CN109534820A

CN109534820A - A kind of glass bending molding ceramic mold and preparation method thereof

Info

Publication number: CN109534820A
Application number: CN201811599724.7A
Authority: CN
Inventors: 保玉芝; 李虎; 付利华
Original assignee: NINGXIA MACHINERY RESEARCH INSTITUTE Co Ltd
Current assignee: NINGXIA MACHINERY RESEARCH INSTITUTE Co Ltd
Priority date: 2018-12-26
Filing date: 2018-12-26
Publication date: 2019-03-29
Anticipated expiration: 2038-12-26
Also published as: CN109534820B

Abstract

The present invention relates to silicon carbide ceramics field, a kind of glass bending molding ceramic mold and preparation method thereof is provided.The raw material of the ceramic mold includes carborundum powder 60~85%, binder 3~10% and Heat Conduction Material 12~30% by mass percentage.The ceramic mold prepared by the raw material has excellent antioxygenic property, and hardness that is higher and being easy to machining, abrasion resistance properties are excellent, and service life is 3~5 times of graphite material, and has preferable compactness.The preparation method includes that the raw material of above-mentioned glass bending molding ceramic mold is mixed into mixture, dry pack, and compression moulding is simultaneously sintered.It is sintered using blank of the specific sintering process to compression moulding, product is made and is not infiltrated under the conditions of 400~1100 DEG C with glass, antioxygenic property is excellent, and hardness is high, is easy to be machined, abrasion resistance properties are excellent.

Description

A kind of glass bending molding ceramic mold and preparation method thereof

Technical field

The present invention relates to silicon carbide ceramics field, in particular to a kind of glass bending molding ceramic mold and its Preparation method.

Background technique

Current screen comprehensively is the hot spot of Mobile Industry circle, and 3D bent plate cover board and production capacity breakthrough are to push comprehensive screen market comprehensive The key factor of outburst.Since mold and glass can expand when heating, if the thermal expansion coefficient of glass mold greatly Thermal expansion coefficient it is small, then glass can burst when carrying out hot bending process.The mainstream mold materials that industry uses at present are stone Ink, and high-precision 3D glass is higher to the quality requirements of graphite material, can be used for the graphite of hot bending graphite jig currently on the market Material is simultaneously few, depends on external high-end import graphite material, Germany, Japan, France, etc. the graphite material of country occupy Mainstream.

Compared with external graphite manufacture production, domestic graphite manufacture production start-up time is later, therefore in production work There is also certain gaps on skill and graphite quality.And Some Domestic large size graphite manufacturer is asked due to environmental pollution in recent years Topic, is constrained by policies and regulations, is shut down more, is ordered rectification to upgrade, is significantly limited the supply of graphite material.

Although graphite has easy to process, elevated temperature strength height, good and more consistent with the glass thermal expansion coefficient etc. of thermal conductance The defects of advantage, but since graphite is oxidizable under aerobic environment, hardness is low, not wear-resisting, while higher equipment requirement Significantly limit the service life of graphite grinding tool.

In consideration of it, special propose the application.

Summary of the invention

The purpose of the present invention is to provide a kind of glass bending molding ceramic molds, do not infiltrate with glass, anti-oxidant It has excellent performance, hardness is high, is easy to be machined, and abrasion resistance properties are excellent, and service life is 3~5 times of graphite material.

Another object of the present invention is to provide a kind of preparation method of glass bending molding ceramic mold, the preparation sides Method can effectively control particular product performance parameters, so that glass bending molding is excellent with ceramic mold antioxygenic property, hardness is high, easily In machining, abrasion resistance properties are excellent.

The embodiment of the present invention is achieved in that

A kind of glass bending molding ceramic mold, raw material include by mass percentage carborundum powder 60~85%, Binder 3~10% and Heat Conduction Material 12~30%.

A kind of glass bending molding preparation method of ceramic mold comprising by above-mentioned glass bending molding ceramic die The raw material of tool is mixed into mixture, dry pack, and compression moulding is simultaneously sintered.

