CN111548518A - Ultra-light/ultra-heavy non-silicon release film and preparation method thereof - Google Patents
Ultra-light/ultra-heavy non-silicon release film and preparation method thereof Download PDFInfo
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- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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Abstract
The invention discloses an ultra-light/ultra-heavy non-silicon release film, which comprises a substrate layer, an antistatic primer layer coated on the substrate layer, and a non-silicon release coating coated on the antistatic primer layer; the non-silicon release coating is prepared from the following components in parts by weight: 1000 parts of ester solvent, 50-500 parts of ketone solvent, 0-300 parts of amino modified acrylic resin, 0-300 parts of hydroxyl-containing acrylic resin and 5-50 parts of curing agent, wherein the total amount of the amino modified acrylic resin and the hydroxyl-containing acrylic resin is 300 parts; the viscosity of the amino modified acrylic resin is 100-300CPS, and the molecular weight is 3-6 ten thousand; the hydroxyl-containing acrylic resin has the viscosity of 200-500CPS and the molecular weight of 4-7 ten thousand. The invention also discloses a preparation method of the ultralight/overweight non-silicon release film. The ultra-light/ultra-heavy non-silicon release film does not contain silicon element, does not produce silicon pollution, and the release force can be adjusted in a wide range.
Description
Technical Field
The invention relates to the technical field of adhesive tapes, in particular to an ultralight/overweight non-silicon release film and a preparation method thereof.
Background
The release film is a functional film material with low surface energy obtained by coating a plurality of special chemical coatings on various films and drying or ultraviolet curing, is an indispensable component of pressure-sensitive adhesive protective film products, and is also a die cutting material which must be used in the die cutting industry. Among release agents required by the release film, compared with other release agents, the silicone oil and the silicon-containing release agent have many outstanding advantages, such as good transparency, good isolation effect, adjustable stripping force in a large range, high temperature resistance, solvent resistance, adjustable coating thickness and silicon content, good durability and reusability. Silicone oil and silicon-containing release agents have become the most interesting release agent materials, are widely applied in the industries of pressure sensitive adhesive tapes, waterproof materials, PCB manufacturing, automobile molding material manufacturing, electronic communication and the like, and permeate into more industries along with the development of technology.
At present, electronic products are higher and higher in requirements, some special electronic products are extremely sensitive to silicon and fluorine elements, the silicon elements easily cause poor processing and short circuit risks of the electronic products, but proper protective film materials are required to protect the electronic products in the process of manufacturing, so that higher requirements are provided for the protective film products, and the silicon content range of the protective film materials is strictly controlled. However, the isolation films used for the protective film products produced by the traditional coating manufacturers are common organic silicon release films, which can cause silicon to be transferred to the surface of the protective film adhesive, thereby bringing the risk of silicon pollution of materials; the silicon pollution risk is strictly controlled by a terminal customer, so that the demand of coating manufacturers and die cutting manufacturers on meeting the demand of fluorine-free and silicon-free release films with service performance is urgent, and release film enterprises are required to accelerate the development of high-end special ultra-light and ultra-heavy non-silicon release film products to meet the market demand.
Disclosure of Invention
The invention aims to solve the technical problem of providing an ultra-light/ultra-heavy non-silicon release film, wherein the release film product does not contain silicon element, does not generate silicon pollution, and can adjust the release force in a wide range.
In order to solve the technical problems, the invention provides the following technical scheme:
the invention provides an ultra-light/ultra-heavy non-silicon release film, which comprises a substrate layer, an antistatic primer layer coated on the substrate layer, and a non-silicon release coating coated on the antistatic primer layer;
the non-silicon release coating is prepared from the following components in parts by weight: 1000 parts of ester solvent, 50-500 parts of ketone solvent, 0-300 parts of amino modified acrylic resin, 0-300 parts of hydroxyl-containing acrylic resin and 5-50 parts of curing agent, wherein the total amount of the amino modified acrylic resin and the hydroxyl-containing acrylic resin is 300 parts;
the viscosity of the amino modified acrylic resin is 100-300CPS, and the molecular weight is 3-6 ten thousand; the hydroxyl-containing acrylic resin has the viscosity of 200-500CPS and the molecular weight of 4-7 ten thousand.
