CN113478107B - Method for cutting electronic additive circuit board by femtosecond laser - Google Patents
Method for cutting electronic additive circuit board by femtosecond laser Download PDFInfo
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- CN113478107B CN113478107B CN202110905241.0A CN202110905241A CN113478107B CN 113478107 B CN113478107 B CN 113478107B CN 202110905241 A CN202110905241 A CN 202110905241A CN 113478107 B CN113478107 B CN 113478107B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a technological method for cutting an electronic additive circuit board by femtosecond laser, which comprises the steps of firstly, placing the electronic additive circuit board on a tool plane, and fixing the circuit board in a non-processing area; then opening an air suction device and an air blowing device, preheating a laser, starting cooling circulating water, and setting laser cutting parameters; drawing a cutting band with the thickness of 0.2-0.6 mm, filling with the density of 0.005-0.02 mm, and carrying out mirror image filling on the newly built layer in the cutting band area compared with the original layer for alternate scanning; setting feeding amount and single-layer scanning time of laser cutting each layer, and executing cutting parameters; shifting the cutting belt inwards by 0.01-0.2 mm along the cutting section, and performing secondary scanning cutting of the cutting surface; and cleaning the electronic circuit board to remove the adhered particulate matters and drying the electronic circuit board. The invention realizes the accurate processing of the cross section of the electronic material-increasing multilayer circuit board, avoids the condition of adhering metal powder on the cross section of a medium substrate and the cross section collapse caused by the traditional milling processing, effectively realizes the cutting of the electronic material-increasing circuit board and ensures the effective insulation between circuit layers.
Description
Technical Field
The invention relates to a processing method of a circuit board, in particular to a method for cutting an electronic additive circuit board by using femtosecond laser.
Background
The electronic additive manufacturing technology belongs to subdivision field technology applied to the field of electronic industry by 3D printing technology, and the principle of the technology is that electronic materials are subjected to graphic deposition according to requirements through processes such as ink jet, electric field, extrusion and the like to form functional circuit patterns. Currently, the usa OPTOMEC company has adopted aerosol spray technology to realize the application of curved conformal antennas, sensors, electromagnetic shielding and the like. The piezoelectric ink-jet composite deposition technology is adopted by the israel Nano Dimension company, and the application of the multilayer circuit board, the sensor, the capacitor and the like is realized. With the development of electronic additive manufacturing technology, the breakthrough of materials, processes and other technologies is advanced, and the future application field is also becoming wider and wider.
In the process of adopting Nano Dimension ink jet composite deposition of a multilayer circuit board, due to the drift and spreadability of ink drops in the printing process, adhesion of the ink drops in the thickness direction is usually formed at the edge position of the printing board containing the circuit layer, so that the upper layer and the lower layer of the inner layer of the circuit board are conducted, and short circuit failure is caused. In addition, after the printing of the multilayer circuit board is completed, the circuit board needs to be cut according to the requirements of special electronic devices, and the traditional cutting mode such as milling, the existing public common laser cutting method and the like cannot realize the processing of the existing Nano Dimension circuit board. The main reason is that: the medium substrate of the printed circuit board is brittle, the inner layer circuit and the medium substrate are easy to lead to the phenomenon of cracking in the milling process, the cutting surface is incomplete, and in addition, the common laser is a heat removal process, so that the phenomena of board explosion and layering are easy to occur in the cutting process.
Disclosure of Invention
Aiming at the problems existing in the existing multi-layer circuit board cutting process adopting electronic additive manufacturing, the invention aims to provide a method for cutting the electronic additive multi-layer circuit board by femtosecond laser, which can be applied to cutting, punching and other processing of the electronic additive circuit board, can ensure that the processing section is complete and continuous, interlayer dielectric insulation is reliable, and has the advantages of simplicity, easiness in operation and higher processing precision and efficiency.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
a method for cutting an electronic additive circuit board by femtosecond laser comprises the following steps:
step 1: placing the electronic material-adding circuit board on a tool plane, wherein the cutting area is in a suspended state, and fixing the circuit board in a non-processing area in a mode such as a magnet; the surface of the placing tool is ensured to be as smooth as possible, and the straightness of the cut section is mainly ensured, otherwise, the section and the plane of the circuit board are possibly not vertical, so that the subsequent installation and matching cannot be realized.
Step 2: adjusting proper air pressure, opening the air suction device and the air blowing device, and aligning the air suction device and the air blowing device to the processing area as vertically as possible; wherein the air suction device is arranged in a slag discharge area as far as possible, so that gasified waste slag is effectively sucked; the air blowing port should be aligned vertically to the cutting area as much as possible.