The beneficial effect of the embodiment of the present invention is for example:

Glass bending molding ceramic mold provided in this embodiment, by using 60~85% carborundum powder as mainly Raw material compounds 3~10% binder and 12~30% Heat Conduction Material, the ceramic mold prepared by the raw material, tool There is excellent antioxygenic property, hardness that is higher and being easy to machining, abrasion resistance properties are excellent, and service life is graphite material 3~5 times, and have preferable compactness.The glass bending molding provided in this embodiment preparation method of ceramic mold It is sintered using blank of the specific sintering process to compression moulding, desired product can be obtained, prepared by above method Heat-bending glass mold materials do not infiltrated under the conditions of 400~1100 DEG C with glass, antioxygenic property is excellent, and hardness is high, is easy to Machining, abrasion resistance properties are excellent, and service life is 3~5 times of graphite material.

Specific embodiment

Embodiment of the present invention is described in detail below in conjunction with embodiment, but those skilled in the art will Understand, the following example is merely to illustrate the present invention, and is not construed as limiting the scope of the invention.It is not specified in embodiment specific Condition person carries out according to conventional conditions or manufacturer's recommended conditions.Reagents or instruments used without specified manufacturer is The conventional products that can be obtained by commercially available purchase.

Glass bending molding ceramic mold of the embodiment of the present invention and preparation method thereof is specifically described below.

Glass bending molding ceramic mold provided in this embodiment, raw material includes carborundum powder by mass percentage 60~85%, binder 3~10% and Heat Conduction Material 12~30%.

Preferably, carborundum powder 70~75%, binder 5~8% and Heat Conduction Material 18~25%.

Wherein, it is 0.3~1.5 micron that the particle diameter distribution of carborundum powder, which is D50,.In the present embodiment, preferably carborundum powder is It is obtained by 20~50 hours ball milling shaping granule-morphologies, and the purity of the carborundum powder is 99% or more.Silicon carbide Stable chemical performance, thermal coefficient is high, and thermal expansion coefficient is worked as with graphite-phase, and, energy more consistent with the thermal expansion coefficient of glass Enough glass is effectively prevent to rupture during heating, wear-resisting property is good.

Binder includes alphalise starch, polyacrylic acid, polyethylene oxide, alkylcellulose, hydroxy alkyl cellulose, hydroxyalkyl alkane One or more of base cellulose.

Heat Conduction Material includes Polycarbosilane, modified graphite, boron carbide, pure boron, modified aluminium nitride, simple substance carbon, two boronations One or more of titanium and silicon nitride；

Preferably, it is 0.5~5 micron that the particle diameter distribution of Polycarbosilane, which is D50, and purity is greater than 99%；

Preferably, it is 0.3~5 micron that the particle diameter distribution of modified graphite, which is D50,；

Preferably, it is 0.3~3.5 micron that the particle diameter distribution of boron carbide, which is D50,；

Preferably, it is 0.3~5 micron that the particle diameter distribution of pure boron, which is D50,；

Preferably, it is 1~8 micron that the particle diameter distribution of modified aluminium nitride, which is D50,；

Preferably, it is 0.01~1.5 micron that the particle diameter distribution of simple substance carbon, which is D50,；

Preferably, it is 1.5~10 microns that the particle diameter distribution of titanium diboride, which is D50,；

Preferably, it is 0.5~6 micron that the particle diameter distribution of silicon nitride, which is D50,.

In the present embodiment, D50 is commonly used to indicate the average particle size of powder, by the particle diameter distribution for controlling each Heat Conduction Material D50, to effectively control the granularity of each Heat Conduction Material.

In the production process of ceramic mold, the partial size and particle diameter distribution of raw material directly affect the craftsmanship of mud, green body Can, such as viscosity, plasticity, green body compactness, dry tenacity, firing temperature etc..After the component of slurry determines, grain composition It to its decisive role of its performance, can be seen that in the present embodiment from above-mentioned particle diameter distribution, the particle diameter distribution model of carborundum powder It encloses relatively narrow, its particle size range is required stringent, it is 0.3~1.5 micron that the particle diameter distribution by controlling carborundum powder, which is D50, energy Enough obtain superior properties of product.Through inventor the study found that the average grain diameter when carborundum powder is greater than 0.3~1.5 micron When, fine and close carborundum sintered body can not be obtained above and below silicon carbide theory sintering temperature, can be existed in the matrix many different The defects of micropore of shape, when defect is exposed in matrix surface, meeting forms spot in glass surface, influence glass transparent degree.

