CN113471175A - Conformal shielding structure and preparation method thereof - Google Patents
Conformal shielding structure and preparation method thereof Download PDFInfo
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- CN113471175A CN113471175A CN202110733174.9A CN202110733174A CN113471175A CN 113471175 A CN113471175 A CN 113471175A CN 202110733174 A CN202110733174 A CN 202110733174A CN 113471175 A CN113471175 A CN 113471175A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
Abstract
The invention discloses a conformal shielding structure and a preparation method thereof, wherein the preparation method comprises the following steps: providing a substrate, mounting a chip on the substrate, and plastically packaging the substrate to form a plastic packaging layer for coating the chip; forming a groove unit on the plastic packaging layer along the laminating direction of the plastic packaging layer and the substrate; filling conductive adhesive into the groove unit, coating the conductive adhesive along one side of the plastic packaging layer, which is far away from the substrate, and curing the conductive adhesive to form a conformal shielding layer; and cutting the substrate to form a plurality of independent conformal shielding structures. The invention avoids forming a conformal shielding layer by magnetron sputtering, and a magnetron sputtering main line body and an auxiliary line body are not required to be purchased, thereby reducing the cost; and if the packaging structure needs the cavity-separating shielding, the process can be completed synchronously with the conformal shielding, thereby simplifying the process flow.
Description
Technical Field
The invention relates to the field of semiconductor packaging, in particular to a conformal shielding structure and a preparation method thereof.
Background
Electromagnetic waves play an increasingly important role in human society, but increasingly prominent electromagnetic radiation and electromagnetic interference in the semiconductor industry have a great negative impact on manufacturing and can seriously interfere with the stable operation of precision instruments and equipment. Generally, electromagnetic shielding measures are taken to reduce interference and radiation of electromagnetic waves to a protected object as much as possible, the electromagnetic shielding is a measure for preventing a high-frequency electromagnetic field from being transmitted in space by using a shielding body, and the shielding body can avoid the problem of system performance deterioration caused by electromagnetic noise or interference generated in the same system or different systems. Conformal shielding is mainly used for packaging SIP (System In a Package, System and Package) modules such as WiFi and Memory, and is used for isolating interference between a packaged internal circuit and an external System.
Disclosure of Invention
The invention mainly aims to provide a conformal shielding structure and a preparation method thereof, aiming at solving the problem of high preparation cost of the conventional conformal shielding structure.
In order to achieve the above object, the present invention provides a method for preparing a conformal shielding structure, comprising the following steps:
providing a substrate, mounting a chip on the substrate, and plastically packaging the substrate to form a plastic packaging layer for coating the chip;
forming a groove unit on the plastic packaging layer along the laminating direction of the plastic packaging layer and the substrate;
filling conductive adhesive into the groove unit, coating the conductive adhesive along one side of the plastic packaging layer, which is far away from the substrate, and curing the conductive adhesive to form a conformal shielding layer;
and cutting the substrate to form a plurality of independent conformal shielding structures.
Preferably, the step of forming a groove unit on the plastic package layer along a stacking direction of the plastic package layer and the substrate includes:
and respectively forming a first groove and a second groove along two sides of a cutting path for cutting the substrate to form the groove unit.
Preferably, the step of forming a groove unit on the plastic package layer along a stacking direction of the plastic package layer and the substrate includes:
and arranging the groove units on the plastic packaging layer in a laser or mechanical cutting mode along the laminating direction of the plastic packaging layer and the substrate.
Preferably, the number of the groove units is multiple, and the groove units are arranged at intervals along a direction perpendicular to the lamination direction of the plastic package layer and the substrate.
Preferably, the step of filling the groove unit with a conductive adhesive and coating the conductive adhesive along a side of the molding compound layer facing away from the substrate includes:
and filling the conductive adhesive into the groove unit by adopting a screen printing plate through screen printing, and coating the conductive adhesive on one side of the plastic packaging layer, which is far away from the substrate, by adopting the screen printing plate through screen printing.
Preferably, the screen printing plate is a stainless steel screen printing plate or an aluminum sheet screen printing plate.
Preferably, the step of curing the conductive paste to form a conformal shielding layer includes:
and baking the conductive adhesive at the temperature of 120-140 ℃ for 30-60 min to solidify and form the conformal shielding layer.
Preferably, the material of the conductive paste includes a matrix resin and a conductive filler.