Further, the material of the substrate layer is PET, BOPP or PE, and the thickness is 25-188 μm.
Further, the ester solvent is selected from one or more of ethyl acetate, butyl acetate and isobutyl acetate. The ketone solvent is selected from one or more of acetone, butanone and methyl isobutyl ketone.
Further, the curing agent is toluene diisocyanate and/or polyphenyl methane polyisocyanate.
Further, the antistatic base coat is prepared from the following components in parts by weight: 100 parts of polythiophene aqueous solution with the concentration of 5-8% and 10 parts of curing agent.
Further, the thickness of the antistatic primer layer is 0.2-2 um.
Further, the ultra-light/ultra-heavy non-silicon release film has the release force range of 5-800g for NITTO 31B adhesive tape and 30-1000g for TESA7475 adhesive tape.
The second aspect of the present invention provides a method for preparing an ultra-light/ultra-heavy non-silicon release film, comprising the following steps:
coating antistatic primer coating liquid on a base material, and baking to form an antistatic primer coating;
preparing coating liquid from 500-1000 parts of ester solvent, 50-500 parts of ketone solvent, 0-300 parts of amino modified acrylic resin, 0-300 parts of hydroxyl-containing acrylic resin and 5-50 parts of curing agent;
coating the coating liquid on the antistatic bottom coating, and baking to form a non-silicon release coating;
and curing the obtained semi-finished product to obtain a non-silicon release film finished product.
Further, the antistatic bottom coating is coated by adopting a mode of micro-gravure coating, extrusion coating or wire roller coating, and the wet coating amount is 6-10g/m2The baking temperature after coating is 80-120 ℃, and the baking time is 10-30 seconds.
Further, the non-silicon release coating is coated by adopting a mode of micro-concave coating, extrusion coating or mesh roller coating, and the wet coating amount is 6-10g/m2The baking temperature after coating is 80-130 ℃, and the baking time is 30-60 seconds.
Compared with the prior art, the invention has the beneficial effects that:
1. the non-silicon release film product does not contain silicon element, and does not produce silicon pollution.
2. In the traditional non-silicon release film, a non-silicon coating is attached to a base material through physical adsorption, the adhesive force is poor, and the coating falling risk is easily generated under the high-temperature and high-humidity environment. In the non-silicon release film, the release coating is attached to the base material in a chemical reaction curing mode, so that the adhesiveness of the release layer is greatly improved, the residual adhesion rate of the product is high, the aging release force is stable, the high temperature and high humidity resistance is realized, and the phenomenon of white fog and the like cannot be generated when the product is attached to a protective film; in addition, the adhesion of the non-silicon release coating is further improved due to the addition of the bottom coating antistatic layer treatment on the base material.
3. According to the non-silicon release film product, due to the fact that multi-component chemical reaction curing is adopted, the required effect of different release forces can be achieved by adding the amino modified acrylic resin and the hydroxyl-containing acrylic resin in different proportions, the range of the release force is wider than that of the traditional single-component and single-release-force non-silicon release film products, and the non-silicon release film product can be well applied to the protection film and die cutting industries.
Drawings
FIG. 1 is a schematic structural diagram of a non-silicon release film according to an embodiment of the present invention;
the reference numbers in the figures illustrate: 1. a substrate layer; 2. an antistatic primer layer; 3. a non-silicon release coating.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The experimental methods used in the following examples are conventional methods unless otherwise specified, and materials, reagents and the like used therein are commercially available without otherwise specified.
The invention provides an ultra-light/ultra-heavy non-silicon release film, which comprises a substrate layer 1, an antistatic primer layer 2 coated on the substrate layer, and a non-silicon release coating 3 coated on the antistatic primer layer 2, as shown in figure 1.