Step 3: preheating a femtosecond laser, starting cooling circulating water, and setting laser cutting parameters, wherein the laser cutting parameters comprise scanning frequency, scanning speed, laser power and the like.
Step 4: drawing a cutting belt with the thickness of 0.2-0.6 mm, filling with the density of 0.005-0.02 mm, newly creating another layer, carrying out mirror image filling in the cutting belt area in comparison with the original layer, and carrying out alternate scanning according to the two layers; the main purpose is that the gasified slag is easy to be discharged from the kerf along with the increase of the cutting depth, otherwise, gasified particles are easy to adhere to the side wall under the action of laser after being piled up, and heat is piled up, and the risk of layering is brought after the gasified particles are transferred to a circuit layer; the alternate scanning of the mirror image filling pattern is adopted, and the main purpose is to change the path of laser scanning and reduce the butt seam trace caused by the starting point and the ending point. The scanning method may be changed by providing a plurality of layers, and is not limited to the two layers described.
Step 5: setting feeding amount of laser cutting each layer and single-layer scanning time, focusing the laser and then executing a cutting process; the laser spot is 30-50 mu m, in order to ensure that each layer is at the focus of the laser, the single-layer time is set to effectively ensure that each layer is completely removed, and the next layer is removed by setting the feeding amount.
Step 6: shifting the cutting belt inwards by 0.01-0.2 mm along the cutting section, and performing secondary scanning cutting of the cutting surface; the purpose is mainly to further clean the cut section to remove adhered metal particles, and the section is in an open state after the first cutting is easier to discharge slag. The specific offset is required to cover the taper range of the first cut according to the plate thickness.
Step 7: the cut electronic circuit board is preferably subjected to section cleaning by ultrasonic waves, and the section can be cleaned by dipping a non-woven cotton swab in alcohol.
Further, in step 1, the frock is preferably ferromagnetic metal material and is convenient for magnet absorption fixed, and the plane degree of placing the face is less than 0.05, and roughness Ra is less than 1.6, and is the fretwork form in the cutting region, and the gas circulation can be guaranteed to the bottom, can effectively guarantee the waste residue discharge in the cutting process. The circuit board is a multilayer circuit board manufactured by adopting electronic additive materials, and can be also applied to similar resin substrate multilayer circuit boards in a derivative way, and the thickness of the circuit board is not more than 3mm.
Further, in the step 1, the magnet is used for fixing, and a flexible substrate such as non-woven fabric, paper or other plastics is padded at the bottom of the magnet to prevent the surface of the circuit board from being scratched; the mechanical clamping tool mode can be adopted, but the controllable stress in the clamping process is ensured.
Furthermore, the air blowing device in the step 2 should be aligned to the cutting area as much as possible under the condition of not interfering the laser path, and perpendicular to the circuit board surface, the air blowing pressure should be above 0.2Mpa, and meanwhile, the air pressure cannot be too large, so that the circuit board is ensured to be stable, and the circuit board is prevented from loosening in the cutting process due to the too large air flow.
Further, in the step 3, the preferred wavelength of the femto-second laser is 1064nm, the cutting power is 12-20W, and the scanning speed is: 400-1000 mm/min, the scanning frequency is: 100KHz.
Further, in step 5, the feeding amount is preferably set to 0.005-0.03 mm, and the single-layer scanning time is 200-500 ms.
Advantageous effects
Compared with the background technology, the invention has the following beneficial effects:
1) The method for cutting the additive circuit board by the femtosecond laser can effectively avoid the defects of delamination of the board, board explosion and difficult effective removal of metal objects with sections caused by conventional laser cutting, and has the characteristic of high processing efficiency.
2) The femtosecond laser cutting mode can also be used for punching processing of the additive circuit board.
3) The femtosecond laser cutting additive manufacturing circuit board can be also applied to cutting of other types of circuit boards of metal resin composite types and trimming of high-precision circuits.
