- release film
- antistatic
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 63
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 63
- 239000010703 silicon Substances 0.000 title claims abstract description 63
- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- 239000011248 coating agent Substances 0.000 claims abstract description 36
- 238000000576 coating method Methods 0.000 claims abstract description 36
- 239000002904 solvent Substances 0.000 claims abstract description 29
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 23
- 239000002216 antistatic agent Substances 0.000 claims abstract description 19
- -1 polyethylene Polymers 0.000 claims abstract description 18
- 238000002156 mixing Methods 0.000 claims abstract description 17
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 239000004698 Polyethylene Substances 0.000 claims abstract description 9
- 229920002873 Polyethylenimine Polymers 0.000 claims abstract description 9
- GJNDMSSZEBNLPU-UHFFFAOYSA-N octadecylurea Chemical compound CCCCCCCCCCCCCCCCCCNC(N)=O GJNDMSSZEBNLPU-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229920000573 polyethylene Polymers 0.000 claims abstract description 9
- 238000003851 corona treatment Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000007865 diluting Methods 0.000 claims abstract description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 24
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 18
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 6
- 229920000123 polythiophene Polymers 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 4
- 230000000694 effects Effects 0.000 description 6
- 230000032683 aging Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000009194 climbing Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011417 postcuring Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2429/00—Presence of polyvinyl alcohol
- C09J2429/005—Presence of polyvinyl alcohol in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2465/00—Presence of polyphenylene
- C09J2465/003—Presence of polyphenylene in the primer coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/02—Presence of polyamine or polyimide polyamine
- C09J2479/025—Presence of polyamine or polyimide polyamine in the release coating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a preparation method of a high-temperature-resistant antistatic non-silicon release film, which is characterized by comprising the following steps of: carrying out corona treatment on the base material, and coating a primer to obtain a primer layer; coating an antistatic agent on the bottom coating to obtain an antistatic layer; coating a non-silicon release agent on the antistatic layer, and curing at 120 ℃ for 30-60s to obtain a high-temperature-resistant antistatic non-silicon release film; the preparation method of the non-silicon release agent comprises the following steps: mixing polyethyleneimine octadecyl urea and polyethylene amino octadecyl formate according to the weight ratio of 1:0.8 to obtain a mixture A; diluting the mixture A to 0.25-2wt% by using a solvent B, and heating to dissolve to obtain the non-silicon release agent.
Description
Technical Field
The invention belongs to the field of release films, and particularly relates to a preparation method of a high-temperature-resistant antistatic non-silicon release film.
Background
The release film is a film material coated with a release agent, and is characterized by smooth surface, high cleanliness, stable subsequent processing dimension, adjustable transparency and color, wide selectable range of the thickness of the film and the variety of the base material, no viscosity or slight viscosity after the release film is contacted with a specific material under limited conditions; at present, the PET release film has a release effect, mainly because the surface is coated with a layer of silicone oil with a barrier effect; however, with the rise of the electronic display screen industry, release films cannot contain any silicon element required by companies such as Huashi and apple, and even trace silicon transfer can cause defects in the adhesion of the OCA tape in the field of display screens, pollute panels and reduce the yield; therefore, the non-silicon release film gradually rises; in addition, current non-silicon release film, high temperature resistance is poor, and is ageing easily under high temperature environment, and life is short, and resistance to compression and antistatic effect are poor, produce static easily during the use and cause the conflagration.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a preparation method of a high-temperature-resistant antistatic non-silicon release film, which solves the problems of silicon transfer, poor antistatic effect, serious climbing of release force after aging and the like in the prior art.
In order to solve the problems of the prior art, the invention adopts the technical scheme that:
the invention provides a preparation method of a high-temperature-resistant antistatic non-silicon release film, which comprises the following steps:
carrying out corona treatment on the base material, and coating a primer to obtain a primer layer;
coating an antistatic agent on the bottom coating to obtain an antistatic layer;
coating a non-silicon release agent on the antistatic layer, and curing at 120 ℃ for 30-60s to obtain a high-temperature-resistant antistatic non-silicon release film;
the preparation method of the non-silicon release agent comprises the following steps:
mixing polyethyleneimine octadecyl urea and polyethylene amino octadecyl formate according to the weight ratio of 1:0.8 to obtain a mixture A;
diluting the mixture A to 0.25-2wt% by using a solvent B, and heating to dissolve to obtain the non-silicon release agent.
Further, the primer includes polyvinyl butyral.