When the particle diameter distribution of silicon carbide and each Heat Conduction Material exceeds scope of the present application, i.e., average grain diameter is greater than this When each range in embodiment, the compactness of product is bad.

In addition, the embodiment of the invention also provides a kind of preparation methods of glass bending molding ceramic mold comprising Following steps:

S1, mixing

The raw material of above-mentioned glass bending molding ceramic mold is mixed into mixture.

Specifically, carborundum powder and binder are first placed in water mixing 6-20h, are subsequently added into Heat Conduction Material, mixed 10-40h forms mixture, mixture is crossed 40-80 mesh.In the present embodiment, using first hybrid silicon carbide and bonding agent, then The hybrid mode of mixed heat conducting material enables to silicon carbide and bonding agent to be pre-mixed uniformly, and Heat Conduction Material can be abundant It is scattered between hybrid silicon carbide and bonding agent, is conducive to thermally conductive when subsequent heat, and bonding agent can preferably bond carbonization Si powder.

S2, drying

Mixture is carried out to be spray-dried to obtain dried feed；Preferably, it is spray-dried using spray drying tower；It is spraying dry The inlet temperature of dry tower is 240-280 DEG C, and outlet temperature is 100-140 DEG C.It, can be maximum by spray drying in the present embodiment The partial size of the control mixture of change, avoids the partial size of mixture excessive.

After dry to mixture, dried feed is crossed into 40-80 mesh, the bulk density of dried feed is 0.815g/cm³。

It is worth noting that, in other embodiments of the invention, can also using other drying modes to mixture into Row drying, such as infrared lamp drying, baking oven drying, drier drying etc..

S3, compression moulding

By the mixture after drying in mold after pre-molding, using solidifying after isostatic cool pressing；

Preferably, pre-molding is carried out under 50~120MPa；Preferably, isostatic cool pressing is carried out under 70~220MPa； Preferably, baking and curing 5~20 hours at 90~180 DEG C.

In the present embodiment, it is pressed by the mould pressing method that dry-pressing and isostatic cool pressing combine, is able to ascend mold Compactness, and then promoted properties of product.Then solidified in 90~180 DEG C, compared to room temperature curing, better effect.

S4, sintering

The mixture of compression moulding is sintered.

Specifically, pre-burning is first carried out, the temperature of pre-burning is 300~900 DEG C；Pre-burning can make moisture sufficiently volatilize, raw material In binder decompose.

Then vacuum-sintering, the temperature of vacuum-sintering are 1950~2250 DEG C, and sintering time is 5~15h；Vacuum-sintering energy Enough hot conditions to recrystallize, and in particle, the crystal grain of deformation is restored, and are reorganized as new crystal grain, while surface Oxide is reduced, and granular boundary forms sintering neck and forms a large amount of closed pores with the continuous raising of temperature, and continue to zoom out, make Pore-size and hole sum must be made to be reduced, sintered density obviously increases.It is then cooled to room temperature.

It heats and keeps the temperature again, 400~1800 DEG C are heated to when heating again, heat preservation is cooled to room temperature after 3~12 hours. In the present embodiment, after high temperature sintering is cooling, heats and keep the temperature again, and when heating temperature is significantly lower than vacuum-sintering plus Hot temperature can be effectively reduced the hardness of product, so that the hardness of product meets Vickers hardness 600≤HV5≤1600, at this time not For the mold of glass bending molding, reached the requirement of hardness, at the same avoid die hardness it is too big and Caused situation not easy to be processed, it is easier to process.