The femtosecond laser cutting mode can further improve the precision of electronic devices and further promote the feasibility of printing electronic products for industrial application.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a flow chart of a method for cutting an electronic additive circuit board by femtosecond laser according to the invention
FIG. 2 shows the effect of amplification after punching a multilayer circuit board using a femtosecond laser
FIG. 3 is a cross-sectional effect of cutting a multilayer circuit board using a femtosecond laser
Detailed Description
In order to further illustrate the practice of the invention, the invention is further described below with reference to the drawings and examples. Fig. 1 is a flowchart of a method for cutting a multilayer circuit board by a femtosecond laser according to the present invention, and a cutting process of the circuit board and a similar metal resin composite multilayer board can be performed with reference to the flowchart. Fig. 2 shows the punching effect of the femtosecond laser cutting on the electronic additive circuit board, and the section of the electronic additive circuit board is clear, and the section of the dielectric layer between the metal layers is free of adhesive redundant metal particles. Fig. 3 is a cross section of a multi-layer circuit board cut by femtosecond laser, and the metal layer and the dielectric layer of the same cross section are clear, and the dielectric layer has no adhesion sundry phenomenon. The specific implementation procedure is shown in the following embodiment.
Examples:
the circuit board adopted in the embodiment is a multilayer circuit board printed by Dragonfly2020Pro type equipment of Nano Dimension company, and the thickness of the circuit board is as follows: 2.8mm. The femtosecond laser cutting equipment is five-axis ultrafast laser processing equipment of micro-fine photon manufacturing technology limited company in western security. Specific laser cutting parameters are: wavelength: 1064nm, cutting power: 13w, scanning frequency: 100KHz, single-layer feeding amount is: 0.008mm, single layer scan time 280ms, dicing tape width: 0.3mm, packing density: 0.008, the blowing pressure is: 0.23Mpa, the inspiration pressure is: -0.01Mpa. Punching and cutting of the multilayer circuit board are respectively performed, and a specific cutting process is performed according to fig. 1:
step 1: the electronic material-increasing circuit board is placed on a ferromagnetic metal tool plane, the flatness of a placement surface is less than 0.05, the roughness Ra is less than 1.6, the cutting area is hollow, the cutting area is in a suspended state, the circuit board is fixed in a non-processing area by adopting a magnet mode, and flexible substrates such as non-woven fabrics, paper or other plastics are padded at the bottom of the magnet to prevent the surface of the circuit board from being scratched.
Step 2: adjusting proper air pressure, opening the air suction device and the air blowing device, and aligning the air suction device and the air blowing device to the processing area as vertically as possible; wherein the air suction device is arranged in a slag discharge area as far as possible, so that gasified waste slag is effectively sucked; the air blowing port should be aligned vertically to the cutting area as much as possible.
The air blowing device is aligned to the cutting area as much as possible under the condition of not interfering the laser light path, is perpendicular to the circuit board surface, and has air blowing pressure of more than 0.2Mpa, meanwhile, the air blowing device cannot be excessively large, the circuit board is ensured to be stable, and the circuit board is prevented from loosening in the cutting process due to excessively large air flow. As described above, the blowing pressure in this example was 0.23MPa, and the suction pressure was-0.01 MPa.
Step 3: preheating a femtosecond laser, starting cooling circulating water, and setting laser cutting parameters, wherein the laser cutting parameters comprise scanning frequency, scanning speed, laser power and the like. As described above, in this embodiment, specific laser cutting parameters are: wavelength: 1064nm, cutting power: 13w, scanning frequency: 100KHz.
Step 4: drawing a cutting belt with the thickness of 0.2-0.6 mm, filling with the density of 0.005-0.02 mm, newly creating another layer, mirror-image filling the original layer in the cutting belt area, and alternately scanning according to the two layers; in this embodiment, the dicing tape width: 0.3mm, packing density: 0.008.
step 5: setting feeding amount of laser cutting each layer and single-layer scanning time, focusing the laser and then executing a cutting process; the single-layer feeding amount in this embodiment is: 0.008mm, single layer scan time 280ms.
Step 6: shifting the cutting belt inwards by 0.01-0.2 mm along the cutting section, and performing secondary scanning cutting of the cutting surface; the cut section is shown in particular in figures 2 and 3. Fig. 2 shows the punching effect of the femtosecond laser cutting on the electronic additive circuit board, and the section of the electronic additive circuit board is clear, and the section of the dielectric layer between the metal layers is free of adhesive redundant metal particles. Fig. 3 is a cross section of a multi-layer circuit board cut by femtosecond laser, and the metal layer and the dielectric layer of the same cross section are clear, and the dielectric layer has no adhesion sundry phenomenon.
According to the invention, the cold removal effect of the femtosecond laser is utilized, the accurate processing of the cross section of the electronic material-increasing multilayer circuit board can be realized, the conditions of adhesion of metal powder on the cross section of a medium substrate, cross section collapse caused by traditional milling processing and the like are effectively avoided, the cutting of the electronic material-increasing circuit board is effectively realized, and the effective insulation between circuit layers is effectively ensured.