Further, the coating amount of the primer is 0.1-1 um.
Further, the preparation method of the antistatic agent is as follows: and mixing the polythiophene and the solvent C according to the weight ratio of 1:7 to obtain the antistatic agent.
Further, the preparation method of the solvent C is as follows: isopropanol and water were mixed in a weight ratio of 6:4 to give solvent C.
Further, the coating amount of the antistatic agent is 0.1-0.2 um.
Further, the preparation method of the solvent B is as follows: toluene and isopropanol were mixed in a weight ratio of 3:1 to give solvent B.
Further, the heating and dissolving temperature is 42-45 deg.C, and the heating and dissolving time is 30 min.
Further, the coating weight of the non-silicon release agent is 0.1-0.4 um.
Further, the substrate comprised 0.05mm matte PET.
Compared with the prior art, the invention has the beneficial effects that:
according to the preparation method of the high-temperature-resistant antistatic non-silicon release film, the antistatic agent is coated on the bottom coating to form the antistatic layer, so that the antistatic effect is good; the non-silicon release agent is prepared from polyethyleneimine octadecyl urea and polyethylene amino octadecyl formate, so that product defects caused by silicon transfer are avoided; the release film can be completely molded after being cured for 30-60s at 120 ℃, post curing is not needed, the finally obtained release film has good high-temperature resistance, and the phenomenon of serious climbing of release force after aging can not occur in a high-temperature environment.
Detailed Description
The invention is further described below. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
Example 1
According to the preparation method of the high-temperature-resistant antistatic non-silicon release film provided by the embodiment of the invention, firstly, 50 matte PET is subjected to corona treatment, and a primer polyvinyl butyral is coated, wherein the coating amount is 0.5um, so that a primer layer is obtained.
Isopropanol and water are mixed into a solvent C in a weight ratio of 6:4, polythiophene and the solvent C are mixed in a weight ratio of 1:7 to obtain an antistatic agent, and then the antistatic agent is coated on a base coat layer with the coating weight of 0.1um to obtain the antistatic layer.
Mixing polyethyleneimine octadecyl urea and polyethylene amino octadecyl formate according to the weight ratio of 1:0.8 to obtain a mixture A; mixing toluene and isopropanol according to the weight ratio of 3:1 to obtain a solvent B; and mixing the mixture A and the solvent B in a weight ratio of 1:220, heating and dissolving at 42 ℃ for 30min to obtain a non-silicon release agent, coating the non-silicon release agent on an antistatic layer with the coating weight of 0.1um, and curing at 120 ℃ for 45s to obtain the final high-temperature-resistant antistatic non-silicon release film.
The high-temperature resistant antistatic non-silicon release film is subjected to 24-hour release force test at different temperatures, and the data are as follows: release force 24.5(gf/inch) at 23 ℃, release force 44.7(gf/inch) at 50 ℃, release force 67.8(gf/inch) at 70 ℃ and release force 147(gf/inch) at 120 ℃.
Example 2
According to the preparation method of the high-temperature-resistant antistatic non-silicon release film provided by the embodiment of the invention, firstly, 50 matte PET is subjected to corona treatment, and a primer polyvinyl butyral is coated, wherein the coating amount is 0.5um, so that a primer layer is obtained.
Isopropanol and water are mixed into a solvent C in a weight ratio of 6:4, polythiophene and the solvent C are mixed in a weight ratio of 1:7 to obtain an antistatic agent, and then the antistatic agent is coated on a base coat layer with the coating weight of 0.2um to obtain the antistatic layer.
Mixing polyethyleneimine octadecyl urea and polyethylene amino octadecyl formate according to the weight ratio of 1:0.8 to obtain a mixture A; mixing toluene and isopropanol according to the weight ratio of 3:1 to obtain a solvent B; and mixing the mixture A and the solvent B in a weight ratio of 1:100, heating and dissolving at 45 ℃ for 30min to obtain a non-silicon release agent, coating the non-silicon release agent on an antistatic layer with the coating weight of 0.3um, and curing at 120 ℃ for 30s to obtain the final high-temperature-resistant antistatic non-silicon release film.
The high-temperature resistant antistatic non-silicon release film is subjected to 24-hour release force test at different temperatures, and the data are as follows: release force 15.5(gf/inch) at 23 ℃, release force 22.5(gf/inch) at 50 ℃, release force 35.4(gf/inch) at 70 ℃ and release force 62(gf/inch) at 120 ℃.
