CN113453507B - Modularized miniature liquid cooling system - Google Patents
Modularized miniature liquid cooling system Download PDFInfo
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- CN113453507B CN113453507B CN202110710951.8A CN202110710951A CN113453507B CN 113453507 B CN113453507 B CN 113453507B CN 202110710951 A CN202110710951 A CN 202110710951A CN 113453507 B CN113453507 B CN 113453507B
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- 239000007788 liquid Substances 0.000 title claims abstract description 330
- 238000001816 cooling Methods 0.000 title claims abstract description 184
- 239000012530 fluid Substances 0.000 claims abstract description 96
- 230000000712 assembly Effects 0.000 claims abstract description 6
- 238000000429 assembly Methods 0.000 claims abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims description 41
- 230000005855 radiation Effects 0.000 claims description 6
- 230000004087 circulation Effects 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000002826 coolant Substances 0.000 description 10
- 230000004089 microcirculation Effects 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a modularized miniature liquid cooling system which comprises a liquid cooling machine box, a micro-channel liquid cooling source component and a heat source cold plate component, wherein the micro-channel liquid cooling source component and the heat source cold plate component are arranged in the liquid cooling machine box. The invention miniaturizes, modularizes and standardizes the liquid cooling system, integrates the liquid cooling source on a standard micro-channel cold plate to form the micro-channel liquid cooling source assembly, the micro-channel liquid cooling source assembly can be inserted into a standard liquid cooling machine case, electronic components to be cooled in the liquid cooling machine case are respectively fixed on a plurality of heat source cold plate assemblies, the micro-channel cold plate and the heat source cold plate assemblies to be cooled in the liquid cooling machine case are connected through the fluid connector and the circulating flow channel on the rear panel of the liquid cooling machine case to form a complete liquid cooling system, thereby realizing concentrated cooling of the electronic components in the liquid cooling machine case, and achieving high cooling efficiency and rapid cooling.
Description
Technical Field
The invention relates to the field of liquid cooling systems of electronic equipment, in particular to a modularized miniature liquid cooling system.
Background
The liquid cooling system is developed under the condition that the traditional cooling mode cannot meet with the gradual increase of the power of electronic components and electronic equipment. The foreign liquid cooling system is widely used as an important component of modern high-performance weapon equipment. Electronic equipment with high heat dissipation capacity and high reliability, such as vehicle-mounted, airborne and ground radars, is one of the main directions of application of liquid cooling systems. The traditional liquid cooling system mainly comprises a pump, a liquid storage tank, a heat exchanger, a radiator, a connecting pipeline, a control system and the like, wherein the heat exchanger mainly exchanges heat with a heat source, and the radiator releases heat absorbed by a liquid cooling medium into the air. At present, the traditional liquid cooling system has been developed for many years, the technology is relatively mature, and the problems of large volume, external connection of a liquid cooling source and low heat exchange rate of a heat exchanger still exist.
With the continuous improvement of performance indexes and continuous increase of power consumption of airborne electronic equipment, the liquid cooling heat dissipation technology is increasingly applied to the airborne electronic equipment, and with the modularized development of the airborne electronic equipment, the electronic equipment is designed into external field replaceable units according to functions, so that a standard case is made, and a plurality of external field replaceable modules (LRM modules) are inserted into the case. The former cooling mode is that a liquid channel is designed on the side wall of a standard case to form a liquid cooling case, all the liquid cooling cases are connected to an independent liquid cooling system after being interconnected through liquid cooling pipelines, heat dissipation is realized on modules in the case, and the liquid cooling case is equivalent to a heat exchanger of the liquid cooling system. Because the whole liquid cooling system occupies a large space, for some specific airborne and vehicle-mounted radars, the liquid cooling system is required to be miniaturized and light, so that the traditional liquid cooling system externally connected with a liquid cooling source on a liquid cooling machine box is difficult to meet the requirements.