In the present invention, the material of the substrate layer can be selected from substrates commonly used in the art, such as PET, biaxially oriented polypropylene (BOPP), PE. The thickness is preferably 25-188 μm, such as 25um, 36um, 50um, 75um, 100um, 125um, 150um, 188 um.
The antistatic bottom coating is formed by coating antistatic bottom coating liquid on a substrate layer and then baking and curing, and the thickness of the antistatic bottom coating is preferably 0.2-2 um. The antistatic bottom coating not only improves the antistatic effect of the release film, but also increases the adhesive force between the non-silicon release coating and the base material. In the invention, the antistatic primer coating liquid preferably adopts an alcohol wiping resistant polythiophene antistatic agent, and the formula comprises the following components in parts by weight: 100 parts of polythiophene aqueous solution with the concentration of 5-8% and 10 parts of curing agent. The antistatic primer coating formed by coating the antistatic primer coating liquid has good adhesion to base materials such as PET/PE/BOPP and the like.
In the invention, the non-silicon release coating is prepared from the following components in parts by weight: 1000 parts of ester solvent, 50-500 parts of ketone solvent, 0-300 parts of amino modified acrylic resin, 0-300 parts of hydroxyl-containing acrylic resin and 5-50 parts of curing agent, wherein the total amount of the amino modified acrylic resin and the hydroxyl-containing acrylic resin is 300 parts; wherein the viscosity of the amino modified acrylic resin is 100-300CPS, and the molecular weight is 3-6 ten thousand; the hydroxyl-containing acrylic resin has a viscosity of 200-500CPS and a molecular weight of 4-7 ten thousand.
In the invention, through a large number of experiments at the early stage, the inventor finally selects and uses two non-silicon resin raw materials of amino modified acrylic resin with the viscosity of 100-300CPS and the molecular weight of 3-6 ten thousand and hydroxyl-containing acrylic resin with the viscosity of 200-500CPS and the molecular weight of 4-7 ten thousand in a matching way, and can obtain a series of non-silicon release films with different release forces by adjusting the proportion of the two resins in the formula of the release solution. In addition, in the traditional non-silicon release film, the non-silicon coating is adhered to the base material through the physical adsorption effect, the adhesion is poor, and the coating falling risk is easily generated under the high-temperature and high-humidity environment. The release coating disclosed by the invention is attached to the base material in a chemical reaction curing mode, so that the adhesiveness of the release layer is greatly improved, the residual adhesion rate of the product is high, the aging release force is stable, the high temperature and high humidity resistance is realized, and the phenomenon of white fog and the like cannot be caused when the protective film is attached to the product.
The ester solvent is preferably one or more of ethyl acetate, butyl acetate and isobutyl acetate, and the ketone solvent is preferably one or more of acetone, butanone and methyl isobutyl ketone.
In the present invention, the curing agent is preferably an isocyanate-based curing agent, and more preferably toluene diisocyanate and/or polyphenyl methane polyisocyanate.
The non-silicon release film can achieve the release force range of 5-800gf/inch for NITTO 31B adhesive tape, for example, 5, 10, 15, 20, 30, 40, 50, 60, 70, 80, 100, 120, 150, 200, 250, 300, 400, 600, 800gf/inch and other series of non-silicon release film products for attaching protective films, the attaching protective films of the series of release film products can not generate the phenomena of powder falling and fogging, and the non-silicon release film has high temperature and high humidity resistance compared with the traditional non-silicon release film.
The non-silicon release film of the invention can also realize the release force range of 30-1000gf/inch for the TESA7475 adhesive tape, for example, 30, 40, 50, 60, 70, 80, 100, 120, 150, 200, 250, 300, 350, 400, 500, 600, 800, 1000gf/inch and other series of release films for overweight die cutting, and the series of release films have the following characteristics compared with the traditional organosilicon heavy release products: the adhesive has the advantages of no silicon pollution, stable aging release force, high residual adhesion rate, narrow release force fluctuation range and the like, and completely meets the requirements of release films in the die cutting industry.