Preferably, in the present embodiment, heating speed when heating again is 0.5-15 DEG C/min, cooling velocity 3-20 ℃/min.Product is formed after the direct high temperature sintering that the present embodiment is different from the prior art, the present embodiment is using first pre-burning, then High temperature sintering after then allowing to cool to room temperature, then carries out heating and heat preservation and cools down, also, be not simple heating and heat preservation simultaneously Cooling, but heated up using specific heating speed, cooled down using specific cooling velocity.Its hardness can obtain It is substantially reduced and does not influence the compactness of product.

The preparation method of glass bending molding ceramic mold provided in this embodiment is using specific sintering process to pressure It makes molding blank to be sintered, desired product can be obtained, the heat-bending glass mold materials prepared by above method are 400 It not being infiltrated under the conditions of~1100 DEG C with glass, antioxygenic property is excellent, and hardness is high, is easy to be machined, and abrasion resistance properties are excellent, Service life is 3~5 times of graphite material.

With reference to embodiments to glass bending molding ceramic mold of the invention and preparation method thereof further progress It illustrates.

It is described as follows so that 100kg raw material produces glass bending ceramic die material as an example.

Embodiment 1:

S1, mixing: ball milling shaping in 20 hours of learning from else's experience, the silicon carbide powder 60 that partial size is 0.3 micron, purity is 99% After mixing 20 hours in the mixture addition pure water of ㎏, 6 kilograms of alphalise starch and 4 kilograms of polyacrylic acid, it is 0.5 micron that partial size, which is added, Purity be 10 kilograms of Polycarbosilane of 99%, partial size is 2 kilograms of modified graphite that 0.5 micron of purity is 99% or more, grain Diameter is 18 kilograms of boron carbide that 3.5 microns of purity is 95% or more.After mixing 40 hours, 60 meshes are crossed；

S2, drying: the slurry after sieving is dried by spray drying tower, and 260 DEG C of spray drying tower inlet temperature, 120 DEG C of outlet temperature；After material after drying is crossed 60 meshes, material accumulation density is 0.93g/cm³；

S3, molding: choose the die-filling tool of rectangle rigid splicing, by above-mentioned powder be packed into mold cavity in 50MPa it is preforming after, 70MPa carry out isostatic cool pressing, 90 DEG C dry solidification 5 hours；

S4, sintering: being cooled to room temperature after the dry solidification green compact of above-mentioned steps preparation are sintered 15 hours at 1950 DEG C, then After the secondary heating rate with 0.5 DEG C/min is heated to 400 DEG C of heat preservations 12 hours, room is cooled to the cooling velocity of 20 DEG C/min Temperature.

Its thermal conductivity is 109W/ (mk) (20 DEG C), and apparent porosity 0.5%, Vickers hardness 755 is heated to from 150 degree 950 degree, continuous 5 cycle detections are not destroyed.

Embodiment 2:

S1, mixing: ball milling shaping in 35 hours of learning from else's experience, the silicon carbide powder 70 that partial size is 0.3 micron, purity is 99% ㎏, 2 kilograms of polyethylene oxide and 4 kilograms of alkylcelluloses or hydroxy alkyl cellulose or hydroxyalkylalkylcellulose are added in pure water After mixing 14 hours, modification aluminium nitride 6kg, D50 that pure boron 4.5kg, D50 that addition D50 is 0.3 micron are 1 micron are 0.015 micron simple substance carbon 2.8kg, D50 be 1.5 microns titanium diboride 10.1kg, mixing 25 hours after, cross 60 meshes；

S2, drying: the slurry after sieving is dried by spray drying tower, and 260 DEG C of spray drying tower inlet temperature, 120 DEG C of outlet temperature；After material after drying is crossed 60 meshes, material accumulation density is 1.035g/cm³；

S3, molding: choose the die-filling tool of rectangle rigid splicing, by above-mentioned powder be packed into mold cavity in 85MPa it is preforming after, 150MPa carry out isostatic cool pressing, 140 DEG C dry solidification 13 hours；

S4, sintering: being cooled to room temperature after the dry solidification green compact of above-mentioned steps preparation are sintered 10 hours at 2000 DEG C, then After the secondary heating rate with 8 DEG C/min is heated to 1100 DEG C of heat preservations 8 hours, it is cooled to room temperature with the cooling velocity of 13 DEG C/min.