An integrated cooling device (patent of the invention is ZL 201310122627.3) comprises a liquid cooling system and an air cooling system; the liquid cooling system comprises a liquid storage tank, a filter, a circulating pump and a cold plate; the air cooling system comprises a fan assembly, a fan power supply, an air cooling heat dissipation mechanism and an air duct static pressure cavity. The air-cooling heat dissipation mechanism consists of parallel heat dissipation fins. The liquid cooling system and the air cooling system are both distributed on the side face of the cold plate, a cooling medium pipeline is arranged on the cold plate, and the air cooling heat dissipation mechanism is correspondingly arranged on the cold plate at the position of the cooling medium pipeline. The liquid inlet of the cold plate is connected with the circulating pump, the liquid outlet of the cold plate is communicated with the liquid storage tank, and the circulating pump and the liquid storage tank are arranged on the cold plate. The air cooling heat dissipation mechanism consists of an air duct static pressure cavity and three parallel axial flow fans, the air duct static pressure cavity is an L-shaped cube, the air duct static pressure cavity covers the upper part of the liquid cooling pipeline, and an inlet is connected with the three axial flow fans. The disadvantages of such an integrated cooling device are: 1. the integrated cooling device has large volume and is difficult to be placed in a standard case; 2. the commercial application difficulty is high due to the fact that no interface and no mounting structure exist; 3. the liquid cooling pipelines are arranged in disorder, and potential safety hazards in the use process are large; 4. only can dispel the heat to the components and parts that generate heat on the cooling device, can't satisfy the heat dissipation demand of a set of system to the polylith cold plate.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a modularized miniature liquid cooling system, which is realized by carrying out liquid cooling heat dissipation on a modularized heat source cold plate assembly fixed with an electronic element through a modularized assembled microchannel liquid cooling source assembly.
The technical scheme of the invention is as follows:
a modularized miniature liquid cooling system comprises a liquid cooling machine box, a micro-channel liquid cooling source component and a heat source cold plate component, wherein the micro-channel liquid cooling source component and the heat source cold plate component are arranged in the liquid cooling machine box;
The liquid cooling cabinet is characterized in that a liquid inlet channel and a liquid return channel are arranged in a rear panel of the liquid cooling cabinet, both ends of the liquid inlet channel and both ends of the liquid return channel are of sealing structures, two rows of fluid connector sockets are arranged on the inner wall of the rear panel, the number of the two rows of fluid connector sockets is equal and corresponds to that of the two rows of fluid connector sockets one by one, one row of fluid connector sockets are connected with the liquid inlet channel, and the other row of fluid connector sockets are connected with the liquid return channel;
The micro-channel liquid cooling source component comprises a micro-channel cold plate, a fluid connector liquid return plug, a fluid connector liquid supply plug, a heat dissipation fan, a heat dissipation plate, a liquid storage tank, a micro circulating pump, two temperature sensors, two flow sensors, a control module and a power module, wherein the micro-channel cold plate is vertically arranged in the liquid cooling case, the fluid connector liquid return plug and the fluid connector liquid supply plug are fixedly connected to the rear end of the micro-channel cold plate and are respectively connected with two fluid connector sockets corresponding to the rear panel up and down, the heat dissipation fan, the heat dissipation plate, the control module and the power module are all fixed on the same vertical surface of the micro-channel cold plate, the heat dissipation fan is positioned at the side of the heat dissipation plate, the liquid storage tank is fixed on the heat dissipation plate, the micro circulating pump is arranged in the liquid storage tank, and the inlet of the micro circulating pump is communicated with the interior of the liquid storage tank, the outlet of the micro circulating pump is connected with the liquid outlet of the micro channel cold plate, the liquid outlet of the micro channel cold plate is connected with the liquid supply plug of the fluid connector, the liquid inlet of the micro channel cold plate is connected with the liquid storage tank through the micro channel in the micro channel cold plate, the liquid inlet of the micro channel cold plate is connected with the liquid return plug of the fluid connector, namely the liquid storage tank is connected with the liquid inlet channel on the back panel through the micro circulating pump, the liquid outlet of