The invention also provides a preparation method of the ultralight/overweight non-silicon release film, which comprises the following steps:
coating antistatic primer coating liquid on a base material, and baking to form an antistatic primer coating;
preparing coating liquid from 500-1000 parts of ester solvent, 50-500 parts of ketone solvent, 50-300 parts of amino modified acrylic resin, 0-300 parts of hydroxyl-containing acrylic resin and 5-50 parts of curing agent;
coating the coating liquid on the antistatic bottom coating, and baking to form a non-silicon release coating;
and curing the obtained semi-finished product to obtain a non-silicon release film finished product.
In the invention, the antistatic bottom coating is coated by adopting a mode of micro-gravure coating, extrusion coating or wire roller coating, and the wet coating amount is 6-10g/m2The baking temperature after coating is 80-120 ℃, and the baking time is 10-30 seconds. Preferably, the antistatic base coat is applied by dimple coating, and the wet coating amount is 6g/m2The baking temperature is 105 ℃, and the baking time is 20 s.
The non-silicon release coating is coated by adopting a mode of micro-concave coating, extrusion coating or mesh roller coating, and the wet coating amount is 6-10g/m2The baking temperature after coating is 80-130 ℃, and the baking time is 30-60 seconds. Preferably, the non-silicon release coating is coated by a dimple coating, the baking temperature is 120 ℃, and the baking time is 35 s.
The curing treatment can promote the curing of the release coating to be complete, so that the release force of the release film is more stable, and the fluctuation of the release force is reduced. The curing temperature is preferably 35-65 ℃, and the curing time is preferably 1-3 days.
In each of the following examples and comparative examples, the amino group-containing modified acrylic resin used had a viscosity of 100 CPS, a solid content of 25%, a molecular weight of 3 to 6 ten thousand, and a glass transition temperature of about-40 ℃; the viscosity of the acrylic resin containing hydroxyl is 200-500CPS, the solid content is 30 percent, the molecular weight is 4-7 ten thousand, and the glass transition temperature is about-50 ℃; the vinyl polydimethylsiloxane is terminal vinyl polydimethylsiloxane with molecular weight of 50-100 ten thousand and viscosity of about 2 ten thousand CPS; the hydrogen-containing organic silicon resin has a molecular weight of about 20000 and a viscosity of about 300CPS, and the silane coupling agent is 1: 1 mixture, platinum catalyst of the dow 4000 series.
Example 1
The embodiment provides a high temperature and high humidity resistant non-silicon release film, which comprises a substrate layer, an antistatic primer layer and a non-silicon release coating.
The formula of the antistatic base coat comprises:
100 parts of 5% polythiophene aqueous solution
10 portions of melamine curing agent
The components are prepared into antistatic primer coating liquid, and the antistatic primer coating liquid is coated on a 50-micrometer PET substrate in a micro-concave coating mode, wherein the coating moisture content is 6g/m2And baking in an oven after coating, wherein the baking temperature is 105 ℃, and the baking time is 20 seconds, so as to obtain the antistatic base coat.
The formula of the non-silicon release coating comprises the following components:
preparing the components into coating liquid, coating the coating liquid on the antistatic bottom coating in a micro-concave coating mode, wherein the wet coating amount is 10g/m2And baking in an oven after coating, wherein the baking temperature is 120 ℃, the baking time is 35 seconds, and then curing for 2 days to obtain the non-silicon release film.
Example 2
The embodiment provides a high temperature and high humidity resistant non-silicon release film, which comprises a substrate layer, an antistatic primer layer and a non-silicon release coating.
The formula of the antistatic base coat comprises:
100 parts of 5% polythiophene aqueous solution
10 portions of melamine curing agent
The components are prepared into antistatic primer coating liquid, and the antistatic primer coating liquid is coated on a 50-micrometer PET substrate in a micro-concave coating mode, wherein the coating moisture content is 6g/m2And baking in an oven after coating, wherein the baking temperature is 105 ℃, and the baking time is 20 seconds, so as to obtain the antistatic base coat.