Its thermal conductivity is 120W/ (mk) (20 DEG C), and apparent porosity 0.41%, Vickers hardness 1017 is heated to from 150 degree 950 degree, continuous 5 cycle detections are not destroyed.

Embodiment 3:

S1, mixing: the purity for 50 hours ball milling shaping granule-morphologies of learning from else's experience is 1.5 micrometer silicon carbides in 99% or more D50 Silicon powder 85kg, alphalise starch 0.7kg, polyacrylic acid 0.3kg, polyethylene oxide 0.5kg, alkylcellulose 0.5kg, hydroxylalkyl Plain 0.4kg, hydroxyalkylalkylcellulose 0.6kg are sufficiently mixed 6 hours in pure water, are added into the mixture, and D50 is 5 micro- The carbon that modified graphite 1.2kg, D50 that Polycarbosilane 2.1kg, D50 that the purity of rice is 99% or more are 5 microns are 3.5 microns The list that modification aluminium nitride 1.9kg, D50 that pure boron 1.8kg, D50 that change boron 1.5kg, D50 are 5 microns are 8 microns are 1 micron The silicon nitride 2kg that titanium diboride 1kg, D50 that matter carbon 0.5kg, D50 are 10 microns are 1.8 microns crosses 60 after mixing 10 hours Mesh；

S2, drying: the slurry after sieving is dried by spray drying tower, and 260 DEG C of spray drying tower inlet temperature, 120 DEG C of outlet temperature；After material after drying is crossed 60 meshes, material accumulation density is 0.815g/cm³；

S3, molding: choosing the die-filling tool of rectangle rigid splicing, and it is preforming that above-mentioned powder is packed into 120MPa in mold cavity Afterwards, 220MPa carry out isostatic cool pressing, 180 DEG C dry solidification 20 hours；

S4, sintering: being cooled to room temperature after the dry solidification green compact of above-mentioned steps preparation are sintered 5 hours at 2050 DEG C, then After the secondary heating rate with 15 DEG C/min is heated to 1800 DEG C of heat preservations 3 hours, it is cooled to room temperature with the cooling velocity of 3 DEG C/min.

Its thermal conductivity is 150W/ (mk) (20 DEG C), and apparent porosity 0.39%, Vickers hardness 1315 is heated to from 150 degree 950 degree, continuous 5 cycle detections are not destroyed.

Comparative experiments

Comparative example 1

By the sintering step replacement in embodiment 1 are as follows: be sintered the dry solidification green compact of above-mentioned steps preparation at 1950 DEG C It is cooled to room temperature after 15 hours.

Comparative example 2

By the sintering step replacement in embodiment 1 are as follows: be sintered the dry solidification green compact of above-mentioned steps preparation at 1950 DEG C It is cooled to room temperature after 15 hours.Again with the heating rate of 0.5 DEG C/min be heated to 200 DEG C heat preservation 12 hours after, with 20 DEG C/ The cooling velocity of min is cooled to room temperature.

Comparative example 3

By the sintering step replacement in embodiment 1 are as follows: be sintered the dry solidification green compact of above-mentioned steps preparation at 1950 DEG C It is cooled to room temperature after 15 hours.Again with the heating rate of 0.5 DEG C/min be heated to 2000 DEG C heat preservation 12 hours after, with 20 DEG C/ The cooling velocity of min is cooled to room temperature.

Comparative example 4

By the sintering step replacement in embodiment 1 are as follows: be sintered the dry solidification green compact of above-mentioned steps preparation at 1950 DEG C Be cooled to room temperature after 15 hours, again with the heating rate of 0.2 DEG C/min be heated to 400 DEG C heat preservation 12 hours after, with 20 DEG C/ The cooling velocity of min is cooled to room temperature.

Comparative example 5

By the sintering step replacement in embodiment 1 are as follows: be sintered the dry solidification green compact of above-mentioned steps preparation at 1950 DEG C It is cooled to room temperature after 15 hours, after being heated to 400 DEG C of heat preservations 12 hours with the heating rate of 18 DEG C/min again, with 20 DEG C/min Cooling velocity be cooled to room temperature.