Preferably, the step of mounting a chip on the substrate includes:
in addition, the invention also provides a conformal shielding structure which is prepared by the preparation method, and the conformal shielding structure comprises a substrate, a plastic packaging layer and a conformal shielding layer, wherein the plastic packaging layer is arranged on one side of the substrate, and the conformal shielding layer is arranged on the plastic packaging layer.
Preferably, the plastic-sealed layer includes relative first side and the second side that sets up, conformal shielding layer include first shielding layer and two with the second shielding layer that first shielding layer is connected, first shielding layer sets up the plastic-sealed layer deviates from one side of base plate, two the second shielding layer inlays to be established in the plastic-sealed layer and be close to respectively first side with the second side sets up.
In the technical scheme of the invention, firstly, a chip is installed on a substrate, the substrate is subjected to plastic package to form a plastic package layer for coating the chip, and a groove unit is arranged on the plastic package layer along the laminating direction of the plastic package layer and the substrate; filling conductive adhesive into the groove unit, and coating the conductive adhesive along one side of the plastic packaging layer, which is far away from the substrate; curing the conductive adhesive to form a conformal shielding layer; the substrate is cut to form a plurality of independent conformal shielding structures, so that a conformal shielding layer is prevented from being formed by magnetron sputtering, a magnetron sputtering main line body and an auxiliary line body are not required to be purchased, and the cost is reduced; and if the packaging structure needs the cavity-separating shielding, the process can be completed synchronously with the conformal shielding, thereby simplifying the process flow.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic flow chart of a method for manufacturing a conformal shielding structure according to a first embodiment of the present invention;
FIG. 2 is a schematic flow chart illustrating a method for fabricating a conformal shielding structure according to a second embodiment of the present invention;
FIG. 3 is a schematic flow chart illustrating a method for fabricating a conformal shielding structure according to a third embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a substrate and a molding layer according to an embodiment of the invention;
fig. 5 is a schematic view illustrating a groove unit formed on a plastic package layer according to an embodiment of the invention;
fig. 6 is a schematic view illustrating a trench unit filled with a conductive paste according to an embodiment of the invention;
FIG. 7 is a cut-away view of a conformal shielding structure according to an embodiment of the invention;
fig. 8 is a schematic diagram of a conformal shielding structure according to an embodiment of the invention.
The reference numbers illustrate:
| 1 | |
2 | |
| 3 | |
31 | |
| 32 | |
4 | Conductive adhesive |
| 5 | |
6 | |
| 70 | |
71 | |
| 72 | Second shielding layer | 21 | |
| 22 | Second side |
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a packaging method of a conformal shielding structure.
Referring to fig. 1, a flow chart of a first embodiment of a packaging method of a conformal shielding structure of the present invention is shown, the method includes the following steps:
s10, as shown in fig. 4, providing a substrate 1, mounting a chip on the substrate 1, and performing plastic package on the substrate 1 to form a plastic package layer 2 covering the chip;
the substrate 1 can also be provided with components, and the plastic sealing layer 2 is used for protecting chips or components so as to prevent the electric performance from being reduced due to the corrosion of impurities in the air to a circuit.
S20, as shown in fig. 5, forming a groove unit 3 in the molding layer 2 along the laminating direction of the molding layer 2 and the substrate 1;
the lamination direction of the plastic package layer 2 and the substrate 1 is the direction of the substrate 1 towards the plastic package layer 2, if cavity separation shielding is needed, grooves for cavity separation shielding can be simultaneously formed, conformal shielding and cavity separation shielding are simultaneously carried out, and the process is simplified.
S30, as shown in fig. 6, filling the trench unit 3 with a conductive adhesive 4, and coating the conductive adhesive 4 along a side of the molding compound layer 2 facing away from the substrate 1, and curing the conductive adhesive 4 to form a conformal shielding layer 70;
the groove units 3 are filled with the conductive adhesive 4, the surface of the molding layer 2 is also coated with the conductive adhesive 4, and the conformal shielding layer 70 can prevent electromagnetic interference between chips.
S40, as shown in fig. 7, the substrate 1 is cut to form a plurality of independent conformal shielding structures.
As shown in fig. 8, after the substrate 1 is cut, the conductive paste 4 is coated on the sidewalls and the top wall of each conformal shielding structure 6, so as to achieve conformal shielding. The substrate 1 can be plastically packaged to form the plastic packaging layer 2 by firstly installing a plurality of same circuit structures or installing a plurality of different circuit structures on the substrate 1, and the plastic packaging layer 2 is cut to obtain the groove units 3 and finally cut into a plurality of independent conformal shielding structures 6, so that the production efficiency is improved.