the micro channel cold plate, the liquid supply plug of the fluid connector and the corresponding fluid connector socket in sequence, the liquid storage tank is connected with the liquid return channel on the back panel through the micro channel in the micro channel cold plate, the liquid inlet of the micro channel cold plate, the liquid return plug of the fluid connector and the corresponding fluid connector socket in sequence, so as to realize water cooling circulation, two temperature sensors and two flow sensors are connected with the micro channel cold plate for collecting the liquid inlet and outlet temperature and flow of the micro channel cold plate, the control end of the heat radiation fan and the control end of the micro circulating pump are connected with the control module to realize control, the signal output ends of the two temperature sensors and the two flow sensors are connected with the control module to send the collected signals to the control module, and the heat radiation fan, the micro circulating pump, the temperature sensors, the flow sensors and the control module are connected with the power module to realize power supply;
The heat source cold plate assembly comprises a liquid cooling plate, a fluid connector liquid inlet plug, a fluid connector liquid outlet plug and a liquid outlet temperature sensor, wherein the liquid cooling plate is vertically arranged in a liquid cooling case, an electronic element to be cooled is fixed on the liquid cooling plate, the fluid connector liquid inlet plug and the fluid connector liquid outlet plug are fixedly connected to the rear end of the liquid cooling plate and are respectively connected with two fluid connector sockets corresponding to the rear panel from top to bottom, an outlet of the liquid cooling plate is connected with the fluid connector liquid outlet plug, an inlet of the liquid cooling plate is connected with the fluid connector liquid inlet plug, namely, an inlet of the liquid cooling plate is connected with a liquid inlet channel through the fluid connector liquid inlet plug and the corresponding fluid connector socket, an outlet of the liquid cooling plate is connected with a liquid return channel through the fluid connector liquid outlet plug and the corresponding fluid connector socket, the liquid outlet temperature sensor is connected with the liquid cooling plate and is used for collecting the liquid outlet temperature of the liquid cooling plate, a signal output end of the liquid outlet temperature sensor is connected with a control module of the micro-channel liquid cooling source assembly, and a power supply end of the liquid outlet temperature sensor is connected with a power module of the micro-channel liquid cooling source assembly.
The inner top surface and the inner bottom surface of the liquid cooling cabinet are respectively provided with a mounting groove, so that the modularized positioning and mounting of the micro-channel liquid cooling source assembly and the heat source cold plate assembly are facilitated.
The rear ends of the micro-channel cold plate and the liquid cooling plate are respectively fixed with two guide pins, and the two guide pins are respectively adjacent to the top end and the bottom end of the corresponding micro-channel cold plate or the liquid cooling plate.
The front ends of the micro-channel cold plate and the liquid cooling plate are respectively provided with a puller, and locking strips are respectively arranged on the vertical surfaces of the micro-channel cold plate and the liquid cooling plate and at positions adjacent to the top end and the bottom end.
The radiating plate is a fin type radiating plate.
The power module of the micro-channel liquid cold source component is an AC/DC power module.
The micro-channel of the micro-channel cold plate is a flow channel with the aperture of 0.8 mm.
The liquid cooling cabinet is internally provided with a plurality of heat source cold plate assemblies, an inlet of each heat source cold plate assembly liquid cooling plate is connected with the liquid inlet channel through a fluid connector liquid inlet plug and a corresponding fluid connector socket, and an outlet of each heat source cold plate assembly liquid cooling plate is connected with the liquid return channel through a fluid connector liquid outlet plug and a corresponding fluid connector socket.
The invention has the advantages that:
(1) The invention miniaturizes, modularizes and standardizes the liquid cooling system, integrates the liquid cooling source on a standard micro-channel cold plate, can be inserted into a standard liquid cooling machine box, fixes the electronic element to be cooled in the liquid cooling machine box on the heat source cold plate assembly, connects the micro-channel cold plate with the heat source cold plate assembly needing to be cooled in the box through the fluid connector and the circulation flow channel on the back panel, and forms a complete liquid cooling system to realize the concentrated cooling of the heat source cold plate assembly in the liquid cooling machine box.