Comparative example 6

By the sintering step replacement in embodiment 1 are as follows: be sintered the dry solidification green compact of above-mentioned steps preparation at 1950 DEG C Be cooled to room temperature after 15 hours, again with the heating rate of 0.5 DEG C/min be heated to 400 DEG C heat preservation 12 hours after, with 1.5 DEG C/ The cooling velocity of min is cooled to room temperature.

Comparative example 7

By the sintering step replacement in embodiment 1 are as follows: be sintered the dry solidification green compact of above-mentioned steps preparation at 1950 DEG C Be cooled to room temperature after 15 hours, again with the heating rate of 0.5 DEG C/min be heated to 400 DEG C heat preservation 12 hours after, with 25 DEG C/ The cooling velocity of min is cooled to room temperature.

Comparative example 8

The partial size of raw material in embodiment 1 is replaced are as follows: the silicon carbide powder that 2 micron of partial size, 6 microns of partial size of poly- carbon silicon Alkane, 6 microns of partial size of modified graphite, the boron carbide that partial size is 5 microns.

The ceramic mold that above-described embodiment 1-3 and comparative example 1-8 is obtained carries out performance detection, and testing result is as follows:

	Thermal conductivity (20 DEG C)	Apparent porosity	Vickers hardness	Wear resistance	It is anti-oxidant
						Embodiment 1	109W/(m·k)	0.50%	755	It is good	It is excellent
Embodiment 2	120W/(m·k)	0.41%	1017	It is excellent	It is excellent
						Embodiment 3	150W/(m·k)	0.39%	1315	It is excellent	It is excellent
Comparative example 1	80W/(m·k)	1.1%	723	It is good	Difference
						Comparative example 2	91W/(m·k)	0.91%	691	It is good	Difference
Comparative example 3	118W/(m·k)	0.5%	1820	It is excellent	It is excellent
						Comparative example 4	98W/(m·k)	0.85%	1670	It is excellent	It is good
Comparative example 5	85W/(m·k)	0.36%	1760	It is excellent	Difference
						Comparative example 6	103W/(m·k)	0.52%	1825	It is excellent	It is good
Comparative example 7	97W/(m·k)	0.76%	1640	It is excellent	It is good
						Comparative example 8	113W/(m·k)	0.45%	1586	It is excellent	It is good

As can be seen from the above table, subsequent heating and heat preservation step is omitted in comparative example 1, and the holding temperature of comparative example 2 is low, It is low to will lead to its thermal conductivity heating rate, and apparent porosity is big, performance is poor, and comparative example 3 is kept the temperature at a higher temperature, hardness It is larger, it is unfavorable for subsequent machining.Comparative example 4-7 can be seen that under same sintering condition, different heating rate and drop Warm rate influences the thermal conductivity of matrix, apparent porosity and hardness different.It is indicated above in specific heating and rate of temperature fall section Interior, substrate performance is heated up and rate of temperature fall is affected, therefore obtains moderate (Vickers hardness 600≤HV5≤1600 of Vickers hardness Interior, can have a preferable processing performance, and can be unfavorable for being machined after Vickers hardness is greater than 1600), wear resistance Good and oxidation resistant basis material, it is necessary to considered critical heating and rate of temperature fall.And comparative example 8 is as can be seen that powder Partial size is big, and it is larger to will lead to hardness, is unfavorable for subsequent processing.1 sintering temperature of embodiment is relatively low, therefore hardness is lower, Processability is preferable.In general the processability of ceramic material is to be determined by hardness, and embodiment 1 is using specific cooling speed Rate, the hardness of material can guarantee in a certain range, therefore processing performance will be significantly better than comparative example.It is more suitable for actually answering With.

These are only the preferred embodiment of the present invention, is not intended to restrict the invention, for those skilled in the art For member, the invention may be variously modified and varied.All within the spirits and principles of the present invention, it is made it is any modification, Equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.