If the conformal shielding is performed by magnetron sputtering, the price of the sputtering machine and the auxiliary equipment is expensive, and the overflow problem exists in the production of BGA (Ball Grid Array) products. Magnetron sputtering apparatus structures typically occupy a large area, are individually assembled, are inefficient, have complex assembly processes, and may cause damage to internal chips. The magnetron sputtering device does not need to purchase a magnetron sputtering main line body and an auxiliary line body, can greatly save cost, simultaneously avoids the problem of BGA (ball grid array) over-plating of a produced product, has simple process and improves efficiency.
Further, referring to fig. 2, which is a flowchart illustrating a second embodiment of the packaging method of the conformal shielding structure according to the present invention, based on the first embodiment, the step S20 includes:
s21, as shown in fig. 5, a first groove 31 and a second groove 32 are respectively opened along both sides of a scribe line 5 for cutting the substrate 1 to form the groove unit 3.
That is, the trench unit 3 includes the first trench 31 and the second trench 32 arranged in parallel at an interval, and when the substrate 1 is subsequently cut, the substrate is cut along the scribe line 5 to form the plurality of independent conformal shielding structures 6, so when the first trench 31 and the second trench 32 are formed, the scribe line 5 of the substrate 1 needs to be determined first, the first trench 31 and the second trench 32 are formed on two sides of the scribe line 5, and then the first trench 31 and the second trench 32 are filled with the conductive adhesive 4, respectively, and widths of the first trench 31 and the second trench 32 can be set according to specific process requirements, which is not specifically limited herein. Because the first trench 31 and the second trench 32 are filled with the conductive adhesive 4, and one side of the molding compound layer 2 away from the substrate 1 is coated with the conductive adhesive 4, after the substrate 1 is cut along the cutting street 5, the conductive adhesive 4 in the first trench 31/the second trench 32 is located on the side surface of the conformal shielding structure 6, and the top surface of the conformal shielding structure 6 is also coated with the conductive adhesive 4, so that electromagnetic interference can be prevented. And only need follow cutting street 5 and cut plastic-sealed layer 2 and base plate 1 in proper order, need not to cut conducting resin 4, can not destroy conformal shielding layer 70 for electromagnetic shield effect is better.
Based on the first embodiment, step S20 of the packaging method of the conformal shielding structure of the present invention includes: and arranging the groove units 3 on the plastic package layer 2 in a laser or mechanical cutting mode along the laminating direction of the plastic package layer 2 and the substrate 1.
Mechanical cutting may be performed using the blade of a cutting tool. Laser processing, also known as laser processing, is a process of irradiating a material surface with a high-energy-density light beam to vaporize the material or change the color of the material. The laser cutting can obtain high-density energy by focusing through holes, and can instantly melt and even evaporate solid materials. The laser beam has four characteristics of high brightness, high directivity, high monochromaticity and high coherence, and has no mechanical deformation because of non-contact processing and no direct impact on materials, no cutter abrasion and no cutting force act on the materials in the laser processing process. The mechanical cutting can adopt a blade to directly cut, the equipment is simple, and the cost can be reduced.
The number of the groove units 3 is multiple, and the groove units 3 are arranged at intervals along a direction perpendicular to the laminating direction of the plastic package layer 2 and the substrate 1. The plastic package layer 2 and the substrate 1 are defined to be laminated along a first direction, and the plurality of groove units 3 are respectively arranged at intervals along a second direction, so that the first direction and the second direction are perpendicular to each other. The cutting channels 5 of the substrate 1 are multiple, and at least three conformal shielding structures 6 can be cut along the multiple cutting to the cutting plastic-sealed layer 2 and the substrate 1, so that the production efficiency is further improved.
Referring to fig. 3, which is a flowchart illustrating a third embodiment of the packaging method of the conformal shielding structure according to the present invention, based on the first embodiment, the step S30 "of filling the trench unit 3 with the conductive paste 4, and the step of coating the conductive paste 4" along the side of the molding layer 2 away from the substrate 1 includes:
and S31, filling the conductive adhesive 4 into the groove unit 3 by screen printing through a screen printing plate, and coating the conductive adhesive 4 on one side of the plastic packaging layer 2, which is far away from the substrate 1, by screen printing through the screen printing plate.