The formula of the non-silicon release coating comprises the following components:
preparing the components into coating liquid, coating the coating liquid on the antistatic bottom coating in a micro-concave coating mode, wherein the wet coating amount is 10g/m2And baking in an oven after coating, wherein the baking temperature is 120 ℃, the baking time is 35 seconds, and then curing for 2 days to obtain the non-silicon release film.
Example 3
The embodiment provides a high temperature and high humidity resistant non-silicon release film, which comprises a substrate layer, an antistatic primer layer and a non-silicon release coating.
The formula of the antistatic base coat comprises:
100 parts of 5% polythiophene aqueous solution
10 portions of melamine curing agent
The components are prepared into antistatic primer coating liquid, and the antistatic primer coating liquid is coated on a 50-micrometer PET substrate in a micro-concave coating mode, wherein the coating moisture content is 6g/m2And baking in an oven after coating, wherein the baking temperature is 105 ℃, and the baking time is 20 seconds, so as to obtain the antistatic base coat.
The formula of the non-silicon release coating comprises the following components:
preparing the components into coating liquid, coating the coating liquid on the antistatic bottom coating in a micro-concave coating mode, wherein the wet coating amount is 10g/m2And baking in an oven after coating, wherein the baking temperature is 120 ℃, the baking time is 35 seconds, and then curing for 2 days to obtain the non-silicon release film.
Example 4
The embodiment provides a high temperature and high humidity resistant non-silicon release film, which comprises a substrate layer, an antistatic primer layer and a non-silicon release coating.
The formula of the antistatic base coat comprises:
100 parts of 5% polythiophene aqueous solution
10 portions of melamine curing agent
The components are prepared into antistatic primer coating liquid, and the antistatic primer coating liquid is coated on a 50-micrometer PET substrate in a micro-concave coating mode, wherein the coating moisture content is 6g/m2And baking in an oven after coating, wherein the baking temperature is 105 ℃, and the baking time is 20 seconds, so as to obtain the antistatic base coat.
The formula of the non-silicon release coating comprises the following components:
preparing the components into coating liquid, coating the coating liquid on the antistatic bottom coating in a micro-concave coating mode, wherein the wet coating amount is 10g/m2And baking in an oven after coating, wherein the baking temperature is 120 ℃, the baking time is 35 seconds, and then curing for 2 days to obtain the non-silicon release film.
Example 5
The embodiment provides a high temperature and high humidity resistant non-silicon release film, which comprises a substrate layer, an antistatic primer layer and a non-silicon release coating.
The formula of the antistatic base coat comprises:
100 parts of 5% polythiophene aqueous solution
10 portions of melamine curing agent
The components are prepared into antistatic primer coating liquid, and the antistatic primer coating liquid is coated on a 50-micrometer PET substrate in a micro-concave coating mode, wherein the coating moisture content is 6g/m2And baking in an oven after coating, wherein the baking temperature is 105 ℃, and the baking time is 20 seconds, so as to obtain the antistatic base coat.
The formula of the non-silicon release coating comprises the following components:
preparing the components into coating liquid, coating the coating liquid on the antistatic bottom coating in a micro-concave coating mode, wherein the wet coating amount is 10g/m2Baking in an oven at 120 deg.C for 35s after coating, and aging for 2 days to obtain final productAnd (4) a silicon release film.
Example 6
The embodiment provides a high temperature and high humidity resistant non-silicon release film, which comprises a substrate layer, an antistatic primer layer and a non-silicon release coating.
The formula of the antistatic base coat comprises:
100 parts of 5% polythiophene aqueous solution
10 portions of melamine curing agent
The components are prepared into antistatic primer coating liquid, and the antistatic primer coating liquid is coated on a 50-micrometer PET substrate in a micro-concave coating mode, wherein the coating moisture content is 6g/m2And baking in an oven after coating, wherein the baking temperature is 105 ℃, and the baking time is 20 seconds, so as to obtain the antistatic base coat.