Although embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives, and variations may be made in the above embodiments by those skilled in the art without departing from the spirit and principles of the invention.
Claims (6)
1. A method for cutting an electronic additive circuit board by femtosecond laser is characterized in that: the method comprises the following steps:
step 1: placing the electronic material-adding circuit board on a tool plane, wherein the cutting area is in a suspended state, and fixing the circuit board in a non-processing area; the circuit board is a multilayer circuit board manufactured by adopting electronic additive materials, and the thickness is not more than 3mm;
step 2: adjusting proper air pressure, opening the air suction device and the air blowing device, and aligning the air suction device and the air blowing device to the processing area as vertically as possible;
step 3: preheating a femtosecond laser, starting cooling circulating water, and setting laser cutting parameters including scanning frequency, scanning speed and laser power;
step 4: drawing a cutting band with the thickness of 0.2-0.6 mm, filling the cutting band with the density of 0.005-0.02 mm, newly creating a plurality of layers, carrying out mirror image filling on the cutting band area compared with the original layer, and carrying out alternate scanning according to the plurality of layers; with the increase of the cutting depth, the gasified slag is discharged from the cutting joint, so that the risk of layering caused by heat accumulation caused by adhesion of gasified particles on the side wall after accumulation is avoided; by adopting alternate scanning of mirror image filling patterns, the path of laser scanning is changed, and the butt seam marks caused by the starting point and the ending point are reduced;
step 5: setting feeding amount of laser cutting each layer and single-layer scanning time, focusing the laser and then executing a cutting process;
step 6: shifting the cutting belt inwards by 0.01-0.2 mm along the cutting section, and performing secondary scanning cutting on the cutting surface;
step 7: and cleaning the cross section of the cut electronic circuit board to remove adhered particles, and drying.
2. The method for cutting the electronic additive circuit board by the femtosecond laser according to claim 1, wherein the method comprises the following steps: in the step 1, the tool is made of ferromagnetic metal, the flatness of the placing surface is less than 0.05, the roughness Ra is less than 1.6, and the cutting area is hollow.
3. The method for cutting the electronic additive circuit board by the femtosecond laser according to claim 2, wherein the method comprises the following steps: in the step 1, a magnet is adopted to fix the circuit board in the non-processing area, and a flexible substrate is padded at the bottom of the magnet to prevent the surface of the circuit board from being scratched.
4. The method for cutting the electronic additive circuit board by the femtosecond laser according to claim 2, wherein the method comprises the following steps: and 2, the blowing device is used for blowing air with the pressure of more than 0.2Mpa, ensuring the stability of the circuit board and preventing the loosening of the circuit board in the cutting process caused by overlarge air flow.
5. The method for cutting the electronic additive circuit board by the femtosecond laser according to claim 1, wherein the method comprises the following steps: in the step 3, the preferred wavelength of the femtosecond laser is 1064nm, the cutting power is 12-20W, and the scanning speed is high: 400-1000 mm/min, and the scanning frequency is: 100KHz.
6. The method for cutting the electronic additive circuit board by the femtosecond laser according to claim 1, wherein the method comprises the following steps: in the step 5, the feeding amount is 0.005-0.03 mm, and the single-layer scanning time is 200-500 ms.
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| CN101402158B (en) * | 2008-11-05 | 2012-03-14 | 深圳市大族激光科技股份有限公司 | Laser cutting method for PCB plate |
| CN104439714A (en) * | 2014-11-13 | 2015-03-25 | 南京中科神光科技有限公司 | Method for filling and cutting materials through ultrashort pulse lasers |
| US11064611B2 (en) * | 2018-06-29 | 2021-07-13 | Ipg Photonics Corporation | Patterning and removal of circuit board material using ultrafast lasers |
| CN109511225B (en) * | 2018-09-25 | 2021-01-08 | 通元科技(惠州)有限公司 | Semi-metallized hole circuit board processing method |
| CN111151892B (en) * | 2018-11-08 | 2022-05-20 | 中国科学院西安光学精密机械研究所 | Non-taper laser cutting method |
| CN110625271A (en) * | 2019-06-25 | 2019-12-31 | 苏州德龙激光股份有限公司 | Ultrafast laser PCB drilling equipment and method thereof |
| CN110385521B (en) * | 2019-08-29 | 2021-03-16 | 西安交通大学 | Femtosecond laser processing device and method for silicon carbide rapid deep etching |
| CN112775553A (en) * | 2019-11-08 | 2021-05-11 | 深圳市捷智造科技有限公司 | Laser processing device for regulating and controlling glass haze and processing method thereof |
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