The silk screen printing refers to that a silk screen is used as a plate base, and a silk screen printing plate with pictures and texts is manufactured by a photosensitive plate making method. The screen printing is composed of five major elements, namely a screen printing plate, a scraper, ink, a printing table and a printing stock. The basic principle that the meshes of the image-text part and the non-image-text part of the screen printing plate are permeable to ink and impermeable to ink is utilized to print. When printing, ink is poured into one end of the screen printing plate, a scraper plate is used for applying a certain pressure to the ink position on the screen printing plate, meanwhile, the scraper plate moves towards the other end of the screen printing plate at a constant speed, and the ink is extruded onto a printing stock from meshes of the image-text part by the scraper plate in the moving process. In the semiconductor field, generally adopt screen printing to print the tin cream on base plate 1, this embodiment replaces the tin cream with conducting resin 4, adopts the conformal shielding layer 70 of screen printing mode preparation, avoids using the magnetron sputtering equipment that the price is expensive, and the cost is reduced, and can not produce BGA and spill over the problem of plating, and simple process has improved production efficiency. The screen printing plate is preferably a stainless steel screen printing plate or an aluminum sheet screen printing plate, and the conductive adhesive 4 can be more uniformly filled into the first grooves 31 and the second grooves 32 and can also be more uniformly coated on the side of the plastic packaging layer 2 departing from the substrate 1.
The step S30 "curing the conductive paste 4 to form the conformal shielding layer 70" includes: and baking the conductive adhesive 4 at the temperature of 120-140 ℃ for 30-60 min to solidify and form the conformal shielding layer, wherein the preparation process is simple and the efficiency is high.
Wherein, the material of the conductive adhesive 4 comprises matrix resin and conductive filler. The conductive adhesive 4 is an adhesive which has certain conductivity after being cured or dried, and can connect a plurality of conductive materials together, so that an electric path is formed between the connected materials. The contact between the conductive particles forms a conductive path to make the conductive paste 4 conductive, and the stable contact between the particles in the paste layer is caused by the curing or drying of the conductive paste 4. Before the conductive adhesive 4 is cured or dried, the conductive particles are separated in the adhesive and are not in continuous contact with each other, so that the conductive particles are in an insulating state. After the conductive paste 4 is cured or dried, the volume of the paste is shrunk by the volatilization of the solvent and the curing of the paste, and the conductive particles are stably continuous with each other, thereby exhibiting conductivity. The conductive adhesive 4 mainly comprises a resin matrix, conductive particles, a dispersing additive, an auxiliary agent and the like, wherein the matrix mainly comprises epoxy resin, acrylate resin, polyvinyl chloride and the like, and the conductive filler can be gold, silver, copper, aluminum, zinc, iron and nickel powder, graphite and some conductive compounds.
Based on the first embodiment, the step of "mounting a chip on the substrate 1" in step S10 of the fourth embodiment of the packaging method of the conformal shielding structure of the present invention includes: and fixing the chip on the substrate 1, and welding and bonding the bonding area on the substrate 1 and the chip by adopting a metal wire.
The metal wire welding bonding is welding gold wire, and the bare chip and the bonding area on the substrate 1 are bonded together through the gold wire by adopting high-precision bonding equipment. Firstly, cleaning the substrate 1 by using a plasma cleaning machine to remove surface pollutants, exposing more surface areas, roughening the surface of the substrate 1, enhancing the bonding force between a gold wire and a gold finger of the substrate 1, and then welding by using a high-speed full-automatic lead welding machine with the welding precision of +/-2 microns. The plasma is a state of a substance, which is also called a fourth state of a substance, and is not a common solid-liquid-gas three-state, and it is a plasma state by applying sufficient energy to a gas to ionize the gas. The "active" components of the plasma include: ions, electrons, atoms, active groups, excited nuclides, photons and the like, and the plasma cleaning machine is used for treating the surface of a sample by utilizing the properties of the active components so as to achieve the purposes of cleaning, coating and the like.
Further, the step of fixing the chip on the substrate 1 includes: dispensing glue on the substrate 1, bonding the chip at the dispensing position, and curing and baking. Specifically, a die bonder is used for bonding a die to the substrate 1, and the specific process comprises dispensing, bonding, curing and baking.
In addition, the invention also provides a conformal shielding structure which is prepared by the preparation method, the conformal shielding structure comprises a substrate 1, a plastic packaging layer 2 and a conformal shielding layer 70, the plastic packaging layer 2 is arranged on one side of the substrate 1, and the conformal shielding layer 70 is arranged on the plastic packaging layer 2. Since the conformal shielding structure adopts all technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and no further description is given here.
