CN113458396A - Preparation method of copper-based metal honeycomb heat dissipation material - Google Patents

Preparation method of copper-based metal honeycomb heat dissipation material Download PDF

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Publication number
CN113458396A
CN113458396A CN202110354238.4A CN202110354238A CN113458396A CN 113458396 A CN113458396 A CN 113458396A CN 202110354238 A CN202110354238 A CN 202110354238A CN 113458396 A CN113458396 A CN 113458396A
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copper
heat dissipation
based metal
dissipation material
metal honeycomb
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CN113458396B (en
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周芸
张光成
左孝青
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Kunming University of Science and Technology
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Kunming University of Science and Technology
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/20Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by extruding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10Sintering only
    • B22F3/1003Use of special medium during sintering, e.g. sintering aid
    • B22F3/1007Atmosphere
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10Sintering only
    • B22F3/1017Multiple heating or additional steps
    • B22F3/1021Removal of binder or filler
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10Sintering only
    • B22F3/11Making porous workpieces or articles
    • B22F3/1103Making porous workpieces or articles with particular physical characteristics
    • B22F3/1115Making porous workpieces or articles with particular physical characteristics comprising complex forms, e.g. honeycombs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/10Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention discloses a preparation method of a copper-based metal honeycomb heat dissipation material, and belongs to the field of preparation of porous metal heat dissipation materials. The method combines powder plasticizing extrusion forming with powder metallurgy technology to prepare the copper-based metal honeycomb heat dissipation material, namely, the method comprises the following steps: mixing powder, refining, extrusion forming, de-bonding and decarbonizing, sintering and the like to prepare the porous copper-based heat dissipation material with different pore shapes and a honeycomb structure. The copper-based metal honeycomb heat-dissipating material prepared by the invention has the characteristics of good heat conductivity, large heat-dissipating area, high heat-dissipating efficiency, simple preparation process, low cost and the like, and has wide application prospect in the aspects of heat-dissipating electronic components such as computer chips, high-power electronic equipment, photoelectric devices and the like.