(2) According to the invention, the electronic component to be radiated is fixed on the heat source cold plate assembly, so that the electronic component can radiate quickly, a plurality of heat source cold plate assemblies can be arranged in the liquid cooling cabinet, each heat source cold plate assembly is fixed with a corresponding electronic component, and the heat source cold plate assemblies radiate through the micro-channel liquid cold source assembly in a liquid cooling way, so that the heat radiation efficiency is high, and the heat radiation is quick.
(3) The micro-channel liquid cooling source component and the heat source cold plate component are of modularized structures, and are provided with the extractor, the locking bar and the guide pin, so that the interface design is standardized, the micro-channel liquid cooling source component and the heat source cold plate component can be directly matched with a standard liquid cooling machine case, and the installation and the positioning are rapid and simple.
(4) The microchannel liquid cooling source component adopts the microchannel liquid cooling heat dissipation of 0.8mm, the heat dissipation capacity is better than that of the traditional serpentine flow channel cold plate, and the cooling medium after heat dissipation finally enters the liquid storage tank; the main function of the micro-channel cold plate is to increase the contact area between the cooling liquid and the cold plate metal piece, improve the heat exchange effect, set the heat dissipation plate, increase the heat dissipation area, combine the heat dissipation fan to force the air cooling to dissipate heat, and can obviously improve the heat dissipation efficiency.
The invention has the advantages of modularization, high integration level, compact structure, simple control and standardized interface design, and can be directly matched with the existing liquid cooling machine box.
Drawings
Fig. 1 is a schematic structural view of the present invention.
FIG. 2 is a cross-sectional view of the rear panel of the liquid-cooled chassis of the present invention.
FIG. 3 is a schematic diagram of a microchannel liquid cooling source assembly according to the present invention.
FIG. 4 is a cross-sectional view of a microchannel liquid cooling source assembly of the present invention.
Fig. 5 is a schematic view of a heat source cold plate assembly according to the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, a modularized miniature liquid cooling system comprises a liquid cooling machine box 1, a micro-channel liquid cooling source component 2 and a heat source cold plate component 3, wherein the micro-channel liquid cooling source component 2 and the heat source cold plate component 3 are arranged in the liquid cooling machine box 1;
Referring to fig. 1 and 2, a liquid inlet channel 5 and a liquid return channel 6 are arranged in a rear panel of the liquid cooling cabinet 1, both ends of the liquid inlet channel 5 and the liquid return channel 6 are of sealing structures, two rows of fluid connector sockets 4 are arranged on the inner wall of the rear panel, the number of the two rows of fluid connector sockets 4 is equal and corresponds to each other up and down, one row of fluid connector sockets 4 is connected with the liquid inlet channel 5, and the other row of fluid connector sockets 4 is connected with the liquid return channel 6;
Referring to fig. 1-4, the micro-channel liquid cooling source assembly 2 comprises a micro-channel cold plate 21, a fluid connector liquid return plug 22, a fluid connector liquid supply plug 23, a heat dissipation fan 24, a fin type heat dissipation plate 25, a liquid storage tank 26, a micro-circulation pump 27, two temperature sensors 28, two flow sensors 29, a control module 210 and an AC/DC power supply module 211, wherein the micro-channel of the micro-channel cold plate 21 is a runner with the aperture of 0.8mm, the micro-channel cold plate 21 is vertically arranged in the liquid cooling case 1, the fluid connector liquid return plug 22 and the fluid connector liquid supply plug 23 are fixedly connected to the rear end of the micro-channel cold plate 21 and are respectively connected with two fluid connector sockets 4 corresponding to the rear panel from top to bottom, the heat dissipation fan 24, the fin type heat dissipation plate 25, the control module 210 and the AC/DC power supply module 211 are all fixed on the same vertical surface of the micro-channel cold plate 21, and the heat dissipation fan 24 is located at the side of the fin-type heat dissipation plate 25, the liquid storage tank 26 is fixed on the fin-type