As shown in fig. 8, the molding compound layer 2 includes a first side 21 and a second side 22 which are oppositely disposed, the conformal shielding layer 70 includes a first shielding layer 71 and two second shielding layers 72 connected to the first shielding layer 71, the first shielding layer 71 is disposed on one side of the molding compound layer 2 which is away from the substrate 1, and the two second shielding layers 72 are embedded in the molding compound layer 2 and are respectively close to the first side 21 and the second side 22. Since the cutting track is located between the first trench 31 and the second trench 32 when the molding layer 2 is cut, the conformal shielding layer 70 of the independent conformal shielding structure after cutting includes the first shielding layer 71 on the top and the second shielding layer 72 on the side, and the second shielding layer 72 is embedded in the molding layer 2, but the two second shielding layers 72 are respectively close to the first side 21 and the second side 72 of the molding layer 2, so that conformal shielding is realized, and the cutting of the second shielding layer 72 is avoided, so that the conformal shielding layer 70 is more complete.
The above is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by the present specification or directly/indirectly applied to other related technical fields under the spirit of the present invention are included in the scope of the present invention.
Claims (10)
1. A preparation method of a conformal shielding structure is characterized by comprising the following preparation methods:
providing a substrate, mounting a chip on the substrate, and plastically packaging the substrate to form a plastic packaging layer for coating the chip;
forming a groove unit on the plastic packaging layer along the laminating direction of the plastic packaging layer and the substrate;
filling conductive adhesive into the groove unit, coating the conductive adhesive along one side of the plastic packaging layer, which is far away from the substrate, and curing the conductive adhesive to form a conformal shielding layer;
and cutting the substrate to form a plurality of independent conformal shielding structures.
2. The method for manufacturing the conformal shielding structure according to claim 1, wherein the step of forming the trench unit in the molding layer along the stacking direction of the molding layer and the substrate includes:
and respectively forming a first groove and a second groove along two sides of a cutting path for cutting the substrate to form the groove unit.
3. The method for manufacturing the conformal shielding structure according to claim 1, wherein the step of forming the trench unit in the molding layer along the stacking direction of the molding layer and the substrate includes:
and arranging the groove units on the plastic packaging layer in a laser or mechanical cutting mode along the laminating direction of the plastic packaging layer and the substrate.
4. The method for manufacturing the conformal shielding structure of claim 1, wherein the number of the trench units is plural, and the plural trench units are arranged at intervals along a direction perpendicular to a lamination direction of the molding compound layer and the substrate.
5. The method for manufacturing a conformal shielding structure according to claim 1, wherein the step of filling the trench unit with a conductive paste and coating the conductive paste along a side of the molding compound layer facing away from the substrate comprises:
and filling the conductive adhesive into the groove unit by adopting a screen printing plate through screen printing, and coating the conductive adhesive on one side of the plastic packaging layer, which is far away from the substrate, by adopting the screen printing plate through screen printing.
6. The method of claim 5, wherein the screen is a stainless steel screen or an aluminum sheet screen.
7. The method for preparing the conformal shielding structure according to any one of claims 1 to 6, wherein the step of curing the conductive adhesive to form the conformal shielding layer comprises:
and baking the conductive adhesive at the temperature of 120-140 ℃ for 30-60 min to solidify and form the conformal shielding layer.
8. The method for preparing the conformal shielding structure according to any one of claims 1 to 6, wherein the material of the conductive paste comprises a matrix resin and a conductive filler.
9. A conformal shielding structure prepared by the method according to any one of claims 1 to 9, wherein the conformal shielding structure comprises a substrate, a molding layer and a conformal shielding layer, the molding layer is disposed on one side of the substrate, and the conformal shielding layer is disposed on the molding layer.
10. The conformal shielding structure of claim 9, wherein the molding layer comprises a first side and a second side disposed opposite to each other, the conformal shielding layer comprises a first shielding layer and two second shielding layers connected to the first shielding layer, the first shielding layer is disposed on a side of the molding layer facing away from the substrate, and the two second shielding layers are embedded in the molding layer and disposed close to the first side and the second side, respectively.
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| CN101803017A (en) * | 2007-06-27 | 2010-08-11 | 射频小型装置公司 | Use the conformal shielding process of process gas |
| US20130082366A1 (en) * | 2011-09-30 | 2013-04-04 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor package and method of manufacturing the same |
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