Claims

1. a kind of glass bending molding ceramic mold, which is characterized in that its raw material includes carborundum powder by mass percentage 60~85%, binder 3~10% and Heat Conduction Material 12~30%.

2. glass bending molding ceramic mold according to claim 1, which is characterized in that the partial size of the carborundum powder Being distributed as D50 is 0.3~1.5 micron.

3. glass bending molding ceramic mold according to claim 1, which is characterized in that the Heat Conduction Material includes poly- One of carbon silane, modified graphite, boron carbide, pure boron, modified aluminium nitride, simple substance carbon, titanium diboride and silicon nitride are several Kind；

Preferably, it is 0.5~5 micron that the particle diameter distribution of the Polycarbosilane, which is D50, and purity is greater than 99%；

Preferably, it is 0.3~5 micron that the particle diameter distribution of the modified graphite, which is D50,；

Preferably, it is 0.3~3.5 micron that the particle diameter distribution of the boron carbide, which is D50,；

Preferably, it is 0.3~5 micron that the particle diameter distribution of the pure boron, which is D50,；

Preferably, it is 1~8 micron that the particle diameter distribution of the modified aluminium nitride, which is D50,；

Preferably, it is 0.01~1.5 micron that the particle diameter distribution of the simple substance carbon, which is D50,；

Preferably, it is 1.5~10 microns that the particle diameter distribution of the titanium diboride, which is D50,；

Preferably, it is 0.5~6 micron that the particle diameter distribution of the silicon nitride, which is D50,.

4. glass bending molding ceramic mold according to claim 1, which is characterized in that the binder includes α-shallow lake One of powder, polyacrylic acid, polyethylene oxide, alkylcellulose, hydroxy alkyl cellulose, hydroxyalkylalkylcellulose are several Kind.

5. the preparation method that ceramic mold is used in a kind of glass bending molding, which is characterized in that it includes will be as claim 1-4 appoints The raw material of glass bending molding ceramic mold described in one is mixed into mixture, the dry mixture, pressure Type is made and is sintered.

6. the preparation method that ceramic mold is used in glass bending according to claim 5 molding, which is characterized in that being pressed into It includes: first to carry out pre-burning that the mixture of type, which is sintered, and then vacuum-sintering after being cooled to room temperature, is heated again and protected Temperature is then cooled to room temperature；

Preferably, the temperature of pre-burning is 300~900 DEG C；

Preferably, the temperature of vacuum-sintering is 1950~2250 DEG C, and sintering time is 5~15h；

Preferably, 400~1800 DEG C are heated to when heating again, heat preservation is cooled to room temperature after 3~12 hours；

Preferably, heating speed when heating again is 0.5-15 DEG C/min, and cooling velocity is 3-20 DEG C/min.

7. the preparation method that ceramic mold is used in glass bending molding according to claim 5, which is characterized in that after drying The mixture be pressed include: by the mixture after drying in mold after pre-molding, using Solidify after isostatic cool pressing；

Preferably, pre-molding is carried out under 50~120MPa；

Preferably, isostatic cool pressing is carried out under 70~220MPa；

Preferably, baking and curing 5~20 hours at 90~180 DEG C.

8. the preparation method that ceramic mold is used in glass bending molding according to claim 5, which is characterized in that described in dry Mixture includes carrying out the mixture to be spray-dried to obtain dried feed；

Preferably, it is spray-dried using spray drying tower；

Preferably, the inlet temperature of the spray drying tower is 240-280 DEG C, and outlet temperature is 100-140 DEG C.

9. the preparation method that ceramic mold is used in glass bending molding according to claim 8, which is characterized in that described It further include that the dried feed is crossed to 40-80 mesh, the accumulation of the dried feed is close between compression molding after mixture is dry Degree is 0.815g/cm³。

10. the preparation method that ceramic mold is used in glass bending molding according to claim 5, which is characterized in that first by institute It states carborundum powder and the binder is placed in water mixing 6-20h, be subsequently added into the Heat Conduction Material, mix 10-40h, formed The mixture is crossed 40-80 mesh by mixture.