Description

Preparation method of copper-based metal honeycomb heat dissipation material
Technical Field
The invention relates to a preparation method of a copper-based metal honeycomb heat dissipation material, and belongs to the technical field of advanced metal porous heat dissipation materials.
Background
With the rapid development of the information age, the high integration and microminiaturization of electronic components and photoelectric devices, the heat generated per unit area is increasing, and how to effectively dissipate the heat on the electronic components in a short time becomes an important subject restricting the development of electronic technology.
Research data show that the normal working temperature of the CPU is below 65 ℃, the operation stability of the CPU is seriously influenced when the temperature is higher than the normal working temperature, and the CPU needs to be efficiently cooled in order to ensure the accuracy and the reliability of a computer. As a new generation of green illumination light source, LEDs have many advantages and also have a considerable disadvantage, that is, about 80% of energy is converted into heat during the light emitting process, and if the heat is not dissipated in time, the light emitting efficiency and the service life of the LEDs are directly affected, so the heat dissipation problem related to the CPU and the LEDs has been a hot point of research all the time.
In all metals, except silver, copper has the best heat conducting property, so that the prepared radiator has good radiating effect, but the density of copper is high, the prepared all-copper radiator has the defects of heavy weight and high processing difficulty, and cannot meet the weight limit of a CPU (central processing unit) and an LED (light-emitting diode) on radiating fins, and the radiator prepared from aluminum has light weight, but the radiating efficiency cannot achieve the radiating effect of copper, and cannot meet the radiating requirement of a new generation of high-power electronic component. Since a heat sink with a given volume needs to have excellent heat dissipation performance while reducing weight, the development of porous copper heat dissipation elements is an important technical development.
In the existing radiator preparation technology, the traditional finned radiator can increase the radiating surface area by reducing the distance between fins, but the weight of the radiator is increased, and meanwhile, the air flow resistance is increased, so that the thermal resistance is increased, and the radiating efficiency is reduced.
The copper with the open pore structure is adopted as the heat dissipation material, so that the surface area of the heat dissipation sheet can be increased, and the heat dissipation capability of the heat dissipation element is hopefully improved. The main preparation process of the open-pore copper-based porous material at present comprises the following steps: (1) the directional solidification method (GASAR), namely, the eutectic reaction of copper and hydrogen at high temperature is utilized, and the directional solidification method is adopted to prepare the porous copper matrix material with the porosity of more than 15 percent and the holes in cylindrical distribution. The technology has the problems that the process control difficulty is high, a penetrating linear pore structure is difficult to obtain, and the preparation process has certain danger. (2) The powder metallurgy method is characterized in that copper powder, a pore-forming agent and a binder are mixed, and a porous copper structure with the relative density of 50-80% is prepared through the processes of compacting, de-bonding, sintering, hydrolyzing, pyrolyzing, removing the pore-forming agent and the like. There are two main problems with this approach: the hole shape is irregular, a complete open pore structure is difficult to obtain, and the controllability is poor. In the forced cooling mode, the flow resistance is larger, so that the heat loss is limited; the process is relatively complex and requires multiple subsequent processes. (3) The deposition method is that polyurethane foam is used as a substrate, copper particles are deposited on the polyurethane foam by adopting an electrodeposition technology, and then the polyurethane foam is removed by sintering to obtain the three-dimensional reticular porous copper.
Disclosure of Invention
The invention aims to provide a preparation method of a copper-based metal honeycomb heat dissipation material, the copper-based metal honeycomb heat dissipation material prepared by the method has light weight, quick heat dissipation and low cost, and the porous copper heat dissipation material can be used for heat dissipation of computer chips, high-power electronic equipment, photoelectric devices and the like, and specifically comprises the following steps:
(1) mixing and refining: mixing pure copper powder and a binder uniformly according to a proportion, adding water to smelt the mixture, wherein the copper powder accounts for 70-80% of the total mass fraction, and after mixing, smelting the mixture for multiple times to obtain a pasty blank with appropriate hardness.
(2) Extrusion molding: and (3) putting the paste blank in the step (1) into a porous shunting extrusion die to be extruded and formed into an integral honeycomb structure.
(3) And (3) drying treatment: the extruded honeycomb body is placed in a constant temperature drying box for drying treatment.
(4) And (3) debonding and decarbonizing: the dried honeycomb body is subjected to de-bonding treatment, sintering and de-bonding are carried out in an aerobic atmosphere furnace, and the pressure in the furnace is controlled to be 1-2 multiplied by 105Pa range, to obtain the desired oxygen content, and removing the carbon remaining from the carbonization of the binder by oxidation.
(5) And (3) sintering: and sintering the debonded sample in an inert protective atmosphere to finally obtain the copper-based metal honeycomb heat dissipation material.
Preferably, the pure copper powder in the step (1) of the invention is gas atomized powder with the average particle size of 300-400 meshes and the apparent density of 2.2g/cm3~2.5g/cm3The purity was 99.9%.
Preferably, in the step (1), the binder is a mixture of M1 (cellulose ether HF4000) and M2 (hydroxypropyl methyl cellulose 6000PF), and the ratio is 1: 1-1: 1.5.
Preferably, the mass ratio of the binder to the water in the step (1) is 1: 2-1: 3.
Preferably, the drying conditions in step (3) of the present invention are: the drying temperature is 120-130 ℃, and the drying time is 1-2 h.
Preferably, the conditions of the de-binding and decarbonizing treatment in step (4) of the present invention are as follows: the temperature is 280-300 ℃, and the time is 120 min; the binder is carbonized at the temperature of 280-300 ℃, a carbon film formed by carbonizing the binder is wrapped on the surface of copper particles to seriously hinder sintering and bonding, and a proper amount of oxygen is required to react with carbon to generate gas to be discharged.