heat dissipation plate 25, the micro circulation pump 27 is arranged inside the liquid storage tank 26, the inlet of the micro circulation pump 27 is communicated with the interior of the liquid storage tank 26, the outlet of the micro circulation pump 27 is connected with the liquid outlet of the micro channel cold plate 21, the liquid outlet of the micro channel cold plate 21 is connected with the liquid supply plug 23 of the fluid connector, the liquid inlet of the micro channel cold plate 21 is connected with the interior of the liquid storage tank 26 through the micro channel inside the micro channel cold plate 21, the liquid inlet of the micro channel cold plate 21 is connected with the liquid return plug 22 of the fluid connector, namely the liquid storage tank 26 is connected with the liquid inlet channel 5 on the rear panel through the micro circulation pump 27, the liquid outlet of the micro channel cold plate 21, the fluid connector liquid supply plug 23 and the corresponding fluid connector socket 4 sequentially, the liquid storage tank 26 sequentially passes through the micro channel in the micro channel cold plate 21, the liquid inlet of the micro-channel cold plate 21, the liquid return plug 22 of the fluid connector and the corresponding liquid return plug 4 are connected with the liquid return channel 6 on the rear panel to realize water cooling circulation, the two temperature sensors 28 and the two flow sensors 29 are connected with the micro-channel cold plate 21 to collect the liquid inlet and outlet temperature and flow of the micro-channel cold plate 21, the control end of the heat dissipation fan 24 and the control end of the micro-circulation pump 27 are connected with the control module 210 to realize control, the signal output ends of the two temperature sensors 28 and the two flow sensors 29 are connected with the control module 210 to send collected signals to the control module 210, and the heat dissipation fan 24, the micro-circulation pump 27, the temperature sensors 28, the flow sensors 29 and the control module 210 are connected with the AC/DC power module 211 to realize power supply;
Referring to fig. 5, the heat source cold plate assembly 3 includes a liquid cooling plate 31, a fluid connector liquid inlet plug 32, a fluid connector liquid outlet plug 33 and a liquid outlet temperature sensor 34, the liquid cooling plate 31 is vertically disposed in the liquid cooling chassis 1, an electronic component 35 to be cooled is fixed on the liquid cooling plate 31, the fluid connector liquid inlet plug 32 and the fluid connector liquid outlet plug 33 are both fixedly connected to the rear end of the liquid cooling plate 31 and respectively connected to two corresponding fluid connector sockets 4 on the rear panel, the outlet of the liquid cooling plate 31 is connected to the fluid connector liquid outlet plug 33, the inlet of the liquid cooling plate 31 is connected to the fluid connector liquid inlet plug 32, that is, the inlet of the liquid cooling plate 31 is connected to the liquid inlet channel 5 through the fluid connector liquid outlet plug 32 and the corresponding fluid connector socket 4, the outlet of the liquid cooling plate 31 is connected to the liquid return channel 6 through the fluid connector liquid outlet plug 33 and the corresponding fluid connector socket 4, the liquid outlet temperature sensor 34 is connected to the liquid cooling plate 31 and is used for collecting the liquid outlet temperature of the liquid cooling plate 31, and the signal output end of the liquid outlet temperature sensor 34 is connected to the control module 210 of the micro-channel liquid cooling source assembly, i.e. the inlet of the liquid cooling plate 31 is connected to the power supply module 211.
Wherein, the inner top surface and the inner bottom surface of the liquid cooling machine box 1 are provided with mounting grooves, which is convenient for the modularized positioning and mounting of the micro-channel liquid cooling source component 2 and the heat source cold plate component 3; two guide pins 7 are fixed at the rear ends of the micro-channel cold plate 21 and the liquid cooling plate 31, and the two guide pins 7 are adjacent to the top end and the bottom end of the corresponding micro-channel cold plate 21 or the liquid cooling plate 31 respectively; the front ends of the micro-channel cold plate 21 and the liquid cooling plate 31 are respectively provided with a puller 8, and locking strips 9 are respectively arranged on the vertical surfaces of the micro-channel cold plate 21 and the liquid cooling plate 31 and adjacent to the top end and the bottom end.