The formula of the non-silicon release coating comprises the following components:
preparing the components into coating liquid, coating the coating liquid on the antistatic bottom coating in a micro-concave coating mode, wherein the wet coating amount is 10g/m2And baking in an oven after coating, wherein the baking temperature is 120 ℃, the baking time is 35 seconds, and then curing for 2 days to obtain the non-silicon release film.
Example 7
The embodiment provides a high temperature and high humidity resistant non-silicon release film, which comprises a substrate layer, an antistatic primer layer and a non-silicon release coating.
The formula of the antistatic base coat comprises:
100 parts of 5% polythiophene aqueous solution
10 portions of melamine curing agent
The components are prepared into antistatic primer coating liquid, and the antistatic primer coating liquid is coated on a 50-micrometer PET substrate in a micro-concave coating mode, wherein the coating moisture content is 6g/m2And baking in an oven after coating, wherein the baking temperature is 105 ℃, and the baking time is 20 seconds, so as to obtain the antistatic base coat.
The formula of the non-silicon release coating comprises the following components:
preparing the components into coating liquid, coating the coating liquid on the antistatic bottom coating in a micro-concave coating mode, wherein the wet coating amount is 10g/m2And baking in an oven after coating, wherein the baking temperature is 120 ℃, the baking time is 35 seconds, and then curing for 2 days to obtain the non-silicon release film.
Comparative example 1
The comparative example provides an organosilicon release film with high temperature and high humidity resistance, which comprises a substrate layer, an antistatic primer layer and an organosilicon release coating.
The formula of the antistatic base coat comprises:
100 parts of 5% polythiophene aqueous solution
10 portions of melamine curing agent
The components are prepared into antistatic primer coating liquid, and the antistatic primer coating liquid is coated on a 50-micrometer PET substrate in a micro-concave coating mode, wherein the coating moisture content is 6g/m2And baking in an oven after coating, wherein the baking temperature is 105 ℃, and the baking time is 20 seconds, so as to obtain the antistatic base coat.
The formula of the organic silicon release coating comprises the following components:
preparing the components into coating liquid, coating the coating liquid on the antistatic bottom coating in a micro-concave coating mode, wherein the wet coating amount is 10g/m2And baking in an oven after coating, wherein the baking temperature is 150 ℃, and the baking time is 30 seconds, so as to obtain the organic silicon release film.
Comparative example 2
The comparative example provides a high temperature and high humidity resistant non-silicon release film, which comprises a substrate layer and a non-silicon release coating.
The formula of the non-silicon release coating comprises the following components:
the components are prepared into coating liquid, and the coating liquid is coated on a 50um PET substrate in a micro-concave coating mode, wherein the wet coating amount is 10g/m2And baking in an oven after coating, wherein the baking temperature is 120 ℃, the baking time is 35 seconds, and then curing for 2 days to obtain the non-silicon release film.
Comparative example 3
The comparative example provides a high temperature and high humidity resistant non-silicon release film, which comprises a substrate layer and a non-silicon release coating.
The formula of the non-silicon release coating comprises the following components:
the components are prepared into coating liquid, and the coating liquid is coated on a 50um PET substrate in a micro-concave coating mode, wherein the wet coating amount is 10g/m2And baking in an oven after coating, wherein the baking temperature is 120 ℃, the baking time is 35 seconds, and then curing for 2 days to obtain the non-silicon release film.
The release films prepared in the above examples and comparative examples were subjected to a performance test, in which the release force was measured by NITTO 31B, the residual adhesion was measured by NITTO 31B, and the above test values are the average values of three tests; 65/953D release force is tested for 3 days by the adhesive tape with 65 ℃ temperature/95% RH humidity, the white fog test of the adhesive protective film is PU protective film product, and the environmental test condition is 65/95 adhesive protective film 20H. The results obtained are shown in the following table.