Example 3
According to the preparation method of the high-temperature-resistant antistatic non-silicon release film provided by the embodiment of the invention, firstly, 50 matte PET is subjected to corona treatment, and a primer polyvinyl butyral is coated, wherein the coating amount is 0.5um, so that a primer layer is obtained.
Isopropanol and water are mixed into a solvent C in a weight ratio of 6:4, polythiophene and the solvent C are mixed in a weight ratio of 1:7 to obtain an antistatic agent, and then the antistatic agent is coated on a base coat layer with the coating weight of 0.1um to obtain the antistatic layer.
Mixing polyethyleneimine octadecyl urea and polyethylene amino octadecyl formate according to the weight ratio of 1:0.8 to obtain a mixture A; mixing toluene and isopropanol according to the weight ratio of 3:1 to obtain a solvent B; and mixing the mixture A and the solvent B in a weight ratio of 1:150, heating and dissolving for 30min at 44 ℃ to obtain a non-silicon release agent, coating the non-silicon release agent on an antistatic layer with the coating weight of 0.4um, and curing at 120 ℃ for 60s to obtain the final high-temperature-resistant antistatic non-silicon release film.
The high-temperature resistant antistatic non-silicon release film is subjected to 24-hour release force test at different temperatures, and the data are as follows: release force 22(gf/inch) at 23 ℃, release force 37(gf/inch) at 50 ℃, release force 52.6(gf/inch) at 70 ℃ and release force 135(gf/inch) at 120 ℃.
Example 4
According to the preparation method of the high-temperature-resistant antistatic non-silicon release film provided by the embodiment of the invention, firstly, 50 matte PET is subjected to corona treatment, and a primer polyvinyl butyral is coated, wherein the coating amount is 0.5um, so that a primer layer is obtained.
Isopropanol and water are mixed into a solvent C in a weight ratio of 6:4, polythiophene and the solvent C are mixed in a weight ratio of 1:7 to obtain an antistatic agent, and then the antistatic agent is coated on a base coat layer with the coating weight of 0.2um to obtain the antistatic layer.
Mixing polyethyleneimine octadecyl urea and polyethylene amino octadecyl formate according to the weight ratio of 0.8:1 to obtain a mixture A; mixing toluene and isopropanol according to the weight ratio of 3:1 to obtain a solvent B; and mixing the mixture A and the solvent B in a weight ratio of 1:100, heating and dissolving at 44 ℃ for 30min to obtain a non-silicon release agent, coating the non-silicon release agent on an antistatic layer with the coating weight of 0.4um, and curing at 120 ℃ for 60s to obtain the final high-temperature-resistant antistatic non-silicon release film.
The high-temperature resistant antistatic non-silicon release film is subjected to 24-hour release force test at different temperatures, and the data are as follows: release force at 23 ℃ of 45(gf/inch), release force at 50 ℃ of 60(gf/inch), release force at 70 ℃ of 82.4(gf/inch), and release force at 120 ℃ of 154 (gf/inch).
In conclusion, according to the preparation method of the high-temperature-resistant antistatic non-silicon release film, the antistatic agent is coated on the bottom coating to form the antistatic layer, so that the antistatic effect is good; the non-silicon release agent is prepared from polyethyleneimine octadecyl urea and polyethylene amino octadecyl formate, so that product defects caused by silicon transfer are avoided; the release film can be completely molded after being cured for 30-60s at 120 ℃, post curing is not needed, the finally obtained release film has good high-temperature resistance, and the phenomenon of serious climbing of release force after aging can not occur in a high-temperature environment; the non-silicon release agent does not contain harmful substances such as silicon element, fluorine element and heavy metal, and belongs to an environment-friendly product.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A preparation method of a high-temperature-resistant antistatic non-silicon release film is characterized by comprising the following steps:
carrying out corona treatment on the base material, and coating a primer to obtain a primer layer;
coating an antistatic agent on the bottom coating to obtain an antistatic layer;
coating a non-silicon release agent on the antistatic layer, and curing at 120 ℃ for 30-60s to obtain a high-temperature-resistant antistatic non-silicon release film;
the preparation method of the non-silicon release agent comprises the following steps:
mixing polyethyleneimine octadecyl urea and polyethylene amino octadecyl formate according to the weight ratio of 1:0.8 to obtain a mixture A;
diluting the mixture A to 0.25-2wt% by using a solvent B, and heating to dissolve to obtain the non-silicon release agent.