The working principle of the invention is as follows:
Firstly, a cooling fan 24 and a micro circulating pump 27 in a micro channel liquid cold source assembly 2 are started to work, a cooling medium in a liquid storage tank 26 sequentially enters a liquid inlet channel 5 through the micro circulating pump 27, a liquid outlet of a micro channel cold plate 21, a fluid connector liquid supply plug 23 and a fluid connector socket 4, then sequentially enters a flow channel of a liquid cooling plate 31 through the liquid inlet channel 5, the fluid connector socket 4 and a fluid connector liquid inlet plug 32, heat of an electronic element 35 on the liquid cooling plate 31 is taken away, and cooling is realized; the cooling medium carrying heat enters the liquid return channel 6 through the liquid outlet plug 33 of the fluid connector of the liquid cooling plate 31 and the liquid outlet plug 4 of the fluid connector, and under the driving of the micro circulating pump 27, the cooling medium enters the micro channel of the micro channel cold plate 21 through the liquid outlet plug 22 of the fluid connector and the liquid inlet of the micro channel cold plate 21 in sequence, the heat is diffused by the radiating fins of the fin type radiating plate 25, meanwhile, the redundant heat is forcedly blown out of the liquid cooling machine case 1 by the radiating fan 24, and the cooling medium after the micro channel cold plate 21 is re-cooled returns to the liquid storage tank 26, so that a complete working cycle is completed. Meanwhile, the temperature sensor 28 and the flow sensor 29 of the micro-channel liquid cold source assembly monitor the temperature and the flow of the recovered cooling medium in the whole process, and when the liquid return temperature of the cooling medium exceeds a set value, the heat dissipation fan 24 automatically adjusts the air quantity and the micro-circulation pump 27 automatically adjusts the pump flow, so that quick and effective cooling is realized.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A modular miniature liquid cooling system, characterized in that: the micro-channel liquid cooling system comprises a liquid cooling machine box, a micro-channel liquid cooling source component and a heat source cold plate component, wherein the micro-channel liquid cooling source component and the heat source cold plate component are arranged in the liquid cooling machine box;
The liquid cooling cabinet is characterized in that a liquid inlet channel and a liquid return channel are arranged in a rear panel of the liquid cooling cabinet, both ends of the liquid inlet channel and both ends of the liquid return channel are of sealing structures, two rows of fluid connector sockets are arranged on the inner wall of the rear panel, the number of the two rows of fluid connector sockets is equal and corresponds to that of the two rows of fluid connector sockets one by one, one row of fluid connector sockets are connected with the liquid inlet channel, and the other row of fluid connector sockets are connected with the liquid return channel;
The micro-channel liquid cooling source component comprises a micro-channel cold plate, a fluid connector liquid return plug, a fluid connector liquid supply plug, a heat dissipation fan, a heat dissipation plate, a liquid storage tank, a micro circulating pump, two temperature sensors, two flow sensors, a control module and a power module, wherein the micro-channel cold plate is vertically arranged in the liquid cooling case, the fluid connector liquid return plug and the fluid connector liquid supply plug are fixedly connected to the rear end of the micro-channel cold plate and are respectively connected with two fluid connector sockets corresponding to the rear panel up and down, the heat dissipation fan, the heat dissipation plate, the control module and the power module are all fixed on the same vertical surface of the micro-channel cold plate, the heat dissipation fan is positioned at the side of the heat dissipation plate, the liquid storage tank is fixed on the heat dissipation plate, the micro circulating pump is arranged in the liquid storage tank, and the inlet of the micro circulating pump is communicated with the interior of the liquid storage tank, the outlet of the micro circulating pump is connected with the liquid outlet of the micro channel cold plate, the liquid outlet of the micro channel cold plate is connected with the liquid supply plug of the fluid connector, the liquid inlet of the micro channel cold plate is connected with the liquid storage tank through the micro channel in the micro channel cold plate, the liquid inlet of the micro channel cold plate is connected with the liquid return plug of the fluid connector, namely the liquid storage tank is connected with the liquid inlet channel on the back panel through the micro circulating pump, the liquid outlet of the micro channel cold plate, the liquid supply plug of the fluid connector and the corresponding fluid connector socket in sequence, the liquid storage tank is connected with the liquid return channel on the back panel through the micro channel in the micro channel cold