Preferably, the conditions of the sintering process in step (5) of the present invention are: the sintering temperature is 850-950 ℃, and the heat preservation time is 1-2.5 h.
The heat transfer mode generally includes heat conduction, heat convection and heat radiation, but in the electronic device, the heat conduction and the heat convection are the main heat transfer modes; the metal honeycomb is internally provided with a large number of ordered three-dimensional through hole structures, so that the specific surface area is greatly increased, compared with foam metal, the metal honeycomb has more contact surfaces with air, and two heat transfer modes can be effectively combined, so that the heat dissipation effect is improved; meanwhile, the honeycomb-shaped metal copper heat dissipation material is lighter than fins and foam copper heat dissipation materials. The invention adopts the powder plasticizing extrusion-powder metallurgy sintering technology, prepares copper powder into paste through mixing and refining, extrudes the paste through a porous flow-dividing die under certain pressure and speed to obtain a honeycomb structure body, performs de-bonding and decarburization treatment on the honeycomb body in an aerobic atmosphere furnace after drying, removes a carbon film left after carbonization of a binder, and finally sinters the honeycomb body in an inert protective atmosphere to obtain the copper-based metal honeycomb heat-radiating material.
The invention has the advantages and beneficial effects that:
(1) compared with a copper fin type radiator and a foam copper radiator, the invention has the advantages and beneficial effects that: the preparation method can realize one-step forming of the copper honeycomb heat dissipation material into a complete structure, does not have complex processing steps, and has simple process and cost saving; the copper-based metal honeycomb heat dissipation material prepared by the invention has a large number of linear through holes in the metal honeycomb, the hole walls are thin (the wall thickness is 0.15-0.3 mm), the distribution is uniform, the specific surface area is higher, and the gas flow is facilitated.
(2) By replacing the extrusion die core and adjusting corresponding process parameters, the hole shape, the hole size and the hole density of the metal honeycomb heat dissipation material prepared by the invention can be accurately controlled, the honeycomb heat dissipation material with a required hole shape structure is obtained, heat can be quickly and efficiently dissipated, and the heat dissipation efficiency is obviously improved.
(3) The copper-based metal honeycomb heat dissipation material with the square or hexagonal inner hole can be prepared according to the requirements, the hole wall is thin and regular, the resistance to airflow is small, the surface area is large, heat can be taken away in a convection mode, the heat dissipation speed is high under the same volume, the efficiency is high, and the weight is lighter.
Drawings
FIG. 1 is a flow chart of a process for preparing a copper-based metal honeycomb heat dissipation material.
FIG. 2 is a cross-sectional view of a quadrilateral internal hole honeycomb heat sink material.
Fig. 3 is a cross-sectional view of a hexagonal-shaped-bore honeycomb heat sink material.
Detailed Description
The present invention is described in further detail with reference to the following embodiments, but the protection of the present invention is not limited to the embodiments, and any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Example 1
A preparation method of a copper-based metal honeycomb heat dissipation material specifically comprises the following steps:
(1) mixing and refining: putting atomized copper powder with the average particle size of 300 meshes and a binder into a mixer, uniformly mixing, putting the uniformly mixed powder into a material mixing device, adding water to mix the powder, wherein the copper powder accounts for 80% of the total mass fraction, the mass ratio of the binder to the water is 1:2.5, mixing, and mixing for multiple times to obtain a pasty blank with appropriate hardness; the binder is prepared by mixing cellulose ether HF4000 and hydroxypropyl methyl cellulose 6000PF, and the ratio is 1: 1.
(2) Extrusion molding: and putting the uniformly mixed paste extrusion blank into a quadrilateral porous shunting die to extrude an integral honeycomb structural body with a quadrilateral inner hole.
(3) And (3) drying: slowly drying the extruded honeycomb structure in a constant-temperature drying oven at 120 ℃ for 120 min;
(4) the de-bonding and decarbonization treatment needs sintering and de-bonding in an oxygen atmosphere furnace, and the pressure in the furnace is controlled to be 1 x 105Pa range, obtaining the required oxygen content, removing the carbon remained by carbonizing the binder through oxidation, and the debonding temperature is 280 ℃ and the time is 120 min.
(5) And (3) sintering: sintering the debonded sample in argon protective atmosphere at 850-900 deg.C for 2.5h to obtain the final product with quadrilateral inner hole and hole wall thickness (0.20 mm), with the cross section shown in FIG. 2.
Example 2
A preparation method of a copper-based metal honeycomb heat dissipation material specifically comprises the following steps:
(1) mixing and refining: the method comprises the steps of putting atomized copper powder with the average particle size of 400 meshes and a binder into a mixer, uniformly mixing, putting the uniformly mixed powder into a material mixing device, adding water for mixing, wherein the copper powder accounts for 75% of the total mass fraction, the mass ratio of the binder to the water is 1:3, mixing for multiple times, and mixing to obtain a pasty blank with appropriate hardness, wherein the binder is formed by mixing cellulose ether HF4000 and hydroxypropyl methyl cellulose 6000PF, and the ratio is 1: 1.5.
(2) Extrusion molding: and putting the uniformly mixed paste extrusion blank into a hexagonal porous shunting die to extrude an integral honeycomb structural body with hexagonal inner holes.
(3) And (3) drying: slowly drying the extruded honeycomb structure in a constant-temperature drying oven at 130 deg.C for 60 min.
(4) And (3) debonding and decarbonizing treatment: sintering and de-bonding in an oxygen atmosphere furnace with the pressure in the furnace controlled at 1.5 × 105Pa range, obtaining the required oxygen content, removing the carbon remained by carbonizing the binder through oxidation, and the debonding temperature is 300 ℃ and the time is 120 min.
(5) And (3) sintering: sintering the debonded sample in an argon protective atmosphere at the sintering temperature of 900-950 ℃ for 1.5h, and finally obtaining the copper-based metal honeycomb heat dissipation material with the hexagonal inner hole and the hole wall thickness (0.25 mm), wherein the hexagonal inner hole honeycomb heat dissipation material has a higher specific surface area and a better heat dissipation effect than the quadrilateral inner hole honeycomb heat dissipation material, and the cross section is shown in fig. 3.