2. The method for preparing the high-temperature-resistant antistatic non-silicon release film according to claim 1, wherein the primer comprises polyvinyl butyral.
3. The preparation method of the high-temperature-resistant antistatic non-silicon release film according to claim 1, characterized in that the coating amount of the primer is 0.1-1 um.
4. The preparation method of the high-temperature-resistant antistatic non-silicon release film according to claim 1, characterized in that the preparation method of the antistatic agent is as follows:
and mixing the polythiophene and the solvent C according to the weight ratio of 1:7 to obtain the antistatic agent.
5. The preparation method of the high-temperature-resistant antistatic non-silicon release film according to claim 4, characterized in that the preparation method of the solvent C is as follows:
isopropanol and water were mixed in a weight ratio of 6:4 to give solvent C.
6. The method for preparing the high-temperature resistant antistatic non-silicon release film according to claim 1, wherein the coating amount of the antistatic agent is 0.1-0.2 um.
7. The preparation method of the high-temperature-resistant antistatic non-silicon release film according to claim 1, characterized in that the preparation method of the solvent B is as follows:
toluene and isopropanol were mixed in a weight ratio of 3:1 to give solvent B.
8. The preparation method of the high temperature resistant antistatic non-silicon release film according to claim 1, characterized in that the temperature of the heating and dissolving is 42-45 ℃ and the time of the heating and dissolving is 30 min.
9. The method for preparing the high-temperature-resistant antistatic non-silicon release film according to claim 1, wherein the coating amount of the non-silicon release agent is 0.1-0.4 um.
10. The method for preparing the high-temperature-resistant antistatic non-silicon release film according to claim 1, wherein the substrate comprises 0.05mm matte PET.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110862094.3A CN113480769A (en) | 2021-07-29 | 2021-07-29 | Preparation method of high-temperature-resistant antistatic non-silicon release film |
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| CN202110862094.3A CN113480769A (en) | 2021-07-29 | 2021-07-29 | Preparation method of high-temperature-resistant antistatic non-silicon release film |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115873529A (en) * | 2022-12-30 | 2023-03-31 | 江苏斯迪克新材料科技股份有限公司 | Non-silicon mold release agent with adjustable release force and melting point and preparation method thereof |
| CN116656187A (en) * | 2023-05-29 | 2023-08-29 | 太仓斯迪克新材料科技有限公司 | Long-chain non-silicon release agent with high temperature resistance and high adhesive force and preparation method thereof |
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| CN1118585A (en) * | 1993-01-25 | 1996-03-13 | 艾弗里·丹尼森公司 | Release films formed by coextrusion |
| CN106010323A (en) * | 2015-03-25 | 2016-10-12 | 藤森工业株式会社 | Antistatic surface protective film and optical part with same |
| CN208485841U (en) * | 2018-05-02 | 2019-02-12 | 昆山云松电子材料有限公司 | Antistatic fluorine element release film |
| CN111548518A (en) * | 2020-06-18 | 2020-08-18 | 太仓斯迪克新材料科技有限公司 | Ultra-light/ultra-heavy non-silicon release film and preparation method thereof |
| CN112571879A (en) * | 2019-09-30 | 2021-03-30 | 日东电工株式会社 | Laminated sheet |
-
2021
- 2021-07-29 CN CN202110862094.3A patent/CN113480769A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1118585A (en) * | 1993-01-25 | 1996-03-13 | 艾弗里·丹尼森公司 | Release films formed by coextrusion |
| CN106010323A (en) * | 2015-03-25 | 2016-10-12 | 藤森工业株式会社 | Antistatic surface protective film and optical part with same |
| CN208485841U (en) * | 2018-05-02 | 2019-02-12 | 昆山云松电子材料有限公司 | Antistatic fluorine element release film |
| CN112571879A (en) * | 2019-09-30 | 2021-03-30 | 日东电工株式会社 | Laminated sheet |
| CN111548518A (en) * | 2020-06-18 | 2020-08-18 | 太仓斯迪克新材料科技有限公司 | Ultra-light/ultra-heavy non-silicon release film and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115873529A (en) * | 2022-12-30 | 2023-03-31 | 江苏斯迪克新材料科技股份有限公司 | Non-silicon mold release agent with adjustable release force and melting point and preparation method thereof |
| CN116656187A (en) * | 2023-05-29 | 2023-08-29 | 太仓斯迪克新材料科技有限公司 | Long-chain non-silicon release agent with high temperature resistance and high adhesive force and preparation method thereof |
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