plate, the liquid inlet of the micro channel cold plate, the liquid return plug of the fluid connector and the corresponding fluid connector socket in sequence, so as to realize water cooling circulation, two temperature sensors and two flow sensors are connected with the micro channel cold plate for collecting the liquid inlet and outlet temperature and flow of the micro channel cold plate, the control end of the heat radiation fan and the control end of the micro circulating pump are connected with the control module to realize control, the signal output ends of the two temperature sensors and the two flow sensors are connected with the control module to send the collected signals to the control module, and the heat radiation fan, the micro circulating pump, the temperature sensors, the flow sensors and the control module are connected with the power module to realize power supply;
The heat source cold plate assembly comprises a liquid cooling plate, a fluid connector liquid inlet plug, a fluid connector liquid outlet plug and a liquid outlet temperature sensor, wherein the liquid cooling plate is vertically arranged in a liquid cooling cabinet, an electronic element to be cooled is fixed on the liquid cooling plate, the fluid connector liquid inlet plug and the fluid connector liquid outlet plug are fixedly connected to the rear end of the liquid cooling plate and are respectively connected with two fluid connector sockets corresponding to the rear panel from top to bottom, the outlet of the liquid cooling plate is connected with the fluid connector liquid outlet plug, the inlet of the liquid cooling plate is connected with the fluid connector liquid inlet plug, namely, the inlet of the liquid cooling plate is connected with a liquid inlet channel through the fluid connector liquid inlet plug and the corresponding fluid connector socket, the outlet of the liquid cooling plate is connected with a liquid return channel through the fluid connector liquid outlet plug and the corresponding fluid connector socket, the liquid outlet temperature sensor is connected with the liquid cooling plate and is used for collecting the liquid outlet temperature of the liquid cooling plate, the signal output end of the liquid outlet temperature sensor is connected with a control module of the micro-channel liquid cooling source assembly, and the power supply end of the liquid temperature sensor is connected with a power supply module of the micro-channel liquid cooling source assembly to realize power supply;
The inner top surface and the inner bottom surface of the liquid cooling cabinet are respectively provided with a mounting groove, so that the modularized positioning and mounting of the micro-channel liquid cooling source assembly and the heat source cold plate assembly are facilitated;
the rear ends of the micro-channel cold plate and the liquid cooling plate are respectively fixed with two guide pins, and the two guide pins are respectively adjacent to the top end and the bottom end of the corresponding micro-channel cold plate or the liquid cooling plate.
2. The modular miniature liquid cooling system of claim 1, wherein: the front ends of the micro-channel cold plate and the liquid cooling plate are respectively provided with a puller, and locking strips are respectively arranged on the vertical surfaces of the micro-channel cold plate and the liquid cooling plate and at positions adjacent to the top end and the bottom end.
3. The modular miniature liquid cooling system of claim 1, wherein: the radiating plate is a fin type radiating plate.
4. The modular miniature liquid cooling system of claim 1, wherein: the power module of the micro-channel liquid cold source component is an AC/DC power module.
5. The modular miniature liquid cooling system of claim 1, wherein: the micro-channel of the micro-channel cold plate is a flow channel with the aperture of 0.8 mm.
6. The modular miniature liquid cooling system of claim 1, wherein: the liquid cooling cabinet is internally provided with a plurality of heat source cold plate assemblies, an inlet of each heat source cold plate assembly liquid cooling plate is connected with the liquid inlet channel through a fluid connector liquid inlet plug and a corresponding fluid connector socket, and an outlet of each heat source cold plate assembly liquid cooling plate is connected with the liquid return channel through a fluid connector liquid outlet plug and a corresponding fluid connector socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110710951.8A CN113453507B (en) | 2021-06-25 | 2021-06-25 | Modularized miniature liquid cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110710951.8A CN113453507B (en) | 2021-06-25 | 2021-06-25 | Modularized miniature liquid cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113453507A CN113453507A (en) | 2021-09-28 |
| CN113453507B true CN113453507B (en) | 2024-04-19 |
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| CN114269122B (en) * | 2021-12-23 | 2023-03-24 | 四川九洲电器集团有限责任公司 | Liquid discharging clamping device for liquid cooling module and liquid discharging method thereof |
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