Claims (7)

1. The preparation method of the copper-based metal honeycomb heat dissipation material is characterized by comprising the following steps of:
(1) mixing and refining: mixing pure copper powder and a binder uniformly according to a proportion, adding water to smelt the mixture, wherein the copper powder accounts for 70-80% of the total mass fraction, and after mixing, smelting the mixture for multiple times to obtain a pasty blank with appropriate hardness;
(2) Extrusion molding: putting the paste blank in the step (1) into a porous shunting extrusion die to be extruded and formed into an integral honeycomb structure;
(3) and (3) drying treatment: placing the extruded honeycomb body in a constant-temperature drying box for drying treatment;
(4) and (3) debonding and decarbonizing: the dried honeycomb body is subjected to de-bonding treatment, sintering and de-bonding are carried out in an aerobic atmosphere furnace, and the pressure in the furnace is controlled to be 1-2 multiplied by 105Pa range, obtaining a desired oxygen content, removing carbon remaining from carbonization of the binder by oxidation;
(5) and (3) sintering: and sintering the debonded sample in an inert protective atmosphere to finally obtain the copper-based metal honeycomb heat dissipation material.
2. The method for preparing the copper-based metal honeycomb heat dissipation material according to claim 1, wherein: the pure copper powder in the step (1) is gas atomized powder with the average particle size of 300-400 meshes and the apparent density of 2.2g/cm3~2.5g/cm3The purity was 99.9%.
3. The method for preparing the copper-based metal honeycomb heat dissipation material according to claim 1, wherein: the binder in the step (1) is prepared by mixing cellulose ether HF4000 and hydroxypropyl methyl cellulose 6000PF in a ratio of 1: 1-1: 1.5.
4. The preparation method of the copper-based metal honeycomb heat dissipation material according to any one of claims 1 to 3, wherein: the mass ratio of the binder to the water in the step (1) is 1: 2-1: 3.
5. The method for preparing the copper-based metal honeycomb heat dissipation material according to claim 1, wherein: the drying conditions in the step (3) are as follows: the drying temperature is 120-130 ℃, and the drying time is 1-2 h.
6. The method for preparing the copper-based metal honeycomb heat dissipation material according to claim 1, wherein: the conditions of the debonding treatment in the step (4) are as follows: the temperature is 280-300 ℃ and the time is 120 min.
7. The method for preparing the copper-based metal honeycomb heat dissipation material according to claim 1, wherein: the conditions of the sintering process in the step (5) are as follows: the sintering temperature is 850-950 ℃, and the heat preservation time is 1-2.5 h.
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN88103047A (en) * 1987-05-27 1988-12-14 康宁玻璃公司 Porous metal bodies
US20030100448A1 (en) * 2001-08-08 2003-05-29 Cutler Willard A. Thermally conductive honeycombs for chemical reactors
CN101195162A (en) * 2006-12-04 2008-06-11 上海材料研究所 Method of manufacturing stephanoporate metal honeycomb structure member
CN101537496A (en) * 2008-03-17 2009-09-23 大阳日酸株式会社 Process for producing porous metal body
CN102631952A (en) * 2012-04-01 2012-08-15 昆明理工大学 Method for preparing iron-based metal honeycomb carrier material
CN104550968A (en) * 2014-12-30 2015-04-29 昆明理工大学 Method for manufacturing automobile exhaust catalyst carriers with honeycomb structures
CN108526459A (en) * 2018-04-16 2018-09-14 昆明理工大学 A kind of preparation method of copper/aluminium oxide In-situ reaction cellular material
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CN88103047A (en) * 1987-05-27 1988-12-14 康宁玻璃公司 Porous metal bodies
US20030100448A1 (en) * 2001-08-08 2003-05-29 Cutler Willard A. Thermally conductive honeycombs for chemical reactors
CN101195162A (en) * 2006-12-04 2008-06-11 上海材料研究所 Method of manufacturing stephanoporate metal honeycomb structure member
CN101537496A (en) * 2008-03-17 2009-09-23 大阳日酸株式会社 Process for producing porous metal body
CN102631952A (en) * 2012-04-01 2012-08-15 昆明理工大学 Method for preparing iron-based metal honeycomb carrier material
CN104550968A (en) * 2014-12-30 2015-04-29 昆明理工大学 Method for manufacturing automobile exhaust catalyst carriers with honeycomb structures
CN108526459A (en) * 2018-04-16 2018-09-14 昆明理工大学 A kind of preparation method of copper/aluminium oxide In-situ reaction cellular material
CN110449586A (en) * 2019-08-29 2019-11-15 上海材料研究所 A kind of method that low pressure injection molding prepares metal honeycomb material

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