From the results of examples 1 to 7, it can be seen that the non-silicon release film of the present invention has a wide range of release force, and the release force of 5 to 800gf/inch at room temperature can be achieved by adjusting the ratio of the amino group-containing modified acrylic resin to the hydroxyl group-containing acrylic resin in the formulation. Compared with the comparative example, the non-silicon release film of the embodiment has higher residual adhesion rate, more stable aging release force and no white fog phenomenon.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (10)
1. The ultra-light/ultra-heavy non-silicon release film is characterized by comprising a substrate layer, an antistatic primer layer coated on the substrate layer and a non-silicon release coating coated on the antistatic primer layer;
the non-silicon release coating is prepared from the following components in parts by weight: 1000 parts of ester solvent, 50-500 parts of ketone solvent, 0-300 parts of amino modified acrylic resin, 0-300 parts of hydroxyl-containing acrylic resin and 5-50 parts of curing agent, wherein the total amount of the amino modified acrylic resin and the hydroxyl-containing acrylic resin is 300 parts;
the viscosity of the amino modified acrylic resin is 100-300CPS, and the molecular weight is 3-6 ten thousand; the hydroxyl-containing acrylic resin has the viscosity of 200-500CPS and the molecular weight of 4-7 ten thousand.
2. The ultra-light/extra-heavy non-silicon release film according to claim 1, wherein the material of the substrate layer is PET, BOPP or PE, and the thickness is 25-188 μm.
3. The ultra-light/extra-heavy non-silicon release film according to claim 1, wherein the ester solvent is selected from one or more of ethyl acetate, butyl acetate and isobutyl acetate, and the ketone solvent is selected from one or more of acetone, butanone and methyl isobutyl ketone.
4. The ultra light/extra heavy non-silicon release film according to claim 1, wherein the curing agent is toluene diisocyanate and/or polyphenyl methane polyisocyanate.
5. The ultra-light/ultra-heavy non-silicon release film according to claim 1, wherein the antistatic primer coating is prepared from the following components in parts by weight: 100 parts of polythiophene aqueous solution with the concentration of 5-8% and 10 parts of curing agent.
6. The ultra-light/ultra-heavy non-silicon release film according to claim 1, wherein the thickness of the antistatic primer layer is 0.2-2 um.
7. The ultra light/extra heavy non-silicon release film according to claim 1, wherein the ultra light/extra heavy non-silicon release film has a release force to NITTO 31B tape ranging from 5 to 800gf/inch and a release force to TESA7475 tape ranging from 30 to 1000 gf/inch.
8. The method for preparing an ultra-light/ultra-heavy non-silicon release film according to any one of claims 1 to 7, comprising the steps of:
coating antistatic primer coating liquid on a base material, and baking to form an antistatic primer coating;
preparing coating liquid from 500-1000 parts of ester solvent, 50-500 parts of ketone solvent, 0-300 parts of amino modified acrylic resin, 0-300 parts of hydroxyl-containing acrylic resin and 5-50 parts of curing agent;
coating the coating liquid on the antistatic bottom coating, and baking to form a non-silicon release coating;
and curing the obtained semi-finished product to obtain a finished product of the non-silicon release film.
9. The method for preparing an ultra-light/ultra-heavy non-silicon release film according to claim 8, wherein the method comprisesThe antistatic bottom coating is coated by adopting a mode of micro-gravure coating, extrusion coating or wire roller coating, and the wet coating amount is 6-10g/m2The baking temperature after coating is 80-120 ℃, and the baking time is 10-30 seconds.
10. The method for preparing an ultra-light/ultra-heavy non-silicon release film according to claim 8, wherein the non-silicon release coating is coated by micro-gravure coating, extrusion coating or mesh roller coating, and the wet coating amount is 6-10g/m2The baking temperature after coating is 80-130 ℃, and the baking time is 30-60 seconds.
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| CN116535949A (en) * | 2023-05-23 | 2023-08-04 | 太仓斯迪克新材料科技有限公司 | Quick-drying antistatic coating liquid for bottom coating, antistatic film and preparation method |
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